JP4597772B2 - Suction head and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus including a suction head used for sucking and transferring an object to be sucked and a component tray discharging device that sucks and discharges an empty component tray for which component supply has been completed.

  In order to supply a large-sized electronic component, it is difficult to hold the large-sized electronic component in the tape with a carrier tape. Then, in order to replace the component tray in accordance with the discharge of the component tray with no electronic components or the change of the type of the printed circuit board, it is necessary to move the component tray. As described above, when the electronic component is supplied by the component tray, the transfer of the electronic component and the transfer of the component tray are conventionally performed by separate transfer devices. For this reason, there is a problem that the configuration of the electronic component transfer device is complicated and the cost is increased.

  In order to solve this problem, a technique described in Patent Document 1 has been considered. As shown in FIG. 1 on page 13 of this document, this technique moves a holder 92 that can hold alternatively a tray suction head 200 that holds a component tray and a component suction head that holds an electronic component, and the holder. The component tray 34 and the electronic component are held and transferred by the holder moving device. In this technique, since both the component tray 34 and the electronic component can be transferred by the common holder 92 and the moving device 58 only by changing the head portion, the configuration of the device can be simplified.

Further, this technology sucks and holds the component tray 34 and the electronic component with negative pressure, and the component suction head holds the electronic component by supplying negative pressure to the component passage 146 and supplies compressed air. To release the holding. On the other hand, the tray suction head 200 causes the compressed air supplied from the component passage 146 to the air supply body 204 to be ejected from the outlet 240 to the vicinity of the opening on the side opposite to the component tray 34 side of the annular passage 234. Air between the passage 234 and the component tray 34 is sucked to hold the component tray 34.
JP-A-6-296092 (page 13, FIG. 1)

  However, there are shallow recesses and low protrusions on the suction surface of the component tray, and the thickness of the component tray varies. There is a need for a buffer device that performs buffer movement in the direction perpendicular to the suction surface in the head. For example, in Patent Document 1, a sponge 242 is used as a buffer device, but sufficient buffer movement could not be obtained.

  A tray suction head 155 having a stroke buffer device 153 as shown in FIGS. 7 and 8 is also known. This is biased so that the mounting table 156 and the suction part 158 are separated by a spring member, and when the component tray is sucked, the buffer part moves so that the suction part 158 approaches the mounting table 156. The head holder device 157 to which the tray suction head 155 is mounted includes a mounting air flow path 159 through which negative pressure air flows for mounting the tray suction head 155 and the component suction head, and when the component suction head is mounted. And a negative pressure flow passage 161 through which negative pressure air flows.

  When the component suction head is mounted, the negative pressure flow passage 161 opens on the lower surface of the suction portion 160, so that it directly communicates with the suction nozzle through the component suction head mounted on the suction portion 160. Yes.

  On the other hand, the tray suction head 155 is provided with a positive pressure flow passage as an air hose 151 for supplying positive pressure air to the ejector 163 that sucks the component tray. However, the air hose 151 hinders the smooth movement of the head holder device 157 or comes in contact with the adsorbing component tray, which may interfere with the operation when the component tray is ejected.

  The present invention has been made in view of the conventional problems, and the configuration of the apparatus can be simplified, and the air hose that obstructs the discharge operation of the object to be adsorbed can be eliminated, and sufficient buffer movement is achieved. It is an object of the present invention to provide a suction head capable of performing the above and an electronic component mounting apparatus including the suction head.

  In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a head holder device having a supply hole for supplying air is provided with a mounting base that is detachably mounted and an ejector. In the suction head having a suction part, the mounting base includes a connection part provided with a communication hole that is a projection-like connection part and communicates with the supply hole, and the suction part includes a sliding part. The connecting hole is movably fitted and has a connecting hole in which the communication hole opens, the connecting hole communicates with an ejection nozzle that supplies positive pressure air to the ejector, and between the mounting base and the suction part, A balance device is provided that cancels the force acting in the direction of separating the mounting base and the suction part when positive pressure air is supplied.

The structural feature of the invention according to claim 2 is that a substrate carrying device for carrying in and mounting a substrate on which electronic components are mounted and a component tray on which a large number of pockets for accommodating the electronic components are arranged. Electronic component supply device, a component suction head for sucking each electronic component stored in each pocket of the component tray supplied by the electronic component supply device, and the component suction head are detachably mounted And a head holder device having a supply hole for supplying a negative pressure to the component suction head for sucking the electronic component, and mounting the electronic component sucked by the component suction head on the substrate In an electronic component mounting machine comprising a transfer device and a tray suction head that is detachably attached to the head holder device and sucks and discharges an empty component tray, The tray suction head includes a mounting base that is detachably mounted on the head holder device, and a suction portion that is provided with an ejector that sucks the component tray at a lower portion. A connecting portion provided with a communicating hole communicating with the supply hole, and the suction portion includes a connecting hole in which the connecting portion is slidably fitted and the communicating hole is opened. The connecting hole communicates with an ejection nozzle that supplies positive pressure air to the ejector, and includes an air supply device that selectively supplies negative pressure air or positive pressure air to the supply hole. And a balance device that cancels a force that presses the suction portion downward against the mounting base when positive pressure air is supplied.

  The structural feature of the invention according to claim 3 is that in claim 2, the balance device is a cylinder device provided between the mounting base and the suction portion, and the cylinder device is disposed in the connecting hole. It is provided with a communicating path that communicates, and when positive pressure air is supplied to the connecting hole, a force that cancels the force that presses the suction portion downward is generated.

  The structural feature of the invention according to claim 4 is that, in claim 2 or 3, a spring member is provided between the mounting base and the suction part, and the mounting base and the suction part are separated from each other. It is to force.

  In the invention according to claim 1, positive pressure air is supplied to the ejection nozzle through a supply hole provided in the head holder device, a communication hole provided in the connection portion, and a connection hole in which the communication hole opens, Suction is performed with an ejector (ejector vacuum pump). Thereby, an air hose for supplying positive pressure air to the ejector can be omitted, and conventionally, there is no air hose that hinders the work, so that the suction work can be performed smoothly. Further, the attachment head and the suction part are relatively moved closer to and away from each other by sliding the connection part and the connection hole of the suction head. When positive pressure air is supplied to the connecting hole, a force that pushes the connecting portion from the connecting hole is acted by the pressure of the air, and the force acts in a direction to separate the mounting base and the suction portion. At this time, the suction device can be made to approach the mounting table smoothly with a small force by offsetting this force with a balance device provided between the mounting table and the suction unit. As a result, it is possible to provide a suction head that can reliably suck in response to variations in the thickness of the object to be sucked.

  In the invention according to claim 2, positive pressure air is supplied to the ejection nozzle through a supply hole provided in the head holder device, a communication hole provided in the connection portion, and a connection hole in which the communication hole opens, and the component tray is ejected. Aspirate with. Thereby, the air hose for supplying positive pressure air to the ejector can be omitted, and since there is no air hose that hinders the work, the tray discharge work can be performed smoothly. In addition, the tray suction head slides the connecting portion and the connecting hole, so that the suction portion approaches and separates from the mounting base in the vertical direction. When positive pressure air is supplied to the connection hole, the pressure of the air causes a force to push the connection portion out of the connection hole, and the force that the suction portion presses downward against the mounting base. Arise. At this time, by using a balance device provided between the mounting base and the suction part, the suction part can be brought close to the mounting base smoothly with a small force by canceling out the pressing force. As a result, it is possible to provide an electronic component mounting apparatus including a tray suction head that can reliably suck in response to variations in the thickness of the component tray to be sucked.

  Further, when the electronic component mounting apparatus sucks an electronic component, the component sucking head can be mounted on the same head holder device on which the tray suction head is mounted. In this way, by selectively mounting the tray suction head and the component suction head on the same head holder device, there is no need to provide different head holder devices or different moving devices for moving the head holder device. The configuration of the electronic component mounting apparatus can be simplified as a whole.

  According to a third aspect of the present invention, when positive pressure air is supplied to the cylinder device, the piston of the cylinder device contracts to generate a force that pulls the suction portion upward, and presses the suction portion downward. The power can be offset.

  In the invention according to claim 4, since the spring member is biased in the direction of separation, the mounting base and the suction portion are held in a separated state even when positive pressure air is not supplied, and the backlash is Does not cause. Further, by changing the spring member to one having a different elastic force, the downward pressing force of the suction portion can be easily changed.

  An embodiment of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is an overall schematic view showing an electronic component mounting apparatus, and FIG. 2 is a sectional view of a tray suction head mounted on a suction head holder used in the electronic component mounting apparatus.

  An electronic component mounting apparatus 1 according to the present embodiment includes a substrate transport device 3 that carries a substrate S on which an electronic component is mounted and positions it at a mounting position, and an electronic component that supplies a component tray 5 in which the electronic component is accommodated. The supply device 9, the component transfer device 11 for mounting the electronic component supplied from the electronic component supply device 9 on the substrate S, and the component tray discharge device 15 for discharging the component tray 5 that has been emptied by taking out the electronic component. And a control device (not shown) for controlling these devices and a storage device (not shown) for storing management data.

  The substrate transfer device 3 is provided with a pair of horizontal frames 17 extending in the transfer direction, and the horizontal frame 17 is provided with a conveyor belt on which the substrate S is placed and transferred. Although not shown, the substrate transfer device 3 includes an elevating device that supports the substrate S and raises it to the mounting position, and a clamp device that positions and fixes the substrate S at the raised position.

  The electronic component supply device 9 includes a tray supply device 21, and the tray supply device 21 has a housing 25 supported by a support portion 23 having casters 23a and wheels 23b. A tray stocker 27 in which a plurality of shelves are formed is provided in the housing 25, and the tray stocker 27 is formed so as to be movable up and down in the housing 25. Each of these shelves can be identified for each level, and a component tray 5 is stored for each shelf. In order to pull out the component tray 5 from these shelves, the tray stocker 27 is moved up and down to position the shelf in which the component tray 5 that needs to be pulled out is positioned at the take-out position. The tray 5 is pulled out. Each of these component trays 5 is provided with an individual identification number, and a large number of pockets for accommodating electronic components are formed. These pockets are formed, for example, in a grid pattern, and the positions of the pockets can be specified by numbers on the vertical axis and alphabets on the horizontal axis. Thereby, the position of the pocket and the electronic component to be accommodated can be managed in a one-to-one correspondence. Also in the tray stocker 27, for each shelf storing the component tray 5, the loading / unloading of the component tray 5 is recorded as management data in the storage device so that the storage status of the component tray 5 can be managed. . Even when a plurality of component trays 5 are held in a stacked state on a rectangular pallet (not shown), accommodated in the tray stocker 27 in that state, and pulled out by a tray take-out device 29 described later, It moves to B. The height of each component tray 5 is also recorded in the storage device, and the height of the component tray 5 when a plurality of components are stacked can be calculated. In the drawing of the housing 25, a single door 28 that is opened over substantially the entire surface is provided on the right side, and a new component tray 5 is carried in. On the left side of the housing 25 in the drawing, there is provided a tray take-out device 29 for taking out the component tray 5 containing electronic components to be mounted from the tray stocker 27 into the component suction area B. On the front side of the tray take-out device 29, a discharge box 31 is provided for collecting and discharging the component tray 5 that has been emptied after the electronic components are taken out.

  As shown in FIGS. 1 and 6, the component transfer device 11 includes a support base 33 attached to a moving table (not shown), and a guide screw supported by the support base 33 in the Z direction perpendicular to the X direction and the Y direction. The head holder device 35 is moved up and down by a servo motor via a head, and the component suction head 37 is detachably attached to the head holder device 35. The component suction head 37 is provided with a suction nozzle 39 for sucking and holding electronic components. Further, as shown in FIG. 6, the head holder device 35 includes a tubular support main body 41 and a suction portion 43 having a flat bottom surface. The support main body 41 is a double-structured tube, and the outer tube is a suction hole 45 as a negative-pressure air flow path to which negative-pressure air is supplied. The suction hole 45 opens on the lower surface of the suction portion 43. As shown in FIG. 5, the component suction head 37 and a later-described tray suction head are selectively mounted by the negative pressure air supplied to the suction hole 45. The inner pipe of the support main body 41 is a supply hole 47 as an air flow passage to which positive pressure air or negative pressure air is supplied. The supply hole 47 opens at the center of the lower surface of the suction portion 43. The supply hole 47 communicates with an air supply device (not shown), and positive pressure air and negative pressure air are switched and supplied by an electromagnetic valve (not shown) controlled by the control device. The supply hole 47 communicates with the suction nozzle 39 of the component suction head 37, and when the component suction head 37 is mounted, a negative pressure is supplied to the supply hole 47 to suck the electronic component. The pneumatic circuit for supplying air to the suction holes 45 and the supply holes 47 is provided with a vacuum breaker (not shown) so that the sucked electronic components can be quickly removed.

  As shown in FIGS. 2, 3, and 4, the tray suction head 49 includes a disk-shaped mounting base 51 that is mounted on the head holder device 35 and a suction portion 55 that includes an ejector 53 at the lower portion. When the mounting sheet 51 is attached to the upper surface of the mounting table 51 and the mounting table 51 is mounted on the head holder device 35, the sealing sheet 57 is pressed against the lower surface of the suction portion 43 of the head holder device 35 and mounted on the mounting table. The upper surface of 51 and the lower surface of the suction part 43 are sealed. A projecting connecting portion 59 extending downward is provided on the lower surface of the mounting base 51. The connecting portion 59 penetrates from the upper surface of the mounting base 51 to the lower end of the connecting portion 59 and communicates with the supply hole 47. Is provided. The mounting base 51 is provided with a piston locking hole for locking a piston portion of a cylinder, which will be described later, and a pair of guide locking holes penetrating from the upper surface to the lower surface of the mounting base 51. These piston locking holes and guide locking holes are provided in parallel with the communication holes 61. An annular groove is engraved on the lower surface of the mounting base 51 so as to surround the connecting portion 59.

  A connecting hole 65 into which the connecting portion 59 is fitted is provided on the upper surface of the suction portion 55, and an annular seal groove to which an annular seal member 67 is attached is provided on the inner wall near the opening of the connecting hole 65. A communication hole 61 of the connection part 59 is opened in the connection hole 65 so that the connection hole 65 and the supply hole 47 communicate with each other. The bottom of the connection hole 65 communicates with the annular air passage 71 of the ejector 53, and a plurality of ejection nozzles 73 that are ejected to the right side in FIG. A communication path 75 communicating with a cylinder device described later is opened in the lower inner wall of the connection hole 65. An annular spring holding groove is provided around the upper surface of the suction portion 55 so as to surround the connecting hole 65, and a spiral spring member 81 is held between the annular groove. The spring member 81 is configured to urge the mounting base 51 and the suction portion 55 in a direction away from each other.

  A cylinder device 77 as a balance device is provided beside the connection hole 65 so that the axial direction is parallel to the connection hole 65. The cylinder device 77 includes a cylinder main body 83 and a piston portion 85, and the cylinder main body 83 is fitted into a cylinder mounting hole 87 provided in parallel with the connection hole 65. A sealing material 89 is provided between the cylinder main body 83 and the cylinder mounting hole 87, and the cylinder main body 83 and the cylinder mounting hole 87 are fixed by a retaining member 91 so as not to be relatively movable. The piston portion 85 is screwed into the piston locking hole 63 of the mounting base 51 by a screw member 93 and protrudes downward from the lower surface of the mounting base 51 and is slidably fitted into the sliding hole 90 of the cylinder body 83. Has been. An annular outer peripheral groove is provided on the outer periphery of the front end of the piston portion 85, and an annular front end seal member 97 is provided in the annular outer peripheral groove to seal between the inner peripheral wall of the cylinder body 83. An opening seal member 99 is provided in the vicinity of the opening of the sliding hole 90 and seals between the outer peripheral wall of the piston portion 85. An airtight chamber 101 is formed by the annular tip seal member 97, the opening seal member 99, the inner peripheral wall of the sliding hole 90, and the outer peripheral wall of the piston portion 85. The airtight chamber 101 is configured such that the communication path 75 is opened so that the airtight chamber 101 and the connection hole 65 communicate with each other. When positive pressure air is supplied to the connecting hole 65, the positive pressure air is also supplied to the airtight chamber 101 that communicates, and the airtight chamber 101 expands to draw the piston portion 8 into the cylinder body 83.

  As shown in FIG. 4, a pair of guide portions 98 are provided on both sides of the connecting hole 65 of the suction portion 55, and guide holes 96 are respectively penetrated in the guide portions 98. A guide shaft 102 having a stopper 100 at the lower end is slidably fitted in the guide hole 96, and the distal end of the guide shaft 102 is screwed into the guide locking hole by a screw member 93. For example, a ball bush 104 is disposed in these guide holes 96, and the guide shaft 102 slides smoothly by the ball bush 104.

  The ejector 53 is disposed below the suction unit 55 and includes a blowing unit 103, a suction chamber 105, and a suction holding unit 107. The blow-out part 103 has a throttle part 109 that accelerates the flow rate of the air that is blown out by opening the jet nozzle 73 on the upstream side, and blows out air from a blow-out port 111 that is further downstream than the throttle part 109. Yes. In the vicinity of the air outlet 111 of the air outlet 103, there is provided a wind shield 113 that restricts the downward air blowing. The suction chamber 105 is on the upstream side of the blowing unit 103, generates a negative pressure by the air flow generated by the jet nozzle 73, and sucks air from the suction holding unit 107 on the opposite side of the blowing unit 103. ing. The suction holding unit 107 has a suction port 115 opened downward, and a suction plate 117 is fixed to the suction port 115 with a bolt. For example, a shock absorbing plate 119 made of a sponge material is attached to the lower surface of the suction plate 117.

  The tray suction head 49 and the component suction head 37 are placed on a mounting table (not shown) disposed beside the tray take-out device 29 when not in use. When necessary, the head holder device 35 moves to the mounting table under the control of the control device, and the necessary heads 37 and 49 are selectively mounted on the head holder device 35 so that they can be used.

  Next, the operation of the electronic component mounting apparatus 1 configured as described above will be described below. First, the substrate S on which electronic components are mounted is carried to a predetermined position by the substrate transfer device 3 controlled by the control device, and is positioned and fixed by a clamp device (not shown) at that position.

  For the electronic components to be mounted, the component tray 5 containing the electronic components necessary for mounting the substrate S is specified by the management data, the tray stocker 27 is moved up and down by the control device, and the necessary electronic components are accommodated. The pallet on which the component tray 5 is placed is positioned at the height of the take-out position. Then, the component tray 5 is pulled out to the component suction area B while being placed on the pallet by the tray take-out device 29. During this time, a component suction head 37 is mounted on the head holder device 35 in advance, and a negative pressure can be supplied to the supply hole 47 of the head holder device 35.

  Next, the moving base and the support base 33 are moved, and the head holder device 35 and the component suction head 37 are moved to the component tray 5 drawn out to the component suction region B, and the necessary electronic components are sucked by the suction nozzle 39. And mounted on the substrate S positioned at the mounting position.

  In this way, electronic components are continuously removed from the component tray 5 and mounted. If it is determined from the electronic component extraction record corresponding to the pocket position of the component tray 5 input as management data that all the electronic components have been extracted and the component tray 5 has become empty, the empty component tray 5 is discharged from the component suction area B.

  In discharging the empty component tray 5, first, the component suction head 37 and the head holder device 35 are moved to the mounting table (not shown), and the vacuum breaker is operated in the suction hole 45 which is a negative pressure flow path. Then, the component suction head 37 is detached from the head holder device 35.

  Next, by moving the head holder device 35 to a mounting table (not shown) on which the tray suction head 49 is placed and supplying negative pressure air to the suction hole 45, the tray suction head 49 is moved to the head holder device 35. Install it.

  Next, the head holder device 35 to which the tray suction head 49 is mounted is moved to the empty component tray 5 placed in the component suction area B. At that time, the tray suction head 49 moves to substantially the center of the component tray 5 to be sucked, and the tray suction head 49 is aligned with the height position of the empty component tray 5 at the uppermost position where a plurality of sheets are stacked. Then, the suction port 115 of the tray suction head 49 is brought into contact with the upper surface of the component tray 5.

  Next, the solenoid valve is switched to supply positive pressure air to the supply hole 47. When the positive pressure air is supplied to the supply hole 47, the positive pressure air is supplied to the connection hole 61 communicating with the supply hole 47, and further, the positive pressure air is supplied to the annular air passage 71. The positive pressure air supplied to the annular air passage 71 is ejected from the ejection nozzle 73 of the ejector 53 toward the ejection port 111 and is sucked from the suction port 115 on the lower surface to suck the empty component tray 5.

  At this time, a force that pushes the connecting portion 59 out of the connecting hole 61 by the positive pressure air acts, and a force that pushes the suction portion 55 downward with respect to the mounting base 51 is generated. On the other hand, positive pressure air is also supplied to the airtight chamber 101 through the communication path 75 to the cylinder device 77 as a balance device. And the force which draws the piston part 85 in the cylinder main body 83 acts, and the force which pulls the suction part 55 upwards with respect to the mounting base 51 is produced, and the pushing-down force is offset. Therefore, the suction part 55 can be brought close to the mounting base 51 with a small force, and the buffer part of the suction part 55 can absorb the variation in thickness due to the plurality of types of component trays 5 and can reliably adsorb it. . Further, since the buffer plate 119 adheres following the shape of the upper surface of the component tray 5, it is more reliably adsorbed.

  Next, the tray suction head 49 is raised while the component tray 5 is sucked. Then, by moving the head holder device 35, the empty component tray 5 is transferred above the discharge box 31 provided on the side of the tray take-out device 29. Then, the suction by the tray suction head 49 is stopped by the operation of the vacuum breaker, and the empty component tray 5 is stored in the discharge box 31.

  If there is an electronic component stored in the component tray 5 without being taken out, the tray take-out device 29 is reversely operated to return it to the location stored at the end of the tray stocker 27. When another component tray 5 is required, similarly, the tray stocker 27 and the tray take-out device 29 are operated, and a new component tray 5 is pulled out to the component suction region B, and the necessary electronic components are sucked. It is adsorbed by the nozzle 39 and mounted on the substrate S.

  In this embodiment, the empty component tray is sucked in the electronic component mounting apparatus. However, the suction head according to claim 1 is not limited to this, and sucks various objects to be sucked. Can do.

  In the present embodiment, the cylinder device is used as the balance device. However, the present invention is not limited to this. The material may be provided between the mounting base and the suction part.

1 is a schematic view of an electronic component mounting apparatus according to the present invention. Sectional drawing with which the tray adsorption | suction head was mounted | worn with the head holder apparatus. Sectional drawing from the front side of a tray adsorption | suction head. Sectional drawing from the side surface side of a tray adsorption | suction head. 1 is a schematic diagram of a pneumatic circuit showing the supply of air. Sectional drawing with which the component adsorption | suction head was mounted | worn with the head holder apparatus. The perspective view of a prior art example. Sectional drawing of a prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting apparatus, 3 ... Board conveyance apparatus, 5 ... Component tray, 9 ... Electronic component supply apparatus, 11 ... Component transfer apparatus, 35 ... Head holder apparatus, 37 ... Component adsorption head, 47 ... Supply hole, 49 DESCRIPTION OF SYMBOLS ... Tray suction head, 51 ... Mounting base, 53 ... Ejector, 55 ... Suction part, 59 ... Connection part, 61 ... Communication hole, 65 ... Connection hole, 73 ... Injection nozzle, 75 ... Communication path, 77 ... Cylinder apparatus, 81 ... Spring member, S ... Substrate.

Claims (4)

In a suction head having a mounting base that is detachably mounted on a head holder device having a supply hole for supplying air, and a suction portion provided with an ejector,
The mounting base is provided with a connecting part provided with a communication hole that is a protruding connection part and communicates with the supply hole;
The suction portion includes a connection hole in which the connection portion is slidably fitted and the communication hole is opened, and the connection hole communicates with an ejection nozzle that supplies positive pressure air to the ejector,
A balance device is provided between the mounting base and the suction part to offset a force acting in a direction to separate the mounting base and the suction part when positive pressure air is supplied. Suction head. A board transfer device that carries in and mounts a board on which electronic components are mounted; and
An electronic component supply device for supplying a component tray in which a large number of pockets for storing electronic components are arranged;
A component suction head for sucking each electronic component stored in each pocket of the component tray supplied by the electronic component supply device, and a component suction head for detachably mounting and sucking the electronic component A component holder for mounting an electronic component sucked by the component suction head on the substrate, the head holder device having a supply hole for supplying negative pressure to the component suction head;
In an electronic component mounting machine including a tray suction head that is detachably attached to the head holder device and sucks and discharges an empty component tray,
The tray suction head has a mounting base that is detachably mounted on the head holder device, and a suction portion provided with an ejector that sucks the component tray at the bottom,
The mounting base is provided with a connecting part provided with a communication hole that is a projecting connection part extending downward and communicated with the supply hole,
The suction part includes a connection hole in which the connection part is slidably fitted and the communication hole is opened, and the connection hole communicates with an ejection nozzle that supplies positive pressure air to the ejector.
An air supply device that selectively supplies negative pressure air or positive pressure air to the supply hole;
An electronic component comprising a balance device between the mounting base and the suction portion for offsetting a force that presses the suction portion downward against the mounting base when positive pressure air is supplied Mounting device.   The balance device according to claim 2, wherein the balance device is a cylinder device provided between the mounting base and the suction portion, and the cylinder device includes a communication path communicating with the connection hole, and a positive pressure is applied to the connection hole. An electronic component mounting apparatus, wherein when air is supplied, a force is generated that cancels a force that presses the suction portion downward.   4. The electronic component mounting apparatus according to claim 2, wherein a spring member is provided between the mounting base and the suction portion, and the mounting base and the suction portion are biased in a separating direction.

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