JP4588506B2 - Coating liquid coating apparatus and coating method - Google Patents

Coating liquid coating apparatus and coating method Download PDF

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JP4588506B2
JP4588506B2 JP2005087705A JP2005087705A JP4588506B2 JP 4588506 B2 JP4588506 B2 JP 4588506B2 JP 2005087705 A JP2005087705 A JP 2005087705A JP 2005087705 A JP2005087705 A JP 2005087705A JP 4588506 B2 JP4588506 B2 JP 4588506B2
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coating
box
pedestal
coating liquid
substrate
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JP2006263638A (en
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要司 岩本
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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Description

本発明は、塗布液の塗布装置および塗布方法に関するものである。   The present invention relates to a coating liquid coating apparatus and a coating method.

表示装置や半導体基板等の基板は、表面に傷のような微細な欠陥や段差等があると特性を悪化させるおそれがあるため、表面に塗布液を塗布して欠陥や段差等を埋め、表面を平滑化している場合がある。   Substrates such as display devices and semiconductor substrates may deteriorate their characteristics if there are fine defects such as scratches on the surface, so that the surface is coated with a coating liquid to fill in the defects and steps. May be smoothed.

ここで、塗布液を塗布する際は、微細な欠陥の内部に塗布液が浸透するようにするため、塗布装置を減圧状態にする場合があり、以下のようなものが知られている。
(特許文献1)。
特開平6−232038号公報
Here, when applying the coating liquid, the coating apparatus may be in a reduced pressure state in order to allow the coating liquid to penetrate into fine defects, and the following are known.
(Patent Document 1).
JP-A-6-232038

しかしながら、このような塗布装置では、減圧下で塗布液の成分の一部が蒸発してしまい、塗布液が変質してしまうという問題があった。   However, such a coating apparatus has a problem that a part of the components of the coating solution evaporates under reduced pressure, and the coating solution is altered.

本発明は、このような問題に鑑みてなされたもので、その目的は減圧下でも塗布液が変質しない塗布装置を提供することにある。   The present invention has been made in view of such problems, and an object of the present invention is to provide a coating apparatus in which the coating solution does not change even under reduced pressure.

前述した目的を達成するために、第1の発明は、基材を載置する台座と、前記台座と密着可能に設けられる箱体と、前記箱体と前記台座に載置された前記基材との間に設けられる支柱と、前記台座と前記箱体の間の空間を減圧する減圧装置と、前記空間に塗布液を供給する供給装置と、を具備し、前記支柱は、前記箱体の上部裏面に設けられ、端部が前記台座に載置された前記基材に接するものであり、前記箱体内部を減圧しつつ、前記供給装置から前記塗布液が、前記空間全体に供給されることを特徴とする塗布液の塗布装置である。 In order to achieve the above-described object, the first invention includes a pedestal on which a base material is placed, a box provided so as to be in close contact with the pedestal, and the base material placed on the box and the pedestal. A support provided between the base and the box, and a supply device for supplying a coating solution to the space . provided in the upper rear surface, which is in contact with the substrate end portion is placed on the pedestal, while vacuum the box body portion, the coating liquid from the supply device is supplied to the entire said space This is a coating liquid coating apparatus.

また、第2の発明は、基材を載置する台座と、前記台座と密着可能に設けられる箱体と、前記箱体と前記台座に載置された前記基材との間に設けられる支柱を具備し、前記支柱は、前記箱体の上部裏面に設けられ、端部が前記基材に接するものである塗布装置を用い、前記台座に基材を載置する工程と、前記箱体を、前記基材を覆い、前記支柱の端部を前記基材上に接触させつつ、前記台座に載置する工程と、前記台座と前記箱体の間の空間を減圧する工程と、前記減圧状態で、前記空間全体に塗布液を供給する工程と、を具備することを特徴とする塗布液の塗布方法である。 Moreover, 2nd invention is a support | pillar provided between the base which mounts the base which mounts a base material, the box provided so that it can contact | adhere with the base, and the base material mounted on the box and the base The column is provided on the upper back surface of the box body, and the step of placing the base material on the pedestal using a coating apparatus whose end is in contact with the base material, and the box body A step of covering the base material and placing an end of the support on the base material while contacting the base material, a step of reducing the space between the base and the box, and the reduced pressure state And a step of supplying the coating liquid to the entire space .

本発明では、基材を載置する台座と、台座と密着可能に設けられる箱体とを備えており、塗布の際は、箱体と台座とで構成される空間全体に塗布液を供給する。   In the present invention, a pedestal on which the substrate is placed and a box provided so as to be in close contact with the pedestal are provided, and the coating liquid is supplied to the entire space formed by the box and the pedestal during application. .

本発明によれば、塗布の際は、箱体と台座とで構成される空間全体に塗布液を供給するため、減圧下でも塗布液の蒸発を防ぐことができる。   According to the present invention, during application, the application liquid is supplied to the entire space formed by the box and the pedestal, so that evaporation of the application liquid can be prevented even under reduced pressure.

以下、図面に基づいて本発明に好適な実施形態を詳細に説明する。図1は、本実施形態に係る基板1を示す断面図である。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings. FIG. 1 is a cross-sectional view showing a substrate 1 according to the present embodiment.

基材としての基板1は、ガラス基板3を有し、ガラス基板3上には電極5a、5b、5c、5dが設けられている。
ガラス基板3および電極5a、5b、5c、5d上には機能層7が設けられている。
A substrate 1 as a base material has a glass substrate 3, and electrodes 5 a, 5 b, 5 c, and 5 d are provided on the glass substrate 3.
A functional layer 7 is provided on the glass substrate 3 and the electrodes 5a, 5b, 5c, and 5d.

機能層7上には平滑化層として塗布液9が塗布されており、機能層7上の欠陥10を埋めている。   A coating liquid 9 is applied as a smoothing layer on the functional layer 7 to fill the defects 10 on the functional layer 7.

次に、塗布液9を塗布する塗布装置11の構造について説明する。
図2は塗布装置11の構造を示す斜視図であって、図3は図2のA−A断面図である。また、図4は図3における箱体15のB方向矢視図である。
Next, the structure of the coating apparatus 11 that applies the coating liquid 9 will be described.
2 is a perspective view showing the structure of the coating apparatus 11, and FIG. 3 is a cross-sectional view taken along the line AA of FIG. 4 is a view in the direction of arrow B of the box 15 in FIG.

図2および図3に示すように、塗布装置11は板状の台座13を有し、台座13上には箱状の箱体15が設けられている。
台座13は図3のC方向に回転可能である。
台座13の材質は例えばフッ素樹脂やアルミニウム等である。
アルミニウムを用いる場合、表面に陽極酸化処理を行ってもよく、また、表面にフッ素樹脂をコーティングしてもよい。あるいは、陽極酸化処理とフッ素樹脂のコーティングの両方を行ってもよい。
As shown in FIGS. 2 and 3, the coating device 11 has a plate-like pedestal 13, and a box-like box 15 is provided on the pedestal 13.
The pedestal 13 is rotatable in the direction C in FIG.
The material of the base 13 is, for example, a fluororesin or aluminum.
When aluminum is used, the surface may be anodized, or the surface may be coated with a fluororesin. Or you may perform both an anodizing process and the coating of a fluororesin.

箱体15の材質はフッ素樹脂、アルミニウム、ステンレス等である。
アルミニウムを用いる場合、表面に陽極酸化処理を行ってもよく、また、表面にフッ素樹脂をコーティングしてもよい。あるいは、陽極酸化処理とフッ素樹脂のコーティングの両方を行ってもよい。
ステンレスを用いる場合、表面にフッ素樹脂をコーティングしてもよい。
The material of the box 15 is fluororesin, aluminum, stainless steel or the like.
When aluminum is used, the surface may be anodized, or the surface may be coated with a fluororesin. Or you may perform both an anodizing process and the coating of a fluororesin.
When stainless steel is used, the surface may be coated with a fluororesin.

箱体15は上部17a、側部17b、底部17cからなり、底部17cには溝19が設けられている。
溝19にはシール部としてOリング21が設けられており、台座13と箱体15とは、Oリング21によって密着している。
Oリング21の材質はゴム等である。
The box 15 includes an upper portion 17a, a side portion 17b, and a bottom portion 17c, and a groove 19 is provided in the bottom portion 17c.
The groove 19 is provided with an O-ring 21 as a seal portion, and the pedestal 13 and the box 15 are in close contact with each other by the O-ring 21.
The material of the O-ring 21 is rubber or the like.

箱体15の上部17aには塗布液供給装置23が設けられており、塗布液供給装置23内には塗布液9が貯蔵されている。
また塗布液供給装置23にはバルブ23aが設けられている。
上部17aにはチューブ27を介して真空ポンプ29が設けられている。
チューブ27には、バルブ27aが設けられている
さらに、図4に示すように、上部17aの裏面には支柱31a、31b、31c、31d、31e、31f、31g、31h、31iが設けられている。
A coating liquid supply device 23 is provided on the upper portion 17 a of the box 15, and the coating liquid 9 is stored in the coating liquid supply device 23.
The coating liquid supply device 23 is provided with a valve 23a.
A vacuum pump 29 is provided on the upper portion 17 a via a tube 27.
The tube 27 is provided with a valve 27a. Further, as shown in FIG. 4, support posts 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h, and 31i are provided on the back surface of the upper portion 17a. .

塗布液供給装置23は台座13と箱体15の内部に塗布液を供給する。
バルブ23aは、塗布液9の供給の際の流量を調節する。
真空ポンプ29は、台座13と箱体15の内部を減圧する。
バルブ27aは減圧の際の圧力を調整する。
The coating liquid supply device 23 supplies the coating liquid to the inside of the base 13 and the box 15.
The valve 23 a adjusts the flow rate when supplying the coating liquid 9.
The vacuum pump 29 depressurizes the inside of the base 13 and the box 15.
The valve 27a adjusts the pressure during decompression.

支柱31a、31b、31c、31d、31e、31f、31g、31h、31iは、台座13と箱体15の内部を減圧した際に、圧力で箱体15が変形し、基板1と接触することを防ぐ。
支柱を設けない場合、圧力で箱体15と基板1が接触しないようにするために、箱体の高さをより高くしなければならず、箱体15が大型化し、材料の無駄が発生するおそれがある。
特に基板1が大きい場合は箱体15の変形量も大きくなるため、支柱を設ける必要がある。
The struts 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h, and 31i indicate that when the pressure inside the pedestal 13 and the box body 15 is reduced, the box body 15 is deformed by pressure and contacts the substrate 1. prevent.
In the case where no support is provided, the height of the box must be increased in order to prevent the box 15 and the substrate 1 from coming into contact with each other due to pressure, and the box 15 becomes larger and wastes material. There is a fear.
In particular, when the substrate 1 is large, the amount of deformation of the box 15 also increases, and thus it is necessary to provide a support.

なお、支柱31a、31b、31c、31d、31e、31f、31g、31h、31iは、箱体15を台座13上に載置する際に、基板1上において、コーティング後に基板1の性能に影響しない位置に接触するようにする。   The columns 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h, and 31i do not affect the performance of the substrate 1 after coating on the substrate 1 when the box 15 is placed on the pedestal 13. Make contact with the position.

接触する位置としては、例えば基板1が配線基板であれば配線外であり、基板1がディスプレイであれば画素外に接触するようにする。
また、支柱31a、31b、31c、31d、31e、31f、31g、31h、31iの配置間隔は例えば3〜5cm程度である。
As the contact position, for example, if the substrate 1 is a wiring substrate, it is out of the wiring, and if the substrate 1 is a display, it is in contact with the outside of the pixel.
Moreover, the arrangement | positioning space | interval of support | pillar 31a, 31b, 31c, 31d, 31e, 31f, 31g, 31h, 31i is about 3-5 cm, for example.

次に、塗布装置11を用いて基板1に塗布液9を塗布する際の手順について説明する。
図5〜図10は基板1に塗布液9を塗布する際の手順を示す図である。
Next, a procedure for applying the coating liquid 9 to the substrate 1 using the coating apparatus 11 will be described.
5-10 is a figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. FIG.

まず、図5に示すように基板1を台座13上に載置する。
次に、箱体15を図5のD方向に移動して、基板1を覆うようにして台座13上に載置する。
First, the substrate 1 is placed on the pedestal 13 as shown in FIG.
Next, the box 15 is moved in the direction D in FIG. 5 and placed on the base 13 so as to cover the substrate 1.

次に図6に示すようにバルブ27aを開放した状態で真空ポンプ29を用いて、台座13と箱体15の間の空間の空気を図6のE方向に吸引し、空間を減圧する。減圧が完了するとバルブ27aを閉鎖する。
次に、図7に示すように、塗布液供給装置23のバルブ23aを開放し、塗布液9を台座13と箱体15の間の空間に供給する(図6のF方向)。
このように、減圧状態で塗布液9を供給することにより、欠陥10の内部まで塗布液9を浸透させることができる。
Next, as shown in FIG. 6, the air in the space between the pedestal 13 and the box 15 is sucked in the direction E of FIG. 6 using the vacuum pump 29 with the valve 27a opened, and the space is decompressed. When the decompression is completed, the valve 27a is closed.
Next, as shown in FIG. 7, the valve 23a of the coating liquid supply device 23 is opened, and the coating liquid 9 is supplied to the space between the base 13 and the box 15 (direction F in FIG. 6).
Thus, by supplying the coating liquid 9 in a reduced pressure state, the coating liquid 9 can penetrate into the inside of the defect 10.

この際、図7に示すように塗布液供給装置23は、塗布液9が台座13と箱体15の間の空間全体を満たすように供給する。
このように、塗布液9が台座13と箱体15の間の空間全体を満たすことにより、減圧下で塗布液9の成分の一部が蒸発することを防ぐことができる。
At this time, as shown in FIG. 7, the coating liquid supply device 23 supplies the coating liquid 9 so as to fill the entire space between the base 13 and the box 15.
Thus, when the coating liquid 9 fills the entire space between the pedestal 13 and the box 15, part of the components of the coating liquid 9 can be prevented from evaporating under reduced pressure.

次に、図8に示すように、箱体15をG方向に移動させて台座23から分離し、図9に示すように、台座23をH方向に回転させる。   Next, as shown in FIG. 8, the box 15 is moved in the G direction and separated from the pedestal 23, and the pedestal 23 is rotated in the H direction as shown in FIG.

台座23を回転させることにより、基板1上の塗布液9の膜厚を一定にすることができる。   By rotating the pedestal 23, the film thickness of the coating liquid 9 on the substrate 1 can be made constant.

このようにして、図10に示すように、塗布液9を平滑化層として基板1上に設けることができる。   Thus, as shown in FIG. 10, the coating liquid 9 can be provided on the substrate 1 as a smoothing layer.

このように、本実施の形態によれば、塗布装置11が台座13と箱体15を有しており、塗布の際には塗布液9を、台座13と箱体15によって形成される空間全体を満たすように供給する。
従って、塗布液9が変質することを防止できる。
Thus, according to the present embodiment, the coating apparatus 11 has the base 13 and the box 15, and the coating liquid 9 is applied to the entire space formed by the base 13 and the box 15 at the time of coating. Supply to satisfy.
Therefore, the coating liquid 9 can be prevented from being altered.

以上、添付図面を参照しながら、本発明の実施形態を説明したが、本発明の技術的範囲は、前述した実施の形態に左右されない。当業者であれば、特許請求の範囲に記載された技術的思想の範疇内において各種の変更例または修正例に想到し得ることは明らかであり、それらについても当然に本発明の技術的範囲に属するものと了解される。   As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

例えば、本実施形態では、台座13を回転させて塗布液9の膜厚を均一化する、いわゆるスピンコート法を用いているが、ブレードコート法により塗布液9の膜厚を均一化してもよい。   For example, in this embodiment, a so-called spin coating method is used in which the pedestal 13 is rotated to make the coating solution 9 uniform in thickness, but the coating solution 9 may be made uniform by a blade coating method. .

基板1を示す断面図Sectional view showing substrate 1 塗布装置11の構造を示す斜視図The perspective view which shows the structure of the coating device 11 図2のA−A断面図AA sectional view of FIG. 図3における箱体15のB方向矢視図B direction arrow view of box 15 in FIG. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1. 基板1に塗布液9を塗布する際の手順を示す図The figure which shows the procedure at the time of apply | coating the coating liquid 9 to the board | substrate 1.

符号の説明Explanation of symbols

1…………基板
3…………ガラス基板
5a………電極
7…………機能層
9…………塗布液
10………欠陥
11………塗布装置
13………台座
15………箱体
19………溝
21………Oリング
23………塗布液供給装置
25………塗布液
27………チューブ
29………真空ポンプ
31a……支柱
1 ………… Substrate 3 ………… Glass substrate 5a ………… Electrode 7 ………… Functional layer 9 ………… Coating liquid 10 ………… Defect 11 ……… Applicator 13 ……… Base 15… ...... Box 19 ...... Groove 21 ...... O-ring 23 ...... Coating liquid supply device 25 ...... Coating liquid 27 ...... Tube 29 ...... Vacuum pump 31 a ...... Post

Claims (9)

基材を載置する台座と、
前記台座と密着可能に設けられる箱体と、
前記箱体と前記台座に載置された前記基材との間に設けられる支柱と、
前記台座と前記箱体の間の空間を減圧する減圧装置と、
前記空間に塗布液を供給する供給装置と、
を具備し、
前記支柱は、前記箱体の上部裏面に設けられ、端部が前記台座に載置された前記基材に接するものであり、
前記箱体内部を減圧しつつ、前記供給装置から前記塗布液が、前記空間全体に供給されることを特徴とする塗布液の塗布装置。
A pedestal on which the substrate is placed;
A box provided in close contact with the pedestal;
A support provided between the box and the base material placed on the pedestal;
A decompression device for decompressing a space between the base and the box;
A supply device for supplying a coating liquid to the space ;
Comprising
The support column is provided on the upper back surface of the box body, and the end portion is in contact with the base material placed on the pedestal,
While reducing the pressure of the box body section, the coating liquid from the supply device, a coating solution of a coating apparatus characterized in that it is supplied to the entire space.
前記減圧装置は、真空ポンプであることを特徴とする請求項1記載の塗布液の塗布装置。   2. The coating liquid coating apparatus according to claim 1, wherein the decompression device is a vacuum pump. 前記箱体は、前記台座との接触面にシール部を有することを特徴とする請求項1記載の塗布液の塗布装置。   2. The coating liquid coating apparatus according to claim 1, wherein the box has a seal portion on a contact surface with the pedestal. 前記シール部は、Oリングからなることを特徴とする請求項記載の塗布液の塗布装置。 4. The coating liquid coating apparatus according to claim 3 , wherein the seal portion is formed of an O-ring. 前記台座を回転させる回転手段を更に具備することを特徴とする請求項1記載の塗布液の塗布装置。   2. The coating liquid coating apparatus according to claim 1, further comprising a rotating means for rotating the pedestal. 基材を載置する台座と、前記台座と密着可能に設けられる箱体と、前記箱体と前記台座に載置された前記基材との間に設けられる支柱を具備し、前記支柱は、前記箱体の上部裏面に設けられ、端部が前記基材に接するものである塗布装置を用い、
前記台座に基材を載置する工程と、
前記箱体を、前記基材を覆い、前記支柱の端部を前記基材上に接触させつつ、前記台座に載置する工程と、
前記台座と前記箱体の間の空間を減圧する工程と、
前記減圧状態で、前記空間全体に塗布液を供給する工程と、
を具備することを特徴とする塗布液の塗布方法。
A pedestal on which a base material is placed, a box provided so as to be in close contact with the pedestal, and a support provided between the box and the base material placed on the pedestal, Provided on the upper back surface of the box , using a coating device whose end is in contact with the substrate,
Placing the substrate on the pedestal;
Placing the box on the pedestal while covering the base material and bringing the end of the column into contact with the base material;
Depressurizing the space between the pedestal and the box;
Supplying the coating liquid to the entire space in the reduced pressure state;
The coating method of the coating liquid characterized by comprising .
前記箱体は、Oリングを有することを特徴とする請求項6記載の塗布液の塗布方法。   The coating method according to claim 6, wherein the box has an O-ring. 前記減圧は、真空ポンプにより行われることを特徴とする請求項6記載の塗布液の塗布方法。   The coating liquid coating method according to claim 6, wherein the pressure reduction is performed by a vacuum pump. 前記基材上に塗布された前記塗布液を、スピンコートまたはブレードコートにより膜厚を均一化する工程をさらに具備することを特徴とする請求項6記載の塗布液の塗布方法。   The coating solution coating method according to claim 6, further comprising a step of uniforming the film thickness of the coating solution coated on the substrate by spin coating or blade coating.
JP2005087705A 2005-03-25 2005-03-25 Coating liquid coating apparatus and coating method Expired - Fee Related JP4588506B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349955A (en) * 1976-10-18 1978-05-06 Fuji Photo Film Co Ltd Spin coating method
JPH06232038A (en) * 1993-02-05 1994-08-19 Nec Yamaguchi Ltd Rotary coating device
JPH07263475A (en) * 1994-03-17 1995-10-13 Fuji Electric Co Ltd Protective resin casting mold
JP2002513209A (en) * 1998-04-28 2002-05-08 テッセラ・インコーポレーテッド Encapsulation of microelectronic assemblies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5349955A (en) * 1976-10-18 1978-05-06 Fuji Photo Film Co Ltd Spin coating method
JPH06232038A (en) * 1993-02-05 1994-08-19 Nec Yamaguchi Ltd Rotary coating device
JPH07263475A (en) * 1994-03-17 1995-10-13 Fuji Electric Co Ltd Protective resin casting mold
JP2002513209A (en) * 1998-04-28 2002-05-08 テッセラ・インコーポレーテッド Encapsulation of microelectronic assemblies

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