JP4569925B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device in which a semiconductor light emitting element is used as a light source and is mounted on a wall.

  2. Description of the Related Art Conventionally, there is a so-called indirect lighting device in which an incandescent bulb or a fluorescent lamp, which is a light source, is attached to a wall and a shade that covers the light source is provided so as to block direct light from the light source. In such an illumination device, when used for a long period of time, the wall near the light source turns black due to heat rays (infrared rays) emitted from incandescent bulbs and fluorescent lamps. There is a problem in that the overhang of the light source becomes large, or when the gap between the shade and the wall becomes large and a person approaches the wall, direct light from the light source leaks from the gap to cause glare.

On the other hand, in recent years, indirect lighting devices using LED elements as light sources have been commercialized (for example, see Non-Patent Document 1). In the illumination device using the LED element, a light emitting unit using a plurality of LED elements is embedded in a wall, and a shade is attached in parallel to the wall so as to face the light emitting surface of the light emitting unit. Since the LED element does not emit the heat rays generated by incandescent bulbs and fluorescent lamps, the wall can be prevented from turning black, and the LED element (light emitting part) is small, and the light emitting part is walled. As a result, the entire device can be thinned, and the gap between the shade and the wall can be reduced, so that the occurrence of glare can be suppressed.
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  However, in the lighting device using the LED element, the light output from the light emitting unit is small, so the light amount as the lighting device is low, and if the input current to the LED element is increased to increase the light amount, the heat dissipation measures at the time of lighting In addition to the problem that the light emitting efficiency of the LED element is greatly reduced and the life is shortened because of not being performed, it is necessary to provide a relatively large hole in the wall for embedding the light emitting part.

  The present invention has been made in view of the above problems, and does not require a hole for embedding a light emitting portion in a wall. Further, even if the amount of light is increased, the light emission rate is reduced and the life is shortened. It is an object of the present invention to provide a lighting device that can suppress the occurrence of glare.

To achieve the above object, the lighting apparatus according to the present invention is a lighting device mounted to a wall, a post that will be erected on the wall, Ru is支架to the strut in a state away from the wall A heat-radiating part , a light-emitting part having a substrate and a semiconductor light-emitting element provided on the front side of the substrate, the heat-radiating part has a flat surface on the wall side, and the light-emitting part is flat on the heat-radiating part The back surface of the substrate is pressed against the surface and is in contact with the surface so as to be able to conduct heat .

Here, the “wall” is a concept including a room wall, a ceiling wall, and a floor wall. Moreover, the support | pillar may be erected directly on the wall, or may be erected on the wall indirectly, for example, via a reflector.
Between the front Symbol radiating portion and the wall, the reflective portion to reflect the light emitted from the light emitting unit in a desired direction is characterized by being provided.

On the other hand, the reflection part is directly attached to the wall, and the beam angle of light emitted from the light emitting part is 120 ° or less.

In the lighting device according to the present invention, since the light emitting part is mounted on the heat radiating part, it is not necessary to provide a hole in the wall in order to mount the light emitting part. Moreover, the light emitting portion so mounted in a state in contact with the heat radiating portion, the heat generated from the semiconductor light-emitting element is lit transmitted to enable the heat radiating portion, and is radiated the heat radiating portion or al.
Furthermore, since the heat radiating part is supported by the support with a space from the wall, air can pass between the heat radiating part and the wall, which cools the heat radiating part and consequently occurs in the semiconductor light emitting device. Heat can be efficiently radiated. Therefore, even if the input current to the semiconductor light emitting element is increased for the purpose of increasing the amount of light, the temperature rise of the semiconductor light emitting element can be suppressed, and the decrease in the emission light rate and the shortening of the lifetime due to the temperature increase can be suppressed. .

<Embodiment>
Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to the drawings.
1. About Illuminating Device (1) Overall Structure FIG. 1 is a perspective view of an illuminating device according to the present embodiment. 2 is a front view of the illuminating device, and FIG. 3 is a view of the illuminating device viewed from the direction of the arrow along the line XX in FIG.

  The illuminating device 1 includes a reflecting plate (a “reflecting member” of the present invention) 5 attached to a wall 3 and support columns 4 a, 4 b, 4 c, which are erected on the wall 3 via the reflecting plate 5. 4d, a heat radiating plate 7 (the “heat radiating member” of the present invention) supported on the columns 4a, 4b, 4c, 4d in a state of being separated from the wall 3 (reflecting plate 5), and an LED element A light-emitting module (which is a “light-emitting portion” of the present invention) 9 having a “semiconductor light-emitting element” of the invention and a socket 51 for mounting the light-emitting module 9 on the heat sink 7 (see FIG. 5). ) And a lighting unit 11 for lighting the light emitting module 9 is a so-called indirect lighting device.

Here, the lighting unit 11 turns on or off the light emitting module 9 by turning on / off a switch provided on the wall 3, for example.
The reflector 5 is attached to the wall 3 using, for example, screws, and a light distribution adjusting unit 15 that reflects light from the light emitting module 9 in a desired direction is provided at a portion facing the light emitting module 9. ing. The light distribution adjusting unit 15 has a conical shape as shown in FIG. 1, a virtual line segment (in the line segment A of FIG. There is a substantial match.

  The reflecting plate 5 is made of, for example, an aluminum material, and the surface on the light emitting module 9 side is a mirror surface, and the light distribution adjusting unit 15 is provided at the center thereof. The light distribution adjusting unit 15 is also made of an aluminum material in the same manner as the reflector 5, and the surface on the light emitting module 9 side is a mirror surface. In addition, here, the reflection plate 5 has the light distribution adjustment unit 15 having another configuration, but the light distribution adjustment unit may be formed by deforming the central portion of the reflection plate, for example.

The heat radiating plate 7 is substantially the same size as the reflecting plate 5 and is made of, for example, an aluminum plate, and is attached to the reflecting plate 5 by four support columns 4a to 4d.
The heat radiating plate 7 has such a size that heat generated when the light emitting module 9 is lit is sufficiently dissipated. Specifically, the temperature of the LED element at the time of lighting does not exceed a predetermined junction temperature. It is a size.

(2) Light-Emitting Module FIG. 4 is a view for explaining the light-emitting module, (a) is a plan view of the light-emitting module, and (b) is a YY cross section of (a) seen from the arrow direction. It is sectional drawing of a light emitting module, (c) is an enlarged view of the B section of (b).
As shown in FIG. 4, the light emitting module 9 is mainly provided on the back side of the insulating plate 25 for the purpose of enhancing the heat transfer effect and the insulating plate 25 having the light emitting portion 21 and the power feeding portion 23 formed on the front side. The metal plate 27 is provided. A metal base substrate (corresponding to the “substrate” of the present invention) is formed by laminating the insulating plate 25 and the metal plate 27 and having a wiring pattern for supplying power to the light emitting unit 21 on the surface of the insulating plate 25. .) 31.

  As shown in the cross-sectional view of FIG. 4B and the enlarged view of FIG. 4C, the light-emitting portion 21 has a wiring pattern (not shown) formed in a portion corresponding to the light-emitting portion 21 in the insulating plate 25. The mounted LED element 33, the resin body 35 covering the LED element 33, the reflection plate 39 having the reflection hole 37 in the portion corresponding to each LED element 33, and the reflection hole 37 of the reflection plate 39 A lens member 43 whose portion is the lens portion 41.

Here, as can be seen from FIG. 4A, a total of 64 LED elements 33 are mounted in an approximately square 8 × 8 array, and each resin element 35 covering each LED element 33 is provided with each LED. A phosphor that converts light emitted from the element 33 into a desired light color is included.
The reflection plate 39 is for reflecting the light emitted from the LED element 33 in a desired direction, and here, a trumpet-shaped reflection hole 37 whose front side (opposite side of the insulating plate 25 having the wiring pattern) is widened. have. The reason that the shape of the reflection hole 37 is a trumpet shape is to efficiently reflect the light emitted from the LED element 33 to the front side.

Here, the lens portion 41 fills the reflection hole 37 of the reflection plate 39 and has a shape that further protrudes in a hemispherical shape from the surface of the reflection plate 39. The lens member 43 including the lens portion 41 is, for example, a light transmitting member. It is made of a resin with excellent properties. The detailed configuration of the light emitting module 9 having the above configuration is described in Japanese Patent Laid-Open No. 2003-124528.
The width and length of the insulating plate 25 are wider than the width and length of the light emitting unit 21, respectively, and a blank portion is secured around the light emitting unit 21. That is, the light emitting part 21 is formed in the central region excluding the edge part of the insulating plate 25.

Here, as shown in FIG. 4A, the light emitting module 9 has a rectangular shape in plan view, and the light emitting unit 21 has a substantially square shape in plan view. Correspondingly, there are four edge portions 45a, 45b, 45c, and 45d on the surface of the insulating plate 25. In particular, when the edge portions are described regardless of the location, reference numeral 45 is used although not shown in the drawing.
The power supply unit 23 is for supplying power to each LED element 33. Here, the LED elements 33 are appropriately arranged in series and in parallel with each other by power supply terminals 23-n (n is an integer from 1 to 16) corresponding to each row and a wiring pattern (not shown). Electrically connected.

The light emitting module 9 having the above-described configuration is attached to the heat dissipation plate 7 via a socket described later. In this state, the power feeding unit 23 receives power from the power feeding terminal unit of the socket.
FIG. 5 is a view for explaining the mounting of the light emitting module to the socket.
As shown in the figure, the light emitting module 9 is mounted by being inserted into the socket 51 whose upper part is opened from above.

In a state where the light emitting module 9 is attached to the heat sink 7 via the socket 51, the metal base substrate 31 (to be exact, the metal plate 27) of the light emitting module 9 contacts the heat sink 7 so as to be capable of conducting heat. ing.
(3) Configuration of Socket FIG. 6 is a diagram showing a configuration of the back side of the socket.

  As shown in FIG. 4, the socket 51 is formed by combining a socket body 53 and a power supply unit 55. The socket body 53 is formed by, for example, pressing a stainless steel plate, and has a “U” -shaped top wall provided with an opening 57 that matches the size of the light emitting portion 21 of the light emitting module 9. 59 and side walls 60 and 61 extending from two sides adjacent to the opening of the top wall 59. As the material of the socket body 53, a material having excellent heat dissipation characteristics such as brass can be used in addition to the stainless steel plate.

  The side walls 60 and 61 are base portions with the top wall 59 and are bent at a substantially right angle with respect to the top wall 59, and then to the outside of the top wall 59 in the middle from the base portion to the tip portion. It is bent at a right angle. Three pressing portions 63, 65, and 67 are formed on the edge of the opening 57 of the socket 51. The pressing parts 63, 65, 67 have a spring structure integrally formed with the socket body 53.

  These pressing portions 63, 65, 67 are formed by leaving a T-shaped portion connected to the periphery of the opening when the opening 57 is punched, and then bending the T-shaped portion. The pressing portions 63, 65, and 67 include upright bars 63a, 65a, and 67a (67a not shown), horizontal bars 63b, 65b, and 67b supported by the upright bars, and horizontal bars 63b and 65b. , 67b are formed of pressing contact portions 63c, 63d, 65c, 65d, 67c, 67d formed by arranging both ends in a circular arc shape.

Here, the height of the socket 51 in the thickness direction is such that the light emitting module 9 is reliably pressed against the heat radiating plate 7 by the pressing portions 63, 65, 67. It is designed to be slightly smaller than the sum of the height.
On the other hand, a power supply unit 55 is provided at a position corresponding to the power supply unit 23 of the light emitting module 9 on the side of the inner surface of the ceiling wall 59 of the socket body 53 that has no side wall. As shown in FIG. 6, the power supply unit 55 is electrically conductive and has insertion / extraction (insertion / extraction) durability to a terminal holding member 71 (insulating housing) made of a resin material such as a liquid crystal polymer or a heat-resistant flame-retardant material. The external terminal 73-n (n is an integer of 1 to 16 and corresponds to “n” of the power supply terminal 23-n of the light emitting module 9) is held. .

  A portion of the external terminal 73-n extending from the terminal holding member 71 toward the opening 57 is a contact portion 75-n having a shape that warps so that the opposite side of the top wall 59 is convex in the thickness direction of the socket 51. (N is an integer of 1 to 16 and corresponds to “n” of the power supply terminal 23-n of the light emitting module 9). The reason why the shape of the contact portion 75-n is set in this way is to ensure contact (electrically connect) with the power supply terminal 23-n of the light emitting module 9.

  On the other hand, a portion of the external terminal 73-n that extends from the terminal holding member 71 to the side opposite to the opening 57 is, for example, a connection cable 77 (see FIG. 5) connected to the lighting unit 11 disposed on the back surface of the wall 3. Connected). The light emitting module 9 is removed by pulling out the light emitting module 9 from the opening 57 of the socket 51 along the heat sink 7. Note that the lighting unit 11 is connected to an external power source via a connection cable 79 as shown in FIG. The connection cable 77 is led out from the heat radiating plate 7, for example, through the inside of the column 4 d to the reflecting plate 5, and from the through hole of the reflecting plate 5 to the back side of the wall 3.

2. About lighting The case where the illuminating device of the said structure is lighted is demonstrated.
For example, when the lighting device 1 is turned on, the lighting unit 11 starts application of light to the light emitting module 9 to start light emission of the light emitting module 9 and lights up.
As shown in FIG. 1, the light emitted from the light emitting unit 21 of the light emitting module 9 reaches the light distribution adjusting unit 15, and along the reflecting plate 5 in each direction such as up and down, left and right by the light distribution adjusting unit 15. Thus, the light is radiated from the lighting device 1 in each direction.

  When the light emitting module 9 is turned on, heat is generated from the internal LED elements 33. This heat is transmitted to the insulating plate 25 and the metal plate 27. Since the metal plate 27 is in contact with the heat sink 7, the heat of the metal plate 27 is transmitted to the heat sink 7. The heat transmitted to the heat radiating plate 7 is transmitted so that the inside of the heat radiating plate 7 is spread over almost the entire range. Since the surface of the heat sink 7 (the main surface on the wall side and the main surface opposite to the wall side) is exposed to the atmosphere, the heat transferred from the light emitting module 9 is dissipated from the heat sink 7 to the atmosphere. The Thereby, the temperature rise of the light emission part 21, ie, the LED element 33, can be suppressed.

  Therefore, even if the amount of current applied to the LED element 33 is increased in order to increase the amount of light from the light emitting unit 21, the heat generated in the LED element 33 is radiated from the heat radiating plate 7. In particular, the size of the heat sink 7 is set so that the temperature of the LED element 33 when the LED element 33 is fully lit (brightest state) does not reach the specified junction temperature. There will be less occurrences of lowering and shorter life.

In the lighting device 1, the light emitting module 9 as a light source is mounted on the heat radiating plate 7, and the heat radiating plate 7 is attached to the reflecting plate 5 via the support columns 4a, 4b, 4c, 4d. Since the plate 5 is attached to the wall 3 with screws or the like, it is not necessary to provide a hole for the light emitting portion in the wall unlike a conventional indirect lighting device using an LED element.
Moreover, since the light emitting part 21 is set to have a beam angle of light emitted from each LED element 33 within 120 (°), it is difficult for light to leak directly from the lighting device 1 to the side surface, so that glare is not generated. Can be suppressed.

In general, when the beam angle of the LED element 33 is θ (°) and the distance between the surface of the light emitting portion 21 and the surface of the reflection plate 5 is D (see FIG. 3), the LED element 33 to the heat sink 7 Let L be the distance to the periphery of
L ≧ D · tanθ
If the above can be satisfied, the occurrence of glare can be suppressed.

<Modification>
As mentioned above, although this invention has been demonstrated based on embodiment, it cannot be overemphasized that this invention is not restricted to an above-described form, For example, it can also be set as the following forms.
1. Heat Dissipation Member (1) Shape In the embodiment, when the shape of the heat dissipation plate is viewed from the front, it is square, but the heat dissipation member according to the present invention may have other shapes. Other shapes include polygons such as a circular shape, an elliptical shape, a hexagonal shape, and the like, as well as various shapes in consideration of design.

Furthermore, although the heat radiating plate in the embodiment has a plate shape, the heat radiating member according to the present invention may have a three-dimensional shape such as a conical shape or a polygonal pyramid shape, or a design property. Various three-dimensional shapes may be taken into consideration.
(2) Heat dissipation The heat dissipation plate in the embodiment has not been processed to improve heat dissipation, but the heat dissipation member according to the present invention has, for example, a heat dissipation area (surface area) in order to improve heat dissipation. In order to increase the width, groove processing or the like may be performed. What is necessary is just to determine suitably the shape of the groove | channel in a thermal radiation member, and also the shape in the cross section of a groove | channel. Further, the surface to be processed for improving heat dissipation may be the outer surface of the heat radiating member that is visible to the human eye, or may be the surface on the wall side. When processing on the outer surface, the grooves may be formed in various patterns in consideration of the design, and in order to improve the heat dissipation, heat exchange is promoted on the surface of the heat sink, for example, anodized Processing may be performed.

(3) Material In the embodiment, an aluminum material is used for the heat radiating plate. However, the heat radiating member according to the present invention may be, for example, a ceramic material or a metal filler (for example, aluminum nitride). It may be a resin material (for example, epoxy resin).
2. Reflecting member In the embodiment, when the shape of the reflecting plate is a square when viewed from the front, the reflecting member according to the present invention may have another shape. Other shapes include polygons such as a circular shape, an elliptical shape, a hexagonal shape, and the like, as well as various shapes in consideration of design. Furthermore, although the reflector in the embodiment has the conical light distribution adjusting portion at the center thereof, the reflecting member according to the present invention does not have the light distribution adjusting portion and has a flat shape. May be.

Naturally, the light distribution adjusting unit can have a shape other than the conical shape in accordance with the light distribution characteristics of the lighting device.
In addition, the reflector and the heat radiating plate in the embodiment have the same shape and the same size, but the reflecting member and the heat radiating member according to the present invention may not be the same shape, and are not the same size. May be.

3. Light-Emitting Module (1) Number of Light-Emitting Elements The light-emitting module according to the embodiment has been described in which LED elements are arranged in a matrix of 8 rows and 8 columns, but the light-emitting module according to the present invention includes the number and arrangement of LED elements There are no particular restrictions on the method, the configuration of the LED element used, the type of phosphor, the presence or absence of a lens plate, the presence or absence of a reflecting mirror, and the like.

(2) Light-Emitting Element In the embodiment, an LED element is used as the light-emitting element. However, other elements such as a laser diode can be used as the semiconductor light-emitting element according to the present invention.
In the embodiment, the LED element is directly mounted on the substrate. However, the semiconductor light emitting element according to the present invention may be indirectly mounted on the substrate (so-called submount).

FIG. 7 is a diagram illustrating an example in which a light emitting element is mounted in a submant. In addition, the same code | symbol is used about the same part as embodiment, The description is abbreviate | omitted.
The submount 101 is, for example, a silicon substrate (hereinafter referred to as “Si substrate”) 103, a semiconductor light emitting element mounted on the upper surface of the Si substrate 103, for example, an LED element 33, and a resin that encapsulates the LED element 33. A body 105.

A first terminal electrically connected to one electrode of the LED element 33 is electrically connected to the lower surface of the Si substrate 103, and an other electrode of the LED element 33 is electrically connected to the upper surface of the Si substrate 103. The formed second terminals are respectively formed.
The submount 101 is mounted on the metal base substrate 31 by, for example, die bonding using a silver paste 107, and the first terminal on the lower surface of the Si substrate 103 is connected to the wiring pattern on the surface of the insulating plate 25 via the silver paste 107. In addition, the second terminal on the upper surface of the Si substrate 103 is wire-bonded to the wiring pattern of the insulating plate 25 via the wire 109.

In addition, as shown in FIG. 7, since the LED element 33 is previously mounted on the Si substrate 103, the submount 101 is inspected to check whether the mounted LED element 33 is normally lit. This can be done before mounting on the metal base substrate 31.
For this reason, for example, the inspected submount 101 can be mounted on the metal base substrate 31, and the manufacturing yield as the light emitting module can be improved. In addition, when the light colors emitted from the submount 101 vary, there is a merit that the submounts 101 with similar colors can be selected and used, or those that emit light of a color that meets the requirements can be collected and mounted. is there.

(3) Substrate In the embodiment, the metal base substrate 31 composed of the insulating plate 25 and the metal plate 27 is used. However, the substrate according to the present invention may be composed only of the insulating plate. Or you may comprise only from a metal plate. In the case where a metal base substrate is used, the insulating plate may have a multilayer structure including a plurality of layers.

(4) Light emission color In the embodiment, the light color emitted from the light emission module is white. However, the light emission module according to the present invention may have a plurality of light colors. Each color of blue and green may be emitted and mixed to obtain a desired light color. In this case, it is necessary to provide a lighting circuit that can adjust the amount of light of each color of red, blue, and green.

4). Lighting unit In the embodiment, the light emitting module is fully lit, but in the lighting device according to the present invention, the light emitting module may be fully lit and dimmed. In this case, it is necessary to provide a lighting circuit capable of dimming and lighting the semiconductor light emitting element.
5). Socket In the above embodiment, the light emitting module can be attached and detached by inserting and removing the light emitting module along the heat sink, but the socket according to the present invention may be of another type, for example, light emitting The socket may be screwed to the heat radiating member in a state where the module is set at a predetermined position of the heat radiating member and the light emitting module is covered from the light emitting surface side.

FIG. 8 is a view showing a modified example of the socket.
The socket 200 is formed by combining a socket main body 202 and a power supply unit 204 in the same manner as the socket 51 of the first embodiment. The socket body 202 is formed by, for example, pressing a stainless steel plate, and has a rectangular ceiling wall 208 provided with an opening 206 that matches the size of the light emitting portion 21 of the light emitting module 9, and a ceiling wall. 208 includes side walls 210, 212, and 214 extending from three sides excluding the side where the power supply unit 204 is located.

  Among the side walls 210, 212, and 214, the side walls 212 and 214 corresponding to the long side of the top wall 208 are bent at right angles to the outside of the top wall 208 at the intermediate part from the base part to the tip part of the top wall 208. is doing. Then, the outwardly extending portions (hereinafter referred to as “extended portions”) 212a and 214a have through holes 218, 220, 222, and 224 (through holes 222 and 224 are shown in FIG. Only one appears.) Is formed.

On the edge of the opening 206 of the socket 200, four pressing parts 226 similar to those in the first embodiment (not shown in FIG. 8) are formed.
On the other hand, on the inner side of the top wall 208 of the socket main body 202 and without the side wall, a power supply unit 204 is provided at a position corresponding to the power supply unit 23 of the light emitting module 9 as in the first embodiment. Yes. As in the first embodiment, the power supply unit 204 has an external terminal 228-n (n is an integer of 1 to 16, and corresponds to “n” of the power supply terminal 23-n of the light emitting module 9). Have).

To attach the light emitting module 9 to the heat radiating plate 7, first, the light emitting module 9 is set at the attachment position of the heat radiating plate 7, and then the light emitting portion 21 of the light emitting module 9 is fitted into the opening 206 of the socket 200. The light emitting module 9 is covered with the socket 200, and the extended portions 212 a and 214 a of the socket 200 are brought into contact with the heat sink 7.
In this state, the four screws 232, 234, 236, 238 are moved from the through holes 218, 220, 222, 224 of the extended portions 212 a, 214 a to the screw holes 242, 244, 246, 248 ( 24 is not shown in FIG. 8), and the mounting of the socket 200 covering the light emitting module 9 is completed.

6). About a reflection member and a heat radiating member (1) About space | interval of both In the said embodiment, the heat sink 7 and the reflector 5 are fixed with respect to the wall 3, and the space | interval of the reflector 5 and the heat sink 7 is constant. However, for example, at least one of the reflecting plate and the heat radiating plate may be configured to be movable in the perspective direction with respect to the wall 3 so that the distance between the two can be adjusted.

FIG. 9 is a diagram showing a schematic diagram of an illuminating device in which the reflecting plate is movable.
The lighting device 300 has a plurality of, for example, four columns 303a, 303b, 303c, and 303d (for example, 303b and 303c are 303a and 303d, and are not shown in FIG. 9) installed upright on the wall 3. The heat sink 305 supported in a state of facing the wall 3 through the columns 303a to 303d, the light emitting module 307 mounted at a predetermined position of the heat sink 305, for example, substantially the center, and the heat sink A reflector 309 mounted on the support columns 303a to 303d in a state where the distance from the 305 can be adjusted, and a lighting unit 311 for causing the light emitting module 307 to emit light. Here, the heat radiating plate 305, the light emitting module 307, and the reflecting plate 309 have the same configuration as the heat radiating plate 7, the light emitting module 9, and the reflecting plate 5 in the embodiment.

  In this example, the four support columns 303a to 303d use screw shafts, and one end is inserted into the through holes 3a to 3d (3b and 3c are not shown in FIG. 9) provided in the wall 3. The back side of the wall 3 is screwed to the wall 3 by female screw members (nuts) 313a to 313d. A pair of female screw members (nuts) 315a to 315d and 317a to 317d sandwiching the reflection plate 309 are attached to each of the columns 303a to 303d. Through holes larger than the diameter are formed at corresponding positions near the four corners of the square shape.

The movement of the reflector 309 relative to the heat sink 305 is performed by loosening the pair of female screw members 315a to 315d and 317a to 317d sandwiching the reflector 309, and fixing the reflector 309 to the heat sink 305 (keep the distance constant). Is performed by tightening the pair of female screw members 315 a to 315 d and 317 a to 317 d from both sides of the reflection plate 309.
Note that the cable 319 for connecting the light emitting module 307 and the lighting unit 311 is led out from the light emitting module 307 to the back of the wall 3 through one column, here the column 303d, as in the embodiment. Yes.

(2) Regarding the inclination of the heat sink In the above embodiment and the above modification, the posture of the heat sinks 7, 305 and the reflectors 5, 309 is fixed, that is, the positions of the reflectors 5, 309 and the heat sinks 7, 305 are fixed. Although the posture is constant, for example, at least one of the reflecting plate and the heat radiating plate may be changeable.
FIG. 10 is a diagram illustrating a schematic diagram of a lighting device in which the posture of the heat sink can be changed.

  As in the embodiment, the illuminating device 350 is opposed to the wall 3 through the reflector plate 353 attached to the wall 3, the support member 355 attached to the reflector 353, and the support member 355. In addition, a heat sink 357 supported in a state in which the posture can be changed, a light emitting module 359 mounted at a predetermined position of the heat sink 357, for example, substantially in the center, and lighting for causing the light emitting module 359 to emit light (Not shown). Here, the basic configurations of the heat dissipation plate 357, the light emitting module 359, and the reflection plate 353 are the same as those of the heat dissipation plate 7, the light emitting module 9, and the reflection plate 5 of the embodiment.

  The support member 355 has a spherical front end (this portion is referred to as a “spherical portion 361”), and a portion extending from the base of the spherical portion 361 to the other end side is a male screw (this portion is referred to as a “male screw portion 363). And a movable portion 365 and a fixed portion 369 which has a cylindrical shape and has an inner peripheral surface which is a female screw portion 367 screwed into the male screw portion 363, and the movable portion 365 is a male screw portion 363. The movable portion 365 expands and contracts in the axial direction with respect to the fixed portion 369 by rotating about the axis of the center.

The heat radiating plate 357 is provided with a receiving portion 371 having a cavity having substantially the same shape as the outer peripheral shape of the spherical portion 361 of the column member 355, and the receiving unit 371 rotates in all directions with respect to the column member 355. It is free. Thereby, the attitude | position of the heat sink 357 can be arbitrarily adjusted with respect to the reflecting plate 353. FIG.
In addition, the support | pillar member 355 is provided below the light distribution adjustment part 373 (a lower side and a lower part are included), for example. This is because the illumination device 350 mainly illuminates the upper side, so that the shadow of the column member 355 does not appear upward. Therefore, for example, in an illuminating device that mainly illuminates the lower part of the apparatus, it is preferable that the support member is provided above, above or above the light distribution adjusting unit.

(3) Positional relationship between heat radiating member and reflecting member In the embodiment and the modified examples, the reflecting plates 5, 309, 353 are closer to the wall 3 than the heat radiating plates 7, 305, 357, that is, the heat radiating plate 7 , 305, 357 and the wall 3, and the light emitting modules 9, 307, 359 are mounted on the wall side surfaces of the heat sinks 7, 305, 357. However, the lighting device of the present invention is not limited to the above-described positional relationship between the heat dissipation member and the reflection member. For example, the heat dissipation member is arranged in a state closer to the wall than the reflection member, and the light emitting module is in the heat dissipation member. It may be mounted on the surface opposite to the wall side.

FIG. 11 is a view showing a lighting device in which the light emitting module is mounted on the surface of the heat sink opposite to the wall.
Similarly to the embodiment, the lighting device 400 appears in FIG. 11 because a plurality of, for example, four columns 403a, 403b, 403c, and 403d (403b and 403c are 403a and 403d) attached to the wall 3. And the support columns 403a to 403d in a state in which the distance between the reflection plate 405 supported in a state of facing the wall 3 via the support columns 403a to 403d and the reflection plate 405 can be adjusted. And a light emitting module 409 mounted at a predetermined position of the heat radiating plate 407, for example, a substantially central position, and a lighting unit 411 for causing the light emitting module 409 to emit light.

The four struts 403a to 403d are screwed by female screw members 413a to 413d on the back side of the wall 3 with one end thereof being inserted into a through hole (see FIG. 9) provided in the wall 3.
The heat radiating plate 407 is movable in a direction perpendicular to the main surface of the wall by a pair of female screw members (nuts) 415a to 415d and 417a to 417d sandwiching the heat radiating plate 407. The reflection plate 405 is deformed so that the center portion protrudes toward the light emitting module 409. Specifically, as the distance from the end of the reflecting plate 405 approaches the center position, the light emitting module 409 is linearly approached. When the reflecting plate 405 is viewed from the light emitting module 409 side, the shape of the reflecting plate 405 is conical. It has become.

7). Others In the above-described embodiments and modifications, examples of the illumination device according to the present invention have been described. However, it goes without saying that a device combining these may be used.

  INDUSTRIAL APPLICABILITY The present invention can be used for a lighting device that suppresses the occurrence of glare and has excellent heat dissipation characteristics.

It is a perspective view of the illuminating device which concerns on this Embodiment. It is a front view of an illuminating device. It is the figure which looked at the illuminating device from the arrow direction of the cross section in the XX line of FIG. It is a figure for demonstrating a light emitting module. It is a figure for demonstrating mounting | wearing to the socket of a light emitting module. It is a figure which shows the structure of the back side of a socket. It is a figure which shows the example which mounted the light emitting element by the submant. It is a figure which shows the modification of a socket. It is a figure which shows the schematic of the illuminating device which enabled the reflecting plate to move. It is a figure which shows the schematic of the illuminating device which enabled change of the attitude | position of a heat sink. It is a figure which shows the illuminating device with which the light emitting module was mounted | worn with the surface on the opposite side to the wall in a heat sink.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Illuminating device 5 Reflecting plate 7 Heat sink 9 Light emitting module 11 Lighting part 25 Insulating plate 27 Metal plate 31 Metal base substrate 33 LED element

Claims (10)

A lighting device mounted on a wall,
A post that will be erected on the wall,
A heat radiating portion that will be支架to the post in a state away from the wall,
A light emitting unit having a substrate and a semiconductor light emitting element provided on the front side of the substrate;
The heat dissipation part has a flat surface on the wall side,
The lighting device, wherein the light emitting unit is attached to the heat radiating unit in a state where the back surface of the substrate is pressed against the flat surface of the heat radiating unit so as to allow heat conduction . The lighting device according to claim 1, wherein the heat radiating portion is made of an aluminum material . Wherein between the heat radiating portion and the wall, the illumination device according to claim 1 or 2, characterized in that the reflecting portion for reflecting the light emitted from the light emitting unit in a desired direction is provided. The reflection portion includes a light distribution adjustment portion having a conical shape,
The lighting device according to claim 3 , wherein a central axis of the cone and a virtual line segment that passes through a substantial center of a light emitting portion of the light emitting unit and is orthogonal to the light emitting surface substantially coincide . The lighting device according to claim 3 , wherein the reflecting portion is movable in a perspective direction with respect to the wall . The lighting device according to claim 3, wherein the reflecting portion is directly attached to the wall. The lighting device according to claim 1, wherein the heat radiating portion is movable in a perspective direction with respect to the wall. The lighting device according to claim 1, wherein a posture of the heat radiating unit can be changed. The beam angle of light emitted from the light emitting unit is θ (°), the distance between the light emitting unit mounting surface and the reflecting member is D, and the distance from the semiconductor light emitting element of the light emitting unit to the periphery of the heat radiating unit is L. Then,
L ≧ D · tanθ
The lighting device according to claim 3 or 6, wherein: The illumination device according to claim 1, wherein a beam angle of light emitted from the light emitting unit is 120 ° or less.

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