JP4586613B2 - Method for forming groove in glass substrate, method for manufacturing electrostatic actuator, method for manufacturing droplet discharge head, and method for manufacturing device - Google Patents

Description

The present invention relates to a method of forming a groove in a glass substrate, a method of manufacturing an electrostatic actuator, a method of manufacturing a droplet discharge head, and a method of manufacturing a device. Groove forming method, electrostatic actuator manufacturing method using the glass substrate groove forming method, electrostatic drive type inkjet head manufacturing method and the like The present invention relates to a device manufacturing method including an actuator manufacturing method.

In an electrostatic drive type inkjet head, a structure that increases the displacement amount of the diaphragm and increases the ejection energy of droplets without causing an increase in drive voltage has been studied. One of the structures is a method of providing a stepped step on the individual electrode.
As a conventional method of manufacturing an electrostatic actuator, a stepped step is formed on a silicon substrate or borosilicate glass in the short side direction so that there are at least two kinds of gaps (gap lengths) between the diaphragm and the individual electrodes. (For example, refer to Patent Document 1).

In addition, as another conventional inkjet head, it is described that a large gap portion and a small gap portion are formed in a step shape in the long side direction of the individual electrode as a gap between the diaphragm and the individual electrode. There is no description about a method of forming a large gap portion and a small gap portion in a step shape. (For example, refer to Patent Document 2).
Furthermore, as another conventional method for forming a glass substrate groove using a Cr film, a glass substrate is formed by using a patterned resist film for groove formation of a glass substrate and a laminated film composed of a Cr film as an etching mask. It is described that a groove is formed on the surface of the substrate by wet etching. (For example, refer to Patent Document 3).
JP 2000-318155 A (first page, FIG. 2) JP-A-9-39235 (first page, FIG. 1) Japanese Unexamined Patent Publication No. 2002-145543 (first page, FIG. 4)

When a stepped step is formed on a silicon substrate by the conventional method of manufacturing an electrostatic actuator described in Patent Document 1, processing is easier than when borosilicate glass is used, but the following drawbacks are present. is there.
1) Since the unit price of the silicon substrate is higher than the unit price of borosilicate glass, the cost increases.
2) Anodic bonding is not possible when bonding cavity substrates.
3) Since the silicon substrate is not transparent, the inside of the electrostatic actuator cannot be observed.
Further, the conventional ink jet head described in Patent Document 2 does not describe a method of forming a step, and the conventional groove forming method of a glass substrate using a Cr film described in Patent Document 3 is applied to the glass substrate. Although a method for forming one groove is described, there is no description about forming a stepped groove.
Therefore, at the present time, when manufacturing an electrostatic actuator, it is desired to propose a method for forming a stepped step on a so-called glass substrate with low cost and high accuracy.

The glass substrate groove forming method according to the present invention is a glass substrate groove forming method in which a recess having a multi-step groove is formed on a glass substrate, and a corrosion-resistant metal film is formed on the surface of the glass substrate having a predetermined thickness. Forming a resist pattern corresponding to the first-stage groove on the surface of the metal film, etching a part of the metal film in accordance with the resist pattern, and simultaneously forming an alignment mark by etching. And a third step of forming a first-stage groove by glass etching the exposed surface portion of the glass substrate exposed by etching of the metal film to a predetermined depth; A resist pattern corresponding to the second-stage groove is formed on the metal film from which the resist film is peeled off in a fourth step of removing the resist film remaining on the surface of the glass substrate. A fifth step of forming the alignment mark, dropping a resist on the alignment mark portion, and etching a part of the metal film according to the resist pattern, and exposing the metal film by etching. A sixth step of forming a second step groove larger in the longitudinal direction than the first step groove by subjecting the exposed surface portion of the glass substrate to glass etching to a predetermined depth; and a surface of the glass substrate And a seventh step of peeling the resist film remaining on the surface of the glass substrate, and an eighth step of removing the metal film remaining on the surface of the glass substrate by etching.

According to the present invention, when the first step groove and the second step groove larger in the longitudinal direction than the first step groove are sequentially formed on the surface of the glass substrate, each corresponds to each groove. A resist pattern is formed. When forming a resist pattern for forming the first-stage groove, an alignment mark is formed on the metal film formed on the surface of the glass substrate, and the alignment mark is protected by dropping the resist. Therefore, when forming the resist pattern for forming the second stage groove, it can be aligned with the alignment mark, and the resist pattern for forming the first stage groove can be adjusted to the second stage. The resist pattern for forming the eye groove can be matched with high accuracy, and the accuracy of the groove to be formed is improved.
In addition, since the resist pattern for forming the second-stage groove can be formed while leaving the first metal film formed on the surface of the glass substrate, the number of steps can be reduced and the cost can be reduced. became.

Further, the glass substrate groove forming method according to the present invention is a glass substrate groove forming method in which a concave portion having a multi-step groove is formed on a glass substrate, and a corrosion-resistant metal film on the surface of the glass substrate having a predetermined thickness. Forming a resist pattern corresponding to the first-stage groove on the surface of the metal film, etching a part of the metal film in accordance with the resist pattern, and simultaneously etching the alignment mark And a third step of forming a first-stage groove by glass etching the exposed surface portion of the glass substrate exposed by etching of the metal film to a predetermined depth. A fourth step of removing the resist film remaining on the surface of the glass substrate; and a resist pattern corresponding to the second-stage groove on the metal film from which the resist film has been removed. A fifth step of etching a part of the metal film in accordance with the resist pattern, and exposing the metal film by etching. A sixth step of forming a second step groove larger in the longitudinal direction than the first step groove by subjecting the exposed surface portion of the glass substrate to glass etching to a predetermined depth, and the glass substrate; The seventh step of peeling the resist film remaining on the surface of the substrate and the fifth step to the seventh step are sequentially repeated, and the glass substrate is provided with the nth step from the second step to the third step. An eighth step of forming grooves up to the step, a ninth step of removing the resist film remaining on the surface of the glass substrate, and metal film etching of the metal film remaining on the surface of the glass substrate liquid Characterized in that it comprises a tenth step of removing by edging.

According to the present invention, a resist pattern corresponding to each groove is formed on the surface of the glass substrate in the case where the first step groove to the nth step groove are successively formed in the longitudinal direction. When forming a resist pattern for forming the first-stage groove, an alignment mark is formed on the metal film formed on the surface of the glass substrate, and the resist pattern corresponding to the groove after the first-stage groove is formed. Since the alignment mark is protected by dropping the resist when forming the resist pattern, it can be aligned with the alignment mark when forming the resist pattern for forming the first and subsequent grooves. The resist pattern for forming the second stage groove can be accurately matched with the resist pattern for forming the stage groove.
In addition, since the resist pattern for forming the first and subsequent grooves can be formed while leaving the first metal film formed on the surface of the glass substrate, the number of steps can be reduced and the cost can be reduced. It became.

In the method for forming a groove of a glass substrate of the present invention, a resist stripping solution is used in the step of stripping the resist film, and the resist stripping solution is a dedicated organic stripping solution or high-concentration ozone water. .
In this way, by using a dedicated organic stripping solution or high-concentration ozone water as the resist stripping solution, high-temperature concentrated sulfuric acid is not used. Therefore, when the resist is stripped, pinholes are opened in the metal film or surface roughness is reduced. Can be prevented, and the yield can be improved.

The glass substrate groove forming method of the present invention is characterized in that scrub cleaning is performed on the metal film formed on the surface of the glass substrate and / or the metal film from which the resist film has been peeled off.
Thus, by scrub cleaning the metal film formed on the surface of the glass substrate and / or the metal film from which the resist film has been peeled off, pattern loss due to foreign matters is prevented during the subsequent resist coating, and the yield is reduced. Can be improved.

Further, in the method for forming a groove of the glass substrate according to the present invention, when forming a resist pattern corresponding to the second or n-th groove on the metal film from which the resist film has been peeled, Forming a new alignment mark for patterning on the surface of the metal film, forming an ITO film on the entire surface of the glass substrate after the seventh or ninth step, and the IT
A resist pattern that leaves the ITO film in the recess having the multi-stage groove on the O film is formed according to the new alignment mark, and an ITO pattern is formed by etching a part of the ITO film according to the resist pattern. The process is added.

According to the present invention, when forming a resist pattern corresponding to the second or final n-th groove on the metal film from which the resist film has been peeled off, the ITO film is patterned. A new alignment mark is formed on the surface of the metal film, an ITO film is formed on the entire surface of the glass substrate, and then a resist pattern that leaves the ITO film in the recess having the multi-step groove on the ITO film is used as the new alignment mark. Since the ITO pattern is formed by etching a part of the ITO film according to the resist pattern, when the ITO pattern is formed, the resist that leaves the ITO film according to the new alignment mark Since the pattern can be formed, the ITO film does not remain or run on the surface of the glass substrate, and the ITO wiring is accurately placed in the recess. It is possible to Ku formation.

In addition, the method for manufacturing an electrostatic actuator according to the present invention includes forming a recess having a multi-step groove on a glass substrate by any one of the groove forming methods of the glass substrate, and vibrating the glass substrate in which an electrode is provided in the recess. A silicon substrate having a plate is bonded, and an electrostatic actuator having a vibration plate facing the electrode and the electrode with a gap is manufactured.
A concave portion having a multi-step groove is formed on the glass substrate by any one of the groove forming methods of the glass substrate, a silicon substrate having a vibration plate is bonded to the glass substrate provided with the electrode in the concave portion, and the electrode and the electrode If an electrostatic actuator having a diaphragm facing each other with a gap is manufactured, an electrostatic actuator in which the diaphragm and the multistage electrode are in good contact with each other can be manufactured at a low cost with a good yield.

In addition, the method for manufacturing an electrostatic actuator according to the present invention includes forming a recess having a multi-stage groove in which an ITO pattern is provided on a glass substrate by the glass substrate groove forming method, and the glass substrate having an ITO pattern in the recess. A silicon substrate having a vibration plate is bonded to the electrode, and an electrostatic actuator including the electrode and a vibration plate facing the electrode with a gap is manufactured.
A concave portion having a multi-stage groove in which an ITO pattern is provided on the glass substrate is formed by the groove forming method of the glass substrate, a silicon substrate having a vibration plate is bonded to the glass substrate having the ITO pattern in the concave portion, and the ITO pattern If an electrostatic actuator provided with a diaphragm facing the ITO pattern with a gap is manufactured, an electrostatic actuator can be manufactured at a low cost and with good yield and in which the diaphragm and the multistage ITO pattern are in good contact.
In addition, when the silicon substrate is bonded to the glass substrate, anodic bonding failure can be prevented even if anodic bonding is performed.

Also, the method for manufacturing a droplet discharge head according to the present invention includes joining a nozzle substrate having a plurality of nozzle holes to a silicon substrate of an electrostatic actuator manufactured by any one of the above-described electrostatic actuator manufacturing methods. A discharge chamber that communicates with each of the nozzles is formed between the nozzle substrate and the silicon substrate, and a droplet discharge head that discharges droplets from the nozzles by deformation of the vibration plate is manufactured.
A nozzle substrate having a plurality of nozzle holes is bonded to a silicon substrate of the electrostatic actuator manufactured by any one of the electrostatic actuator manufacturing methods, and each nozzle is interposed between the nozzle substrate and the silicon substrate. If a droplet discharge head that forms a communication discharge chamber and discharges droplets from the nozzle by deformation of the vibration plate is manufactured, a droplet discharge head that is low in cost and good in yield can be manufactured.

A device manufacturing method according to the present invention includes any one of the above-described electrostatic actuator manufacturing methods.
By including any one of the above-described electrostatic actuator manufacturing methods, a low-cost and high-yield device can be manufactured.

Embodiment 1 FIG.
1 is an exploded perspective view showing an outline of the configuration of a droplet discharge head manufactured by the method of manufacturing a droplet discharge head according to Embodiment 1 of the present invention, and FIG. 2 is an outline of the configuration of the droplet discharge head. It is sectional drawing shown.
As shown in FIG. 1, the droplet discharge head according to the first embodiment includes a cavity substrate 1 as a first substrate having a vibration plate, a glass substrate 2 as a second substrate having an electrode 8, and nozzle holes. 12 has a three-layer structure in which a nozzle substrate 3 as a third substrate having 12 is laminated.
A cavity substrate 1 serving as an intermediate first substrate is a silicon substrate having a thickness of about 140 μm, and a discharge chamber 5 having a bottom wall as a diaphragm 4 and a common for supplying a liquid to each discharge chamber 5. The reservoir 7 is provided. TEOS is formed on the entire surface of the cavity substrate 1 by plasma CVD.
A film is formed to a thickness of 0.1 μm to form the insulating film 15. This is for preventing the diaphragm 4 and the electrode 8 from coming into contact with each other and electrically short-circuiting and preventing the cavity substrate 1 from being etched by the liquid (ink).

The glass substrate 2 as the second substrate bonded to the lower surface of the cavity substrate 1 has a thickness of 1 mm.
Use borosilicate glass. The cavity substrate 1 and the glass substrate 2 are joined by anodic bonding.
The concave portion 9 for mounting the electrode 8 on the glass substrate 2 is formed in, for example, three stages, and the facing interval between the diaphragm 4 and the electrode 8 disposed to face the diaphragm 4, that is, the gap G is formed in three stages. is doing. The depth of the gap G is 190 nm at the deepest part and 150 nm at the shallowest part.
The concave portion 9 is patterned in a slightly larger shape similar to the electrode portion shape so that the electrode 8, the lead portion 10, and the terminal portion 11 can be mounted therein. The electrode 8 is produced by sputtering an electrode member (ITO in the first embodiment) into the recess 9 by sputtering with a thickness of 0.1 μm to form an electrode pattern.
Therefore, the gap G after the anodic bonding of the cavity substrate 1 and the glass substrate 2 in the first embodiment is 120 nm at the deepest portion.

Further, the nozzle substrate 3 as a third substrate bonded and bonded to the upper surface of the cavity substrate 1 is:
A silicon substrate having a thickness of 180 μm is used, and nozzle holes 12 are provided in the surface portion of the nozzle substrate 3 so as to communicate with the discharge chamber 5, and an orifice 6 for communicating the discharge chamber 5 and the reservoir 7 is provided. The nozzle hole 12 is a two-stage nozzle, and improves the straightness of the ink by the rectifying action of the ink flow.
In addition, diaphragms 13 are formed at both ends of the nozzle substrate 3 so as to face the reservoir 7 formed on the cavity substrate 1 and suppress pressure fluctuations in the reservoir 7. The diaphragm 13 is formed by processing a part of the nozzle substrate 3 into a thin wall, for example, by etching.
The nozzle substrate 3 can also be made of a borosilicate hard glass, a steel plate such as stainless steel, a resin plate such as plastic, or the like as the electrode substrate 2 as the second substrate.

The operation of the droplet discharge head configured as described above will be described.
An oscillation circuit 18 is connected between the terminal portion 11 of the electrode 8 provided on the glass substrate 2 and the common electrode 19 provided on the cavity substrate 1. When a pulse voltage of 0 V to 30 V is applied to the electrode 8 by the oscillation circuit 18 and the surface of the electrode 8 is positively charged, the lower surface of the corresponding diaphragm 4 is charged to a negative potential. Therefore, the diaphragm 4 bends downward due to electrostatic attraction.
Next, when the pulse voltage is turned off, the diaphragm 4 is restored. For this reason, the pressure in the discharge chamber 5 rapidly increases, and the droplet 16 is discharged from the nozzle hole 12 toward the recording paper 17.
Next, the vibration plate 4 is bent downward again, whereby droplets are supplied from the reservoir 7 through the orifice 6 into the discharge chamber 5. The cavity substrate 1 and the oscillation circuit 18 are connected to each other through a common electrode 19 opened in a part of the cavity substrate 1 by dry etching. The liquid is supplied to the droplet discharge head through a liquid supply port 14 formed on the electrode substrate 2.

The ink used is prepared by dissolving or dispersing a surfactant such as ethylene glycol and a dye or pigment in a main solvent such as water or alcohol. Furthermore, if a heater or the like is attached to the droplet discharge head, hot melt type ink can also be used.
The droplet discharge head according to the first embodiment is a face inkjet method, but may be an edge inkjet method in which nozzle holes 12 for discharging ink are opened on the end surface of the cavity substrate 1 or the nozzle substrate 3. .

As described above, in the first embodiment, the electrostatic actuator is mainly configured by the diaphragm 4 and the electrode 8. In the first embodiment, an electrostatic drive type droplet discharge head is shown as an example to which the method for manufacturing the electrostatic actuator according to the present invention is applied. However, the method for manufacturing the droplet discharge head according to the first embodiment is described. Is an optical MEMS (Micro Electro Mechanical Syst
em) It can also be applied to devices.

The diaphragm 4 in the droplet discharge head of Embodiment 1 is a high-concentration boron-doped layer, and the boron-doped layer has a thickness that is the same as the desired diaphragm thickness.
When the dopant is boron, the etching rate in the Si etching with alkali is very small in a high concentration region (about 5 × 10 19 atoms / cc or more).
In the first embodiment, by utilizing this fact, when the diaphragm forming region is a high-concentration boron-doped layer and the discharge chamber 5 is formed by alkali anisotropic etching, the etching rate is increased when the boron-doped layer is exposed. The diaphragm 4 is produced to a desired plate thickness by a so-called etching stop technique that is extremely small.

A method of manufacturing the second glass substrate 2 of the droplet discharge head in the first embodiment will be described in detail with reference to the manufacturing process diagram of FIG.
First, a glass substrate 2 of borosilicate glass having a thickness of 1 mm polished on both sides is prepared. (Fig. 3 (a1
A2)).
Next, after purifying the glass substrate 2 with a calcium carbonate solution, a Cr film 51, which is a corrosion-resistant metal film, is formed to 100 nm on one surface by sputtering. (FIG. 3 (b1, b2)).
As the corrosion-resistant metal film, a film obtained by laminating gold on Cr or a titanium film can be used in addition to the Cr film.

After scrub cleaning is performed on the surface on which the Cr film 51 is formed, a resist is applied to the surface of the Cr film 51, and then the resist film is exposed and developed to form the first groove 9a (the deepest portion of the recess 9). The first-stage resist pattern 52 corresponding to 2) is formed, and a portion of the Cr film 51 is etched with a Cr etchant that is an aqueous solution of ceric ammonium nitrate to match the resist pattern 52 to form a Cr pattern. . At the same time, an alignment mark 53 for aligning the resist pattern after the second-stage groove 9b is also formed. (Fig. 3 (c1, c2))
. The scrub cleaning is performed by rubbing the surface of the Cr film 51 with a soft member such as sponge, PVA, mohair, nylon, and washing with pure water.
The shape of the alignment mark 53 formed on the surface of the Cr film 51 is a square as shown in FIG.

Using the Cr pattern with the resist pattern 52 as a mask (hereinafter referred to as “Cr mask”), an aqueous ammonium fluoride solution is used for the glass substrate 2 to form the first groove 9 in the recess 9.
a is etched by 20 nm. When etching with aqueous ammonium fluoride solution,
Since this is isotropic etching, the area under the Cr mask is etched to form side etching ((d1) in FIG. 3). For this reason, the Cr mask is designed to be smaller in consideration of the side etching than the final shape.

When the etching is performed to a desired depth, the resist is peeled off. However, in the resist stripping step, resist stripping with hot sulfuric acid that is generally performed is not performed, and a dedicated organic stripping solution is used as the resist stripping solution. Or peel off using high-concentration ozone water.
When resist stripping is performed using hot sulfuric acid, the Cr film may be attacked to generate pinholes on the surface. In order to avoid this, it is desirable to perform resist stripping using an organic stripping solution or high-concentration ozone water.

Examples of the organic solvent used as the organic stripping solution, which is a resist stripping solution, include the following types.
Sulphoxides, sulfones, pyrrolidones, amines, amino alcohols, ketones, amides, ethylene glycols, diethylene glycols, triethylene glycols, propylene glycols and their derivatives and specific examples of these solvents For example, sulfoxides: dimethyl sulfoxide, diethyl sulfoxide, etc. Sulfones: sulfolane, dimethyl sulfone, diethyl sulfone, etc. Pyrrolidones: N-methyl-2-pyrrolidone, etc. Amines: 3-diethylaminopropylamine, methylaminopropylene
Amino alcohols such as ruamine: isopropanolamine, N, N-diethylethanol
Min, aminoethylethanolamine, N-methyl-N,
N-diethanolamine, N-methylethanolamine,
3-amino-1-propanol, monoethanolamine,
Diethanolamine, etc. Ketones: Acetylacetone, methyl isobutyl ketone, etc. Amides: N, N-dimethylformacid, N, N-dimethylacetate
Amines and other ethyne glycols: ethylene glycol, ethylene glycol dimethyl ether
, Ethylene glycol monobutyl ether, cellosolve
Acetate, etc. Diethylene glycols: Dietine glycol monoethyl ether, diethylene glycol
Cole mono-n-butyl ether, etc. Triethylene glycols: triethylene glycol, triethylene glycol monoe
Propylene glycols such as tilether: Dipropylene glycol monomethyl ether, etc. Among these, monoethanolamine, dimethyl sulfoxide, N-methyl-2-pyrrolidone are particularly preferable as solvents having a relatively high boiling point, water solubility and easy handling. And dipropylene glycol monomethyl ether. These solvents are used as a mixture of one or more.
Of these, for example, when a dedicated amine stripping solution is used, the substrate is immersed at 80 ° C. for 1 hour, rinsed with ultrapure water, and spin-dried. (FIG. 3 (d1, d2)).

When resist stripping is performed using hot sulfuric acid, the Cr film may be attacked to generate pinholes on the surface. For this reason, it is desirable to perform resist stripping using an organic stripping solution or high-concentration ozone water.
As in the first step, the surface on which the Cr film 51 is formed is scrubbed, and then a resist is applied to the surface of the Cr film 51, and then the resist film is exposed and developed to form the second step of the recess 9. A second-stage resist pattern 54 corresponding to the eye groove 9 b is formed, and a part of the Cr film 51 is etched with a Cr etching solution in accordance with the resist pattern 54.
At this time, the second stage patterning is performed in accordance with the alignment mark 53 formed in the first stage. Then, before etching a part of the Cr film 51, the alignment mark 53 is used.
A resist is dropped on a portion where the mark exists, and Cr in the alignment mark 53 portion is protected. Thereafter, a part of the Cr film 51 is etched with a Cr etching solution to form a Cr pattern.
(FIG. 3 (e1, e2)).

Using the Cr pattern with the resist as a mask (Cr mask), the second-stage groove 9b is etched by 20 nm using an aqueous ammonium fluoride solution. This is the same as the first stage.
The Cr mask is designed to be smaller in consideration of the side etching than the final shape. As a result, the depth of the first-stage groove 9a is 40 nm, and the depth of the second-stage groove 9b is 20 nm.
After etching to a desired depth, the resist is stripped using a dedicated organic stripping solution such as a mixed solution of monoethanolamine or high-concentration ozone water. For example, when a dedicated amine stripping solution is used, the substrate is immersed for 1 hour at 80 ° C., rinsed with ultrapure water, and spin-dried. (
FIG. 3 (f1, f2)).

After scrub cleaning on the surface on which the Cr film 51 was formed, as in the first and second stages,
After a resist is applied to the surface of the Cr film 51, the resist film is exposed and developed to form a third-stage resist pattern 55 corresponding to the third-stage (shallowest) groove 9c of the recess 9.
At this time, patterning is performed according to the alignment mark 53 formed in the first stage. And before etching a part of Cr film 51, a resist is dripped at the part in which the alignment mark 53 exists, and Cr of the alignment mark 53 part is protected. Then Cr
A part of the film 51 is etched with a Cr etching solution to form a Cr pattern. (Fig. 3 (g
1, g2)).

In the third stage patterning, a new alignment mark 63 different from the previous alignment mark 53 for patterning the ITO film is formed on the cr film 51. The shape of the new alignment mark 63 has a cross shape as shown in FIG. The alignment mark 63 is formed so as to be positioned in the square alignment mark 53 shown in FIG. This alignment mark 63 is also protected by dripping the resist.

Using the Cr pattern with the resist as a mask (Cr mask), the third-stage groove 9c is etched by 150 nm using an aqueous ammonium fluoride solution. As in the first and second stages, the Cr mask is designed to be smaller in consideration of the side etching than the final shape. As a result, the depth of the first-stage groove 9a is 190 nm, the depth of the second-stage groove 9b is 170 nm, and the depth of the third-stage groove 9c is 150 nm.
After etching to a desired depth, the resist is stripped using a dedicated organic stripping solution such as a mixed solution of monoethanolamine or high-concentration ozone water. For example, when a special amine-based stripping solution is used, the substrate is immersed for 1 hour at 80 ° C., rinsed with ultrapure water, and spin-dried.
(FIG. 3 (h1, h2)).

Immerse the glass substrate 2 in the Cr etching solution and leave the alignment marks 53, 63 and C
The r film 51 is peeled off. (Figure i)
Next, after the glass substrate 2 is washed with sulfuric acid, an ITO film 56 is formed on the entire surface of the glass substrate 2 by sputtering on the surface on which the resist pattern has been formed so far. (Fig. 3 (
j)).
After scrub cleaning is performed on the surface on which the ITO film 56 is formed, a resist is applied so that the ITO pattern remains in the recess 9 in which the third-stage groove 9c is formed, and then the resist film is exposed and developed. Then, a resist pattern is formed. At this time, patterning is performed in accordance with the alignment mark 63 newly formed in the third stage. Then, the ITO film 56 is etched with a mixed solution of hydrochloric acid and nitric acid to form an ITO pattern 57. (FIG. 3 (k)).

The ITO patterning is matched with the alignment mark 63 formed in the third stage, so that I
The TO film 56 does not remain (climb) on the surface of the glass substrate 2, and the ITO wiring can be formed inside the recess 9 with high accuracy.
Finally, the Cr film with the alignment marks 53 and 63 is removed by etching with a Cr etchant, and a hole to be the ink supply port 14 is formed in the glass substrate 2 by sandblasting or drilling. (Fig. 1)

Embodiment 2. FIG.
FIG. 6 is a perspective view showing an example of a droplet discharge device manufactured by the method of manufacturing a droplet discharge head shown in the first embodiment.
A droplet discharge device 100 shown in FIG. 6 is a general inkjet printer.
Since the droplet discharge head shown in the first embodiment has high discharge stability and durability because water vapor does not enter the gap G between the diaphragm 4 and the electrode 8, the droplet discharge excellent in discharge performance and durability. Device 100 can be obtained.
In addition to the ink jet printer shown in FIG. 6, the droplet discharge head shown in Embodiment 1 can be used for variously changing the droplets to produce a color filter for a liquid crystal display, to form a light emitting portion of an organic EL display device, It can also be applied to the discharge of biological liquids.

Embodiment 3 FIG.
FIG. 7 is a perspective view showing a principal part of an example of a device manufactured by the method for manufacturing an electrostatic actuator according to the present invention. The device 200 shown in FIG. 7 is a mirror device used as a laser scan mirror for an optical switch or a laser printer.
In the device 200 according to the third embodiment, a drive unit 202, a hinge 20 and a drive substrate 201 are provided.
3. A mirror 204 is formed. In addition, the electrode substrate 2 bonded to the drive substrate 201
In 05, a counter electrode 206 made of ITO or the like is formed. The drive substrate 201 corresponds to the cavity substrate 2 of the droplet discharge head according to the first embodiment, and the drive unit corresponds to the vibration plate unit 4.

In the device 200 shown in FIG. 7, the drive unit 202 swings when a voltage is applied between the drive unit 202 and the counter electrode 206. As a result, the hinge 203 is twisted and the force is transmitted to the mirror 204, whereby the mirror 204 changes its angle. As described above, in the third embodiment, the electrostatic actuator is mainly configured by the drive unit 202, the hinge 203, the mirror 204, and the counter electrode 206.
Also in the device 200 according to the third embodiment, a passivation film (not shown in FIG. 7) is formed on the electrode substrate 205, and the counter electrode 206 is formed thereon to block water vapor and the like to drive. The driving stability of the unit 202 and the mirror 204 can be improved. Note that the device 200 shown in FIG. 11 is generally vacuum-sealed by packaging (not shown) to be shut off from the outside air.

In the first embodiment, a droplet discharge head is shown as an example to which the manufacturing method of the electrostatic actuator according to the present invention is applied. However, the manufacturing method of the electrostatic actuator shown in the first embodiment of the present invention is not limited to this. The present invention can also be applied to a device manufacturing method. Specifically, the present invention can be applied to a method for manufacturing a MEMS device such as a wavelength tunable filter or a micropump.
The manufacturing method of the electrostatic actuator, the manufacturing method of the droplet discharge head, and the manufacturing method of the device according to the present invention are not limited to the embodiments of the present invention, and are changed within the scope of the idea of the present invention. can do.

FIG. 2 is an exploded perspective view showing an outline of a configuration of a droplet discharge head manufactured by the method for manufacturing a droplet discharge head according to Embodiment 1 of the present invention. Sectional drawing which shows the outline of a structure of the droplet discharge head. Sectional drawing which shows the manufacturing process of the glass substrate of the manufacturing method of the droplet discharge head. Explanatory drawing which shows the shape of the alignment mark of Cr film | membrane in the manufacturing process of the droplet discharge head. The perspective view which showed an example of the droplet discharge apparatus which mounts the droplet discharge head. The principal part perspective view which showed an example of the device carrying the electrostatic actuator which concerns on this invention.

Explanation of symbols

1 cavity substrate, 2 glass substrate, 3 nozzle substrate, 4 diaphragm, 5 discharge chamber, 6
Orifice, 7 Reservoir, 8 Electrode, 9 Recess, 9a First stage groove, 9b Second stage groove, 9c Third stage groove, 12 Nozzle hole, 51 Metal film (Cr film), 52 First Stage resist pattern, 53 alignment mark, 54 Second stage resist pattern, 55 Third stage resist pattern, 56 ITO film, 57 ITO pattern, 63
Alignment mark.

Claims (9)

In the glass substrate groove forming method of forming a recess having a multi-stage groove on a glass substrate,
A first step of forming a corrosion-resistant metal film on the surface of a glass substrate having a predetermined thickness;
Forming a resist pattern corresponding to the first-stage groove on the surface of the metal film, etching a part of the metal film according to the resist pattern, and simultaneously forming an alignment mark by etching;
A third step of forming a first stage groove by glass etching the exposed surface portion of the glass substrate exposed by etching the metal film to a predetermined depth;
A fourth step of removing the resist film remaining on the surface of the glass substrate;
A resist pattern corresponding to the second-stage groove is formed on the metal film from which the resist film has been peeled off in accordance with the alignment mark, and a resist is dropped on the alignment mark, and the resist pattern is aligned with the resist pattern. A fifth step of etching part of the metal film;
A second step groove larger in the longitudinal direction than the first step groove is formed by glass etching the exposed surface portion of the glass substrate exposed by the etching of the metal film to a predetermined depth. And the process of
A seventh step of removing the resist film remaining on the surface of the glass substrate;
An eighth step of removing the metal film remaining on the surface of the glass substrate by etching;
A groove forming method for a glass substrate, comprising: In the glass substrate groove forming method of forming a recess having a multi-stage groove on a glass substrate,
A first step of forming a corrosion-resistant metal film on the surface of a glass substrate having a predetermined thickness;
Forming a resist pattern corresponding to the first-stage groove on the surface of the metal film, etching a part of the metal film according to the resist pattern, and simultaneously forming an alignment mark by etching;
A third step of forming a first stage groove by glass etching the exposed surface portion of the glass substrate exposed by etching the metal film to a predetermined depth;
A fourth step of removing the resist film remaining on the surface of the glass substrate;
A resist pattern corresponding to the second-stage groove is formed on the metal film from which the resist film has been peeled off in accordance with the alignment mark, and a resist is dropped on the alignment mark, and the resist pattern is aligned with the resist pattern. A fifth step of etching part of the metal film;
A second step groove larger in the longitudinal direction than the first step groove is formed by glass etching the exposed surface portion of the glass substrate exposed by the etching of the metal film to a predetermined depth. And the process of
A seventh step of removing the resist film remaining on the surface of the glass substrate;
An eighth step of sequentially forming the fifth step to the seventh step to form a groove from the second step groove to the third step and the nth step on the glass substrate;
A ninth step of removing the resist film remaining on the surface of the glass substrate;
A tenth step of etching and removing the metal film remaining on the surface of the glass substrate;
A groove forming method for a glass substrate, comprising:   3. The glass substrate according to claim 1, wherein a resist stripping solution is used in the fourth or / and the seventh step, and the resist stripping solution is a dedicated organic stripping solution or high-concentration ozone water. Groove formation method.   4. The scrub cleaning is performed on the metal film formed on the surface of the glass substrate in the first step and / or the metal film from which the resist film is peeled off in the fourth and seventh steps. The groove formation method of the glass substrate in any one of. A new pattern for patterning the ITO film when forming a resist pattern corresponding to the second or nth groove on the metal film from which the resist film has been removed in the fifth or eighth step. Forming an alignment mark on the surface of the metal film,
After the eighth step, forming an ITO film on the entire surface of the glass substrate;
A resist pattern that leaves the ITO film in the concave portion having the multi-stage groove on the ITO film is formed according to the new alignment mark, and an ITO pattern is formed by etching a part of the ITO film according to the resist pattern. And the process of
The glass substrate groove forming method according to any one of claims 1 to 3, which is added.   5. A glass substrate groove forming method according to claim 1, wherein a concave portion having multi-step grooves is formed in the glass substrate, and a silicon substrate having a vibration plate is bonded to the glass substrate provided with electrodes in the concave portion. And manufacturing an electrostatic actuator comprising the electrode and a diaphragm facing the electrode with a gap.   A recess having a multistage groove in which an ITO pattern is provided on a glass substrate is formed by the method for forming a groove in a glass substrate according to claim 5, and a silicon substrate having a vibration plate is bonded to the glass substrate having the ITO pattern in the recess. An electrostatic actuator manufacturing method comprising manufacturing an electrostatic actuator comprising the ITO pattern and a diaphragm facing the ITO pattern with a gap.   A nozzle substrate having a plurality of nozzle holes is joined to the silicon substrate of the electrostatic actuator manufactured by the method for manufacturing an electrostatic actuator according to claim 6 or 7, and the nozzle substrate and the silicon substrate are bonded to each other. A method of manufacturing a droplet discharge head, comprising: forming a discharge chamber communicating with each of the nozzles, and manufacturing a droplet discharge head for discharging droplets from the nozzle by deformation of the vibration plate.   A device manufacturing method comprising the electrostatic actuator manufacturing method according to claim 6.

Images