JP4563245B2 - Component mounting order determination method - Google Patents

Description

  The present invention relates to a component mounting order determination method and a component mounting order determination apparatus for optimizing a component mounting order for an electronic component mounting machine or the like.

  Conventionally, an electronic component that receives electronic components from a component supply unit fixed at a predetermined position and mounts the electronic components on a circuit board set at a fixed position with a mounting head configured to be movable. There has been a method of creating component arrangement data in a component supply unit that reduces the moving distance of the mounting head and improves the mounting efficiency with respect to the component mounting machine. By performing component mounting with a specified component arrangement according to the data created in this way, it is possible to reduce the mounting time per board to be produced (see, for example, Patent Document 1).

When electronic component mounting is performed using the above-described component arrangement data creation method, it is necessary to set the components in the component supply unit in accordance with the created component arrangement data in order to start production of the board by the electronic component mounting machine. Therefore, there has been a situation that the setting work of the parts is complicated.
JP-A-9-81603

  The present invention has been made in view of the above-described conventional circumstances, and provides a component mounting order determination method and a component mounting order determination device that are easy to change the setup and can reduce the time required for switching the production board. Objective.

  In the component mounting order determination method of the present invention, a component is sucked by a mounting head capable of sucking a component from an arrangement of a plurality of component cassettes containing the component, and the mounting head is moved to place the component on a substrate. A component mounting order determination method that targets a component mounting machine to be mounted and determines a component mounting order by a computer, and acquires component placement data obtained by reading identification information of the component cassette placed in a component supply unit Creating a component arrangement list in which identification information of the component cassette and a position to be arranged in the component supply unit are associated with each other based on the component arrangement data, and the created component arrangement list And determining a mounting order of the components in a state where the arrangement of the component cassettes is fixed.

  According to this method, the mounting order can be optimized even when component cassettes are randomly arranged, the setup can be easily changed, and the time required for switching the production board can be shortened.

  The determination method further includes the step of reading the identification information of the component cassette from an IC tag provided on the component cassette or a component tape in the component cassette, and from the position information received from the IC tag, A step of specifying a position and a step of creating a component arrangement list based on the position of the specified component cassette and the read identification information can be included.

  The step of determining the mounting order includes a step of changing the mounting order regarding the mounting points with reference to mounting point information including information regarding the positions of components mounted on the board, and a mounting time under the changed mounting order. And calculating the mounting order such that the mounting time is shorter. By this method, a mounting order that shortens the mounting time is obtained, so that the board production time can be shortened.

  When the mounting head has a plurality of nozzles, the step of determining the mounting order creates a histogram indicating the relationship between the component to be mounted and the number of components based on the arrangement of the component cassettes. A step of referring to the histogram, determining a component cassette including the component having the largest number, and determining a component that can be suctioned simultaneously with the suction of the component from the determined component cassette; The mounting order is determined based on the determined component cassette and the adsorbable components.

  The component mounting order determination method further includes a step of determining whether or not there is a missing component after the component cassette is placed in the component supply unit, and a warning when it is determined that there is a missing component. And a step of determining whether or not a component cassette including the insufficient component is disposed in the component supply unit after the notification step.

  Further, in the step of determining whether or not there is a lacking part, if it is found that a plurality of part cassettes that store the same part are arranged in the part supply unit, 1) of the plurality of part cassettes Preferentially picking up components from any one of the component cassettes and handling the components of the other component cassettes as spare components when the components run out, or 2) assigning the mounting points on the board to the plurality of component cassettes, Any of the steps can be performed.

  Further, in the step of determining whether or not there is a lacking component, if there is a substitute component in the component cassette, the substitute component can be regarded as a component mounted on the board.

  In addition, when there are a plurality of component mounters on the board production line, it is possible to determine whether or not the missing component exists for all of the plurality of component mounters.

  The present invention also provides a component mounting order determination program that causes a computer to execute the steps of the component mounting order determination method.

  With this program, it is possible to optimize the mounting order even when component cassettes are randomly arranged, making it easy to change the setup and shortening the time required for switching the production board.

  The present invention also provides a computer-readable recording medium in which the component mounting order determination program is recorded.

  The component mounting order determining apparatus of the present invention sucks a component with an mounting head capable of sucking a component from an arrangement of a plurality of component cassettes containing the component, and moves the mounting head to place the component on a substrate. A component mounting order determination device that targets a component mounting machine to be mounted and determines the mounting order of components by a computer, and acquires component arrangement data obtained by reading identification information of the component cassette arranged in a component supply unit A read data acquisition unit, a component placement list creation unit that creates a component placement list in which identification information of the component cassette and a position to be placed in the component supply unit are associated with each other based on the component placement data; A mounting order determining unit that determines a mounting order of components in a state where the arrangement of the component accommodating portions is fixed based on the created component arrangement list. .

  With this configuration, it is possible to optimize the mounting order even when component cassettes are randomly arranged, making it easy to change the setup and shortening the time required to switch production boards.

  A component mounter of the present invention includes the above-described component mounting order determination device, and a control unit that mounts components on a board according to the component mounting order determined by the component mounting order determination device.

  The component mounter according to the present invention has a component supply unit in which a plurality of component cassettes storing components are arranged, and a plurality of components are sucked from the component supply unit, and the sucked components are mounted on a substrate. Obtains a histogram indicating the relationship between the mounting head, the control unit for controlling the operation of the mounting head, and the number of components to be mounted, which are obtained based on the arrangement of the component cassettes arranged in the component supply unit. A histogram acquisition unit configured to determine a component cassette including the component having the largest number with reference to the histogram, and simultaneously suck another component from the determined component cassette, The mounting head is controlled to suck a component that can be sucked from a component cassette, and the control unit determines a mounting order of the components based on the component sucked by the mounting head. To.

  In the constraint condition determination method of the present invention, a component is picked up by a mounting head capable of picking up a component from an arrangement of a plurality of component cassettes storing the component, and the mounting head is moved to move the component to the substrate. A constraint condition determination method for determining a component mounter constraint condition by a computer, and a component placement data obtained by reading identification information of the component cassette placed in a component supply unit Obtaining a component arrangement list in which identification information of the component cassette and a position arranged in the component supply unit are associated with each other based on the component arrangement data, and the component arrangement list; Whether the arrangement of the component cassettes violates the constraint condition based on the constraint condition regarding the component placement position constraint of the component mounter Comprising determining, the steps of the sequence of the component cassette gives a warning if it violates the constraints, the.

  In the constraint condition determination method, the step of determining whether or not the component arrangement violates the constraint condition is based on a relationship between the mounting head and an arrangement position of the component cassette. Determining whether the component can be picked up.

  Furthermore, the component mounting order determination method of the present invention is configured to suck a component with a mounting head having a plurality of nozzles capable of sucking the component from an arrangement of a plurality of component cassettes containing the component, and move the mounting head. A component mounting order determination method that targets a component mounter that mounts the component on a board and determines the order of component mounting by a computer, and is obtained by reading identification information of the component cassette arranged in a component supply unit. Obtaining component placement data, creating a component placement list in which identification information of the component cassette and a position to be placed in the component supply unit are associated with each other based on the component placement data; Based on the component placement list and the constraint conditions related to the component placement position constraints of the component mounter, the plurality of nodes are set so as to satisfy the constraint conditions. Comprising determining a nozzle for sucking a component from Le, determining a component mounting order on the basis of the nozzle for sucking the component, a.

  According to the present invention, it is possible to provide a component mounting order determination method and a component mounting order determination apparatus that can be easily replaced and can reduce the time required for switching production boards.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a component mounting machine that is a target of a component mounting order optimization method (component mounting order determination method) and a component mounting order optimization device (component mounting order determination device) according to an embodiment of the present invention will be described.

  There are various types of component mounters that are targets of the component mounting optimization device (hereinafter referred to as optimization device) according to the embodiment of the present invention. For example, a type that mounts components while the mounting head rotates while moving the component supply unit and the board (hereinafter referred to as a rotary machine), a component that mounts components while the mounting head moves XY, and relatively large electronic components and irregular shapes There are types corresponding to mounting of components, IC components, etc. (hereinafter referred to as multi-function machines), types in which mounting heads having a plurality of nozzles mount XY while moving components (hereinafter referred to as modular machines), and the like. In the embodiment of the present invention, a case where a modular machine is used as the component mounting machine will be described.

  FIG. 15 is an external view of a component mounter according to the embodiment of the present invention. As shown in FIG. 15, the component mounting machine 100 includes two sub-equipment (front sub-equipment 110 and rear sub-equipment) that perform component mounting simultaneously and independently or in cooperation with each other (or in an alternating operation). Equipment 120).

  Each sub-equipment 110, 120 is an orthogonal robot type mounting stage. For example, two component supply units 115a and 115b having an arrangement of up to 48 component cassettes 114 for storing component tapes, and the component cassettes 114, For example, a multi mounting head 112 (10 nozzle head) having 10 suction nozzles (hereinafter also simply referred to as “nozzles”) capable of sucking and mounting a maximum of 10 components onto the substrate 20, and the multi mounting head XY robot 113 that moves 112, component recognition camera 116 for inspecting the suction state of the components sucked by multi-mounting head 112 two-dimensionally or three-dimensionally, and tray supply unit 117 that supplies tray components Prepare.

  FIG. 16 is a diagram showing a supply reel used in the component cassette according to the embodiment of the present invention. As shown in FIG. 16, a plurality of electronic components 423d are stored in a storage recess 424a formed continuously on a carrier tape 424 at regular intervals, and a cover tape 425 is attached to the upper surface and packaged. It is supplied in a taping form (part tape) in which a predetermined quantity is wound. The supply reel 426 is attached with a bar code 420 indicating information such as the part name of the housed parts and the number of housed parts.

  The identification information indicating the name of the component stored in the component cassette 114 is not limited to the barcode, and various identification information such as a non-contact IC chip and an RFID tag can be used. This will be described later.

  When the component cassette 114 having the supply reel 426 is attached to the component supply unit 115, the carrier tape 424 is pulled out into the component mounter 100. At the time of component mounting, the carrier tape 424 is transported with the cover tape 425 peeled off as necessary, and the chip-type electronic component 423d stored in the storage recess 424a is sucked by the suction head and taken out. It is.

  FIG. 17 is an external view for explaining the collective exchange cart according to the embodiment of the present invention. The collective replacement cart 50 shown in FIG. 17 has a component placement section 51 in which a plurality of component cassettes 114 can be placed. Then, by inserting the component cassette 114 into the component supply unit 115 of the component mounter 100 in a state where the component cassette 114 is disposed, a plurality of component cassettes 114 can be set in the component mounter 100 at one time.

  FIG. 18 is a diagram showing the constraint conditions of the component placement of the component mounter, and FIG. 18A shows a specific configuration example of the component supply units 115a, b and 215a, b of the sub-equipment 110 and 120, respectively. FIG. 18B is a table showing the number of various component cassettes 114 mounted in the configuration and the position on the Z-axis. As shown in FIG. 18A, each of the component supply units 115a, 115b, 215a, and 215b can mount a maximum of 48 component tapes (the positions are Z1 to Z48, Z49 to Z96, Z97 to Z144, Z145 to Z192).

  Specifically, as shown in FIG. 18 (b), a maximum of 48 types can be provided for each component supply unit (A block to D block) by using a double cassette containing two component tapes having a tape width of 8 mm. Can be mounted. The larger the tape width (component cassette), the smaller the number of cassettes that can be mounted in one block. It should be noted that the left part supply units 115a and 215a (A block, C block) toward each sub-equipment are “left block”, and the right part supply units 115b and 215b (B block and D block) toward each sub-equipment. Is also called “right block”.

  Here, when a component cassette having a large tape width is set at the end of each block of the component supply unit, the component cassette protrudes greatly from the component supply unit. Therefore, there is a restriction that a component cassette having a large tape width cannot be attached to the end of each block. In FIG. 18B, “◯” indicates that attachment is possible, and “−” indicates that attachment is not possible. For example, at the positions of Z1 and Z47 which are the end portions of the block A, there is a restriction that a component cassette having a tape width of 44 mm or more cannot be attached.

  FIG. 19 is a diagram illustrating an example of a position (Z axis) of a component supply unit that can be adsorbed by a nozzle head, and a diagram and a table illustrating an example of a position (Z axis) of a component supply unit that can be adsorbed by a 10 nozzle head It is. In addition, H1-10 in a figure points out the nozzle (position) mounted in the 10 nozzle head. Here, the interval between the nozzles of the 10-nozzle head corresponds to the width (21.5 mm) of one double cassette, so the Z numbers of parts picked up by one up-and-down movement are every other number (only odd numbers) (Or even number only).

In addition, due to the movement restriction of the 10 nozzle head in the Z-axis direction, as shown in FIG. 19B, the nozzle that cannot adsorb to the component (Z-axis) constituting one end of each component supply unit ("-" In the figure) exists. As described above, the component mounter 100 is provided with constraint conditions regarding the component arrangement position in the component supply unit and the position where the component is mounted.
(First embodiment)

  In the first embodiment of the present invention, in the component mounting machine as described above, even if the user randomly arranges the component cassettes and sets them on the component mounting machine, the mounting is performed while the arrangement state is fixed. It aims to optimize the component mounting order so that the time is minimized. As a result, it is possible to save the trouble of creating the optimum part arrangement data and setting the parts according to the data.

  FIG. 1 is a block diagram showing a schematic configuration of an optimization apparatus according to the first embodiment of the present invention. As shown in FIG. 1, the optimization device 1 according to the first embodiment includes an arithmetic control unit 10, a component information input unit 11, a display unit 12, an input unit 13, a database unit 14, and a memory unit 15. , An optimization program storage unit 16 including an arrangement list creation unit 17 and a mounting order determination unit 18, and an optimization data output unit 19.

  The arithmetic control unit 10 is a CPU, a numerical processor, or the like, and loads and executes a necessary program from the optimization program storage unit 16 to the memory unit 15 in accordance with an instruction from the user, and performs optimization according to the execution result. Each component of the apparatus 1 is controlled.

  The component information input unit 11 receives the component arrangement information read by the component information reader 5. The type of the component information reading device 5 is not particularly limited. Here, the component information reading device 5 is configured by a barcode reader that reads information on the barcode 420 provided on the supply reel 426 described with reference to FIG. Further, instead of the barcode 420, an IC (Integrated Circuit) tag including the above-described non-contact IC chip, RFID tag, or the like can be employed. In this case, the component information reading device 5 is configured by an IC tag reader / writer 111 (FIG. 21) that reads identification information for identifying a component stored in the IC tag.

  FIG. 20 is a diagram for explaining the component supply units 115a and 115b using IC tags in more detail. The component cassette 114 is provided with a supply reel 426 having an IC tag 426b instead of the barcode 420 of FIG. In the component supply units 115a and 115b, a switch 450 and a joint detection sensor 452 are provided for each Z number along the Z axis.

  The switch 450 is a switch (sensor) that is electrically turned on when the component cassette 114 is mounted on the component supply unit 115a (115b). Based on the output from the switch 450, the IC tag reader / writer 111 can know the Z number of the component supply unit 115a (115b) in which the component cassette 114 is mounted. The joint detection sensor 452 is a sensor that optically detects the joint of the carrier tape 424. At the time of component mounting, before the end of the carrier tape to be mounted is removed, the end is connected to the start of another carrier tape. Such connection enables component replenishment without stopping the component mounter 100.

  As shown in FIG. 20, when the switch 450 is installed, the switch 450 detects that the component cassette 114 is mounted on the component supply unit 115a (115b). Therefore, the Z number of the component cassette 114 can be specified based on the detection result of the switch 450.

  FIG. 21 is a diagram for explaining a method of specifying the Z number of the carrier tape 424 using an IC tag without using the switch 450 as shown in FIG. The two IC tag reader / writers 111 constituting the component reading device specify the position of each IC tag 426b based on the direction of the radio wave received by each IC tag 426b. When the position of the IC tag 426b is specified, the Z number is specified. At that time, since the two IC tag reader / writers 111 receive the part name information from each IC tag 426b, the part name and Z number of the part cassette 114 are specified based on the information received from the IC tag 426b. The For example, if the Z number is incremented by 1 every time X increases by 10 as shown in the figure, when the position of the part A is specified as (X, Y) = (10, 4), It can be seen that the Z number of the part A is 1. In the case of a double cassette, there are two component tapes at the same Z position. However, since the X coordinate of the component is different, the component tape is located on the left side or the right side of the double cassette. Can be discriminated.

  Note that the method of specifying the position of the IC tag 426b is not limited to the direction of radio waves, and may be based on the strength of radio waves received by the two IC tag reader / writers 111 or the ratio of the strengths of radio waves. . Furthermore, when the IC tag 426b outputs a signal using electromagnetic waves, infrared rays, or the like as a wireless communication medium, the position of the IC tag 426b may be specified based on the signal output status such as the strength and direction.

  The number of IC tag readers / writers 111 is not necessarily two, and may be one as long as the position of the IC tag 426b can be determined from the strength and direction of the received radio wave.

  FIG. 22 is an explanatory diagram for explaining how one IC tag reader / writer 111 specifies the position of the IC tag 426b. For example, the component mounting machine 100 includes one IC tag reader / writer 111 and an antenna 111a disposed from the IC tag reader / writer 111 to the vicinity of the IC tag 426b of each component cassette 114 in the component supply units 115a and 115b. Is provided.

  As described above, since the antenna 111a is close to each IC tag 426b, the IC tag reader / writer 111 can reliably receive the radio wave of the IC tag 426b. In other words, the IC tag reader / writer 111 can accurately specify the position of each IC tag 426b based on the radio wave intensity and reception direction of each IC tag 426b, which is the reception result. Further, the IC tag reader / writer 111 can accurately specify the Z number of the component cassette 114 from the position.

  Further, for each IC tag 426b, an antenna extending to the vicinity of the IC tag 426b may be laid. In this case, since each antenna corresponds to each Z number (Z = 1, 2,...), The IC tag reader / writer 111 is switched by switching and acquiring the output of each antenna. The Z number of the IC tag 426b (component cassette 114) corresponding to the antenna is specified, and the component information is acquired from the IC tag 426b.

  That is, each antenna is provided with a switch. When the switch is turned on, an output from the antenna corresponding to the switch is acquired by the IC tag reader / writer 111. The IC tag reader / writer 111 turns on only the antenna switch corresponding to Z = 1 from among the switches corresponding to each antenna, and then turns on only the antenna switch corresponding to Z = 2. By sequentially turning on the switches, the output of each antenna is switched and acquired.

  The display unit 12 is a CRT, LCD, or the like, and the input unit 13 is a keyboard, a mouse, or the like. These components are used for interaction between the optimization device 1 and the operator under the control of the arithmetic control unit 10. Used.

  The database unit 14 includes a hard disk or the like that stores input data (mounting point data 14a, component library 14b, and mounting device information 14c) used for optimization processing, mounting point data generated by optimization, and the like. The

  The mounting point data 14a is a collection of information indicating mounting points of components to be mounted. The information indicating one mounting point is, for example, component type (component name), X coordinate, Y coordinate, constraint information regarding component mounting (type of usable suction nozzle, maximum moving speed of the multi mounting head 112, etc.), etc. Control data.

  The component library 14b is a library in which unique information about each component type that can be handled by the component mounting machine 100 is collected, and the component size, tact (tact specific to the component type under a certain condition) for each component type, Other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 116, a maximum speed ratio of the multi mounting head 112, and the like) are included.

  The mounting device information 14c is information indicating the device configuration for each of the sub-equipment constituting the production line, the above-described restrictions, etc., head information regarding the type of the multi mounting head, etc., and the suction nozzle that can be mounted on the multi mounting head Nozzle information related to type, cassette information related to the maximum number of component cassettes 114, tray information related to the number of trays stored in the tray supply unit 117, and the like.

  The memory unit 15 includes a RAM or the like that provides a work area for the arithmetic control unit 11.

  The optimization program storage unit 16 includes a hard disk or the like that stores various optimization programs that implement the functions of the optimization device 1. The optimization program storage unit 16 includes an arrangement list creation unit 17 and a mounting order determination unit 18.

  The optimized data output unit 19 outputs optimized data obtained by the optimization program. As an optimization data output form, the optimization data input unit 130 of the component mounter may be connected by wire or wirelessly to transmit the optimization data, or the optimization data may be recorded and output on a recording medium. Also good.

  The component mounting machine 100 includes an optimization data input unit 130 to which optimization data is input, and a mounting machine control unit 140 that controls a work head, a suction nozzle, and the like of the mounting unit 110 according to the input optimization data. .

  A component mounting order optimization method by the component mounter having the above configuration will be described below. The method of the present embodiment generally optimizes the mounting order from an arrangement of component cassettes arranged at random.

  FIG. 2 is a flowchart showing the optimization method according to the first embodiment. As shown in FIG. 2, the user places a component cassette in the component supply unit 115 (S201). Then, the identification information attached to the arranged component cassette is read by the component information reading device 5 (S202). Then, the read component information is input to the component information input unit 11, and the arrangement list creation unit 17 indicates what component (component cassette) is set at which position (Z number) of the component supply unit. A component arrangement list is created (S203). As shown in FIG. 4, the component arrangement list has at least a Z number and a corresponding component name, and includes a shape code or the like as necessary.

  When the component information reading device 5 is a barcode reader, the component placement list is created in S203 by displaying the reading position (Z number) on the display unit of the barcode reader, and for the component cassette set in the corresponding Z number. Read the barcode. In this way, the Z number is associated with the component, and a component arrangement list is created.

  On the other hand, when the component information reading device is an IC tag reader (IC tag reader / writer 111), the processing shown in FIG. 23 is performed in the component arrangement list creation step S203. The optimization device 1 uses the IC tag reader / writer 111 constituting the component information reading device 5 to determine whether or not the component cassette 114 containing the component tape is set in the component supply units 115a and 115b. (S11A). When the component cassette 114 is newly set in the component supply units 115a and 115b (YES in S11A), the Z number of the component cassette 114 set is specified from the output of the switch 450 (S12A). Thereafter, one IC tag reader / writer 111 acquires component information from the IC tag 426b of the set component tape (S13).

  The arithmetic control unit 10 creates a component arrangement list based on the set component tape (S14). That is, the component arrangement list is created based on the component name of the set component tape, the unit ID, and the Z number specified in S13.

  In the component arrangement list creation process shown in FIG. 23, the Z number of the component cassette 114 is specified based on the output of the switch 450. For this reason, in the case of a double cassette, the position of each component tape cannot be specified accurately. Further, even when a plurality of component cassettes are set simultaneously, the position of each component tape cannot be specified. Therefore, as shown in FIG. 24, the position of each component tape may be specified using an IC tag reader / writer 111.

  FIG. 24 is a flowchart of a modification of the component arrangement list creation process shown in FIG. The optimization apparatus 1 checks whether or not the component cassette 114 containing the component tape is set in the component supply units 115a and 115b using the two IC tag readers / writers 111 (S11B). That is, as described with reference to FIG. 21, by checking the position of the IC tag 426b with the two IC tag reader / writers 111, the component cassette 114 in which the component tape to which the IC tag 426b is attached is set. Check the position. When the component cassette 114 is newly set in the component supply units 115a and 115b (YES in S11B), the Z number of the component cassette 114 set by the two IC tag reader / writers 111 is specified (S12B). Since the subsequent processing is the same as that shown in FIG. 23, detailed description thereof will not be repeated here. By using two IC tag readers / writers 111, in the case of a double cassette, it is possible to check whether or not the information stored on either the left side or the right side of the cassette matches. Further, the switch 450 is not necessarily required.

  Returning to FIG. 2, the mounting order is optimized and determined in a state where all the component arrangements are fixed (S204). That is, in the optimization method of the present embodiment, the mounting order is optimized in the arrangement that is still arranged in the component supply unit 115. Therefore, even if the user randomly arranges the component cassettes 114 in the component supply unit 115, the components can be mounted in the optimized mounting order in the arrangement.

  FIG. 3 is a flowchart showing the mounting order determination method according to the first embodiment. FIG. 3 is a diagram illustrating a state in which two mounting points are switched by the random selection method. First, the component optimization unit 316a calculates the total tact in the initial state (S301). The state here is a state in which the mounting order of all the parts constituting one task group is set to a fixed pattern. Therefore, the total tact for one state is uniquely determined from the mounting point data 14a, the component library 14b, and the mounting apparatus information 14c stored in the database unit 14.

  In the present application, the “task” means one operation in a series of operations of picking, moving and mounting parts by the multi-mounting head 112 (FIG. 12) capable of picking up and mounting a plurality of parts on a substrate. Or a group of components mounted by such a single operation. A set of tasks that are combinations of component types of components is called a “task group”. The term “task group” is a term particularly used in the field of modular mounting machines. However, as described above, this embodiment uses other mounting machines (such as high-speed rotary machines) other than the modular mounting machines. This can also be applied to the determination of the mounting order.

  Next, two of these mounting points are selected at random (S302), and the total tact (temporary tact) when the mounting order of the two selected mounting points is changed is calculated (S303). Then, it is determined whether or not the calculated temporary tact is smaller than the tact in the previous state (S304). If the result is smaller, the two mounting points are exchanged (S305). In other words, the current state and total tact are updated and stored when the mounting points are replaced.

  Then, it is determined whether or not the end condition at that time (the tact in that state is smaller than the target tact designated in advance by the operator or a certain processing time has been reached) is satisfied (S306). If it meets, the process ends. On the other hand, if the tact does not become small even if the two mounting points are replaced (NO in S304) and if the end condition is not satisfied (NO in S306), the same processing is performed again until the end condition is satisfied. Repeat (S302 to S306). In this way, the random selection method reduces the tact for each task group in accordance with the spent execution time, and optimizes the component mounting order.

  In the above-described example, the procedure for optimizing the component mounting order by the random selection method has been described, but the optimization may be performed by other various methods.

  According to the optimization method and apparatus of this embodiment, even when component cassettes are randomly installed, the mounting order is optimized, so that the setup change is easy and the time required for switching the production board is shortened. can do.

  In recent years, there is an increasing need to respond quickly to high-mix / low-volume production. If the component arrangement is optimized as in the past, the mounting time per board can be shortened. However, especially when the production substrate is frequently switched due to small-scale production, the ratio of the production substrate switching time to the entire substrate production increases. Therefore, even if the mounting time per board is shortened, the board switching time for the installation / installation confirmation of the component cassettes becomes long, and thus the production time of the board to be produced may become long. In the present embodiment, since the user may install them randomly without being aware of the arrangement of the component cassettes, it is possible to greatly reduce the board switching time.

  In the above-described embodiment, the case where the component cassette 114 is arranged in the component supply unit 115 of the component mounting machine 100 and optimization is performed by reading the arranged arrangement information is described. It may be arranged in the collective exchange cart 50 described in the above, and optimization may be performed by reading the arranged arrangement information.

  In this case, installation and optimization of components can be performed in advance at a location away from the component mounter 100 without using the component supply unit 115 of the component mounter 100. Therefore, it is possible to quickly create optimization data for a board to be produced next while the component mounter 100 is in operation. In other words, when the board is switched, the batch replacement cart 50 is set in the component supply unit 115, and the optimization data created in advance is input to the mounting machine 100, so that production of the next board can be started immediately. Therefore, the setup change can be easily and quickly performed.

(Second Embodiment)
By using the optimization method and the optimization apparatus according to the first embodiment, it is possible to eliminate the trouble of creating the optimal part arrangement data and setting the parts according to the data. It is possible to shorten the time. However, in this embodiment, since the arrangement order of the component cassettes remains in a state of being randomly arranged by the user, depending on the type of substrate, compared with the case where the arrangement of the cassettes is also considered, Component mounting time can be long. If the number of produced substrates is not large, it will not be a serious problem, but the total production time may increase as the number of produced substrates increases. This is because as the number of produced sheets increases, the influence of the part mounting time per sheet becomes larger with respect to the total production time than the influence due to the replacement time of the parts cassette.

  Therefore, in this embodiment, the mounting time according to the mounting order determined according to the first embodiment (total tact by the first optimization approach) and the mounting time when the arrangement of the component cassettes is changed (second Compare the total tact by optimization approach) and adopt the shorter mounting order. By such a method, a shorter mounting time can be achieved.

  FIG. 5 is a block diagram showing a hardware configuration of the optimization program storage unit in the optimization apparatus according to the second embodiment of the present invention. In the figure, the same reference numerals are given to the portions overlapping those in FIG. 1 described in the first embodiment. As shown in FIG. 5, the optimization program storage unit 20 of the present embodiment includes a first total tact calculation unit 21, an optimization information generation unit 22, a second total tact calculation unit 23, and an optimization method determination unit. 24.

  As described in the first embodiment, the first total tact calculating unit 21 fixes the entire arrangement of arranged component cassettes and optimizes the entire board production time (total tact; board to be produced now) , The production time required to produce the entire production number) is calculated. The optimization information generation unit 22 optimizes the arrangement of the component cassettes in consideration of the XY movement time, the nozzle replacement time, and the like, that is, optimizes the mounting order by changing the arrangement of the component cassettes.

  The second total tact calculation unit 23 calculates the total tact when the optimization information generation unit 22 optimizes. The optimization method determination unit 24 selects and determines one of the optimization methods based on the calculation results of the first total tact calculation unit 21 and the second total tact calculation unit 23.

  FIG. 6 is a flowchart showing an optimization method according to the second embodiment. As shown in FIG. 6, first, as a first optimization approach, in S201 to S204, all the component arrangements are fixed and the mounting order is determined. This determination method is the same as that of the first embodiment shown in FIG. Then, the mounting time X per board is calculated (S601). Note that when the method shown in FIG. 3 is used as the mounting order determination procedure in S204, the mounting time (tact) per substrate is calculated in the procedure, so that the value may be set to X. .

  Then, a production tact α (= X × D) is calculated based on the production number D of substrates and the mounting time X input by the input unit 13 (S602). In this first optimization approach, this production tact α is used for board production including board exchange time (actual replacement time is 0 because production is performed with the arrangement of component cassettes already arranged). Total tact that is the total time.

  On the other hand, the optimization information generation unit 22 determines the mounting order by changing the XY movement time of the working head, the nozzle replacement time, and the arrangement of the component cassettes as a second optimization approach (S611).

  In the order determination method of FIG. 3, the provisional tact is calculated by changing the mounting order of the mounting points on the premise that the arrangement order of the component cassettes is fixed. In other words, the change in tact when the arrangement order of the component cassettes is changed is not reflected at all. In consideration of this point, an example in which the arrangement order of the component cassettes is also considered in the calculation of the tact in step S611 is shown in FIG. 7 (extended random selection method). Steps S701 to S706 are the same as S301 to S306 in FIG. In the example of FIG. 7, after it is determined that the end condition of the mounting order is satisfied (YES in S706), the end condition of the cassette arrangement (the tact in that state is based on the target tact specified in advance by the operator). It is also determined whether or not a predetermined processing time is satisfied (S707). If the condition is satisfied, the process ends (YES in S707). On the other hand, if the end condition is not satisfied (NO in S707), two component cassettes are randomly selected in the mounting order (S708), and a temporary tact is calculated when the two selected component cassettes are replaced. (S709). Then, it is determined whether or not the calculated temporary tact is smaller than the tact in the previous state (S710). If the result is smaller (YES in S710), the parts cassette arrangement and the tact are updated. On the other hand, the temporary tact calculated now is larger than the tact in the previous state (NO in S710). The same processing is repeated again (S707 to SS709). In this way, the random selection method extended to the determination of the cassette arrangement reduces the tact for each task group and optimizes the component mounting order in accordance with the execution time spent.

  Returning to FIG. 6, the mounting time Y per board in the mounting order determined in S611 is calculated (S612). In addition, when the method shown in FIG. 3 or FIG. 7 is used as the mounting order determination procedure in S611, the mounting time (tact) per substrate is calculated in the procedure. do it.

  Then, the number A of cassettes to be replaced is obtained based on the difference between the arrangement of the component cassettes before the exchange of the component cassettes and the arrangement of the component cassettes obtained in S611. Then, the cassette replacement time A × B is calculated from the cassette replacement time B per one input from the input unit 13 (S613). Note that the cassette replacement time B per bottle may be given in advance to the second total tact calculating unit 23.

  Further, based on the board production number C input from the input unit 13 and the mounting time Y calculated in S612, a production tact C × Y, which is a time required for board production, is calculated (S614).

  Then, a total tact β (= A × B + Y × C) is obtained by adding the cassette replacement time and the production tact (S615).

  Then, the optimization method determination unit 24 selects and determines a mounting order that is one of the optimization approaches based on the total tacts α and β (S621). For this selection / determination, for example, the one with the smaller total tact is selected.

  In the above-described embodiment, the optimization apparatus selects and determines one of the optimization approaches. However, the optimization apparatus is a source of obtaining the total tact obtained in steps S602 and S615 and the total tact. The mounting time per cassette, the cassette replacement time, the number of produced sheets, and the like may be displayed on the display unit 12, and the user may determine any approach based on the information.

  In addition, when there is mounting point data of a plurality of types of boards to be produced in advance, as a second optimization approach, for each of the nozzle, the component cassette, and the support pins that support the board at the time of mounting, The optimization may be performed in consideration of a portion that can be shared so as to reduce the exchange accompanying the substrate exchange as much as possible.

  According to the second embodiment as described above, it is possible to select and compare the optimization in which the arrangement of the component cassettes arranged in the component supply unit is fixed and the optimization in which the arrangement of the component cassettes is changed. Therefore, it is possible to provide a mounting order optimization method and apparatus for performing production more quickly.

(Third embodiment)
By using the optimization method and the optimization apparatus according to the first embodiment, it is possible to save the trouble of creating the optimum part arrangement data and setting the parts according to the data. However, there still remains a need to perform a prior optimization process before component mounting. In particular, in a modular mounting machine in which a mounting head having a plurality of nozzles such as the multi mounting head 112 mounts components while moving in the XY direction, when determining the mounting order of the components, the components can be removed from the component cassette in the shortest time using the multi nozzles. The problem is whether to adsorb. For this purpose, it is important to determine a combination of components that can simultaneously collect components from a plurality of component cassettes, or that can absorb components from a plurality of component cassettes to a multi-nozzle with the shortest moving distance. Become.

  Therefore, in the present embodiment, prior optimization is not performed on the arrangement of the component cassettes set randomly by the user, and a plurality of tasks can be performed in a short time for each task (one operation of component adsorption and mounting). Consider whether the component is picked up by the head and mounted on the board. For this purpose, the type and number of components to be mounted are obtained in advance, and the head is controlled so that the components that can be picked up simultaneously with the component with the largest remaining number of components to be mounted for each task are picked up.

  FIG. 8 is a block diagram showing a schematic configuration of the optimization apparatus according to the third embodiment of the present invention. In the figure, the same reference numerals are given to the portions overlapping those in FIG. 1 described in the first embodiment.

  As shown in FIG. 8, the optimization program storage unit 30 in the optimization device of this embodiment includes a histogram creation unit 31. Further, the component mounting machine 100 includes a mounting order control unit 150 that has a mounting order determination unit 151 and controls the mounting unit 110.

  FIG. 9 is a flowchart showing a component mounting method according to the third embodiment. As shown in FIG. 9, the component cassette is installed (S201), the component information attached to the installed component cassette is read by the component information reader 5 (S202), and the component information is based on the read identification information. An arrangement list is created (S203). The histogram creation unit 31 creates a component histogram based on the created component arrangement list and the mounting point data 14a stored in the database unit 14 (S801).

  FIG. 10 is a component histogram showing the relationship between the component arrangement and the number of components to be mounted. As shown in FIG. 10, the component histogram is a histogram showing the relationship between the Z number (component arrangement position) and the number of components to be mounted on the board of the components arranged at the Z number. This histogram is obtained from an array list showing the correspondence between Z numbers and component cassettes (component names) randomly arranged by the user, mounted components obtained from the mounting point data, and the number of components.

  Next, the mounting machine control unit 150 aligns the position of the work head 112 so as to suck the component having the largest remaining number to be mounted, and sucks the component and the component that can be sucked at the same time (S802). The mounter control unit 150 refers to the remaining number of components to be mounted, and aligns the work head 112 at a position where the component with the largest remaining number can be picked up and the number of components that can be picked up at the same time is increased as much as possible. Is preferred. Thereby, adsorption | suction efficiency can be raised. Further, when simultaneous suction is performed and there are empty suction nozzles that can be suctioned, it is desirable to perform suction until all the empty suction nozzles are filled.

  When the component suction to the suction nozzle is completed, the mounting order determination unit 151 determines the mounting order for the sucked components (S803). The mounting order is determined using a greedy method based on, for example, mounting point data and a mounting time for a sucked component calculated by a component sucked by the work head. The greedy method is a method for determining the mounting order so that the mounting is performed in the order of the mounting points closest to the mounting points on the board. That is, the mounting order in which the head moves along the shortest path is determined for the task (part group sucked by the suction head).

  That is, in the optimization method of the present embodiment, when the component histogram is generated, the component suction processing is first performed by the component mounting machine, and the mounting order is determined each time the suction processing is performed. Therefore, it is possible to optimize the mounting order while performing the component mounting operation by simply inputting the mounting point data and supplying the randomly arranged components.

  Then, when the board mounting of the sucked component is finished (YES in S804), it is determined whether or not the mounting of the component is finished (S805). If there are still parts to be mounted (NO in S805), the process returns to S802.

  According to the third embodiment, since the mounting operation of the component can be started quickly by the mounting apparatus, it is possible to cope with an urgent production particularly when the number of the boards is small. Can do. That is, since the mounting order is determined for each task by the mounting machine, it is not necessary to determine the mounting order in advance, and mounting can be started immediately.

(Fourth embodiment)
As described with reference to FIGS. 18 and 19, in the modular mounting machine such as the multi mounting head 112, there may be a predetermined constraint condition (constraint associated with the tape width of the component cassette) on the component arrangement. Due to such constraints, there are cases where component mounting cannot always be performed using the results of the above-described embodiment. In such a case, it is necessary to determine the mounting order in consideration of the constraint conditions.

  Therefore, in the present embodiment, it is determined whether or not the arrangement of the component cassettes randomly set by the user does not violate the constraint conditions. Alternatively, the mounting order is determined so as to satisfy the constraint conditions.

  FIG. 11 is a block diagram showing a schematic configuration of the optimization apparatus according to the fourth embodiment of the present invention. In the figure, the same reference numerals are given to the portions overlapping those in FIG. 1 described in the first embodiment. As illustrated in FIG. 11, the optimization device 4 that operates as the constraint condition determination device of the present embodiment includes a constraint condition determination program storage unit 40 and a warning notification unit 42.

  The constraint condition determination program storage unit 40 includes a constraint condition determination unit 41. The warning notification unit 42 includes the display unit 12, a light emitting unit such as an LED, a voice output unit that outputs a warning sound and guidance, and the like.

  Here, the constraint condition relates to the constraint on the arrangement position of the components described with reference to FIG. As in the prior art, in the case of optimization for designating the arrangement position of parts, by performing optimization processing in consideration of this constraint condition in advance, it is possible to avoid component arrangement that violates the constraint condition. On the other hand, in the first to third embodiments, since it is possible to perform the optimization by randomly arranging the components, there may be a component arrangement that violates the constraint condition. Therefore, as in the present embodiment, when a constraint condition is violated, a warning is notified to the user, so that the parts can be arranged in compliance with the constraint condition.

  FIG. 12 is a flowchart illustrating a constraint condition determination method according to the fourth embodiment. Parts are placed in the parts supply unit (or batch exchange cart) (S201), the placement of the parts cassette is read (S202), and a parts placement list is created (S203). Then, the mounting order is determined with the component arrangement fixed (S204), and which component is to be picked up by which nozzle is determined. Then, the constraint condition determination unit 41 determines whether or not the component layout position violates the constraint conditions based on the component layout list and the constraint information in the mounting apparatus information 14c (S1101).

  As a result of determining the mounting order by the steps S201 to S204, it is determined which component is to be picked up by which nozzle. This means that it is determined which component from which component cassette is to be absorbed by which suction nozzle. At this time, as shown in FIG. 19B, the suction of the component by the suction nozzle may be restricted depending on the type of the component cassette. Accordingly, whether the combination of the Z number of the component cassette and the suction nozzle (head position) does not violate the constraint condition can be determined based on “◯” and “−” in FIG. . This determination is the process of S1101 described above.

  In the first and second embodiments, it is determined in advance to select only the combination of the suction nozzle (head position Z number) and the component cassette that are “◯” in FIG. 19B. Also good. On the other hand, in the third embodiment, since the mounting order is determined for each task based on the histogram in FIG. 9 (S802 in FIG. 9), the suction nozzle (head) that picks up at the time when the component cassette is set. I haven't decided yet. Therefore, the determination as in S1101 is impossible. However, when determining the mounting order for each task, the mounting order can be determined in consideration of constraints.

  When there is a constraint condition violation (YES in S1102), the warning notification unit 42 notifies that there is a constraint condition violation (S1103). This notification method includes a display on the display indicating that a constraint violation has occurred, a flashing light emitting unit, a warning sound, etc., and whether or not there is a constraint violation in any part of the Z-axis. You may alert | report by a display or audio | voice guidance. When the warning is notified, the process returns to the work of placing the parts in order to eliminate the constraint violation.

  If there is no constraint condition violation (S1102), the constraint condition determination process ends. Thereafter, as in the first embodiment or the second embodiment, a mounting order optimization process in which the component arrangement is fixed may be performed.

  According to such a fourth embodiment, even when the component placement order is optimized by randomly performing component placement, a warning is given when a component placement constraint condition violation occurs, Component placement can be performed in accordance with the constraints.

(Fifth embodiment)
In the description of each of the above-described embodiments, it is assumed that the component cassette 114 set in the component supply units 115a and 115b of the component mounter 100 includes all components necessary for board production. However, when the user randomly sets a component cassette in the component supply unit, all of the necessary component cassettes are not always set, and there may be a shortage of components. In such a case, it is preferable to perform control to warn of the presence of the missing component cassette. In this embodiment, such a warning is given.

  FIG. 13 is a flowchart showing a missing component warning method according to the fifth embodiment. First, when a user arranges a component cassette in the component supply unit 115, identification information (component cassette information) attached to the arranged component cassette is read by the component information reading device 5 (S1201). Then, the arithmetic control unit 10 reads information on components used on the board currently being produced as CAD information from an external PC or the like (S1202). Of course, as in the first embodiment, the component type (component name) may be read from the mounting point data 14a held in advance.

  Then, the arithmetic control unit 10 collates the above-described component cassette information and CAD information (S1203). As a result of the collation, if it is determined that there are no missing parts (NO in S1204), a parts arrangement list is created (S1208) and the mounting order is optimized (S1209), as in the above-described embodiment.

  On the other hand, if it is determined as a result of the collation that there is a missing part (YES in S1204), a warning that there is a missing part and the type of the missing part are displayed via the display unit 12 (S1205). Then, it is determined whether or not the user who has seen this warning has set a component cassette of insufficient components in the component supply unit 115 (S1206). This determination is continued intermittently until the cassette is set (NO in S1206). When the cassette is set (YES in S1206), the component cassette information is read again (S1207), a component arrangement list is created (S1208), and the mounting order is optimized, as in the above-described embodiment. (S1209).

  In the above-described procedure, optimization is not started until the missing part is set. However, it is also possible to ignore the presence of missing parts and start mounting after determining the mounting order for mounting only the currently set parts. In this case, it is possible to configure so that mounting of the missing part is started when the missing part is set.

  The insufficient component warning method of the present embodiment can be used as the pre-processing of all the above-described embodiments, and can appropriately cope with the occurrence of a component shortage associated with the production board switching.

(Modification 1 of 5th Embodiment)
In the fifth embodiment, when it is determined that the cassette of the same component is set in the plurality of component supply units at the time when the component cassette information and the CAD information are collated (S1203 in FIG. 13), the following 1 ) And 2) can be further provided. In addition, the optimization device can be configured so that one of 1) and 2) can be selected.

1) Parts are picked up from any one of the parts cassettes, and the parts in the other parts cassette are used as spare parts when the parts are out.
2) Assign mounting points of corresponding parts in the CAD information to a plurality of parts cassettes.

(Modification 2 of the fifth embodiment)
In the fifth embodiment, when the parts cassette information and the CAD information are collated (S1203 in FIG. 13), the parts cassette information is collated including the alternative parts. “Substitute part” means a part that can be regarded as a substitute as a part that can realize the same use / function as the original part even if the part name, shape, and the like are different. If an alternative part for the specified part is registered in advance, if the part read from the parts cassette matches the name of the alternative part even if it does not match the specified part, the part arrangement list is displayed as if the alternative part was set. Create and determine the order of implementation.

(Modification 3 of the fifth embodiment)
In the fifth embodiment, occurrence of a shortage of components in a single component mounter is monitored, and when a shortage of components occurs, a predetermined warning is given. On the other hand, in this modification, in a production line including a plurality of component mounters, control is performed to warn of the presence of a missing component cassette when a component shortage occurs in at least one of the plurality of component mounters. That is, in this modification, the shortage component warning is expanded from the component mounter level to the production line level.

  FIG. 14 is a flowchart showing a missing component warning method according to the third modification of the fifth embodiment. First, when a user arranges a component cassette in the component supply section of all the mounting machines on the production line, identification information (component cassette information) attached to the arranged component cassette is read by the component information reading device in each mounting machine. (S1301). Then, the arithmetic and control unit of each mounting machine reads information on components used on the board that is currently being produced as CAD information from an external PC or the like (S1302). Of course, as in the first embodiment, the component type (component name) may be read from the mounting point data 14a held in advance.

  Then, the arithmetic control unit 10 collates the above-described component cassette information and CAD information (S1304). As a result of the collation, if it is determined that there are no missing parts (NO in S1304), each mounting point is assigned to a mounting machine having a component cassette (S1308). Then, as in the above-described embodiment, a component arrangement list is created (S1309), and the mounting order is optimized (S1310).

  On the other hand, if it is determined that there is a missing part (YES in S1304), a warning that there is a missing part and the type of the missing part are displayed via the display unit 12 (S1305). Then, it is determined whether or not the user who has seen this warning has set a component cassette of insufficient components in the component supply unit 115 (S1306). This determination is continued intermittently until the cassette is set (NO in S1306). When the cassette is set (YES in S1306), the component cassette information is read again (S1307), and each mounting point is distributed to the mounting machine having the component cassette (S1308). As in the above-described embodiment, a component arrangement list is created (S1309), and the mounting order is optimized (S1310).

  In the above embodiment, the case where the optimization device and the array information reading device are separately provided has been described, but these may be integrated. Moreover, the component mounting machine 100 may be provided with the optimization apparatus of each embodiment. In this embodiment, a plurality of nozzles are provided in a single mounting head, but the number of mounting heads per component mounting machine is not limited to one, and a plurality of mounting heads can be received. The present invention is also applied when a mounting head having one nozzle is provided in a multi-component mounting machine.

  Although various embodiments of the present invention have been described above, the present invention is not limited to the matters shown in the above-described embodiments, and those skilled in the art will be able to understand based on the claims and the description of the specification and well-known techniques. Such changes and applications are also within the scope of the present invention, and are included in the scope of seeking protection.

  INDUSTRIAL APPLICABILITY The present invention has an effect that setup change is easy and the time required for switching a production board can be shortened, and is useful for a component mounting order determination method and a component mounting order determination device for a component mounting machine and the like.

The block diagram which shows schematic structure of the optimization apparatus which concerns on the 1st Embodiment of this invention. The flowchart which shows the optimization method which concerns on 1st Embodiment The flowchart which shows the mounting order determination method which concerns on 1st Embodiment Explanatory drawing showing an example of an arrangement list The block diagram which shows the hardware constitutions of the optimization program storage part in the optimization apparatus which concerns on the 2nd Embodiment of this invention. The flowchart which shows the optimization method which concerns on 2nd Embodiment. The flowchart which shows the mounting order determination method which concerns on 2nd Embodiment The block diagram which shows schematic structure of the optimization apparatus which concerns on the 3rd Embodiment of this invention. The flowchart which shows the component mounting method which concerns on 3rd Embodiment. Component histogram showing the relationship between the component array and the number of components to be mounted The block diagram which shows schematic structure of the optimization apparatus which concerns on the 4th Embodiment of this invention. The flowchart which shows the constraint condition determination method which concerns on 4th Embodiment The flowchart which shows the lack component warning method which concerns on the 5th Embodiment of this invention. The flowchart which shows the lack component warning method which concerns on the modification 3 of the 5th Embodiment of this invention. External view for explaining a component mounting machine according to an embodiment of the present invention The figure which shows the reel for supply used for the components cassette which concerns on embodiment of this invention External view for explaining a collective exchange cart according to an embodiment of the present invention The figure which shows the restriction condition of the component placement of the component mounter The figure which shows the example of the position (Z-axis) of the component supply part which a nozzle head can adsorb | suck The figure for demonstrating in detail the structure of the components supply part in the example which uses an IC tag. The figure for demonstrating the method of specifying the Z number of a carrier tape from IC tag same as the above Explanatory drawing for demonstrating a mode that one IC tag reader / writer same as the above determines the position of an IC tag. It is a flowchart of a component collation process same as the above. It is a flowchart of the modification of a component collation process same as the above.

Explanation of symbols

1, 2, 4 Optimization device 5 Component information reading device 10 Operation control unit 11 Component information input unit 12 Display unit 13 Input unit 14 Database unit 15 Memory unit 16, 20, 30 Optimization program storage unit 17 Arrangement list creation unit 18 Mounting order determination unit 19 Optimization data output unit 21 First total tact calculation unit 22 Optimization information generation unit 23 Second total tact calculation unit 24 Optimization method determination unit 31 Histogram creation unit 40 Constraint condition determination program storage unit 41 Constraint conditions Determination unit 42 Warning notification unit 50 Collective replacement cart 51 Component placement unit 100 Component mounter 110, 120 Mounting unit 111 IC tag reader / writer (component information reader)
112 Working heads 112a to 112b Suction nozzle 113 XY robot 114 Component cassette 115a, 115b Component supply unit 116 Recognition camera 117 Tray supply unit 420 Bar code 423d Electronic component 424 Carrier tape 424a Storage recess 425 Cover tape 426 Supply reel 426b IC tag 450 Switch 452 Seam detection sensor

Claims (8)

A component mounting machine for picking up a component from an arrangement of a plurality of component cassettes containing the component with a mounting head capable of sucking the component and moving the mounting head to mount the component on a board, and a computer A component mounting order determination method for determining the mounting order of components by
Obtaining component arrangement data obtained by reading identification information of the component cassette randomly arranged in the component supply unit;
Creating a component arrangement list in which identification information of the component cassette and a position arranged in the component supply unit are associated with each other based on the component arrangement data;
Determining the mounting order of the components in a state where the arrangement of the component cassettes is fixed based on the created component arrangement list, and
The determined mounting order is a first mounting order,
The component mounting order determination method further includes:
Obtaining a second mounting order which is a mounting order in a state where the arrangement of the component cassettes is further changed under the first mounting order in the previous period;
Comparing the mounting time of the first mounting order with the mounting time including the time to change the arrangement of the component cassettes in the second mounting order;
A component mounting order determination method comprising: selecting one of the first mounting order and the second mounting order . The component mounting order determination method according to claim 1,
Reading the identification information of the component cassette from an IC tag provided on the component cassette or a component tape in the component cassette;
Identifying the position of the component cassette from the position information received from the IC tag;
A component mounting order determination method, further comprising: creating a component arrangement list based on the position of the specified component cassette and the read identification information. A component mounting order determination method according to claim 1 or 2,
The step of determining the mounting order includes:
Changing the mounting order for those mounting points with reference to mounting point information including information regarding the positions of the components mounted on the board; and
Calculating a mounting time under the changed mounting order, and determining a mounting order that shortens the mounting time. A component mounting order determination method according to any one of claims 1 to 3 ,
When the mounting head has a plurality of nozzles, the step of determining the mounting order includes:
Creating a histogram showing a relationship between a component to be mounted based on the arrangement of the component cassettes and the number of components;
Determining a parts cassette including the parts with the highest number with reference to the histogram; and
Determining a component that can be sucked simultaneously with the picking of the component from the determined component cassette, and the mounting order is determined based on the determined component cassette and the pickable component Order determination method. A component mounting order determination method according to any one of claims 1 to 4 ,
The component mounting order determination method further includes:
Determining whether there are any missing parts after the parts cassette is placed in the parts supply section;
A step of notifying a warning when it is determined that there is a missing part;
And a step of determining whether or not a component cassette including the insufficient component is disposed in the component supply unit after the notification step. The component mounting order determination method according to claim 5 ,
In the step of determining whether or not there is a missing part, if it is found that a plurality of part cassettes that store the same part are arranged in the part supply unit, 1) one of the plurality of part cassettes Either pick up components preferentially from one component cassette and treat the components of other component cassettes as spare components when the components run out, or 2) distribute the mounting points on the board for each of the plurality of component cassettes A component mounting order determination method that executes these steps. The component mounting order determination method according to claim 5 ,
A component mounting order determination method in which, in the step of determining whether or not there is a missing component, if a replacement component exists in a component cassette, the replacement component is regarded as a component mounted on a board. The component mounting order determination method according to claim 5 ,
A component mounting order determination method for performing a step of determining whether or not there is a missing component for all of the plurality of component mounters when there are a plurality of component mounters on a board production line.

Images