JP4640675B2 - Air conditioning system - Google Patents

Air conditioning system Download PDF

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JP4640675B2
JP4640675B2 JP2006169566A JP2006169566A JP4640675B2 JP 4640675 B2 JP4640675 B2 JP 4640675B2 JP 2006169566 A JP2006169566 A JP 2006169566A JP 2006169566 A JP2006169566 A JP 2006169566A JP 4640675 B2 JP4640675 B2 JP 4640675B2
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rack
air
equipment
chamber
conditioning system
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JP2008002690A (en
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貢 河村
義人 荒井
満博 高橋
浩厚 早川
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Shimizu Corp
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Description

本発明は、サーバ等による発熱密度の高い部屋の空調システムに関するものである。   The present invention relates to an air conditioning system for a room having a high heat generation density by a server or the like.

従来から、サーバ等の機器は、ラック内に多段に収容され、このラックは、ラック列として並べられ、機器室内に設置されている。   Conventionally, devices such as servers are accommodated in multiple stages in a rack, and the racks are arranged in a rack row and installed in an equipment room.

近年、インターネット等の普及により、通信・情報設備が充実するにつれて、サーバの電力・熱負荷密度は、約5〜6KW/m2に急速に上昇し、ブレード型サーバでは更に10〜11KW/m2程度となっている。 In recent years, with the spread of the Internet and the like, as the communication and information facilities are enriched, the power / thermal load density of the server rapidly increases to about 5 to 6 KW / m 2 , and further 10 to 11 KW / m 2 for blade type servers. It is about.

このような電力・熱負荷密度が高い部屋の空調システムとして、従来、サーバ等の機器を搭載したラック列間の各通路空間部の上方に局所冷却装置を、ラックの上部に送風機を設置し、局所冷却装置からの低温の空調空気が開口部内からラック内に取り入れられ、機器からの排熱が送風機により局所的に処理される空調システムがある(特許文献1)。   As an air conditioning system for a room with such a high power / heat load density, a local cooling device has been installed above each passage space between rack rows mounted with devices such as servers, and a blower is installed above the rack. There is an air conditioning system in which low-temperature conditioned air from a local cooling device is taken into a rack from an opening, and exhaust heat from the equipment is locally processed by a blower (Patent Document 1).

この発明によれば、局所冷却装置がラックとは分離、独立して設置されているので、一部の局所冷却装置に故障が発生しても静圧の変動が少なく、また、既存の設備への対応も容易でメンテナンス性も良好となる。
特開2003−166729号公報
According to this invention, since the local cooling device is installed separately from the rack, even if a failure occurs in some of the local cooling devices, there is little fluctuation in static pressure, and the existing equipment is installed. Is easy to handle and easy to maintain.
JP 2003-166729 A

しかしながら、上記特許文献1のような空調システムでは、局所冷却装置を新たに設置する必要があり、メンテナンス等の管理が必要となっていた。また、サーバ等の負荷に対して、局所冷却装置自体にかかる負荷がさらに加わることとなり、結果的に効率の悪いものとなっていた。さらに、3台ほどのラック一組に対して局所冷却装置を1台設置する構造なので、ラック1台毎の集中的な冷却ができず、効率が悪かった。   However, in the air conditioning system as in Patent Document 1, it is necessary to newly install a local cooling device, and management such as maintenance is required. Moreover, the load applied to the local cooling device itself is further added to the load of the server or the like, resulting in poor efficiency. Furthermore, since one local cooling device is installed for a set of about three racks, the cooling cannot be performed intensively for each rack, resulting in poor efficiency.

本発明は上記課題を解決し、新たに設ける設備を最低限に抑えながら、省エネルギーで、効率よく活用できる空調システムを提供することを目的とする。   This invention solves the said subject, and it aims at providing the air-conditioning system which can be utilized efficiently by energy saving, minimizing the installation newly installed.

本発明は上記課題を解決するものであって、機器を上下に搭載したラックが整列したラック列を複数並べて設置した機器を空調部により空調する空調システムにおいて、前記機器の電流値を前記ラック毎に管理する機器配電盤と、前記機器配電盤の管理する前記電流値から前記ラック毎の機器発熱量の予測値を演算し、前記予測値により空調部を制御する制御装置と、室温を検出する室温センサと、を備え、前記機器室は、床下チャンバ及び天井チャンバを有し、前記空調部は、前記床下チャンバに送風する空調機と、前記ラック列間の一つおきの床面に前記ラック毎に対応して設置され、前記床下チャンバから機器室内に送風する空気風量を調整する空気風量調整手段と、前記ラック列間の前記空気風量調整手段の無い側の天井面に設置され、機器室外の前記天井チャンバへ送風する排気手段と、を有し、前記制御装置は、前記室温センサの検出する検出値に応じて前記空調機及び前記排気手段を制御し、前記機器配電盤の管理する前記ラック毎の前記電流値に応じて前記空気風量調整手段を前記ラック毎に制御することを特徴とする。 This invention solves the said subject, Comprising: In the air-conditioning system which air-conditions the equipment room which installed and arranged the several rack row | line | column with which the rack which mounted the apparatus up and down was arranged side by side, the electric current value of the said apparatus is set to the said rack. A device switchboard to be managed every time, a control device for calculating a predicted value of the heat generation amount of each rack from the current value managed by the device switchboard, and controlling an air-conditioning unit based on the predicted value, and a room temperature for detecting a room temperature And the equipment room has an underfloor chamber and a ceiling chamber, and the air conditioning unit has an air conditioner that blows air to the underfloor chamber, and every rack on every other floor between the rack rows. Installed on the ceiling surface on the side where there is no air air volume adjusting means between the rack rows, and air air volume adjusting means for adjusting the air air volume to be blown into the equipment room from the underfloor chamber And an exhaust means for blowing air to the ceiling chamber outside the equipment room, and the control device controls the air conditioner and the exhaust means according to a detection value detected by the room temperature sensor, and The air flow rate adjusting means is controlled for each rack according to the current value for each rack to be managed .

また、前記空調機は、前記ラック列間に一つおきに送風することを特徴とする。 In addition, the air conditioner blows air every other rack row .

本発明によれば、機器配電盤の管理情報を空調システムの制御に適用することで、新たに設ける設備を最低限に抑えながら、省エネルギーで、効率よく活用することができる。また、空気風量調整手段をラック毎に設けることで、ラック1台毎に対する制御を可能とする。   ADVANTAGE OF THE INVENTION According to this invention, by applying the management information of an equipment switchboard to control of an air conditioning system, it can be efficiently utilized with energy saving while suppressing newly provided equipment to the minimum. Further, by providing the air flow rate adjusting means for each rack, it is possible to control each rack.

以下、図面を参照して空調システムの実施形態を説明する。図1は本実施形態である空調システムの概念図を示す。なお、実際の空調機はラック列と平行に送風するように設置されているが、図1では便宜上位置を変更している。図中、1は空調部、2は空調機、3は空気風量調整手段の一例としてのVAVグレーチング吹出口、4は吹出口、5はダンパ、6は排気手段の一例としての排気ファン、7は室温センサ、7aはクール室温センサ、7bはホット室温センサ、10は室、11は機器室、11aはクールコリドー、11bはホットコリドー、12はレタンチャンバ、13は床下チャンバ、14は天井チャンバ、16は壁面、17は床面、18は天井面、21は第1開口部、22は床面開口部、23は天井面開口部、24は第2開口部、ASは空調システム、Aは空気、Lはラック、L1〜L4はラック列である。 Hereinafter, an embodiment of an air-conditioning system will be described with reference to the drawings. FIG. 1 is a conceptual diagram of an air conditioning system according to this embodiment. In addition, although the actual air conditioner is installed so that it may blow in parallel with a rack row | line, the position is changed for convenience in FIG. In the figure, 1 is an air conditioning unit, 2 is an air conditioner, 3 is a VAV grating outlet as an example of an air flow rate adjusting means, 4 is an outlet, 5 is a damper, 6 is an exhaust fan as an example of an exhaust means, and 7 is A room temperature sensor, 7a is a cool room temperature sensor, 7b is a hot room temperature sensor, 10 is a room, 11 is an equipment room, 11a is a cool corridor, 11b is a hot corridor, 12 is a retin chamber, 13 is an underfloor chamber, 14 is a ceiling chamber, 16 Is a wall surface, 17 is a floor surface, 18 is a ceiling surface, 21 is a first opening, 22 is a floor surface opening, 23 is a ceiling surface opening, 24 is a second opening, AS is an air conditioning system, A is air, L is a rack, and L 1 to L 4 are rack rows.

本実施形態の空調システムASの室10の構造を説明する。ラックLが設置される機器室11は、壁面16を隔てて、空調機2が設置されているレタンチャンバ12が形成されると共に、二重床構造となっており、床面17の下は床下チャンバ13が形成されている。レタンチャンバ12と床下チャンバ13との間には第1開口部21が設けられている。機器室11と床下チャンバ13との間の床面17には、床面開口部22が設けられており、床面開口部22には、VAVグレーチング吹出口3が設置されている。機器室11の天井面18の上には天井チャンバ14が形成されている。機器室11と天井チャンバ14との間の天井面18には、天井面開口部23が設けられており、天井面開口部23には、排気ファン6が設置されている。天井チャンバ14とレタンチャンバ12との間には第2開口部24が設けられている。   The structure of the chamber 10 of the air conditioning system AS of this embodiment will be described. The equipment room 11 in which the rack L is installed has a double-chamber structure with a wall chamber 16 and a retent chamber 12 in which the air conditioner 2 is installed. A chamber 13 is formed. A first opening 21 is provided between the lettan chamber 12 and the underfloor chamber 13. A floor surface opening 22 is provided in the floor surface 17 between the equipment room 11 and the underfloor chamber 13, and the VAV grating outlet 3 is installed in the floor surface opening 22. A ceiling chamber 14 is formed on the ceiling surface 18 of the equipment room 11. A ceiling surface opening 23 is provided in the ceiling surface 18 between the equipment room 11 and the ceiling chamber 14, and the exhaust fan 6 is installed in the ceiling surface opening 23. A second opening 24 is provided between the ceiling chamber 14 and the lettan chamber 12.

VAVグレーチング吹出口3は、図2に示すように、スラブS上に設けた支柱Mに支持され空気Aが通過する床面吹出口4と、開閉自在なダンパ5とを有し、空気Aの量を調整しながら、床下チャンバ13から機器室11へ空気Aを通過させている。   As shown in FIG. 2, the VAV grating blower outlet 3 has a floor blower outlet 4 that is supported by a support M provided on the slab S and through which air A passes, and a damper 5 that can be freely opened and closed. Air A is passed from the underfloor chamber 13 to the equipment room 11 while adjusting the amount.

機器室11には、床面17に通信・情報処理機器を搭載したラックLの列が設置され、本実施形態ではL1〜L4の4列が設置されている。ラックLは、サーバ等の機器を多段に積層し、前面又は後面に保守点検用の開口を有しており、空気Aが前面から後面に流れるようになっている。ラック列は1列ごとにラックLの前面又は後面同士が向かい合うように並べられており、本実施形態では、第1ラック列L1と第2ラック列L2との間、及び、第3ラック列L3と第4ラック列L4との間がラックLの前面、壁面16と第1ラック列L1との間、及び、第2ラック列L2と第3ラック列L3との間がラックLの後面となっている。 In the equipment room 11, rows of racks L on which communication / information processing equipment is mounted on the floor surface 17 are installed, and in this embodiment, four rows L 1 to L 4 are installed. The rack L is configured by stacking devices such as servers in multiple stages, and has an opening for maintenance and inspection on the front or rear surface, so that air A flows from the front surface to the rear surface. The rack rows are arranged in such a way that the front or rear surfaces of the racks L face each other, and in this embodiment, between the first rack row L 1 and the second rack row L 2 and the third rack. Between the row L 3 and the fourth rack row L 4 is the front surface of the rack L, between the wall surface 16 and the first rack row L 1, and between the second rack row L 2 and the third rack row L 3. Is the rear surface of the rack L.

第1ラック列L1と第2ラック列L2との間の床面にはVAVグレーチング吹出口31,32が形成され、同様に、第3ラック列L3と第4ラック列L4との間の床面17にはVAVグレーチング吹出口33,34が形成されており、第1ラック列L1と第2ラック列L2との間には、ラックL内の機器を冷却するための空気Aが通過するクールコリドー11a12、第3ラック列L3と第4ラック列L4との間にはクールコリドー11a34が形成されている。 VAV grating outlets 3 1 and 3 2 are formed on the floor surface between the first rack row L 1 and the second rack row L 2, and similarly, the third rack row L 3 and the fourth rack row L 4. VAV grating outlets 3 3 and 3 4 are formed on the floor surface 17 between the first rack row L 1 and the second rack row L 2 to cool the equipment in the rack L. A cool corridor 11a 34 is formed between the cool corridor 11a 12 through which the air A to be transmitted passes and the third rack row L 3 and the fourth rack row L 4 .

また、VAVグレーチング吹出口3の無い側の壁面16と第1ラック列L1との間の天井面開口部23には排気ファン 1 が形成され、同様に、VAVグレーチング吹出口3の無い側の第2ラック列L2と第3ラック列L3との間の天井面開口部23には、排気ファン623が形成されており、壁面16と第1ラック列L1との間には、ラックL内の機器を冷却し温まった空気Aが通過するホットコリドー11b1、第2ラック列L2と第3ラック列L3との間にはホットコリドー11b23が形成されている。

In addition, the ceiling surface opening 23 between the side wall 16 without VAV grating outlet 3 and the first rack rows L 1 is formed an exhaust fan 61, likewise, no side of the VAV grating outlet 3 An exhaust fan 623 is formed in the ceiling surface opening 23 between the second rack row L 2 and the third rack row L 3, and between the wall surface 16 and the first rack row L 1. , hot corridor 11b 1 that air a is cooled warm equipment in the rack L passes, hot corridor 11b 23 is formed between the second rack row L 2 and the third row of racks L 3.

さらに、クールコリドー11a及びホットコリドー11bの上方には室温を検知する室温センサ7が設置され、クールコリドー11a12,11a34の上方の室温センサ7をクール室温センサ7a12,7a34、ホットコリドー11b1,11b23の上方の室温センサ7をホット室温センサ7b1,7b23としている。 Further, a room temperature sensor 7 for detecting the room temperature is installed above the cool corridor 11a and the hot corridor 11b, and the room temperature sensor 7 above the cool corridors 11a 12 and 11a 34 is connected to the cool room temperature sensors 7a 12 and 7a 34 and the hot corridor 11b. The room temperature sensors 7 above 1 and 11b 23 are designated as hot room temperature sensors 7b 1 and 7b 23 .

なお、本実施形態ではラック列L1〜L4を4列設置したが、ラック列は4列に限らず、何列設置してもよい。その際、VAVグレーチング吹出口3を設置したクールコリドー11aと、排気ファン6を設置したホットコリドー11bとは一つおきにする。 In this embodiment, four rack rows L 1 to L 4 are installed, but the number of rack rows is not limited to four, and any number of rows may be installed. At that time, every other cool corridor 11a provided with the VAV grating outlet 3 and hot corridor 11b provided with the exhaust fan 6 are arranged.

また、第1ラック列L1と第2ラック列L2との間、及び、第3ラック列L3と第4ラック列L4との間の機器前面側にVAVグレーチング吹出口3を設置してクールコリドー11aとし、壁面16と第1ラック列L1との間、及び、第2ラック列L2と第3ラック列L3との間の機器後面側に排気ファン6を設置してホットコリドー11bとしたが、逆でもよい。特に、機器又はラックLの排気方向にホットコリドー11bを設けるのが望ましい。 Further, the VAV grating outlet 3 is installed between the first rack row L 1 and the second rack row L 2 and on the front side of the equipment between the third rack row L 3 and the fourth rack row L 4. and cool corridor 11a Te, between the wall 16 and the first rack rows L 1, and a hot established the exhaust fan 6 to the apparatus rear surface side between the second rack row L 2 and the third rack row L 3 The corridor 11b is used, but it may be reversed. In particular, it is desirable to provide the hot corridor 11b in the exhaust direction of the equipment or rack L.

次に、本実施形態の空調システムASの空気Aの流れを説明する。まず、機器室11と壁面16を隔てたレタンチャンバ12に設置した空調機2から、新鮮な空気Aを排出する。排出された空気Aは第1開口部21を通過し、機器室11の床面17の下部に設けた床下チャンバ13へ供給される。床下チャンバ13には、吹出口4及びダンパ5を有するVAVグレーチング吹出口3が設けられ、VAVグレーチング吹出口3は床下チャンバ13から機器室11へ流量を調整しながら空気Aを通過させている。VAVグレーチング吹出口3を通過した空気Aは、機器室11のクールコリドー11aへ吹き出す。この時の空気Aの温度は第1室温センサ7aにより検知される。その後、空気Aは通信・情報処理機器を搭載したラックLを通過し、ホットコリドー11bへ流れる。この時の空気Aの温度は第2室温センサ7bにより検知される。次に、空気Aは天井面18に設置した排気ファン6により機器室11から天井チャンバ14へ流れ、第2開口部24を通過しレタンチャンバ12へ戻る。   Next, the flow of air A in the air conditioning system AS of the present embodiment will be described. First, fresh air A is discharged from the air conditioner 2 installed in the retan chamber 12 that separates the equipment room 11 and the wall surface 16. The discharged air A passes through the first opening 21 and is supplied to the underfloor chamber 13 provided in the lower part of the floor surface 17 of the equipment room 11. The underfloor chamber 13 is provided with a VAV grating air outlet 3 having an air outlet 4 and a damper 5. The VAV grating air outlet 3 allows air A to pass from the underfloor chamber 13 to the equipment room 11 while adjusting the flow rate. The air A that has passed through the VAV grating outlet 3 is blown out to the cool corridor 11 a in the equipment room 11. The temperature of the air A at this time is detected by the first room temperature sensor 7a. Thereafter, the air A passes through the rack L on which the communication / information processing device is mounted and flows to the hot corridor 11b. The temperature of the air A at this time is detected by the second room temperature sensor 7b. Next, the air A flows from the equipment room 11 to the ceiling chamber 14 by the exhaust fan 6 installed on the ceiling surface 18, passes through the second opening 24, and returns to the lettan chamber 12.

次に、空調システムASの制御について図1乃至図4を用いて説明する。図3は空調システムASのブロック図、図4は空調システムASの機器発熱予測制御の概要を示す図である。図3において、Pはサーバ配電盤、Cは制御装置である。   Next, control of the air conditioning system AS will be described with reference to FIGS. FIG. 3 is a block diagram of the air conditioning system AS, and FIG. 4 is a diagram showing an outline of device heat generation prediction control of the air conditioning system AS. In FIG. 3, P is a server switchboard and C is a control device.

本実施形態の空調システムASにおける制御では、クールコリドー11aに設置したクール室温センサ7aとホットコリドー11bに設置したホット室温センサ7bとにより、各コリドー内の雰囲気温度を検知すると共に、機器配電盤の一例としてのサーバ配電盤Pにより各ラックL内の機器の電流値を検知し、制御装置Cは、サーバ配電盤Pの管理する電流値から各ラックLの発熱量の予測値を演算し、その予測値と室温センサ7の検出値とにより空調部1である空調機2、VAVグレーチング吹出口3のダンパ5及び排気ファン6等を制御する。   In the control in the air conditioning system AS of the present embodiment, the cool room temperature sensor 7a installed in the cool corridor 11a and the hot room temperature sensor 7b installed in the hot corridor 11b detect the ambient temperature in each corridor and an example of a device switchboard The server switchboard P as a server detects the current value of the equipment in each rack L, and the control device C calculates the predicted value of the heat generation amount of each rack L from the current value managed by the server switchboard P, and the predicted value and The air conditioner 2, which is the air conditioning unit 1, the damper 5 of the VAV grating outlet 3, the exhaust fan 6, and the like are controlled by the detection value of the room temperature sensor 7.

次に、制御系の概要を示す。例えば、図4のように、機器室に設置したラックに対して、ラック列を上からラック列L1、ラック列L2のように示し、各ラック列のラックを左からラックL1-1、ラックL2-1のように示す。すなわち本実施形態では各ラック列にはそれぞれ13個のラックが並んでいるので、一番上の左端のラックは、ラックL1-1とし、一番下の右端のラックは、ラックL4-13とする。 Next, an outline of the control system is shown. For example, as shown in FIG. 4, with respect to the racks installed in the equipment room, the rack rows are shown as rack row L 1 and rack row L 2 from the top, and the racks in each rack row are rack L 1-1 from the left. And shown as rack L 2-1 . That is, in the present embodiment, since 13 racks are arranged in each rack row, the uppermost leftmost rack is the rack L1-1, and the lowermost rightmost rack is the rack L4-. 13

空調機2は、ラック列L1とラック列L2間の第1クールコリドー11a12用の第1空調機2a、ラック列L3とラック列L4間の第2クールコリドー11a34用の第2空調機2bを設置する。VAVグレーチング吹出口3は、各ラックLに対して一つ設置され、一番左上のラックL1-1に対応するものをVAVグレーチング吹出口31-1とし、一番右下のラックL4-13に対応するものをVAVグレーチング吹出口34-13とする。また、各ラックLの電流値の大小を濃淡で表示しておくが、実際には、カラー表示するのが好ましい。その他、各設備は、図1に示したように設置され、図3に示したブロック図のように連結されている。 Air conditioner 2, first of rack rows L 1 and the first air-conditioner 2a for first cool corridor 11a 12 between rack rows L 2, rack rows L 3 and the second cool corridor 11a 34 between rack rows L 4 2 Air conditioner 2b is installed. One VAV grating outlet 3 is installed for each rack L, and the one corresponding to the upper left rack L 1-1 is the VAV grating outlet 3 1-1, and the lower right rack L 4 those corresponding to -13 and VAV grating blow-out port 3 4-13. Further, although the magnitude of the current value of each rack L is displayed in shades, it is actually preferable to display in color. In addition, each facility is installed as shown in FIG. 1 and connected as shown in the block diagram shown in FIG.

まず、室温センサ7に基づく制御に関して説明する。クールコリドー11aのうち、第1クールコリドー11a12に設置された第1クール室温センサ7a12が通常よりも高温を検知した場合、制御装置Cは、第1空調機2aの風量を大きくするか、又は、温度を低くするように制御する。また、ホットコリドー11bのうち、第1ホットコリドー11b1に設置された第1ホット室温センサ7b1が通常よりも高温を検知した場合、制御装置Cは、図1における第1排気ファン6a1の回転数を上げるように制御する。 First, control based on the room temperature sensor 7 will be described. When the first cool room temperature sensor 7a 12 installed in the first cool corridor 11a 12 among the cool corridors 11a detects a temperature higher than normal, the control device C increases the air volume of the first air conditioner 2a, Alternatively, the temperature is controlled to be lowered. When the first hot room temperature sensor 7b 1 installed in the first hot corridor 11b 1 of the hot corridor 11b detects a temperature higher than normal, the control device C controls the first exhaust fan 6a 1 in FIG. Control to increase the rotation speed.

次に、サーバ配電盤Pに基づくサーバ発熱予測制御に関して説明する。例えば、図4のように、サーバ配電盤Pからの信号により、ラック列L1の一番左のラックL1-1が電流値の多いことを表す濃い色で示され、隣のラックL1-2が薄い色で示されている場合、ラックL1-1の発熱量が多く、ラックL1-2の発熱量が少ないと予測する。すると、制御装置Cは、ラックL1-1に対応する箇所のVAVグレーチング吹出口31-1のダンパ51-1の開閉角を制御し、空気風量を多くする。 Next, server heat generation prediction control based on the server switchboard P will be described. For example, as shown in FIG. 4, the leftmost rack L 1-1 in the rack row L 1 is indicated by a dark color indicating that the current value is large, based on the signal from the server switchboard P, and the adjacent rack L 1− If 2 is shown in a lighter color, the amount of heat generated rack L 1-1 many predicts that the amount of heat generated rack L 1-2 is small. Then, the controller C controls the opening and closing angle of the damper 5 1-1 VAV grating outlet 3 1-1 of a portion corresponding to the rack L 1-1, to increase the air air volume.

なお、空調機2の温度設定や風量設定、VAVグレーチング吹出口3のダンパ5の開閉角、排気ファン6の回転数等をそれぞれ組み合わせて制御すると、さらに細かい制御が可能となる。また、排気ファン6及び室温センサ7は、各コリドーに複数個設けてもよい。さらに、VAVグレーチング吹出口3は必ずしもラックL毎に設ける必要はなく、ラックL2台に対してVAVグレーチング吹出口3を一つ設けるというように調整してもよい。   In addition, if the temperature setting of the air conditioner 2 and the air volume setting, the opening / closing angle of the damper 5 of the VAV grating outlet 3, the rotational speed of the exhaust fan 6, and the like are combined and controlled, finer control becomes possible. A plurality of exhaust fans 6 and room temperature sensors 7 may be provided in each corridor. Further, the VAV grating outlet 3 is not necessarily provided for each rack L, and may be adjusted such that one VAV grating outlet 3 is provided for two racks L.

このようにサーバ配電盤Pの管理情報を空調システムASの制御に適用することで、新たに設ける設備を最低限に抑えながら、省エネルギーで、効率よく活用することができる。また、VAVグレーチング吹出口3をラックL毎に設けることで、ラック1台毎に対する制御を可能とする。   In this way, by applying the management information of the server switchboard P to the control of the air conditioning system AS, it is possible to efficiently use it with energy saving while minimizing the equipment to be newly provided. Further, by providing the VAV grating outlet 3 for each rack L, it is possible to control each rack.

本実施形態の空調システムを示す図The figure which shows the air-conditioning system of this embodiment 本実施形態のVAVグレーチング吹出口を示す図The figure which shows the VAV grating blower outlet of this embodiment 本実施形態の空調システムのブロック図Block diagram of the air conditioning system of this embodiment 本実施形態の空調システムのサーバ発熱予測制御を示す図The figure which shows the server heat_generation | fever prediction control of the air conditioning system of this embodiment

符号の説明Explanation of symbols

1…空調部、2…空調機、3…VAVグレーチング吹出口(空気風量調整手段)、4…吹出口、5…ダンパ、6…排気ファン(排気手段)、7…室温センサ、10…室、11…機器室、11a…クールコリドー、11b…ホットコリドー、12…レタンチャンバ、13…床下チャンバ、14…天井チャンバ、16…壁面、17…床面、18…天井面、21…第1開口部、22…床面開口部、23…天井面開口部、24…第2開口部、AS…空調システム、A…空気、L…ラック、L1〜L4…ラック列、P…サーバ配電盤(機器配電盤)、C…制御装置

DESCRIPTION OF SYMBOLS 1 ... Air-conditioning part, 2 ... Air conditioner, 3 ... VAV grating blower outlet (air volume adjustment means), 4 ... Air outlet, 5 ... Damper, 6 ... Exhaust fan (exhaust means), 7 ... Room temperature sensor, 10 ... Chamber, DESCRIPTION OF SYMBOLS 11 ... Equipment room, 11a ... Cool corridor, 11b ... Hot corridor, 12 ... Retin chamber, 13 ... Under floor chamber, 14 ... Ceiling chamber, 16 ... Wall surface, 17 ... Floor surface, 18 ... Ceiling surface, 21 ... 1st opening part , 22 ... floor opening, 23 ... ceiling surface opening 24: second opening, AS ... air conditioning system, A ... air, L ... rack, L 1 ~L 4 ... rack rows, P ... server switchboard (equipment Switchboard), C ... Control device

Claims (2)

機器を上下に搭載したラックが整列したラック列を複数並べて設置した機器を空調部により空調する空調システムにおいて、
前記機器の電流値を前記ラック毎に管理する機器配電盤と、
前記機器配電盤の管理する前記電流値から前記ラック毎の機器発熱量の予測値を演算し、前記予測値により空調部を制御する制御装置と、
室温を検出する室温センサと、
を備え、
前記機器室は、床下チャンバ及び天井チャンバを有し、
前記空調部は、
前記床下チャンバに送風する空調機と、
前記ラック列間の一つおきの床面に前記ラック毎に対応して設置され、前記床下チャンバから機器室内に送風する空気風量を調整する空気風量調整手段と、
前記ラック列間の前記空気風量調整手段の無い側の天井面に設置され、機器室外の前記天井チャンバへ送風する排気手段と、
を有し、
前記制御装置は、
前記室温センサの検出する検出値に応じて前記空調機及び前記排気手段を制御し、
前記機器配電盤の管理する前記ラック毎の前記電流値に応じて前記空気風量調整手段を前記ラック毎に制御する
ことを特徴とする空調システム。
In the air conditioning system that air-conditions the equipment room where a plurality of rack rows in which racks with equipment mounted are arranged side by side are installed,
An equipment switchboard for managing the current value of the equipment for each rack;
A control device that calculates a predicted value of the device heat generation amount for each rack from the current value managed by the device switchboard, and controls an air conditioning unit according to the predicted value;
A room temperature sensor for detecting room temperature;
With
The equipment room has an underfloor chamber and a ceiling chamber,
The air conditioning unit
An air conditioner for blowing air into the underfloor chamber;
An air flow rate adjusting means which is installed corresponding to each rack on every other floor between the rack rows and adjusts the air flow rate blown into the equipment room from the underfloor chamber;
Exhaust means that is installed on the ceiling surface on the side without the air flow rate adjusting means between the rack rows and blows air to the ceiling chamber outside the equipment room;
Have
The control device includes:
Controlling the air conditioner and the exhaust means according to the detection value detected by the room temperature sensor,
The air conditioning system characterized in that the air flow rate adjusting means is controlled for each rack in accordance with the current value for each rack managed by the equipment switchboard .
前記空調機は、前記ラック列間に一つおきに送風することを特徴とする請求項に記載の空調システム。 The air conditioning system according to claim 1 , wherein the air conditioner blows air every other rack row .
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