JP2005219231A - Manufacturing method for electrostatic actuator, manufacturing method for droplet ejecting head, electrostatic actuator, droplet ejecting head, and droplet ejector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electrostatic actuator, which can prevent foreign matter from adhering to an electrode in drilling, a manufacturing method for a droplet ejecting head, the electrostatic actuator, the droplet ejecting head, and a droplet ejector equipped with the droplet ejecting head. <P>SOLUTION: In a joining step S103 as the manufacturing method for the electrostatic actuator with an electromechanical transducer wherein the electrode and a diaphragm part are arranged in an opposed manner at a predetermined interval, a first substrate with the electrode, and a second substrate with the diaphragm part are joined together in a state wherein the electrode and the diaphragm part are arranged in the opposed manner at the predetermined interval and wherein the electrode is almost closed in a chamber facing the diaphragm part. In a through-hole forming step S105, a through-hole, which constitutes at least a part of a channel for leading a fluid to a position to be pressurized by the diaphragm part of the electromechanical transducer, is formed in a position to pass through the first and second substrates joined together, and not to communicate with the chamber. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electrostatic actuator, a method for manufacturing a droplet discharge head, an electrostatic actuator, a droplet discharge head, and a droplet discharge device, and in particular, does not allow foreign matter to adhere to electrodes constituting the electrostatic actuator. Thus, the present invention relates to a method for drilling holes in a substrate constituting an electrostatic actuator.

  As a droplet discharge head having an electrostatic actuator, ink is used for the discharged liquid, the discharge chamber filled with this ink is pressurized by the electrostatic actuator, and recording is performed by discharging ink from a nozzle onto recording paper or the like. An ink jet head for performing the above is known.

  The inkjet head includes a nozzle that ejects ink droplets, an ink flow path that communicates with the nozzle, an ink intake port that supplies ink to the ink flow path, and an electromechanical conversion element provided in a part of the ink flow path. And an electrode constituting an electromechanical conversion element. The ink-jet head has a laminated structure of three substrates made of a glass substrate or a silicon substrate, and the electrical conversion element is a vibration arranged at a predetermined interval in a chamber provided on the bonding surface of the two substrates. It has a plate part and an electrode. As a method of manufacturing this type of ink jet head, a pattern forming step of forming the electrode pattern on an insulating first substrate, and forming the ink intake port on the first substrate on which the electrode pattern is formed There is known a manufacturing method including a drilling process for processing a through-hole and a bonding process for bonding the first substrate and the second substrate on which the ink flow path is formed (Patent Document 1). ).

JP-A-11-123824

  In such a conventional manufacturing method, an electrode corresponding to a vibration plate portion formed in a part of the ink flow path is formed on the first substrate, and then an ink intake port for guiding ink to the ink flow path, After the through hole to be formed is drilled in the first substrate, the first substrate having the electrode and the second substrate having the vibration plate portion are joined. As shown in FIG. 11, in the conventional drilling of the through hole, first, the hole serving as the ink intake 14 is not penetrated from the upper surface of the first substrate 1 on which the pattern of the electrode 11 is formed, Next, drilling is performed so as to communicate with the hole formed earlier from the lower surface of the first substrate 1. In this hole (hole) processing, a diamond drill 60 is used for drilling. In such hole (hole) processing, foreign matter 61 such as cutting waste is generated, and the electrode already formed on the first substrate 1 is formed. 11 adheres to the surface. Therefore, the drive of the electromechanical transducer composed of the electrode 11 to which the foreign matter 61 has adhered and the vibration plate portion is disturbed by the foreign matter 61 that has adhered to the electrode 11, which causes a malfunction.

  The present invention has been made in consideration of the above problems, and a manufacturing method of an electrostatic actuator capable of preventing foreign matter from adhering to an electrode during drilling, and manufacturing of a droplet discharge head It is an object to provide a method, an electrostatic actuator, a droplet discharge head, and a droplet discharge device equipped with the droplet discharge head.

  The method for manufacturing an electrostatic actuator according to the present invention is a method for manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval. The electrode and the second substrate having the vibration plate portion are bonded to each other so that the electrode is disposed opposite to the vibration plate portion at a predetermined interval and is substantially closed in a chamber facing the vibration plate portion. And a through-hole forming step of forming a through-hole forming a fluid flow path in at least one of the bonded first substrate and second substrate.

  According to this configuration, when the through-hole forming the fluid flow path is formed in at least one of the first substrate and the second substrate, the first substrate having the electrode and the second substrate having the diaphragm portion are formed. After the electrodes are joined to the diaphragm portion at a predetermined interval and joined in a state of being substantially closed in a chamber facing the diaphragm portion, the joined first substrate and the first substrate 2 is provided with a through-hole forming step for forming a through-hole forming a fluid flow path in at least one of the two substrates, so that foreign matter such as cutting chips generated in the through-hole forming step An electrostatic actuator can be manufactured without adhering to the electrode which comprises. That is, it is possible to manufacture the electrostatic actuator with a reduced yield and a high yield.

  The method for manufacturing an electrostatic actuator according to the present invention is a method for manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other with a predetermined interval, and includes an electrode. The first substrate and the second substrate having the diaphragm portion are bonded to each other so that the electrode is disposed opposite to the diaphragm portion at a predetermined interval and is substantially closed in a chamber facing the diaphragm portion. Through the first substrate and the second substrate through a through hole forming at least a part of a flow path for guiding a fluid to a position pressurized by the diaphragm portion of the electromechanical conversion element And a through hole forming step formed at a position not communicating with the chamber.

  According to this configuration, the electrode constituting the electromechanical conversion element is disposed opposite to the diaphragm portion at a predetermined interval, and is joined in a state of being substantially closed in the chamber facing the diaphragm portion. Later, a through hole forming at least a part of a flow path for guiding a fluid to a position pressurized by the diaphragm portion of the electromechanical conversion element passes through the first substrate and the second substrate, and Because it has a through hole forming process that is formed at a position not communicating with the chamber, the electrostatic actuator is manufactured without foreign matter such as cutting chips generated in the through hole forming process adhering to the electrodes constituting the electromechanical transducer can do.

  In this case, the through-hole forming step includes a first drilling step of drilling from the first substrate to a position that is not less than half of the thickness of the first substrate and not penetrating, and the first drilling step after the first drilling step. A second drilling step of forming the through hole by subjecting the remaining part of the first substrate and the second substrate before penetrating to break by punching using a high-pressure water flow from the substrate side of the substrate It is preferable to comprise.

  According to this configuration, the first drilling step of first drilling from the first substrate side to a position that is not more than half the thickness of the first substrate and does not penetrate, and the first substrate and the first substrate from the first substrate side. Since the through hole is formed separately from the second drilling step of drilling the remaining portion before penetrating with the second substrate, the drilling process can be performed without difficulty, and the high-pressure water flow is generated by the hole drilled in the first drilling step. In the second drilling step, the remaining portion of the first substrate and the second substrate before penetrating is broken and punched to form a through hole without causing a step in the through hole. be able to. Further, since the holes are always drilled from the first substrate side, it is possible to prevent the positional deviation from being generated in the drilling of the second drilling process as compared with the case of drilling from the second substrate side.

  A method for manufacturing an electrostatic actuator according to the present invention is a method for manufacturing an electrostatic actuator having an electromechanical transducer element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval. A first through hole forming step for forming a first through hole constituting a fluid flow path in the substrate; an electrode forming step for forming an electrode on the first substrate on which the first through hole is formed; The formed first substrate and the second substrate having the vibration plate portion are disposed so as to face each other with a predetermined distance from the vibration plate portion, and are substantially blocked in a chamber facing the vibration plate portion. And a second through hole forming step of forming a second through hole communicating with the first through hole in the second substrate bonded to the first substrate. Features.

  According to this configuration, the first through-hole is formed in the first substrate in the first through-hole forming step, and the cutting waste generated in the processing step is properly removed, and then the electrode is formed on the first substrate. An electrode forming step can be performed. Therefore, in order to join the first substrate on which the electrode is formed and the second substrate having the vibration plate portion without adhering foreign matter such as cutting chips on the electrode, this electrode is connected to the electrode constituting the electromechanical transducer. An electrostatic actuator can be manufactured without foreign matter adhering.

  The method for manufacturing an electrostatic actuator according to the present invention is a method for manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm are disposed to face each other at a predetermined interval. The first through-hole forming at least a part of a flow path for guiding a fluid to a position pressurized by the vibration plate portion of the element is disposed so as to face the vibration plate portion at a predetermined interval and vibrate. A first through hole forming step formed in the first substrate at a position not communicating with the chamber facing the plate portion, and an electrode forming step forming an electrode on the first substrate in which the first through hole is formed; The first substrate on which the electrode is formed and the second substrate having the vibration plate portion are disposed so as to face each other with a predetermined distance from the vibration plate portion, and are substantially closed in a chamber facing the vibration plate portion. A bonding step of bonding to the formed state, and a first bonding to the first substrate To the substrate, characterized in that a second through-hole forming step of forming a second through-hole communicating with the first through hole.

  According to this configuration, the first through hole that forms at least a part of the flow path for guiding the fluid to the position pressurized by the diaphragm portion of the electromechanical conversion element has an electrode at a predetermined distance from the diaphragm portion. The first substrate is perforated at a position that is opposed to the chamber and does not communicate with the room facing the diaphragm. After properly removing the cutting waste generated in the first through-hole forming step, the electrode is formed in a state in which foreign matter such as cutting waste is not attached to the electrode by forming the electrode on the first substrate. The first substrate and the second substrate having the diaphragm portion are joined in a state in which the electrode is disposed opposite to the diaphragm portion at a predetermined interval and is substantially closed in a chamber facing the diaphragm portion. Therefore, the electrostatic actuator can be manufactured without the foreign matter adhering to the electrodes constituting the electromechanical conversion element.

  Further, in this case, the second through hole forming step is performed by punching and punching the second substrate by a jet punching method using a high-pressure water flow from the first through hole side formed in the first substrate. It is preferable to form a through hole.

  According to this, since the jet punching method in which the second substrate is fractured and punched by the high-pressure water flow guided by the first through hole is used, the second through hole can be drilled at a time and communicated with the first through hole. A hole can be formed without a step on the joint surface with the through hole. Further, as compared with the case where the second through hole is formed from the second substrate side, it is possible to prevent the positional displacement of the second through hole with respect to the first through hole.

  The electrostatic actuator manufacturing method according to the present invention also includes a step of forming a recess or a through-hole for positioning when bonding the first substrate and the second substrate before forming the electrode on the first substrate. It is preferable to further comprise a drilling step formed in one substrate.

  According to this configuration, before forming the electrode on the first substrate, a drilling step for forming a concave portion or a through-hole for positioning when the first substrate and the second substrate are bonded in advance is provided. In this case, the electrodes can be formed on the first substrate based on the recesses or the through holes after properly removing foreign matters such as cutting waste generated in the drilling step. As a result, the electrostatic actuator can be manufactured without the foreign matter adhering to the electrodes constituting the electromechanical transducer. Further, if the first substrate on which the electrode is formed and the second substrate having the vibration plate portion are bonded with reference to the recess or the through hole, the bonding can be performed with high accuracy.

  In the method for manufacturing a droplet discharge head according to the present invention, an electrostatic actuator having an electromechanical transducer element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval is positioned facing the diaphragm portion. In a method for manufacturing a droplet discharge head that discharges droplets from a nozzle by pressurizing a liquid filled in a discharge chamber, an electrode includes a first substrate having an electrode and a second substrate having a diaphragm portion. A bonding step of being opposed to the vibration plate portion with a predetermined interval and bonding in a state of being substantially closed in a chamber facing the vibration plate portion; and among the bonded first substrate and second substrate A through-hole forming step of forming a through-hole forming a fluid flow path in at least one of the fluid flow paths.

  According to this configuration, when the through-hole forming the fluid flow path is formed in at least one of the first substrate and the second substrate, the first substrate having the electrode and the second substrate having the diaphragm portion are formed. After the electrode is disposed so as to be opposed to the diaphragm portion with a predetermined interval and is substantially closed in a chamber facing the diaphragm portion, the through hole is formed in the through hole forming step. If formed, foreign matter such as cutting waste generated in the through hole forming step can be prevented from adhering to the electrodes constituting the electromechanical conversion element. That is, a droplet discharge head including an electrostatic actuator having an electromechanical conversion element in which no foreign matter is attached to the electrode can be manufactured with high yield.

  Further, according to the method for manufacturing the droplet discharge head of the present invention, the electrostatic actuator having the electromechanical conversion element in which the electrode and the vibration plate portion are arranged to face each other with a predetermined interval is positioned facing the vibration plate portion. In a manufacturing method of a droplet discharge head that discharges droplets from a nozzle by pressurizing a liquid filled in a discharge chamber, a first substrate having an electrode and a second substrate having a diaphragm portion are connected to the electrode. Is disposed opposite to the diaphragm portion at a predetermined interval, and is joined in a state of being substantially closed in a chamber facing the diaphragm portion, and the joined first substrate and second substrate. A through-hole forming step for forming a through-hole for guiding the liquid to the discharge chamber at a position not communicating with the chamber, and joining the third substrate to the second substrate after the through-hole forming step And a discharge chamber forming step for forming a discharge chamber. It is characterized in.

  According to this configuration, after the first substrate having the electrode and the second substrate having the vibrating portion are joined, the first through hole for guiding the liquid to the discharge chamber located facing the vibrating plate portion is provided. Since a through-hole forming step is formed so as to pass through the substrate and the second substrate, foreign matter such as cutting chips generated in the through-hole forming step is prevented from adhering to the electrodes constituting the electrostatic actuator. can do. In addition, since it has a discharge chamber forming step of forming a discharge chamber by bonding a third substrate to the second substrate after properly removing foreign matters such as cutting chips generated in the through hole forming step, This foreign matter can be prevented from adhering to the chamber.

  Further, according to the method for manufacturing the droplet discharge head of the present invention, the electrostatic actuator having the electromechanical conversion element in which the electrode and the vibration plate portion are arranged to face each other with a predetermined interval is positioned facing the vibration plate portion. In a manufacturing method of a droplet discharge head that discharges droplets from a nozzle by pressurizing a liquid filled in a discharge chamber, at least one of flow paths for guiding the liquid pressurized by the electrostatic actuator to the discharge chamber A first through hole is formed at a position where the electrode is disposed on the first substrate so as to face the diaphragm portion at a predetermined interval and does not communicate with the chamber facing the diaphragm portion. An electrode forming step of forming an electrode on the first substrate in which the first through-hole is formed, a first substrate on which the electrode is formed, and a second substrate having a diaphragm portion. Is placed opposite the diaphragm with a predetermined distance Both the joining step of joining in a state of being substantially closed in the chamber facing the diaphragm portion, and the second through hole communicating with the first through hole in the second substrate joined to the first substrate. A second through-hole forming step to be formed; and a discharge chamber forming step of forming a discharge chamber by bonding the third substrate to the second substrate after the second through-hole forming step. And

  According to this configuration, the electrode constituting the electrostatic actuator on the first substrate after the first through hole forming step of forming the first through hole penetrating the first substrate in order to guide the liquid to the discharge chamber. In order to perform the electrode forming process of forming the electrode, the foreign matter such as the cutting waste generated during the first through hole forming process is properly removed by using a method such as acid cleaning that cannot be used for cleaning after the electrode formation. The electrode forming step can be performed, and this foreign matter can be prevented from adhering to the electrode. In addition, the first substrate on which the electrode is formed and the second substrate having the vibration plate portion are disposed so as to face each other with a predetermined distance from the vibration plate portion, and in a room facing the vibration plate portion. Since a second through-hole forming step for forming a second through-hole communicating with the first through-hole after joining in a substantially closed state is provided, cutting waste generated in the second through-hole forming step, etc. This foreign matter can be prevented from adhering to the room constituted by the diaphragm portion and the electrode. Further, after the foreign matter such as cutting waste generated in the second through-hole forming step is properly removed, the third substrate can be bonded to the second substrate, and this foreign matter is prevented from adhering to the discharge chamber. Can do.

  The electrostatic actuator of the present invention is manufactured using the above-described electrostatic actuator manufacturing method.

  According to this configuration, when forming a through-hole constituting a fluid flow path in at least one of the first substrate and the second substrate, or for introducing the fluid to a position pressurized by the diaphragm portion. When forming the through hole forming at least a part of the path, the first substrate having the electrode and the second substrate having the diaphragm portion are subjected to drilling after the bonding step, or the first processing is performed. Since the drilling process is performed before the electrode forming process of the substrate, it is possible to manufacture an electrostatic actuator while preventing foreign matters such as cutting chips generated during drilling from adhering to the electrode. Therefore, it is possible to prevent the foreign matter from obstructing the driving of the electrostatic actuator having the electromechanical conversion element including the electrode and the diaphragm.

  The droplet discharge head of the present invention is manufactured using the method for manufacturing a droplet discharge head.

  According to this configuration, the through-hole forming step for forming the through-hole for guiding the liquid to the discharge chamber after the joining step of joining the first substrate having the electrode and the second substrate having the vibration plate portion. Or a first through-hole forming step formed before the electrode forming step of the first substrate, so that it is possible to prevent foreign matter such as cutting chips generated in the drilling process from adhering to the electrode. it can. Therefore, the driving of the electrostatic actuator by the foreign matter can be prevented from being obstructed, and a highly reliable liquid droplet ejection head capable of stably ejecting liquid can be provided.

  The liquid droplet ejection apparatus of the present invention is equipped with the liquid droplet ejection head of the above invention. According to this, since a highly reliable droplet discharge head capable of stable liquid discharge is mounted, a droplet discharge device having high discharge reliability quality can be provided.

  Note that the fluid described here includes substances such as gas, liquid, and fluid resin.

  First, an inkjet head according to an embodiment of the present invention will be described. This ink jet head is pressurized by an electrostatic actuator having a discharge chamber that faces the vibration plate portion and communicates with the nozzles, and ink filled in the discharge chamber by a vibration plate portion and an electrode facing the discharge chamber. An inkjet head as a droplet ejection head mounted on a recording apparatus that is an inkjet printer that ejects ink from a nozzle as droplets and prints on a recording medium such as recording paper.

  FIG. 1 is an exploded perspective view showing the structure of the inkjet head of this embodiment. 2 is a schematic cross-sectional view taken along line AA after joining in FIG. As shown in FIG. 1, the inkjet head 10 according to the present embodiment includes a first substrate having an electrode 11, a second substrate having a diaphragm portion 5, and a third substrate having a nozzle 4 from which ink is ejected. It consists of and.

  The first substrate 1 includes a plurality of electrodes 11 that are arranged to face each other at a predetermined interval from the diaphragm portion 5 of each discharge chamber 6 provided on the second substrate 2, and a recess that has the electrodes 11 formed on the bottom surface. 15, a lead portion 12 and a terminal portion 13 connected to the electrode 11 formed on the bottom surface of the recess 15, and a through hole 16 including an ink intake port 14 for communicating with the outside and supplying ink to the reservoir 8. doing.

  The second substrate 2 is a plurality of recesses 22 serving as discharge chambers 6 filled with ink with the diaphragm portion 5 as a bottom surface, and a common ink cavity for supplying ink connected to the plurality of recesses 22. A recess 24 serving as the reservoir 8 and a narrow groove 23 serving as an orifice 7 connecting the recesses 22 and the recesses 24 are provided.

  The third substrate has a plurality of nozzles 4 formed so as to communicate with the plurality of discharge chambers 6 of the second substrate 2.

  In addition, as shown in FIG. 2, in a state where the first substrate 1 and the second substrate 2 are joined, the electrode 11 is disposed in a substantially closed state in the vibration chamber 9 as a chamber formed by the recess 15. At the same time, the electrode 11 and the diaphragm portion 5 are arranged to face each other with a predetermined gap (gap). The electrode 11 and the diaphragm portion 5 constitute an electromechanical transducer 18 that drives the diaphragm 5 with electrostatic force. An electrostatic actuator 19 having the electromechanical transducer 18 is a first substrate 1. And the lower part of the second substrate 2.

  After the first substrate 1 and the second substrate 2 are joined as described above, the vibration chamber 9 is made of an epoxy resin or the like at the end of the second substrate 2 and at the upper portion of the terminal portion 13 connected to the electrode 11. The sealing material 31 is hermetically sealed from the outside. At this time, the distance between the vibration plate portion 5 of the vibration chamber 9 and the electrode 11 is maintained at about 0.2 μm.

  And the 2nd board | substrate 2 and the 3rd board | substrate 3 are joined so that the discharge chamber 6 and the nozzle 4 may respond | correspond. Accordingly, the reservoir 8 serving as a flow path for supplying ink and the plurality of discharge chambers 6 connected to the reservoir 8 are partitioned, and the nozzles 4 communicate with each discharge chamber 6. Incidentally, a narrow groove 17 constituting the orifice 7 is also formed in the third substrate 3 in correspondence with the narrow groove 23 which becomes the orifice 7 formed in the second substrate 2. The narrow groove 17 is formed in consideration of the amount of fluid passing through the orifice 7, the pressure, and the like, and is not necessarily provided. In addition, the inkjet head 10 of the present embodiment is a so-called face inkjet system in which the nozzle 4 penetrates the third substrate 3 and communicates with the ejection chamber 6 to eject ink. An edge inkjet method may be employed in which nozzle holes or grooves are formed in the end portion of the substrate 2 and ink is ejected from nozzles formed on the side end surface (left side surface in FIG. 2) of the inkjet head 10.

  The inkjet head 10 uses borosilicate glass as the first substrate 1 and uses a silicon substrate as the second substrate 2, but the first substrate 1 can also be manufactured from low expansion glass or a silicon substrate. is there. The third substrate 3 having the nozzles 4 can be a low expansion glass, a metal such as plastic or stainless steel, or a thin plate such as silicon.

  Further, when the ink jet head 10 is driven, an insulating layer 25 (shown in FIG. 1) made of SiO 2 is formed on the lower surface of the silicon substrate as the second substrate 2 in order to prevent a short circuit between the vibration plate portion 5 and the electrode 11. ing. Further, a common electrode 26 (shown in FIG. 2) is formed on the upper surface of the silicon substrate which is the second substrate 2 for driving the inkjet head 10.

  If a circuit board such as an FPC on which a driver IC 50 for driving the inkjet head 10 is mounted is connected between the common electrode 26 of the inkjet head 10 having such a configuration and the terminal portion 13 connected to each electrode 11, The inkjet head 10 can be driven.

  Further, if the ink supply pipe 41 connected to the ink tank member 409 shown in FIG. 3 is connected to the ink inlet 14, the reservoir 8 and each discharge chamber 6 can be filled with ink through the through hole 16 shown in FIG. The ink used in this embodiment is prepared by dissolving or dispersing a surfactant such as ethylene glycol and a dye or pigment in a main solvent such as water or alcohol. Further, if the inkjet head 10 is provided with a heating mechanism such as a heater, hot-melt type ink can also be used.

  Here, the driving method of the inkjet head 10 will be briefly described. For example, a positive voltage pulse is applied to the electrode 11 formed on the glass substrate which is the first substrate 1 by the driver IC 50. When the surface of 11 is charged to a positive potential, the lower surface of the corresponding diaphragm portion 5 is charged to a negative potential. Then, the diaphragm part 5 is attracted | sucked by electrostatic force, and bends in the direction where the space | interval with the electrode 11 becomes narrow. At this time, the vibration plate portion 5 is bent, whereby ink is supplied from the reservoir 8 to the discharge chamber 6 via the orifice 7. Next, when the voltage pulse applied to the electrode 11 is turned off and the stored electric charge is discharged, the diaphragm portion 5 is restored to the original position. By this restoring operation, the internal pressure of the discharge chamber 6 is rapidly increased, the ink filled in the discharge chamber 6 is pressurized, and ink droplets are discharged from the nozzle 4 toward the recording paper.

  In FIG. 1, a part of one inkjet head is illustrated, but actually, a concave portion that is a plurality of ink flow path patterns on a silicon substrate that is a wafer-like second substrate 2. 22 and 24 and the narrow groove 23 are formed by anisotropic etching, and the first substrate 1 and the third substrate 3 on which a plurality of electrodes 11 and nozzles 4 are respectively formed are bonded to the second substrate 2. After that, a predetermined portion is cut by dicing and divided into individual inkjet heads 10. In this way, a plurality of inkjet heads 10 can be manufactured simultaneously, and the mass productivity is excellent.

  Next, an ink jet printer which is a recording apparatus as a liquid droplet ejection apparatus equipped with the ink jet head 10 of this embodiment will be described with reference to FIG. FIG. 3 is a schematic view showing an ink jet printer. Specifically, it is a schematic view seen from the scanning direction of the carriage on which the inkjet head 10 is mounted.

  As shown in FIG. 3, the inkjet printer 400 includes a recording paper 401, feed rollers 402 and 405 that feed the recording paper 401, press rollers 403 and 404 that press the recording paper 401 corresponding to the feed rollers 402 and 405, and an inkjet printer. The inkjet head 10 fixed to the carriage 406 via the base member 43 so that the nozzle surface 44 of the head 10 is parallel to the print surface of the recording paper 401 at a predetermined interval, and the carriage supported on the carriage shaft 408. A belt 407 that moves the 406 in connection with a driving mechanism (not shown), an ink supply pipe 41 joined to the glass surface 45 of the inkjet head 10, and an ink tank member 409 that supplies ink stored in connection with the ink supply pipe 41. It consists of

  The ink jet printer 400 includes the face ink jet type ink jet head 10, and ink is supplied from the ink tank member 409 through the ink supply pipe 41 joined to the glass surface 45 of the ink jet head 10, and the ink jet head 10 is supplied with the ink. Ink is filled in the discharge chamber 6 (see FIG. 2) from the provided ink inlet 14 through the through hole 16 and the reservoir 8. That is, the ink supply direction K and the ink discharge direction L from the nozzle 4 are configured to be the same direction. Therefore, when the inkjet head 10 is driven, the ink droplets 42 are ejected onto the recording paper 401 positioned in parallel with the nozzle surface 44, and printing is performed by scanning the carriage 406 and feeding the recording paper 401.

  In addition, since the face ink jet type ink jet head 10 is not a type in which the ink supply pipe 41 is joined to the nozzle surface 44, the ink jet head 10 can be disposed close to the recording paper 401, and the print quality can be improved. it can. Further, the feed rollers 402 and 405 for feeding the recording paper 401 can be disposed in the vicinity of the inkjet head 10, and paper jam due to the floating of the recording paper 401 can be prevented.

  Hereinafter, in order to avoid complicated explanation, the glass substrate which is the first substrate 1 is called the glass substrate 1, the silicon substrate which is the second substrate 2 is called the silicon substrate 2, and the third substrate 3 is called the nozzle plate 3.

(First embodiment)
Next, the manufacturing method of the inkjet head 10 of one Embodiment of this invention is demonstrated based on FIGS. FIG. 4 is a manufacturing flow diagram illustrating the method of manufacturing the ink jet head according to the first embodiment. FIG. 5 is a schematic cross-sectional view of the inkjet head showing a processed state corresponding to the manufacturing flow of FIG.

  The glass substrate electrode forming step S <b> 101 is a step of forming electrodes constituting the electromechanical conversion element on the glass substrate 1. The glass substrate 1 in FIG. 5A is borosilicate glass having a thickness of 1 mm. As shown in FIGS. 5B and 5C, the glass substrate 1 is partitioned by forming an electrode 11 and a recess 15 for forming a lead portion 12 and a terminal portion 13 connected to the electrode 11 by a depth of about 0.28 μm. .

  In this etching method, the surface of the glass substrate 1 other than the recessed portion 15 to be etched is patterned so as to be masked with Cu—Au, and etched at room temperature with a mixed solution of ammonium fluoride and hydrogen peroxide solution. it can. Note that the recess 15 that becomes the vibration chamber 9 may be formed on the surface of the silicon substrate 2 facing the electrode 11 by anisotropic etching.

  Further, when the glass substrate 1 is etched, a positioning recess (not shown) for bonding the glass substrate 1 and the silicon substrate 2 is simultaneously etched on the etching surface of the glass substrate 1 or the opposite surface. May be. Or you may form the through-hole for positioning instead of a recessed part.

  Next, an ITO (Indium Tin Oxide) thin film is formed as an electrode material on the glass substrate 1 with a thickness of approximately 0.1 μm by vacuum deposition or vacuum sputtering. Then, a photoresist, which is a photosensitive resin, is coated on the surface of the formed ITO thin film, and exposed, developed, and etched using a photomask having the same pattern as the electrode, as shown in FIGS. 1 and 5C. The electrode 11, the lead part 12, and the terminal part 13 are formed.

  As the photoresist, a positive resist OFPR800 manufactured by Tokyo Ohka Co., Ltd. is used. The concave portion 15 is sectioned, and the glass substrate 1 on which the ITO thin film is formed is uniformly coated with a film thickness of about 1 μm by spin coating. . Etching of the ITO thin film is performed using aqua regia or a hydrochloric acid solution of iron chloride. After etching, the photoresist is peeled off from the glass substrate 1 using an inorganic alkaline solution or the like, and a glass substrate having a cross-sectional structure in which electrodes 11 and terminal portions 13 are partitioned on the bottom surface of the recess 15 as shown in FIG. 1 is formed.

  In the silicon substrate diaphragm forming step S102, the diaphragm 5 constituting the electromechanical conversion element 18, the recess 22 constituting the discharge chamber 6 forming the bottom of the diaphragm 5, and the reservoir 8 serving as a common ink cavity are provided. A step of forming the recesses 24 to be formed, and the recesses 22 and the narrow grooves 23 forming the orifices 7 communicating with the recesses 24 by anisotropic etching in the silicon substrate 2, and the recesses 22 and 24 and the narrow grooves And the step of forming the common electrode 26 on the silicon substrate 2 on which the substrate 23 is formed.

  FIG. 6A is a schematic cross-sectional view showing a silicon substrate. This silicon substrate 2 is obtained by polishing a silicon single crystal substrate on both sides to a thickness of 180 μm. Further, thermal oxidation is performed by heating at 1100 ° C. for 1 hour in the atmosphere, and an oxide film of SiO 2 is formed on the entire surface with a thickness of about 0.1 μm. This oxide film functions as the insulating layer 25 shown in FIG.

  FIG. 6B is a schematic cross-sectional view showing a state in which the silicon substrate is anisotropically etched. Similar to the glass substrate 1, the silicon substrate 2 is etched by photolithography. Etching is performed by immersing the silicon substrate 2 in a KOH aqueous solution. The thickness of the diaphragm portion 5 formed thereby is approximately 2 μm.

  FIG. 6C is a schematic cross-sectional view showing a state where a common electrode is formed on a silicon substrate. The common electrode 26 is formed by masking these ink flow paths on the silicon substrate 2 formed with the recesses 22 and 24 and the fine grooves 23, which are ink flow paths, and depositing Pt (platinum) by vacuum evaporation or vacuum sputtering. Etc. are formed.

  In the bonding step S103, the glass substrate 1 having the electrode 11 (FIG. 5C) and the silicon substrate 2 having the vibration plate portion 5 (FIG. 6C) are connected to the electrode 11 and the vibration plate portion 5 at a predetermined interval. And a anodic bonding in a state of being substantially closed in the vibration chamber 9 facing the vibration plate portion 5.

  FIG. 5D is a schematic cross-sectional view showing a state where the glass substrate 1 and the silicon substrate 2 are joined. In anodic bonding for bonding the glass substrate 1 and the silicon substrate 2, the silicon substrate 2 is connected to the positive electrode and the glass substrate 1 is connected to the negative electrode, and 700 to 900 V is applied at a temperature of 300 to 400 ° C. for about 5 minutes. Thereby, it is possible to perform bonding in which the silicon substrate 2 and the glass substrate 1 are completely adhered. As a result, the electrode 11 of the vibration chamber 9 and the vibration plate portion 5 are bonded with a predetermined interval with high accuracy, and a bonding strength and airtightness substantially equal to the strength of the substrate material can be obtained. Alternatively, the glass substrate 1 and the silicon substrate 2 may be bonded together with an adhesive as long as the glass substrate 1 and the silicon substrate 2 are completely adhered to each other, and the diaphragm portion 5 can be bonded to the electrode 11 while maintaining a predetermined dimension.

  The hermetic sealing step S104 is a step of hermetically sealing the bonded glass substrate 1 and silicon substrate 2 using an epoxy resin. In the joining step S103, the electrode 11 disposed opposite to the vibration plate portion 5 with a predetermined interval is substantially closed in the vibration chamber 9, but as shown in FIG. The recess 15 constituting the chamber 9 has an opening 32 by positioning the end of the silicon substrate 2 above the terminal portion 13 of the glass substrate 1. In the hermetic sealing step S104, the opening 32 is hermetically sealed by using the sealing material 31 that is an epoxy-based thermosetting resin, leaving the terminal portion 13 for a length necessary for subsequent drive circuit connection ( (Refer FIG.5 (e)). In the present embodiment, an epoxy-based thermosetting resin is used as the sealing material 31, but an acrylic-based photocurable resin, a silicon-based sealing material, or the like may be used as long as airtightness can be ensured.

  In the through-hole forming step S105, in order to guide ink to the concave portion 24 that is the reservoir 8 formed in the silicon substrate 2, the through-hole 16 that penetrates the bonded glass substrate 1 and the silicon substrate 2 is used as the ink intake port 14. It is a process of forming.

  In this through-hole forming step S105, a high-pressure is first applied from the glass substrate 1 side after the first perforating step and the first perforating step after the first perforating step. This is constituted by a second drilling step in which the remaining part of the glass substrate 1 and the silicon substrate 2 before penetrating is broken and punched by a jet drilling method using a water flow.

  FIG. 7 is a schematic cross-sectional view showing a drilling method. FIG. 7A shows the first drilling step. First, a hole is drilled from the glass substrate 1 to a position where the glass substrate 1 is not penetrated by using a diamond drill 60. In this embodiment, since the thickness of the glass substrate 1 is 1 mm, it was drilled with a diamond drill 60 of φ0.8 mm to a depth of about 0.6 mm. Depending on the size of the hole to be drilled, a small hole may be drilled first and then a larger hole may be drilled in stages. This is because if the hole is forcibly formed, chipping and cracks occur at the ink intake port 14 of the glass substrate 1, and ink leakage may occur when the ink supply pipe 41 is connected later. FIG. 5 (f) shows a state where the first drilling process has been completed.

  Next, FIGS. 7B and 7C show a second drilling step. A high-pressure water flow 71 is guided from the jet nozzle 70 to the hole 16c formed in the first drilling step, and the remaining 0.4 mm of the glass substrate 1 and the bottom surface of the recess 24 serving as the reservoir 8 of the silicon substrate 2 are simultaneously punched. Thus, the through hole 16 shown in FIG. According to this method, the through-hole 16 can be formed without causing a step in the middle.

  Further, since the bonded glass substrate 1 and the silicon substrate 2 are sealed in the airtight sealing step S104 in the previous step, the cutting scraps and substrate fragments 72 generated in the first drilling step and the second drilling step. Or the like can be prevented from adhering to the electrode 11 constituting the electromechanical transducer 18. Further, the broken substrate 72 can be prevented from being blown away by the high-pressure water flow 71 and reattaching to the silicon substrate 2. In order to prevent the surface of the glass substrate 1 where the ink inlet 14 is formed from being damaged by the high-pressure water flow 71 from the jet nozzle 70, a mask for protecting the surfaces other than the ink inlet 14 after the first perforation process is provided. Preferably, the second drilling step is performed.

  Further, in order to easily and accurately form the second drilling step, in addition to the diaphragm forming step S102 of the silicon substrate 2, the silicon substrate is previously formed on the bonding surface with the glass substrate 1 corresponding to the position of the through hole 16 in advance. If the pits as recesses are etched in 2, the high-pressure water flow 71 in the second drilling step can be easily broken from the pits and punched with high precision to form the through holes 16.

  Next, in the nozzle plate groove forming step S106 and the nozzle forming step S107, the narrow groove 17 constituting the orifice 7 connecting the concave portion 24 serving as the reservoir 8 and the concave portion 22 serving as the discharge chamber 6 which are partitioned and formed in the previous silicon substrate 2. And a step of forming the nozzles 4 for discharging ink corresponding to the plurality of discharge chambers 6 formed in a partitioned manner.

  8A to 8C are schematic cross-sectional views showing a nozzle plate groove forming step and a nozzle forming step. FIG. 8A shows the nozzle plate 3. In the present embodiment, a silicon thin plate is used as the material of the nozzle plate 3. Accordingly, the narrow groove 17 and the nozzle hole 4a are formed by the same method as that in which the concave portions 22, 24 and the narrow groove 23 are formed in the previous silicon substrate 2 by anisotropic etching. Then, the nozzle 4 is dry-etched by plasma etching using a corrosive gas on the silicon thin plate to open a plurality of nozzles 4 at a time (see FIGS. 8B and 8C).

  The discharge chamber forming step S108 is a step of joining the nozzle plate 3 to the silicon substrate 2 to form an ink flow path constituted by the reservoir 8, the orifice 7 connected to the discharge chamber 6, and the discharge chamber 6. FIG. 5H is a schematic cross-sectional view showing the discharge chamber forming step. The nozzle plate 3 and the silicon substrate 2 are bonded by heating and pressing with an epoxy thermosetting resin.

  In the cutting step S109, the above-described plurality of inkjet heads 10 having a three-layer structure of the glass substrate 1 having the electrode 11, the silicon substrate 2 having the vibration plate portion 5, and the nozzle plate 3 as described above are placed at predetermined positions. This is a step of separating the ink jet heads 10 by dicing.

  The head assembly step S110 includes an electrostatic actuator having an electromechanical conversion element 18 between the common electrode 26 on the silicon substrate 2 provided in one inkjet head 10 and the terminal portion 13 connected to the electrode 11 of the glass substrate 1. 19 is a step of connecting a circuit board such as an FPC on which a driver IC 50 for driving 19 is mounted using an ACF (Anisotropic Conductive Film) or the like.

The effects of the first embodiment are as follows.
(1) A state in which the glass substrate 1 having the electrode 11 and the silicon substrate 2 having the vibration plate portion 5 are opposed to the vibration plate portion 5 with a predetermined distance and the electrode 11 is substantially closed by the vibration chamber 9. After the bonding step S103 bonded to the through hole, a through hole forming step S105 for forming a through hole 16 for guiding ink to the reservoir 8 is provided. For this reason, it is possible to prevent foreign matter 61 such as cutting waste generated in the through-hole forming step S105 from adhering to the electrode 11 constituting the electromechanical transducer 18. Thereby, the inkjet head 10 having the electrostatic actuator 19 provided with the electromechanical conversion element 18 can be manufactured in a state where the foreign matter defect is small and the yield is good.
(2) The through-hole forming step S105 includes a first drilling step of drilling from the glass substrate 1 to a position that is not less than half of the thickness of the glass substrate 1 and that does not penetrate, and the glass substrate 1 side after the first drilling step. And a second drilling step in which the remaining part of the glass substrate 1 and the silicon substrate 2 before penetrating is broken by punching and penetrating in a jet drilling method using a high-pressure water flow. At this time, the high-pressure water flow 71 is guided from the jet nozzle 70 to the hole 16c formed in the first drilling step, and the remaining portion of the glass substrate 1 and the bottom surface of the recess 24 serving as the reservoir 8 of the silicon substrate 2 are simultaneously punched. Since the through hole 16 is formed, the through hole 16 can be formed without causing a step in the middle. Further, since the bonded glass substrate 1 and the silicon substrate 2 are sealed in the airtight sealing step S104 in the previous step, the cutting scraps and substrate fragments 72 generated in the first drilling step and the second drilling step. Or the like can be prevented from adhering to the electrode 11 constituting the electromechanical transducer 18. Further, the broken substrate 72 can be prevented from being blown away by the high-pressure water flow 71 and reattaching to the silicon substrate 2.

(Second Embodiment)
Another embodiment of the ink jet head manufacturing method to which the present invention is applied will be described with reference to FIGS. FIG. 9 is a manufacturing flow diagram illustrating a method of manufacturing the ink jet head according to the second embodiment. FIG. 10 is a schematic cross-sectional view of the inkjet head showing the manufacturing process corresponding to the manufacturing flow of FIG. Note that, in the second embodiment, the description will focus on parts that are different from the first embodiment. In addition, an ink jet printer 400 that is a recording apparatus as a liquid droplet ejection apparatus equipped with the ink jet head according to the second embodiment is the same as that described above as a basic structure, and a description thereof will be omitted.

  The first through-hole forming step S201 is a step of forming the first through-hole 16a serving as the ink intake port 14 and the ink flow path in the glass substrate 1 in order to guide the ink to the reservoir 8 formed in the silicon substrate 2. . Fig.10 (a) is a schematic sectional drawing which shows a glass substrate. The glass substrate 1 is made of borosilicate glass having a thickness of 1 mm. FIG. 10B is a schematic cross-sectional view in which the first through hole is formed in the glass substrate. The first through hole 16a is cut using a diamond drill 60 having a size of φ0.8 mm.

  In this case, chipping and cracks due to drilling are likely to occur on the penetrating side of the first through hole 16a, and when the ink supply pipe 41 is joined later and ink is filled, the ink may leak from the chipping or crack portion. It is preferable that the perforation is performed separately so as to perforate from both sides of the glass substrate 1 so as not to occur. Moreover, it is preferable not to forcibly drill at a time, but to drill small holes first and gradually increase the size.

  In the silicon substrate diaphragm forming step S202, the diaphragm 5 constituting the electromechanical conversion element 18, the recess 22 constituting the discharge chamber 6 forming the bottom of the diaphragm 5, and the reservoir 8 serving as a common ink cavity are provided. A step of forming the recesses 24 to be formed, and the recesses 22 and the narrow grooves 23 forming the orifices 7 communicating with the recesses 24 by anisotropic etching in the silicon substrate 2, and the recesses 22 and 24 and the narrow grooves And the step of forming the common electrode 26 on the silicon substrate 2 on which the substrate 23 is formed. The processing method is the same as in the silicon substrate diaphragm forming step S102 of the first embodiment shown in FIGS. 6A to 6C, and the diaphragm 5 is also formed to a thickness of about 2 μm. .

  The glass substrate electrode forming step S203 is a step of forming the electrode 11 constituting the electromechanical transducer 18 on the glass substrate 1 in which the first through-hole 16a is formed. As shown in FIG. 10C, the glass substrate 1 is formed with a recess 15 in which the electrode 11 and the lead portion 12 and the terminal portion 13 connected to the electrode 11 are disposed by etching at a depth of about 0.28 μm. This etching method is the same as the glass substrate electrode formation step S101 of the first embodiment.

  Next, an electrode is formed on the glass substrate 1 on which the recess 15 is formed. As an electrode material, an ITO (Indium Tin Oxide) thin film is formed on the glass substrate 1 with a thickness of about 0.1 μm by vacuum deposition or vacuum sputtering. Then, a photoresist, which is a photosensitive resin, is coated on the surface of the formed ITO thin film, exposed, developed, and etched using a photomask having the same pattern as the electrode, as shown in FIGS. 1 and 10 (d). The electrode 11, the lead part 12, and the terminal part 13 are formed.

  As a photoresist coating method in this case, since the first through hole 16a is already formed in the glass substrate 1, in the spin coating method, resist coating unevenness occurs in the vicinity of the first through hole 16a. Therefore, the photoresist is coated by a slit coating method or a spray coating method. The thickness of the photoresist is about 1.5 μm, and the solvent component is volatilized by the drying process after coating, and the film thickness becomes about 1.2 μm.

  The ITO thin film etching method and the post-etching photoresist removal method are the same as in the electrode forming step S101 of the glass substrate of the first embodiment. Peel off.

  According to such a glass substrate electrode forming step S203, the first through hole 16a is drilled in advance and then the electrode is formed. Therefore, foreign matter such as cutting chips generated in the first through hole forming step S201 is removed. If this electrode formation step S203 is performed after removing by a method such as RCA cleaning, the electrode 11 constituting the electromechanical conversion element 18 can be formed without adhering foreign matter.

  In the bonding step S204, the glass substrate 1 having the electrode 11 (FIG. 10D) and the silicon substrate 2 having the vibration plate portion 5 (FIG. 6C) are connected to the electrode 11 at a predetermined interval. And a anodic bonding in a state of being substantially closed in the vibration chamber 9 facing the vibration plate portion 5. This anodic bonding method is the same as the bonding step S103 of the first embodiment, and bonding is performed as shown in the schematic cross-sectional view of FIG.

  The hermetic sealing step S205 is a step of hermetically sealing the bonded glass substrate 1 and silicon substrate 2 using an epoxy resin. By the joining step S204, the electrode 11 disposed facing the diaphragm portion 5 with a predetermined interval is substantially closed in the vibration chamber 9, but this vibration is shown in FIG. 10 (e). The recess 15 constituting the chamber 9 has an opening 32 by positioning the end of the silicon substrate 2 above the terminal portion 13 of the glass substrate 1. In the hermetic sealing step S205, the opening portion 32 is hermetically sealed by using the sealing material 31 that is an epoxy-based thermosetting resin, leaving the terminal portion 13 for a length necessary for subsequent drive circuit connection ( (See FIG. 10 (f))

  In the second through-hole forming step S206, after the glass substrate 1 having the electrode 11 and the silicon substrate 2 having the vibration plate portion 5 are joined, the second through-hole forming step S206 communicates with the first through-hole 16a and penetrates the silicon substrate 2. This is a step of forming two through holes 16b.

  FIG. 10G is a schematic cross-sectional view showing a state where the second through hole is formed. As a method for drilling the second through-hole 16b, a high-pressure water flow 71 is guided through the first through-hole 16a formed in the glass substrate 1, and the silicon substrate 2 is fractured and punched with the high-pressure water flow 71 to form a second A jet drilling method for forming the through hole 16b is used. According to this method, the glass substrate 1 that already has the electrode 11 and the silicon substrate 2 that has the vibration plate portion 5 are arranged in the vibration chamber 9 so that the electrode 11 that is disposed to face the vibration plate portion 5 at a predetermined interval is provided in the vibration chamber 9. Since it is joined in the closed state, the broken pieces of the silicon substrate 2 that have been punched and broken are not attached to the electrode 11. Further, since the debris is blown away by the high-pressure water flow 71, it can be prevented from reattaching to the silicon substrate 2. Furthermore, since it is always drilled from the direction of the first through hole 16a, it is possible to prevent the first through hole 16a and the second through hole 16b from being misaligned. Further, the second through hole may be formed in advance by anisotropic etching in the diaphragm forming step S202 on the silicon substrate 2.

  The nozzle plate groove forming step S207 and the nozzle forming step S208 include a narrow groove 17 constituting the orifice 7 connecting the concave portion 24 to be the reservoir 8 and the concave portion 22 to be the discharge chamber 6 which are partitioned and formed in the previous silicon substrate 2. This is a step of forming nozzles 4 for discharging ink corresponding to the plurality of discharge chambers 6 formed in a partitioned manner. In the present embodiment, a silicon thin plate is used as the material of the nozzle plate 3. Therefore, these processing methods are processed by the same method as the nozzle plate groove forming step S106 and the nozzle forming step S107 of the first embodiment shown in FIGS.

  The discharge chamber forming step S209 is a step in which the nozzle plate 3 is joined to the silicon substrate 2 to form an ink flow path including the reservoir 8, the orifice 7 connected to the discharge chamber 6, and the discharge chamber 6. FIG. 10H is a schematic cross-sectional view showing the discharge chamber forming step. The nozzle plate 3 and the silicon substrate 2 are bonded by heating and pressing with an epoxy thermosetting resin.

  The subsequent cutting step S210 and head assembly step S211 are the same as the cutting step S109 and head assembly step S110 of the first embodiment.

The effects of the second embodiment are as follows.
(1) After the first through hole forming step S201 in which the first through hole 16a for guiding ink to the reservoir 8 is formed in the glass substrate 1, the electrode 11, the lead portion 12, and the terminal portion 13 are formed in the glass substrate 1. Since the electrode forming step S203 is provided, the electrode forming step S203 can be performed after removing the foreign matter 61 such as cutting chips generated in the first through hole forming step S201. Therefore, the foreign matter 61 can be prevented from adhering to the electrode 11 constituting the electromechanical conversion element 18.
(2) After the first through hole forming step S201 for forming the first through hole 16a in the glass substrate 1, an electrode forming step S203 for forming the electrode 11, the lead portion 12, and the terminal portion 13 on the glass substrate 1 is provided. Therefore, a method such as acid cleaning that cannot be used for cleaning after electrode formation can be used as a method of removing foreign matter such as cutting waste generated in the first through-hole forming step S201. That is, the range of selection of the cleaning method is widened, and foreign matters can be reliably removed.
(3) In the second through-hole forming step S206, the high-pressure water stream 71 is guided through the first through-hole 16a formed in the glass substrate 1, and the silicon substrate 2 is fractured and punched by the high-pressure water stream 71 to perform the second penetration. A jet drilling method for forming the holes 16b is used. At this time, the electrode 11, which is disposed so as to face the glass substrate 1 having the electrode 11 and the silicon substrate 2 having the vibration plate portion 5 at a predetermined interval, is substantially closed by the vibration chamber 9. Since it is bonded to the state, the broken piece of the silicon substrate 2 that has been punched and broken does not adhere to the electrode 11. Further, since the debris is blown away by the high-pressure water flow 71, it can be prevented from reattaching to the silicon substrate 2. Furthermore, since it is always drilled from the direction of the first through hole 16a, it is possible to prevent the first through hole 16a and the second through hole 16b from being misaligned.

Modifications of the above embodiments are as follows.
(Modification 1) In the through-hole forming step S105 in the first embodiment and the first through-hole forming step S201 and the second through-hole forming step S206 in the second embodiment, the jet holes by the diamond drill 60 or the high-pressure water flow 71 are used. Although the drilling method was used, a drilling method using a laser beam such as a carbon dioxide gas laser can also be employed for the drilling.
(Modification 2) The through hole is not limited to the flow path of liquid such as ink. For example, a flow path that communicates in common with the terminal portion 13 formed in a plurality of sections on the glass substrate 1 and two through holes connected to the flow path are formed. If the silicon substrate 2 is bonded, in the hermetic sealing step S104, the fluid sealing material 31 is injected from one of the two through holes and sucked from the other, so that the sealing material 31 is connected to the glass substrate 1. The gap formed by the silicon substrate 2 is filled. That is, the flow path may be a passage of the sealing material 31 that hermetically seals each vibration chamber 9. According to this, the sealing part can be designed more compactly, and the inkjet head 10 can be reduced in size. In this case, the two through holes are preferably drilled before the electrode 11 is formed.
(Modification 3) The through hole is not limited to a liquid such as ink. For example, when the vibration chamber 9 is hermetically sealed, the vibration plate portion 5 bends so as to eliminate the pressure difference between the internal pressure and the external pressure of the vibration chamber 9, and thus the distance between the electrode 11 and the vibration plate portion 5. There is a possibility that vibration variation is caused by fluctuation of (gap). In order to prevent this, a diaphragm for pressure compensation may be provided in the ink jet head. This pressure compensating diaphragm has a structure including two chambers on both sides of a partition formed on the second substrate, and the first chamber communicates with the vibration chamber 9 and the second chamber It communicates with the atmosphere through the atmosphere communication hole. The through hole may be such an air communication hole. Note that the first chamber constituting the diaphragm is formed by a recess formed in at least one of the first substrate and the second substrate, and the second chamber is formed by the second substrate and the third substrate. It is formed by a recess formed in at least one of them.
(Modification 4) The through hole is not limited to the flow path of liquid such as ink. For example, an ink intake port (hole) is formed on the surface of the third substrate (nozzle plate) opposite to the second substrate side, and ink is supplied to the discharge chamber through a conduit connected to the ink intake port. In the case of the droplet discharge head having the configuration, the through hole may be a passage that communicates the chamber of the electromechanical conversion element with the atmosphere.
(Modification 5) In the inkjet head 10 of the present embodiment, the liquid to be filled is not limited to ink. For example, the functional liquid that is discharged when a color filter or an organic EL display device is manufactured by an inkjet method may be filled in the inkjet head 10 as a liquid.
Alternatively, a cleaning liquid for cleaning the ink flow path formed inside the inkjet head 10 may be used.

The technical idea grasped from each of the above-described embodiments and modifications is as follows.
(1) The flow path of the fluid formed in the through-hole forming step includes a through-hole penetrating at least the first substrate out of the first substrate and the second substrate bonded together. An actuator manufacturing method and a droplet discharge head manufacturing method.
(2) The flow path of the fluid formed in the through-hole forming step passes through the first substrate of the first substrate and the second substrate that are joined, and the electromechanical conversion element Manufacturing method of electrostatic actuator and manufacturing method of liquid droplet ejection head, wherein the electrode constituting the electrode is a flow path forming a part of a ventilation path communicating with a chamber disposed opposite to the diaphragm portion at a predetermined interval .
(3) In the first through hole forming step, the surface of the first substrate on which the electrode is formed is bonded to the second substrate, and the first substrate is bonded to the second substrate. A manufacturing method of an electrostatic actuator and a manufacturing method of a droplet discharge head in which the first through hole is formed by drilling from both sides opposite to the surface.
(4) The joining step of joining the electrode in a state of being substantially closed in a chamber facing the diaphragm portion while being arranged to face the diaphragm portion with a predetermined interval is performed on the second substrate. A manufacturing method of an electrostatic actuator and a manufacturing method of a droplet discharge head, which are formed on a surface to be bonded to the first substrate, forming a concave portion constituting a vibration plate portion and bonded to the first substrate having the electrode.

FIG. The schematic sectional drawing cut | disconnected by the AA line after joining in FIG. Schematic diagram of an ink jet printer. FIG. 3 is a manufacturing flow diagram illustrating a method for manufacturing the ink jet head according to the first embodiment. FIG. 5 is a schematic cross-sectional view (a) to (i) of an ink jet head showing a processed state corresponding to the manufacturing flow of FIG. 4. Schematic sectional drawing (a)-(c) which shows the diaphragm formation process of a silicon substrate. Schematic sectional drawing (a)-(c) which shows a drilling method. Schematic sectional drawing (a)-(c) which shows the groove | channel formation process and nozzle formation process of a nozzle plate. The manufacturing flowchart which shows the manufacturing method of the inkjet head of 2nd Embodiment. FIG. 10 is a schematic cross-sectional view (a) to (i) of an inkjet head showing a manufacturing process corresponding to the manufacturing flow of FIG. 9. The schematic sectional drawing which shows the conventional through-hole processing method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Glass substrate as 1st board | substrate, 2 ... Silicon substrate as 2nd board | substrate, 3 ... Nozzle plate as 3rd board | substrate, 4 ... Nozzle, 5 ... Diaphragm part, 6 ... Discharge chamber, 9 ... Vibration chamber as a chamber, 10 ... inkjet head, 11 ... electrode, 12 ... lead portion, 13 ... terminal portion, 14 ... ink intake port, 16 ... through hole, 16a ... first through hole, 16b ... second penetration Hole 18, electromechanical transducer 19, electrostatic actuator 15, 22, 24, recess, 17, 23, narrow groove 42, ink droplet as droplet, 71, high pressure water flow, 400, droplet ejection device S101, S203 ... Glass substrate electrode forming step, S102, S202 ... Silicon substrate vibrating plate forming step, S103, S204 ... Bonding step, S104, S205 ... Airtight sealing step, S 05 ... through hole forming step, S106, S207 ... groove forming step of the nozzle plate, S107, S208 ... nozzle forming step, S108, S209 ... discharge chamber forming step, S109, S210 ... cutting step, S110, S211 ... head assembly process.

Claims (13)

A method of manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval,
A chamber in which the first substrate having the electrode and the second substrate having the diaphragm portion are arranged to face the diaphragm portion with a predetermined distance between the electrode and the diaphragm portion. A joining step for joining in a substantially closed state;
A method of manufacturing an electrostatic actuator, comprising: a through hole forming step of forming a through hole forming a fluid flow path in at least one of the bonded first substrate and the second substrate. . A method of manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval,
A chamber in which the first substrate having the electrode and the second substrate having the diaphragm portion are arranged to face the diaphragm portion with a predetermined distance between the electrode and the diaphragm portion. A joining step for joining in a substantially closed state;
Passing through the first substrate and the second substrate through a through hole forming at least a part of a flow path for guiding a fluid to a position pressurized by the diaphragm portion of the electromechanical transducer, A manufacturing method of an electrostatic actuator, comprising: a through hole forming step formed at a position not communicating with the chamber. The through-hole forming step includes a first drilling step of drilling from the first substrate to a position that is not less than half of the thickness of the first substrate and does not penetrate the first substrate;
After the first drilling step, the remaining part of the first substrate and the second substrate before penetrating is broken and punched by a jet drilling method using a high-pressure water flow from the first substrate side. The method for manufacturing an electrostatic actuator according to claim 2, further comprising a second drilling step of forming the through hole. A method of manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval,
A first through hole forming step of forming a first through hole forming a fluid flow path in the first substrate;
An electrode forming step of forming an electrode on the first substrate in which the first through hole is formed;
The first substrate on which the electrode is formed and the second substrate having the diaphragm portion are disposed so as to face the diaphragm portion with a predetermined distance, and the diaphragm portion and the surface. A joining step for joining in a substantially blocked state in the room
And a second through hole forming step of forming a second through hole communicating with the first through hole in the second substrate bonded to the first substrate. Actuator manufacturing method. A method of manufacturing an electrostatic actuator having an electromechanical conversion element in which an electrode and a diaphragm portion are arranged to face each other at a predetermined interval,
A first through-hole forming at least a part of a flow path for guiding a fluid to a position pressurized by the diaphragm portion of the electromechanical transducer is provided, and the electrode is spaced from the diaphragm portion by a predetermined distance. A first through-hole forming step that is formed in the first substrate at a position that does not communicate with the chamber facing the diaphragm portion and being opposed to the diaphragm,
Forming an electrode on the first substrate in which the first through-hole is formed;
The first substrate on which the electrode is formed and the second substrate having the diaphragm portion are disposed so as to face the diaphragm portion with a predetermined interval, and the diaphragm portion A joining step for joining in a substantially closed state in the facing room;
And a second through hole forming step of forming a second through hole communicating with the first through hole in the second substrate bonded to the first substrate. Actuator manufacturing method.   In the second through-hole forming step, the second substrate is broken and punched by a jet punching method using a high-pressure water flow from the first through-hole side formed in the first substrate. The method of manufacturing an electrostatic actuator according to claim 5, wherein a through hole is formed.   Before forming the electrode on the first substrate, a hole for forming a positioning recess or through hole in the first substrate for bonding the first substrate and the second substrate is formed. The method for manufacturing an electrostatic actuator according to claim 1, further comprising a step. An electrostatic actuator having an electromechanical conversion element in which an electrode and a vibration plate portion are arranged to face each other with a predetermined interval pressurizes a liquid filled in a discharge chamber located facing the vibration plate portion. In a manufacturing method of a droplet discharge head that discharges droplets from a nozzle by
A chamber in which the first substrate having the electrode and the second substrate having the diaphragm portion are arranged to face the diaphragm portion with a predetermined distance between the electrode and the diaphragm portion. A joining step for joining in a substantially closed state;
A droplet discharge head manufacturing method comprising: a through-hole forming step for forming a through-hole forming a fluid flow path in at least one of the bonded first substrate and the second substrate. Method. An electrostatic actuator having an electromechanical conversion element in which an electrode and a vibration plate portion are arranged to face each other with a predetermined interval pressurizes a liquid filled in a discharge chamber located facing the vibration plate portion. In a manufacturing method of a droplet discharge head that discharges droplets from a nozzle by
A chamber in which the first substrate having the electrode and the second substrate having the diaphragm portion are arranged to face the diaphragm portion with a predetermined distance between the electrode and the diaphragm portion. A joining step for joining in a substantially closed state;
A through-hole forming step of forming a through-hole for penetrating the bonded first substrate and the second substrate and guiding the liquid to the discharge chamber at a position not communicating with the chamber;
A method of manufacturing a droplet discharge head, comprising: a discharge chamber forming step of forming the discharge chamber by bonding a third substrate to the second substrate after the through hole forming step. . An electrostatic actuator having an electromechanical conversion element in which an electrode and a vibration plate portion are arranged to face each other with a predetermined interval pressurizes a liquid filled in a discharge chamber located facing the vibration plate portion. In a manufacturing method of a droplet discharge head that discharges droplets from a nozzle by
A first through hole forming at least a part of a flow path for guiding the liquid pressurized by the electrostatic actuator to the discharge chamber is provided, and the electrode is provided on the first substrate with a predetermined distance from the diaphragm portion. A first through-hole forming step that is disposed opposite to the chamber and is formed at a position that does not communicate with the chamber facing the diaphragm portion;
An electrode forming step of forming the electrode on the first substrate in which a first through hole is formed;
The first substrate on which the electrode is formed and the second substrate having the diaphragm portion are disposed so as to face the diaphragm portion with a predetermined interval, and the diaphragm portion A joining step for joining in a substantially closed state in the facing room;
A second through hole forming step of forming a second through hole communicating with the first through hole in the second substrate bonded to the first substrate;
A droplet discharge head comprising: a discharge chamber forming step of forming the discharge chamber by bonding a third substrate to the second substrate after the second through-hole forming step. Production method.   An electrostatic actuator manufactured using the method for manufacturing an electrostatic actuator according to claim 1.   A droplet discharge head manufactured using the method of manufacturing a droplet discharge head according to claim 8. A liquid droplet ejection apparatus comprising the liquid droplet ejection head according to claim 12.

Images