JP4590934B2 - Inkjet head manufacturing method - Google Patents

Description

  The present invention manufactures an ink jet head having a head chip in which drive walls made of piezoelectric elements and channel portions are alternately arranged, and outlets and inlets of the channel portions are arranged oppositely on the front and rear surfaces, respectively. More particularly, the present invention relates to a method of manufacturing an ink jet head in which an electrode electrically connected to an electrode formed on a driving wall in each channel portion is drawn out on an upper surface or a lower surface of a head chip.

  As a shear mode type ink jet head in which a voltage is applied to a drive wall that divides the channel portion to shear the drive wall to discharge ink in the channel portion, an actuator for discharging ink is piezoelectric. The drive wall and the channel portion made up of elements are alternately arranged in parallel, and the front and rear surfaces of the channel portion are arranged so as to be opposed to each other by a so-called harmonica type head chip. There are known ink jet heads that have a large number of wafers taken from a wafer and have extremely improved productivity.

  Since the channel part of such an ink jet head is a straight type whose size and shape are almost the same in the length direction from the inlet to the outlet, a voltage is applied to the electrodes formed on the drive walls in each channel part. It is necessary to pull out the connection electrode to the outer surface of the head chip.

Conventionally, as described in Patent Document 1, as a method for forming such a connection electrode, after plating a metal for an electrode on the entire surface of a head chip, an unnecessary portion is irradiated with a laser beam such as a YAG laser. There is known a method of pulling out an independent electrode for each channel part to the outer surface of the head chip by using and removing it.
JP 2002-264342 A

  However, in the method described in Patent Document 1, since it is necessary to perform trimming between fine channel portions in order to remove unnecessary portions of plating, it is extremely difficult to work and an expensive laser trimming apparatus. Therefore, there is a problem that the manufacturing cost increases.

  For this reason, on the upper surface or the lower surface of the head chip on which the electrode is formed on the drive wall of each channel portion, a connection electrode is selectively formed in advance so as to correspond to each channel portion by plating or the like. By applying the electrode forming metal from the front surface or the rear surface of the head chip multiple times at different angles by vapor deposition or sputtering, the electrodes in each channel portion and the electrodes on the upper or lower surface of the head chip are electrically connected. Although a method of connecting is conceivable, it is difficult to align the electrode in each channel portion with the electrode on the upper surface or the lower surface of the head chip, and the step of forming an electrode for connection on the upper surface or the lower surface of the head chip; Since this connection electrode requires a step of electrically connecting the electrodes in each channel portion, there is a problem that man-hours increase.

  Therefore, the present invention provides a simple method without significantly increasing the number of man-hours on the upper or lower surface of a so-called harmonica type head chip, which is electrically connected to the electrode formed on the drive wall in each channel portion. It is an object of the present invention to provide a method for manufacturing an inkjet head that can be easily pulled out.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

The invention described in claim 1 has an upper substrate and a lower substrate, and drive walls and channel portions made of piezoelectric elements are alternately arranged side by side, and the outlet and the inlet of the channel portion are opposed to the front and rear surfaces, respectively. A method of manufacturing an inkjet head having head chips arranged in a shape, wherein the channel portion and the drive wall are formed by processing a groove from the piezoelectric element side in the lower substrate including a piezoelectric element. When,
Forming a drive electrode on the entire inner surface of the groove including the drive wall of the lower substrate in which the groove is processed ;
Attaching the upper substrate to an upper surface of the drive wall of the lower substrate on which the drive electrode is formed, and producing the head chip;
On the outer surface of the lower substrate of the head chip, a spacer having approximately the same width and the same number of recesses as the channel portions arranged in parallel with the channel portions is overlapped so that the recesses are on the head chip side. Combining the steps,
By masking a region where the metal film is not formed on the front surface or the rear surface of each channel portion of the head chip, the metal film is selectively formed at least in an oblique direction by vapor deposition or sputtering, thereby forming the bottom of the groove. over from the side on the outer surface of the lower substrate in the recess of the spacer and the front or rear surface of the head chip, and forming the drive electrodes and the connecting electrodes electrically connected within the respective channel portions It is a manufacturing method of the inkjet head characterized by having.

The invention described in claim 2 has an upper substrate and a lower substrate, and drive walls and channel portions made of piezoelectric elements are alternately arranged side by side, and an outlet and an inlet of the channel portion are opposed to the front surface and the rear surface, respectively. A method of manufacturing an inkjet head having a head chip arranged in a shape,
Forming the channel portion and the drive wall by processing a groove from the piezoelectric element side in the lower substrate including the piezoelectric element;
Forming a drive electrode on the entire inner surface of the groove including the drive wall of the lower substrate in which the groove is processed ;
Attaching the upper substrate to an upper surface of the drive wall of the lower substrate on which the drive electrode is formed, and producing the head chip;
On the outer surface of the lower substrate of the head chip, a spacer having approximately the same width and the same number of recesses as the channel portions arranged in parallel with the channel portions is overlapped so that the recesses are on the head chip side. Combining the steps,
After adhering a photosensitive dry film in which openings are selectively formed for masking a region where a metal film is not formed on the front surface or the rear surface of each channel portion of the head chip, vapor deposition is performed at least from an oblique direction. Alternatively, by selectively forming a metal film by a sputtering method, each channel extends from the bottom side of the groove to the front or rear surface of the head chip and the outer surface of the lower substrate in the recess of the spacer. And a step of forming a connection electrode that is electrically connected to the drive electrode in the section.

According to a third aspect of the present invention, the connection electrode is formed on the drive wall of the drive electrodes in the channel portion by forming the connection electrode wider than the width of each channel portion by the metal film. 3. The method of manufacturing an ink jet head according to claim 1, wherein the ink jet head is formed so as to be connected to a portion on the lower substrate side .

A fourth aspect of the present invention is the method of manufacturing an ink jet head according to the first or second aspect, wherein the connecting electrode is formed narrower than the channel portions by the metal film.

According to a fifth aspect of the invention, the drive electrodes has at least containing metal Ni, the connecting electrodes, according to claim 1-4 for, characterized in that it comprises at least comprising metal Al This is a method for manufacturing the inkjet head.

According to a sixth aspect of the invention, the drive electrodes is a laminated structure consisting of two or more metal layers, to claim 1-4 for, characterized in that the top layer is at least including metal Au It is a manufacturing method of the described inkjet head.

  The invention according to claim 7 is a process of forming one head chip having two rows of channel portions by superimposing the head chips after forming the drive electrodes each having one row of channel portions in two stages. It is a manufacturing method of the inkjet head in any one of Claims 1-6 characterized by the above-mentioned.

  According to the present invention, an electrode that is electrically connected to an electrode formed on a drive wall in each channel portion on the upper surface or the lower surface of a so-called harmonica type head chip without significantly increasing the man-hour for electrode formation. Moreover, it is not necessary to remove the metal finely using a laser, and it can be easily drawn out by a simple method.

  Hereinafter, an example of a method for manufacturing an inkjet head according to the present invention will be described with reference to the drawings.

  In this specification, the surface on the side where ink is ejected from the head chip 1 is referred to as “front surface”, and the opposite surface is referred to as “rear surface”. In addition, the outer surfaces positioned above and below the channel portions arranged in parallel in the head chip 1 are referred to as “upper surface” and “lower surface”, respectively. In the present specification, the upper surface of the illustrated head chip 1 is defined as an upper surface, and the lower surface is defined as a lower surface.

  First, as shown in FIG. 1, a piezoelectric element 12 in which two piezoelectric material substrates 12a and 12b whose polarization directions (indicated by arrows) are opposite to each other is laminated on a lower substrate 11 made of a ceramic substrate. A laminated body is formed.

  As a piezoelectric material used for such a piezoelectric element 12, a known piezoelectric material that deforms when a voltage is applied can be used, and lead zirconate titanate (PZT) is particularly preferable.

  Although not shown, the lower substrate 11 and the piezoelectric material substrate 12b may be the same. In this case, by using the piezoelectric material substrate 12b having a thickness corresponding to the lower substrate 11, the polarization direction What is necessary is just to comprise a laminated body by the two piezoelectric material board | substrates which varied.

  Next, as shown in FIG. 2, a resist 100 is coated on the upper surface of the laminate by a spin coating method.

  Then, as shown in FIG. 3, grooves 151, 151... Parallel to each other are ground from the side of the piezoelectric element 12 using a disc-shaped grindstone (dicing blade). This groove 151 is a straight groove having a substantially uniform depth along its length direction, and the cross-sectional shape of the groove 151 does not change substantially along the length direction. Although the number of the grooves 151 is four in the illustrated example, the number is not limited. When the number of grooves 151 to be processed is 258, for example, 257 driving walls 14 and 256 channel grooves 151 and one extra groove 151 on each side are formed.

  Thereafter, a metal film serving as a drive electrode for applying a voltage to the drive wall 14 is formed in each groove 151. As the metal for the metal film, there are Ni (nickel), Co (cobalt), Cu (copper), Al (aluminum), etc., but Ni and Cu are preferable, and particularly preferably at low cost and excellent in corrosion resistance. A metal containing at least Ni is used.

  Examples of the method for forming the metal film include a vapor deposition method, a sputtering method, a plating method, a CVD (chemical vapor reaction method), and the like. A method using a plating method is preferable, and an electroless plating method is particularly preferable. By electroless plating, a uniform and pinhole-free metal film can be formed. Also, electroless plating can easily form a metal film containing at least Ni. In particular, after electroless plating, the metal film is immersed in cleaning water or alkali by a cleaning process, a resist removal process, or the like, but Ni is also excellent in corrosion resistance against these.

  In the formation of the metal film by electroless plating, Ni-P plating or Ni-B plating may be used alone, or Ni-P and Ni-B may be stacked to form a laminated structure. Further, in the case of a laminated structure, Ni—P plating or Ni—P plating may be used as a lower layer, and Au (gold) may be formed as an uppermost layer by electrolytic plating, electroless plating, or vapor deposition. In this case, since the surface of the metal film is Au, the corrosion resistance is further improved, oxidation of the surface of the metal film can be prevented, and electrical connection with a connection electrode described later can be stabilized. Also, the metal film can be formed at a lower cost than when the entire metal film is made of Au.

  The thickness of the metal film is preferably in the range of 0.5 to 5 μm.

  Next, by removing the resist with a remover, drive electrodes 16 made of a metal film are formed on the inner surface of each groove 151, that is, both side surfaces of the drive wall 14 and the bottom surface of the groove 151. The state shown in FIG. 4 is obtained in which no electrode is formed. Since each drive wall 14 is formed by piezoelectric elements 12 having different polarization directions, when a voltage is applied from both drive electrodes 16 sandwiching this drive wall 14, each drive wall 14 is sheared into a dogleg shape. Deform. Due to the shear deformation of the drive wall 14, a pressure for ejection is applied to ink in a channel portion 15 described later constituted by each groove 151.

  Here, an example in which a liquid resist coated by a spin coating method is used as a method of forming the drive electrode 16 is shown, but the present invention is not limited to this, and other methods include forming a liquid resist. Instead, a dry film resist is used, and after the Al layer is formed on the entire surface by vacuum deposition, a similar drive electrode 16 is patterned by a lift-off method in which the Al layer on the dry film resist is removed together with the dry film resist with a solvent. Can do. At this time, it is desirable to continuously deposit Au on the Al layer.

  After the drive electrode 16 is formed, an upper substrate 13 made of a separately prepared ceramic substrate is fixed to the upper surface side of each drive wall 14 using an epoxy adhesive. FIG. 5 shows a state after the upper substrate 13 is fixed. As a result, a head substrate a in which the drive walls 14 and the channel portions 15 formed by the grooves 151 are alternately arranged between the upper substrate 13 and the lower substrate 11 is formed.

  Next, as shown in FIG. 5, the head substrate a is cut along cut lines C1, C2, C3,... Substantially orthogonal to the length direction of the channel portion 15, and from one head substrate a. A plurality of head chips 1, 1, 1,.

  In order to form electrodes that are electrically connected to the drive electrodes 16 on the outer surface of the head chip 1 thus obtained, first, as shown in FIG. The spacers 200 are overlapped. Here, a case where the head chip 1 is superimposed on the lower substrate 11 side is shown. This is because of the connection between the drive electrode 16 formed in the channel portion 15 and the portion formed on the lower substrate 11 side (the bottom side of the groove 151 shown in FIG. 4) when the connection electrode described later is formed. This is for electrically connecting the electrodes. As shown in the figure, when the drive electrode 16 is also formed on the lower substrate 11 side in the channel portion 15, the connection electrode electrically connected to the drive electrode 16 is taken out. This can be done simply by pulling it out from the portion formed on the 11th side (the bottom side of the groove 151 shown in FIG. 4) through the front or rear end face of the lower substrate 11.

  Note that the head chip 1 shown in the following shows the lower substrate 11 side on the upper side in the drawing for convenience of explanation.

  The spacer 200 is formed of an appropriate material such as ceramic or plastic so as to have substantially the same width as the head chip 1 and substantially the same length as the channel portion 15 of the head chip 1, and the channel of the head chip 1 is formed on one surface thereof. The same number of recesses 201 having the same width and the same pitch as the portions 15 are formed in parallel with the channel portions 15. Accordingly, when the surface on which the concave portion 201 is formed is arranged so as to be in contact with the lower substrate 11 of the head chip 1 and further the front surface or the rear surface side of the head chip 1 is aligned and overlapped with each other, the head chip 1 The positions of the channel portions 15 and the concave portions 201 of the spacers 200 are arranged so as to coincide vertically. Here, the case where the front side of the head chip 1 is aligned is shown.

  Next, a metal film for forming a connection electrode is selectively formed by using the spacer 200 from the front surface of the superposed head chip 1 and the spacer 200. In order to selectively form the metal film for forming the connection electrode, a vapor deposition method can be used. As this metal, the same metal as the metal for forming the drive electrode 16 can be used, but Al, Au, etc. are preferable from the viewpoint of easiness of vapor deposition.

  When Al is used, Al alone or an Al alloy may be used. In addition, in order to obtain a connection electrode with low cost and excellent corrosion resistance, a layer made of Al or an Al alloy is used as a lower layer, and Au is used as the uppermost layer. It is preferable to have a laminated structure formed.

  When the metal film for forming the connection electrode is selectively deposited, as shown in FIG. 7, a photosensitive dry film 300 is formed on the front surface of the superposed head chip 1 and the spacer 200. It is preferable to mask a region that is attached and does not form a metal film. The photosensitive dry film 300 has a recess 201 of the spacer 200 corresponding to the channel portion 15 from a region to which the deposited metal is applied, specifically, from the periphery including the opening portion of the channel portion 15 on the front surface of the head chip 1. An opening 301 corresponding to a region extending from the front surface to the periphery thereof is formed, and each opening 301 is attached to correspond to the channel portion 15 of the head chip 1 and the concave portion 201 of the spacer 200 corresponding thereto. To wear. The opening 301 was produced by a known photosensitive dry film exposure / development process.

  The metal vapor deposition for forming the connection electrode is performed from the photosensitive dry film 300 side. At this time, as shown in FIG. 8, an oblique direction A inclined by an angle θ toward the upper substrate 13 side of the head chip 1 with respect to a direction perpendicular to the front surface of the head chip 1 and a direction perpendicular to the front surface of the head chip 1. On the other hand, the measurement is performed from an oblique direction B inclined by an angle θ on the spacer 200 side. When the connection electrode has a laminated structure, the above vapor deposition operation may be repeated as many times as the number of laminations.

  When metal is deposited from the oblique direction A shown in FIG. 8, the metal film 17 a is formed on the front surface of the lower substrate 11 through the opening 301 of the photosensitive dry film 300, and the deposited metal is obliquely formed in the channel portion 15. As a result, a metal film 17b is also formed in the vicinity of the front surface side of the drive electrode 16 on the inner surface of the lower substrate 11, and then when metal is deposited from the oblique direction B shown in FIG. Through 301, the metal film 18a is formed on the surface of the metal film 17a, and the vapor deposition metal obliquely enters the recess 201 of the spacer 200, so that the vicinity of the front surface on the upper surface of the lower substrate 11 facing the recess 201 Also, the metal film 18b is formed.

  The order of depositing the metal may be performed from the diagonal direction A next to the diagonal direction B, contrary to the above.

  After that, when the photosensitive dry film 300 is peeled off and the spacer 200 is removed from the head chip 1, as shown in FIG. 9, the drive electrode 16 in each channel portion 15 extends over the front surface and the upper surface of the head chip 1. A connection electrode 19 made of the metal films 17a, 17b, 18a and 18b to be electrically connected is formed. Since the connection electrode 19 here is formed by an opening 301 that is slightly wider than the width of the channel portion 15, a portion of the drive electrode 16 in the channel portion 15 that is formed in close contact with the drive wall 14. Since these portions are connected to each other on the lower substrate 11 side formed so as to connect these portions, the electrical connection with the drive electrode 16 is ensured.

  As described above, the connection electrode 19 does not require the metal film to be finely removed using a laser as in the prior art, and the connection electrode needs to be formed in advance on the upper surface or the lower surface of the head chip 1. In addition, since it can be formed only by devising the metal deposition direction, it is possible to easily draw out the electrode from each channel portion 15 by a simple method without increasing the man-hours for forming the electrode. .

  As a method for forming a metal film for forming the connection electrode 19, sputtering can be used in addition to vapor deposition. In the case of sputtering, metal film forming atoms are incident from random directions including oblique directions, so it is not always necessary to divide the angle into two times as in the case of vapor deposition. That is, when it is desired to increase the length of the connection electrode 19 on the upper surface of the head chip 1, it is preferable to perform sputtering by changing the angle as in the case of vapor deposition.

  The length of the connection electrode 19 on the upper surface of the head chip 1 is 50 μm to 1000 μm in consideration of connection workability when electrically connecting to the drive circuit using an FPC (flexible printed circuit board) not shown. It is preferable that the depth of the concave portion 201 of the spacer 200 and the angle θ at the time of vapor deposition from an oblique direction are appropriately adjusted so that the length of the connection electrode 19 on the upper surface of the head chip 1 falls within the above range. Good.

  For example, when the depth of the recess 201 of the spacer 200 is 200 μm and the angle θ during vapor deposition is 45 °, the length of the connection electrode 19 on the upper surface of the head chip 1 is 200 μm, and FPC or the like is used. Electrical connection with the drive circuit can be made using the connection electrode 19.

  In addition, by overlapping a plurality of the objects in which the spacers 200 are overlapped as described above for each head chip 1, connection electrodes are simultaneously formed on the plurality of head chips 1 from the oblique directions A and B at the same time. A metal for this purpose may be deposited.

  As shown in FIG. 10, the nozzle plate 2 in which the nozzle holes 21 are formed at the positions corresponding to the respective channel portions 15 is bonded to the head chip 1 in which the connection electrodes 19 are formed in this manner. To do. Further, an ink manifold 3 constituting an ink supply chamber for distributing ink to each channel portion 15 is joined to the rear surface of the head chip 1. Thereafter, although not shown, the FPC is bonded to the connection electrode 19 using an anisotropic conductive film, thereby making electrical connection with the drive circuit via the FPC.

  FIG. 11 shows another embodiment of the manufacturing method according to the present invention. The figure is a view of the head chip 1 and the spacer 200 that are overlapped when the connection electrode 19 is formed as seen from the front. The same reference numerals as those in FIG. 7 denote the same components, and detailed description thereof will be omitted.

  Here, as shown in FIGS. 7 and 8, metal deposition from an oblique direction is performed by sticking a photosensitive dry film 400 on the front surface of the superposed head chip 1 and the spacer 200. The opening 401 formed in the photosensitive dry film 400 corresponding to the region where the vapor deposition metal is applied is formed narrower than the channel portion 15. Thus, when metal is deposited from the oblique directions A and B in the same manner as in FIG. 8, the connection electrode 19 narrower than the channel portion 15 can be formed as shown in FIG. 12.

  This is because the drive electrode 16 in the channel portion 15 can be electrically connected to the drive electrode 16 simply by removing the connection electrode 19 from the portion formed on the lower substrate 11 side (bottom side of the groove 151). Because. In this way, since the connecting electrode 19 can be narrower than the channel portion 15, the risk of a short circuit between adjacent connecting electrodes 19 can be reduced, and the capacitance of the electrode can be reduced. The effect that can be reduced can also be obtained.

  FIG. 13 shows an aspect of manufacturing an ink jet head having two rows of channel portions 15, and shows a state in which it is overlapped with a spacer when the connection electrode 19 is formed. Since the same reference numerals as those in FIG. 6 indicate the same configurations, detailed description thereof will be omitted.

  Two head substrates a shown in FIG. 5 are produced, and are superposed and fixed so that the upper substrates 13 are in contact with each other. Then, by cutting along the cut lines C1, C2, C3..., As in FIG. 5, there are two rows of channel portions 15 in a state where the head chips 1 are stacked as shown in FIG. Two head chips 1 ′ are obtained. Next, each spacer 200 is overlaid on the lower substrate 11 side of the head chip 1 ′. Thus, as described above, the connection electrode 19 connected to each drive electrode 16 is formed on the lower substrate 11 side (the bottom side of the groove 151) of the drive electrode 16 in each channel portion 15. And can be taken out so as to be electrically connected.

  Thereafter, when metal is deposited on the head chip 1 'from the oblique directions A and B in the same manner as in FIG. 8, as shown in FIG. A connection electrode 19 can be formed. Here, as in FIGS. 11 and 12, the connection electrode 19 narrower than the channel portion 15 was formed. The FPC for electrical connection with the drive circuit may be electrically connected to each connection electrode 19 on the side opposite to the fixing surface of the upper substrates 13.

  In this aspect, the two upper substrates 13 to be fixed to each other may share one substrate up and down.

The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head The figure which shows 1 process of the manufacturing method of an inkjet head A perspective view of a head chip on which connection electrodes are formed Overall perspective view of inkjet head The figure which shows 1 process of the other aspect of the manufacturing method of an inkjet head The perspective view of the head chip in which the electrode for connection concerning other modes was formed The figure which shows 1 process of the further another aspect of the manufacturing method of an inkjet head. Furthermore, the perspective view of the head chip in which the electrode for connection concerning another aspect was formed

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1 ': Head chip 11: Lower board | substrate 12: Piezoelectric element 13: Upper board | substrate 14: Drive wall 15: Channel part 16: Drive electrode 17a, 17b: Metal film 18a, 18b: Metal film 19: Connection electrode 2: Nozzle plate 21: Nozzle hole 3: Ink manifold 200: Spacer 201: Recess

Claims (7)

A head chip having an upper substrate and a lower substrate, in which drive walls made of piezoelectric elements and channel portions are alternately arranged, and outlets and inlets of the channel portions are arranged oppositely on the front and rear surfaces, respectively. A method of manufacturing an inkjet head having
Forming the channel portion and the drive wall by processing a groove from the piezoelectric element side in the lower substrate including the piezoelectric element;
Forming a drive electrode on the entire inner surface of the groove including the drive wall of the lower substrate in which the groove is processed ;
Attaching the upper substrate to an upper surface of the drive wall of the lower substrate on which the drive electrode is formed, and producing the head chip;
On the outer surface of the lower substrate of the head chip, a spacer having approximately the same width and the same number of recesses as the channel portions arranged in parallel with the channel portions is overlapped so that the recesses are on the head chip side. Combining the steps,
By masking a region where the metal film is not formed on the front surface or the rear surface of each channel portion of the head chip, the metal film is selectively formed at least in an oblique direction by vapor deposition or sputtering, thereby forming the bottom of the groove. over from the side on the outer surface of the lower substrate in the recess of the spacer and the front or rear surface of the head chip, and forming the drive electrodes and the connecting electrodes electrically connected within the respective channel portions A method of manufacturing an ink jet head, comprising: A head chip having an upper substrate and a lower substrate, in which drive walls made of piezoelectric elements and channel portions are alternately arranged, and outlets and inlets of the channel portions are arranged oppositely on the front and rear surfaces, respectively. A method of manufacturing an inkjet head having
Forming the channel portion and the drive wall by processing a groove from the piezoelectric element side in the lower substrate including the piezoelectric element;
Forming a drive electrode on the entire inner surface of the groove including the drive wall of the lower substrate in which the groove is processed ;
Attaching the upper substrate to an upper surface of the drive wall of the lower substrate on which the drive electrode is formed, and producing the head chip;
On the outer surface of the lower substrate of the head chip, a spacer having approximately the same width and the same number of recesses as the channel portions arranged in parallel with the channel portions is overlapped so that the recesses are on the head chip side. Combining the steps,
After adhering a photosensitive dry film in which openings are selectively formed for masking a region where a metal film is not formed on the front surface or the rear surface of each channel portion of the head chip, vapor deposition is performed at least from an oblique direction. Alternatively, by selectively forming a metal film by a sputtering method, each channel extends from the bottom side of the groove to the front or rear surface of the head chip and the outer surface of the lower substrate in the recess of the spacer. Forming a connection electrode that is electrically connected to the drive electrode in the section. The connection electrode is formed wider than the width of each channel portion by the metal film, so that the portion of the drive electrode in the channel portion formed on the drive wall and the lower substrate side 3. The method of manufacturing an ink-jet head according to claim 1, wherein the ink-jet head is formed so as to be connected to a portion . The connecting electrode, The method according to claim 1 or 2 ink jet head according to and forming a narrower shape than the respective channel portion by the metal film.   5. The method of manufacturing an ink jet head according to claim 1, wherein the drive electrode includes a metal containing at least Ni, and the connection electrode includes a metal containing at least Al.   5. The method of manufacturing an ink jet head according to claim 1, wherein the drive electrode has a laminated structure composed of two or more kinds of metal layers, and the uppermost layer is a metal containing at least Au.   A step of forming one head chip having two rows of channel portions by superimposing the head chips after forming the drive electrodes each having one row of channel portions in two stages is provided. Item 7. A method for producing an inkjet head according to any one of Items 1 to 6.

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