JP2010198807A - Lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a conventional lighting device has a configuration in which a power supply for lighting an LED is provided inside a polytope 102, therefore, heat generated from the power supply accumulates inside the polytope 102 and the power supply is put under a high temperature for a long period of time, consequently, it causes various adverse effects. <P>SOLUTION: A lighting device includes a first heat dissipation part for dissipating heat generated from the power supply 4 via a light source 3. Consequently, the lighting device efficiently dissipates heat without allowing the heat to accumulate in the light source 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an illuminating device including a light source unit including a power source unit for lighting a light source, and more particularly, to an illuminating device capable of dissipating heat generated from the power source unit via the light source unit. Is.

  As a conventional lighting device, for example, a technology relating to a lighting device that can be miniaturized while utilizing a limited space and having wide directivity has been proposed (see Patent Document 1).

  As shown in FIG. 9, a lighting bulb that is a conventional lighting device described in Patent Document 1 is a regular pentagonal substrate on which LEDs 100 (hereinafter referred to as chip-type LEDs) mounted with four LED chips are mounted. The six-piece 101a and fifteen regular hexagonal substrates 101b (hereinafter referred to as the substrate 101) are three-dimensionally assembled to form a substantially spherical polyhedron 102, and the chip-type LED 100 is formed in the inner space of the polyhedron 102. It is the structure provided with the power supply and power supply circuit (henceforth a power supply part) for lighting up.

JP 2002-184207 A

  In the conventional lighting device, since the power unit for turning on the chip-type LED 100 is provided inside the polyhedron 102, the heat generated from the power unit stays in the polyhedron 102, and therefore the power source Therefore, when the power supply unit is kept at a high temperature for a long time, the temperature characteristics of the components constituting the power supply unit may vary or the components may be damaged. There is a problem of inducing.

  An object of the present invention is to provide a lighting device capable of efficiently dissipating heat generated from the power supply unit. To do.

  In order to achieve the above object, the present invention provides a lighting device in which a light source unit having a light source for illumination is internally provided with a power source unit such as a power circuit for lighting the light source. A heat dissipating part for dissipating heat through the light source part is provided.

  According to the above invention, since the heat from the power supply unit is radiated through the light source unit which is a heat radiating unit, it is possible to efficiently radiate heat without the heat remaining in the light source unit. The temperature characteristics of the components constituting the power supply unit can vary, or the components can be damaged, so that the failure of the power supply unit can be reliably prevented, and a long-life lighting device can be provided. .

  The heat radiating unit is an optical member that receives light emitted from the light source, and the optical member is a light guide member that guides light from the light source or a reflective member that reflects light from the light source. It is characterized by being.

  According to the present invention, the heat generated from the power supply unit is radiated to the outside through an optical member such as a light guide member or a reflection member. Without providing, it is possible to obtain a lighting device capable of performing heat dissipation with a simpler configuration.

  Further, heat generated from the power supply unit is conducted to the light source unit through a heat conducting member, and is radiated from the heat radiating unit.

  According to the present invention, the local heat generated from the power supply circuit or the like is diffused through the heat transfer member and then conducted to the light source unit, so that the heat is conducted over the entire inner peripheral surface of the light source unit. Can do. Therefore, the heat from the power supply unit built in the light source unit can be dissipated substantially uniformly over the entire outer peripheral surface of the light source unit, so that a lighting device with improved heat dissipation efficiency can be provided.

  In addition, the heat radiating part that radiates heat through the light source part is used as a first heat radiating part, and heat generated from the light source is radiated from a second heat radiating part different from the first heat radiating part. It is characterized by.

  According to the present invention, the heat generated from the power supply unit can be radiated through the light source unit and can be radiated through the second heat radiating unit different from the light source unit. Therefore, heat can be radiated through a plurality of heat radiating portions in accordance with the amount of heat generated by the power supply unit, so that the illuminating device with improved heat radiation efficiency can be provided as the entire lighting device.

  The heat generated from the light source is radiated from the first heat radiating portion.

  According to the present invention, since heat is radiated from the first heat radiating part and the second heat radiating part through the light source part, effective heat radiation can be performed without separately providing a heat radiating means for actively radiating heat. Can do. Therefore, in addition to the original function, an illumination device having a function as a heat radiating unit can be obtained, so that heat can be efficiently radiated with a simpler configuration.

  Furthermore, the heat generated from the power supply unit is also radiated from the second heat radiating unit.

  According to the present invention, according to the present invention, heat generated from the power supply unit is radiated through the light source unit, and heat generated from the light source is transmitted through a second heat radiating unit different from the light source unit. Can be dissipated individually. Therefore, heat from the light source that generates a larger amount of heat than the power source can be effectively dissipated through a heat radiating part that is different from the light source part, thus preventing metal deterioration and disconnection of the electrode part due to heat, A long-life light source can be obtained.

  The light source is a light emitting diode.

  According to the present invention, since the light from the light emitting diode having directivity is irradiated onto the light guide member, the light can be guided to the side farther from the light incident surface of the light guide member.

  According to the present invention, since it is configured as described above, the heat generated from the power supply unit can be efficiently radiated through the light source unit, and there is no variation in component characteristics due to temperature, and the cause of failure can be generated. A long-life lighting device that is suppressed can be provided.

It is principal part sectional drawing which shows the structure of the illuminating device concerning Example 1 of this invention. It is a perspective view regarding the heat radiating member of the illuminating device concerning Example 1 of this invention. It is a perspective view regarding the light guide member of the illuminating device concerning Example 1 of this invention. It is a perspective view regarding the light guide member of the illuminating device concerning Example 1 of this invention. It is principal part sectional drawing which shows the structure of the illuminating device concerning Example 2 of this invention. It is a whole perspective view of the illuminating device concerning Example 3 of this invention. It is principal part sectional drawing which shows the structure of the illuminating device concerning Example 3 of this invention. It is a principal part enlarged view which shows the other Example regarding the heat radiating member of this invention. It is the schematic which shows the structure of the conventional illuminating device.

  Hereinafter, a lighting device according to a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view of a main part of an illumination device according to Embodiment 1 of the illumination device of the present invention. FIG. 2 is an enlarged view of a main part related to a heat radiating member of the lighting apparatus according to the first embodiment of the lighting apparatus of the present invention, and FIGS. 3 and 4 are enlarged views of a main part related to the light guide member.

  The illuminating device 1 according to the first embodiment includes a light source 2 composed of LEDs for illumination, an optical member composed of a light guide member 3A that guides light from the light source 2, and a power supply circuit that lights the power source 2 The power source unit 4 including the light source 2 and the optical member, and the light source unit 3 including the power source unit 4 and the heat radiating member connected to the light source unit 3 and dissipating heat generated from the light source 2 7 and a base 8 having a predetermined size.

  The light source 2 uses an LED for illumination, and the LED is a pseudo white LED in which one or a plurality of LED chips are sealed with a resin material containing a phosphor. The LED emits light to the blue light emitted from the LED chip using a yellow phosphor, so that the light emitted from the LED includes the blue light from the LED chip and the yellow light from the phosphor. Is visually recognized as white.

  In particular, as shown in FIG. 2, the six LEDs are arranged on the inclined surface 7C of the heat radiating member 7 described later at substantially equal intervals, and the light emitted from the LEDs is the light incident surface 3d of the light guide member 3A. To the inside.

  The light guide member 3A, which is the optical member, has a refractive index sufficiently higher than that of air and is substantially transparent (excellent in translucency), such as a synthetic resin (for example, acrylic or polycarbonate) or glass. 3 is formed into a substantially spherical shape having a smooth outer peripheral surface 3b and an inner peripheral surface 3a, as shown in FIG. 3, and provided with an opening 3c for receiving (introducing) light from the light source 2. ing.

  The opening 3c has a light incident surface 3d for allowing light from the light source 2 to enter, and the light incident surface 3d is an inclined surface inclined at approximately 45 ° with respect to the opening 3c. Accordingly, the light emitted from the light incident surface 3d to the inside of the light guide member 3A repeats total reflection in the light guide member 3A and is emitted from the outer peripheral surface 3b side which is a light emission surface. Therefore, since the light irradiated from the light source 2 is emitted over the entire outer peripheral surface 3b of the light guide member 3A, the light can be emitted in almost all directions, and the lighting device 1 having a wide directivity can be obtained.

  As shown in FIG. 1, the light incident surface 3d of the light guide member 3A is joined to an inclined surface 7C of the heat radiating member 7 described later. Since the light source 2 is mounted on the inclined surface 7C, a recess for fitting the light source 2 is formed on the light incident surface 3d joined to the inclined surface 7C. Therefore, since the light emitted from the light source 2 is emitted from the joint surface between the light guide member 3A and the heat radiating member 7 to the light guide member 3A without leaking, the light utilization efficiency is improved.

  The joint surface between the light guide member 3A and the inclined surface 7C is adhered using a light-transmitting adhesive to prevent the entry of dust, water, and the like from the outside. Therefore, it is possible to prevent damage to parts such as the power supply unit 4 incorporated in the light guide member 3A, and to obtain the lighting device 1 that is safe and has a long life.

  As shown in FIG. 3, the light guide member 3 </ b> A is provided with an interior space in which a power supply unit 4 to be described later is provided, and in order to effectively dissipate heat generated from the power supply unit 4 provided in the interior to the outside, It is desirable to form using a material with good infrared transmission. Synthetic resin is not a material with good thermal conductivity because heat transferability is about 1/5 compared to glass, but there is no risk of cracking and scattering like glass, so light guiding member 3A. Can be formed thinly. Therefore, in this embodiment, the light guide member 3A is formed using a synthetic resin.

  In order to efficiently conduct the heat generated from the power supply unit 4 built in the light guide member 3A to the light source unit 3, a reflective film made of a metal film may be provided on the inner peripheral surface 3a. Since the reflective film forms an oxide film on the surface thereof, the inner peripheral area (heat transfer area) of the inner peripheral surface 3 a can be increased, and more heat can be transferred to the light source unit 3. Therefore, the lighting device 1 with improved heat dissipation efficiency can be provided.

  In order to effectively dissipate heat through the light guide member 3A, a paint may be applied to the inner peripheral surface 3a. Therefore, the heat generated from the power supply unit 4 can be efficiently radiated to the outside.

  In order to efficiently dissipate the heat from the power supply unit 4 provided in the interior, the inner peripheral surface 3a of the light guide member 3A is provided with a fine uneven shape, a groove shape, etc., and the inner peripheral area (heat transfer area) is increased. It may be increased.

  Further, when the inner peripheral surface 3a is provided with an uneven shape or a groove shape, the heat from the power source unit 4 is more efficiently transferred to the light source unit 3 and the light guide member 3A can be efficiently used. Illumination light can be extracted. Therefore, in order to extract illumination light efficiently, the outer peripheral surface 3b may be provided with an uneven shape or a groove shape in addition to the inner peripheral surface 3a. That is, the light incident on the light guide member 3A is diffused by the uneven shape or groove shape provided on the inner peripheral surface 3a and the outer peripheral surface 3b of the light guide member 3A, and the diffused light is directed to the inner peripheral surface 3a side. Reflected to the outer peripheral surface 3b side by the provided reflecting member 3B and emitted from the outer peripheral surface 3b. Therefore, the illuminating device 1 which can radiate | emit light substantially uniformly over the outer peripheral surface 3b whole surface can be obtained.

  However, in consideration of breakage and cleaning of the lighting device 1, it is preferable to provide the fine uneven shape and groove shape on the inner peripheral surface 3a of the light guide member 3A.

  The uneven shape and the groove shape are appropriately changed according to the shape of the light guide member 3A, such as the size, depth, and shape, so that the outer peripheral surface 3b is independent of the shape of the light guide member 3A. Light can be emitted over the entire surface, and the amount of light emitted from the outer peripheral surface 3b can be controlled. For example, by providing more irregularities and groove shapes in a region farther from the light incident surface 3d where the amount of light guided from the light source 2 decreases, the light incident surface 3d of the light exit surface 3b (outer peripheral surface) is provided. It is possible to provide the illuminating device 1 in which the difference in the light emission amount between the near side and the far side is made as small as possible and the light emission amount is substantially uniform over the entire outer peripheral surface 3b.

  As described above, the light guide member 3 </ b> A has a function as a heat radiating unit in addition to a function of guiding light from the light source 2.

  The reflecting member 3B, which is the optical member, is a mirror surface on which a metal such as aluminum or silver is deposited on the inner peripheral surface 3a side of the light guide member 3A. The light irradiated from the light incident surface 3d to the inside of the light guide member 3A repeats total reflection in the light guide member 3A, and the outer peripheral surface 3b which is a light emitting surface by the reflecting member 3B provided on the inner peripheral surface 3a side. It is reflected to the side and emitted from the outer peripheral surface 3b.

  Since the reflection member 3B is provided over the entire inner peripheral surface 3a of the light guide member 3B, the light incident surface is not irradiated from the inner peripheral surface 3a into the interior space. All of the light incident from 3d can be emitted to the outside from the outer peripheral surface 3b. Therefore, the illuminating device 1 with improved utilization efficiency of light emitted from the light source 2 can be obtained.

  Moreover, in order to improve the utilization efficiency of the light from the light source 2, the reflection member 3B is deposited by varying the deposition amount of the metal per unit area, whereby the amount of light emitted from the outer peripheral surface 3a ( Hereinafter, it can be controlled. For example, the light guide member 3A may be vapor-deposited in consideration of light and shade gradation such as increasing the vapor deposition amount in the shape of the light guide member 3A, in particular, where light is desired to be emitted.

  And you may vapor-deposit directly on the internal peripheral surface of the said light guide member 3A. When directly vapor-deposited on the inner peripheral surface 3a, the reflecting member 3B can be made thinner, so that heat easily occurs on the inner peripheral surface and the outer peripheral surface of the reflecting member 3B. The heat generated from the power supply unit 4 can be efficiently transferred by the light guide member 3A. Therefore, the illuminating device 1 which can perform effective heat dissipation can be provided.

  In addition, in order to improve the heat transfer efficiency to the said reflection member 3B, you may form with a material with favorable heat conductivity, or may use a reflective sheet.

  In addition, when the fine uneven | corrugated shape and groove shape are provided in the internal peripheral surface of the said light guide member 3A, it is desirable to provide the same shape also regarding the said reflection member 3B. Also on the inner peripheral surface of the reflecting member 3B, when the fine uneven shape and the groove shape are provided, the inner peripheral area (heat transfer area) increases, so that the heat generated from the power supply unit 4 is effectively conducted. The lighting device 1 that can be conducted to the optical member 3A and has improved heat dissipation efficiency can be obtained.

  In addition, although the said reflection member 3B is provided in the internal peripheral surface 3a in order to improve the utilization efficiency of the light from the light source 2, depending on the shape of the said light guide member 3A, without using the reflection member 3B, it is substantially. In some cases, uniform light can be emitted from the outer peripheral surface 3b. In that case, it is also possible to configure the light source unit 3 without using the reflecting member 3B, which leads to a reduction in parts and the lighting device 1 with reduced cost.

  However, the provision of the reflection member 3B prevents the inside of the light source unit 3 from being seen through, so that the power supply unit 4 built in the light guide member 3A having transparency cannot be visually recognized. In addition, it is possible to provide the lighting device 1 that is excellent in design.

  As described above, the light guide member 3A or the reflection member 3B, which is an optical member that forms the light source unit 3, guides light from the light source 2 and reflects it to the outer peripheral surface 3b side. It also has a function as a heat radiating part that radiates heat from the power supply part 4 built in the light source part 3.

  As described above, the light source unit 3 includes the light source 2 including the illumination LED, the substantially spherical light guide member 3A that guides light emitted from the light source 2 through the light incident surface 3d, and the light guide. Of the light that guides the inside of the member 3A, the reflecting member 3B reflects the light on the inner peripheral surface 3a side to the outer peripheral surface 3b side.

  The light source unit 3 functions as an optical member that irradiates light from the light source 2 over the entire outer peripheral surface 3b of the light guide member 3A, and as a heat radiating unit for radiating heat generated from the built-in power supply unit 4. It has a function. Therefore, the illuminating device 1 which does not need to be separately provided with the heat radiating part for radiating the heat from the power supply part 4 effectively can be provided.

  Subsequently, the power supply substrate 4A, the power supply circuit component 4B (power supply circuit), the heat conductive sheet 4D, and the power supply support plate 4C that constitute the power supply unit 4 will be described in order. The power supply board 4A is formed in a disk shape with a material having high thermal conductivity including aluminum and copper, and a plurality of power supply circuit components that convert alternating current into direct current for lighting the light source 2 on the power supply board 4A. 4B is implemented. The power supply circuit component 4B mounted on one surface 4a of the power supply substrate 4A is soldered from the other surface 4b (solder surface) to hold the power supply circuit component 4B.

  The solder portion of the other surface 4b is easily melted due to the influence of heat from the surroundings, and may cause cracks due to thermal fatigue and cause poor conduction. Therefore, the solder portion uses a heat resistant material. In addition, it is desirable that the configuration is not affected by the heat generated from the light source 2 that is a heat source.

  Therefore, in this embodiment, the design of heat dissipation structure is such that the temperature of the solder portion does not exceed 80 ° C., and as shown in FIG. 1, the solder surface 4b side of the power supply substrate 4A is a heat source. It arrange | positioned so that it may distance from the light source 2 which is. That is, when viewed from the opening 3c of the light guide member 3A, the solder surface 4b directly affects the influence of the heat from the light source 2 by lining up the surface 4a on which the power circuit component 4B is mounted. It becomes the composition which does not receive. Therefore, it is possible to provide the safe lighting device 1 in which the solder portion is prevented from being melted due to the influence of heat from the light source 2 or cracking due to thermal fatigue, and the failure of the power supply unit 4 is suppressed. it can. Moreover, since a commercial power supply can be applied directly, the illuminating device 1 compatible with the conventional incandescent lamp can be provided.

  As shown in FIG. 1, the power supply substrate 4A and the power supply circuit component 4B are housed and held in the light guide member 3A. Therefore, it is desirable that the power supply substrate 4A has a size that can be inserted from the opening 3c of the light guide member 3A. Further, when the size of the power supply substrate 4A is larger than the size of the opening 3c and cannot be inserted from the opening 3c, the light guide member 3A is divided into a hemispherical shape as shown in FIG. The problem can be solved. That is, after assembling the power supply unit 4, the power supply unit 4 can be embedded in the light guide member 3 </ b> A by bonding the hemispherical light guide member 3 </ b> A with a light-transmitting adhesive. Further, when the light guide member 3A is divided into hemispheres, the light introduced from the light incident surface 3d is divided in the light guide member 3A without being obstructed in the traveling direction by dividing the light guide member 3A in the direction perpendicular to the opening 3c. It can be guided (propagated).

  The power supply board 4A is connected to the light source 2 by a harness 9. The length of the harness 9 can be adjusted according to the arrangement distance between the power supply board 4A and the light source 2, so that the optimum length is obtained. The interior space can be effectively utilized.

  Further, the power supply board 4A has a through hole (not shown) in a place where the surrounding power circuit component 4B is not mounted, and a power column 6 and a spacer 5 to be described later are connected through the through hole. It has the structure hold | maintained with the same screw | thread.

  The power supply support plate 4C is formed in a disk shape from a metal such as aluminum or copper, and local heat generated from the power supply circuit component 4B and the power supply substrate 4A, which are heat sources, is applied to the light guide member 3A. It has a function of using and diffusing. Therefore, the heat generated from the power supply substrate 4A and the power supply circuit component 4B is diffused into the interior space of the light guide member 3A via a heat conductive sheet 4D (heat conductive member) described later, and is transmitted to the power support plate 4C ( Heat transfer) and further diffused into the interior space via the power support plate 4C. That is, the power supply support plate 4C is a heat conduction member that conducts heat generated from the power supply board 4A or the power supply circuit component 4B to the light source unit 3 (light guide member 3A and reflection member 3B). Therefore, the heat generated from the power supply circuit component 4B is diffused in the limited interior space, so that the heat can be efficiently transferred to the inner peripheral surface 3a of the light guide member 3A and the reflection member 3B. Therefore, heat can be radiated to the outside through the light source unit 3 (light guide member 3A and reflection member 3B) without heat remaining in the interior space of the light guide member 3A.

  The power supply support plate 4C is formed with a through hole (not shown) for joining with a power supply column 6 to be described later, and the power supply substrate 4A, a spacer 5 to be described later, and the like with the same screw through the through hole. It is the structure joined to the power supply column 6.

  The thermal conductive sheet 4D has high thermal conductivity, flame retardancy, and self-adhesiveness, and is provided between the power supply substrate 4A and the power supply support plate 4C. The heat conduction sheet 4D is a heat conduction member for conducting local heat generated from the power supply substrate 4A and the power supply circuit component 4B to the power supply support plate 4C, and is a limited space as an interior space of the light guide member 3A. Therefore, heat can be efficiently transferred to the inner peripheral surface 3a of the light guide member 3A and the reflection member 3B. Therefore, effective heat dissipation can be performed through the light source unit 3 (the light guide member 3A and the reflection member 3B) without thermally melting the solder portion of the power supply substrate 4A.

  In addition to the heat conductive sheet 4D, it is conceivable to fill a resin for heat transfer or to transfer heat by air without any interposition, but when nothing is intervened, the heat conductive sheet 4D It is considered that such a heat transfer effect cannot be expected.

  Further, a spacer 5 is interposed between the power supply support plate 4C and the power supply substrate 4A in order to keep the distance constant. The spacer 5 is a hollow rod-shaped member made of a flame-retardant plastic such as polybutylene terephthalate (PBT) or an insulating material such as porcelain, and electrically connects the power supply support plate 4C and the power supply substrate 4A. This is to insulate and prevent the solder surface 4b from being stressed when the power supply substrate 4A is fixed.

  Next, a description will be given of the power supply column 6 in which the power supply unit 4 is housed in the light guide member 3A and supported by the heat radiating member 7 described later. The power supply column 6 is used to keep the distance between the power supply support plate 4C and the mounting surface 7B of the heat radiating member 7 constant, and is a rod-shaped member formed of an insulating material such as flame retardant plastic or porcelain. It is a member.

  The power supply column 6 is a hollow rod-shaped member. One end of the power supply column 6 is fitted into a through hole (not shown) provided in the power supply substrate 4A, and the other is provided in a heat radiating member 7 described later. It fits with the formed through-hole 7D.

  The inner peripheral surface of the power column 6 has a spiral structure, and the power supply support plate 4C and the heat radiating member 7 can be held by the same screw, so that the number of components can be reduced. Therefore, it is possible to provide the lighting device 1 with reduced costs.

  Next, the heat radiating member 7 will be described. As shown in FIG. 2, the heat radiating member 7 is formed by die casting using a synthetic resin material or a metal material having excellent thermal conductivity, and is a spiral shape obtained by deforming four plate-shaped heat radiating members into a spiral shape. Radiating fins 7A, a smooth mounting surface 7B on which the power supply column 6 is mounted, and an inclined surface 7C for mounting the light source 2 formed on the periphery of the mounting surface 7B.

  The heat radiating fin 7A includes four heat radiating fins 7A joined to the inclined surface 7C, and has a function of radiating heat generated from the light source 2 mounted on the inclined surface 7C to the outside. The heat dissipating fins 7A are spirally deformed by twisting approximately 90 °, and the fins 7a are appropriately spaced apart. Therefore, compared to a structure in which a large number of convex portions or concave portions are simply provided on the surface of the heat dissipation member, an air flow path can be formed between the fins 7a, and the fin 7a has a spiral shape. Regardless of the direction in which the lighting device 1 is attached, air flows between the fins 7a, and the heat radiation effect of the heat radiation fins 7A can be improved.

  In addition, when the heat radiation fins 7A are deformed in a spiral shape, the fins 7a may be twisted and deformed by 90 ° in addition to twisting the fins 7a to approximately 180 ° and spaced apart by an appropriate length. The shape of the radiating fin 7A is not limited to the above example, and may be two to three fins, or about 5 to 6 fins spirally twisted about 90 ° to 180 °. .

  By forming the radiating fin 7A in a spiral shape, it can be seen that the substantially spherical light guide member 3A portion represents a cocoon and the radiating fin 7A portion represents a stem or a leaf. The lighting device 1 that is also excellent in design can be obtained.

  And the unevenness | corrugation is provided in the surface of the said heat radiating fin 7A, and heat dissipation can be accelerated | stimulated by increasing the thermal radiation area which contacts external air, and the illuminating device 1 with the more favorable thermal radiation effect can be provided.

  Further, the mounting surface 7B is provided with a through hole 7D for fixing the power supply column 6, and the power column 6 can be fixed on the mounting surface 7B with a screw through the through hole 7D. it can.

  The light source 2 is mounted on the inclined surface 7B, and the inclined surface 7B is preferably white in order to efficiently introduce light from the light source 2 into the light guide member 3A.

  Next, the base 8 will be described. The base 8 has a hollow shape on the inside, one having an opening and the other having a bottom. The opening is joined to the end portion of the heat radiating fin 7A through an insulating member, and the other outer peripheral surface has a screwed shape for screwing with the light bulb socket.

  The other of the base 8 serves as a single pole terminal, and the other pole terminal protrudes from the bottom surface so as to be insulated from the single pole terminal. The one-pole terminal and the other-pole terminal are electrically connected to the power supply board 4 </ b> A via the power supply line 10.

  Next, a method for radiating heat generated from the power supply unit 4 in this embodiment will be described.

  Since the power supply unit 4 is housed and held in the light source unit 3 (light guide member 3A and reflection member 3B), the heat generated from the power supply unit 4 (particularly, the power supply board 4A and the power supply circuit component 4B) The light is diffused into the interior space of the light guide member 3A through the heat conductive sheet 4D which is a heat conductive member. Then, it is conducted (heat transfer) to the power supply support plate 4C, which is a heat conduction member, and diffused into the interior space via the power supply support plate 4C.

  The interior space is filled with an electrically insulating resin kneaded with a filler (such as an electrically insulating metal oxide powder) for transferring heat generated from the power source unit 4 to the light source unit 3. Heat generated from the power supply unit 4 is transferred to the inner peripheral surface 3a side of the light source unit 3 through an electrically insulating resin that is a heat conducting member.

  Since heat moves from the high temperature region to the low temperature region, the heat from the power source unit 4 transferred to the light source unit 3 (particularly the inner circumferential surface 3a of the light guide member 3A or the reflection member 3B) is in contact with the outside air. It is conducted to the outer peripheral surface 3b side, which is a low temperature region, and is radiated from the entire outer peripheral surface 3b to the outside. Therefore, since the light guide member 3A is formed of a material having good infrared transmission, in addition to the function of guiding light from the light source 2, the heat conducted to the inner peripheral surface 3a is transmitted from the outer peripheral surface 3b. It also has a function as a heat dissipation part that dissipates heat. In addition to the function of emitting light propagating in the light guide member 3A from the outer peripheral surface 3b side, the reflecting member 3B is also formed of a material having good thermal conductivity, and thus functions as a heat radiating portion. Have both.

  Therefore, the heat generated from the power supply unit 4 is radiated to the outside from the heat radiating unit that radiates heat through the light source unit 3. Therefore, the heat generated from the power supply unit 4 can be dissipated without staying in the interior space, resulting in variations in the temperature characteristics of the components constituting the power supply unit 4 or damage to the components. The power supply unit 4 can be prevented from failing, and the lighting device 1 having a long life can be provided.

  In addition, since the interior space is filled with an electrically insulating resin, even when a person touches the light source unit 3 when replacing the light bulb, the interior space is electrically insulated, so that an electric shock is caused. Can be safely replaced.

  Moreover, it is desirable for the LED for illumination which is the said light source 2 to generate heat more effectively than the said power supply part 4, and to perform effective heat dissipation. Therefore, the light source 2 is mounted on the inclined surface 7C of the heat radiating member 7 having excellent thermal conductivity so that the heat generated from the light source 2 can be radiated to the outside directly through the heat radiating member 7. did. Therefore, it is possible to provide the lighting device 1 in which the heat generated from the light source 2 is effectively radiated.

  As described above, the heat generated from the power source unit 4 that is a heat source is radiated to the outside from the first heat radiating unit that radiates heat through the light source unit 3, and the heat generated from the light source 2 that is the heat source is the first heat source. The heat is radiated to the outside through the heat radiating member 7 which is a second heat radiating portion different from the heat radiating portion. Therefore, the heat generated from the two heat sources can be radiated to the outside through different heat radiating portions, and the illuminating device 1 having improved radiating efficiency as the entire illuminating device can be provided. That is, the power source unit 4 and the light source 2 that are heat sources have different heat dissipation paths, and have a structure that effectively dissipates heat to the outside, so that heat generated from the heat source does not stay in the lighting device 1. The lighting device 1 with improved heat dissipation efficiency can be obtained. And since it does not cause the damage of components by thermal deterioration, the illuminating device 1 with a long lifetime can be provided.

  In addition, since the illuminating device 1 generates a large amount of heat from the light source 2, it may be radiated through the light source unit 3 in order to further improve the heat dissipation efficiency. That is, since the light source 2 is configured to be fitted into a recess formed in the light incident surface 3d of the light guide member 3A, the heat generated from the light source 2 is conducted to the light incident surface 3d through the recess, and the outer periphery. Heat can be radiated from the surface 3b side to the outside.

  Therefore, since the heat generated from the light source 2 can be radiated to the outside through the light source unit 3 (particularly the light guide member 3A), the heat from the light source 2 having a large calorific value is applied to the heat radiating member 7. The heat can be radiated from the light source unit 3 to the outside simultaneously. Therefore, the illuminating device 1 with improved heat dissipation efficiency of the heat generated from the light source 2 can be provided. Therefore, it is possible to effectively dissipate heat generated from the light source 2 having a large calorific value, and it is possible to obtain the lighting device 1 including the light source 2 that suppresses the occurrence of failure due to thermal degradation.

  Furthermore, when the heat radiating member 7 having a good heat radiating efficiency is used, the heat generated from the power supply unit 4 can be conducted to the heat radiating member 7 through the electrically insulating resin filled in the interior space. Therefore, in addition to radiating heat through the light source unit 3 (first heat radiating unit), heat can be radiated through the heat radiating member 7 (second heat radiating unit) according to the amount of heat generated by the power supply unit 4. it can. Therefore, since the 1st thermal radiation part or the 2nd thermal radiation part with sufficient heat dissipation efficiency can be selected, the illuminating device 1 with sufficient heat dissipation efficiency as the whole illuminating device can be provided.

  Hereinafter, Example 2 of the illuminating device 21 of this invention is demonstrated based on FIG.

  FIG. 5 is a cross-sectional view of a main part of the illumination device according to the second embodiment of the present invention.

  Unlike the lighting device 1 of the first embodiment, the lighting device 21 of the second embodiment has a configuration in which the direction of the power supply unit 4 provided in the interior space of the light guide member 3A is different. Other configurations are the same as those of the first embodiment. Since they are the same, the same reference numerals are given and detailed description thereof is omitted.

  In the illuminating device 1 according to the first embodiment, the power supply substrate 4A is mounted so that the solder surface 4b of the power supply substrate 4A cannot be seen when viewed from the opening 3c of the light guide member 3A. Then, as shown in FIG. 4, the interior is so arranged that the solder surface 4 b can be seen from the opening 3 c. That is, since the solder surface 4b is arranged close to the light source 2 as a heat source, a certain distance is placed between the solder surface 4b and the mounting surface 7B of the heat radiating member 7, and an air layer is interposed therebetween. The illuminating device 21 suppresses the thermal influence from the light source 2 as much as possible.

  And by decorating as mentioned above, the length of the power supply column 26 can be shortened, the cost of components can be suppressed, and the power supply unit 4 can be more stably held on the mounting surface 7B.

  Further, a screw is inserted from the side of the through hole 7D provided on the mounting surface 7B of the heat radiating member 7, and the power supply column 26, the power supply support plate 4C, the spacer 5 and the power supply board 4A are screwed together with the same screw. As a result, the assembly efficiency of the power supply unit 4 is improved.

  In addition to screwing, the power supply column 26 may be fitted into the through hole 7D or fixed using an adhesive or the like.

  Hereinafter, Example 3 of the illuminating device 31 of this invention is demonstrated based on FIG.6 and FIG.7.

  FIG. 6 is an overall perspective view of the illumination apparatus according to the third embodiment of the present invention. FIG. 7: is principal part sectional drawing which shows the structure of the illuminating device concerning Example 3 of this invention.

  Unlike the lighting device 1 of the first embodiment, the lighting device 31 of the third embodiment has a configuration in which light from the light source 2 is guided using the three light guide members 23A, and other configurations are the same as those of the first embodiment. Since they are the same, the same reference numerals are given and detailed description thereof is omitted.

  Unlike the lighting device 1 of the first embodiment, the lighting device 31 of the third embodiment has a configuration that guides light from the light source 2 using three light guide members 23A (see FIG. 6). Each light guide member 23A in the present embodiment has a petal shape, and as shown in FIG. 7, the cross-sectional shape is formed so as to draw a substantially S-shaped curve. It is possible to provide a lighting device 31 that has an external shape reminiscent of () and is excellent in design.

  Since the light guide member 23A has a shape in which a tip portion (a side different from the light incident surface 23d for introducing light from the light source 2) is cleaved, the light guide member 23A has a structure in which the reflecting member 3B can be directly visually recognized. Therefore, in order to prevent breakage, the reflecting member 3B is made of a material having resistance to cracking even when the lighting device 31 is dropped and heat resistance that is not easily affected by heat from the power supply unit 4, such as synthetic resin (for example, It is desirable to be formed of polycarbonate or the like.

  Further, in order to guide the light from the light source 2 to the tip of the light guide member 23A, a light scattering structure may be provided in addition to the reflection member 3B around the tip. Therefore, since the light guided to the area away from the light incident surface 23d where the amount of light guided from the light source 2 decreases is scattered and emitted from the outer peripheral surface 23b side through the reflecting member 3B, the outer peripheral surface 23b. Among them, the difference in the light emission amount between the side near the light incident surface 23d and the side far from the light incident surface 23d can be made as small as possible, and the illumination device 1 can be provided in which the light emission amount is substantially uniform over the entire outer peripheral surface 3b.

  As described above, the present embodiment has been described, but in addition to forming the light source unit 23 using the three light guide members 23A, the number of the light guide members 23A is appropriately changed according to the size of the lighting device 31. By doing so, it becomes the illumination device 31 which can be visually recognized more like a bag, and is excellent in design. Further, since the light guide member 23A is in contact with the outside air, the lighting device 31 is improved in heat dissipation efficiency as the contact area is larger.

  And the portion where the reflecting member 3B can be visually recognized from the outside may be colored so as to resemble a wrinkle, and since the color of light from the light source 2 is not changed by coloring, An excellent lighting device 31 can be provided. Furthermore, since the inside of the light source unit 23 cannot be seen through, the power source unit 4 built in the light guide member 23A having transparency is not visible, and thus the illumination device 1 that is excellent in appearance and design is provided. Can do.

  In the present embodiment, the illumination device 31 uses three light guide members 23A. However, a portion corresponding to the light guide member 23A may be formed of a resin that molds the LED. By forming in this way, light leakage from the light source 2 can be prevented, and contaminants such as dust entering the lighting device 31 from between the reflecting member 3B and the light guide member 23A can be removed. Moreover, since it is not necessary to adhere | attach using an adhesive etc., a production process can be decreased. Therefore, the illuminating device 31 having a safer and simpler configuration can be provided.

  The heat generated from the power supply unit 4 (power supply board 4A and power supply circuit component 4B) is diffused through a heat conductive member (heat conductive sheet 4D, power supply support plate 4C, electrically insulating resin) and sent to the light source unit 23. Heat is transferred. In the present embodiment, a part of the heat conducted to the light source unit 23 is radiated from the light guide member 23A to the outside through the reflecting member 3B, but the tip portion of the light guide member 23A is cleaved. Then, since the light guide member 23A is not provided, the heat conducted to the inner peripheral surface 23a of the cleaved portion is directly radiated to the outside. Accordingly, in the cleavage portion, only the reflection member 3B is interposed between the interior space and the outside air, and heat is transferred to the outside without passing through the light guide member 23A. The illuminating device 31 is obtained.

  Moreover, the reflective member 3B can increase the area in contact with the outside air depending on the number, size, and arrangement method (for example, overlapping), and effectively radiates heat as the outer peripheral area increases. Can do. Therefore, the lighting device 31 has improved heat dissipation efficiency.

  As described above, in the above-described embodiment, the configuration in which the heat from the light source 2 is radiated by the spiral radiating fin 7A in which the four plate-shaped radiating members are spirally deformed has been described. A radiation fin 27A as shown in FIG. 8 may be used.

  The heat dissipating fin 27A shown in FIG. 8 is cut into a donut shape having a through hole 27b at the center with a metal material such as aluminum or copper, and a plurality of cuts are made in the outer peripheral part, and the outer peripheral part in which the cuts are made. These fins 27a are formed by twisting to about 45 ° by pressing.

  As shown in FIG. 1, the heat radiating member 7 includes a power line 10 electrically connecting the power supply substrate 4 </ b> A and the base 8, and the central portion of the heat radiating member 7 extends from the mounting surface 7 </ b> B to the end surface of the heat radiating member 7. A heat radiating fin 7A deformed in a spiral shape is formed around the through hole 27b. However, the heat radiating fins 27a may be replaced with the helical heat radiating fins 7A and formed in the peripheral portion of the through hole 27b. The radiating fins 27A twist the fins 27a while being cut with a press, so that the number of processing steps can be reduced and the radiating fins 27A can be formed more easily than the spiral radiating fins 7A described in the above embodiments. . Therefore, it is possible to form the inexpensive heat radiation fin 27A with lower cost without deteriorating the heat radiation efficiency.

  Further, although it has been described that each fin 27a is formed by twisting at approximately 45 °, it may be twisted at approximately 90 °, and the torsion range may be varied according to the size and number of cuts. Can do. Therefore, the heat radiation fins 27A having various shapes can be formed, and when the number of cuts is increased, the heat radiation area is increased, so that the heat radiation efficiency is further improved.

  And although the helical heat radiating member 7 was formed by die-casting, it was necessary to consider the ease of material flow and draft angle, and was wasted that it was thicker than pressing. However, by forming it so that it is twisted while being cut with a press as described above, waste in production can be eliminated and mass production can be performed efficiently.

  Furthermore, when the doughnut is cut, corners are formed at the tip portions of the fins 27a when twisted, and the hand may be damaged when the bulb is replaced. Therefore, you may cut | judge the corner | angular part of the front-end | tip part of each fin 27a at the time of cutting. That is, such a problem can be solved by cutting the outer peripheral portion of each fin 27a into a shape including a plurality of arcs (petal shape).

  In addition, when forming the said radiation fin 27A, it is good also as an illuminating device which cut | judged the metal member circularly and has arrange | positioned the said light source 2 directly in the center of the radiation fin 27. FIG. In this case, since it is not necessary to form the inclined surface 7C and the mounting surface 7B of the heat radiating member 7, it is possible to provide an illumination device that has a simpler configuration and does not reduce the heat radiation efficiency.

  In addition, if each fin 27a is formed in the shape of a petal, it is possible to form a heat radiating fin that expresses a leaf or leaf that supports the eyelid expressed by the light source unit 3 by bending it approximately 45 ° in the vertical direction. There is a lighting device with excellent design.

  In the above embodiment, the light source 2 uses a white LED in a single color or emits monochromatic light from three types (R (red), G (green), and B (blue)) of LED chips having different main emission wavelengths. Alternatively, an LED that emits a desired light color by combining them may be used. In addition to these, an organic EL, a small light bulb (bean light bulb, billiken bulb, etc.) or the like may be used, or may be used in combination.

  Furthermore, the inclination angle of the light incident surfaces 3d and 23d with respect to the opening 3c is an incident angle at which light from the light source 2 is incident on the light guide members 3A and 23A. It is desirable to change appropriately according to. Therefore, the inclination range is not limited to about 45 °, and depends on the inclination angle (light incident angle) that can propagate to a region farther from the light incident surfaces 3d and 23d depending on the shape of the light guide members 3A and 23A. Light guide members 3A and 23A are formed.

  The light incident surfaces 3d and 23d of the light guide members 3A and 23A and the inclined surface 7C of the heat radiating member 7 are configured to be adhered and fixed, but the light guide member 3A is disposed on the inclined surface 7C of the heat radiating member 7.・ As long as 23A is held, for example, a convex portion is provided in the opening 3c of the light guide members 3A and 23A, a concave portion is provided in the inclined surface 7C, or both members are screwed. Or may be fixed.

  Further, the outer shape of the light guide members 3A and 23A is not limited to a spherical shape, but may be a shape that emits light in all directions, for example, a cone shape, an elliptical shape, a columnar shape, or the like. May be. And you may form using a some light guide member. For example, a plurality of light guide members having a shape such as an ellipse, a triangle, and a polygon such as a quadrangle may be combined.

  In addition, although the said reflection member 3B is a mirror surface provided with the gradation, a vapor deposition pattern is good also as what patterns, such as a dot pattern and a linear pattern, for example. The shape of each dot may be any shape, and an arbitrary shape such as a round shape, a square shape, or a polygon shape can be selected.

  The reflective member 3B may be formed of a resin having high thermal conductivity, or may be formed of a scattering sheet or a white reflective sheet whose surface is excellent in light reflectivity. Moreover, you may use combining these. For example, when the scattering sheet and the reflection sheet are used in combination, the light scattered by the scattering sheet does not leak into the light guide members 3A and 23A by the reflection sheet, and the outer peripheral surfaces 3b and 23b of the light guide members 3A and 23A. Light can be emitted from 23b. Therefore, it is possible to provide an illuminating device with improved light utilization efficiency.

  The shape of the power supply substrate 4A is not limited to the disc shape, and various shapes are conceivable. Productivity by selecting an optimal shape according to the shape of the power supply unit 4 such as the shape of the opening 3c in which the power supply unit 4 can be easily assembled, for example, a polygonal shape such as a triangle and a quadrangle, and an elliptical shape. An improved lighting device can be obtained. Moreover, when it is desired to reduce the size of the lighting device, by using a double-sided substrate, a smaller power supply unit 4 can be formed and the interior of the opening 3c can be easily provided.

1, 21, 31 Illumination device 2 Light source 3, 23 Light source 3A, 23A Light guide member 3B Reflective member 4 Power supply unit 4B Power supply circuit component 4C Power supply support plate 4D Thermal conduction sheet 7 Heat dissipation member

Claims (9)

In a lighting device in which a light source unit having a light source for illumination is internally provided with a power source unit such as a power source circuit for turning on the light source,
An illuminating device comprising a heat dissipating part for dissipating heat generated from the power supply part through the light source part.   The lighting device according to claim 1, wherein the heat radiating unit is an optical member that receives light emitted from the light source.   The lighting device according to claim 2, wherein the optical member is a light guide member that guides light from the light source.   The lighting device according to claim 2, wherein the optical member is a reflecting member that reflects light from the light source.   5. The lighting device according to claim 1, wherein heat generated from the power supply unit is conducted to the light source unit through a heat conducting member and is radiated from the heat radiating unit. . The heat dissipating part that radiates heat through the light source part is defined as a first heat dissipating part,
6. The lighting device according to claim 1, wherein heat generated from the light source is radiated from a second heat radiating portion different from the first heat radiating portion.   The lighting device according to claim 6, wherein heat generated from the light source is radiated from the first heat radiating portion.   The lighting device according to claim 6 or 7, wherein heat generated from the power supply unit is also radiated from the second heat dissipation unit.   The lighting device according to claim 1, wherein the light source is a light emitting diode.

Images