JP4578312B2 - Electronic component storage container - Google Patents

Description

  The present invention relates to an electronic component storage container for mounting electronic components such as semiconductor elements and capacitive elements.

  Conventionally, an electronic component storage container for storing an electronic component such as a semiconductor element or a capacitive element is made of ceramics such as an aluminum oxide sintered body or a glass ceramic sintered body, and is a recess for storing the electronic component. Has a structure including an insulating base formed on the upper surface and wiring conductors for signals and grounds led out from the inside to the outside of the recess of the insulating base.

  A mounting portion for mounting an electronic component is provided in the concave portion on the upper surface of the insulating base, and a wiring conductor that is electrically connected to the electrode of the electronic component is formed in the mounting portion or its periphery. In addition, the wiring conductor is led out to the lower surface of the insulating base, and an external connection pad for electrically connecting the wiring conductor to the external electric circuit is electrically connected to the wiring conductor on the lower surface of the insulating base. Is formed.

Then, an electronic component is mounted on the mounting portion, electrodes for signal and grounding of the electronic component are connected to the wiring conductor via a connecting material such as a bonding wire and solder, and the electronic component is attached to the lid as necessary. By sealing with a sealing resin or the like, an electronic device such as a power amplifier module is formed. By electrically and mechanically connecting the external connection pad of such an electronic device to an external electric circuit via solder or the like, the electrode of the electronic component is electrically connected to the external electric circuit via the wiring conductor and the external connection pad. Connected. Such an electronic component storage container is made by forming raw powders such as aluminum oxide and silicon oxide into a sheet shape together with an organic solvent and an organic binder to produce a plurality of ceramic green sheets, and wiring conductors and external connection pads are formed on the ceramic green sheets. It is manufactured by printing a metal paste to be processed, cutting and punching, and then laminating and firing.
Japanese Patent Laid-Open No. 2004-241583 JP 2003-60106 A

  Recently, electronic component storage containers have become more functional and electronic components have higher frequencies, and the number of components mounted on external electrical circuits has increased, causing electronic components to be affected by noise from other components and causing malfunctions. It may happen. For this reason, there is a technique for forming a grounding conductor layer having a large area on the lower surface side of the electronic component storage container by using the same metal paste as that for forming the wiring conductor to cope with noise from the outside. Has come to be taken.

  However, when a large-sized conductor layer with a large amount of metal paste is printed on the lower surface of the insulating base in this way, there is a difference in the contraction start time and the difference in contraction behavior between the ceramic green sheet and the metal paste during firing. The accompanying stress increases between the upper and lower surfaces of the ceramic green sheet laminate, and the difference in stress causes a problem that the insulating base is likely to be deformed such as warpage. That is, since the stress generated between the conductor layer (metal paste) having a large area and the insulating base (ceramic green sheet) on the lower surface side of the electronic component storage container is relatively large, the conductive base is formed on the insulating base. It tends to warp so as to be convex on the lower surface side.

  Specifically, since the contraction of the conductor layer (metal paste) is smaller than the contraction of the insulating base (ceramic green sheet), it tends to contract on the upper surface side and hardly contract on the lower surface side. Therefore, the amount of contraction on the upper surface side is larger than the amount of contraction on the lower surface side, resulting in convex warpage on the lower surface side.

  In addition, a concave portion is formed on the upper surface of the insulating base, and a tensile stress tends to be generated inward in the frame-shaped portion surrounding the concave portion of the insulating base. It tends to cause warpage that is convex to the side.

  When the insulating base is warped, it becomes difficult to normally connect the electrodes of the electronic components of the mounting portion and the wiring conductor, and the external connection pads and the external electric circuit.

  The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide an electronic component housing that can effectively prevent deformation such as warping of an insulating base, and has high functionality and easy high frequency response. Is to provide a container.

The electronic component storage container of the present invention has a recess formed on the upper surface of the insulating base and a mounting portion on which the electronic component is mounted on the bottom surface of the concave, and is electrically connected to the electronic component on the lower surface of the insulating base. An electronic component storage container provided with an external connection pad, wherein a conductor layer having an outer circumference extending outward from the outer circumference of the mounting portion is attached to the lower surface of the insulating base and the conductor layer A ceramic layer is deposited thereon, and the external connection pad is formed by providing a non-formed portion in the ceramic layer to expose a part of the conductor layer, and the ceramic layer is formed by the insulating layer. the ceramic material of the ceramic and syngeneic for forming the substrate as a main component, and has contains a metal oxidation product, the metal oxidation product _{is, Fe 2 O 3, MnO 2} , MoO 2, CoO, Cr 2 O 3 And this It is characterized in that comprising at least one of the composite oxide.

  In the electronic component storage container of the present invention, the insulating base, the ceramic layer, and the conductor layer are formed by simultaneous firing.

  Furthermore, the electronic component storage container of the present invention is characterized in that the insulating base has a rectangular shape, and the non-formed portions are arranged along opposing sides of the lower surface of the insulating base. is there.

  Furthermore, the electronic component storage container of the present invention is characterized in that the insulating base has a rectangular shape, and a part of the ceramic layer extends to the four corners of the lower surface of the insulating base. is there.

  According to the electronic component storage container of the present invention, the conductor layer having the outer periphery extending outward from the outer periphery of the mounting portion is deposited on the lower surface of the insulating base, and the ceramic layer is deposited on the conductor layer. Therefore, the stress caused by the difference in shrinkage behavior between the conductor layer and the ceramic green sheet (insulating base) can be effectively canceled by the stress caused by the difference in shrinkage behavior between the ceramic layer and the conductor layer. As a result, it is possible to effectively prevent deformation such as warpage in the insulating substrate. That is, compared with a conductor layer (metal paste), for example, a ceramic layer formed by firing a ceramic paste has a larger shrinkage amount when fired than a conductor layer, so that an insulating substrate is interposed between the ceramic layer and the conductor layer. Is generated such that the protrusion is convex toward the upper surface (the stress opposite to the stress that causes the insulating base to be convex toward the lower surface).

  Further, according to the electronic component storage container of the present invention, since the external connection pad is formed by providing a non-formed portion in the ceramic layer and exposing a part of the conductor layer, the conductor layer is formed on the lower surface of the insulating base. In addition, even if it is formed to extend outward from the outer periphery of the mounting portion, the external connection pads, particularly the external connection pads for grounding that require a large area for effective grounding, are efficiently provided on the lower surface of the insulating base. It can be formed well and easily.

  Furthermore, according to the electronic component storage container of the present invention, the insulating base, the ceramic layer, and the conductor layer are formed by simultaneous firing, resulting in a difference in contraction behavior between the conductor layer and the ceramic green sheet (insulating base). The effect of canceling the stress with the stress caused by the difference in shrinkage behavior between the ceramic layer and the conductor layer can be obtained more effectively. As a result, it is possible to more effectively prevent the insulating base from being deformed such as warping that protrudes toward the lower surface.

Furthermore, according to the electronic component container of the present invention, the ceramic layer is mainly composed of an insulating substrate and syngeneic ceramic materials has been and is formed of a material containing a metal oxide, a metal oxidation product, By comprising at least one of Fe ₂ O ₃ , MnO ₂ , MoO ₂ , CoO, Cr ₂ O ₃ and complex oxides thereof, the metal oxide increases the shrinkage of the ceramic forming the ceramic layer. Therefore, it is possible to increase the stress generated between the ceramic layer and the conductor layer (stress in a direction that causes the insulating base to bend upwardly), even if the ceramic layer is thinner than the insulating base. The stress that effectively cancels the stress that occurs between the conductor layer and the insulating base (stress that causes the insulating base to protrude convexly on the lower surface side) can be generated more reliably. . As a result, it is possible to more reliably prevent the warpage of the insulating substrate.

  Furthermore, according to the electronic component storage container of the present invention, the insulating base is formed in a rectangular shape, and the non-formed portion is disposed along the opposite sides of the lower surface of the insulating base, thereby providing a conductor layer exposed in the non-formed portion. The external connection pads to be formed are arranged along the outer side of the lower surface of the insulating base, so that the connection to the external electric circuit is easy, and the connection reliability, workability, and practicality are improved.

  Further, in this case, the non-formed portion is disposed along the opposing sides on the lower surface of the rectangular insulating base suitable for storing the electronic component, so that the conductor layer and the ceramic layer are disposed between the opposing sides. It is possible to more reliably align the stress generated between the two. As a result, the influence of stress due to the difference in contraction behavior between the conductor layer and the ceramic green sheet is more uniformly mitigated, and it is possible to more effectively prevent deformation such as warping in the insulating substrate. Can do.

  Furthermore, according to the electronic component storage container of the present invention, the insulating substrate has a rectangular shape, and a part of the ceramic layer extends to the four corners of the lower surface of the insulating substrate, whereby the shrinkage behavior between the conductor layer and the ceramic green sheet is achieved. The influence of the stress caused by the difference can be relaxed in a wider range, and deformation such as warpage can be more effectively prevented from occurring in the insulating substrate. In particular, the stress generated between the conductor layer and the insulating substrate (stress that causes the insulating substrate to bend toward the lower surface) increases in the diagonal direction on the lower surface of the rectangular insulating substrate, so that part of the ceramic layer It is extremely effective in preventing warping of the insulating substrate to obtain effective stress in the diagonal direction (stress that causes the insulating substrate to protrude convexly on the upper surface side) by extending to the four corners of the lower surface of the insulating substrate. It is.

  The electronic component storage container of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage container according to the present invention.

  In FIG. 1, 1 is an insulating substrate, 2 is an external connection pad, 3 is a conductor layer, and 4 is a ceramic layer. The insulating component 1, the external connection pad 2, the conductor layer 3, and the ceramic layer 4 mainly constitute the electronic component storage container 9 of the present invention.

  The insulating base 1 has a recess 1a for accommodating an electronic component on the top surface, and the bottom surface of the recess 1a is a mounting portion 1b for the electronic component.

  In the example of this embodiment, the insulating base 1 has the wiring conductor 5 led out from the inside to the outside of the recess 1a.

  The insulating substrate 1 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. When the insulating substrate 1 is made of, for example, a glass ceramic sintered body, an appropriate organic binder and solvent are added to and mixed with glass ceramic raw material powder such as silicon oxide and aluminum oxide to form a slurry, and this is adopted by a doctor blade method. Then, a plurality of ceramic green sheets are obtained by forming into a sheet shape. After that, the ceramic green sheets are formed into an appropriate shape by cutting or punching, and a plurality of them are laminated, and finally, this lamination is performed. The ceramic green sheet is produced by firing at a temperature of about 1000 ° C. in a reducing atmosphere.

  In addition, about the ceramic green sheet used as the insulation base | substrate 1, the recessed part 1a is formed in the upper surface of the insulation base | substrate 1 by giving the punching process which used the metal mold | die etc. to the thing located in an upper surface side, and providing the opening part. be able to.

  An electronic component (not shown) is accommodated in the concave portion 1a on the upper surface of the insulating base 1, and the electronic component is mounted on the mounting portion 1b and bonded and fixed via a brazing material, glass, resin, or the like. Electronic components (not shown) to be mounted are semiconductor integrated circuit elements such as IC and LSI, LD (semiconductor laser), LED (light emitting diode), PD (photodiode), CCD, line sensor, image sensor, etc. These are semiconductor elements, vibrators such as piezoelectric vibrators and crystal vibrators, and other various electronic components.

  The electronic component is sealed by closing the concave portion 1a on which the electronic component is mounted with a lid (not shown) or filling the concave portion 1a with resin. The lid body is bonded to the upper surface of the insulating base 1 by a bonding method such as a brazing material, glass, resin, or a bonding method such as a welding method, and the concave portion 1a is closed.

  As the lid, for example, a plate (such as a flat plate) that can close the recess 1a is used, and a metal material such as an iron-nickel-cobalt alloy, an iron-nickel alloy, a copper-based alloy, It is formed of a ceramic material such as an aluminum oxide sintered body, a material such as glass or resin.

  After the electronic component is mounted on the mounting portion 1b, the grounding and signal electrodes are electrically connected to the portion of the wiring conductor 5 exposed to the mounting portion 1b via a bonding wire, solder, or the like. .

  An external connection pad 2 is formed on the lower surface of the insulating base 1 so as to be electrically connected to the wiring conductor 5.

  The wiring conductor 5 and the external connection pad 2 function as a conductive path for connecting the electrode of the electronic component to an external electric circuit. For example, the grounding external connection pad 2 electrically connected to the grounding electrode of the electronic component is electrically connected to the grounding terminal of the external electric circuit, and the electronic component is grounded.

  It is preferable that the external connection pad 2 and the wiring conductor 5 have a plating layer such as nickel or gold deposited on the exposed surface. Thereby, the external connection pad 2 and the wiring conductor 5 can effectively prevent the oxidative corrosion of the exposed portion, and can make the connection of the conductive connecting material easier and stronger.

  Also, a conductor layer 3 having an outer periphery extending outward from the outer periphery of the mounting portion 1b is attached to the lower surface of the insulating base 1.

  The conductor layer 3 is for effectively preventing the electronic component mounted on the mounting portion 1b from being affected by electromagnetic noise from the outside and operating the electronic component normally.

  Therefore, the conductor layer 3 is formed to extend outward from the outer periphery of the mounting portion 1b so as to effectively block electromagnetic noise.

  In order to effectively cut off electromagnetic noise by the conductor layer 3, the conductor layer 3 is preferably grounded.

  Such a conductor layer 3 is formed of a conductor material such as a metal material such as copper, silver, palladium, gold, tungsten, molybdenum, or manganese.

  For example, if the conductor layer 3 is made of copper, a metal paste prepared by adding an organic solvent, a resin binder, or the like to copper powder is punched into the surface of the green sheet to be the insulating substrate 1 or in advance on the green sheet. It can be formed by printing and filling the inside of the formed through hole.

  A ceramic layer 4 is deposited on the conductor layer 3.

  The ceramic layer 4 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body.

  The ceramic layer 4 is made of a metal paste (conductor) printed on the lower surface of the insulating substrate 1 using a ceramic paste prepared by adding and kneading an organic solvent and an organic binder to the same ceramic powder as the ceramic constituting the insulating substrate 1. It is formed by applying on the surface of the layer 3).

  Thus, by applying the ceramic layer 4 on the conductor layer 3, the ceramic layer is affected by the stress caused by the difference in shrinkage behavior between the conductor layer 3 and the ceramic green sheet (insulating base 1). 4 and the conductor layer 3 can be effectively canceled by the stress caused by the difference in contraction behavior, and as a result, the insulating base 1 can be effectively prevented from being deformed such as warping. That is, compared with the conductor layer 3 (metal paste), for example, the ceramic layer 4 formed by firing the ceramic paste has a larger shrinkage amount during firing than the conductor layer 3. In the meantime, a stress that makes the insulating base 1 convex toward the upper surface (the stress opposite to the stress that warps the insulating base 1 so as to protrude toward the lower surface) occurs.

  Further, as shown in FIG. 1 and FIGS. 2A to 2C, the external connection pad 2 is formed by providing a non-formed portion 4 a on the ceramic layer 4 and exposing a part of the conductor layer 4. Yes. 2A is a bottom view of the electronic component storage container shown in FIG. 1, FIG. 2B is a bottom view with the ceramic layer 4 removed in this embodiment, and FIG. 2C is a ceramic layer. It is a bottom view of 4 itself.

Thus, the external connection pads 2, by which the non-formed portion 4a provided in the ceramic layer 4 is formed to expose a portion of the conductive layer 3, the conductive layer 3 on the lower surface of the insulating base 1, mounting portions 1b Even if it is formed so as to extend to the outside rather than the outer periphery, the external connection pad 2, particularly the external connection pad 2 for grounding that requires a large area for effective grounding, can be efficiently provided on the lower surface of the insulating base 1. And can be formed easily.

  The non-formation part 4a can be provided, for example, by providing a portion that is not printed corresponding to the non-formation part 4a for printing plate making when printing a ceramic paste to be the ceramic layer 4.

The ceramic layer 4, the same ceramic as the ceramic constituting the dielectric substrate 1, for example, ceramic ceramic constituting the dielectric substrate 1 that constitutes the ceramic layer 4 in the case made of glass-ceramic sintered body also glass ceramic sintered body including the. This is for strengthening the bonding between the ceramic layer 4 and the insulating substrate 1.

  The ceramic layer 4 and the insulating substrate 1 do not need to have the same composition. In other words, considering the moldability to ceramic green sheets, printability as ceramic paste, etc., the organic solvent, organic binder control, plasticizer and other additives, and the amount of glass added are slightly different. May be.

  As described above, the conductor layer 3 is sandwiched between the insulating base 1 and the ceramic base 4 having almost the same components as the insulating base 1, so that the difference in the contraction start time and the contraction behavior between the ceramic green sheet and the metal paste during firing. Stress due to the difference between the upper and lower surfaces increases, and problems such as warping of the insulating base 1 due to the difference in stress are effectively suppressed.

  Further, by preventing the insulating substrate 1 from warping, the connection between the electrode of the electronic component of the mounting portion 1b and the wiring conductor 5 and the connection between the external connection pad 2 and the external electric circuit can be normally performed.

  The ceramic layer 4 preferably covers 80% or more of the conductor layer 3.

  The thicker the ceramic layer 4 is, the more balanced the shrinkage behavior with the insulating base 1 sandwiching the conductor layer 3 is. However, when the ceramic layer 4 is too thick, the external connection pad 2 and the grounding terminal of the external electric circuit The distance is so large that connection becomes difficult, and about 10 μm to 60 μm is preferable.

  Moreover, it is preferable that the electronic component storage container 9 of this invention is what the insulating base | substrate 1, the ceramic layer 4, and the conductor layer 3 were formed by simultaneous baking.

  In that case, the effect of canceling the stress caused by the difference in shrinkage behavior between the conductor layer 3 and the ceramic green sheet (insulating base 1) with the stress caused by the difference in shrinkage behavior between the ceramic layer 4 and the conductor layer 3 is further enhanced. It can be obtained effectively. As a result, it is possible to more effectively prevent the insulating base body 1 from being deformed such as a warp that protrudes downward.

The electronic component storing container 9 of the present invention, the ceramic layer 4, a ceramic and syngeneic ceramic material forming the insulating base 1 as a main component, that and to contain a metal oxide. Therefore, since the metal oxide has an action of increasing the shrinkage of the ceramic forming the ceramic layer 4, the stress generated between the ceramic layer 4 and the conductor layer 3 (the insulating substrate 1 is warped convexly on the upper surface side). Yo to stress) orientation can be greatly even thin ceramic layer 4 as compared with the insulating base 1, a convex stress (insulating substrate 1 on the lower surface side generated between the conductor layer 3 and the insulating base 1 Soraseyo it to stress) effectively cancel such stress can be caused securely to. As a result, it is possible to prevent securely the warp occurs in the insulating base 1.

  In this case, it is preferable that the ceramic layer 4 covers the entire surface of the conductor layer 3 except for the external connection pads 2 in order to obtain the same effect of suppressing shrinkage over the entire circumference of the lower surface of the insulating substrate 1.

The metal oxides include oxides of Fe, oxide of Mn, oxide of Mo, Ru consists of at least one of oxides and oxides of Cr Co. Specifically, Fe oxide is Fe ₂ O ₃ as iron oxide (III: trivalent), and Mn oxide is MnO ₂ as manganese oxide (IV).
, Mo oxide is MoO ₂ as molybdenum oxide (IV), Co oxide is CoO as cobalt oxide (II), Cr oxide is Cr ₂ O ₃ as chromium oxide (III), and these It is a complex oxide.

These metal oxides, since the effect of delaying the sintered against ceramic mainly containing aluminum oxide or silicon oxide is particularly large, the probability the real and effectively its firing when the insulating layer 5 contracts it can be delayed, and it is possible to prevent the occurrence of securely the warp deformation Kikushi large the effect of restraint with respect to the insulating substrate 1.

  Further, the above-described metal oxide has a greater effect of delaying the sintering of the ceramics of the ceramic layer 4 as the addition amount is increased, and the effect of suppressing the warp of the insulating substrate 1 is increased. In consideration of economy and shrinkage of the electronic component storage container 9, the content of the metal oxide in the ceramic layer 4 is preferably 0.1 to 10% by mass.

  Furthermore, according to the electronic component storage container 9 of the present embodiment, it is preferable that the insulating base 1 is formed in a rectangular shape, and the non-formed portion 4a is disposed along the opposing sides of the lower surface of the insulating base 1.

  With this configuration, the external connection pad 2 formed by the conductor layer 3 exposed in the non-forming portion 4a is disposed along the outer side of the lower surface of the insulating base 1, and can be easily connected to an external electric circuit. Connection reliability, workability, and practicality are good.

  Further, the non-formed portion 4a is disposed on the lower surface of the rectangular insulating substrate 1 suitable for housing electronic components along the opposing sides, so that the conductor layer 3 and the ceramic layer 4 are interposed between the opposing sides. The stress generated between the conductor layer and the ceramic green sheet can be more evenly mitigated, and the influence of the stress caused by the difference in contraction behavior between the conductor layer and the ceramic green sheet can be more evenly mitigated, and warping and other deformations occur in the insulating substrate. This can be prevented more effectively.

  Further, according to the electronic component storage container 9 of the present embodiment, the insulating base 1 is formed in a rectangular shape, and a part of the ceramic layer 4 is extended to the four corners on the lower surface of the insulating base 1, thereby The influence of stress resulting from the difference in shrinkage behavior with the ceramic green sheet can be alleviated over a wider range, and deformation of the insulating substrate 1 such as warpage can be more effectively prevented.

  In particular, since the stress generated between the conductor layer 3 and the insulating base 1 (stress that causes the insulating base 1 to protrude convexly toward the lower surface) increases in the diagonal direction of the lower surface of the rectangular insulating base 1, It is possible to effectively obtain stress in a diagonal direction (stress that causes the insulating substrate 1 to be convexly warped upward) by extending a part of the layer 4 to the four corners on the lower surface of the insulating substrate 1. It is extremely effective in preventing warpage.

  Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the gist of the present invention. For example, the external connection pad 2 is formed of the conductor layer 3 exposed at the non-formation portion 4a of the ceramic layer 4, and the signal electrode of the electronic component that is electrically independent from the conductor layer 3 What is electrically connected may be formed.

It is sectional drawing which shows an example of embodiment of the electronic component storage container of this invention. (A) is a bottom view of the electronic component storage container shown in FIG. 1, (b) is a bottom view of the conductor layer 3 and the external connection pad 2 shown in (a), and (c) is the ceramic layer 4 of (a). FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... External connection pad 3 ... Conductor layer 4 ... Ceramic layer 4a ... Non-formation part 5 ... Wiring conductor 9 ... Electronic component storage container

Claims (4)

An electronic component in which a concave portion is formed on the upper surface of the insulating base, a mounting portion on which the electronic component is mounted is provided on the bottom surface of the concave portion, and an external connection pad electrically connected to the electronic component is provided on the lower surface of the insulating base A storage container,
A conductor layer having an outer periphery extending outward from the outer periphery of the mounting portion is attached to the lower surface of the insulating base, and a ceramic layer is attached on the conductor layer, and the external connection pad However, the ceramic layer is formed by providing a non-forming portion to expose a part of the conductor layer, and the ceramic layer is mainly composed of a ceramic material similar to the ceramic forming the insulating base, and which contain a metal oxidation product, the metal oxidation product _{is, Fe 2 O 3, MnO 2} , MoO 2, CoO, Cr 2 O 3 , and to consist of at least one of these complex oxides Electronic component storage container characterized by.   The electronic component storage container according to claim 1, wherein the insulating base, the ceramic layer, and the conductor layer are formed by simultaneous firing.   3. The electronic component storage container according to claim 1, wherein the insulating base has a rectangular shape, and the non-formed portion is disposed along opposing sides of the lower surface of the insulating base. .   4. The electron according to claim 1, wherein the insulating base has a rectangular shape, and a part of the ceramic layer extends to four corners of the lower surface of the insulating base. 5. Parts storage container.

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