JP4572465B2 - Manufacturing method of electronic component device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an electronic component device in which an electronic component is mounted on a substrate via a bump, and more particularly to a method for manufacturing an electronic component device to be mounted using a flip chip bonding method.
[0002]
[Prior art]
Conventionally, a bump formed on an electrode portion of a semiconductor chip and a wiring pattern of a substrate arranged on a heating stage are aligned, pressure and ultrasonic waves are applied to the back surface of the chip via a tool, A flip chip bonding method for bonding a wiring pattern on a substrate has been proposed (Japanese Patent Laid-Open No. 63-288031).
[0003]
FIG. 1 shows an example of an electronic component device, FIG. 2 shows a bonding method thereof, and FIG. 3 shows a substrate.
1 is a substrate, 2a and 2b are wirings, 3 is a bump, and 4 is an electronic component.
On the substrate 1, wirings 2a and 2b are formed vertically and horizontally, and bumps 3 are formed in advance at the inner ends of these wirings 2a and 2b. The bump 3 is joined to the electrode part of the electronic component 4 by pressing the upper surface of the electronic component 4 with the bonding tool 5 and applying ultrasonic vibration in the horizontal direction X.
[0004]
[Problems to be solved by the invention]
As described above, the electrode 2 of the electronic component 4 and the wiring pattern of the substrate 1 are joined together, and the wiring 2b extending in parallel to the wiring 2a extending in the direction orthogonal to the direction X of the ultrasonic vibration is unavoidable. Will occur. In particular, the wiring 2a provided in the direction orthogonal to the direction X of ultrasonic vibration has a drawback that the distortion of the wiring 2a due to ultrasonic vibration is large and the bonding is incomplete compared to the parallel wiring 2b.
[0005]
4A shows a state in which the electronic component 4 is joined to the wiring 2a provided in a direction orthogonal to the ultrasonic vibration direction X, and FIG. 4B is provided in parallel with the ultrasonic vibration direction X. FIG. A state in which the electronic component 4 is joined to the wiring 2b is shown. In FIG. 4, reference numeral 6 denotes an electrode portion of the electronic component 4.
[0006]
Since the wiring 2a provided in the orthogonal direction has low rigidity with respect to the direction X of the ultrasonic vibration, the distortion amount δ of the wiring 2a is larger than that of the wiring 2b provided in parallel, and the bonding is incomplete.
As described above, if there is a variation in the bonding property depending on the direction of the wiring, the wiring (or electrode) to be bonded early and the wiring (or electrode) to be bonded are mixed, and the wiring 2a having a large amount of distortion is completely bonded. As described above, when the ultrasonic wave application time is lengthened, there is a problem that cracks start to occur from the wiring (or electrode) 2b that is joined early.
[0007]
SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an electronic component device that can suppress variations in the amount of distortion of wiring due to ultrasonic vibration and can obtain a substantially uniform bonding state with all wirings.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, a plurality of wirings are formed on a substrate in different directions, and a plurality of electrodes of an electronic component are ultrasonically applied to the plurality of wirings via bumps. In the method of manufacturing an electronic component device that is collectively bonded using vibration, an angle θ formed between the substrate and the direction of the ultrasonic vibration is set so that the amount of distortion of the wiring due to the ultrasonic vibration is substantially the same. A method of manufacturing an electronic component device is provided, wherein a plurality of different wirings are formed, and the wiring having the larger angle θ is formed wider than the wiring having the smaller angle θ .
[0009]
For example, bumps are formed on a plurality of wirings (or on the electrodes of the electronic component) extending in the orthogonal direction, and bonded to the electrodes (or wirings) facing the bumps using ultrasonic vibration.
In this case, a wire having a large angle θ formed with the direction of ultrasonic vibration and a wire having a small angle θ are generated. In the present invention, the shape of the wire is set so that the amount of distortion of the wire due to the ultrasonic vibration is substantially the same. Since it is set, the transmission efficiency of the ultrasonic waves becomes substantially uniform, and a substantially uniform joining state can be obtained in all the wirings. Therefore, it is possible to prevent incomplete joining and occurrence of cracks.
[0010]
In order to make the distortion amount of the wiring due to the ultrasonic vibration substantially the same, a plurality of wirings having different angles θ formed with the direction of the ultrasonic vibration are formed on the substrate as in claim 1 , and the larger angle θ is formed. The wiring is preferably formed wider than the wiring having the smaller angle θ.
In other words, the larger the angle θ with respect to the direction of ultrasonic vibration, the greater the distortion caused by ultrasonic vibration. By widening the wiring with a large angle θ, the amount of distortion is reduced and the bonding property of all wirings is increased. Can be made uniform.
[0011]
According to a second aspect of the present invention, at least one wiring of the substrate is bent in an L shape in the vicinity of a portion connected to the electrode of the electronic component, and a width of the portion connected to the electrode of the electronic component of this L-shaped wiring. You may make D3 narrower than the width | variety D2 of the wiring whose angle (theta) with the direction of an ultrasonic vibration is 45 degrees or more.
That is, when the wiring is bent in an L shape in the vicinity of the connection portion with the electronic component, the length of the connection portion of the wiring is short, so that the angle θ formed with the direction of ultrasonic vibration is 45 ° or more. In comparison, distortion caused by ultrasonic vibration is relatively small. Therefore, by making the width D3 of the connection portion of the L-shaped wiring narrower than the wiring width D2 of 45 ° or more, which has low rigidity against ultrasonic vibration, the amount of distortion can be made almost the same.
[0012]
As in claim 3 , at least one wiring of the substrate is bent into an L shape, and the length L of the portion connected to the electrode of the electronic component of the L shape wiring is set to be longer than the range in which the ultrasonic vibration spreads. May be.
That is, in the fourth aspect, as a means for making the amount of distortion the same, a method of adjusting the length dimension is used instead of the method of adjusting the width dimension of the connecting portion. In other words, instead of bending in an L shape near the joint with the electronic component, the connection is set to be longer than the range in which the ultrasonic vibration is applied, so that it has the same rigidity as other joints. It is.
[0013]
As in claim 4, the substrate, the angle θ between the direction of ultrasonic vibration to form a less 45 ° or more wires and 45 ° lines, the electrodes of the electronic component of the angle θ is less than 45 ° wire It is desirable to form a bent portion or a curved portion in which the angle θ changes in the vicinity of the portion connected to the.
That is, since the wiring with an angle θ of less than 45 ° has higher rigidity against ultrasonic vibration than the wiring with 45 ° or more, a bent portion or a curved portion should be formed in the vicinity of the connecting portion of the wiring having a high rigidity of less than 45 °. Thus, the rigidity in the vicinity of the connecting portion is lowered. Therefore, the amount of strain can be made uniform and the joining state can be made almost uniform.
[0014]
A plurality of wirings extending in a direction orthogonal to each other are formed on the substrate as in claim 5 , and each wiring is bent at 45 ° with respect to one wiring in the vicinity of the portion connected to the electrode of the electronic component . Multiple portions may be formed.
In other words, if the portion near the connection portion of the wiring is bent at multiple positions of 45 ° without changing the width of the wiring, the distortion amount of all wiring can be made uniform regardless of the direction of ultrasonic vibration. Is possible. In this case, since the width and pitch of the wiring can be made substantially uniform, there is an advantage that the electrical characteristics do not change and the substrate does not need to be enlarged.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
A first embodiment of an electronic component device according to the present invention will be described with reference to FIGS. 5 is a plan view of the electronic component device, FIG. 6 is a side view of the electronic component device, FIG. 7 is a plan view of the substrate, and FIG. 8 is a partially enlarged view of the substrate.
[0016]
The substrate 10A is a resin substrate such as glass epoxy resin or BT resin, a ceramic substrate such as alumina, and a crystal substrate such as silicon. A plurality of wirings 11 to 14 extending in a direction orthogonal to each other are formed on the substrate 10A. ing. Here, the shape of the substrate 10A is not particularly limited. The wirings 11 to 14 are formed by a thin film forming method or a thick film forming method, and the thickness is preferably several μm to several tens μm, but is not limited thereto. Further, portions other than the connection portions 11a to 14a of the wirings 11 to 14 may be covered with an insulator such as a resist.
[0017]
Bumps 15 are formed on the connection portions 11a to 14a provided at the inner ends of the wirings 11 to 14 by using a plating method, a wire bonding method, or the like. For these bumps 15, metal bumps mainly composed of Au, Ag, Pd, and Cu, solder, or the like can be used.
[0018]
Reference numeral 20 denotes an electronic component such as a semiconductor chip, and an electrode portion (not shown) is formed on the lower surface thereof at a position corresponding to the bump 15. The electrode portion of the electronic component 20 is bonded to the bump 15 at a time using ultrasonic vibration.
[0019]
As shown in FIG. 8, the connecting portions 11a and 12a are provided on the wirings 11 and 12 formed in a direction (θ ₁ <45 °) that is nearly parallel to the direction X of the ultrasonic vibration. Reference numerals 13a and 14a are provided on the wirings 13 and 14 formed in a direction (θ ₂ > 45 °) nearly perpendicular to the direction X of the ultrasonic vibration.
The widths D0 of the wirings 11 to 14 excluding the connection parts are all formed the same. If the widths of the connection parts 11a and 12a are D1 and the widths of the connection parts 13a and 14a are D2, the connection parts 11a to 14a caused by ultrasonic vibrations. The following relationship is set so that the distortion amounts are substantially the same.
D0 = D1 <D2
The reason for setting as described above is that the connecting portions 13a and 14a of the wirings 13 and 14 that are substantially orthogonal to the ultrasonic vibration have rigidity in the vibration direction X as compared with the connecting portions 11a and 12a of the substantially parallel wirings 11 and 12. Since it is low, the width D2 of the connection portions 13a and 14a is made wider than the width D1 of the connection portions 11a and 12a, the rigidity with respect to the vibration direction X is substantially equal, and the distortion amount of the wiring due to ultrasonic vibration is substantially the same. .
In addition, the length L of the connection portions 13a and 14a formed to be wide is set to be longer than the range in which the ultrasonic vibration by the bonding tool 30 is spread. Accordingly, the entire wirings 13 and 14 may be formed with the same width D2 as the connection portions 13a and 14a.
[0020]
Next, a method for flip-chip bonding the electronic component 20 onto the wirings 11 to 14 will be described.
First, bumps 15 are formed on the connection portions 11a to 14a of the wirings 11 to 14 of the substrate 10A.
Next, the upper surface of the electronic component 20 is attracted by the bonding tool 30, the electronic component 20 is picked up, and the electrode part and the bump 15 are aligned with high accuracy.
Next, the electrode part of the electronic component 20 and the bump 15 are brought into contact with each other, and ultrasonic vibration is applied through the tool 30 so as to be in the direction X parallel to the surface of the substrate 10A. To do. In joining, pressure may be applied between the substrate 10A and the electronic component 20 or heating may be performed.
At this time, since the widths D1 and D2 are set so that the distortion amounts of the connection portions 11a to 14a are substantially equal to the ultrasonic vibration X, the bonding of the bumps 15 provided on the connection portions 11a to 14a is performed. There is little variation in properties, and almost uniform bonding strength can be obtained. Therefore, it is possible to prevent incomplete bonding and occurrence of cracks in the electrode portion.
After bonding as described above, in order to ensure bonding reliability, resin sealing for reducing the linear expansion difference between the electronic component 20 and the substrate 10A and protecting the bonding portion is performed between the electronic component 20 and the substrate 10A. You may go to the gap.
The bumps 15 are not limited to being formed on the wirings 11 to 14 of the substrate 10A, but may be formed on the electrodes of the electronic component 20 and bonded to the wirings of the substrate.
[0021]
In the above embodiment, the angle θ ₁ formed between the wirings 11 and 12 and the vibration direction X is 0 <θ ₁ <45 °, and the angle θ ₂ formed between the wirings 13 and 14 and the vibration direction X is 45 ° <θ ₂ < Although 90 ° is set, θ ₁ = 0 ° and θ ₂ = 90 ° may be used. In this case, what is necessary is just to enlarge the difference of the width | variety D1 and D2 of a connection part.
Further, when θ ₁ = θ ₂ = 45 °, the widths D1 and D2 of the connecting portions may be made substantially equal.
[0022]
FIG. 9 shows a second embodiment of the substrate according to the present invention.
The substrate 10B of this embodiment has a plurality of wirings 11 to 14 extending in a direction orthogonal to each other on the surface, and one of the wirings 16 is formed in a shape bent in an L shape near the connection portion. Except for this point, it is the same as the substrate 10A shown in FIG. Therefore, the same parts as those of the substrate 10A of FIG.
The width D3 of the connection portion 16a of the L-shaped wiring 16 is set narrower than the width D2 of the connection portions 13a and 14a of the wirings 13 and 14 that are substantially perpendicular to the vibration direction X.
D3 <D2
In the case of the L-shaped wiring 16, since the length of the connecting portion 16a is short and the direction of the wiring portion 16b is substantially parallel to the vibration direction X, the wiring portion 16b functions to suppress distortion of the connecting portion 16a. This is because even if the width D3 of the connecting portion 16a is smaller than the width D2 of the connecting portion 13a, it can have the same rigidity as the connecting portion 13a.
[0023]
If the width D3 of the connecting portion 16a is smaller than the width D1 of the connecting portion 11a, the amount of distortion of the connecting portion 16a becomes too large, and therefore the width of the connecting portions 11a and 12a of the wirings 11 and 12 substantially parallel to the vibration direction X. It is desirable to make it wider than D1. That is, by setting as follows, the distortion amounts of all the connecting portions 11a to 16a can be made almost equal.
D1 <D3 <D2
Note that the width D4 of the wiring portion 16b may be equal to the width D0 of the other wiring, or may be narrower or wider than this.
[0024]
FIG. 10 shows a third embodiment of the substrate according to the present invention.
The substrate 10C of this embodiment also has a plurality of wirings 11 to 14 extending in a direction orthogonal to each other on the surface, and one of the wirings 16 is formed in a shape bent in an L shape near the connection portion. Except for this point, it is the same as the substrate 10A shown in FIG. Therefore, the same parts as those of the substrate 10A of FIG.
In this embodiment, the direction X of the ultrasonic vibration is approximately 45 ° with respect to the wirings 11 to 14. Therefore, all the connection parts 11a-14a are set to the same width D5. Further, the width D6 of the connection portion 16a of the L-shaped wiring 16 is narrower than the connection portions 11a to 14a of the other wirings.
D6 <D5
The reason for this is that since the connecting portion 16a and the wiring portion 16b of the L-shaped wiring 16 are formed in a right angle direction, they are hardly deformed (highly rigid) with respect to ultrasonic vibrations. However, the amount of distortion is smaller than that of other wiring connections. Therefore, in order to make the amount of distortion substantially equal, the width D6 of the connection portion 16a is made narrower than other connection portions.
In this embodiment, the connecting portions 11a to 14a of the wirings 11 to 14 are wider than the other portions, but it is needless to say that they may have the same width.
[0025]
FIG. 11 shows a fourth embodiment of the substrate according to the present invention.
The substrate 10D of this embodiment also has a plurality of wirings 11 to 14 extending in a direction orthogonal to each other on the surface thereof, and one of the wirings 16 is formed in a shape bent in an L shape near the connection portion. Except for this point, it is the same as the substrate 10A shown in FIG.
In this embodiment, the direction X of the ultrasonic vibration is approximately 45 ° with respect to the wirings 11 to 14. Accordingly, the connecting portions 11a to 14a and 16a are all set to the same width D7. In this case, the length L of the connection portion 16a is set to be longer than the range in which the ultrasonic vibration by the bonding tool 30 is spread so that the distortion amounts of the connection portions 11a to 14a and 16a are substantially the same.
The reason is that since the connecting portion 16a and the wiring portion 16b of the L-shaped wiring 16 are formed in a right angle direction, bending to an L-shape in the vicinity of the joint portion with the electronic component is most difficult to deform with respect to ultrasonic vibration ( Therefore, the amount of distortion of the connecting portion 16a of the wiring 16 is smaller than that of the connecting portion of the other wiring. Therefore, by setting the length L of the connecting portion 16a to be longer than the range in which the ultrasonic vibration is spread, it is possible to have the same rigidity as other joint portions.
[0026]
FIG. 12 shows a fifth embodiment of the wiring shape according to the present invention.
In this embodiment, in order to make the distortion amounts of the connection portions 11a and 13a of the wirings 11 and 13 due to ultrasonic vibrations substantially the same, a rectangular recess 11b is formed on the side portion of the connection portion 11a with a small distortion amount, and the distortion amount A rectangular convex portion 13b is formed on the side portion of the connecting portion 13a having a large length. Further, the connection portion 16a of the wiring 16 bent in an L shape has a larger distortion amount than the connection portion 11a, but is smaller than the connection portion 13a, and therefore, a small number or small convex portions 16c are formed.
[0027]
FIG. 13 shows a sixth embodiment of the wiring shape according to the present invention.
In this embodiment, similarly to FIG. 12, in order to make the distortion amounts of the connection portions 11a and 13a of the wirings 11 and 13 caused by ultrasonic vibration substantially the same, the side portion of the connection portion 11a having a small distortion amount is V-shaped. A concave portion 11b is formed, and a mountain-shaped or semicircular convex portion 13b is formed on the side portion of the connecting portion 13a having a large amount of distortion.
Depending on the amount of distortion, the shape, size, and number of the concave portions 11b and the convex portions 13b can be arbitrarily changed.
[0028]
FIG. 14 shows a seventh embodiment of the wiring shape according to the present invention.
In this embodiment, the connection portion 11a having a small distortion amount is bent into a V shape so that the distortion amounts of the connection portions 11a and 13a of the wirings 11 and 13 due to the ultrasonic vibration are substantially the same. That is, by bending the connecting portion 11a, forms part 11a ₁ having an angle with respect to the vibration direction X, by increasing the amount of distortion in this portion 11a _1, substantially equalizing the distortion amount of the connecting portion 13a It has been made.
[0029]
FIG. 15 shows an eighth embodiment of the wiring shape according to the present invention.
Similarly to the sixth embodiment, in this embodiment, in order to make the distortion amounts of the connection portions 11a and 13a of the wirings 11 and 13 caused by ultrasonic vibration almost the same, the connection portion 11a having a small distortion amount is curved in an arch shape. Is. That is, by curving the connecting portion 11a, forms part 11a ₂ having an angle with respect to the vibration direction X, by increasing the amount of distortion in this portion 11a _2, substantially equalizing the distortion amount of the connecting portion 13a It has been made.
[0030]
FIG. 16 shows a ninth embodiment of the substrate according to the present invention.
In this embodiment, the substrate 10E has the same widths of the wirings 11 to 14 and the connection portions 11a to 14a, and a plurality of portions 11a _{3 to} 14a ₃ bent at 45 ° to the connection portions 11a to 14a. These bent portions 11a _{3 to} 14a ₃ are formed in the same shape.
In this case, since the distortion amount is almost the same in all the connecting portions 11a to 14a regardless of the direction of the ultrasonic vibration, the selectivity of the direction of the ultrasonic vibration is improved. Further, no special wiring design is required so that the distortion amounts are almost the same.
It may be arcuate portion in place of the bent portion 11a ₃ ~14a _3.
[0031]
In the case of the fifth embodiment to the ninth embodiment, the widths of the wirings 11 and 13 are made constant, and the amount of distortion is made substantially uniform by providing the connecting portion with a convex portion or a concave portion, or bending or bending. Therefore, there is no need to change the pitch between wirings or connection parts. Therefore, there exists an advantage that an electronic component apparatus does not enlarge.
[0032]
The present invention is not limited to the above embodiments.
In the present invention, the direction X of ultrasonic vibration is not limited to only one direction, and may be rotational vibration that twists within a certain angle range. In addition, vibrations with different vibration directions and frequencies may be synthesized.
The material of the substrate is not particularly limited, but the present invention is effective when the resin substrate is used and bonding is performed by thermocompression bonding using ultrasonic vibration. This is because, in the case of a resin substrate, if thermocompression bonding using ultrasonic vibration is performed, the substrate is deformed, resulting in an increase in the amount of wiring distortion.
The electronic component device of the present invention is not limited to the one using a semiconductor chip as an electronic component element, and can be applied to face-down mounting of any chip component such as a resistance element, a capacitor, and a piezoelectric component.
[0033]
【The invention's effect】
As is apparent from the above description, according to the first to fifth aspects of the present invention, the plurality of electrodes of the electronic component are connected to the plurality of wirings formed in different directions on the substrate via the bumps. When joining together using sonic vibration, the wiring shape is set so that the amount of distortion of the wiring due to ultrasonic vibration is almost the same, so the transmission efficiency of ultrasonic waves is almost uniform, and all wiring A substantially uniform joining state can be obtained.
Therefore, incomplete joining and occurrence of cracks can be prevented, and a highly reliable electronic component device can be obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a general electronic component device.
2 is a perspective view showing a method for joining the electronic component device of FIG. 1; FIG.
3 is a perspective view of a substrate used in the electronic component device of FIG. 1. FIG.
4 is an enlarged view when ultrasonic vibration is applied in the electronic component device of FIG. 1. FIG.
FIG. 5 is a plan view of an example of an electronic component device according to the present invention.
6 is a side view of the electronic component device shown in FIG. 5 at the time of joining.
7 is a plan view of a substrate used in the electronic component device shown in FIG. 5. FIG.
8 is a partial enlarged view of the substrate shown in FIG.
FIG. 9 is a plan view of a second embodiment of the substrate according to the present invention.
FIG. 10 is a plan view of a third embodiment of the substrate according to the present invention.
FIG. 11 is a plan view of a fourth embodiment of the substrate according to the present invention.
FIG. 12 is a plan view of a fifth embodiment of the wiring shape according to the present invention.
FIG. 13 is a plan view of a sixth embodiment of the wiring shape according to the present invention.
FIG. 14 is a plan view of a seventh embodiment of the wiring shape according to the present invention.
FIG. 15 is a plan view of an eighth embodiment of the wiring shape according to the present invention.
FIG. 16 is a plan view of a ninth embodiment of the substrate according to the present invention.
[Explanation of symbols]
10A, 10B, 10C, 10D Substrate 11-14, 16 Wiring 15 Bump 20 Electronic component 30 Bonding tool

Claims (5)

In a method of manufacturing an electronic component device , wherein a plurality of wirings are formed in different directions on a substrate, and a plurality of electrodes of the electronic component are collectively bonded to the plurality of wirings using ultrasonic vibration via bumps ,
A plurality of wirings having different angles θ with respect to the direction of the ultrasonic vibration are formed on the substrate so that the distortion amounts of the wiring due to the ultrasonic vibrations are substantially the same , and the wiring having the larger angle θ is formed. Is formed wider than the wiring with the smaller angle θ . In a method of manufacturing an electronic component device, wherein a plurality of wirings are formed in different directions on a substrate, and a plurality of electrodes of the electronic component are collectively bonded to the plurality of wirings using ultrasonic vibration via bumps ,
The L-shaped wiring is formed by bending at least one wiring of the substrate in the vicinity of a portion connected to the electrode of the electronic component so that the amount of distortion of the wiring due to the ultrasonic vibration becomes substantially the same. A method for manufacturing an electronic component device , characterized in that a width D3 of a portion connected to an electrode of the electronic component is made narrower than a width D2 of a wiring having an angle θ with the direction of ultrasonic vibration of 45 ° or more . In a method of manufacturing an electronic component device, wherein a plurality of wirings are formed in different directions on a substrate, and a plurality of electrodes of the electronic component are collectively bonded to the plurality of wirings using ultrasonic vibration via bumps ,
The length of the portion of the L-shaped wiring connected to the electrode of the electronic component is bent so that at least one wiring of the substrate is bent so that the amount of distortion of the wiring due to the ultrasonic vibration becomes substantially the same. A method of manufacturing an electronic component device , wherein L is set longer than a range in which ultrasonic vibrations are spread . In a method of manufacturing an electronic component device, wherein a plurality of wirings are formed in different directions on a substrate, and a plurality of electrodes of the electronic component are collectively bonded to the plurality of wirings using ultrasonic vibration via bumps ,
In the substrate so that the amount of distortion of the wiring due to the ultrasonic vibration is almost the same ,
A portion in the vicinity of a portion connected to an electrode of an electronic component of a wiring having an angle θ of 45 ° or more and a wiring having a angle of less than 45 ° formed with the ultrasonic vibration direction and a wiring having an angle θ of less than 45 °. In addition, a bending part or a bending part where the angle θ changes is formed . In a method of manufacturing an electronic component device, wherein a plurality of wirings are formed in different directions on a substrate, and a plurality of electrodes of the electronic component are collectively bonded to the plurality of wirings using ultrasonic vibration via bumps ,
A plurality of wirings extending in a direction orthogonal to each other are formed on the substrate so that the amount of distortion of the wiring due to the ultrasonic vibration is substantially the same, and each of the vicinity portions of the portions connected to the electrodes of the electronic components of these wirings And a plurality of portions bent by 45 ° with respect to one wiring .

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