JP4601404B2 - 発光装置および照明装置 - Google Patents

発光装置および照明装置 Download PDF

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Publication number
JP4601404B2
JP4601404B2 JP2004343100A JP2004343100A JP4601404B2 JP 4601404 B2 JP4601404 B2 JP 4601404B2 JP 2004343100 A JP2004343100 A JP 2004343100A JP 2004343100 A JP2004343100 A JP 2004343100A JP 4601404 B2 JP4601404 B2 JP 4601404B2
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JP
Japan
Prior art keywords
light emitting
light
connection pad
emitting element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004343100A
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English (en)
Japanese (ja)
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JP2006156603A5 (de
JP2006156603A (ja
Inventor
督享 森
信幸 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2004343100A priority Critical patent/JP4601404B2/ja
Publication of JP2006156603A publication Critical patent/JP2006156603A/ja
Publication of JP2006156603A5 publication Critical patent/JP2006156603A5/ja
Application granted granted Critical
Publication of JP4601404B2 publication Critical patent/JP4601404B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2004343100A 2004-11-26 2004-11-26 発光装置および照明装置 Expired - Fee Related JP4601404B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004343100A JP4601404B2 (ja) 2004-11-26 2004-11-26 発光装置および照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004343100A JP4601404B2 (ja) 2004-11-26 2004-11-26 発光装置および照明装置

Publications (3)

Publication Number Publication Date
JP2006156603A JP2006156603A (ja) 2006-06-15
JP2006156603A5 JP2006156603A5 (de) 2007-04-19
JP4601404B2 true JP4601404B2 (ja) 2010-12-22

Family

ID=36634513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004343100A Expired - Fee Related JP4601404B2 (ja) 2004-11-26 2004-11-26 発光装置および照明装置

Country Status (1)

Country Link
JP (1) JP4601404B2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996871B2 (ja) 2010-02-09 2016-09-21 日亜化学工業株式会社 発光装置および発光装置の製造方法
US9722157B2 (en) 2010-04-09 2017-08-01 Rohm Co., Ltd. LED module
JP2013041952A (ja) * 2011-08-12 2013-02-28 Sharp Corp 発光装置
TWI556478B (zh) 2014-06-30 2016-11-01 億光電子工業股份有限公司 發光二極體裝置
JP6576344B2 (ja) * 2014-07-15 2019-09-25 シチズン電子株式会社 発光装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01160864U (de) * 1988-04-11 1989-11-08
JPH0951108A (ja) * 1995-08-04 1997-02-18 Furukawa Electric Co Ltd:The 光受発光素子モジュール及びその製作方法
JPH09321341A (ja) * 1996-05-30 1997-12-12 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
JPH10170769A (ja) * 1996-12-10 1998-06-26 Nec Corp 光素子の実装方法
JP2002324918A (ja) * 2001-02-07 2002-11-08 Patent Treuhand Ges Elektr Gluehlamp Mbh リフレクタを備えた半導体モジュール
JP2003243718A (ja) * 2002-02-14 2003-08-29 Matsushita Electric Works Ltd 発光装置
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2004253404A (ja) * 2002-12-24 2004-09-09 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2004311456A (ja) * 2003-02-19 2004-11-04 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005045038A (ja) * 2003-07-23 2005-02-17 Nichia Chem Ind Ltd 窒化物半導体発光素子

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01160864U (de) * 1988-04-11 1989-11-08
JPH0951108A (ja) * 1995-08-04 1997-02-18 Furukawa Electric Co Ltd:The 光受発光素子モジュール及びその製作方法
JPH09321341A (ja) * 1996-05-30 1997-12-12 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
JPH10170769A (ja) * 1996-12-10 1998-06-26 Nec Corp 光素子の実装方法
JP2002324918A (ja) * 2001-02-07 2002-11-08 Patent Treuhand Ges Elektr Gluehlamp Mbh リフレクタを備えた半導体モジュール
JP2003243718A (ja) * 2002-02-14 2003-08-29 Matsushita Electric Works Ltd 発光装置
JP2004253404A (ja) * 2002-12-24 2004-09-09 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2004311456A (ja) * 2003-02-19 2004-11-04 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005045038A (ja) * 2003-07-23 2005-02-17 Nichia Chem Ind Ltd 窒化物半導体発光素子

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JP2006156603A (ja) 2006-06-15

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