JP2005081589A - Process for manufacturing ink jet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for manufacturing an ink jet recording head with high machining precision, reliability and production efficiency. <P>SOLUTION: A dummy substrate 50 is coated with a resist layer 52 and a first resin layer 54 is formed of negative photosensitive resin on the resist layer 52. A part of the first resin layer 54 becoming a partition wall 28 is then exposed (the parts becoming an ink ejection opening 20 and a removing part 102 are not exposed). A second resin layer 56 is then formed of negative photosensitive resin on the first resist layer 54. Subsequently, the parts of the second resin layer 56 becoming the partition wall 28 and a reinforcing wall 30 are exposed (the parts becoming an ink chamber 22 and the removing part 102 are not exposed). When it is developed with liquid developer, non-exposed part of the first resist layer 54 and the second resin layer 56 is removed to form an ink ejection opening 20, an ink chamber 22 and an ink removing part 104 thus producing an ink jet recording head 10. Since a step for forming a photoresist pattern and a step for removing photoresist are not required in the process for forming the ink ejection opening 20 and the ink chamber 22, the process is simplified and production efficiency is enhanced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an ink jet recording head.

  Conventionally, the following manufacturing method is known as a manufacturing method of an ink jet recording head.

  A method of manufacturing an ink jet recording head, wherein a heating resistance element is provided on a substrate on which an ink supply port is formed, and an ink discharge port and an ink chamber are formed on the substrate with a resin. (For example, refer to Patent Document 1).

  An ink discharge port and an ink chamber are formed of a resin on a substrate provided with a heating resistance element. And the manufacturing method of the inkjet recording head which forms an ink supply port in a board | substrate by chemical etching. (For example, refer to Patent Document 2).

  After forming the ink discharge port and ink chamber in the resin coated through the removable resist layer on the dummy substrate, the substrate with the heating resistor element is joined, and then the resist layer is removed and the dummy substrate is separated and removed A method for manufacturing an inkjet recording head.

  Specifically, the manufacturing process is as follows.

(1) A resist layer is formed on a dummy substrate. (2) A first resin layer serving as an orifice plate is coated on the resist layer. (3) A photoresist is coated on the first resin layer to form an ink discharge port pattern. ) Ink outlets are formed in the first resin layer by etching using the photoresist as a mask. (5) Removal of the photoresist. (6) A second resin layer serving as an ink chamber is coated on the first resin layer. (7) Second resin A photoresist is coated on the layer, and an ink chamber pattern is formed on the photoresist. (8) An ink chamber is formed in the second resin layer by etching using the photoresist as a mask. (10) Removal of the photoresist. (11) A heating resistor element is formed. Align the provided substrate with the second resin layer of the dummy substrate so that the heating resistance element fits in the ink chamber (12) Remove the resist layer by immersing it in the etching solution , Separating and removing the dummy substrate. (For example, refer to Patent Document 3).
JP 05-330066 A JP-A-10-157150 Japanese Patent Laid-Open No. 06-340076

  However, in the manufacturing method described in Japanese Patent Laid-Open No. 05-330066, since the ink supply port is formed on the substrate in the initial stage, the strength of the substrate is lowered, and handling in the subsequent manufacturing process becomes complicated. There was a problem.

  Further, in the manufacturing method disclosed in Japanese Patent Laid-Open No. 10-157150, since the ink supply port is formed in the final stage, the problem that the strength of the substrate is lowered and the handling is complicated can be solved. However, since the resin in which the ink chamber and the ink discharge port are formed is exposed to the etching solution used in the chemical etching for forming the ink supply port, the resin surface is damaged and unevenness occurs, or during the etching process. There was a problem that cracks occurred due to the stress.

  Further, the manufacturing method disclosed in Japanese Patent Laid-Open No. 06-340076 has the following problems.

  (1) The first resin layer is covered to form an ink discharge port, and then the second resin layer is covered to form an ink chamber. For this reason, a pattern forming process using a photoresist and a photoresist removing process after etching are required for each process of forming the ink discharge port and the ink chamber, and the process is complicated.

  (2) When the same material is used for the first resin layer and the second resin layer, the second resin layer is etched when the second resin layer is etched to form the ink chamber. When the first resin layer is reached, the first resin layer is also partially etched. That is, it is difficult to control etching. For this reason, the heights of the ink discharge ports and the ink chambers become non-uniform, and as a result, there arises a problem that the discharge characteristics of ink droplets become non-uniform. Further, there is a problem that the etching liquid enters the ink discharge port, affects the shape of the ink discharge port, and the like, and the discharge characteristics of the ink droplet become unstable.

  (3) After forming the ink discharge port in the first resin layer, when the second resin layer is coated thereon, the material of the second resin layer is liquid and is a material that is cured after being applied on the first resin layer. Reflecting the unevenness of the first resin layer, unevenness occurs on the surface of the second resin layer. In particular, when an ink discharge port is opened in the first resin layer, the surface of the second resin layer is recessed due to the influence of the ink discharge port, and the edge of the ink chamber is sagged. Furthermore, when the thickness of the second resin layer is increased, the material needs to have a high viscosity, so that the second resin layer is easily affected by unevenness.

  When the surface of the second resin layer is uneven as described above, a gap (irregularity) is generated at the bonding portion between the second resin layer and the substrate in the bonding between the second resin layer and the substrate, resulting in poor adhesion. . For this reason, adhesive strength falls. In addition, after the ink jet recording head is completed, there is a problem that ink enters the gap (unevenness) and the joint portion is peeled off.

  When a dry sheet is used instead of liquid for the second resin layer, the unevenness of the first resin layer is not reflected, and therefore the unevenness does not occur in the second resin layer. However, the material that can be used for the second resin layer is limited, and a thin dry sheet that can be used for the second resin layer is difficult to handle, and defective products are likely to occur.

  (4) The resist layer between the dummy substrate and the first resin layer is several microns to several tens of microns, and the resist layer is sandwiched between a wide area between the dummy substrate and the first resin layer. Therefore, it takes time to dissolve such a resist layer, that is, time to separate and remove the dummy substrate. For this reason, production efficiency is bad.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for manufacturing an inkjet recording head that has high processing accuracy and reliability and high production efficiency.

  The method for manufacturing an ink jet recording head according to claim 1 includes: a first step of forming a resist layer on a dummy substrate; and a first resin layer formed on the resist layer by a negative photosensitive resin that cures an exposed portion. A second step of forming a second resin layer by a second step of exposing a portion of the first resin layer other than the portion serving as an ink discharge port, and a negative photosensitive resin that cures the exposed portion on the first resin layer. A fourth step, a fifth step of exposing a portion other than the ink chamber portion of the second resin layer, and developing with a developer to remove an unexposed portion of the first resin layer and the second resin, and an ink discharge port A seventh step of simultaneously forming the ink chamber and the ink chamber, a seventh step of bonding the substrate provided with the ink ejection energy element and the second resin layer so that the ink ejection energy device is accommodated in the ink chamber, and a resist layer Dissolve and separate dummy substrate It is characterized by having a eighth step of removed by, a.

  According to the first aspect of the present invention, the first resin layer and the second resin layer are made of a negative photosensitive resin. In the negative photosensitive resin, the exposed portion is cured and remains after development. Accordingly, an unexposed area that becomes a lower ink discharge port is formed in an unexposed area that becomes an upper ink chamber. Therefore, even if the upper layer is exposed, the unexposed area that becomes a lower ink discharge port is not exposed.

  For this reason, after the first resin layer (lower layer) is exposed except for the portion serving as the ink discharge port, the second resin layer (upper layer) is applied without development to expose the portion other than the ink chamber, and then exposed. By developing the first resin layer and the second resin layer, the ink discharge port and the ink chamber can be formed simultaneously.

  Accordingly, the ink discharge port and the ink chamber can be formed by one development. Further, since a pattern forming process using a photoresist and a photoresist removing process after etching are not required, the process is simple and the production efficiency is good.

  In addition, since the portions other than the ink discharge port and the ink chamber are cured by exposure, the development with the developer is much more controllable than the etching (the region that is desired to be removed and the region that is not desired to be removed are dissolved in the developer. Since the selectivity is high, the uniformity is excellent. Therefore, it is possible to form the ink discharge port and the ink chamber with high accuracy.

  Further, when the second resin layer is applied, the first resin layer is undeveloped, so that the first resin layer surface is flat without any unevenness. Further, since the ink discharge port is not formed, the surface of the second resin layer corresponding to the ink discharge port is not recessed, and the edge of the ink chamber is not sagged. For this reason, even if the second resin layer is a highly viscous liquid resin, the unevenness does not occur. Therefore, when bonding the second resin layer and the substrate, the bonding portion has no unevenness and can be in close contact with each other, so that the adhesive strength is high. Further, after the ink jet recording head is completed, since there is no unevenness (gap) in the joining portion, unevenness (gap) ink does not enter and the joining portion does not peel off.

  According to a second aspect of the present invention, there is provided a method for manufacturing an ink jet recording head according to the first aspect, wherein in the third step, exposure is performed except for a region necessary for forming an ink ejection port, and in the fifth step, an ink is used. The first resin layer and the second resin layer that are unnecessary for forming the ink discharge port and the ink chamber are exposed by excluding an area necessary for forming the chamber and developed with a developer in the sixth step. It is characterized by removing.

  In the ink jet recording head manufacturing method according to the second aspect, the first resin layer and the second resin layer which are unnecessary for forming the ink discharge port and the ink chamber are removed, and the resist layer is exposed.

  Therefore, in the eighth step of dissolving the resist layer and separating and removing the dummy substrate, the contact area between the removal liquid and the resist layer increases, and the dissolution of the resist layer is promoted. For this reason, the dissolution time of the resist layer, that is, the time for separating and removing the dummy substrate is shortened, and the production efficiency is improved.

  As described above, according to the present invention, it is possible to provide a method for manufacturing an ink jet recording head with high processing accuracy and reliability and high production efficiency.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 to 3 schematically show an ink jet recording head 10 manufactured by the method of manufacturing an ink jet recording head according to the present embodiment. 2 (X) and (Y) show the X and Y cross sections of FIGS. 1 and 3, respectively. 3A and 3B show cross sections A and B of FIGS. 1 and 2, respectively.

  As shown in FIGS. 1 to 3, the inkjet recording head 10 includes a substrate 40 having an ink supply port 44 formed in the longitudinal direction. One surface of the substrate 40 is covered with an insulating layer 42, and the heating resistor element 24 is provided on the other surface.

  The heating resistance element 24 is housed in an ink chamber 22 composed of a partition wall 28 and an orifice plate 26, and an ink discharge port 20 is formed in the orifice plate 26 corresponding to each ink chamber 22.

  The orifice plate 26 has a reinforcing wall 30 extending toward the ink supply port 44 extending along the ink supply port 44. For this reason, the strength of the orifice plate 26 is increased. Since the height of the reinforcing wall 30 is lower than that of the partition wall 28, the ink supply port 44 is not blocked by the reinforcing wall 30.

  The ink jet recording head 10 having such a configuration fills the ink chamber 22 and the ink discharge port 20 with ink from an ink tank (not shown) from the ink supply port 44. The heat generating resistance element 24 is caused to generate heat, the ink filled in the ink chamber 22 is boiled by this heat generation, and ink droplets are discharged from the ink discharge port 20 by the pressure of bubbles generated at that time.

  After the ink droplet is ejected, the ink chamber 22 and the ink ejection port 20 are filled with ink again to prepare for the ejection of the next ink droplet. Further, the ink flow from the ink supply port 44 is adjusted by the width L of the reinforcing wall 30 (see FIGS. 1, 2 (Y), and 3 (B)) to stabilize the ink droplet ejection characteristics. it can.

  In the present embodiment, the heating resistance element 24 is used as an ink ejection energy element for ejecting ink droplets. However, the present invention is not limited to this. For example, a method using a piezoelectric element that converts electrical energy into mechanical energy may be used, or a method using electrostatic force or magnetic force may be used. Alternatively, other ink discharge energy elements may be used.

  Next, a method for manufacturing the inkjet recording head 10 will be described.

  As shown in FIGS. 3B and 6, the inkjet recording head 10 includes an orifice plate 26 in which an ink discharge port 20 is formed on a dummy substrate 50 via a resist layer 52, an ink chamber 22, a partition wall 28, After the ink flow path portion 12 provided with the reinforcing wall 30 and the substrate portion 14 provided with the ink supply port 44 and provided with the heating resistance element 24 are separately manufactured (see FIG. 6A), The ink channel portion 12 and the substrate portion 14 are joined (see FIG. 6B), and the resist layer 52 is dissolved and the dummy substrate 50 is separated and removed (FIGS. 6C, 6D, and 6). 3 (B)).

Hereinafter, the “manufacturing process of the ink flow path section 12” is based on FIG. 4, the “manufacturing process of the substrate section 14” is based on FIG. 5, and the “joining process of the ink flow path section 12 and the substrate section 14” is performed. Each will be described in detail with reference to FIG. Each of the process diagrams of FIGS. 4 to 6 is a view showing a cross section B of FIG. 1 like FIG. 3B.
“Manufacturing process of ink flow path 12”
FIG. 4 schematically shows the manufacturing process of the ink flow path portion 12 in order from (a) to (g).

  First, a resist layer 52 is applied on the dummy substrate 50 by spin coating. (See FIG. 4 (a)). The thickness of the resist layer 52 may be in the range of about 5 microns to about 100 microns. However, if the thickness of the dummy substrate 50 is separated and removed, the resist layer 52 is not easily removed. If the thickness of the dummy substrate 50 is thick, uniform planarization on the dummy substrate 50 becomes difficult. desirable. The resist layer 52 may be a photosensitive resin or a non-photosensitive resin. However, it is resistant to the negative photosensitive resin applied to the upper surface of the resist layer 52 in the next step, and is removed even if thermocompression bonding is performed in the joining step of the ink flow path portion 12 and the substrate portion 14. It is necessary not to lose the solubility in the liquid. Specific examples of such a resist layer 52 include PMGI (Micro-Chem) and LOR (Micro-Chem). Further, since the dummy substrate 50 does not require integration of an electric circuit or the like, glass, ceramic, or the like can be used in addition to Si.

  Subsequently, a negative photosensitive resin is applied on the resist layer 52 by a spin coating method to form a first resin layer 54 to be the orifice plate 26. (See FIG. 4 (b)). The thickness of the first resin layer 54 may be in the range of about 5 microns to about 30 microns. However, if the first resin layer 54 is thick, the ink ejection port 20 (see FIGS. 1 and 3) becomes longer, so the direction of ejection of the ink droplets is improved. Since it takes time until the ink is refilled (refill time), the response frequency at which ink droplets can be ejected decreases, and the printing speed decreases. In addition, damage to the heating resistor element 24 is increased, and the life of the inkjet recording head 10 is shortened. For this reason, the thickness of the first resin layer 54 is determined to be optimum for the entire inkjet recording apparatus (not shown) using the inkjet recording head 10. A specific material for the first resin layer 54 is SU-8 (Micro-Chem).

  Using the exposure mask 150 in which the ink discharge port pattern and the removal portion pattern are formed on the first resin layer 54, the portions other than the portions that become the ink discharge ports 20 and the removal portion 102 are exposed. In addition, since the 1st resin layer 54 is negative photosensitive resin, the part which received light hardens | cures. (See FIG. 4 (c)). The removal unit 102 is an unnecessary part for forming the ink discharge port 20 and the ink chamber 22.

  Further, a negative photosensitive resin is applied on the first resin layer 54 by a spin coating method to form the second resin layer 56 that becomes the partition wall 28 and the reinforcing wall 30. (Refer FIG.4 (d)). The thickness of the second resin layer 56 may be in the range of about 10 microns to about 50 microns. However, if the second resin layer 56 is thick, the flow of ink is improved, but if the thickness is greater than the depth of the optical system at the time of exposure in the next step, the accuracy decreases. For this reason, it determines to the thickness which balanced both. A specific material for the second resin layer 5 is SU-8 (Micro-Chem).

  Then, using the exposure mask 152 in which the ink chamber pattern and the removal portion pattern are formed on the second resin layer 56, the portions other than the ink chamber 22 and the removal portion 102 are exposed (the partition wall 28 and the reinforcing wall 30). The part to be exposed.).

  Note that the width of the partition wall 28 between the ink chamber 22 and the removal unit 102 may be in the range of about 50 microns to about 100 microns. As the width of the partition wall 28 is increased, the area when the ink flow path portion 12 and the substrate portion 14 are bonded is increased and the adhesion is improved, but the area bonded to the resist layer 52 is also increased. As will be described in the “joining step between the ink flow path portion 12 and the substrate portion 14”, the removability deteriorates when the resist layer 52 is removed. Accordingly, the width (removal part 102) of the partition wall 28 in which both are balanced is determined.

  Similarly to the first resin layer 54, the second resin layer 56 is a negative photosensitive resin, so that the portion exposed to light is cured. (See FIG. 4 (e)).

  Since the ink discharge port 20 (unexposed portion) of the first resin layer 54 comes in the ink chamber 22 (unexposed portion) of the second resin layer 56, the first resin is exposed even if the second resin layer 56 is exposed. The portion (unexposed portion) that becomes the ink discharge port 20 of the layer 54 is not exposed. For this reason, the portion (unexposed portion) of the first resin layer 54 that becomes the ink discharge port 20 is not affected.

  Note that the exposed region of the positive photosensitive resin is removed with a developer. Therefore, as in the present embodiment, when the ink discharge port 20 is formed in the lower first resin layer 54 and the ink chamber 22 is formed outside the area of the ink discharge port 20 in the upper second resin layer 56, If one of the first resin layer 54 and the second resin layer 56 is formed of a positive photosensitive resin, the exposed portion of the upper layer affects the unexposed portion of the lower layer.

  Therefore, it is necessary to use a negative photosensitive resin for both the first resin layer 54 and the second resin layer 56.

  And finally, by developing with a developing solution, the unexposed part (uncured part) of the 1st resin layer 54 and the 2nd resin layer 56 is removed. (See FIG. 4 (f)).

  As described above, since the negative photosensitive resin is used for the first resin layer 54 and the second resin layer 56, a pattern forming process using a photoresist or a post-etching process is performed in the process of forming the ink discharge ports 20 and the ink chambers 22. A photoresist removal process is not required, and furthermore, the first resin layer 54 and the second resin layer 56 can be developed simultaneously, so that the process becomes simple and the production efficiency is good.

  Furthermore, since areas other than the areas to be removed (ink discharge port 20, ink chamber 22, removal section 102) are cured by exposure, development with a developer is much more controllable than etching (removed areas to be removed). The uniformity is excellent because of the high selection ratio (dissolved in the developer in the areas that you do not want). Therefore, the ink discharge port 20 and the ink chamber 22 can be formed with high accuracy.

  Further, when the second resin layer 56 is formed, the first resin layer 54 is undeveloped, so that the surface of the first resin layer 54 is flat with no unevenness. In particular, since the ink discharge port 20 is not formed, the upper surface 56A of the second resin layer is not recessed and the edge of the ink chamber 22 is not sagged. For this reason, even if a highly viscous liquid resin is used for the second resin layer 56, the upper surface 56A of the second resin layer 56A will not be uneven. That is, the joint portion 200 (see FIGS. 3 and 6) between the ink flow path portion 12 and the substrate portion 14 is not uneven. Accordingly, since the ink flow path portion 12 and the substrate portion 14 can be closely bonded without any gap, the adhesive strength is high. In addition, after completion of the inkjet recording head 10, ink does not enter the unevenness (gap) formed in the joint portion 200 and the joint portion 200 does not peel off.

In this manner, the orifice plate 26 in which the ink discharge ports 20 are formed, the ink chamber 22, the reinforcing wall 30, the partition wall 28, and the removal region 104 (the removal portion 102 is removed) via the resist layer 52 on the dummy substrate 50. The ink flow path portion 12 is formed (the region where the resist layer 52 is exposed) (see FIG. 4G).
"Manufacturing process of substrate part 14"
FIG. 5 schematically shows the manufacturing process of the substrate portion 14 in order from (a) to (g).

  First, in the substrate 40 in which the insulating layer 42 is coated on one surface and the heating resistor element 24 is provided on the other surface, the photoresist 70 is coated on the insulating layer 42 to form an ink supply port pattern. (See FIG. 5 (a)). As the insulating layer 42, a layer having resistance to an etching solution used when the ink supply port 44 is opened in the substrate 40 in the subsequent process is used. Specific examples of the material include a silicon oxide film, a silicon nitride film, an epoxy resin, and an acrylic resin. If a silicon oxide film is formed in advance as the substrate 40 and is not removed during the formation process of the heating resistance element 24, this silicon oxide film can be used as the insulating layer 42, and a new insulating layer 42 is formed. The process can be omitted.

  Using the photoresist 70 as a mask, an opening 72 serving as an ink supply port 44 is opened in the insulating layer 42 by dry etching (see FIG. 5B), and the photoresist 70 is removed (see FIG. 5C). In the case where the insulating layer 42 is a photosensitive resin, the insulating layer 42 can be directly patterned, so that steps such as formation of the photoresist 70, dry etching, and removal of the photoresist 70 are unnecessary.

  The surface on which the heating resistor element 24 is provided is covered with a protective layer 80 (see FIG. 5D). As the protective layer 80, like the insulating layer 42, a layer that is resistant to the etching solution used when the ink supply port 44 is opened in the substrate 40 is used. Specific examples of the material include a silicon oxide film, a silicon nitride film, an epoxy resin, and a cyclized rubber resin. If a layer that can become the protective layer 80 has already been formed after the formation process step of the heating resistor element 24 and the like, the step of newly forming the protective layer 80 in this way is unnecessary.

  The ink supply port 44 is formed by dipping in an etching solution. (See FIG. 5 (e)). As an etchant, TMAH, KOH, hydrazine, or the like is used.

  The protective layer 80 is removed. (See FIG. 5 (f)). In removing the protective layer 80, the protective layer 80 is removed over the entire surface in this embodiment. However, the protective layer 80 may be partially removed as necessary to leave a part of the protective layer 80.

Thus, the board | substrate part 14 is made. (See FIG. 5 (g)). In the present embodiment, only the heating resistor element 24 is shown on the substrate 40, but a circuit for driving the heating resistor element 24 may be formed on the substrate 40. Moreover, it is not limited to such a manufacturing process.
“Joint process of ink flow path portion 12 and substrate portion 14”
FIG. 6 schematically shows the joining process of the ink flow path portion 12 and the substrate portion 14 in order from (a) to (d).

  The ink flow path portion 12 and the substrate portion 14 formed on the dummy substrate 50 via the resist layer 52 are aligned so that the heat generating resistance element 24 is accommodated in the ink chamber 22, and the upper surface of the partition wall 28 (second resin layer upper surface 56A). And the upper surface of the substrate 40 (the surface on which the insulating layer 42 is not coated) are bonded by heating and pressure. (See FIG. 6 (b)). As described in “Manufacturing process of ink flow path portion 12”, since the upper surface of the partition wall 28 (second resin layer upper surface 56 </ b> A) is not uneven, the ink flow path portion 12 and the substrate portion 14 are closely adhered to each other. The bonding strength is strong. Further, after the ink jet recording head 10 is completed, the ink does not enter the unevenness (gap) formed in the joint portion 200 and peeling does not occur.

  The resist layer 52 is dissolved by dipping in a removing solution, and the dummy substrate 50 is separated and removed. (See FIG. 6 (c)). Since the removal region 104 is formed, the contact area between the removal liquid and the resist layer 52 is wide. For this reason, dissolution of the resist layer 52 is promoted, and the dissolution time of the resist layer 52, that is, the time for separating and removing the dummy substrate 50 is shortened. Therefore, production efficiency is improved.

  In this way, the ink jet recording head 10 is produced. (See FIG. 6D).

  According to the manufacturing method of the present embodiment, the ink discharge ports 20 and the ink chambers 22 can be formed with high accuracy, as described in “Manufacturing process of the ink flow path portion 12”.

  In addition, a pattern forming process using a photoresist and a photoresist removing process after etching are not required, and the ink discharge port and the ink chamber can be formed by one development, so that the process is simple and the production efficiency is good.

  Further, as described in the “bonding step of the ink flow path portion 12 and the substrate portion 14”, the bonding portion 200 of the ink flow path portion 12 and the substrate portion 14 has no unevenness and is in close contact with each other. In addition, the ink does not enter the unevenness (gap) of the joint portion 200 and the joint portion 200 does not peel off.

  Further, since the removal region 104 is formed, the dissolution time of the resist layer 52, that is, the time for separating and removing the dummy substrate 50 is shortened, and the production efficiency is improved.

  In other words, it is a method for manufacturing an inkjet recording head with high processing accuracy and reliability, and high production efficiency.

1 is a partial cross-sectional perspective view schematically showing an ink jet recording head according to an embodiment of the present invention. 1 schematically shows an ink jet recording head according to an embodiment of the present invention, wherein (X) is a cross-sectional view showing an X cross section of FIG. 1, and (Y) is a cross sectional view showing a Y cross section of FIG. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 schematically shows an inkjet recording head according to an embodiment of the present invention, in which (A) is a cross-sectional view showing a cross section A in Fig. 1, and (B) is a cross-sectional view showing a B cross section in Fig. 1. It is a figure which shows typically the manufacturing process of an ink flow path part in order from (a) to (g). It is a figure which shows typically the manufacturing process of a board | substrate part in order from (a) to (g). It is a figure which shows typically the manufacturing process of joining of an ink flow path part and a board | substrate part in order from (a) to (d).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Inkjet recording head 20 Ink discharge port 22 Ink chamber 40 Substrate 44 Ink supply port 50 Dummy substrate 52 Resist layer 54 First resin layer 56 Second resin layer 102 Removal part

Claims (2)

A first step of forming a resist layer on a dummy substrate;
A second step of forming a first resin layer on the resist layer with a negative photosensitive resin that cures an exposed portion;
A third step of exposing a portion other than the portion serving as the ink discharge port of the first resin layer;
A fourth step of forming a second resin layer with a negative photosensitive resin in which an exposed portion is cured on the first resin layer;
A fifth step of exposing the part other than the ink chamber of the second resin layer;
A sixth step of developing with a developer, removing the unexposed portions of the first resin layer and the second resin, and simultaneously forming the ink discharge port and the ink chamber;
A seventh step of joining the substrate provided with the ink ejection energy element and the second resin layer so that the ink ejection energy element is accommodated in the ink chamber;
An eighth step of dissolving the resist layer and separating and removing the dummy substrate;
An ink jet recording head manufacturing method comprising: In the third step, exposure is performed except for a region necessary for forming the ink discharge port,
In the fifth step, exposure is performed except for an area necessary for forming the ink chamber,
7. The sixth step, wherein the first resin layer and the second resin layer unnecessary for forming the ink discharge port and the ink chamber are removed by developing with a developer. 2. A method for producing an ink jet recording head according to 1.

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