JP4633524B2 - Soft X-ray static eliminator - Google Patents

Soft X-ray static eliminator Download PDF

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JP4633524B2
JP4633524B2 JP2005113551A JP2005113551A JP4633524B2 JP 4633524 B2 JP4633524 B2 JP 4633524B2 JP 2005113551 A JP2005113551 A JP 2005113551A JP 2005113551 A JP2005113551 A JP 2005113551A JP 4633524 B2 JP4633524 B2 JP 4633524B2
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soft
ray
tube
sealed casing
static eliminator
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JP2006294412A (en
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仁 稲葉
祥行 八木
悟 池鯉鮒
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Takasago Thermal Engineering Co Ltd
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Description

本発明は,例えば静電気を帯びた液晶基板や大型ガラス基板などに軟X線を照射して除電する軟X線除電装置に関する。   The present invention relates to a soft X-ray neutralizing apparatus that neutralizes static electricity by irradiating, for example, a liquid crystal substrate or a large glass substrate charged with static electricity with soft X-rays.

例えば液晶パネルの製造では,液晶を配向させるためにガラス基板をバフで摩擦するラビング処理工程があり,処理基板はサイズが大きく絶縁性であるため帯電電位が非常に高くなる。このようにガラス基板が帯電すると,静電気力によって浮遊粒子が付着したり静電気放電が生じたりして,基板上に形成される素子の断線,短絡や画像素子の視覚欠如等を招き,歩留まりを低下させてしまう。そこで,液晶パネル製造の分野ではガラス基板の帯電を防止すべく,除電装置が用いられる。   For example, in the manufacture of a liquid crystal panel, there is a rubbing treatment process in which a glass substrate is rubbed with a buff to align the liquid crystal, and since the treatment substrate is large in size and insulative, the charging potential becomes very high. When the glass substrate is charged in this way, suspended particles adhere to it or electrostatic discharge occurs due to electrostatic force, leading to disconnection of the elements formed on the substrate, short circuit, lack of vision of image elements, etc., and lowering the yield. I will let you. Thus, in the field of liquid crystal panel manufacturing, a static eliminator is used to prevent the glass substrate from being charged.

除電装置には,種々のものが従来より知られているが,それらの内,大気中や大気圧ガス雰囲気中において軟X線を照射して除電を行う軟X線除電装置が公知である。例えば本出願人が先に開示した特許文献1には,クリーンルーム内に設けたハンドリングチャンバ内において,軟X線除電装置で半導体ウェハなどの電子デバイスを除電するシステムが示されている。   Various types of static eliminators are conventionally known, and among them, soft X-ray static eliminators that perform static erasure by irradiating with soft X-rays in the atmosphere or atmospheric pressure gas atmosphere are known. For example, Patent Document 1 previously disclosed by the present applicant shows a system for neutralizing an electronic device such as a semiconductor wafer with a soft X-ray neutralization apparatus in a handling chamber provided in a clean room.

特開2001−44089号公報JP 2001-44089 A

一般に,軟X線を照射して帯電物の除電を行う軟X線除電装置においては,使用時に装置内部の温度が40〜60℃程度まで上昇する。それに伴い,軟X線除電装置の装置内部で膨張した空気が外部に漏洩していた。装置内部には,シリコンシーラントやプリント基板,絶縁樹脂,コンデンサ,抵抗,コイル等の電機部品などといった電子デバイスの製造に影響を及ぼすガス状不純物の発生部材が多用されており,昇温時に装置内部からそれらのガス状不純物が漏洩することによって,電子デバイスの製造に悪影響を与えるリスクがあった。特に装置内部から漏洩するガス状不純物の多くは有機物で,沸点が100℃以上のものが発生しており,これらが製造過程の半導体基板(Siウエハ)や液晶基板(ガラス基板)面に付着すると,成膜障害やコンタクト抵抗障害など,様々な障害の原因となる可能性がある。   In general, in a soft X-ray static eliminator that irradiates soft X-rays to neutralize charged objects, the temperature inside the apparatus rises to about 40 to 60 ° C. during use. Along with this, the air expanded inside the soft X-ray static eliminator leaked to the outside. Inside the equipment, there are many gaseous impurity generating members that affect the production of electronic devices such as silicon sealants, printed circuit boards, insulating resins, capacitors, resistors, coils, and other electrical parts. There was a risk that these gaseous impurities would adversely affect the manufacturing of electronic devices. In particular, most of the gaseous impurities that leak from the inside of the device are organic substances, and boiling points of 100 ° C or higher are generated. If these adhere to the surface of a semiconductor substrate (Si wafer) or liquid crystal substrate (glass substrate) during the manufacturing process. This may cause various problems such as film formation failure and contact resistance failure.

また最近では,電子デバイスのハンドリングチャンバやエンクロージャ,SMIFなどを小型化するいわゆるミニエンバイロメント化が進んでおり,そのような小型化した空間に軟X線除電装置を設けた場合,装置内部から発生したガス状不純物の影響が無視できなくなってきている。   Recently, so-called mini-environment has been developed to reduce the size of electronic device handling chambers, enclosures, SMIFs, etc., and when a soft X-ray static eliminator is installed in such a miniaturized space, it is generated from inside the device. The effects of the gaseous impurities that have been made are becoming ignorable.

このようなガス状不純物に対する障害防止対策としては,製造装置内にケミカルフィルタを配置することも考えられるが,そのような方策では汚染の影響を完全に排除することができない上に,ケミカルフィルタの使用によりコストも高くなってしまう。特に,近年の電子デバイスの高性能化に伴い,そのようなガス状不純物の影響を容易に回避できる手段の出現が望まれている。   As countermeasures against such gaseous impurities, it is conceivable to place a chemical filter in the manufacturing equipment. However, such measures cannot completely eliminate the influence of contamination, and Cost increases due to use. In particular, with the recent improvement in performance of electronic devices, the emergence of means that can easily avoid the influence of such gaseous impurities is desired.

したがって本発明の目的は,軟X線除電装置内で発生するガス状不純物を電子デバイスなどに影響させずに排出できる手段を提供することにある。   Accordingly, an object of the present invention is to provide a means capable of discharging gaseous impurities generated in a soft X-ray static elimination apparatus without affecting an electronic device or the like.

本発明によれば,軟X線を照射して除電を行う軟X線除電装置であって,軟X線を照射する軟X線管を密閉筐体内に収納し,密閉筐体内の雰囲気を所望の箇所に排出させる可撓性のチューブを密閉筐体に接続したことを特徴とする,軟X線除電装置が提供される。   According to the present invention, a soft X-ray static eliminator for irradiating with soft X-rays, wherein a soft X-ray tube for irradiating soft X-rays is housed in a sealed casing, and an atmosphere in the sealed casing is desired. A soft X-ray static eliminator is provided, characterized in that a flexible tube to be discharged at the location is connected to a sealed casing.

この軟X線除電装置にあっては,前記チューブに吸引ポンプを装着しても良い。また,前記密閉筐体の外面になされる各種表示が,焼付け塗装,レーザ加工,ケガキのいずれかによってなされていても良い。   In this soft X-ray static eliminator, a suction pump may be attached to the tube. Further, various indications made on the outer surface of the sealed casing may be made by any one of baking painting, laser processing, and marking.

本発明によれば,軟X線除電装置の密閉筐体内で発生したガス状不純物を,軟X線除電装置の周囲に漏洩させずに,可撓性のチューブを通じて所望の箇所に排出させることができる。   According to the present invention, gaseous impurities generated in the sealed casing of the soft X-ray static eliminator can be discharged to a desired location through the flexible tube without leaking around the soft X-ray static eliminator. it can.

以下,本発明の実施の形態を,図面を参照にして説明する。図1は,本発明の実施の形態にかかる軟X線除電装置1を備えた処理ユニット2の説明図である。この処理ユニット2は,仕切壁10によって囲まれた処理空間11において,帯電体の一例としてガラス基板12の除電を行うものとして構成されている。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of a processing unit 2 including a soft X-ray neutralizing device 1 according to an embodiment of the present invention. The processing unit 2 is configured to remove electricity from the glass substrate 12 as an example of a charged body in the processing space 11 surrounded by the partition wall 10.

処理空間11のほぼ中央の高さに,ガラス基板12が支持部材13によって略水平に支持されている。処理空間11を囲む仕切壁10の上面にはファンフィルタユニット15が装着される。ファンフィルタユニット15は,ファン16とフィルタ17を上下に重ねた構成であり,処理空間11内に清浄な空気を下向きに供給する。フィルタ17は,例えばULPAフィルタや,ULPAフィルタとケミカルフィルタの組合わせなどで構成される。   The glass substrate 12 is supported substantially horizontally by the support member 13 at a substantially central height of the processing space 11. A fan filter unit 15 is mounted on the upper surface of the partition wall 10 surrounding the processing space 11. The fan filter unit 15 has a configuration in which a fan 16 and a filter 17 are vertically stacked, and supplies clean air downward in the processing space 11. The filter 17 is composed of, for example, a ULPA filter or a combination of a ULPA filter and a chemical filter.

処理空間11を囲む仕切壁10の下面は,グレーチングなどの通気性のある面に形成されており,ファンフィルタユニット15から供給された清浄な空気を,処理空間11内を下向きに通過させた後,下面から排気させることにより,処理空間11内にダウンフローを形成させている。   The lower surface of the partition wall 10 surrounding the processing space 11 is formed on a surface having air permeability such as grating, and after the clean air supplied from the fan filter unit 15 passes through the processing space 11 downward. The down flow is formed in the processing space 11 by exhausting from the lower surface.

処理空間11内において,支持部材13に支持されているガラス基板12の両側に,本発明の実施の形態にかかる軟X線除電装置1が対をなして配置されている。軟X線除電装置1には,コントローラ20からの電力供給を行うための配線21と,軟X線除電装置1内の雰囲気を排気させるチューブ22が接続されている。   In the processing space 11, the soft X-ray static eliminating devices 1 according to the embodiment of the present invention are arranged in pairs on both sides of the glass substrate 12 supported by the support member 13. The soft X-ray static eliminator 1 is connected to a wiring 21 for supplying power from the controller 20 and a tube 22 for exhausting the atmosphere in the soft X-ray static eliminator 1.

図2は,本発明の実施の形態にかかる軟X線除電装置1の正面図であり,図3は,本発明の実施の形態にかかる軟X線除電装置1の縦断面図である。この軟X線除電装置1は,軟X線を照射する軟X線管25を密閉筐体26内に収納した構成を有している。   FIG. 2 is a front view of the soft X-ray static eliminator 1 according to the embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of the soft X-ray static eliminator 1 according to the embodiment of the present invention. This soft X-ray static elimination apparatus 1 has a configuration in which a soft X-ray tube 25 that irradiates soft X-rays is housed in a sealed casing 26.

この実施の形態では,軟X線管25として,波長0.5〜20オングストロームの極軟X線を照射する極軟X線管が用いられる。軟X線管25には,配線21が接続してあり,コントローラ20から配線21を通じて電力供給が行われて,軟X線管25は軟X線(極軟X線)を照射するようになっている。   In this embodiment, an extremely soft X-ray tube that irradiates an extremely soft X-ray having a wavelength of 0.5 to 20 angstroms is used as the soft X-ray tube 25. A wiring 21 is connected to the soft X-ray tube 25, and power is supplied from the controller 20 through the wiring 21, so that the soft X-ray tube 25 emits soft X-rays (extremely soft X-rays). ing.

軟X線除電装置1の前面(密閉筐体26の前面)には,軟X線を透過させるベリリウムの透過窓27が設けてあり,図1に示す一対の軟X線除電装置1は,いずれも透過窓27を内側のガラス基板12に向けた姿勢に配置されている。密閉筐体26の内部において軟X線管25から照射された軟X線が,この透過窓27を透過してガラス基板12に向けて照射され,ガラス基板12の静電気を除電する構成になっている。   A beryllium transmission window 27 that transmits soft X-rays is provided on the front surface of the soft X-ray static elimination device 1 (front surface of the sealed casing 26). The pair of soft X-ray static elimination devices 1 shown in FIG. Also, the transmission window 27 is disposed in a posture facing the inner glass substrate 12. The soft X-rays irradiated from the soft X-ray tube 25 inside the hermetic casing 26 pass through the transmission window 27 and are irradiated toward the glass substrate 12 so that static electricity on the glass substrate 12 is eliminated. Yes.

前述のチューブ22は,両端が開口した中空な構造であり,その内部に空気を流通させることができる。チューブ22の先端部は,密閉筐体26の後面(ランプヘッドとなる透過窓27のある面と反対の面)に形成された開口部28にチューブ継ぎ手などを介して密接に接続されている。例えば,チューブ22の先端部を開口部28に密着させる,チューブ22の先端部で開口部28を覆う等の方法で接続されている。なお,開口部28は,熱の発生源となる軟X線管25のなるべく近くに形成してある。密閉筐体26は,開口部28を除き,シール材等で目地止めされた密閉の構造体である。このため,密閉筐体26内の雰囲気は,開口部28からチューブ22内を通ってのみ外部に排出されるようになっている。換言すれば,チューブ22の開放端部22’以外の箇所からは,密閉筐体26内の雰囲気が外部に排出されることがない。この場合,開口部28を軟X線管25のなるべく近くに形成しておくことにより,軟X線管25によって発生した熱雰囲気を速やかに外部に排出させることができる。なお,密閉筐体26内を密封するシール材の一例として,脱ガス量の少ないハマタイトYG−61R(商品名)を使用することができる。ただし,シール材は脱ガス量が少ないものであれば,特に製品は特定されない。   The above-described tube 22 has a hollow structure with both ends opened, and air can be circulated therein. The distal end of the tube 22 is closely connected to an opening 28 formed on the rear surface of the sealed casing 26 (the surface opposite to the surface having the transmission window 27 serving as a lamp head) via a tube joint or the like. For example, the tube 22 is connected by a method such as bringing the tip of the tube 22 into close contact with the opening 28 or covering the opening 28 with the tip of the tube 22. The opening 28 is formed as close as possible to the soft X-ray tube 25 that is a heat generation source. The sealed casing 26 is a sealed structure that is jointed with a sealant or the like except for the opening 28. For this reason, the atmosphere in the sealed casing 26 is discharged to the outside only through the inside of the tube 22 from the opening 28. In other words, the atmosphere in the sealed casing 26 is not discharged from the portion other than the open end portion 22 ′ of the tube 22. In this case, by forming the opening 28 as close as possible to the soft X-ray tube 25, the thermal atmosphere generated by the soft X-ray tube 25 can be quickly discharged to the outside. In addition, as an example of a sealing material that seals the inside of the hermetic casing 26, Hamatite YG-61R (trade name) with a small degassing amount can be used. However, as long as the degassing amount is small, the product is not specified.

チューブ22は可撓性の材質からなっており,任意に変形させることにより,チューブ22の開放端部22’を所望の箇所に配置させることが可能である。チューブ22は,例えばテフロン(登録商標)等のフッ素系樹脂などで構成される。なお,チューブ22の長さは,チューブ22の開放端部22’を所望の箇所に移動させて,軟X線除電装置1内の雰囲気(密閉筐体26内の雰囲気)を所望の箇所に排出するのに充分な長さに設定される。   The tube 22 is made of a flexible material, and the open end portion 22 ′ of the tube 22 can be disposed at a desired location by being arbitrarily deformed. The tube 22 is made of, for example, a fluorine resin such as Teflon (registered trademark). The length of the tube 22 is determined by moving the open end 22 ′ of the tube 22 to a desired location and discharging the atmosphere in the soft X-ray static elimination apparatus 1 (the atmosphere in the sealed casing 26) to the desired location. It is set to a length sufficient to

軟X線除電装置1の外側面(密閉筐体26の外側面)には,製品名,品番,シリアルナンバー,注意書き,使用説明,その他諸々の各種表示30がなされている。これら各種表示30は,焼付け塗装,レーザ加工,ケガキのいずれかによってなされている。焼付け塗装は,シルク印刷等で印刷用塗料を塗布した塗装膜を,100〜200℃程度の高温で乾燥させる塗装方法である。レーザ加工は,レーザを用いて密閉筐体26の外側面に印字加工を施す方法である。ケガキは,トースカンその他の器具を用いて密閉筐体26の外側面に線を引く方法であり,機械加工,手書きの何れでも良い。   On the outer surface of the soft X-ray static elimination apparatus 1 (the outer surface of the sealed casing 26), various displays 30 such as a product name, a product number, a serial number, a cautionary note, an instruction for use, and various other information are made. These various displays 30 are made by any one of baking painting, laser processing, and marking. Baking coating is a coating method in which a coating film coated with a printing paint by silk printing or the like is dried at a high temperature of about 100 to 200 ° C. Laser processing is a method of performing printing processing on the outer surface of the sealed casing 26 using a laser. The scribing is a method of drawing a line on the outer surface of the sealed casing 26 using a Toscan or other instrument, and may be either machine processing or handwriting.

さて,図1に示した処理ユニット2において,ガラス基板12の両側に配置された軟X線除電装置1からガラス基板12に向けて軟X線が照射され,電気分子をイオン化させることによりガラス基板12の静電気が除電される。軟X線は,薄い空気層によってもたやすく吸収されるような透過能の小さいX線領域にあり,その波長は一般に数オングストロームから数百オングストロームである。そのような軟X線は透過能が小く,ガス分子の光子吸収率も高くて,ガス分子をイオン化しやすい特性を有する。また,イオン化過程において中性の酸素原子(ラジカル)をほとんど生成させず,オゾンが発生しない。なお,この実施の形態のように,波長0.5〜20オングストロームの極軟X線を用いることにより,オゾンの発生をより確実に抑制できるようになる。   In the processing unit 2 shown in FIG. 1, soft X-rays are irradiated toward the glass substrate 12 from the soft X-ray neutralization apparatus 1 disposed on both sides of the glass substrate 12, and the electric molecules are ionized to cause the glass substrate. 12 static electricity is removed. Soft X-rays are in the X-ray region with a low transmission ability so that they are easily absorbed by a thin air layer, and their wavelengths are generally several angstroms to several hundreds angstroms. Such soft X-rays have a low transmission ability, a high photon absorption rate of gas molecules, and a property of easily ionizing gas molecules. In addition, neutral oxygen atoms (radicals) are hardly generated in the ionization process, and ozone is not generated. As in this embodiment, generation of ozone can be more reliably suppressed by using extremely soft X-rays having a wavelength of 0.5 to 20 angstroms.

一方,このように軟X線照射を行う軟X線除電装置1は,その使用時において,例えば電子の加速電圧Vと電子電流Aの積A×Vや,電子を発生させるためのヒータ発熱,トランス等のロスなどによって,密閉筐体26内部の温度が40〜60℃程度まで上昇する。それに伴い,密閉筐体26内部に配置された樹脂等からガス状不純物が発生し,それが膨張して密閉筐体26内部が高圧となる。こうして高圧となった密閉筐体26の内部雰囲気は,開口部28からチューブ22内を通って開放端部22’から排出される。   On the other hand, the soft X-ray neutralization apparatus 1 that performs soft X-ray irradiation in this way is, for example, a product A × V of an electron acceleration voltage V and an electron current A, heater heat generation for generating electrons, The temperature inside the sealed casing 26 rises to about 40 to 60 ° C. due to loss of a transformer or the like. Along with this, gaseous impurities are generated from the resin or the like disposed inside the sealed casing 26, which expands to increase the pressure inside the sealed casing 26. The internal atmosphere of the hermetic casing 26 having a high pressure in this manner is discharged from the open end portion 22 ′ through the tube 22 from the opening portion 28.

そこで,この軟X線除電装置1を使用する場合は,チューブ22の開放端部22’をガラス基板12への影響のない箇所に配置させ,密閉筐体26の内部雰囲気をガラス基板12への影響のない箇所で排出させることにより,密閉筐体26内で発生したガス状不純物のガラス基板12への影響を回避する。例えば図1の例で説明すれば,チューブ22の開放端部22’を処理空間11内においてガラス基板12よりも下方に離して配置すれば,チューブ22の開放端部22’から出た密閉筐体26内雰囲気は,処理空間11内に形成されたダウンフローに乗って,ガラス基板12に触れることなく,そのまま仕切壁10の下面から処理空間11外へ排出される。これにより,密閉筐体26内で発生したガス状不純物のガラス基板12への悪影響を回避することが可能となる。なお,このように仕切壁10の下面から処理空間11外へ排出した密閉筐体26内雰囲気を含む空気を,ファンフィルタユニット15から再び処理空間11内に供給する場合は,ファンフィルタユニット15のフィルタ17には,ULPAフィルタとケミカルフィルタの組合わせを利用することが好ましい。   Therefore, when this soft X-ray static elimination apparatus 1 is used, the open end portion 22 ′ of the tube 22 is arranged at a place where there is no influence on the glass substrate 12, and the internal atmosphere of the sealed housing 26 is applied to the glass substrate 12. By discharging at a place where there is no influence, the influence of the gaseous impurities generated in the sealed casing 26 on the glass substrate 12 is avoided. For example, referring to the example of FIG. 1, if the open end 22 ′ of the tube 22 is arranged below the glass substrate 12 in the processing space 11, the sealed housing that protrudes from the open end 22 ′ of the tube 22 will be described. The atmosphere in the body 26 rides on the downflow formed in the processing space 11 and is directly discharged from the lower surface of the partition wall 10 to the outside of the processing space 11 without touching the glass substrate 12. As a result, it is possible to avoid adverse effects of gaseous impurities generated in the sealed casing 26 on the glass substrate 12. When air containing the atmosphere in the sealed casing 26 discharged from the lower surface of the partition wall 10 to the outside of the processing space 11 is supplied from the fan filter unit 15 to the processing space 11 again, the fan filter unit 15 The filter 17 is preferably a combination of a ULPA filter and a chemical filter.

このように,密閉筐体26内の雰囲気を排出させるチューブ22を接続したことにより,軟X線照射による温度上昇に伴って密閉筐体26内で発生したガス状雰囲気を含む雰囲気を,所望の位置に排出させることができ,除電対象であるガラス基板12などの帯電体に影響のない箇所に排気することが可能となる。また,密閉筐体26内の熱を外に逃すことによって温度上昇も抑制できる。このため,帯電体を汚染することのない電子デバイスなどの製造に好適な環境を提供できるようになる。なお,チューブ22の長さは,チューブ22の開放端部22’を所望の箇所に移動させて,軟X線除電装置1内の雰囲気(密閉筐体26内の雰囲気)を,除電対象であるガラス基板12などに影響のない箇所に排気させるのに充分な長さに設定すれば良い。   As described above, by connecting the tube 22 for discharging the atmosphere in the sealed casing 26, an atmosphere including a gaseous atmosphere generated in the sealed casing 26 with a rise in temperature due to the soft X-ray irradiation can be obtained. It can be discharged to a position, and it can be discharged to a place where there is no influence on the charged body such as the glass substrate 12 to be neutralized. Further, the temperature rise can be suppressed by releasing the heat in the sealed casing 26 to the outside. For this reason, it becomes possible to provide an environment suitable for manufacturing electronic devices and the like that do not contaminate the charged body. Note that the length of the tube 22 is such that the open end 22 ′ of the tube 22 is moved to a desired location, and the atmosphere in the soft X-ray static elimination apparatus 1 (the atmosphere in the sealed casing 26) is a charge removal target. What is necessary is just to set to length sufficient to exhaust to the location which does not affect the glass substrate 12 grade | etc.,.

また,この軟X線除電装置1は,密閉筐体26の外側面になされる各種表示30が,焼付け塗装,レーザ加工,ケガキのいずれかによってなされているため,それら各種表示30からガス状不純物を実質的に発生させず,除電対象であるガラス基板12などに各種表示30から悪影響を及ぼす心配もない。   Further, in this soft X-ray static elimination apparatus 1, since various indications 30 formed on the outer surface of the hermetic casing 26 are made by any one of baking coating, laser processing, and scribing, the gaseous impurities are removed from these various indications 30. Is not substantially generated, and there is no concern that the various displays 30 may adversely affect the glass substrate 12 or the like that is the object of charge removal.

次に,図4は,本発明の別の実施の形態にかかる軟X線除電装置1’を備えた処理ユニット2’の説明図である。この実施の形態においても,処理空間11の内部に帯電体としてのガラス基板12が支持部材13によってほぼ水平に支持されている。但し,この実施の形態では,ガラス基板12の側方に配置された軟X線除電装置1’において,密閉筐体26に接続された可撓性のチューブ22に吸引ポンプ35を装着した点が異なっている。また,この実施の形態では,チューブ22の開放端部22’を,処理空間11の外部において排気ダクト36の吸引開口部36’に対向する位置に配置させている。その他の点は,先に図1等で説明した実施の形態と同様であるので,重複説明を省略する。   Next, FIG. 4 is an explanatory diagram of a processing unit 2 'provided with a soft X-ray neutralizing apparatus 1' according to another embodiment of the present invention. Also in this embodiment, the glass substrate 12 as a charged body is supported substantially horizontally by the support member 13 in the processing space 11. However, in this embodiment, in the soft X-ray static eliminator 1 ′ arranged on the side of the glass substrate 12, the suction pump 35 is attached to the flexible tube 22 connected to the sealed casing 26. Is different. In this embodiment, the open end 22 ′ of the tube 22 is disposed outside the processing space 11 at a position facing the suction opening 36 ′ of the exhaust duct 36. The other points are the same as those in the embodiment described above with reference to FIG.

この図4に示した実施の形態によれば,密閉筐体26内の雰囲気をチューブ22に装着した吸引ポンプ35の稼動で強制的に排気できるので,密閉筐体26内を不圧にすることができ,ガス状不純物を含む密閉筐体26内雰囲気が処理空間11内に漏れ出ることをより確実に防止できるようになる。なお,吸引ポンプ35の稼動でチューブ22の開放端部22’から排気された密閉筐体26内雰囲気は,その後,排気ダクト36を通じて排気される。   According to the embodiment shown in FIG. 4, the atmosphere in the sealed casing 26 can be forcibly exhausted by the operation of the suction pump 35 attached to the tube 22. As a result, the atmosphere in the sealed casing 26 containing gaseous impurities can be more reliably prevented from leaking into the processing space 11. The atmosphere in the sealed casing 26 exhausted from the open end 22 ′ of the tube 22 by the operation of the suction pump 35 is then exhausted through the exhaust duct 36.

以上,本発明の好ましい実施の形態を例示したが,本発明はここに説明した形態に限定されない。例えば,軟X線除電装置は,波長0.5〜20オングストロームの極軟X線を照射するものに限らず,波長数百オングストローム程度までの軟X線を照射するものであっても良い。また,本発明の軟X線除電装置は,ガラス基板のほか,半導体ウェハ,その他の電子デバイスといった各種帯電体の除電に利用できる。   As mentioned above, although preferred embodiment of this invention was illustrated, this invention is not limited to the form demonstrated here. For example, the soft X-ray neutralization apparatus is not limited to the one that irradiates ultra-soft X-rays having a wavelength of 0.5 to 20 angstroms, but may be one that irradiates soft X-rays having a wavelength of about several hundred angstroms. The soft X-ray neutralization apparatus of the present invention can be used for neutralization of various charged bodies such as a semiconductor wafer and other electronic devices in addition to a glass substrate.

本発明は,電子デバイスなどの除電を行う軟X線除電装置に適用できる。   The present invention can be applied to a soft X-ray static eliminator that neutralizes an electronic device or the like.

本発明の実施の形態にかかる軟X線除電装置を備えた処理ユニットの説明図である。It is explanatory drawing of the processing unit provided with the soft X-ray static elimination apparatus concerning embodiment of this invention. 本発明の実施の形態にかかる軟X線除電装置の正面図である。It is a front view of the soft X-ray static elimination apparatus concerning embodiment of this invention. 本発明の実施の形態にかかる軟X線除電装置の縦断面図である。It is a longitudinal cross-sectional view of the soft X-ray static elimination apparatus concerning embodiment of this invention. 本発明の別の実施の形態にかかる軟X線除電装置を備えた処理ユニットの説明図である。It is explanatory drawing of the processing unit provided with the soft X-ray static elimination apparatus concerning another embodiment of this invention.

符号の説明Explanation of symbols

1 軟X線除電装置
2 処理ユニット
10 仕切壁
11 処理空間
12 ガラス基板
13 支持部材
15 ファンフィルタユニット
16 ファン
17 フィルタ
20 コントローラ
21 配線
22 チューブ
22’ 開放端部
25 軟X線管
26 密閉筐体
27 透過窓
28 開口部
30 各種表示
35 吸引ポンプ
36 排気ダクト
DESCRIPTION OF SYMBOLS 1 Soft X-ray static elimination apparatus 2 Processing unit 10 Partition wall 11 Processing space 12 Glass substrate 13 Support member 15 Fan filter unit 16 Fan 17 Filter 20 Controller 21 Wiring 22 Tube 22 'Open end 25 Soft X-ray tube 26 Sealed housing 27 Transmission window 28 Opening 30 Various displays 35 Suction pump 36 Exhaust duct

Claims (3)

軟X線を照射して除電を行う軟X線除電装置であって,
軟X線を照射する軟X線管を密閉筐体内に収納し,密閉筐体内の雰囲気を所望の箇所に排出させる可撓性のチューブを密閉筐体に接続したことを特徴とする,軟X線除電装置。
A soft X-ray static eliminator that performs static elimination by irradiating soft X-rays,
A soft X-ray tube that irradiates soft X-rays is housed in a sealed casing, and a flexible tube that discharges the atmosphere in the sealed casing to a desired location is connected to the sealed casing. Wire static eliminator.
前記チューブに吸引ポンプを装着したことを特徴とする,請求項1に記載の軟X線除電装置。 The soft X-ray static eliminator according to claim 1, wherein a suction pump is attached to the tube. 前記密閉筐体の外面になされる各種表示が,焼付け塗装,レーザ加工,ケガキのいずれかによってなされていることを特徴とする,請求項1または2に記載の軟X線除電装置。 The soft X-ray static eliminator according to claim 1 or 2, wherein various indications made on an outer surface of the sealed casing are made by any one of baking painting, laser processing, and marking.
JP2005113551A 2005-04-11 2005-04-11 Soft X-ray static eliminator Expired - Fee Related JP4633524B2 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203134A (en) * 2000-01-18 2001-07-27 Tabai Espec Corp Heat treatment apparatus having destaticizer
JP2001313197A (en) * 2000-05-01 2001-11-09 Harada Sangyo Kk Light irradiation static electricity removing device with cooling function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203134A (en) * 2000-01-18 2001-07-27 Tabai Espec Corp Heat treatment apparatus having destaticizer
JP2001313197A (en) * 2000-05-01 2001-11-09 Harada Sangyo Kk Light irradiation static electricity removing device with cooling function

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