JP4563568B2 - Mounting device for semiconductor processing, plasma processing device, and vacuum processing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting table device, a plasma processing apparatus, and a vacuum processing apparatus, which are objects to be processed such as glass substrates (LCD substrates) for liquid crystal displays (LCD) and semiconductor wafers in semiconductor processing. Here, the semiconductor processing means that a semiconductor device, an insulating layer, a conductive layer, etc. are formed in a predetermined pattern on a substrate to be processed such as a semiconductor wafer or an LCD substrate. The various processes performed in order to manufacture the structure containing the wiring connected to a semiconductor device, an electrode, etc. are meant.
[0002]
[Prior art]
Japanese Patent Application Laid-Open No. 7-74231 discloses a processing apparatus for performing plasma etching or film formation on a substrate to be processed. In this apparatus, a mounting table having a mounting surface for supporting a substrate to be processed is disposed inside a processing chamber composed of a rectangular housing made of a conductive material such as aluminum. The mounting table is formed using a conductive material, and also functions as a lower electrode for applying RF (high frequency) power. In order to assist loading and unloading of the substrate to be processed with respect to the mounting surface, a plurality of lifter pins are arranged at the four corners of the mounting table so as to be movable up and down. When the substrate to be processed is handled by the transfer arm for loading and unloading, the substrate to be processed is supported by the lifter pins so as to float from the placement surface.
[0003]
Since the lifter pins cooperate to provide a support level for horizontally supporting the substrate to be processed, these vertical movements need to be performed synchronously so as to maintain the horizontal state of the substrate to be processed. For this reason, a base plate that can move up and down in a horizontal state is disposed below the mounting table, and lifter pins are disposed at four corners of the base plate so as to protrude vertically upward. The base plate is supported by an up / down driving air cylinder installed at the lower center portion thereof, and the base plate and all lifter pins are integrally moved up and down by driving the air cylinder.
[0004]
[Problems to be solved by the invention]
In the apparatus disclosed in the above publication, the space immediately below the mounting table is occupied by a base plate and a driving unit for driving the lifter pins in synchronization. For this reason, accessory devices such as a vacuum pump and an impedance matching box that are desired to be installed as close to the processing chamber as possible cannot be disposed at an efficient position, which causes deterioration of exhaust characteristics and RF characteristics. In addition, since these accessory devices need to be installed around the apparatus main body, this increases the size of the entire facility. Similar problems have been found with respect to drive mechanisms for other movable frames such as clamp rings disposed around the mounting table.
[0005]
One object of the present invention is to provide a lifter pin disposed on a mounting table and a movable frame disposed around the mounting table in a mounting table apparatus, a plasma processing apparatus, and a vacuum processing apparatus for semiconductor processing. By making it possible to eliminate the drive mechanism from the space directly below the mounting table, it is possible to install auxiliary equipment such as a vacuum pump and impedance matching box very close to the processing chamber, thereby improving exhaust and RF characteristics. It is to let you.
[0006]
Another object of the present invention is to provide a lifter pin disposed on a mounting table and a movable frame disposed around the mounting table in a mounting table device, a plasma processing device, and a vacuum processing device for semiconductor processing. The drive mechanism can be reduced in size and can be excluded from the space immediately below the mounting table, thereby increasing the degree of freedom of the location of the accessory device, thereby reducing the size of the entire facility.
[0007]
[Means for Solving the Problems]
  First aspect of the present inventionThe mounting table device for semiconductor processing related toA mounting table having a mounting surface for supporting the substrate to be processed, on which the substrate to be processed is loaded and unloaded from the mounting surface by the transfer device;
  In order to assist loading and unloading of the substrate to be processed on the mounting surface described above,Move up and down along the vertical axisA plurality of lifter pins which are arranged in a possible manner and cooperate to provide a support level for supporting the substrate to be processed above the mounting surface;
  A plurality of rods arranged to be movable in the vertical direction along the vertical axis with respect to the mounting table so as to move these lifter pins in the vertical direction;
  Connected to each of these rods.A plurality of flexible operating wires;
  theseA drive mechanism for driving the operation wire forward and backward,
  The vertical axis of each of the plurality of rods and the vertical axis of each of the plurality of lifter pins are separated so as to be parallel,
  The plurality of flexible operation wires are disposed with respect to the mounting table so as to secure a space in which the accessory device can be disposed immediately below the mounting table.With featuresis doing.
[0008]
According to a second aspect of the present invention, in the apparatus according to the first aspect, the operation wire is covered with a flexible jacket tube and arranged to move forward and backward with respect to the jacket tube. It is fixed relative to the mounting table.
[0009]
  Third aspect of the present inventionThen, the plurality of rods may be provided so as to move the lifter pins in the vertical direction via a guide.
[0010]
According to a fourth aspect of the present invention, in the apparatus according to any one of the first to third aspects, the lifter pin penetrates the placement surface and protrudes upward, and retracts below the placement surface. It is arrange | positioned so that it may move between the position which carries out.
[0011]
According to a fifth aspect of the present invention, in the apparatus according to any one of the first to fourth aspects, an airtight storage chamber for surrounding the mounting table and for storing a substrate to be processed, and evacuating the storage chamber And a supply system for supplying gas into the housing chamber.
[0012]
According to a sixth aspect of the present invention, in the apparatus according to the fifth aspect, the apparatus further includes an expandable / contractible bellows that airtightly surrounds each lifter pin, and one end of the bellows is operated via the lifter pin support. It is connected to the one end of the wire, and the other end of the bellows is fixed relative to the mounting table via a vacuum seal member so as to ensure the airtightness of the storage chamber. .
[0013]
According to a seventh aspect of the present invention, in the apparatus according to the fifth aspect, the drive mechanism is disposed outside the storage chamber.
[0014]
  In the eighth aspect of the present inventionThe related plasma processing apparatus for semiconductor processing is
An airtight processing chamber,
  A supply system for supplying a processing gas into the processing chamber;
  An exhaust system for evacuating the processing chamber;
  An electric field forming mechanism for forming an RF electric field for converting the processing gas into plasma in the processing chamber;
  A mounting table disposed in the processing chamber, the mounting table having a mounting surface for supporting the substrate to be processed, on which the processing substrate is loaded and unloaded from the mounting surface by the transfer device;
  In order to assist loading and unloading of the substrate to be processed on the mounting surface,
For the table aboveMove up and down along the vertical axisA plurality of lifter pins that are movably disposed and cooperate to provide a support level for supporting the substrate to be processed above the mounting surface;
  MultipleA flexible operating wire;
  A plurality of rods arranged so as to be movable in the vertical direction along the vertical axis with respect to the mounting table so that these operation wires are connected to the lifter pins, respectively, and the lifter pins are moved in the vertical direction by the advancement and retraction of the operation wires. When,
  The operation wireConnected toA drive mechanism for driving the operation wire forward and backward,Comprising
  The vertical axis of each of the plurality of lifter pins is separated so as to be parallel to the vertical axis of the plurality of rods,
  The plurality of flexible operation wires are arranged with respect to the mounting table so as to secure a space immediately below the mounting table.With featuresis doing.
[0015]
According to a ninth aspect of the present invention, in the apparatus according to the eighth aspect, the exhaust system includes an exhaust port and an exhaust pump arranged immediately below the mounting table.
[0016]
  A vacuum processing apparatus for semiconductor processing according to the tenth aspect of the present invention is:
An airtight processing chamber,
  A supply system for supplying a processing gas into the processing chamber;
  An exhaust system for evacuating the processing chamber;
  A mounting table provided in the processing chamber and having a mounting surface for supporting a substrate to be processed;
    A movable frame body arranged to be movable up and down with respect to the mounting table around the mounting table;
  A plurality of flexible operation wires capable of moving back and forth;
  The movable frame body is connected to the plurality of operation wires at a plurality of locations along the movable frame body, and the movable frame body is moved up and down with respect to the mounting table as the operation wire moves forward and backward. A plurality of first rods arranged to move in the vertical direction along the vertical axis with respect to the mounting table;
  A drive mechanism for simultaneously advancing and retracting the plurality of operation wires;
  The plurality of operation wiresTo yaConnected and driven by the drive mechanismA plurality of first rodsA plurality of second rods arranged so as to be movable in the vertical direction along the vertical axis,
  The vertical axis of the first rod extends parallel to the vertical axis of the second rod;
  The plurality of flexible operation wires are arranged with respect to the mounting table so as to secure a space in which the accessory device can be arranged immediately below the mounting table.
  The drive mechanism includes a single piston rod that causes the plurality of flexible operation wires to simultaneously advance and retract, and a cylinder that accommodates the piston rod.
[0017]
According to an eleventh aspect of the present invention, in the apparatus according to the tenth aspect, the operation wire is covered with a flexible jacket tube and arranged to move forward and backward with respect to the jacket tube. It is fixed relative to the mounting table.
[0018]
According to a twelfth aspect of the present invention, in the apparatus according to the tenth or eleventh aspect, the movable frame body is a clamp ring for fixing the substrate to be processed to the mounting table.
[0019]
According to a thirteenth aspect of the present invention, in the apparatus according to the tenth or eleventh aspect, the movable frame is a focus ring for improving processing uniformity with respect to a substrate to be processed.
[0020]
According to a fourteenth aspect of the present invention, in the apparatus according to the tenth or eleventh aspect, the movable frame is a gas rectifying wall for adjusting the processing gas flow with respect to the substrate to be processed.
[0021]
Further, the embodiments of the present invention include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, when an invention is extracted by omitting some constituent elements from all the constituent elements shown in the embodiment, when the extracted invention is carried out, the omitted part is appropriately supplemented by a well-known common technique. It is what is said.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In the following description, components having substantially the same function and configuration are denoted by the same reference numerals, and redundant description will be provided only when necessary.
[0023]
1 and 2 are a longitudinal sectional side view and a transverse plan view showing a plasma etching apparatus according to an embodiment of the present invention.
[0024]
The plasma etching apparatus 1 includes a rectangular box-shaped upper housing 2 made of a conductive material such as aluminum, and a lower frame 2 a that supports the upper housing 2. While the processing chamber 3 is formed by the housing 2, an auxiliary space 1 a is formed in the lower frame 2 a, that is, below the processing chamber 3. On the side surface of the processing chamber 3, an LCD substrate L that is a substrate to be processed and a transfer arm TA of the transfer device pass, so that a port that is opened and closed by the gate valve 3 a is formed.
[0025]
A hollow upper electrode 4 made of a conductive material is disposed in the upper portion of the processing chamber 3. The upper electrode 4 is grounded together with the housing 2 of the processing chamber 3. The upper electrode 4 also functions as a processing gas supply header 6 and is connected to a processing gas supply source (not shown).
[0026]
A mounting table 5 having a horizontal mounting surface 7 for supporting the LCD substrate L is disposed in the lower part of the processing chamber 3. As shown in FIG. 3A, the upper portion of the mounting table 5 is composed of, for example, an upper plate 35 made of plate-like aluminum whose surface is anodized, and an intermediate plate 36 made of a conductive material in close contact therewith. The upper plate 35 and the middle plate 36 are integrated so as to be disassembled by screws or the like. The intermediate plate 36 is attached to the lower plate 38 of the mounting table 5 via an insulator 37. Further, the lower plate 38 is fixed to the bottom of the processing chamber 3 via the hollow cylindrical body 13 for passing a power cable or the like. Is done. An electrostatic chuck (not shown) can be provided on the mounting surface 7 as necessary.
[0027]
The integrated upper plate 35 and middle plate 36 of the mounting table 5 constitute a lower electrode 5a that faces the upper electrode 4 in parallel. A power feeding plate 9 is disposed at the bottom of the lower electrode 5a, and the power feeding plate 9 is connected to an RF power source 10 installed on a side in the auxiliary space 1a below the processing chamber 3 via a cable 9a. . By applying RF power from the RF power source 10 to the lower electrode 5a, an RF electric field for converting the processing gas into plasma is formed in the processing chamber 3 between the upper electrode 4 and the lower electrode 5a.
[0028]
An exhaust port 42 is formed in the center of the bottom of the processing chamber 3 immediately below the mounting table 5. The exhaust port 42 is connected to a vacuum pump 40 for evacuating the processing chamber 3 through an exhaust pipe 41 and a valve 41a. The vacuum pump 40 is disposed in an upright state in the auxiliary space 1 a below the processing chamber 3 immediately below the mounting table 5.
[0029]
In order to assist the loading and unloading of the substrate L with respect to the mounting surface 7 at the four positions of the mounting table 5, a total of four lifter pins 11 can be vertically moved through the mounting table 5, one at each position. It is arranged. The lifter pins 11 cooperate to provide a support level for horizontally supporting the substrate L. When the substrate L is handled by the transfer arm TA for loading and unloading, the substrate L is supported in a state of being lifted from the placement surface 7 by the lifter pins 11 as shown in FIG.
[0030]
FIG. 3A is a partially longitudinal side view showing a part of the mounting table, the lifter pin support mechanism and the drive mechanism in the apparatus shown in FIGS. 1 and 2, and FIG. 3B is a plan view showing the drive mechanism. It is. In addition, since the support mechanism of each lifter pin is the same structure, the one is demonstrated below.
[0031]
As shown in FIG. 3A, the support mechanism 12 for the lifter pin 11 is provided in the hollow cylindrical body 13 disposed between the bottom of the processing chamber 3 (that is, the bottom of the housing 2) and the lower plate 38 of the mounting table 5. It is arranged. The cylindrical body 13 has upper and lower flanges, which are fixed to the housing 2 and the lower plate 38 of the mounting table 5 with screws 14 in an airtight seal state. Thereby, in the state where the airtightness in the processing chamber 3 is ensured, the outside of the cylindrical body 13 communicates with the processing chamber 3 and the inside communicates with the atmosphere side.
[0032]
Inside the cylindrical body 13, an LM (Linear Movement) guide 15 is disposed in the vertical direction, and a base 16 is supported by the guide 15 so as to be movable up and down. A lifter pin 11 protrudes vertically on the upper surface of the base 16 via a support 17. An insertion hole 35 a for allowing the lifter pin 11 to pass therethrough is formed in the upper plate 35 of the mounting table 5 facing the tip of the lifter pin 11, and the upper end thereof opens to the mounting surface 7 of the mounting table 5.
[0033]
An expandable / contractible bellows 18 is disposed so as to surround the lifter pin 11 in an airtight manner. The bottom of the bellows 18 is fixed to the support 17, while a flange 19 is disposed on the top of the bellows 18. The flange 19 is disposed in a recess having substantially the same thickness as the flange 19 formed on the upper surface of the middle plate 36 of the mounting table 5. The flange 19 is pressed against the middle plate 36 by the upper plate 35, and an O-ring 19 a is disposed below the flange 19 in the recess. As a result, the inside of the bellows 18 communicates with the inside of the processing chamber 3 and the outside communicates with the atmosphere side while the airtightness inside the processing chamber 3 is ensured.
[0034]
One end of the coaxial wire device 20 is connected to the support mechanism 12 of the lifter pin 11. The wire device 20 includes a flexible jacket tube 21 made of a synthetic resin or the like, and a flexible operation wire 22 made of a stainless steel wire or the like that is slidably (reciprocated) inserted into the tube tube 21. End metal fittings 21 a are disposed at both ends of the jacket tube 21, while hard metal rods 22 a are connected to both ends of the operation wire 22.
[0035]
The operation wire 22 and each metal rod 22a are connected to the outside of the end fitting 21a, and a hard cylindrical guide 32 is disposed so as to surround the connection portion. As will be described later, the guide 32 is fixed to the processing chamber 3 via a bracket or the like, that is, is fixed relatively to the jacket tube 21. The connecting portion between the operation wire 22 and each metal rod 22a reciprocates only within the guide 32 in a stroke range in which the operation wire 22 slides relative to the jacket tube 21. That is, only the metal rod 22 a extends and retracts with respect to the opening end of the guide 32 as the operation wire 22 reciprocates in the jacket tube 21.
[0036]
At one end of the coaxial wire device 20 on the support mechanism 12 side, the end fitting 21 a and the guide 32 are fixed to the bottom of the housing 2 of the processing chamber 3 via the bracket 31, and the metal rod 22 a is connected to the lifter pin 11. 16 is connected. Accordingly, when the metal rod 22a reciprocates with respect to the guide 32 by the advancement and retraction of the operation wire 22, the base 16 moves along with the LM guide 15, and accordingly, the lifter pin 11 moves up and down. In addition, the stroke of the lifter pin 11 is set to 50 mm, for example.
[0037]
The other end of the coaxial wire device 20 is connected to a drive mechanism 23 disposed outside the lower frame 2a. A guide groove 25 is formed in the base 24 of the drive mechanism 23 along the longitudinal direction thereof. A slider 26 is slidably engaged with the guide groove 25 along the guide groove 25. The slider 26 is connected to a slide rod 28 of an air cylinder 27 fixed to the base 24, and the slider 26 is driven by the air cylinder 27.
[0038]
An end plate 29 is fixed to the slider 26 in a direction perpendicular to the guide groove 25, and slides integrally with the slider 26. The end plate 29 is connected to a metal rod 22 a at the end of the operation wire 22 connected to each lifter pin 11. The four metal rods 22a are arranged in parallel two by two with the air cylinder 27 in between. The end fitting 21a and the guide 32 of the jacket tube 21 are fixed to the base 24 by a fixture 30 or the like. That is, the four coaxial wire devices 20 corresponding to the four lifter pins 11 are driven together by the common drive mechanism 23.
[0039]
When the slide rod 28 contracts by driving the air cylinder 27, the four metal rods 22 a are pushed into the guide 32 through the end plate 29. For this reason, in the jacket tube 21, the operation wire 22 is pushed to the support mechanism 12 side and moves forward, whereby the lifter pins 11 project from the placement surface 7 in synchronization.
[0040]
On the other hand, when the slide rod 28 is extended by driving the air cylinder 27, the four metal rods 22 a are pulled out from the guide 32 through the end plate 29. For this reason, in the jacket tube 21, the operation wire 22 is pulled to the drive mechanism 23 side and retracted, whereby the lifter pins 11 are retracted below the placement surface 7 in synchronization.
[0041]
In the plasma etching apparatus shown in FIGS. 1 and 2, plasma etching is performed in the following manner.
[0042]
First, the substrate L is carried into the processing chamber 3 by the transfer arm TA and placed above the mounting table 5. At the same time, the slide rod 28 is contracted by driving the air cylinder 27 of the drive mechanism 23. As a result, the four lifter pins 11 are driven in synchronization via the operation wire 22 of the coaxial wire device 20 and protrude from the placement surface 7. Then, the four corners of the substrate L are pushed up by the tip portions of the four lifter pins 11 to receive the substrate L from the transfer arm TA.
[0043]
After the transfer arm TA is retracted from the processing chamber 3, the slide rod 28 is extended by driving the air cylinder 27 of the drive mechanism 23. As a result, the four lifter pins 11 are driven in synchronization via the operation wire 22 of the coaxial wire device 20, and are retracted below the placement surface 7. Therefore, the substrate L supported by the tip portions of the four lifter pins 11 is placed on the placement surface 7.
[0044]
Next, the vacuum pump 40 is driven, the processing chamber 3 is vacuumed through the exhaust port 42, and the processing gas is supplied from the processing gas supply source, and the inside of the processing chamber 3 is maintained at a predetermined pressure. At the same time, an RF electric field is formed between the upper electrode 4 and the lower electrode 5a by applying RF power from the RF power source 10 to the lower electrode 5a. The processing gas is turned into plasma by an RF electric field, and the substrate L is etched by ions and active species in the plasma.
[0045]
After the etching is completed, the residual gas or the like in the processing chamber 3 is exhausted by the vacuum pump 40 for a predetermined time. Thereafter, the slide rod 28 is contracted by driving the air cylinder 27 of the drive mechanism 23. As a result, the four lifter pins 11 are driven in synchronization via the operation wire 22 of the coaxial wire device 20 and protrude from the placement surface 7. Then, the four corners of the substrate L are pushed up by the tip portions of the four lifter pins 11 and supported in a state of floating from the placement surface 7. In this state, the transfer arm TA enters the lower side of the substrate L and receives the substrate L from the lifter pins 11.
[0046]
According to the present embodiment, the four lifter pins 11 can be driven in synchronization by the single drive mechanism 23. Moreover, since the lifter pin 11 and the drive mechanism 23 are connected by a flexible operation wire 22, the installation location of the drive mechanism 23 is not limited. Therefore, the drive mechanism 23 can be installed at an arbitrary position away from the processing chamber 3, for example, outside the lower frame 2a.
[0047]
Further, by installing the drive mechanism 23 of the lifter pin 11 outside the auxiliary space 1a directly below the processing chamber 3, the auxiliary space 1a can be used for installing the vacuum pump 40 and the RF power source 10. That is, since the vacuum pump 40 and the RF power source 10 can be installed at a position close to the processing chamber 3, the exhaust pipe length and the RF introduction path are shortened, and the exhaust characteristics and the RF characteristics can be improved.
[0048]
The drive mechanism 23 is smaller than the conventional lifter pin drive mechanism. In addition, as described above, since the auxiliary space 1a immediately below the processing chamber 3 can be used, the degree of freedom of the location of other accessory devices is increased. For this reason, the whole installation can be reduced in size.
[0049]
4 and 5 are a longitudinal sectional side view and a cross-sectional plan view showing the whole of a part of a plasma etching apparatus according to another embodiment of the present invention.
[0050]
This embodiment further includes a clamp ring 57 for fixing the substrate L to the mounting table 5 in the plasma etching apparatus shown in FIGS. The clamp ring 57 has an inner peripheral end extending inward from the peripheral edge of the substrate L, and the substrate L is pressed against the mounting surface 7 of the mounting table 5 by the inner peripheral end of the clamp ring 57. To be clamped. The clamp ring 57, that is, the movable frame body having a rectangular ring shape, is driven by using the coaxial wire device 20 as shown in FIGS. 3 (a) and 3 (b).
[0051]
Specifically, four leg rods 56 extending vertically downward are fixed to the clamp ring 57 at positions substantially corresponding to the four apexes of the rectangle. Each leg rod 56 includes an upper ceramic rod portion 56a and a lower aluminum rod portion 56b connected to each other. Only the rod portion 56a made of ceramic is directly exposed to the atmosphere in the processing chamber 3.
[0052]
On the other hand, an insertion hole 51 (only one is shown) for passing four leg rods 56 is formed around the mounting table 5 at the bottom of the housing 2 constituting the processing chamber 3. A support mechanism 52 for the leg rod 56 is disposed at the bottom of the housing 2 facing the insertion hole 51. Since the four support mechanisms 52 have the same structure, one of them will be described.
[0053]
The support mechanism 52 includes a cylinder 53 that is fixed vertically to the bottom of the housing 2 that constitutes the processing chamber 3. A slider 55 is disposed at the bottom of the cylinder 53 so as to be movable up and down. A support 54 is fixed to the top of the slider 55, and a leg rod 56 is fixed in a vertical state thereon. The upper end of the leg rod 56 is inserted through the insertion hole 51 and protrudes into the processing chamber 3.
[0054]
An expandable / contractible bellows 62 is disposed so as to surround the leg rod 56 in an airtight manner. The bottom of the bellows 62 is fixed to the support 54, while the flange 61 is disposed on the top of the bellows 62. The flange 61 is fixed to the bottom of the housing 2 with the O-ring 60 interposed therebetween. Thereby, the inside of the bellows 62 communicates with the inside of the processing chamber 3 and the outside communicates with the atmosphere side while the airtightness inside the processing chamber 3 is guaranteed.
[0055]
One end of the coaxial wire device 20 is connected to the support mechanism 52 of each leg rod 56. The coaxial wire device 20 has a structure similar to that described with reference to FIGS. 3 (a) and 3 (b). At one end of the coaxial wire device 20 on the support mechanism 52 side, the end fitting 21 a and the guide 32 are fixed to the bottom of the cylinder 53 via the bracket 64, and the metal rod 22 a is attached to the support 54 connected to the leg rod 56. Connected. Therefore, when the metal rod 22a reciprocates with respect to the guide 32 by the advancement and retraction of the operation wire 22, the leg rod 56 moves up and down accordingly.
[0056]
The other end portions of the four coaxial wire devices 20 are connected to a drive mechanism 23 fixed to the bottom portion of the housing 2 with a screw 63. The drive mechanism 23 has the same structure as that described with reference to FIGS. 3 (a) and 3 (b). That is, the four coaxial wire devices 20 corresponding to the four leg rods 56 are driven together by the common drive mechanism 23.
[0057]
When the slide rod 28 contracts by driving the air cylinder 27, the four metal rods 22 a are pushed into the guide 32 through the end plate 29. For this reason, in the jacket tube 21, the operation wire 22 is pushed toward the support mechanism 52 side and moves forward, whereby the clamp ring 57 rises with respect to the placement surface 7 via each leg rod 56.
[0058]
On the other hand, when the slide rod 28 is extended by driving the air cylinder 27, the four metal rods 22 a are pulled out from the guide 32 through the end plate 29. For this reason, in the jacket tube 21, the operation wire 22 is pulled toward the drive mechanism 23 and retreats, whereby the clamp ring 57 is lowered with respect to the placement surface 7 via each leg rod 56.
[0059]
In other words, the substrate L can be clamped and released with respect to the mounting surface 7 by such vertical movement of the clamp ring 57. The other aspects relating to plasma etching in the plasma etching apparatus shown in FIGS. 4 and 5 are the same as those described with reference to FIGS.
[0060]
FIG. 6 is a longitudinal side view showing a part of a plasma etching apparatus according to still another embodiment of the present invention.
[0061]
In this embodiment, the structure for driving the clamp ring 57 in the plasma etching apparatus shown in FIGS. 4 and 5 is applied to a structure for driving a focus ring 71, which is another rectangular ring-shaped movable frame. It is. In this embodiment, the support mechanism 52 and the drive mechanism 23 below the leg rod 56 are the same as those described with reference to FIG. The focus ring 71 efficiently concentrates the ions in the plasma with respect to the substrate L, or increases the apparent area of the substrate L to increase the uniformity of the plasma processing on the substrate L. Used to improve. Further, the uniformity of the plasma processing can be optimized by adjusting the height position of the focus ring 71. Depending on the purpose, the focus ring 71 can be formed of a conductive material or an insulating material.
[0062]
FIG. 7 is a longitudinal side view showing a part of a plasma etching apparatus according to still another embodiment of the present invention.
[0063]
In this embodiment, the structure for driving the clamp ring 57 in the plasma etching apparatus shown in FIGS. 4 and 5 is applied to the structure for driving the gas rectifying wall 73, which is a movable frame body of another rectangular ring shape. Is. In this embodiment, the support mechanism 52 and the drive mechanism 23 below the leg rod 56 are the same as those described with reference to FIG. The rectifying wall 73 has a rectangular ring-shaped vertical wall surface that can surround the substrate L, and is used to adjust the flow of the processing gas to the substrate L. By adjusting the height position of the rectifying wall 73, it is possible to adjust the flow Fa and Fb of the processing gas and optimize the uniformity of the plasma processing. In FIG. 7, reference numeral 42 denotes an exhaust port.
[0064]
According to the embodiment shown in FIGS. 4 to 7, the same effects as those of the previous embodiment can be obtained. That is, the four leg rods 56 can be driven synchronously by one drive mechanism 23. Moreover, since the leg rod 56 and the drive mechanism 23 are connected by the flexible operation wire 22, the installation location of the drive mechanism 23 is not limited. Therefore, the drive mechanism 23 can be installed at an arbitrary position away from the processing chamber 3, for example, outside the lower frame 2a.
[0065]
Further, by installing the drive mechanism 23 of the leg rod 56 outside the auxiliary space 1a directly under the processing chamber 3, the auxiliary space 1a can be used for installing the vacuum pump 40 and the RF power source 10. That is, since the vacuum pump 40 and the RF power source 10 can be installed at a position close to the processing chamber 3, the exhaust pipe length and the RF introduction path are shortened, and the exhaust characteristics and the RF characteristics can be improved.
[0066]
Further, the drive mechanism 23 is smaller than a conventional drive mechanism such as a clamp ring. In addition, as described above, since the auxiliary space 1a immediately below the processing chamber 3 can be used, the degree of freedom of the location of other accessory devices is increased. For this reason, the whole installation can be reduced in size. 4, 6, and 7, for convenience of illustration, the drive mechanism 23 is shown in a state of being disposed in the auxiliary space 1 a.
[0067]
The clamp ring 57, the focus ring 71, and the rectifying wall 73 according to the embodiment shown in FIGS. 4 to 7 can be arbitrarily combined to form an integral movable frame. Further, when the clamp ring 57 is not provided, an electrostatic chuck (not shown) may be provided as necessary.
[0068]
FIG. 8 is a diagram showing a planar layout of a vacuum processing system according to still another embodiment of the present invention. FIG. 9 is a longitudinal side view showing a load lock chamber of the system shown in FIG.
[0069]
In this embodiment, the structure of the lifter pin support mechanism and the drive mechanism shown in FIGS. 1 and 2 is applied to a mounting table for a load lock chamber. Specifically, this vacuum processing system includes, for example, three processing chambers 81, 82, and 83 for film formation and etching, a transfer chamber 84 common to these processing chambers, a transfer chamber 84, and an atmosphere side. And a load lock chamber (vacuum prechamber) 85 connected to each other. A gate valve 86 is disposed between the two chambers 81 to 85 connected to each other and between the load lock chamber 85 and the atmosphere side. In the transfer chamber 84, a transfer device 87 for transferring a semiconductor wafer as a substrate to be processed between the chambers 81 to 85 is disposed.
[0070]
The load lock chamber 85 consists of an airtight housing where inert gas or N₂A supply system 91 for supplying gas and an exhaust system 92 for performing vacuum exhaust are connected. In the load lock chamber 85, a mounting table 95 having a circular mounting surface for supporting the semiconductor wafer W is disposed.
[0071]
In order to assist the loading and unloading of the wafer W with respect to the mounting surface, a total of three lifter pins 96 are disposed through the mounting table 95 at three positions on the mounting table 95 so as to be movable up and down. When the wafer W is handled by the transfer arm of the transfer device 87 for loading and unloading, the wafer W is supported by the lifter pins 96 in a floating state at the support level above the placement surface.
[0072]
The support mechanism 12 and the drive mechanism 23 for the lifter pins 96 have the same structure as that described with reference to FIGS. 3 (a) and 3 (b). Therefore, according to the load lock chamber 85 shown in FIGS. 8 and 9, the same effects as those in the apparatus shown in FIGS. 1 and 2 can be obtained with respect to the exhaust characteristics and the downsizing of the equipment.
[0073]
In the above embodiment, all the operation wires 22 are configured to be driven together by the drive source 27 of the common drive mechanism 23. However, the operation wires 22 are individually driven in synchronization. It is also possible to use a plurality of driving sources. In the above embodiment, the plasma etching has been described as an example of the semiconductor processing. However, the present invention can be applied to other semiconductor processing such as film formation and ashing. Further, the feature of the lifter pin of the present invention can be applied to a mounting table provided in the atmosphere. Further, the present invention can be similarly applied to both an LCD substrate and a semiconductor wafer as a substrate to be processed.
[0074]
In addition, in the category of the idea of the present invention, those skilled in the art can conceive of various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present invention. .
[0075]
【The invention's effect】
According to the present invention, in a mounting table device, a plasma processing device, and a vacuum processing device for semiconductor processing, a drive mechanism for a lifter pin disposed on the mounting table and a movable frame disposed around the mounting table. Can be removed from the space directly under the mounting table, so that accessory equipment such as a vacuum pump and impedance matching box can be placed very close to the processing chamber, thereby improving exhaust characteristics and RF characteristics. Can do.
[0076]
Further, according to the present invention, in the mounting table device for semiconductor processing, the plasma processing device, and the vacuum processing device, for the lifter pins disposed on the mounting table and the movable frame disposed around the mounting table. By making it possible to reduce the size of the drive mechanism and to eliminate it from the space directly below the mounting table, it is possible to increase the degree of freedom of the location of the accessory device, thereby reducing the size of the entire facility.
[Brief description of the drawings]
FIG. 1 is a longitudinal side view showing a plasma etching apparatus according to an embodiment of the present invention.
2 is a cross-sectional plan view of the apparatus shown in FIG. 1. FIG.
3A is a partially longitudinal side view showing a part of a mounting table, a lifter pin support mechanism and a drive mechanism in the apparatus shown in FIGS. 1 and 2, and FIG. 3B is a plan view showing the drive mechanism.
FIG. 4 is a longitudinal side view showing a part of a plasma etching apparatus according to another embodiment of the present invention.
5 is a cross-sectional plan view of the apparatus shown in FIG. 4. FIG.
FIG. 6 is a vertical side view showing a part of a plasma etching apparatus according to still another embodiment of the present invention.
FIG. 7 is a longitudinal side view showing a part of a plasma etching apparatus according to still another embodiment of the present invention.
FIG. 8 is a diagram showing a planar layout of a vacuum processing system according to still another embodiment of the present invention.
9 is a longitudinal side view showing a load lock chamber of the system shown in FIG. 8. FIG.
[Explanation of symbols]
1 ... Plasma etching equipment
1a ... Auxiliary space
2… Upper housing
3. Processing chamber
4 ... Upper electrode
5 ... Mounting table
5 ... Lower electrode
6 ... Supply header
7 ... Placement surface
10 ... RF power supply
11 ... Lifter pin
12 ... Support mechanism
13 ... Cylinder
15 ... Guide
16 ... Base
18 ... Bellows
20 ... Wire device
21 ... Jacket tube
21a ... End fitting
22 ... Operation wire
22a ... Metal rod
23 ... Drive mechanism
26 ... Slider
27 ... Air cylinder
29 ... End plate
32 ... Cylindrical guide
40 ... Vacuum pump
42 ... Exhaust port
52. Support mechanism
56 ... Leg rod
57 ... Clamp ring
62 ... Bellows
71 ... Focus ring
73 ... Rectifier wall
81, 82, 83 ... processing chamber
84 ... Conveying room
85 ... Load lock room
95: Mounting table
96 ... Lifter pin

Claims (14)

A mounting table having a mounting surface for supporting the substrate to be processed, on which the substrate to be processed is loaded and unloaded from the mounting surface by the transfer device;
In order to assist the loading and unloading of the substrate to be processed with respect to the mounting surface, it is arranged to be movable in the vertical direction along the vertical axis with respect to the mounting table and cooperates above the mounting surface A plurality of lifter pins for providing a support level for supporting a substrate to be processed;
A plurality of rods arranged to be movable in the vertical direction along the vertical axis with respect to the mounting table so as to move these lifter pins in the vertical direction;
A plurality of flexible operation wires respectively connected to the plurality of rods ;
These operating wire; and a driving mechanism for driving forward and backward,
The vertical axis of each of the plurality of rods and the vertical axis of each of the plurality of lifter pins are separated so as to be parallel,
The mounting table device for semiconductor processing, wherein the plurality of flexible operation wires are arranged with respect to the mounting table so as to secure a space in which the accessory device can be arranged immediately below the mounting table. . Each of said plurality of operation wires are coated on flexible jacket tubes are arranged to forward and backward movement relative to the jacket tube, the jacket tube is fixed relative to said mounting base The mounting table device for semiconductor processing according to claim 1. The mounting table apparatus for semiconductor processing according to claim 1 , wherein the plurality of rods move the lifter pins in a vertical direction via a guide . Each of the plurality of lifter pins is disposed so as to move between a position that protrudes upward through the placement surface and a position that retreats below the placement surface. table apparatus for a semiconductor process according to any one of claims 1 to 3. An airtight storage chamber for enclosing the mounting table and storing a substrate to be processed; an exhaust system for evacuating the storage chamber; and a supply system for supplying gas into the storage chamber semiconductor processing table apparatus for as claimed in any one of claims 1 to 4, characterized in that it comprises. Each of the bellows further includes a plurality of expandable / contractible bellows hermetically surrounding each of the plurality of lifter pins, and a lower end portion of each bellows is connected to a support body that connects the rods to the lifter pins . semiconductor processing for the mounting table according to claim 5, characterized in that it is fixed to the placing table through a vacuum sealing member as the upper ends to ensure the airtightness of the housing chamber. The drive mechanism is disposed outside the storage chamber, and includes a single slide rod that simultaneously advances and retracts the plurality of flexible operation wires, and a cylinder that stores the piston rod. 7. The mounting table device for semiconductor processing according to claim 1 , wherein the mounting table device is a semiconductor processing device. An airtight processing chamber,
A supply system for supplying a processing gas into the processing chamber;
An exhaust system for evacuating the processing chamber;
An electric field forming mechanism for forming an RF electric field for converting the processing gas into plasma in the processing chamber;
A mounting table disposed in the processing chamber, the mounting table having a mounting surface for supporting the substrate to be processed, on which the processing substrate is loaded and unloaded from the mounting surface by the transfer device;
In order to assist loading and unloading of the substrate to be processed on the mounting surface,
A plurality of lifter pins which are arranged so as to be movable in the vertical direction along the vertical axis with respect to the mounting table, and which cooperate to provide a support level for supporting the substrate to be processed above the mounting surface; ,
A plurality of flexible operating wires;
A plurality of rods arranged so as to be movable in the vertical direction along the vertical axis with respect to the mounting table so that these operation wires are connected to the lifter pins, respectively, and the lifter pins are moved in the vertical direction by the advancement and retraction of the operation wires. When,
A drive mechanism connected to the operation wire for driving the operation wire forward and backward,
The vertical axis of each of the plurality of lifter pins is separated so as to be parallel to the vertical axis of the plurality of rods,
The plasma processing apparatus for semiconductor processing, wherein the plurality of flexible operation wires are arranged with respect to the mounting table so as to secure a space immediately below the mounting table . The plasma processing apparatus for semiconductor processing according to claim 8, wherein the exhaust system includes an exhaust port and an exhaust pump disposed in the space . An airtight processing chamber,
A supply system for supplying a processing gas into the processing chamber;
An exhaust system for evacuating the processing chamber;
A mounting table provided in the processing chamber and having a mounting surface for supporting a substrate to be processed;
A movable frame body arranged to be movable up and down with respect to the mounting table around the mounting table;
A plurality of flexible operation wires capable of moving back and forth;
The movable frame body is connected to the plurality of operation wires at a plurality of locations along the movable frame body, and the movable frame body is moved up and down with respect to the mounting table as the operation wire moves forward and backward. A plurality of first rods arranged to move in the vertical direction along the vertical axis with respect to the mounting table;
A drive mechanism for simultaneously advancing and retracting the plurality of operation wires;
A plurality of second rods connected to the plurality of operation wires and arranged to be movable in the vertical direction along the vertical axis so as to simultaneously advance and retract the plurality of first rods by a drive mechanism;
The vertical axis of the first rod extends parallel to the vertical axis of the second rod;
The plurality of flexible operation wires are arranged with respect to the mounting table so as to secure a space in which the accessory device can be arranged immediately below the mounting table.
The drive mechanism includes a single piston rod that simultaneously moves the plurality of flexible operation wires forward and backward, and a cylinder that accommodates the piston rod, and vacuum processing for semiconductor processing, apparatus. Each of the plurality of operation wires is covered with a flexible jacket tube and arranged to move forward and backward with respect to the jacket tube , and the jacket tube is fixed relative to the mounting table. The vacuum processing apparatus for semiconductor processing according to claim 10.   The vacuum processing apparatus for semiconductor processing according to claim 10 or 11, wherein the movable frame body is a clamp ring for fixing the substrate to be processed to the mounting table.   The vacuum processing apparatus for semiconductor processing according to claim 10, wherein the movable frame body is a focus ring for improving processing uniformity on a substrate to be processed.   12. The vacuum processing apparatus for semiconductor processing according to claim 10, wherein the movable frame body is a gas rectifying wall for adjusting the flow of the processing gas with respect to the substrate to be processed.

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