JP4624107B2 - 電気化学センサの製造方法 - Google Patents
電気化学センサの製造方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
- G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Description
本発明は、連続ウエブに電気化学センサを製造する方法に関し、詳細には、電気化学センサを連続ウエブ上で印刷し、新しいウエブ材料のロールを接合して基材の連続シートを形成するウエブ製造工程に関する。
電気化学センサは、人の血中グルコースの測定を含む様々な診断方法に用いられている。このような電気化学センサの製造では、血液または他の体液を受容するように適合されたサンプル受容セル内に配置される電極を備えた多数の小さなストリップを製造する。体液により、セルの電極間の回路が完成する。電極は通常、血中の分析物と反応して中間分析物を形成する少なくとも1種類の試薬でコーティングされている。この中間分析物は、電極における電流または電荷を測定するように適合された測定器によって測定することができる。このような電気化学セルの製造には、極めて小さな空間に電極材料、絶縁材料、及び試薬の複数の層を体積させる必要がある。このような層の精度及び配置は、この装置の最終的な機能に極めて重要である。更に、コストを抑えて要求を満たすためには、超高速で層間が絶対精度で整合するように電気化学センサを製造することが必須である。
本発明の新規の特徴は、特に添付の特許請求の範囲に記載されている。本発明の特徴及び利点は、添付の図面を参照しながら、本発明の原理を利用した例示的な実施形態を説明する以下の詳細な記載を読めばより良く理解できるであろう。
この発明の具体的な実施態様は以下のとおりである。
1.電極層及び少なくとも1つの試薬層を含む電気化学センサを製造するための連続工程において、この製造方法が、
基板の第1の部分に電極層及び少なくとも1つの試薬層を印刷するステップと、
前記基板の第1の部分に前記基板の第2の部分を接合するステップと、
前記第2の部分に電極層及び少なくとも1つの試薬層を印刷するステップとを含むことを特徴とする方法。
2.電気化学センサの製造方法であって、
基板材料の第1のロールの基板のウエブを1または複数の印刷ステーションを通過させて、スクリーン印刷により1または複数の印刷ステーションで前記基板上に1または複数の電極を印刷するステップと、
基板材料の第2のロールを前記第1のロールの端部に接合するステップと、
前記接合した基板を前記1または複数の印刷ステーションを通過させるステップとを含むことを特徴とする方法。
3.印刷ステーションで、フラットスクリーン印刷を用いて絶縁インキをスクリーン印刷して第1の絶縁層を前記基板上に印刷することを特徴とする実施態様2に記載の方法。
4.別の印刷ステーションで、フラットスクリーン印刷を用いて第1の試薬インキをスクリーン印刷して第1の試薬層を前記基板上に印刷することを特徴とする実施態様3に記載の方法。
5.少なくとも1つの印刷ステーションで、フラットスクリーン印刷を用いて第2の試薬インキをスクリーン印刷して第2の試薬層を前記基板に印刷することを特徴とする実施態様3または4に記載の方法。
6.1つの印刷ステーションで、フラットスクリーン印刷を用いて第2の絶縁インキをスクリーン印刷して第2の絶縁層を前記基板に印刷することを特徴とする実施態様3、4、または5に記載の方法。
7.前記第2の絶縁インキが粘着インキを含むことを特徴とする実施態様6に記載の方法。
8.ある印刷ステーションで、フラットスクリーン印刷を用いてインキをスクリーン印刷して、1または複数の別の電極、試薬層、絶縁層、または粘着層を前記基板に印刷することを特徴とする実施態様1乃至7の何れかに記載の方法。
9.第1の印刷ステーションで、フラットスクリーン印刷を用いて導電インキをスクリーン印刷して前記基板上に1または複数の電極を印刷し、
第2の印刷ステーションで、フラットスクリーン印刷を用いて絶縁インキをスクリーン印刷して前記基板上に第1の絶縁層を印刷し、
第3の印刷ステーションで、フラットスクリーン印刷を用いて第1の試薬インキをスクリーン印刷して前記基板上に第1の試薬層を印刷し、
これらの層がこの順序で印刷されることを特徴とする実施態様3に記載の方法。
Claims (11)
- 電極層及び少なくとも1つの試薬層を含む電気化学センサを製造するための連続工程において、この製造方法が、
基板を前処理のために加熱すること、
前記加熱後に基板の第1の部分に電極層及び少なくとも1つの試薬層を印刷すること、
前記基板の第1の部分に別の基板の第2の部分を接合すること、
前記第2の部分に電極層及び少なくとも1つの試薬層を印刷することを含むことを特徴とする方法。 - 電気化学センサの製造方法であって、
基板のウエブを前処理のために加熱すること、
前記加熱の後、基板材料の第1のロールの前記基板のウエブを1または複数の印刷ステーションを通過させて、スクリーン印刷により1または複数の印刷ステーションで前記基板上に1または複数の電極を印刷すること、
基板材料の第2のロールを前記第1のロールの端部に接合し、前記接合した基板を前記1または複数の印刷ステーションを通過させること
を含むことを特徴とする方法。 - 前記基板上に前記電極を印刷した後、絶縁層印刷ステーションで、フラットスクリーン印刷を用いて絶縁インキをスクリーン印刷して絶縁層を前記基板上に印刷することを特徴とする請求項2に記載の方法。
- 前記基板上に前記絶縁層を印刷した後に、第1の試薬層印刷ステーションで、フラットスクリーン印刷を用いて第1の試薬インキをスクリーン印刷して第1の試薬層を前記基板上に印刷することを特徴とする請求項3に記載の方法。
- 前記基板上に前記第1の試薬層を印刷した後に、第2の試薬層印刷ステーションで、フラットスクリーン印刷を用いて第2の試薬インキをスクリーン印刷して第2の試薬層を前記基板に印刷することを特徴とする請求項4に記載の方法。
- 第1の印刷ステーションで、フラットスクリーン印刷を用いて導電インキをスクリーン印刷して前記基板上に1または複数の電極を印刷し、
第2の印刷ステーションで、フラットスクリーン印刷を用いて絶縁インキをスクリーン印刷して前記基板上に絶縁層を印刷し、
第3の印刷ステーションで、フラットスクリーン印刷を用いて第1の試薬インキをスクリーン印刷して前記基板上に第1の試薬層を印刷し、
これらの層がこの順序で印刷されることを特徴とする請求項2に記載の方法。 - 前記基板のウエブを前処理のために加熱した後に、前記基板を冷却することを特徴とする請求項1から6のいずれか1つに記載の方法。
- 印刷後に前記基板を加熱するステップをさらに含み、前記印刷前の加熱の温度が、前記印刷後の加熱の温度と同一または高温であることを特徴とする請求項1から7のいずれか1つに記載の方法。
- 印刷後に前記基板を加熱するステップをさらに含み、前記印刷前の加熱の温度が、前記印刷後の加熱の温度より高温でないことを特徴とする請求項1から7のいずれか1つに記載の方法。
- 前記印刷後に前記基板を加熱するステップの後に前記基板を冷却することを特徴とする請求項8または9に記載の方法。
- 印刷前の前記基板の加熱の間、張力が前記基板にかけられていることを特徴とする請求項1から10のいずれか1つに記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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US42222602P | 2002-10-30 | 2002-10-30 | |
US42223002P | 2002-10-30 | 2002-10-30 | |
US43668502P | 2002-12-27 | 2002-12-27 | |
US43668302P | 2002-12-27 | 2002-12-27 | |
PCT/GB2003/004656 WO2004040287A1 (en) | 2002-10-30 | 2003-10-30 | Method of manufacture of electrochemical sensors |
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JP2006504945A JP2006504945A (ja) | 2006-02-09 |
JP4624107B2 true JP4624107B2 (ja) | 2011-02-02 |
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JP2004547783A Expired - Fee Related JP4574353B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサの製造の連続工程における印刷ステップの見当合わせを制御する装置及び方法 |
JP2004547786A Expired - Fee Related JP4650876B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサの製造のための連続工程における基板の前処理 |
JP2004547779A Expired - Fee Related JP4650875B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサを製造するためのウエブ印刷工程で使用する冷却ステーション |
JP2004547803A Expired - Fee Related JP4633466B2 (ja) | 2002-10-30 | 2003-10-30 | 可動式フラットスクリーン印刷による電気化学センサの製造 |
JP2004547782A Expired - Fee Related JP4624107B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサの製造方法 |
JP2004547809A Expired - Fee Related JP4642472B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサを製造するための連続工程での酵素印刷の加湿 |
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JP2004547783A Expired - Fee Related JP4574353B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサの製造の連続工程における印刷ステップの見当合わせを制御する装置及び方法 |
JP2004547786A Expired - Fee Related JP4650876B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサの製造のための連続工程における基板の前処理 |
JP2004547779A Expired - Fee Related JP4650875B2 (ja) | 2002-10-30 | 2003-10-30 | 電気化学センサを製造するためのウエブ印刷工程で使用する冷却ステーション |
JP2004547803A Expired - Fee Related JP4633466B2 (ja) | 2002-10-30 | 2003-10-30 | 可動式フラットスクリーン印刷による電気化学センサの製造 |
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Country Status (14)
Country | Link |
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EP (6) | EP1586222B1 (ja) |
JP (6) | JP4574353B2 (ja) |
KR (6) | KR101125202B1 (ja) |
AT (6) | ATE441106T1 (ja) |
AU (6) | AU2003278367B2 (ja) |
CA (6) | CA2504574C (ja) |
DE (6) | DE60315338T2 (ja) |
DK (1) | DK1579204T3 (ja) |
ES (6) | ES2290507T3 (ja) |
HK (6) | HK1076865A1 (ja) |
MX (5) | MXPA05004643A (ja) |
PT (1) | PT1579204E (ja) |
SI (1) | SI1579204T1 (ja) |
WO (6) | WO2004040005A1 (ja) |
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