JP4631545B2 - Method for manufacturing liquid discharge head - Google Patents

Description

The present invention is, for example, a method of manufacturing a liquid discharge head used as a print head of an ink jet printer details, the coating layer formed discharge ports of the liquid, so that defects such as cracks and peeling will not occur those relating to the method of manufacturing a liquid discharge head was.

  Conventionally, a thermal printer head is known as an example of a liquid discharge head. In general, the printer head includes a plurality of heating elements arranged in one direction on a substrate, a coating layer in which a plurality of ejection ports facing each heating element are arranged, and a common ink flow path. An individual flow path for supplying ink to the heat generating element is provided, and the heat generating element is driven to discharge ink from the discharge port to perform printing.

FIG. 12 is a side sectional view showing such a conventional printer head 30.
As shown in FIG. 12, the conventional printer head 30 includes an ink supply member 41 and a chip 31 bonded on the ink supply member 41. Here, in the chip 31, the heating elements 33 are arranged on the semiconductor substrate 32, and the coating layer 35 is provided on the heating elements 33 so that the discharge ports 34 are located. An ink individual flow path 36 is formed in the region on the heat generating element 33, and a through hole 37 communicating with the individual flow path 36 is formed in the semiconductor substrate 32.

  On the other hand, the ink supply member 41 is formed by machining using aluminum, stainless steel, resin, or the like. In FIG. 12, an ink supply port 42 is provided on the lower surface side, and a common flow path 43 is formed so as to penetrate the base of the ink supply member 41 in communication with the ink supply port 42. Therefore, ink is supplied from an external ink tank or the like (not shown) into the common channel 43 through the ink supply port 42, and this ink passes through the through hole 37 of the chip 31 and enters the individual channel 36. It enters and fills the area of the heating element 33.

  When the heat generating element 33 is driven in this state to rapidly heat the ink, bubbles are generated on the heat generating element 33, and the ink on the heat generating element 33 is discharged from the discharge port 34 by the pressure change at the time of the bubble generation. It is ejected as a droplet. The ejected ink droplets land on photographic paper or the like to form pixels.

Incidentally, the chip 31 in the conventional printer head 30 shown in FIG. 12 is manufactured as follows.
That is, first, the heating element 33 is formed on a substrate such as silicon (semiconductor substrate 32) using a semiconductor manufacturing technique or the like. Next, a dissolvable resin, for example, a photosensitive resin such as a photoresist, is formed by patterning using a photolithographic technique, and a sacrificial layer corresponding to the individual flow path 36 is formed thereon. Furthermore, on the sacrificial layer, for example, a resin is applied by spin coating or the like to form a covering layer 35 that becomes a structure.

Subsequently, the discharge port 34 is formed in the coating layer 35 by dry etching or, for example, if the coating layer 35 is a photosensitive resin, the photolithography technique. Thereafter, a through hole 37 is formed from the back surface of the semiconductor substrate 32 by wet etching or the like, and a solution for the sacrifice layer (a developing solution if the sacrifice layer is a photosensitive resin) is poured from the through hole 37 to dissolve the sacrifice layer. To remove. Thereby, the chip 31 in which the individual flow path 36 is formed on the semiconductor substrate 32 is manufactured (for example, see Patent Document 1).
Japanese Patent No. 3343875

  In the technique described in Patent Document 1, the through hole 37 is formed from the back surface of the semiconductor substrate 32 when the sacrificial layer for forming the individual flow path 36 is eluted. Here, the process of opening the through hole 37 in the semiconductor substrate 32 is generally performed by either one of the anisotropic wet etching technique and the dry etching technique, or a combination of both.

However, if the through holes 37 are formed in the semiconductor substrate 32 using an anisotropic wet etching technique or a dry etching technique, the manufacturing process becomes complicated and the manufacturing time becomes longer. Therefore, the printer head 30 including such a chip 31 has a problem that the yield is low and the cost is high.
Therefore, it is conceivable to manufacture the chip 31 without opening the through hole 37 in the semiconductor substrate 32.

FIG. 13 is a side sectional view and a perspective view showing a part of the manufacturing method of the chip 41 improved so that it is not necessary to open a through hole.
As shown in FIG. 13A, in the improved manufacturing method, when the sacrificial layer 48 is eluted between the semiconductor substrate 42 in which the heating elements 43 are arranged and the coating layer 45 in which the discharge ports 44 are formed, the semiconductor substrate 42 is removed. An opening 47 is newly formed above the dicing line 42a to be cut. That is, in addition to the discharge port 44, the coating layer 45 on the dicing line 42 a is also removed to form an opening 47, and a through hole is formed in the semiconductor substrate 42 by using the discharge port 44 and the opening 47. Instead, the sacrificial layer 48 is eluted.

Then, after the sacrificial layer 48 is eluted, the semiconductor substrate 42 is cut using a dicer 50 as shown in FIG. That is, the individual chips 41 are manufactured by cutting the semiconductor substrate 42 along the dicing line 42a while spraying pure water onto the dicing blade 51 that rotates at high speed. Therefore, when manufacturing the chip 41, it is not necessary to make a through hole in the semiconductor substrate 42.
However, with such a manufacturing method, when the semiconductor substrate 42 is cut, there is a possibility that a defect such as a crack or peeling may occur in the coating layer 45.

14A and 14B are a plan view and a side sectional view showing the occurrence of defects in the method of manufacturing the chip 41 improved as described above.
As shown in FIG. 14, the coating layer 45 including the discharge ports 44 constitutes the left and right channel walls of the individual channel 46 and also serves as the top wall of the individual channel 46. Therefore, the covering layer 45 has an eaves-like shape at the tip portion close to the cut surface (hereinafter, this portion is referred to as “eave portion”).

  Here, when the semiconductor substrate 42 is cut by the dicer 50 (see FIG. 13), a pure water flow is generated from the cut surface toward the individual flow path 46. Then, a large water pressure acts on the eaves portion of the coating layer 45, and as shown in FIG. 14A, the eaves portion is cracked and cracked toward the discharge port 44. ), The eaves portion is pushed up by the water flow, and the covering layer 45 may be peeled off.

  Therefore, the problem to be solved by the present invention is to allow the sacrificial layer to be eluted without making a through hole in the semiconductor substrate, and to prevent defects such as cracks and peeling from occurring in the coating layer. In other words, the liquid discharge head can be manufactured at low cost.

The present invention solves the above-described problems by the following means.
The invention of claim 1 which is one of the present invention, a first step in which a plurality of energy generating elements for discharging liquid onto a substrate that is arranged in one direction, to form the sacrificial layer by soluble resin A second step of forming a covering layer on the sacrificial layer; and a plurality of discharge ports that are formed simultaneously with the second step or after the second step and face the energy generating elements in the covering layer. a third step in the method of manufacturing the liquid discharge head comprising forming a third step and performed one after the same time or the third step and the phases were separated the individual channels with each of said discharge port Performed after the opening forming step of forming an opening in the covering layer, the third step and the opening forming step , so that the covering layer on the opposite side has a recess , the discharge port and the opening The sacrificial layer is eluted from each of the energy generating elements A fourth step of forming a separate flow path extending in the direction orthogonal to the arrangement direction, is performed after the fourth step, using the dicer, the substrate in the opening while spraying pure water to the dicing blade to rotate look including a cutting step of cutting, said recess of said coating layer, when viewed from above the dicing lines for cutting the substrate by the cutting step, retracted toward the individual channels from the opening shape And

According to the first aspect of the present invention, the liquid discharge head is manufactured by the steps including the first step to the fourth step. The manufacturing process of the liquid discharge head includes an opening forming step for forming an opening in the coating layer so that the coating layer on the opposite side across the discharge port and the individual flow path has a recess. . Therefore, when the sacrificial layer is dissolved with the dissolving liquid to form the individual flow path, the sacrificial layer can be eluted from the discharge port and the opening without forming a through hole in the substrate. Further, the manufacturing process of the liquid discharge head includes a cutting process for cutting the substrate in the opening, but the coating layer is opened when viewed from above the dicing line for cutting the substrate by the cutting process. Since the concave portion having a shape retracted from the portion toward the individual flow path is provided, the substrate can be cut without causing cracks or peeling in the eaves portion of the coating layer.

According to the first aspect of the present invention, in the opening forming step, the sacrificial layer is eluted from the discharge port and the opening to form the individual flow path, and the liquid discharge head can be manufactured. Therefore, the process of forming the through hole in the substrate is not necessary, the yield is good, and the liquid discharge head can be manufactured at a low cost. Further, the liquid discharge head can be manufactured by cutting the substrate without causing cracks or peeling at the eaves portion of the covering layer. Therefore, the yield can be improved and the liquid discharge head can be manufactured at low cost.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following embodiments, a liquid discharge head and a method for manufacturing the liquid discharge head according to the present invention are thermal ink jet printer heads (hereinafter simply referred to as “printer heads”) that discharge ink as a liquid and a method for manufacturing the same. As an example.

(First embodiment)
FIG. 1 to FIG. 6 are side cross-sectional views for sequentially explaining intermediate steps in the method of manufacturing the printer head 10 of the first embodiment. FIG. 7 is a side sectional view showing the printer head 10 according to the first embodiment manufactured through processes including the processes of FIGS. 1 to 6.
First, FIG. 1 shows a first step (FIG. 1A) for forming a sacrificial layer 13 on a semiconductor substrate 11 (corresponding to “substrate” in the present invention), and a coating on the sacrificial layer 13. It is sectional drawing of the side surface which shows the 2nd process (FIG.1 (b)) which forms the layer.

  In the manufacturing method of the printer head 10 of the first embodiment, as shown in FIG. 1A, for example, a fine structure for semiconductor or electronic device manufacturing technology is formed on a semiconductor substrate 11 made of silicon, glass, ceramics, or the like. A plurality of heating elements 12 (corresponding to “energy generating elements” in the present invention) are formed using a processing technique. Here, the heating elements 12 are arranged at a predetermined pitch continuously in one direction in the direction perpendicular to the paper surface in FIG. 1A. For example, in the case of the printer head 10 having a resolution of 600 DPI. The pitch between the heating elements 12 is 42.3 μm. In the first embodiment, a silicon wafer is used as the semiconductor substrate 11.

  Then, a sacrificial layer 13 is formed at least in a region serving as a liquid chamber on each heating element 12, a region serving as an individual flow path, and a region including the dicing line 11a of the semiconductor substrate 11 (first step). The sacrificial layer 13 is formed by a method such as spin coating with a soluble resin, for example, a photosensitive resin such as a photoresist, on the semiconductor substrate 11 and the heating element 12 in order to form each liquid chamber and each individual flow path. The pattern of each liquid chamber and each individual flow path is formed by photolithography. That is, in the first embodiment, a positive photoresist PMER-LA900 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is applied onto the semiconductor substrate 11 by spin coating so as to have a film thickness of 10 μm. After the exposure, the substrate is developed with a developer (tetramethylammonium hydroxide 3% aqueous solution) and rinsed with pure water to form a sacrificial layer 13 in which patterns such as individual channels are formed. Then, the entire surface of the resist pattern of the sacrificial layer 13 was exposed with a mask aligner and allowed to stand naturally in a nitrogen atmosphere for 24 hours.

  Next, as shown in FIG. 1B, for example, a photosensitive resist is applied on the sacrificial layer 13 by a method such as spin coating, and a coating layer is formed on a region including the region where the sacrificial layer 13 is formed. 14 is formed (second step). Specifically, a photo-curing negative photoresist is applied onto the patterned sacrificial layer 13 resist by spin coating so as to have a film thickness of 10 μm by spin coating to form a coating layer 14. To do. In addition, this coating layer 14 is a layer which has a function as a general nozzle sheet and a barrier layer, and becomes a structure.

  FIG. 2 shows a third step of forming the discharge port 15 and an opening forming step of forming the opening 16 (FIG. 2A) in the coating layer 14 formed in the second step shown in FIG. FIG. 10 is a side sectional view showing a fourth step (FIG. 2B) of eluting the sacrificial layer 13 to form the individual flow path 18. In the first embodiment, the discharge port 15 and the opening 16 are formed at the same time. However, they can be formed separately as long as they are before the fourth step.

  As shown in FIG. 2A, the discharge port 15 is formed in the coating layer 14 positioned immediately above each heating element 12 (third step). Here, for example, if the coating layer 14 is a photosensitive resin, the ejection port 15 is formed by patterning by, for example, photolithography so as to reach the sacrificial layer 13, that is, through the coating layer 14. The Specifically, the coating layer 14 is exposed with a mask aligner, developed and rinsed with a developer (OK73 thinner: manufactured by Tokyo Ohka Kogyo Co., Ltd.) and a rinse solution (IPA), and the discharge port 15 having a diameter of 15 μm is formed. Form.

  At the same time, similarly, an opening 16 is formed above the dicing line 11a for cutting the semiconductor substrate 11 (opening forming step). That is, the covering layer 14 on the dicing line 11a is removed to expose the lower sacrificial layer 13, and the opening 16 is formed. At this time, the opening 16 protrudes in a triangular convex shape toward the region serving as the individual flow path (so that the concave portion 14a having a shape recessed in the triangular concave shape is formed in the coating layer 14). A mask pattern is designed in advance. Note that when the discharge port 15 and the opening 16 are simultaneously formed, a photomask capable of forming them at the same time may be used.

  Next, by immersing the semiconductor substrate 11, the sacrificial layer 13, and the coating layer 14 in a liquid tank filled with a solution in which the sacrificial layer 13 is dissolved, as shown by arrows in FIG. The sacrificial layer 13 is eluted from the discharge port 15 and the opening 16, respectively. That is, while ultrasonic vibration is applied to an organic solvent (PGMEA) that is soluble in the positive photoresist, the immersion is continued until the positive photoresist is completely dissolved and eluted. And the individual flow path 18 which used the coating layer 14 extended in the direction (direction parallel to the paper surface in FIG. 2) orthogonal to the arrangement direction (direction perpendicular to the paper surface in FIG. 2) of each heat generating element 12 as a flow channel wall. Is formed (fourth step).

  As described above, when the semiconductor substrate 11, the sacrificial layer 13, and the coating layer 14 are immersed in the solution, the sacrificial layer 13 is dissolved by the solution and becomes a fluid, as shown in FIG. It elutes from the outlet 15 and the opening 16 to the outside of the coating layer 14. On the other hand, the semiconductor substrate 11 and the coating layer 14 have no change in shape or the like before and after immersion with the dissolving liquid. Thereby, the portion where the sacrificial layer 13 was present becomes a void, and this portion becomes the individual flow path 18 and the liquid chamber 19. Therefore, after elution of the sacrificial layer 13, the coating layer 14 becomes a structure, and the discharge port 15 formed in the coating layer 14 communicates with the individual flow path 18. Further, the heating element 12 is present inside the liquid chamber 19. Furthermore, a concave portion 14 a is formed in the coating layer 14 on the opposite side across the discharge port 15 and the individual flow path 18, and is recessed into a triangular concave shape toward the individual flow path 18.

FIG. 3 is a plan view showing a state where the fourth step has been completed.
As shown in FIG. 3, after elution of the sacrificial layer 13 (see FIG. 2), the side surface of the individual channel 18 is partitioned by the coating layer 14, and the top surface of the individual channel 18 is covered by the coating layer 14. . In addition, a discharge port 15 is formed in the coating layer 14 so as to face the heating element 12. Further, on the opening 16 side, a triangular recess 14 a toward the individual flow path 18 is formed in the coating layer 14. That is, the eaves portion of the coating layer 14 is a triangular recess 14a.

4A and 4B are a perspective view and a side sectional view showing a cutting process of cutting the semiconductor substrate 11 into one chip 20. FIG. 5 is a plan view and a side sectional view showing such a cutting process.
As shown in FIG. 4A, in this cutting step, the dicer 50 is used and the semiconductor substrate 11 is cut while spraying pure water onto the dicing blade 51 that rotates at high speed. That is, as shown in FIG. 4B, the semiconductor substrate 11 is cut along the dicing line 11 a of the semiconductor substrate 11 exposed through the opening 16 of the covering layer 14 to form one chip 20.

  At this time, as shown in FIG. 5, the pure water sprayed on the dicing blade 51 becomes a water flow that flows toward the individual flow path 18. However, as described above, the coating layer 14 has the triangular recesses 14 a. It is formed and has a shape retracted toward the individual flow path 18. Therefore, the water pressure acting on the coating layer 14 (water flow acting to push up the eaves portion from below) is released by the triangular recess 14a. That is, the coating layer 14 has the weakest strength at the center in the width direction of the individual flow path 18, but the water pressure is the lowest at the center. Therefore, in the chip 20 shown in FIG. 5, the coating layer 14 is free from defects such as cracking and peeling.

FIG. 6 is a side cross-sectional view showing a fifth step of bonding one chip 20 manufactured in this way to an ink supply member 21 (corresponding to a “liquid supply member” in the present invention).
Here, the ink supply member 21 is made of, for example, aluminum, stainless steel, ceramics, or resin that is manufactured by machining or the like separately from the manufacture of the chip 20. The through-hole which penetrates is formed. The lower surface side of the through hole is an ink supply port 22, and the inside is a common flow path 23.

  Such adhesion between the ink supply member 21 and the chip 20 is performed using a silicone-based adhesive so that the opening surface of the individual flow path 18 in the chip 20 faces the common flow path 23 side (fifth step). . Then, the individual flow path 18 of the chip 20 and the common flow path 23 of the ink supply member 21 communicate with each other. The bonding conditions are natural standing for 1 hour at room temperature.

  Further, as shown in FIG. 6, the ink supply member 21 is formed such that the upper surface on the side to which the chip 20 is bonded with the common flow path 23 is lower than the upper surface on the opposite side. When the chip 20 is bonded, the upper surface of the covering layer 14 of the chip 20 and the upper surface of the ink supply member 21 on the side where the chip 20 is not bonded are substantially flush with each other. Therefore, a top plate (not shown) that closes the upper portions of the recesses 14a and the common flow path 23 can be bonded so as to straddle the upper surface of the covering layer 14 of the chip 20 and the upper surface of the ink supply member 21 (sealing). Stop process).

FIG. 7 is a side cross-sectional view showing a state in which the top plate 24 is bonded to form the printer head 10 of the first embodiment. In addition, the part of the recessed part 14a in the coating layer 14 has shown partially the top view of the direction of an arrow.
As shown in FIG. 7, in the printer head 10 of the first embodiment, one chip 20 is bonded to the ink supply member 21, and straddles the upper surface of the chip 20 and the upper surface of the ink supply member 21. A top plate 24 is attached.

  The top plate 24 is a sheet-like member formed from, for example, a resin film such as polyimide or PET, or a metal foil such as nickel, aluminum, or stainless steel, and is cut into a desired shape in advance and is on the coating layer 14. Affixed to the top plate adhesive white area. The adhesive for attaching the top plate 24 is applied in advance to the lower surface of the top plate 24 or the top plate adhesion white area of the coating layer 14 and the upper surface of the ink supply member 21, and the printer head according to the first embodiment. 10, a polyimide film having a thickness of 25 μm is used as the top plate 24, and a film-like adhesive is attached to the top plate 24 in advance and bonded by thermocompression bonding or the like.

  The length of the top plate adhesion white area (the length covered by the top plate 24) is 300 μm, and the deepest part (the apex of the triangle) in the triangular recess 14a is the length of the top plate adhesion white area. Retracted in the range of 5-20%. Therefore, not only the upper part of the common flow path 23 but also the concave part 14 a is covered by the adhesion of the top plate 24. Here, if the degree of retraction of the deepest portion of the recess 14a exceeds 20%, the top plate adhesion white area becomes insufficient, and the adhesive force may be insufficient. On the other hand, when the degree of retraction of the deepest portion of the concave portion 14a is less than 5%, the water pressure acting on the coating layer 14 cannot be sufficiently released in the above cutting step, and cracks or Defects such as peeling may occur.

  Note that a printed circuit board for driving the chip 20 is connected to the printer head 10 by wire bonding, and a portion including the terminal (PAD) of the chip or the terminal of the printed circuit board is not sealed by the sealant. It is sealed with (epoxy adhesive).

  Thus, the printer head 10 of the first embodiment shown in FIG. 7 is manufactured through the steps shown in FIGS. As shown in FIG. 7, the chip 20 constituting the printer head 10 includes a plurality of heating elements 12 arranged in one direction on a semiconductor substrate 11 and a plurality of discharge ports facing each heating element 12. 15 and the individual flow path 18 extending in a direction orthogonal to the arrangement direction of the heat generating elements 12, and the region on the heat generating element 12 communicating with the individual flow path 18 is a liquid chamber. It is 19. Further, the ink supply member 21 is formed with an ink supply port 22 and a common flow path 23, and the common flow path 23 communicates with the individual flow path 18. Further, the top plate 24 seals a portion penetrating in order to form the common flow path 23 of the ink supply member 21, and closes the concave portion 14 a formed in the coating layer 14.

  Therefore, when ink enters the ink supply member 21 from the ink supply port 22, the ink enters the individual flow path 18 and the liquid chamber 19 of the chip 20 through the common flow path 23. Next, when the heat generating element 12 is heated in this state, bubbles are generated in the ink on the heat generating element 12, and a part of the ink is changed to the ink liquid by the pressure change (bubble expansion and contraction) at the time of the bubble generation. It is discharged from the discharge port 15 as a droplet.

  In the printer head 10 according to the first embodiment shown in FIG. 7, problems such as ink leakage and ink ejection failure that may be caused by cracking or peeling of the coating layer 14 did not occur. That is, in the printer head 10 of the first embodiment, since the coating layer 14 is not broken or peeled off by the recess 14a formed in the coating layer 14, the printer head 10 with high yield and stable quality can be obtained. It has become.

(Second Embodiment)
8A and 8B are a plan view and a side sectional view showing a cutting step in the method of manufacturing the printer head 10a of the second embodiment. FIG. 9 is a side sectional view showing the printer head 10a of the second embodiment.
The printer head 10a according to the second embodiment is manufactured in the same manner as in the first embodiment. However, as shown in FIGS. 8 and 9, the shape of the recess 14a in the coating layer 14 is different from that in the first embodiment. ing. That is, in the first embodiment (see FIG. 5), the shape of the concave portion 14a is a shape recessed into a triangular concave shape. In the second embodiment, the shape of the concave portion 14a is retracted into a semicircular concave shape. It is what.

  Similarly to the first embodiment, the printer head 10a according to the second embodiment also has a semicircular concave portion of pure water sprayed on the dicing blade 51 (see FIG. 4) that rotates at a high speed in the cutting process. It will be escaped by 14a, and the water pressure which acts on the coating layer 14 will reduce sequentially. Therefore, the coating layer 14 is not broken or peeled off in the cutting process. In addition, the printer head 10a is high in yield and stable in quality.

(Third embodiment)
FIG. 10 is a plan view showing a state where the fourth step is completed in the method for manufacturing the printer head 10b of the third embodiment. FIG. 11 is a side sectional view showing the printer head 10b of the third embodiment.
As shown in FIG. 10, the third embodiment is different from the first embodiment in that triangular recesses 14 a are formed on both sides of the opening 16. That is, in the first embodiment (see FIG. 3), the heating element 12, the coating layer 14, the recess 14a, the discharge port 15, and the individual flow path 18 are formed only on the left side of the opening 16, but the third In the embodiment, the heating element 12, the coating layer 14, the recess 14 a, the discharge port 15, and the individual flow path 18 are formed symmetrically about the opening 16.

  Also in the manufacturing method of the third embodiment, the flow of pure water sprayed on the dicing blade 51 (see FIG. 4) that rotates at a high speed in the cutting process is the same as that of the first embodiment. Therefore, the covering layers 14 on both the left and right sides are not cracked or peeled off. In the cutting step, the chips 20 can be cut out from both the left and right sides of the opening 16.

  Further, as shown in FIG. 11, the printer head 10 b of the third embodiment is different from the first embodiment in the number of chips 20 and the shape of the ink supply member 21. That is, in the first embodiment (see FIG. 7), the chip 20 is bonded only to the left side of the ink supply member 21 with the common flow path 23 therebetween. On the other hand, in the third embodiment shown in FIG. 11, the upper surface of the ink supply member 21 is flat, and the chips 20 are bonded to the ink supply member 21 symmetrically across the common flow path 23.

  Therefore, in the third embodiment, the opening surface sides of the individual flow paths 18 of the two chips 20 face each other toward the common flow path 23, and the chips 20 are arranged to face each other with the common flow path 23 therebetween. Here, since the height of the upper surface of the ink supply member 21 to which the opposing chips 20 are bonded is equal, the height of the upper surface of the covering layer 14 of both the chips 20 is equal even if the two chips 20 are bonded to each other. . And the top plate 24 is attached so that each coating layer 14 in both the chips | tips 20 may be straddled.

  Even in the printer head 10b according to the third embodiment, problems such as ink leakage and ink ejection failure that may be caused by the cracking or peeling of the coating layer 14 do not occur as in the first embodiment. . That is, in the printer head 10b of the third embodiment, since the coating layer 14 is not cracked or peeled off by the recess 14a formed in the coating layer 14, the printer head 10b having a high yield and stable quality can be obtained. Become.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and for example, the following modifications can be made. In other words, in the present embodiment, the coating layer 14 is formed with a concave portion 14a that is recessed into a triangular or semicircular concave shape. However, the recess 14a is not limited to such a shape, and may be any shape as long as it can release the water pressure acting on the coating layer 14 (water flow acting to push up the eaves portion from below) in the cutting process.

It is sectional drawing of the side surface which demonstrates the intermediate | middle process in the manufacturing method of the printer head of 1st Embodiment in order. It is sectional drawing of the side surface explaining the process following the process of FIG. It is a top view which shows the state completed to the process of FIG. FIG. 3 is a perspective view and a side sectional view for explaining a process following the process of FIG. 2. It is the top view and sectional drawing of a side surface which show the process of FIG. It is sectional drawing of the side surface explaining the process following the process of FIG. FIG. 3 is a side sectional view showing the printer head of the first embodiment. It is the top view explaining the intermediate | middle process in the manufacturing method of the printer head of 2nd Embodiment, and sectional drawing of the side. It is sectional drawing of the side surface which shows the printer head of 2nd Embodiment. It is a top view which shows the state which complete | finished to the intermediate process in the manufacturing method of the printer head of 3rd Embodiment. It is sectional drawing of the side surface which shows the printer head of 3rd Embodiment. It is sectional drawing of the side which shows the conventional printer head. It is sectional drawing and the perspective view of the side which show a part of manufacturing method of the improved chip | tip. It is the top view which shows generation | occurrence | production of the malfunction in the manufacturing method of the chip | tip improved, and sectional drawing of a side surface.

Explanation of symbols

10, 10a, 10b Printer head (liquid discharge head)
11 Semiconductor substrate (substrate)
12 Heating element (energy generating element)
DESCRIPTION OF SYMBOLS 13 Sacrificial layer 14 Cover layer 14a Recessed part 15 Ejection port 16 Opening part 18 Individual flow path 21 Ink supply member (liquid supply member)
23 Common flow path 24 Top plate

Claims (4)

A first step of forming a sacrificial layer with a soluble resin on a substrate on which a plurality of energy generating elements for discharging a liquid are arranged in one direction;
A second step of forming a coating layer on the sacrificial layer;
A third step that is performed simultaneously with the second step or after the second step, and that forms a plurality of discharge ports facing the respective energy generating elements in the covering layer;
A method for manufacturing a liquid discharge head comprising:
It is performed at the same time as the third step or before and after the third step, and the coating layer is opened so that the coating layer on the opposite side across the discharge port and the individual flow path has a recess. An opening forming step for forming a portion;
Performed after the third step and the opening forming step, the sacrificial layer is eluted from the discharge port and the opening to form an individual flow path extending in a direction perpendicular to the arrangement direction of the energy generating elements. A fourth step;
A cutting step that is performed after the fourth step and cuts the substrate in the opening while spraying pure water onto a rotating dicing blade using a dicer.
Including
The method of manufacturing a liquid ejection head , wherein the recess of the coating layer is shaped to be recessed from the opening toward the individual channel when viewed from above a dicing line that cuts the substrate in the cutting step . In the manufacturing method of the liquid discharge head according to claim 1,
The concave portion of the coating layer is a shape that is recessed into a triangular or semicircular concave shape from the opening toward the individual channel when viewed from above a dicing line that cuts the substrate by the cutting step . A method for manufacturing a liquid discharge head. A first step of forming a sacrificial layer with a soluble resin on a substrate on which a plurality of energy generating elements for discharging a liquid are arranged in one direction;
A second step of forming a coating layer on the sacrificial layer;
A third step that is performed simultaneously with the second step or after the second step, and that forms a plurality of discharge ports facing the respective energy generating elements in the covering layer;
A method for manufacturing a liquid discharge head comprising:
It is performed at the same time as the third step or before and after the third step, and the coating layer is opened so that the coating layer on the opposite side across the discharge port and the individual flow path has a recess. An opening forming step for forming a portion;
Performed after the third step and the opening forming step, the sacrificial layer is eluted from the discharge port and the opening to form an individual flow path extending in a direction perpendicular to the arrangement direction of the energy generating elements. A fourth step;
A cutting step that is performed after the fourth step and cuts the substrate in the opening while spraying pure water onto a rotating dicing blade using a dicer;
A fifth step of bonding the substrate so that the common flow channel and the individual flow channel are in communication with the liquid supply member formed after the cutting step and having a common flow channel penetrating the substrate;
Sealing that is performed after the fifth step and seals across a portion that penetrates to form the common flow path, and that attaches a top plate that closes the concave portion of the coating layer to the coating layer on the individual flow path. Stop process and
Including
The method of manufacturing a liquid ejection head , wherein the recess of the coating layer is shaped to be recessed from the opening toward the individual channel when viewed from above a dicing line that cuts the substrate in the cutting step . In the manufacturing method of the liquid discharge head according to claim 3,
The sealing step, the so deepest part in the concave portion of the coating layer is the length 5-20% range of which is closed by the top plate, the liquid discharge head attaching said top plate to said coating layer Manufacturing method .

Images