JP4620448B2 - Substrate recognition processing method - Google Patents

Description

  The present invention relates to a substrate recognition processing method in which an illuminating device illuminates a positioning mark attached to a printed circuit board and an image is captured by a substrate recognition camera, and the captured image is recognized by a substrate recognition processing device.

This type of substrate recognition processing method is disclosed in, for example, Patent Document 1, but the illumination device illuminates the positioning mark attached to the printed circuit board, and the substrate recognition camera captures the image. When the processing device performs recognition processing, the input signal of the image is amplified and adjusted to enhance contrast, that is, the sensitivity is changed and adjusted to correspond to the type of printed circuit board.
Japanese Patent Laid-Open No. 2002-94298

  However, there is a limit in changing the sensitivity and adapting to the type of the printed circuit board, and there are cases where it cannot be handled.

  Accordingly, an object of the present invention is to optimize the luminance with which light is irradiated by an illumination device in accordance with the type of printed circuit board.

Therefore, according to a first aspect of the present invention, there is provided a substrate recognition processing method in which a lighting device illuminates a positioning mark attached to a printed circuit board, and a substrate recognition camera captures an image.
The substrate recognition processing device performs recognition processing on an image captured by the substrate recognition camera in a state where the illumination device is illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result.

According to a second aspect of the present invention, there is provided a substrate recognition processing method in which an illumination device illuminates a positioning mark attached to a printed circuit board and the substrate recognition camera captures an image, and the captured image is recognized by the substrate recognition processing device.
The substrate recognition processing device performs recognition processing on an image captured by the substrate recognition camera in a state where the illumination device is illuminated so as to have a predetermined brightness based on reference luminance data,
If this recognition process is abnormal, the image is illuminated, imaged and recognized based on a plurality of first luminance data increased or decreased at a predetermined first increase / decrease rate with the reference luminance data as the center,
Weighting the recognition processing results for each of the plurality of first luminance data,
Illuminating, imaging, and recognizing based on a plurality of second luminance data increased or decreased at a second increase / decrease rate smaller than the first increase / decrease rate with the first best luminance data selected based on the weighted result as a center,
Weighting the recognition processing results for each of the plurality of second luminance data,
A subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result .

According to a third aspect of the present invention, a half mirror is disposed in a cylinder below a board recognition camera that images a positioning mark attached to a printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror. A plurality of ring illumination devices are provided in the cylinder below the half mirror, the positioning mark is illuminated by the coaxial illumination device and the ring illumination device, and the substrate recognition camera images the image. A substrate recognition processing method in which the substrate recognition processing apparatus performs recognition processing,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result.

According to a fourth aspect of the present invention, a half mirror is disposed in a cylinder below a board recognition camera that images a positioning mark attached to a printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror. A plurality of ring illumination devices are provided in the cylinder below the half mirror, the positioning mark is illuminated by the coaxial illumination device and the ring illumination device, and the substrate recognition camera images the image. A substrate recognition processing method in which the substrate recognition processing apparatus performs recognition processing,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Determine whether the illumination by the ring illumination device should be dark,
When it is determined that the darker one is better, the ring illumination device is turned off and illuminated with only the coaxial illumination device based on the plurality of first luminance data, imaged and recognized,
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result.

According to a fifth aspect of the present invention, a half mirror is disposed in a cylinder below a board recognition camera that images a positioning mark attached to a printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror. A plurality of ring illumination devices are provided in the cylinder below the half mirror, the positioning mark is illuminated by the coaxial illumination device and the ring illumination device, and the substrate recognition camera images the image. A substrate recognition processing method in which the substrate recognition processing apparatus performs recognition processing,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Determine whether the illumination by the coaxial illumination device should be dark,
If it is determined that the darker one is better, the coaxial illumination device is turned off and only the ring illumination device is illuminated and imaged based on the plurality of first luminance data for recognition processing,
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result.

  Since the present invention can optimize the luminance of light emitted from the lighting device according to the type of printed circuit board, there are cases where the conventional method of changing and adjusting the sensitivity cannot cope with it. Can respond reliably.

  An embodiment of the present invention will be described below based on the drawings. In FIG. 1, reference numeral 1 denotes a board recognition camera apparatus having an illumination device, which includes a board recognition camera 2 for imaging a positioning mark attached on a printed board P in an electronic component mounting apparatus. A lens 4 is disposed in the lower cylinder 3.

  Further, a half mirror 5 is disposed below the lens 4, and a coaxial illumination device 6 is provided around the tube 3 on the side of the half mirror 5, and light from the coaxial illumination device 6 is half-lighted. In this configuration, the positioning mark on the printed circuit board P can be irradiated through the mirror 5. A plurality of first ring illumination devices 8 are provided on the mounting cylinder 7 provided around the inside of the cylinder 3 below the half mirror 5, and a plurality of mounting cylinders 9 provided on the lower end of the cylinder 3 are provided. The second ring illumination device 10 is provided and can irradiate the positioning mark of the printed circuit board P.

  Then, illumination by the coaxial illumination device 6 and the first ring illumination device 8 (standard illumination selection) or illumination by the second ring illumination device 10 (optional illumination) is performed, the positioning mark is irradiated with light, and the substrate recognition camera 2 It is the structure imaged by.

  Next, in the block diagram of FIG. 2, 11 is a CPU as a control unit that performs overall control of operations related to mounting of the electronic component mounting apparatus, 12 is the X direction in the printed circuit board P for each mounting order of electronic components, and Y RAM (Random Access) for storing mounting data, part library data, reference luminance data relating to brightness by light irradiation by a lighting device described later, and the like including direction and angle position information, arrangement number information of each component supply unit, etc. (Memory), 13 is a ROM (Read Only Memory) for storing the program.

  Then, the CPU 11 comprehensively controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 13 based on each data stored in the RAM 12. That is, the CPU, for example, an X-axis drive motor 15 for moving the mounting head provided with the suction nozzle in the X direction via the drive circuit 14, and a Y-axis drive motor 16 for moving the mounting head in the Y direction, The driving of the vertical axis drive motor 17 for moving the suction nozzle up and down and the θ-axis drive motor 18 for rotating the suction nozzle are controlled.

  Reference numeral 20 denotes a component recognition camera for imaging an electronic component sucked by the suction nozzle. Reference numeral 21 denotes how much the electronic component is displaced and held with respect to the suction nozzle by XY direction and rotation angle. A component recognition processing circuit 22 to be processed is a substrate recognition processing circuit 22 for recognizing an image obtained by imaging the positioning mark attached to the printed board P by the board recognition camera 2 and recognizing the position of the positioning mark. Images taken by the board recognition camera 2 and the component recognition camera 20 are displayed on the monitor 24 by the display circuit 23.

  The component recognition processing circuit 21 and the substrate recognition processing circuit 22 are connected to the CPU 11 via the interface 25, and the component recognition processing is performed by recognizing an image captured by the component recognition camera 20 or the substrate recognition camera 2. The processing is performed by the circuit 21 and the substrate recognition processing circuit 22, and the processing result is sent to the CPU 11.

  Then, when the positional deviation amount is grasped by the recognition processing of the component recognition processing circuit 21 and the board recognition processing circuit 22, the result is sent to the CPU 11, and the CPU 11 detects the X axis drive motor 15 and the Y axis drive motor 16. By moving in the X direction and Y direction by driving, and by rotating θ by the θ axis drive motor 18, the rotational angular position about the X, Y direction and the vertical axis is corrected.

  The coaxial illumination device 6, the first ring illumination device 8, and the second ring illumination device 10 are controlled to be lit by the CPU 11 via the illumination lighting circuit 27.

  With the above configuration, the luminance level automatic tracking operation will be described below based on the flowchart of FIG. In the electronic component mounting apparatus, the printed circuit board P conveyed from the upstream apparatus and positioned by the positioning apparatus is imaged with a positioning mark by the board recognition camera 2 configured to be movable in the plane direction. In this case, the positioning mark is illuminated in accordance with the reference luminance data stored in the RAM 12 for each type of the printed circuit board P, and is imaged as described above.

  In this case, illumination by the coaxial illumination device 6 and the first ring illumination device 8 (standard illumination selection) based on the reference luminance data stored in the RAM 12 or illumination by the second ring illumination device 10 (optional illumination) is performed. The lighting is controlled by the CPU 11 via the illumination lighting circuit 27, and the positioning mark 2 is imaged by the substrate recognition camera 2. In the following description, it is assumed that the illumination is standard illumination by the coaxial illumination device 6 and the first ring illumination device 8 unless otherwise specified.

  The captured image of the positioning mark is recognized by the substrate recognition processing circuit 22. In this case, if the result of the recognition processing by the board recognition processing circuit 22 is abnormal because the CPU 11 should not continue the operation related to the mounting of the electronic component, for example, the positioning mark is not found or the area of the positioning mark is constant. If it is determined that it is out of the range or the contrast is out of a certain range, the automatic follow-up operation is continued if it is determined as abnormal.

  When the recognition is determined to be abnormal, it is determined whether the selected illumination is not standard illumination but optional illumination, that is, illumination by the second ring illumination device 10, and the coaxial illumination device 6 and the first ring illumination device 8 are determined. The standard illumination by the second ring illumination device 10 and not the optional illumination by the second illumination device 10, the brightness level values of 24 points excluding the reference luminance value in the range A in FIG. Illuminated by the ring illumination device 8, the positioning mark is imaged by the substrate recognition camera 2, and the substrate recognition processing circuit 22 executes the substrate recognition processing. That is, with the reference luminance value as the center, the luminance level value of the illumination by the first ring illumination device 8 is increased and decreased by 40%, and the luminance level value of the illumination by the coaxial illumination device 6 is increased and decreased by 40%. Illuminate with 24 luminance level values excluding the reference luminance value in the range A, and take an image.

  In this case, each of the 24 points is weighted. In other words, when it cannot be recognized, it is set to 0 (zero point), and when it can be recognized, weighting is performed from the degree of area coincidence and contrast. Add. The area coincidence is the ratio of the area of the binarized image to the area calculated from the edge of the detected positioning mark, and is necessary for judging the degree of worm-eating, and the contrast is near the edge of the positioning mark. This is the contrast difference between the base material portion of the printed circuit board P and the positioning mark.

  In addition, when the base material of the printed circuit board P is shining due to the corrosion tendency of the over resist or the positioning mark, the positioning mark does not shine and the contrast cannot be obtained, or when the positioning mark has many irregularities and there is a worm-eaten state, etc. Correspondingly, weighting is performed from the degree of area coincidence and contrast.

  If the 24 weighting points are not all 0 points, the maximum MAX value (best value) of the points is included in the range B in FIG. 5, in other words, the illumination by the first ring illumination device 8 is darker. When the CPU 11 determines whether or not it is good and the maximum MAX value of the score is included in the range B of FIG. 5, the reference luminance value only by the coaxial illumination device 6 with the first ring illumination device 8 turned off, Using the brightness level value increased and decreased by 40% around the reference brightness value, and the brightness level value increased and decreased by 40% around the brightness level value, illumination imaging is performed five times. The maximum follow-up reference luminance is set to the maximum MAX value of the weighting points in the range B in 5 and the 10 luminance level values in the current range D.

  However, in the case where the maximum MAX value of the 24 weighted points is not included in the range B in FIG. 5, this maximum MAX value is included in the range C in FIG. 5, in other words, the illumination by the coaxial illumination device 6 is more. When the CPU 11 determines whether the darker one is better and the maximum MAX value of the score is included in the range C in FIG. 5, the reference luminance only by the first ring illumination device 8 with the coaxial illumination device 6 turned off. Using the value, the brightness level value increased and decreased by 40% around the reference brightness value, and the brightness level value increased and decreased by 40% around the brightness level value, The maximum MAX value of the weighting points in the 10 brightness level values in the previous range A and the current ranges E and D in FIG.

  However, when the maximum MAX value of the 24 weighted points is not included in the range C in FIG. 5, the CPU 11 sets the maximum MAX value weighted among the 24 points as the detailed follow-up reference luminance.

  Next, as shown in FIG. 6, when the weighted score among the 24 points as described above is not zero, and the maximum MAX value of the score is included in the range B in FIG. Or the maximum MAX value of the weighting points in the ranges A and D when the maximum MAX value of the points is not included in the range B and included in the range C, or the maximum MAX value of the points is in the range B Using a plurality of luminance level values centered on the detailed follow-up reference luminance when the maximum follow-up reference luminance is set to the maximum MAX value weighted among the 24 points when not included in the range C, Imaging with the illumination by the coaxial illumination device 6 and the first ring illumination device 8 and the substrate recognition camera 2 is performed, and the substrate recognition processing by the substrate recognition processing 22 is executed. That is, the board recognition processing is executed using the first ring illumination device 8 and the coaxial illumination device 6 whose luminance level values are increased or decreased by 20% with the detailed tracking reference luminance as the center.

  Then, the CPU 11 weights (scores) each of the other eight points excluding the detailed follow-up reference luminance. The luminance level value of the weighted maximum MAX value is stored in the RAM 12 as an automatic follow-up value, and the board recognition process is executed using the luminance level value of the maximum MAX value from the next recognition process of the printed board P.

  As described above, the illumination based on the reference luminance data of the coaxial illumination device 6 and the first ring illumination device 8 is performed, the recognition is determined to be normal, and the selected illumination is the optional illumination, that is, the second ring. If it is determined that the illumination is performed by the second ring illumination device 10 when it is determined whether the illumination is performed by the illumination device 10, the control shown in FIG. 4 is performed.

  That is, when the selected illumination is optional illumination for the printed circuit board P to correspond to a special substrate such as a ceramic substrate, illumination is performed by the second ring illumination device 10, and the reference luminance as shown in FIG. The board recognition process is executed by illuminating with the brightness level values of 8 points, each of which is increased or decreased by 20% around the reference brightness value excluding the value.

  In this case, each of the 8 points is weighted. In other words, when it cannot be recognized, it is set to 0 (zero point), and when it can be recognized, weighting is performed from the degree of area coincidence and contrast. Add.

  If the eight weighting points are not all 0 points, the maximum MAX value of the points among the eight points is set as the detailed follow-up reference luminance, and as shown in FIG. Is used to execute the substrate recognition process. That is, the board recognition process is executed using eight points obtained by increasing and decreasing the brightness level value of the second illumination device 10 by 2% around the detailed follow-up reference brightness.

  Then, each of the eight points is weighted (scored). Using the luminance level value of the weighted maximum MAX value as the automatic follow-up value, the board recognition process is executed using the luminance level value of the maximum MAX value from the next recognition process of the printed circuit board P.

  As described above, when the selected illumination is not the optional illumination and the weighting points of 24 points in the range A in FIG. 5 are all 0 points, or the selected illumination is the optional illumination and the 8 points are weighted. When all the points are 0, the CPU 11 performs control so that the recognition abnormality is displayed on the monitor 24.

  In this case, the CPU 11 stops the operation of the electronic component mounting apparatus and shifts to the alignment mode, and the operator changes the reference luminance data, and each coaxial illumination device 6, the first and second ring illumination devices 8, 10. Make adjustments.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a side view which carries out a partial section of a substrate recognition camera device. It is a control block diagram. It is a flowchart figure which concerns on the luminance level automatic tracking in board | substrate recognition. It is a flowchart figure similarly concerning the luminance level automatic tracking in board | substrate recognition. It is a figure which shows the luminance level value of the example of rough tracking in case standard illumination is selected. It is a figure which shows the luminance level value of the detailed follow-up example when standard illumination is selected. It is a figure which shows the luminance level value of the example of rough tracking when option illumination is selected. It is a figure which shows the luminance level value of the example of detailed follow-up when option illumination is selected.

Explanation of symbols

2 substrate recognition camera 6 coaxial illumination device 8 first ring illumination device 10 second ring illumination device 11 CPU
12 RAM
22 PCB recognition processing circuit P Printed circuit board

Claims (5)

In the substrate recognition processing method in which the illumination device illuminates the positioning mark attached to the printed circuit board and the substrate recognition camera captures an image, and the captured image is recognized by the substrate recognition processing device.
The substrate recognition processing device performs recognition processing on an image captured by the substrate recognition camera in a state where the illumination device is illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data ,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result ,
Weighting the recognition processing results for each of the plurality of second luminance data,
A substrate recognition processing method, wherein a subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result . In the substrate recognition processing method in which the illumination device illuminates the positioning mark attached to the printed circuit board and the substrate recognition camera captures an image, and the captured image is recognized by the substrate recognition processing device.
The substrate recognition processing device performs recognition processing on an image captured by the substrate recognition camera in a state where the illumination device is illuminated so as to have a predetermined brightness based on reference luminance data ,
If this recognition process is abnormal, the image is illuminated, imaged and recognized based on a plurality of first luminance data increased or decreased at a predetermined first increase / decrease rate with the reference luminance data as the center,
Weighting the recognition processing results for each of the plurality of first luminance data ,
Illuminating, imaging, and recognizing processing based on a plurality of second luminance data that are increased or decreased at a second increase / decrease rate smaller than the first increase / decrease rate with the first best luminance data selected based on the weighted result as a center,
Weighting the recognition processing results for each of the plurality of second luminance data,
A substrate recognition processing method, wherein a subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result . A half mirror is disposed in a cylinder below the board recognition camera that images the positioning mark attached to the printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror, and the half mirror A plurality of ring illumination devices are provided in the cylinder at the lower side, the coaxial illumination device and the ring illumination device illuminate the positioning mark, and the substrate recognition camera captures an image, and the substrate recognition processing device captures the captured image. A substrate recognition processing method for performing recognition processing ,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A substrate recognition processing method, wherein a subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result. A half mirror is disposed in a cylinder below the board recognition camera that images the positioning mark attached to the printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror, and the half mirror A plurality of ring illumination devices are provided in the cylinder at the lower side, the coaxial illumination device and the ring illumination device illuminate the positioning mark, and the substrate recognition camera captures an image, and the substrate recognition processing device captures the captured image. A substrate recognition processing method for performing recognition processing ,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Determine whether the illumination by the ring illumination device should be dark,
When it is determined that the darker one is better, the ring illumination device is turned off and illuminated with only the coaxial illumination device based on the plurality of first luminance data, imaged and recognized,
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A substrate recognition processing method, wherein a subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result. A half mirror is disposed in a cylinder below the board recognition camera that images the positioning mark attached to the printed circuit board, and a coaxial illumination device is provided around the cylinder on the side of the half mirror, and the half mirror A plurality of ring illumination devices are provided in the cylinder at the lower side, the coaxial illumination device and the ring illumination device illuminate the positioning mark, and the substrate recognition camera captures an image, and the substrate recognition processing device captures the captured image. A substrate recognition processing method for performing recognition processing,
The substrate recognition processing device recognizes the image captured by the substrate recognition camera in a state where the coaxial illumination device and the ring illumination device are illuminated so as to have a predetermined brightness based on reference luminance data,
When this recognition process is abnormal, illumination is performed based on the plurality of first luminance data increased or decreased with the reference luminance data as a center, and imaging and recognition processing are performed.
Weighting the recognition processing results for each of the plurality of first luminance data,
Determine whether the illumination by the coaxial illumination device should be dark,
If it is determined that the darker one is better, the coaxial illumination device is turned off and only the ring illumination device is illuminated and imaged based on the plurality of first luminance data for recognition processing,
Weighting the recognition processing results for each of the plurality of first luminance data,
Illumination, imaging, and recognition processing are performed based on a plurality of second luminance data that are increased or decreased around the first best luminance data selected based on the weighted result,
Weighting the recognition processing results for each of the plurality of second luminance data,
A substrate recognition processing method, wherein a subsequent printed circuit board recognition process is performed based on the second best luminance data selected based on the weighted result.

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