JP2003229524A - Rack-mounting cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To individually cool a rack with high heat generation density and to effectively cool electronic equipment with high calorific value. <P>SOLUTION: In the rack-mounting cooling device, a whole device is stored in the rack where electronic equipment as a heat generation load is stored. The cooling device is provided with cooling parts 10A and 10B cooling suction air, radiating parts 12A and 12B discharging generated heat when suction air is cooled in the cooling part, an outer exhaust duct 18 exhausting warm air discharged from the radiating part to the outside of the device, and an inner exhaust duct 16 which is formed to connect to the outer exhaust duct and guides warm air discharged from the radiating part to the outer exhaust duct by a part of suction air. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rack mount type cooling device housed in a rack in which a heat generating load such as an electronic device is housed.

[0002]

2. Description of the Related Art In a room such as a data center where a plurality of racks accommodating electronic devices are installed, a cooling device for cooling the heat generated from the electronic devices is installed in indoor units. Therefore, the cooling capacity may be insufficient in a rack having a particularly high heat generation density. Moreover, since the conventional cooling device is installed in the indoor unit, it is not possible to effectively cool the electronic device having a high heat generation amount in the same rack.

The present invention has been made in view of such circumstances, and it is possible to individually cool racks having a high heat generation density and to effectively cool electronic devices having a high heat generation amount. An object is to provide a rack mount type cooling device.

[0004]

In order to achieve the above object, the invention according to claim 1 is a rack mount type cooling device in which an entire device is housed in a rack in which electronic equipment as a heat generating load is housed. In the cooling device, a cooling unit that cools intake air, a heat radiating unit that radiates heat generated when cooling the intake air in the cooling unit, and warm air that is radiated from the heat radiating unit are external to the device. An external exhaust duct for discharging, and an internal exhaust duct that is formed so as to communicate with the external exhaust duct and guides the warm air released from the heat dissipation portion to the external exhaust duct by a part of the sucked air. And

The invention described in claim 2 is the same as claim 1.
In the rack-mounted cooling device according to the item (1), the cooling unit and the heat dissipation unit are integrated, and the entire device is unitized.

The invention described in claim 3 is the same as claim 1
The rack mount cooling device according to any one of items 1 to 2 is characterized in that it has an airflow guide for adjusting the direction of one or both of the suction air and the cooling air outside the main body of the device.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2 show the configuration of a rack-mounted cooling device according to an embodiment of the present invention.
FIG. 1 is a plan view of a rack mount cooling device according to an embodiment of the present invention, and FIG. 2 is a front view thereof.

In these figures, a rack mount type cooling device (hereinafter, simply referred to as a cooling device) 1 according to an embodiment of the present invention includes cooling units 10A and 1A for cooling intake air.
0B and heat radiating parts 12A, 1A for releasing heat generated when cooling the intake air in the cooling parts 10A, 10B.
2B, an external exhaust duct 18 for discharging warm air emitted from the heat radiating parts 12A, 12B to the outside of the apparatus, and heat radiating parts 12A, 12 formed so as to communicate with the external exhaust duct 18.
An internal exhaust duct 16 for guiding the warm air released from B to the external exhaust duct 18 by a part of the intake air;
It has a power supply unit 14, and the entire device is unitized. The power supply unit 14 is a power supply for driving the cooling units 10A and 10B and the heat radiation units 12A and 12B.

The cooling device 1 is used by accommodating the entire device in a rack accommodating electronic equipment as a heat generation load. FIG. 3 shows a state in which the cooling device 1 is housed in the rack 20. As shown in the figure, the rack 20 accommodates electronic devices 30A, 30B, 30C that generate heat, and the cooling device 1 is accommodated below these electronic devices. A plurality of ventilation fans 22, 24, 26, 28 are attached to the ceiling of the rack 20.

1 to 3, the ventilation fan 22,
By driving 24, 26 and 28, the air sucked from the lower part of the rack 20 is cooled by the cooling unit 10 in the cooling device 1.
The cooled air is cooled by A and 10B, and the cooled air cools the heat radiation generated in the electronic devices 30A, 30B and 30C stored above the cooling device 1 in the rack 20. Then, by cooling this heat radiation, it passes toward the ventilation fans 22, 24, 26, 28, and the ventilation fan 2
It is discharged by 2, 24, 26, 28 and discharged to the outside of the rack 20.

The warm air released from the heat radiating parts 12A and 12B during cooling by the cooling parts 10A and 10B is guided to the internal exhaust duct 16 by the air flow of a part of the air sucked into the cooling device 1, and the external exhaust duct. It is discharged by the ventilation fans 22, 24, 26 and 28 via 18.
It is discharged to the outside of the rack 20. FIG. 4 shows a configuration in which a plurality of cooling devices 1 are mounted in the rack 20 in order to increase the cooling capacity in the rack 20.

In FIG. 4, the cooling device 1A is provided below the electronic devices 30A and 30B which become a heat load in the rack 20.
The cooling device 1B is installed below the electronic devices 30C and 30D, which are heat loads. 18A and 18B are external exhaust ducts. The configurations of the cooling device 1A and the cooling device 1B are the same as those of the cooling device 1 shown in FIGS. The same components as those in FIG. 3 are designated by the same reference numerals.

As described above, by increasing the number of unitized cooling devices mounted in the rack 20, it is possible to easily enhance the cooling capacity in the rack in which the heat load of the electronic device or the like is stored. Further, by installing the cooling device directly below the electronic device that generates a large amount of heat, it is possible to effectively cool the specific electronic device.

FIG. 5 shows an example in which an airflow guide is provided in the cooling device 1 installed between the heat generating loads 30A and 30B in the rack. As shown in the figure, a plurality of guide plates 100 are provided on the top and bottom of the cooling device 1 so that the angles can be adjusted.
Suction air introduced into the cooling device 1 by providing the airflow guides 100A, 100B
You can adjust the direction of the cooling air discharged from
It is possible to effectively cool the specific portions of the heat generating load 30A and the heat generating load 30B.

FIG. 6 shows a state in which the cooling device is attached to the rack.
Shown in. The cooling device 1 includes rack mounting metal fittings 200A, 200 attached to a rack as shown in FIG.
The frames 300A, 3 attached to the racks B, 200C, 200D by the screws 202.
It is attached to 00B, 300C, and 300D by a screw 302. FIG. 6A is a front view and FIG. 6B is a plan view.

As described above, according to the rack mount type cooling device of this embodiment, the cooling device itself is cooled by the air sucked in the rack, so that it can be unitized. The entire device can be stored in a rack. Further, since the entire apparatus can be housed in the rack, it is possible to individually cool racks having a high heat generation density, which is insufficient in cooling capacity in the existing air conditioning equipment.

Further, the cooling capacity can be easily improved by increasing the number of cooling devices mounted in the rack. Further, by installing the cooling device in the rack immediately below the device (heat load) having a large heat generation amount, the device can be effectively cooled.

[0018]

According to the first aspect of the invention, there is provided a rack mount type cooling device in which the entire device is housed in a rack in which electronic equipment as a heat load is housed. A cooling unit for cooling, a heat radiating unit for releasing heat generated when cooling sucked air in the cooling unit, an external exhaust duct for discharging warm air released from the heat radiating unit to the outside of the apparatus, and the external exhaust duct. And an internal exhaust duct that is formed so as to communicate with each other and guides the warm air discharged from the heat dissipation portion to the external exhaust duct by a part of the sucked air.

According to a second aspect of the present invention, in the rack mount cooling device according to the first aspect, the cooling unit and the heat radiating unit are integrated and the entire device is unitized. To do. Therefore, it is possible to individually cool racks having a high heat generation density that have insufficient cooling capacity in the existing air conditioning equipment.

Furthermore, the cooling capacity can be easily improved by increasing the number of cooling devices mounted in the rack. Further, by installing the cooling device in the rack immediately below the device (heat load) having a large heat generation amount, the device can be effectively cooled.

According to the invention of claim 3, claim 1
In the rack mount cooling device according to any one of items 1 and 2, since an airflow guide for adjusting the direction of either or both of the suction air and the cooling air is provided outside the device body, a specific portion of the heat load can be effectively applied. Can be cooled.

[Brief description of drawings]

FIG. 1 is a plan view showing the configuration of a rack mount cooling device according to an embodiment of the present invention.

FIG. 2 is a front view showing the configuration of the rack-mounted cooling device according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a state in which the rack mount cooling device according to the embodiment of the present invention is housed in a rack.

FIG. 4 is an explanatory diagram showing a state in which a plurality of rack mount cooling devices according to the embodiment of the present invention are housed in a rack.

FIG. 5 is an explanatory diagram showing a configuration example in which an airflow guide is provided in the cooling device main body of the rack mount cooling device according to the embodiment of the present invention.

FIG. 6 is a front view and a plan view showing a state in which the rack mount cooling device according to the embodiment of the present invention is mounted in a rack.

[Explanation of symbols]

1, 1A, 1B ... Rack mount cooling device 10A, 10B ... Cooling unit 12A, 12B ... Heat dissipation part 14 ... Power supply unit 16 ... Internal exhaust duct 18 ... External exhaust duct 20 ... rack 22-28 ... Ventilation fan 30A to 30D ... Electronic device (heating load)

Claims (3)

[Claims] 1. A rack mount type cooling device in which the entire device is housed in a rack housing electronic equipment as a heat generation load, wherein the cooling device is a cooling unit for cooling intake air, and the cooling unit. In the case of (1), a heat radiating portion that releases heat generated when cooling the intake air, an external exhaust duct that exhausts warm air released from the heat radiating portion to the outside of the apparatus, and the heat radiating portion that is formed to communicate with the external exhaust duct A rack-mounted cooling device, comprising: an internal exhaust duct that guides the warm air released by the intake air to a part of the external exhaust duct. 2. The cooling unit and the heat dissipation unit are integrated with each other,
The rack mount cooling device according to claim 1, wherein the entire device is unitized. 3. The rack mount cooling device according to claim 1, further comprising an airflow guide for adjusting the direction of one or both of the suction air and the cooling air outside the main body of the device. .