JP4626190B2 - Electronic component transfer method and transfer device - Google Patents

Description

The present invention relates to a method and apparatus for transferring a chip-type electronic component such as a chip capacitor or a chip resistor between holding jigs.
More specifically, the present invention relates to a method and apparatus for transferring an electronic component between holding jigs provided with an adhesive layer in the case where external electrodes are formed on both end faces of a chip-type electronic component.

Conventionally, in order to form external electrodes on both end surfaces of a chip-type electronic component, a method is adopted in which one end surface of the electronic component is held by a holding jig and the other end surface is dipped in an external electrode paste and applied. Yes. Then, the external electrode paste applied to one end face is dried, then the end face to which the external electrode paste is applied is held by another holding jig, and the external electrode paste is similarly applied to the other end face.

As a holding jig used for forming such an external electrode, an adhesive layer such as silicone rubber is formed on a hard plate as described in Patent Document 1, and an end face of an electronic component is adhered and held on the adhesive layer. It has been broken. In order to form external electrodes on both end faces of the electronic component, it is necessary to change the end face of the electronic component. For this purpose, the adhesion is stronger than the adhesive force of the first holding jig held at the first application. The electronic component must be pressed against the second holding jig having a force, and the electronic component must be transferred from the first holding jig to the second holding jig.
JP-A-4-291712

Conventionally, the only way to make a difference in the adhesive force between the first holding jig and the second holding jig is to change the material of the adhesive layer. However, due to variations in the adhesive strength of the material constituting the adhesive layer, there is a problem that the difference in adhesive strength is unstable and transfer errors are likely to occur.
The reason why the difference in adhesive force between the first holding jig and the second holding jig cannot be increased is also the method of forming the external electrode. For example, after applying the external electrode paste to one end surface of the electronic component held by the first holding jig, a drying process is performed, but the adhesive force of the adhesive layer made of silicone rubber increases due to heat during drying. The phenomenon that occurs. Therefore, the difference in adhesive force between the first holding jig and the second holding jig is reduced, and a transfer error is more likely to occur.
Further, the adhesive strength of the adhesive layer has a property of changing depending on the number of pressings. When the electronic component is transferred from the first holding jig to the second holding jig, the electronic component is already pressed against the adhesive layer of the first holding jig. This is the second time. On the other hand, since the second holding jig is the first time, the second holding jig whose adhesive force should be set higher has a smaller number of times of pressing than the first holding jig. Difficult to make a difference.

Therefore, an object of the present invention is to generate a stable adhesive force difference between the first holding jig and the second holding jig with a simple configuration, and to transfer from the first holding jig to the second holding jig. An object of the present invention is to provide an electronic component transfer method and transfer device that can prevent occurrence of mistakes.

In order to achieve the above object, the invention according to claim 1 uses a first holding jig in which an adhesive layer is formed on a hard plate and a second holding jig in which an adhesive layer is formed on a hard plate. With the first end surface of the chip-type electronic component being adhesively held on the adhesive layer of the 1 holding jig, the adhesive layer of the second holding jig is pressed against the second end surface facing the first end surface of the electronic component, By pulling the 2 holding jig away from the first holding jig in the direction perpendicular to the adhesive surface of the adhesive layer, the electronic component is moved from the first holding jig to the second holding jig by the difference in adhesive force of the adhesive layer. The adhesive layer of the first holding jig and the adhesive layer of the second holding jig are made of the same material, and the thickness of the adhesive layer of the first holding jig and the adhesive layer of the second holding jig Are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is that of the adhesive layer of the first holding jig. Provides a sorting method of the electronic component, characterized in that Mino is 1/2 or less.

The invention according to claim 2 uses the first holding jig in which the adhesive layer is formed on the hard plate and the second holding jig in which the adhesive layer is formed on the hard plate, and the adhesive layer of the first holding jig. The adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component in a state where the first end face of the chip-type electronic component is adhesively held thereon, and the second holding jig is moved to the first end face. In the method of transferring the electronic component from the first holding jig to the second holding jig due to the difference in the adhesive force of the adhesive layer by pulling it away from the holding jig in a direction perpendicular to the adhesive surface of the adhesive layer, The adhesive layer of the second holding jig is made of a material having higher adhesiveness than the adhesive layer of the first holding jig, and the thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig. Are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is 1 / th of the thickness of the adhesive layer of the first holding jig. It provides a sorting method of the electronic component, wherein the or less.

The invention according to claim 3 uses the first holding jig in which the adhesive layer is formed on the hard plate and the second holding jig in which the adhesive layer is formed on the hard plate, and the adhesive layer of the first holding jig. The adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component in a state where the first end face of the chip-type electronic component is adhesively held thereon, and the second holding jig is moved to the first end face. In the apparatus for transferring the electronic component from the first holding jig to the second holding jig due to a difference in the adhesive force of the adhesive layer by pulling away from the holding jig in a direction perpendicular to the adhesive surface of the adhesive layer, The adhesive layer of the first holding jig and the adhesive layer of the second holding jig are made of the same material, and the thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less. There, and the thickness of the adhesive layer of the second holding jig is 1/2 or less of the thickness of the adhesive layer of the first holding jig this Providing sorter electronic component characterized by.

The invention according to claim 4 uses the first holding jig in which the adhesive layer is formed on the hard plate and the second holding jig in which the adhesive layer is formed on the hard plate, and the adhesive layer of the first holding jig. The adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component in a state where the first end face of the chip-type electronic component is adhesively held thereon, and the second holding jig is moved to the first end face. In the apparatus for transferring the electronic component from the first holding jig to the second holding jig due to a difference in the adhesive force of the adhesive layer by pulling away from the holding jig in a direction perpendicular to the adhesive surface of the adhesive layer, The adhesive layer of the second holding jig is made of a material having higher adhesiveness than the adhesive layer of the first holding jig, and the thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig. Are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is 1 / th of the thickness of the adhesive layer of the first holding jig. Providing sorter of electronic components, characterized in that at most.

The present inventor has found that the adhesive force on the chip-type electronic component changes by changing the thickness of the adhesive layer formed on the hard plate, and in particular, the adhesive force increases when the thickness of the adhesive layer is reduced. Normally, increasing the thickness of the adhesive layer is expected to increase the contact area with the electronic component and increase the adhesive force, but in reality the adhesive force increases with the thinner adhesive layer. To do. The reason is that when the end face of the electronic component is pressed against the adhesive layer with a certain force, if the adhesive layer is thick, the adhesive layer itself is an elastic body. This is presumably because the adhesive strength at the adhesive interface is weakened. When the pressure-sensitive adhesive layer is thinned, the amount of elastic deformation is reduced and the diffusion of the pressing force is reduced. Therefore, it is considered that the adhesion force at the adhesive interface increases when the same pressing force is applied.
In claim 1, even if the material of the adhesive layer is the same, by changing the thickness, the adhesive layer is stable between the first holding jig and the second holding jig regardless of variations in the adhesive strength of the material constituting the adhesive layer. It is possible to ensure a difference in adhesive strength. As a result, occurrence of transfer mistakes can be suppressed.

According to the second aspect of the present invention, it is possible to stably secure a large difference in adhesive force between the first holding jig and the second holding jig by changing the thickness of the adhesive layer and changing the material of the adhesive layer itself. It is a thing.
Here, the adhesive layer of the second holding jig is made of a material having higher adhesiveness than the adhesive layer of the first holding jig, and the thickness of the adhesive layer of the second holding jig is the adhesive layer of the first holding jig. It is formed thinner than the thickness.

The transfer device according to claim 3 is a device that performs the transfer method according to claim 1, and the transfer device according to claim 4 is a device that performs the transfer method according to claim 2. is there.
In either case, the same effects as those of the first or second aspect can be exhibited.

As in claim 5, at least the main plate of the hard plate of the second holding jig so that the distance from the main surface of the hard plate of the first holding jig and the second holding jig to the surface of the adhesive layer is substantially equal. It is preferable to provide a pedestal having a predetermined height on the surface and form an adhesive layer on the pedestal.
When the first and second holding jigs are used for the external electrode application work, it is necessary to hold the hard plate of the holding jig with the chuck device and immerse the end face of the electronic component in the tank to which the external electrode paste has been applied. is there. At this time, in order to make the application amount of the external electrode paste applied to both end faces of the electronic component constant, it is necessary to make the immersion depth constant. The distance from the bottom surface of the coating layer of the holding jig is constant between when holding with the first holding jig and applying to the one end face, and holding with the second holding jig and applying the other end face. This is preferable for making the immersion depth constant.
In Claim 5, from the main surface of a hard board to the surface of an adhesion layer by providing the base of predetermined height on the main surface of the hard board of a 2nd holding jig, and forming an adhesion layer on this base. The distances are set approximately equal. Therefore, if the distance from the bottom surface of the coating layer is made constant between the first holding jig and the second holding jig, the immersion depth can be made constant, and the external electrode paste applied to both end faces of the electronic component can be applied. The amount can be constant.
The pedestal formation region may be larger than the adhesion layer formation region, or may be smaller than the adhesion layer formation region as long as it is larger than the region where the electronic component is adhered. The pedestal may be formed integrally with the hard plate, or another member may be fixed on the hard plate. The material of the pedestal may be a material having a higher hardness than the adhesive layer, and may be a metal material, a resin material, or an elastic material.
The pedestal is formed at least on the second holding jig, but may be formed on the first holding jig in the same manner. In this case, the height of the base differs between the first holding jig and the second holding jig.

As in claim 6, the pedestal is preferably formed in a region substantially equal to the region where the adhesive layer is formed.
The adhesive layer can be formed by bringing a concave casting mold into contact with the main surface of the hard plate, casting an adhesive material in the interior space of the casting mold, and curing it. In that case, the thickness of the adhesive layer can be easily changed by forming a pedestal on the main surface of the hard plate as in claim 5.
If the formation area of the pedestal and the adhesive layer is set to be the same, the same mold can be used for the first holding jig and the second holding jig as the casting mold for forming the adhesive layer, thereby reducing the manufacturing cost. it can.

In the present invention, the thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is the adhesive of the first holding jig. It is set to 1/2 or less of the thickness of the layer.
When the inventor changed the thickness of the pressure-sensitive adhesive layer and measured the pressure-sensitive adhesive strength, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer of the second holding jig was the same as that of the pressure-sensitive adhesive layer of the first holding jig. Thus, a large difference in adhesive strength was obtained.

As described above, according to the first aspect, even if the material of the adhesive layer is the same, by changing the thickness, the first holding jig and the second holding jig can be used regardless of the adhesive force variation of the material constituting the adhesive layer. A stable adhesive force difference can be ensured between the jig and the jig. As a result, it is possible to suppress occurrence of an error in transferring the electronic component from the first holding jig to the second holding jig.

According to the second aspect, since the material of the adhesive layer itself is changed at the same time when the thickness of the adhesive layer is changed, a large adhesive force difference is stably secured between the first holding jig and the second holding jig. it can. Therefore, it is possible to further suppress the occurrence of an error in transferring the electronic component from the first holding jig to the second holding jig.

Embodiments of the present invention will be described below with reference to examples.

FIG. 1 shows a first embodiment of an electronic component P transfer device according to the present invention.
This transfer device includes a first holding jig 1 and a second holding jig 2. The first holding jig 1 is formed by forming an adhesive layer 12 having a certain thickness on a hard plate 11. The material of the hard plate 11 is made of metal such as stainless steel, hard resin such as epoxy or acrylic, and further ceramic material. The adhesive layer 12 is made of a viscoelastic material having adhesiveness on the surface, such as silicone rubber, and can hold the end face of the electronic component P on the surface.

Similarly to the first holding jig 1, the second holding jig 2 is formed by forming an adhesive layer 22 having a certain thickness on the hard plate 21, and the material of the hard plate 21 and the adhesive layer 22 is the first holding jig. The same as the hard plate 11 and the adhesive layer 12 of the tool 1. The pressure-sensitive adhesive layer 22 is formed thinner than the pressure-sensitive adhesive layer 12, the thickness of each of the pressure-sensitive adhesive layers 12 and 22 is 2 mm or less, and the thickness d2 of the pressure-sensitive adhesive layer 22 is ½ or less of the thickness d1 of the pressure-sensitive adhesive layer 12. Is desirable. Here, the thickness d1 of the adhesive layer 12 was 1.6 mm, and the thickness d2 of the adhesive layer 22 was 0.8 mm.
As described above, the adhesive layer 22 of the second holding jig 2 is made of the same material as the adhesive layer 12 of the first holding jig 1, but is formed to be thin, so that the adhesive force of the adhesive layer 22 is increased. Can be stronger than 12.

Here, the adhesive force of two types of adhesive layers 12 and 22 made of the same material (silicone rubber) and having different thicknesses was measured. FIG. 2 shows the apparatus used for the measurement.
In FIG. 2, reference numeral 30 denotes a base on which the holding jigs 1 and 2 are placed, 31 denotes a support column erected on the base 30, 32 denotes an elevator base that can be raised and lowered on the support pillar 31, and 33 denotes an elevator base 32. Further, a rod 35 is provided so as to be movable up and down via a linear motion bearing 34, 35 is a load cell provided in the middle of the rod 33, and 36 is a measurement terminal provided at the lower end of the rod 33. The measurement conditions are as follows.
Measurement terminal: Cylindrical pressing pressure of φ7mm diameter: 1750gf
Pressing time: 7 seconds Pulling speed: 3 mm / second The adhesive strength of the adhesive layers 12 and 22 is that the measuring terminal 36 is pulled up to the adhesive layer when the measuring terminal 36 is pulled up after pressing the measuring terminal 36 against the adhesive layer under the above conditions. The pulling force is measured by the load cell 35.

Table 1 shows the results of measuring the adhesive strength of the adhesive layers 12 and 22 under the above conditions.
As is clear from Table 1, it can be seen that the thin adhesive layer 22 has an adhesive force of 1.5 times or more that of the thick adhesive layer 12.

FIG. 3 shows an example of a method for transferring the chip-type electronic component P using the holding jigs 1 and 2.
As shown in (a), the first end surface P1 of the electronic component P is adhesively held on the adhesive layer 12 of the first holding jig 1, and the adhesive layer 22 faces downward above the first holding jig 1. 2 The holding jig 2 is arranged. Next, the adhesive layer 22 of the second holding jig 2 is pressed against the other end surface P2 facing the end surface P1 of the electronic component P as shown in FIG. The pressing force at this time is preferably set such that the electronic component P sinks somewhat with respect to both the adhesive surfaces 12 and 22. Next, when the second holding jig 2 is pulled away from the first holding jig 1 as shown in (c), the adhesive layer 12 having a thicker adhesive force between the thin adhesive layer 22 and the other end surface P2 of the electronic component P Since the adhesive strength with the one end surface P1 of the electronic component P is larger, the electronic component P is transferred from the first holding jig 1 to the second holding jig 2 due to the adhesive force difference.
As shown in Table 1, when the same pressing pressure is applied, the adhesive layer 22 has an adhesive force about 1.5 times that of the adhesive layer 12, so that the electronic component P is moved from the first holding jig 1 to the second. Transfer to the holding jig 2 is ensured, and transfer errors are less likely to occur.

When the external electrodes are formed on the end faces P1 and P2 of the electronic component P, the electrode paste is applied and dried while the electronic component P is adhesively held on the adhesive layer 12 of the first holding jig 1. However, the adhesive force of the adhesive layer 12 of the first holding jig 1 increases due to heat during drying, and the difference in adhesive force with the adhesive layer 22 of the second holding jig 2 decreases. Further, since the number of times of pressing the first holding jig 1 is the second time in the stage of FIG. 3B, the number of pressing times of the second holding jig 2 is the first time. The adhesive force difference between 1 and the second holding jig 2 is reduced. However, as described above, the adhesive layer 22 has an adhesive force that is 1.5 times or more that of the adhesive layer 12, so that a sufficient adhesive force difference is ensured even if there is a decrease in the adhesive force difference or an adhesive force variation as described above. The electronic component P can be reliably transferred from the first holding jig 1 to the second holding jig 2.

FIG. 4 shows a second embodiment of the first holding jig 1 and the second holding jig 2.
The first holding jig 1 is the same as that of the first embodiment, but the second holding jig 2 has a base 23 having a size equal to the formation area of the adhesive layer 22 on the hard plate 21. The adhesive layer 22 is formed on the pedestal 23. The height H2 from the main surface of the hard plate 21 to the surface of the adhesive layer 22 is set equal to the height H1 from the main surface of the hard plate 11 of the first holding jig 1 to the surface of the adhesive layer 12. Yes.
Also in this case, since the thickness d2 of the adhesive layer 22 of the second holding jig 2 is thinner than the thickness d1 of the adhesive layer 12 of the first holding jig 1, the adhesive force thereof is larger than that of the adhesive layer 12.

The adhesive layers 12 and 22 of the holding jigs 1 and 2 of the second embodiment can be manufactured by the method shown in FIG.
(A) shows the manufacturing method of the 1st holding jig 1, arrange | positions the concave casting metal mold | die 40 on the hard board 11, and sticks adhesive material from the inlet 41 to the internal space 42 of the casting metal mold | die 40. FIG. After the injection, the adhesive layer 12 can be formed on the hard plate 11 by curing the adhesive material.
(B) shows the manufacturing method of the 2nd holding jig 2. FIG. Since the pedestal 23 is formed on the hard plate 21, the same casting mold 40 used for manufacturing the first holding jig 1 is fitted into the pedestal 23, and the inside of the casting mold 40 is injected from the inlet 41. After the adhesive material is injected into the space 42, the adhesive layer 22 can be formed on the pedestal 23 by curing the adhesive material.
Thus, by providing the base 23 on the hard plate 21, the adhesive layers 12 and 22 having different thicknesses can be formed with one casting mold 40, and the manufacturing cost can be reduced.

FIG. 6 shows a state in which the end face of the electronic component held by the holding jig of the second embodiment is immersed in the coating tank 50 coated with the electrode paste 51 in order to form the external electrode. (A) is a case where the first holding jig 1 is used, and (b) is a case where the second holding jig is used.
As is apparent from FIG. 6, since the heights H1 and H2 from the main surfaces of the hard plates 11 and 21 of the two types of holding jigs 1 and 2 to the surfaces of the adhesive layers 12 and 22 are equal, If the distance S from the coating tank 50 to the bottom surface of the coating tank 50 is made constant, the immersion depth of the end face of the electronic component P in the electrode paste 51 can be made constant. That is, the application amount of the external electrode formed on both end faces of the electronic component P can be easily made the same.

FIG. 7 shows a third embodiment of the holding jig.
In the first embodiment, the first and second holding jigs are formed by directly forming an adhesive layer on a hard plate. In the second embodiment, a pedestal is formed on the hard plate having only the second holding jig. However, as shown in FIG. 7, pedestals 13 and 23 having different thicknesses can be provided on the hard plates of both holding jigs 1 and 2.
In this case, the heights H1 and H2 from the main surfaces of the hard plates 11 and 21 to the surfaces of the adhesive layers 12 and 22 can be arbitrarily set regardless of the thicknesses d1 and d2 of the adhesive layers 12 and 13. It is. It is desirable to make the heights H1 and H2 from the main surfaces of the hard plates 11 and 21 to the surfaces of the adhesive layers 12 and 22 equal.

In the first to third embodiments, the adhesive layers of the first and second holding jigs are formed of the same material, but may be formed of different materials. In particular, if the adhesive layer 22 of the second holding jig 2 is made of a material having a higher adhesive strength than the adhesive layer 12 of the first holding jig 1, this is combined with the effect of the difference in thickness between the adhesive layers 12 and 22. Thus, the difference in adhesive strength can be further increased, and transfer errors can be further reduced.
As materials with different adhesive strength, there are cases where the composition itself of silicone rubber, butyl rubber, urethane rubber, etc. is different, the amount of additives contained in the adhesive material is different, and the curing conditions of the adhesive material are different. .

Moreover, when providing a base on a hard board, it is not necessary to make the width of a base the same as an adhesive layer, and it can also form in an area wider than an adhesive layer, and can also be made into an area narrower than an adhesive layer. However, when the pedestal has a smaller area than the adhesive layer, the area of the pedestal needs to be larger than at least the region where the electronic component is adhesively held.
Of course, the holding jig according to the present invention can be used not only for the formation of the external electrode on the end face of the electronic component but also for other uses.

It is a side view of 1st Example of the holding jig used for the transfer apparatus concerning this invention. It is a side view which shows an example of the measuring apparatus of adhesive force. It is process drawing which shows the method of transferring an electronic component using the holding jig shown in FIG. It is a side view of 2nd Example of a holding jig. It is sectional drawing which shows the formation method of the adhesion layer of the holding jig of 2nd Example. It is a figure which shows the method of apply | coating an external electrode paste using the holding jig of 2nd Example. It is a side view of 3rd Example of a holding jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st holding jig 11 Hard board 12 Adhesive layer 2 2nd holding jig 21 Hard board 22 Adhesive layer 23 Base P Electronic component P1, P2 End surface

Claims (6)

Using a first holding jig in which an adhesive layer is formed on a hard plate and a second holding jig in which an adhesive layer is formed on a hard plate, the first of the chip-type electronic component is placed on the adhesive layer of the first holding jig. With the one end face being adhesively held, the adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component, and the second holding jig is moved from the first holding jig to the adhesive layer. In the method of transferring the electronic component from the first holding jig to the second holding jig due to the difference in the adhesive force of the adhesive layer by pulling away in the direction perpendicular to the adhesive surface ,
The adhesive layer of the first holding jig and the adhesive layer of the second holding jig are made of the same material,
The thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is the thickness of the adhesive layer of the first holding jig. A method for transferring an electronic component, characterized in that it is ½ or less of the thickness . Using a first holding jig in which an adhesive layer is formed on a hard plate and a second holding jig in which an adhesive layer is formed on a hard plate, the first of the chip-type electronic component is placed on the adhesive layer of the first holding jig. With the one end face being adhesively held, the adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component, and the second holding jig is moved from the first holding jig to the adhesive layer. In the method of transferring the electronic component from the first holding jig to the second holding jig due to the difference in the adhesive force of the adhesive layer by pulling away in the direction perpendicular to the adhesive surface ,
The adhesive layer of the second holding jig is made of a material having higher adhesiveness than the adhesive layer of the first holding jig,
The thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is the thickness of the adhesive layer of the first holding jig. A method for transferring an electronic component, characterized in that it is ½ or less of the thickness . Using a first holding jig in which an adhesive layer is formed on a hard plate and a second holding jig in which an adhesive layer is formed on a hard plate, the first of the chip-type electronic component is placed on the adhesive layer of the first holding jig. With the one end face being adhesively held, the adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component, and the second holding jig is moved from the first holding jig to the adhesive layer. In the apparatus for transferring the electronic component from the first holding jig to the second holding jig due to the difference in the adhesive force of the adhesive layer by pulling away in the direction perpendicular to the adhesive surface ,
The adhesive layer of the first holding jig and the adhesive layer of the second holding jig are made of the same material,
The thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is the thickness of the adhesive layer of the first holding jig. An electronic component transfer device characterized by having a thickness of ½ or less . Using a first holding jig in which an adhesive layer is formed on a hard plate and a second holding jig in which an adhesive layer is formed on a hard plate, the first of the chip-type electronic component is placed on the adhesive layer of the first holding jig. With the one end face being adhesively held, the adhesive layer of the second holding jig is pressed against the second end face facing the first end face of the electronic component, and the second holding jig is moved from the first holding jig to the adhesive layer. In the apparatus for transferring the electronic component from the first holding jig to the second holding jig due to the difference in the adhesive force of the adhesive layer by pulling away in the direction perpendicular to the adhesive surface ,
The adhesive layer of the second holding jig is made of a material having higher adhesiveness than the adhesive layer of the first holding jig,
The thickness of the adhesive layer of the first holding jig and the thickness of the adhesive layer of the second holding jig are both 2 mm or less, and the thickness of the adhesive layer of the second holding jig is the thickness of the adhesive layer of the first holding jig. An electronic component transfer device characterized by having a thickness of ½ or less .   At least a predetermined height is provided on the main surface of the hard plate of the second holding jig so that the distance from the main surface of the hard plate of the first holding jig and the second holding jig to the surface of the adhesive layer is substantially equal. 5. The electronic component transfer device according to claim 3, wherein a pedestal is provided, and an adhesive layer is formed on the pedestal.   6. The electronic component transfer device according to claim 5, wherein the pedestal is formed in an area substantially equal to an area where the adhesive layer is formed.

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