JP2007166873A - Method of manufacturing electrode substrate, method of manufacturing electrostatic actuator, method of manufacturing liquid droplet discharge head, and method of manufacturing liquid droplet discharge device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing electrode substrate, a method of manufacturing electrostatic actuator, a method of manufacturing device, a method of manufacturing droplet discharge head, and a method of manufacturing droplet discharge device, capable of effecting effective cleaning with high foreign substances removal effect, preventing the occurrences of poor joining with other substrates or malfunctions, thereby enhancing yield. <P>SOLUTION: A method of manufacturing an electrode substrate has an electrode recess forming step S1 for forming an electrode recess for forming an electrode on a glass substrate, a drilling step S2 for drilling a predetermined position of a glass substrate, a cleaning step S3 for cleaning a glass substrate after drilling step, an electrode forming step S4 for forming an electrode in an electrode recess of a glass substrate after cleaning step. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electrode substrate manufacturing method applied to an electrostatic drive type electrostatic actuator, an electrostatic actuator manufacturing method using the electrode substrate, and a droplet discharge head manufacturing method using the electrostatic actuator.

  A conventional method for manufacturing a droplet discharge head includes a first step of forming a discharge chamber and a diaphragm on a silicon substrate to form a first substrate, and forming an electrode on a glass substrate, and then forming a liquid supply port therethrough. A second step of forming a second substrate, a third step of subjecting the surface of the second substrate facing the first substrate to ultrasonic scrubbing and non-contact scrubbing, and the first substrate, And a fourth step of joining the second substrate (see, for example, Patent Document 1). In this technique, foreign matters such as glass chipping generated when the liquid supply port is formed are removed by ultrasonic scrubbing and non-contact scrubbing, and the foreign matter adheres to the electrodes and causes malfunction. The inconvenience is prevented. Hereinafter, this technique is referred to as a first conventional example.

  In addition, in the conventional method for manufacturing a droplet discharge head, when forming the liquid supply port in the glass substrate in the second step, a photosensitive dry film is pasted on both surfaces of the glass substrate on which the electrodes are formed. There is a technique in which exposure and development are performed through an exposure mask to open a portion serving as a liquid supply port, and the liquid supply port is formed by sandblasting through the opening. Hereinafter, this technique is referred to as a second conventional example.

Japanese Patent Laying-Open No. 2005-138385 (second page)

  In the first conventional example, since the glass substrate is cleaned after the electrodes are formed, the influence on the electrodes due to the cleaning operation is taken into consideration, and strong cleaning cannot be performed, and foreign matters are sufficiently removed. It was difficult.

  Further, in the second conventional example, the photosensitive dry film is attached to the glass substrate. However, when the photosensitive dry film is peeled off, adhesive residue is likely to occur, and bonding failure occurs when bonding to the first substrate. There was a problem of inviting.

  As described above, in the conventional manufacturing method, since sufficient cleaning cannot be performed, operation failure, bonding failure with other substrates connected to the electrode substrate, and as a result, yield is reduced.

  The present invention has been made in view of such points, and can perform effective cleaning with a high effect of removing foreign matter, thereby preventing the occurrence of malfunctions and poor bonding with other substrates and improving the yield. An electrode substrate manufacturing method, an electrostatic actuator manufacturing method, a device manufacturing method, a droplet discharging head manufacturing method, and a droplet discharging apparatus manufacturing method are provided.

An electrode substrate manufacturing method according to the present invention includes: an electrode recess forming step for forming an electrode recess for forming an electrode on a glass substrate; an excavation step for excavating a predetermined position of the glass substrate; A cleaning process for cleaning the glass substrate and an electrode forming process for forming electrodes in the recesses for electrodes of the glass substrate after the cleaning process are included.
This makes it possible to select an optimum cleaning method as needed without worrying about the influence on the electrode during cleaning, and it is possible to perform effective cleaning with a wider range of selection of cleaning methods. Therefore, it is possible to solve the problem of operation failure and bonding failure with other substrates due to insufficient cleaning, and it is possible to improve the yield.

Moreover, the manufacturing method of the electrode substrate which concerns on this invention performs an excavation process by a sandblasting method, peels the photosensitive dry film stuck in order to perform a sandblasting method, and performs sulfuric acid washing | cleaning by a washing | cleaning process.
Since the cleaning process is performed before the electrode forming process, it is possible to use sulfuric acid cleaning effective in removing the adhesive residue of the photosensitive dry film, and the adhesive residue can be sufficiently removed.

Moreover, the manufacturing method of the electrode substrate which concerns on this invention performs the etching washing | cleaning by the etching liquid for glass further in a washing | cleaning process.
Thereby, the chipping remaining on the inner surface of the site excavated in the excavation process can be removed, and the roughness of the inner surface can be taken and smoothed. Therefore, it is possible to prevent the inconvenience that foreign matters that have been peeled off and floated from the inner surface in subsequent steps applied to the electrode substrate adhere to the electrode and cause malfunction.

In the electrode substrate manufacturing method according to the present invention, in the electrode formation step, an electrode film is formed on the surface of the glass substrate where the concave portions for electrodes are formed, a photoresist is applied thereon, and then a resist pattern is formed by photolithography. Using the resist pattern as a mask, the electrode film is etched to form an electrode. Before applying the photoresist, the electrode of the glass substrate is covered so as to cover the through hole formed in the excavation process. A protective film is attached to the surface opposite to the surface on which the concave portions for forming are formed, so that the photoresist is prevented from entering through the through hole and flowing out from the opposite side.
Thereby, it can prevent that a resist flows in from the surface opening side of a through-hole, flows out from a back side opening, and wraps around the back surface of a glass substrate. This makes it possible to prevent various inconveniences that occur when the resist wraps around the back surface of the glass substrate.

Moreover, the manufacturing method of the electrostatic actuator which concerns on this invention manufactures an electrostatic actuator using the manufacturing method of one of said electrode substrates.
Thereby, a highly reliable electrostatic actuator can be manufactured with a high yield.

A method for manufacturing a droplet discharge head according to the present invention is a method for manufacturing a droplet discharge head using the above-described method for manufacturing an electrostatic actuator.
Thereby, a highly reliable droplet discharge head can be manufactured with a high yield.

A method for manufacturing a droplet discharge device according to the present invention is a method for manufacturing a droplet discharge device using the method for manufacturing a droplet discharge head described above.
Thereby, a highly reliable droplet discharge device can be manufactured with high yield.

Embodiment 1 FIG.
FIG. 1 is an exploded perspective view of a droplet discharge head including an electrode substrate manufactured by the electrode substrate manufacturing method according to Embodiment 1 of the present invention. 2 is a longitudinal sectional view of the droplet discharge head shown in FIG. 1, and is a sectional view taken along line AA of FIG.

  The droplet discharge head according to the first embodiment is mainly configured by bonding a cavity substrate 1, an electrode substrate 2, and a nozzle substrate 3. The cavity substrate 1 is made of, for example, a single crystal silicon substrate (hereinafter simply referred to as a silicon substrate), and is subjected to the following predetermined processing. In FIG. 1, a silicon substrate having a (110) plane orientation is used as the cavity substrate 1. The cavity substrate 1 is formed by subjecting the silicon substrate to anisotropic wet etching, so that the bottom wall is formed as the vibration plate 4 and serves as a droplet discharge chamber 5 and a droplet 5 to be supplied to each discharge chamber 5. And a recess 6a that constitutes a reservoir 6 that stores water. The electrode terminal 7 is connected to the drive circuit 23 shown in FIG.

The diaphragm 4 is formed from a high-concentration boron-doped layer. This boron-doped layer is formed by doping boron at a high concentration (about 5 × 10 ¹⁹ atoms / cm ³ or more). For example, when single crystal silicon is etched with an alkaline aqueous solution, the etching rate is extremely low. This is a so-called etching stop layer that is delayed. Since the boron-doped layer functions as an etching stop layer, the thickness of the diaphragm 4 and the volume of the discharge chamber 5 can be formed with high accuracy. The diaphragm 4 is formed with a thickness of 4 μm in this example. The diaphragm 4 having such a configuration functions as a common electrode on each discharge chamber 5 side.

  An insulating film 4a made of silicon oxide, aluminum oxide or the like is formed on the entire surface of the cavity substrate 1 on the electrode substrate 2 side. The insulating film 4a is for preventing a short circuit and a dielectric breakdown between the diaphragm 4 functioning as a common electrode on each discharge chamber 5 side and a counter electrode 11 described later.

  The electrode substrate 2 is made of, for example, borosilicate glass having a thickness of 1 mm, and is joined to the diaphragm 4 side of the cavity substrate 1. In this electrode substrate 2, an electrode recess 10 a that forms a gap 10 with the diaphragm 4 is formed by etching. The electrode recess 10a is formed in a rectangular shape having a short side and a long side when viewed in a plan view, and its bottom surface has a stepwise step portion 10aa that is symmetric so that its depth increases toward the center. 10ab, 10ac, 10ad. 1 and FIG. 2 shows an example of four steps, but the number of steps is not limited to this, and a configuration without a step may be employed.

  A counter electrode 11 is formed inside the electrode recess 10 a so as to face the diaphragm 4. The counter electrode 11 is made of ITO (Indium Tin Oxide) doped with tin oxide or the like, and is formed with a thickness of 0.1 μm by sputtering, for example. The counter electrode 11 is connected to the drive circuit 23 via the lead portion 12 and the terminal portion 13. The electrode substrate 2 is provided with a liquid supply port 14 for supplying droplets to the reservoir 6. The gap 10 is sealed with a sealing material 10b. The cavity substrate 1 and the electrode substrate 2 form the electrostatic actuator portion of the droplet discharge head.

  The nozzle substrate 3 is made of, for example, a single crystal silicon substrate having a thickness of 180 μm, and a nozzle 20 penetrating in the thickness direction of the nozzle substrate 3 is formed. In the nozzle 20, the lower surface side of the nozzle substrate 3 communicates with the discharge chamber 5, and the upper surface side of the nozzle substrate 3 is an opening for discharging droplets. The nozzle 20 includes a first groove 20a having a small cross-sectional area on the upper surface side of the nozzle substrate 3, and a second groove 20b having a large cross-sectional area on the lower surface side of the nozzle substrate 3, and is stepped. A two-stage nozzle 20 is provided. In addition, on the lower surface of the nozzle substrate 3, a recess 21 a serving as an orifice 21 for communicating the discharge chamber 5 and the reservoir 6 and a recess 22 a for providing the reservoir diaphragm 22 are provided. A portion of the upper surface of the nozzle substrate 3 corresponding to the reservoir diaphragm 22 is a recess. By thinning the reservoir diaphragm 22 in this way, pressure interference between the nozzles 20 via the reservoir 6 can be prevented, and droplets can be stably ejected regardless of the number of nozzles 20 to be driven. It has become.

  In practice, a silicon oxide film is formed on the entire outer surface of the nozzle substrate 3, but the illustration thereof is omitted in FIGS. 1 and 2. 1 shows an inkjet head in which the nozzles 20 and the discharge chambers 5 are arranged in two rows, the nozzle 20 and the discharge chambers 5 may be arranged in one row. In FIGS. 1 and 2, the ejection method has been described by taking the face ejection type of ejecting droplets in parallel to the nozzle substrate 3 as an example, but it may be a side ejection type.

Next, the operation of the droplet discharge head shown in FIGS. 1 and 2 will be described.
When a pulse voltage is applied between the cavity substrate 1 and the counter electrode 11 by the drive circuit 23, an electrostatic force is generated between the diaphragm 4 and the counter electrode 11, and the diaphragm 4 is moved by the suction action. The volume of the discharge chamber 5 is increased by being pulled toward the side and bent. As a result, droplets of ink or the like accumulated in the reservoir 6 flow into the discharge chamber 5 through the orifice 21. Next, when the application of the voltage to the counter electrode 11 is stopped, the electrostatic attractive force disappears, the diaphragm 4 is restored, and the volume of the discharge chamber 5 is rapidly contracted. As a result, the pressure in the discharge chamber 5 rapidly increases, and droplets such as ink are discharged from the nozzles 20 communicating with the discharge chamber 5.

  Next, a method for manufacturing the droplet discharge head according to the first embodiment will be described with reference to FIGS. 3, 4a, and 4b. The nozzle substrate 3 and the cavity substrate 1 can be formed using a conventionally known method, and the description thereof is omitted here, and a method for manufacturing the electrode substrate 2 that is a main part of the present invention will be described below.

FIG. 3 is a flowchart showing the manufacturing process of the electrode substrate.
The manufacturing process of the electrode substrate 2 is roughly divided into four steps. The electrode recess forming step (S1) for forming the electrode recess 10a in the glass substrate 31 and the excavation for forming the liquid supply port 14 are performed. It comprises a step (S2), a cleaning step (S3), and an electrode formation step (S4) for forming an electrode in the electrode recess 10a. Hereinafter, each process is demonstrated in order.

FIGS. 4a and 4b show the manufacturing process of the electrode substrate. FIGS. 4a (a) to (f) correspond to the electrode recess forming process of FIG. 3, and FIGS. 4b (g) to (i) correspond to FIGS. 4b (j) and (k) correspond to the electrode forming process, corresponding to the excavation process and the cleaning process.
A Cr / Au film (chromium / gold alloy film) 32 is formed by sputtering on the front surface of a glass substrate 31 made of borosilicate glass (thickness 1 mm) to be the electrode substrate 2 of the droplet discharge head (FIG. 4a (a)). ). Next, a resist (not shown) having a predetermined shape is patterned and etched on the surface of the glass substrate 31 by photolithography, and the fourth step 10ad of the stepped step of the electrode recess 10a of the Cr / Au film 32 is performed. The portion 32a corresponding to is removed (FIG. 4a (b)). Then, using the Cr / Au film 32 as an etching mask, the glass substrate 31 is formed with a hydrofluoric acid aqueous solution to form a stepped stepped fourth step 10ad halfway (FIG. 4a (c)).

  Then, a resist (not shown) having a predetermined shape is patterned and etched again by photolithography, and a portion 32b corresponding to the third step 10ac of the stepped step of the electrode recess 10a of the Cr / Au film 32 is formed. It is removed (FIG. 4a (d)). Then, using the Cr / Au film 32 as an etching mask, the glass substrate 31 is etched with a hydrofluoric acid aqueous solution to create stepped stepped fourth steps 10ad and third step 10ac halfway (FIG. 4a (e)). The above process is repeated as necessary while expanding the opening shape of the etching mask in the long side direction according to the shape of the step portion to form four step portions 10aa, 10ab, 10ac, 10ad, and the Cr / Au film 32 is formed. It is removed (FIG. 4a (f)).

  Then, a photosensitive dry film 33 is attached to both side surfaces of the glass substrate 31, exposed through an exposure mask, and development is performed to form a resist pattern in which the portion 33a serving as the liquid supply port 14 is opened (FIG. 4b ( g)), using the resist pattern as a mask, the liquid supply port 14 is formed through the opening 33a by sand blasting as excavation (FIG. 4B (h)). Thereafter, the photosensitive dry film 33 on both surfaces of the glass substrate 31 is peeled off and washed (FIG. 4b (i)).

  This cleaning process includes a sulfuric acid cleaning process for removing the adhesive residue of the photosensitive dry film 33 and an etching cleaning process for removing chipping (a piece of the glass substrate 31) generated when the liquid supply port 14 is formed. . The order of the sulfuric acid cleaning step and the etching cleaning step is arbitrary.

  In the sulfuric acid cleaning step, the glass substrate 31 is cleaned with sulfuric acid using a sulfuric acid cleaning solution containing sulfuric acid and hydrogen peroxide. Since the paste of the photosensitive dry film 33 is an organic substance, the removal effect by washing with sulfuric acid is high. For this reason, it becomes possible to remove reliably the adhesive residue adhering to the glass substrate 31 by performing sulfuric acid cleaning. Here, the sulfuric acid cleaning cannot be performed on the glass substrate 31 after the counter electrode 11 is formed. However, in this example, since the cleaning process is provided before the process of forming the counter electrode 11, the sulfuric acid cleaning is performed. It is possible to perform cleaning.

  In the next etching cleaning step, the entire glass substrate surface is etched by immersing the glass substrate 31 in an etching solution for glass. Thereby, the chipping remaining on the inner surface of the liquid supply port 14 can be removed and the roughness of the inner surface can be taken and smoothed.

  After the above cleaning process is completed, a protective film 34 is attached to the entire back surface of the glass substrate 31 so as to cover the liquid supply port 14, and then an ITO film 35 is formed on the entire front surface of the glass substrate 31 by sputtering. (FIG. 4b (j)). Then, a resist 36 is applied to the entire front surface of the glass substrate 31 on which the ITO film 35 is formed (FIG. 4b (k)).

  The resist 36 is applied by a coating apparatus that applies the resist by a spin coating method. In the coating apparatus, the glass substrate 31 is held on the rotating plate by vacuum suction, the resist 36 is dropped on the glass substrate 31, and the rotating plate is rotated to uniformly apply the resist 36 on the glass substrate 31 by centrifugal force. It is applied. Therefore, if the resist 36 is applied without attaching the protective film 34, the resist 36 flows from the front opening of the liquid supply port 14, flows out from the back opening, and wraps around the back surface of the glass substrate 31. Then, the coating device is damaged by adhering to the rotating plate, or the resist 36 around the opening surface of the liquid supply port 14 is reduced, and the film thickness cannot be obtained uniformly. Problems such as adversely affecting the formation of the provided lead portion 12 (see FIG. 1) occur. However, in this example, the protective film 34 is applied to the entire back surface of the glass substrate 31 and then the resist 36 is applied. Therefore, the protective film 34 does not wrap around the back surface of the glass substrate 31, and these Can prevent problems from occurring.

  Next, the resist 36 applied on the ITO film 35 is patterned and etched by photolithography into a shape corresponding to the counter electrode 11, and the ITO film 35 other than the portion of the counter electrode 11 is removed to form the counter electrode 11. . Simultaneously with the formation of the counter electrode 11, the lead portion 12 and the terminal portion 13 (see FIG. 1) are also formed by the ITO film 35. However, as described above, the uniformity of the film thickness of the resist 36 is ensured in this example. Therefore, it is possible to satisfactorily form the lead portion 12 and the terminal portion 13. Thus, the electrode substrate 2 is completed (FIG. 4b (l)).

  Next, the cavity substrate 1 is bonded to the electrode substrate 2 manufactured by the manufacturing method described above by anodic bonding. Then, the nozzle substrate 3 is bonded to the cavity substrate 1. When the nozzle substrate 3 is made of silicon, the cavity substrate 1 and the nozzle substrate 3 are bonded using an adhesive to form a bonded body. Then, such a joined body is cut by dicing, and further, the drive circuit 23, the terminal portion 13, and the electrode terminal 7 of the cavity substrate 1 are electrically connected, and foreign matter is mixed into the gap 10, moisture, etc. In order to prevent adverse effects due to entering, sealing with the sealing material 10b is performed to complete the droplet discharge head.

  As described above, according to the first embodiment, the cleaning is performed before the counter electrode 11 is formed on the glass substrate 31, so that the influence on the counter electrode 11 at the time of cleaning is not a concern. Therefore, the most suitable cleaning method can be selected according to need. Since the range of selection of the cleaning method is thus widened, effective cleaning can be performed. Therefore, problems such as operation failure and bonding failure with other substrates due to insufficient cleaning can be solved.

  That is, in this example, it is possible to select sulfuric acid cleaning effective for removing the adhesive residue of the photosensitive dry film 33, and the adhesive residue of the photosensitive dry film 33 can be sufficiently removed. Therefore, it is possible to perform good bonding with the cavity substrate 1, and it is possible to manufacture a highly reliable droplet discharge head with high yield.

  In addition, when removing foreign matters such as chipping of glass generated when the liquid supply port 14 is formed, etching cleaning is performed using an etching solution for glass, so that chipping remaining on the inner surface of the liquid supply port 14 can be removed. Also, the roughness of the inner surface can be taken and smoothed. Accordingly, in the subsequent manufacturing process, for example, when immersed in an etching solution, foreign matter is peeled off from the inner surface of the liquid supply port 14 and floats and adheres on the counter electrode 11 to prevent malfunctions. can do. Also in this respect, a highly reliable droplet discharge head can be manufactured with a high yield.

  Further, when applying the resist 36 for patterning the ITO film 35 on the glass substrate 31 on which the liquid supply port 14 is formed, the protective film 34 is attached to the entire back surface of the glass substrate 31 and then the resist 36 is applied. Since the coating is performed, it is possible to prevent the resist 36 from flowing out from the back side opening of the liquid supply port 14 and wrapping around the back surface of the glass substrate 31. Thereby, it is possible to prevent the various inconveniences that occur when the resist 36 wraps around the back surface of the glass substrate 31.

  In this example, the example of the liquid supply port 14 has been described as the hole formed in the electrode substrate 2 by excavation. However, the present invention is not limited to this.

Embodiment 2. FIG.
FIG. 5 is a perspective view showing an example of a droplet discharge device equipped with the droplet discharge head shown in the first embodiment. A droplet discharge device 100 shown in FIG. 5 is a general inkjet printer, and the droplet discharge head obtained by the method of manufacturing a droplet discharge head described in the first embodiment is a highly reliable droplet. Since it is an ejection head, the droplet ejection apparatus 100 according to Embodiment 2 is also highly reliable. In addition, the droplet discharge apparatus 100 as shown in FIG. 5 can be manufactured using a well-known manufacturing method.

  In addition to the inkjet printer shown in FIG. 5, the droplet discharge head obtained by the method for manufacturing the droplet discharge head shown in Embodiment 1 can be used for various colors of liquid crystal displays. Application to filter manufacture, formation of light emitting part of organic EL display device, formation of wiring part of wiring board manufactured by printed wiring board manufacturing apparatus, discharge of biological liquid (production of protein chip or DNA chip), etc. Can do.

  Further, the manufacturing method of the electrostatic actuator according to the first embodiment can be used not only for manufacturing a droplet discharge head but also for manufacturing other devices such as a capacitive pressure sensor and an optical MEMS device.

  The electrode substrate manufacturing method, electrostatic actuator manufacturing method, droplet discharge head manufacturing method, device manufacturing method, and droplet discharge apparatus manufacturing method of the present invention are limited to the above embodiments. Instead, it can be modified within the scope of the idea of the present invention.

The exploded perspective view of a droplet discharge head. The longitudinal cross-sectional view which showed the droplet discharge head. The flowchart which shows the manufacturing process of the electrode substrate of one embodiment of this invention. The figure (1/2) which shows the manufacturing process of the electrode substrate of one embodiment of this invention. The figure (2/2) which shows the manufacturing process of the electrode substrate of one embodiment of this invention. FIG. 3 is a perspective view of a droplet discharge device on which the droplet discharge head according to Embodiment 1 is mounted.

Explanation of symbols

1 cavity substrate, 2 electrode substrate, 3 nozzle substrate, 4 diaphragm, 4a insulating film, 5 discharge chamber, 5a recess, 6 reservoir, 6a recess, 7 electrode terminal, 10 gap, 10a electrode recess, 10aa, 10ab, 10ac , 10ad Stepped portion, 10b Sealing material, 11 Counter electrode, 12 Lead portion, 13 Terminal portion, 14 Liquid supply port, 19 Electrode recess, 20 Nozzle, 20a First groove, 20b Second groove, 21 Orifice, 21a recess, 22 reservoir diaphragm, 22a recess, 23 drive circuit, 31 glass substrate, 32 Cr / Au film, 33 photosensitive dry film, 34 protective film, 35 ITO film, 36 resist, 100 droplet discharge device.

Claims (7)

An electrode recess forming step for forming an electrode recess for forming an electrode on a glass substrate;
A drilling step of drilling a predetermined position of the glass substrate;
A cleaning step of cleaning the glass substrate after the excavation step;
An electrode forming step of forming an electrode in the electrode recess of the glass substrate after the cleaning step.   The electrode substrate according to claim 1, wherein the excavation step is performed by a sand blasting method, and after the photosensitive dry film attached for performing the sand blasting method is peeled off, sulfuric acid cleaning is performed in the cleaning step. Method.   The method for manufacturing an electrode substrate according to claim 1, wherein the cleaning step further includes etching cleaning with an etching solution for glass.   In the electrode forming step, an electrode film is formed on the formation surface side of the electrode recess of the glass substrate, a photoresist is applied thereon, a resist pattern is formed by photolithography, and the resist pattern is used as a mask. The electrode film is etched to form an electrode, and before applying the photoresist, the electrode substrate recess formation surface of the glass substrate is formed so as to cover the through hole formed in the excavation step. 4. A protective film is attached to a surface opposite to the first surface, and the photoresist is prevented from entering from the through hole and flowing out from the opposite side. The manufacturing method of the electrode substrate of description.   An electrostatic actuator manufacturing method using the electrode substrate manufacturing method according to claim 1 to manufacture an electrostatic actuator.   A method for manufacturing a droplet discharge head, wherein the droplet discharge head is manufactured using the method for manufacturing an electrostatic actuator according to claim 5. A method for manufacturing a droplet discharge device, comprising: manufacturing a droplet discharge device using the method for manufacturing a droplet discharge head according to claim 6.

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