JP4560400B2 - Plating equipment - Google Patents

Description

  The present invention relates to a plating apparatus for performing a plating process on an object to be plated such as a semiconductor wafer or an electronic substrate.

  Conventionally, various plating processes have been performed on plating objects such as semiconductor wafers and electronic substrates. And a jet type plating apparatus is known as one of apparatuses which plate such a plating object.

  This jet plating apparatus is generally formed so that a cup-shaped plating tank provided with a liquid supply pipe at the bottom and a peripheral part of a plating object can be placed along the opening of the plating tank. The mounting portion and a liquid outlet provided below the mounting portion and in the same plane as the inner wall surface of the bath that forms the plating bath opening are provided so that the plating solution can be discharged. The plating solution is supplied from the liquid supply pipe toward the surface to be plated of the object to be plated in the mounting portion, and the plating process is performed while discharging the plating solution from the liquid outlet.

  That is, in this jet plating apparatus, the plating solution supplied by the jet toward the surface to be plated flows along the entire surface of the surface to be plated and is discharged from the liquid outlet. In particular, when the liquid supply pipe is provided at the center of the tank bottom, the plating solution is supplied by being jetted toward the center of the surface to be plated, and spreads in the peripheral direction from the vicinity of the center on the surface to be plated. The plating solution contacts in such a fluid state. Therefore, this jet plating apparatus can perform uniform plating treatment on the entire surface to be plated. Furthermore, this jet type plating apparatus is widely used as an apparatus suitable for small-lot production and automation of the plating process because the plating object of the mounting part can be sequentially replaced to perform the plating process.

  FIG. 8 is a sectional view of a conventional jet plating apparatus. The plating apparatus 100 includes a mounting part 120 formed in the upper opening of the plating tank 110, a cathode electrode 123 fixed to the mounting part 120, and a liquid outlet 130 formed at a position below the mounting part 120. And a liquid supply pipe 140 provided at the bottom of the plating tank 110, and an anode electrode 150 formed around the liquid supply pipe 140.

  When the plating process is performed by the plating apparatus 100, the peripheral portion of the plating object W is pressed by the pressing means P with the plating object W placed so that the surface to be plated Ws faces the plating tank. It fixes to the mounting part 120. Then, a plating solution that flows from the center of the surface to be plated to the outer peripheral direction is brought into contact with the surface to be plated by spraying and supplying the plating solution from the liquid supply pipe toward the surface to be plated. Process.

  FIG. 9 shows details of the mounting portion of the jet plating apparatus shown in FIG. The mounting unit 120 is installed on an annular mounting table 121 having an opening having the same shape as the opening of the plating tank 110, an annular seal packing 122 installed on the annular mounting table 121, and an upper surface of the seal packing 122. And a cathode electrode 123. The annular mounting table 121, the seal packing 122, and the cathode electrode 123 are fixed to the upper opening of the plating tank 110 by a top ring 124.

  As shown in FIG. 9, in this conventional jet type plating apparatus, the liquid outlet 130 is formed at a position below the annular mounting table 121, and the liquid outlet 130 further includes the inner surface 121 </ b> A of the annular mounting table 121 and the seal. The inner surface 122 </ b> A of the packing 122 is formed to coincide with the inner surface 122 </ b> A. Therefore, the corner | angular part (FIG.) Formed by the peripheral part of the to-be-plated surface Ws of the plating target object W, the inner side surface 121A of the cyclic | annular mounting base 121, the inner side surface 122A of the seal packing 122, and the liquid outlet 130 of a plating solution. 9 at the position indicated by S1), the flow of the plating solution stayed, and the air in the plating solution tended to easily accumulate in that portion. That is, in the conventional jet-type plating apparatus shown in FIG. 8, when the plating solution showing the fluid state is brought into contact with the surface to be plated Ws of the object to be plated W, the plating treatment at the peripheral portion of the surface to be plated Ws is not performed. It becomes uniform. This is not preferable because it limits the usable area of the plating target surface to be plated, and if the plating target is a wafer, the production yield of effective chips is reduced.

  For such non-uniformity of the plating properties resulting from the structural features of the conventional jet-type plating apparatus, the applicant assigns the liquid outlet provided at the lower position of the mounting portion to the object to be plated. The plating apparatus provided in the position away from the periphery of the to-be-plated surface in the outward direction was proposed. (For example, Patent Document 1)

JP 2004-124138 A

  An example of the plating apparatus of Patent Document 1 is shown in FIG. Although the configuration of the plating apparatus is the same as that of the conventional jet-type plating apparatus shown in FIG. 8, the liquid outlet 130 is formed on the outer side from the inner peripheral surface 120A of the mounting portion 120.

  According to the plating apparatus of Patent Document 1, although the plating solution stays in the vicinity of the liquid outlet 130, the liquid outlet 130 is located outside the periphery of the surface Ws to be plated of the object W to be plated. It is possible to avoid stagnation of the plating solution flow at the periphery of the surface Ws. That is, the stay of the plating solution flow that occurs in the vicinity of the solution outlet 130 does not directly affect the plating properties of the object W to be plated, so that the unevenness of the plating process can be effectively prevented.

  However, even in the plating apparatus of Patent Document 1 proposed by the applicant of the present application, as shown in FIG. 11, the surface to be plated Ws of the object to be plated W, the inner side surface 121 </ b> A of the annular mounting table 121, and the seal packing 122. A minute corner (S2) is formed by the inner side surface 122A. In this small corner portion S2, since the flow of the plating solution still stays slightly, the plating properties in the vicinity of the edge of the peripheral portion of the surface to be plated Ws tend to be non-uniform.

  However, in recent years, in addition to the speeding up of the plating process required for conventional plating apparatuses and the uniformity of high-precision plating properties, for example, when the object to be plated is a wafer, the plating apparatus in recent years is a single plating. There is a need for a technique that can acquire more effective chips from an object. The minute corner S2 shown in FIG. 11 is considerably smaller than the corner S1 in the conventional jet plating apparatus shown in FIGS. However, if it is possible to improve the flow of the plating solution in this minute corner portion, it is possible to perform plating processing with high precision plating properties at the periphery of the surface to be plated of the object to be plated, and when the object to be plated is a wafer, As compared with the case where plating is performed with a conventional plating apparatus, it is possible to expect more effective chips.

  In addition, due to the demand for high production efficiency, the area of plating objects has been increased, and a plating process having even higher accuracy in plating properties is desired for such objects to be plated. For example, when the object to be plated is a wafer, the amount of effective chips that can be acquired at the peripheral edge of the surface to be plated increases as the diameter of the wafer increases, so that uniform plating treatment is performed up to the edge of the peripheral edge of the surface to be plated. There is a strong demand for technology that can achieve this.

  The present invention is made in the background as described above, in the jet plating apparatus, the retention of the plating solution flow that occurs at the minute corners formed by the mounting portion inner peripheral surface and the surface to be plated, We intend to provide plating technology that can be easily eliminated.

  In order to solve the above-mentioned problems, as a result of intensive studies by the present inventors, the present invention provides an annular mounting table provided at the upper opening edge of the plating tank so as to protrude inward from the inner wall surface of the plating tank, and the annular mounting table. A mounting portion having a seal packing disposed at the top of the mounting table; a liquid supply pipe provided at the bottom of the plating tank; and a liquid outlet provided at a position below the mounting portion. In a plating apparatus that forms a flow that flows out of the plating tank from the liquid outlet to the plating solution supplied in an upward flow and makes the plating solution come into contact with the entire surface of the object to be plated. The mounting portion is provided with a liquid discharge hole for discharging the plating solution staying at a minute corner formed by the surface to be plated of the object to be plated and the inner peripheral surface of the mounting portion.

  In the present invention, the inner circumferential surface of the mounting portion refers to a side surface at a step formed due to the thickness of the inner surface of the annular mounting table and the inner surface of the seal packing in the mounting portion. By forming the liquid discharge hole in the mounting portion, the plating solution staying in the small corner portion is discharged to the outside through the liquid discharge hole, so that the stay of the plating solution flow in the small corner portion is eliminated. It becomes possible.

  The liquid discharge hole formed in the mounting portion may have any structure as long as it can prevent the plating liquid flow from staying in the minute corner portion. For example, it may be formed along these surfaces from the inner surface of the annular mounting table toward the lower surface of the annular mounting table, and a hole through which the plating solution can be discharged to the outside is formed on the inner surface of the annular mounting table or seal packing. Also good. Preferably, it is easy to process the annular mounting table and the sealing performance at the mounting portion is not impaired.

  In the plating apparatus according to the present invention, the mounting portion includes an annular mounting table having a protruding portion that extends from the inner surface of the seal packing toward the center of the plating tank, and liquid is discharged to the protruding portion. The thing provided with the hole is preferable. This is because if the annular mounting table having the overhanging portion is employed, the liquid discharge hole can be easily provided and the sealing performance in the mounting portion can be maintained. The projecting portion of the annular mounting table in this mounting table may be formed so that the annular mounting table projects by increasing the opening diameter of the seal packing.

  And it is preferable that the liquid discharge hole has a downward slope toward the outer periphery of the annular mounting table and is formed in a plurality so as to be radial from the center of the plating tank. When the liquid discharge hole having the above gradient is formed in the projecting portion of the annular mounting table, the plating solution at the minute corners is discharged from the solution discharge hole to the outside. It is because it can eliminate.

  In the plating apparatus of the present invention, since the placing portion is formed in a state of projecting inward from the inner wall of the plating tank, when placing a plating object on this projecting portion and fixing with a pressing means, the placing portion is There is a risk of damage due to insufficient strength. Therefore, it is necessary to provide some reinforcing means on the protruding portion of the mounting portion. The reinforcing means may have any structure, but it is preferable to adopt a structure that does not hinder the plating solution flow as much as possible.

  In view of the above points, the plating apparatus according to the present invention includes a flange having an inner surface formed so as to coincide with the inner wall surface of the plating tank, and a plurality of flanges formed to support the mounting portion on the flange inner surface. An annular top plate having a reinforcing plate is provided, and the top plate is preferably sandwiched between the placing portion and the plating bath upper opening edge.

  The annular top plate is an annular plate that includes a flange and a reinforcing plate, and a plurality of reinforcing plates that are integrally formed on the inner surface of the flange. If this annular top plate is sandwiched between the plating tank of the conventional plating apparatus and the mounting portion, the lower surface of the protruding portion of the mounting portion comes into contact with the reinforcing plate, thereby reinforcing the mounting portion. Is possible.

  The greatest advantage of adopting the annular top plate is that it has an advantage in terms of manufacturing cost. This is because the plating apparatus according to the present invention can be modified by a relatively simple operation of sandwiching the annular top plate between the mounting portion and the plating tank in the conventional jet plating apparatus.

  In addition, it is preferable that the liquid supply amount in the plating apparatus according to the present invention is capable of adjusting the flow rate so as to supply the plating liquid at 1 L / min to 20 L / min. If the supply flow rate of the plating solution is less than 1 L / min, a high current plating process tends to be impossible, and if it exceeds 20 L / min, the flow of the plating solution may stay in the small corners. Because there is.

  The flow rate of the plating solution in the liquid supply pipe may be any structure as long as the above-described flow rate can be secured, but the liquid discharge part of the liquid supply pipe is positioned so as to be positioned about 20 mm below the surface to be plated. A supply tube may be formed. Although the liquid supply pipe is arranged in this manner, the liquid discharge part of the liquid supply pipe approaches the surface to be plated, although it depends on the type of plating liquid, plating current, and plating treatment conditions such as the supply flow rate of the plating liquid. This is because it is predicted that the plating treatment at the center of the surface to be plated and the vicinity of the peripheral edge will not be uniform if it is too much.

  In the case of the plating apparatus according to the present invention, in the conventional jet-type plating apparatus, it is effective to retain the plating solution generated at the minute corner formed by the surface to be plated and the inner peripheral surface of the mounting table. Can be eliminated. As a result, the usable area of the surface to be plated of the object to be plated is increased. For example, when the object to be plated is a wafer, the production yield of effective chips can be increased.

  Hereinafter, a preferred embodiment of a plating apparatus according to the present invention will be described with reference to the drawings.

1st embodiment : The plating apparatus of this 1st embodiment pinched | interposed the cyclic | annular top plate between the plating tank and the mounting part, and also provided the overhang | projection part which has a some liquid discharge hole in the cyclic | annular mounting base. Is. In FIG. 1, the schematic sectional drawing of the plating apparatus in this embodiment is shown. An annular top plate 60 is provided in the upper opening of the plating tank 10 in the present embodiment so that the inner wall surface of the plating tank 10 and the inner surface of the flange 61 coincide.

  A liquid outlet 30 for discharging the plating solution supplied into the plating tank 10 is provided at the bottom of the mounting portion 20, and a liquid supply pipe 40 for supplying the plating solution into the tank at the center of the bottom of the plating tank 10. Is provided. Further, an anode electrode 50 is disposed around the liquid supply pipe 40 so as to face the surface to be plated Ws. The anode electrode 50 and the cathode electrode 23 are connected to a plating current supply power source.

1st embodiment: The plating apparatus of this 1st embodiment pinched | interposed the cyclic | annular top plate between the plating tank and the mounting part, and also provided the overhang | projection part which has a some liquid discharge hole in the cyclic | annular mounting base. Is. In FIG. 1, the schematic sectional drawing of the plating apparatus in this embodiment is shown. In the present embodiment, an annular top plate 60 is provided in the upper opening of the plating tank 10, and the mounting portion 20 is provided on the upper surface of the flange 61. When the mounting portion 20 is provided on the upper surface of the annular top plate 60, the reinforcing plate 62 comes into contact with the protruding portion of the mounting portion 20, so that the mounting portion can be reinforced.

A liquid supply pipe 40 for supplying a plating solution into the tank is provided at the bottom center of the plating tank 10. Further, an anode electrode 50 is disposed around the liquid supply pipe 40 so as to face the surface to be plated Ws. The anode electrode 50 and the cathode electrode 23 are connected to a plating current supply power source.

  FIG. 2 shows a schematic cross-sectional view of the mounting portion of the plating apparatus according to the first embodiment. The mounting portion 20 includes a cathode electrode 23, a seal packing 22 for preventing plating solution leakage under the cathode electrode 23, and an annular mounting base 21, and these are fixed to the opening of the annular top plate 60 by a top ring 24. . And in the mounting part 20, the peripheral part of the plating target object W is mounted in the state which made the to-be-plated surface Ws of the plating target object W downward, and it is plated by the cyclic | annular pressing member provided in the press means P. The entire circumference of the upper surface of the object Ws is pressed to fix the plating object W to the mounting portion. At this time, the peripheral edge portion of the plating object W is sealed by the seal packing and is in contact with the cathode electrode 23 for plating current. In addition, the front end side of the seal packing 22 is provided with a convex portion, and can reliably prevent the plating solution from leaking to the outside. (Japanese Unexamined Patent Application Publication No. 2004-68093)

  Here, the annular top plate will be described. The annular top plate 60 is formed of a flange 61 and a reinforcing plate 62, and a plurality of reinforcing plates 62 are formed on the inner surface of the flange 61. And this reinforcement board 62 is standingly arranged radially so that it may protrude toward the plating tank 10 center direction. When the reinforcing plate 62 is provided, a plurality of spaces partitioned by the reinforcing plate and the flange, that is, partitioned liquid chambers are formed radially. In each compartment liquid chamber, an opening (not shown) for flowing out the plating solution is provided in the upper part of the flange. In this case, the opening for discharging the plating solution and the surface coinciding with the inner side surface of the annular top plate become the liquid outlet.

  When the top plate 60 is installed so that the inner surface 61 of the flange and the inner wall surface of the plating tank 11 coincide with each other, and further, a mounting portion is installed on the upper surface of the flange, a plurality of radially formed reinforcing plates protrude from the mounting portion. It comes into contact with the part. That is, the mounting portion is supported by the reinforcing plate simply by sandwiching the annular top plate between the plating tank opening and the mounting portion, and the strength of the mounting portion can be ensured. Also, if the annular top plate is installed as described above, the liquid outlet forming opening and the liquid outflow passage are in communication with each other, so that the plating solution can be discharged from the liquid outlet forming opening. Can do.

  Next, FIG. 3 shows a plan view of the annular mounting table used in this embodiment. As shown in this figure, the annular mounting table 21 is annular, and is formed of an overhanging part 21B and a main body part 21C. A liquid discharge hole 25 is formed in the overhang portion 21B over the entire circumference.

  The overhanging portion 21B preferably overhangs about 2-3 mm from the inner surface 22A of the seal packing 22 of the mounting portion 20 toward the center of the plating tank. If it is longer than 3 mm, the flow of the plating solution is blocked by the overhanging portion, and the flow of the plating solution becomes uneven, which may affect the plating properties. If it is shorter than 2 mm, it is difficult to process the overhanging portion. Because it becomes.

  The interval between the liquid discharge holes 25 is an interval at which the angle between the center of the annular mounting table 21 and the line segment L (see FIG. 4) obtained by connecting each liquid outflow hole becomes 3 °. Further, as shown in FIG. 4, the shape of the liquid discharge hole 25 is a truncated cone shape having a downward slope toward the outer circumferential direction of the annular mounting table 21.

  Next, in the plating apparatus according to the present embodiment, the flow of the plating solution in the minute corner portion when the above-described mounting table is used will be described with reference to FIG. In the plating apparatus according to this embodiment, the plating solution supplied toward the plating target surface Ws of the plating target W has a flow F that spreads from the vicinity of the center of the plating target surface Ws to the peripheral direction. And in the peripheral part of to-be-plated surface Ws, the flow of a plating solution is flowing toward the liquid outflow port, without staying.

  The flow F of the plating solution generates a suction force f in the vicinity of the liquid discharge hole 25 provided in the annular mounting table overhanging portion 21B. Therefore, the plating solution in the small corner portion S <b> 2 is pulled by the suction force f to form a flow from the liquid discharge hole 25 toward the liquid outlet 30. Moreover, in the plating apparatus of this embodiment, the downward flow toward the outer peripheral direction of the annular mounting base 21 through the liquid discharge hole 25 provided in the protruding part of the annular mounting base 21, that is, the plating flow staying in the small corner portion S2 is generated. Since the plating solution is formed so as to go to the liquid outlet 30, the plating solution staying in this portion is discharged to the outside together with the flow F of the plating solution after passing through the solution discharge hole 25.

  In other words, in the plating apparatus using the annular mounting table, the liquid discharge hole formed in the overhanging portion provided on the annular mounting table makes it possible to prevent the plating liquid flow from staying in the minute corner portion. In this case, a more uniform plating process can be performed.

  Next, in the plating apparatus of the first embodiment, the results of conducting a plating process effective area survey when a wafer is plated as a plating object will be described. The effective area of the plating treatment was investigated by Au plating on the entire plated surface of the Au seeded wafer in which the Au metal seed was applied to the plated surface. The wafer used for this investigation has a diameter of 200 mm, and the surface to be plated of the wafer has a diameter of 190 mm. The plating solution used was a non-cyan Au plating solution (trade name: Microfab Au: manufactured by Nippon Electroplating Engineering Co., Ltd.). For comparison, the conventional jet plating apparatus (FIG. 8) and the plating apparatus disclosed in Patent Document 1 (FIG. 10) were also subjected to plating treatment under the same conditions.

  When the wafer is plated by a conventional jet plating apparatus (FIG. 8), the plating thickness tends to be thin at a portion about 15 to 20 mm from the periphery of the surface to be plated. And in the part from the to-be-plated surface periphery to 10 mm inside, it becomes a non-uniform plating property by the influence of an air retention. In the above case, the non-uniform portion of the plating property occupies about 25% of the entire surface to be plated Ws of the plating object W, and an effective chip cannot be obtained at this portion.

  Moreover, when the said wafer was plated in the plating apparatus (FIG. 10) of patent document 1, there existed a tendency for plating thickness to become thin in the part inside about 3-5 mm from the to-be-plated surface periphery. And in the part from the to-be-plated surface periphery to 2 mm inside, it became non-uniform plating property due to the influence of air retention or the stop of the flow of plating solution. In this case, the uneven portion of the plating property occupies about 3% of the entire surface to be plated Ws of the plating object W, which is better than the conventional jet plating apparatus, but is still effective in this portion. Unable to get a chip.

  On the other hand, when the wafer was plated in the plating apparatus of the first embodiment, the plating thickness was uniform over the entire surface to be plated, and no stagnation of air was observed at the periphery of the surface to be plated. As a result, when the wafer is plated by the plating apparatus of the first embodiment, effective chips can be acquired at the peripheral portion of the surface to be plated, which is impossible to acquire effective chips with the plating apparatus of Patent Document 1. It became.

  The liquid discharge hole is not limited to that described in the present embodiment. For example, as shown in FIG. 5, it may be formed along these surfaces from the inner surface of the annular mounting table toward the lower surface of the annular mounting table. In FIG. 6, the plating solution is applied to the inner surface of the annular mounting table or the seal packing. What formed the hole which can discharge outside may be used.

Second Embodiment : This second embodiment is the plating apparatus of the first embodiment, wherein the liquid supply pipe is formed in a state of protruding from the bottom surface of the plating tank, and further the lower part of the inner surface of the annular mounting table from the upper part of the liquid supply pipe It is the type of plating apparatus provided with the partition arrange | positioned in the shape of a mortar toward. In addition, in FIG. 7 explaining this 2nd embodiment, the same code | symbol is attached | subjected to the member which has the same structure as the plating apparatus of said 1st embodiment.

  An annular top plate 60 is disposed along the upper opening of the plating tank 10, and the mounting portion 20 is disposed thereon. Then, the plating object W is placed on the placement unit 20, and a plating process is performed on the surface to be plated Ws of the plating object W. The liquid outlet 30, the anode electrode 50, and the plating method of the plating object W are the same as those in the first embodiment, and therefore the details are omitted.

  The liquid supply pipe 40 is formed at the center position of the plating tank 10. Further, the liquid discharge port 40A of the liquid supply pipe 40 is formed to be 20 mm below the surface to be plated Ws. The liquid supply pipe 40 is adjusted so as to supply the plating solution into the plating tank 10 at 1 L / min to 20 L / min.

  Further, the diaphragm 70 is arranged in a mortar shape from the upper part of the liquid supply pipe 40 toward the lower inner surface of the annular mounting table 21, and is joined to the lower inner surface of the annular mounting table 21. By the arrangement of the diaphragm 70, the inside of the plating tank 10 is partitioned into a cathode side and an anode side. On the anode side, a gas discharge port (not shown) is provided for extracting air generated from the anode electrode 50 and gathering in the vicinity of the diaphragm 70.

  When plating was performed using the plating apparatus of the second embodiment, air and anode sludge generated from the anode could be blocked by the diaphragm 70. As a result, it was possible to prevent air generated from the anode and anode sludge from entering the cathode side, and it was confirmed that the plating property on the surface to be plated of the object to be plated became more uniform.

Schematic sectional view of the mounting portion in the plating apparatus of the first embodiment Schematic sectional view of the mounting portion in the plating apparatus of the first embodiment The top view of the annular mounting base used for the plating apparatus of a first embodiment Detailed view of the liquid discharge hole of the annular mounting table Example 1 of liquid discharge hole Example 2 of liquid discharge hole Schematic sectional view in the plating apparatus of the second embodiment Schematic cross-sectional view of conventional jet plating equipment Schematic sectional view of the mounting part in the conventional jet plating apparatus Plating apparatus schematic cross-sectional view of Patent Document 1 Schematic cross-sectional view of the mounting portion in the plating apparatus of Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plating apparatus 10 Plating tank 20 Mounting part 21 Annular mounting base 21A Annular mounting base inner surface 21B Annular mounting base projecting part 21C Annular mounting base main body 22 Seal packing 22A Seal packing inner surface 23 Cathode electrode 24 Top ring 30 Liquid flow Exit 40 Liquid supply pipe 50 Anode electrode 60 Annular top plate 61 Flange 62 Reinforcement plate 70 Diaphragm F Flow of plating solution P Pressing means S1 Corner portion S2 Small corner portion W Plated object Ws Plated surface f Suction force

Claims (3)

At the upper opening edge of the plating tank, an annular mounting table provided so as to protrude inward from the inner wall surface of the plating tank, a mounting part having a seal packing disposed on the upper part of the annular mounting table, and a bottom part of the plating tank A liquid supply pipe provided, and a liquid outlet provided at a position below the mounting portion,
Plating is performed by forming a flow that flows from the liquid outlet to the outside of the plating tank in the plating liquid supplied in an upward flow from the liquid supply pipe, and bringing the plating liquid into contact with the entire surface to be plated of the object to be plated. In the device
The mounting part is provided with an annular mounting table having an overhanging part formed so as to protrude from the inner surface of the seal packing toward the center of the plating tank and project inward from the inner wall of the plating tank,
The overhanging part is provided with a liquid discharge hole ,
The liquid discharge hole has a downward slope toward the outer periphery of the annular mounting table, and is formed in a plurality so as to be radial from the center of the plating tank, and is formed by the surface to be plated and the inner peripheral surface of the mounting portion. The plating solution staying in the minute corner is discharged to the outside .
Furthermore, an annular top plate having a flange having an inner surface formed so as to coincide with the inner wall surface of the plating tank, and a plurality of reinforcing plates formed on the flange inner surface to support the annular mounting table is provided. ,
The top plate is sandwiched between the placing portion and the plating tank upper opening edge, and the lower surface of the overhanging portion is in contact with the reinforcing plate . The plating apparatus according to claim 1, wherein the liquid supply pipe is capable of adjusting a flow rate so as to supply a plating solution at 1 L / min to 20 L / min. The mounting part is provided with a cathode electrode, an anode electrode is provided in the plating tank, and a partition wall is provided for partitioning the inside of the plating tank into a cathode side and an anode side,
The said partition is a plating apparatus of Claim 1 or Claim 2 arrange | positioned in the shape of a mortar from the upper part of a liquid supply pipe toward the lower part of an annular mounting base.

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