JP2006156603A5 - - Google Patents
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- Publication number
- JP2006156603A5 JP2006156603A5 JP2004343100A JP2004343100A JP2006156603A5 JP 2006156603 A5 JP2006156603 A5 JP 2006156603A5 JP 2004343100 A JP2004343100 A JP 2004343100A JP 2004343100 A JP2004343100 A JP 2004343100A JP 2006156603 A5 JP2006156603 A5 JP 2006156603A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- connection pad
- light
- emitting element
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 230000002093 peripheral Effects 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 239000003086 colorant Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000003287 optical Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000009877 rendering Methods 0.000 description 7
- 230000001629 suppression Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 241001417501 Lobotidae Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052803 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 230000000295 complement Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 231100000040 eye damage Toxicity 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004343100A JP4601404B2 (ja) | 2004-11-26 | 2004-11-26 | 発光装置および照明装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004343100A JP4601404B2 (ja) | 2004-11-26 | 2004-11-26 | 発光装置および照明装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006156603A JP2006156603A (ja) | 2006-06-15 |
| JP2006156603A5 true JP2006156603A5 (de) | 2007-04-19 |
| JP4601404B2 JP4601404B2 (ja) | 2010-12-22 |
Family
ID=36634513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004343100A Expired - Fee Related JP4601404B2 (ja) | 2004-11-26 | 2004-11-26 | 発光装置および照明装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4601404B2 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102754229B (zh) | 2010-02-09 | 2016-07-06 | 日亚化学工业株式会社 | 发光装置、及发光装置的制造方法 |
| CN105720180B (zh) | 2010-04-09 | 2018-05-29 | 罗姆股份有限公司 | Led模块 |
| JP2013041952A (ja) * | 2011-08-12 | 2013-02-28 | Sharp Corp | 発光装置 |
| TWI556478B (zh) * | 2014-06-30 | 2016-11-01 | 億光電子工業股份有限公司 | 發光二極體裝置 |
| JP6576344B2 (ja) * | 2014-07-15 | 2019-09-25 | シチズン電子株式会社 | 発光装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160864U (de) * | 1988-04-11 | 1989-11-08 | ||
| JP2994235B2 (ja) * | 1995-08-04 | 1999-12-27 | 古河電気工業株式会社 | 光受発光素子モジュール及びその製作方法 |
| JPH09321341A (ja) * | 1996-05-30 | 1997-12-12 | Nichia Chem Ind Ltd | 光半導体装置及びその製造方法 |
| JP3036446B2 (ja) * | 1996-12-10 | 2000-04-24 | 日本電気株式会社 | 光素子の実装方法 |
| DE10105802A1 (de) * | 2001-02-07 | 2002-08-08 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Reflektorbehaftetes Halbleiterbauelement |
| JP2003243718A (ja) * | 2002-02-14 | 2003-08-29 | Matsushita Electric Works Ltd | 発光装置 |
| JP2004253404A (ja) * | 2002-12-24 | 2004-09-09 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP4307094B2 (ja) * | 2003-02-04 | 2009-08-05 | パナソニック株式会社 | Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置 |
| JP4163982B2 (ja) * | 2003-02-19 | 2008-10-08 | 京セラ株式会社 | 発光素子収納用パッケージおよび発光装置 |
| JP4889193B2 (ja) * | 2003-07-23 | 2012-03-07 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
-
2004
- 2004-11-26 JP JP2004343100A patent/JP4601404B2/ja not_active Expired - Fee Related
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