JP4559269B2 - Electronic component mounting device - Google Patents

Description

  In the present invention, a beam is provided so as to be movable in one direction, and a mounting head provided with a suction nozzle is provided so as to be movable along the beam. The present invention relates to an electronic component mounting apparatus that mounts an electronic component held by the suction nozzle on a printed board that is positioned and held by a substrate positioning unit. More specifically, the present invention relates to an electronic component mounting apparatus provided with a cutter device that holds a storage tape after taking out an electronic component from each component supply unit and cuts it while moving in the direction in which the component supply units are arranged.

A mounting head equipped with a suction nozzle is provided so that the beam can be moved in one direction, and a mounting head provided with the suction nozzle can be moved along the beam. An electronic component mounting apparatus that mounts an electronic component held by the suction nozzle on a printed circuit board that is positioned and held by the board positioning unit is disclosed in, for example, Japanese Patent Application Laid-Open No. 2002-299892. It is known that the storage tape after the electronic component is taken out from the electronic component mounting apparatus is cut by a cutting device. And the technique which provides the cutter apparatus which moves to the parallel arrangement direction of the said component supply unit and cut | disconnects, holding the storage tape after taking out the electronic component from each component supply unit is also proposed (refer patent document 1). ).
JP 2004-342634 A

  However, each belt stretched between pulleys provided at both ends of one shaft rotated by driving of a drive motor provided at one end and front and rear pulleys provided at the other end. Since the cutter unit is fixed to the structure, the cutter unit is moved in the direction in which the component supply units are arranged in parallel by driving the drive motor, so that the waste tape is scattered in many directions when the storage tape is cut. Due to this scattering, scrap tape enters each mechanism in the cutter unit, especially the rotary drive element part of the cutter, and the original function, i.e., the driven part does not drive, or the movement of the scrap tape becomes poor due to the resistance of the scrap tape. There was a problem that occurred.

  Then, even if this invention moves a cutter for a cutting | disconnection, it aims at preventing a waste tape from scattering in many directions at the time of a cutting | disconnection of a storage tape.

For this reason, the first invention provides a beam movably in one direction and a mounting head provided with a suction nozzle movably along the beam. In an electronic component mounting apparatus that mounts an electronic component held by the suction nozzle on a substrate that is positioned and held by the substrate positioning unit after the component is picked up by the suction nozzle, after the electronic component is removed from each component supply unit A cutter device is provided that includes a pair of holding portions that hold the storage tape and a pair of cutters that move and cut the storage tape held by the holding portion while rotating in the direction in which the component supply units are arranged. with, located between the respective support shaft of the pair of cutters, and the pair of cutters is provided in a direction along the direction of movement the mosquitoes Characterized in that a scattering prevention member for preventing scattering of debris tape cut by coater.

According to a second aspect of the present invention, a beam is movably provided in one direction and a mounting head provided with a suction nozzle is movably provided along the beam. In an electronic component mounting apparatus that mounts an electronic component held by the suction nozzle on a substrate that is positioned and held by the substrate positioning unit after being picked up by the suction nozzle, storage after taking out the electronic component from each component supply unit A cutter device is provided that includes a pair of holding units that hold the tape, and a pair of cutters that move and cut the storage tape held by the holding unit while rotating in the parallel arrangement direction of the component supply unit, setting the scattering prevention member for preventing scattering of the pair of scrap tape cutter is cut by the pair of cutter in a direction along the direction of movement The scattering prevention member includes a respective plate body provided opposite to both sides in a direction along the direction in which the pair of cutter movement, the longer than overlapping margin of spacing said pair of cutters of each plate formation It is characterized by that.

  According to a third invention, in the first or second invention, the scattering prevention member has an upper surface and a lower surface opened.

According to a fourth invention, in the first or second invention, the scattering prevention member is fixed to opposing side walls constituting a cutter body of the cutter device.

  Even if the cutter is moved for cutting, the present invention can prevent the waste tape from scattering in many directions when the storage tape is cut. For this reason, the cleaning work can be simplified, and the maintenance work can be improved.

  In FIG. 1, which is a plan view of the electronic component mounting apparatus 1, a component supply unit 3 as a component supply device that supplies various electronic components to the base 2 one by one at its component extraction position (component suction position) is attached and detached. A plurality of them are fixed in parallel. Two positioning parts 4 are provided between the opposing component supply unit 3 groups, and the printed circuit board P received from the upstream device is conveyed to the positioning part 4 via the conveyor 6, and the positioning part 4 is not shown in the figure. An electronic component is mounted on the printed circuit board P positioned by the positioning mechanism.

  The electronic component mounting apparatus 1 is provided with a pair of beams 5 that are long in the X direction on the left and right sides, and each beam 5 is driven by a linear motor (not shown) along the pair of left and right guides. The slider fixed to the beam 5 slides and individually moves in the Y direction above the printed circuit board P on the positioning unit 4 and the component extraction position (component suction position) of the component supply unit 3. The linear motor includes a pair of upper and lower stators fixed to the base 2 and a mover fixed to lower portions of mounting plates provided at both ends of the beam 5.

  Each beam 5 is provided with a mounting head 7 that moves along the guide in the longitudinal direction, that is, the X direction by a linear motor. The linear motor includes a pair of front and rear stators fixed to the beam 5 and a movable element provided on the mounting head 7. Each mounting head 7 is provided with twelve suction nozzles (not shown) urged upward by springs at predetermined intervals on the periphery. The suction nozzle is provided on the mounting head 7 so as to be rotatable in the θ direction by each θ-axis drive motor and to be vertically movable by each vertical-axis drive motor. Each mounting head 7 is provided with a substrate recognition camera 8.

  Reference numeral 9 denotes a component recognition camera, and a total of four component recognition cameras are provided corresponding to each of the mounting heads 7, and how much the electronic component is displaced and held with respect to the suction nozzle in the XY direction and the rotation angle. In order to recognize the position, all the electronic components sucked and held by the plurality of suction nozzles are collectively imaged.

  Reference numeral 10 denotes a cutter device for cutting each storage tape T after the electronic component is taken out. The cutter device is provided corresponding to the component supply unit 3 group, and will be described in detail below with reference to FIGS. First, reference numeral 11 denotes a drive motor capable of forward and reverse rotation. A timing belt 16 is stretched between a pulley 13 provided on an output shaft 12 of the drive motor 11 and a pulley 15 provided on a front end portion of a driven shaft 14. Has been. Pulleys 19A and 19B are provided on the driven shaft 14 outside the main body front side walls 17A and 17a and main body rear side walls 17B and 17b at the left end of the rectangular cutter body 17 in plan view. Pulleys 20A and 20B are provided on driven shafts 18A and 18B supported outside the front and rear side walls 17A and 17B. Timing belts 21A and 21B are provided between the pair of pulleys 19A and 19B and the pair of pulleys 20A and 20B, respectively. And the cutter units 23A and 23B are fixed to the belts 21A and 21B, respectively. A pulley 19 </ b> A is provided on the rear side of the pulley 15 provided on the driven shaft 14.

  Accordingly, since the pulleys 19A, 19B, 20A, 20B and the timing belts 21A, 21B are disposed outside the front and rear side walls 17A, 17B of the cutter body 17, the storage tape T after the electronic components are taken out is cut. It is possible to prevent the cut waste tape from entering between the pulleys 19A, 20A and the timing belt 21A for moving the cutter units 23A, 23B for the purpose, or between the pulleys 19B, 20B and the timing belt 21B. it can. As a result, it is possible to avoid the deviation between the cutter unit 23A and the cutter unit 23B due to the stoppage of the movement of either the timing belt 21A or 21B caused by the waste tape entering, and the cutting of the storage tape can be reliably continued. .

  The cutter body 17 includes front and rear side walls 17A, 17a, 17B, and 17b, left and right side walls 17C and 17D, and a bottom wall 17E provided at the left and right end portions. The bottom wall 17E is formed by the cutter units 23A and 23B. However, it is necessary because only the side wall having a rectangular shape in a plan view is not sufficient in terms of strength. However, if it is provided over the entire bottom surface, the waste tape cannot be dropped, so it is provided only at the left and right ends. In FIG. 2, a bottom wall 17E is provided from the right end of the unit body 17 to the position indicated by the broken line 17G and from the left end to the position indicated by the broken line 17G.

  Then, when the drive motor 11 rotates forward and backward, the driven shaft 14 rotates via the timing belt 16 between the pulley 13 and the pulley 15, and the timing belt 21A between the pulleys 19A and 19B and the pulleys 20A and 20B. , 21B also rotate, and the cutter units 23A, 23B, whose upper ends are fixed to the timing belts 21A, 21B, reciprocate left and right. At this time, a holding member 25 is provided between the left and right side walls 17C and 17D of the cutter body 17, and the cutter units 23A and 23B move while holding the storage tape from which the electronic components of the component supply units 3 are taken out. Will be. Hereinafter, the cutter units 23A and 23B and the holding member 25 will be described in detail.

  First, the holding member 25 is opposed to a support portion 25A fixed to the left and right side walls 17C and 17D of the cutter body 17, and one end portion is rotatably connected to the support portion 25A via a support shaft. It consists of a pair of left and right elastic portions 25C that have a slightly concave shape in the direction and are urged to open outward by a coil spring 25B, and a holding portion 25D that connects the left and right elastic portions 25C. The holding portion 25D includes an outer frame body 25D1 having a U-shaped cross section and an elastic body 25D2 made of a synthetic resin material having elasticity embedded in the outer frame body 25D1.

  The cutter units 23A and 23B are fitted into unit main bodies 24A and 24B, fixing portions 26A and 26B fixed by sandwiching the timing belts 21A and 21B, and guides 33A and 33B provided in the cutter main body 17. Sliders 27A, 27B, generally cylindrical sandwiching portions 29A, 29B that are rotatably supported via bearings 32A, 32B around support shafts 28A, 28B provided on the unit main bodies 24A, 24B. It comprises thin plate donut-shaped cutters 30A and 30B fixed to the lower portions of the portions 29A and 29B.

  When the cutter units 23A and 23B are at either one of the left and right end positions of the cutter device 10, the clamping portions 29A and 29B of the cutter units 23A and 23B press the elastic portions 25C of the holding member 25 from the outside. However, when the timing belts 21A and 21B are rotated by the drive motor 11 and the cutter units 23A and 23B are moved to the left and right along the guides 33A and 33B, the holding portions 29A and 29B are moved. Is in contact with the outer frame body 25D1 of each holding part 25D from the state in contact with each elastic part 25C and presses the elastic bodies 25D2 of each holding part 25D from the outside, so that each clamping part 29A, 29B and cutters 30A, 30B Moves while rotating in opposite directions with the support shafts 28A and 28B as fulcrums.

  Next, the scattering prevention device 40 that prevents the scrap tape cut by the cutters 30A and 30B from being scattered along the moving direction of the cutter units 23A and 23B will be described with reference to FIGS. The scattering prevention device 40 is roughly composed of a scattering prevention cylinder 41 and a fixed body 42 that fixes and holds the cylinder 41.

  As shown in FIG. 6, the scattering prevention cylinder 41 is configured by movably fitting U-shaped plates 41 </ b> A and 41 </ b> B in a plan view, and holding portions 46 and 46 of a fixed body 42 to be described later. The plate bodies 41A and 41B are fixed to the side surfaces by welding. Accordingly, although the plate bodies 41A and 41B having the interval A have a rectangular tube shape with the upper and lower surfaces opened, both are movable, and when the cutter units 23A and 23B are at the left and right ends, the interval A The storage tape after the electronic parts are taken out can be easily guided into the scattering prevention cylinder 41. When the cutter units 23A and 23B move for cutting the storage tape, the interval A is It narrows and becomes easy to cut. In addition, the storage unit is cut by moving the cutter units 23A and 23B to the left and right, but the left and right direction is such that the waste tape cut at the left and right moving ends of the cutters 30A and 30B can also be guided to the inside thereof ( And the length in the front-rear direction is longer than the overlap of the cutters 30A and 30B. The scattering prevention cylinder 41 may have a lower opening that is appropriately smaller than the upper opening, and may have a funnel shape with an extremely reduced lower opening.

  Next, the fixed body 42 provided below the holding member 25 will be described. The fixed body 42 includes support portions 43 and 43 fixed to the left and right side walls 17C and 17D of the cutter body 17, and the support portions 43 and 43, respectively. A pair of left and right support portions 45 each having one end portion rotatably connected to the shaft 43 via a support shaft and having a slightly recessed shape in the opposite direction and biased to open outward by coil springs 44 and 44. , 45 and holding parts 46, 46 for connecting the left and right support parts 45, 45. The holding portions 46 and 46 have a U-shaped cross section, and the opening side end portions are fixed to the side surfaces of the scattering prevention cylindrical body 41 by welding. That is, the holding portions 46 and 46 are fixed to the side surfaces of the plate bodies 41A and 41B of the scattering prevention cylindrical body 41, respectively. As a result, the holding portions 46 and 46, the support portions 45 and 45, and the support portions 43 and 43 are used to The scattering prevention cylinder 41 is fixed to the left and right side walls 17C, 17D of the cutter body 17.

  Also, a bearing 47 that can rotate around the support shafts 28A and 28B provided on the unit main bodies 24A and 24B is pressed against the side surface of the fixed body 42, and as the cutter units 23A and 23B move, 47 slides while pressing the side surface of the fixed body 42.

  In FIG. 5, reference numeral 31 denotes a guide member for guiding the storage tape T after the electronic component is taken out between the pair of holding portions 25D. The lateral width of the guide member 31 is substantially the entire area of the component supply units 3 arranged side by side. The upper frame and the lower surface of the holding frame 25 </ b> D <b> 1 of the holding part 25 </ b> D at one position below the surface of the rectangular tube form a guide member 31. A guide 34 is provided for positioning the storage tape T between the holding portions 25D.

  With the above configuration, the electronic component mounting operation will be described below. First, the printed circuit board P is carried into the positioning unit 4 on the left side from an upstream device (not shown), and the positioning operation is started by the positioning mechanism.

  Then, one of the mounting heads 7 before and after the left and right mounting heads 7 moves above each printed circuit board P, and the substrate recognition camera 8 images the positioning mark attached to each printed circuit board P, and the recognition processing device (Not shown) recognizes the position of each printed circuit board P. After this imaging, the electronic component mounting is performed according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the storage device (not shown), the rotation angle position around the vertical axis, the arrangement number, etc. are designated. Electronic components to be mounted by the suction nozzles of the mounting heads 7 positioned on the left side of the apparatus 1 are sucked and taken out from the opposing component supply unit 3 group. Specifically, the suction nozzle of each mounting head 7 positioned on the left side of the electronic component mounting apparatus 1 moves so as to be positioned above each component supply unit 3 that stores the electronic component to be mounted, but the Y direction is linear. The motor is driven to move each beam 5 along a pair of guides. Similarly, in the X direction, the linear motor is driven to move each mounting head 7 along the guides.

  Since each of the predetermined supply units 3 has already been driven and the components can be taken out at the component suction position, the suction nozzle is lowered by a predetermined stroke by driving the vertical axis drive motor, and the electronic components from the component supply unit 3 are The part is adsorbed and rises further.

  Then, as described above, the mounting head 7 is moved in the X and Y directions, and is moved above the component recognition camera 9 to pick up and hold the picked-up electronic component and capture the image, and the recognition processing device recognizes the component. Start processing. Based on the recognition processing result of the electronic component to be mounted and the position recognition processing result of the printed circuit board P, the control device (not shown) controls each linear motor and θ-axis drive motor to correct XYθ, and The suction nozzle is lowered by a predetermined stroke by driving the drive motor, and the electronic component is mounted on the printed board P.

  When all predetermined electronic components are mounted on the printed circuit board P, the printed circuit board P between the positioning parts 4 and 4 is moved to the right positioning part 4 and the left positioning part 4 is moved. The printed circuit board P is moved between the positioning portions 4 and 4 and is moved from the upstream side to the left positioning portion 4. Thereafter, the electronic components to be mounted by the suction nozzles of the mounting heads 7 located on the left part of the electronic component mounting apparatus 1 are picked up and taken out from the opposing component supply unit 3 group, and the printed circuit board in the positioning unit 4 on the left side. The electronic components to be mounted by the suction nozzles of the mounting heads 7 mounted on P and located on the right side of the electronic component mounting apparatus 1 are picked up from the opposing component supply unit 3 group and taken out to the positioning unit 4 on the right side. It is mounted on a certain printed circuit board P. Hereinafter, electronic components are similarly mounted on each printed circuit board P.

  And not only this at the time of board | substrate conveyance to the downstream after completion | finish of mounting | wearing operation | movement of all the electronic components to the printed circuit board P, but not limited to this, Arbitrary component supply units in predetermined component supply unit 3 groups After the feeding operation of the third storage tape T is completed and before the feeding operation of an arbitrary next electronic component is started, the cutter device 10 corresponding to the component supply unit 3 group is operated to supply the component. Each storage tape T after the electronic parts of the unit 3 group are taken out is cut. Hereinafter, this cutting operation will be described in detail.

  That is, when the cutter units 23A and 23B are at the left and right end positions of the cutter device 10, the clamping portions 29A and 29B of the cutter units 23A and 23B resist the elastic portions 25C of the holding member 25 against the urging force of the coil spring 25B. However, since the output shaft 12 is rotated by driving the drive motor 11 and the driven shaft 14 is rotated via the timing belt 16, the timing belts 21A and 21B are When each cutter unit 23A, 23B rotates and moves to the left along the guides 33A, 33B, the outer frame body of each holding portion 25D from the state where each clamping portion 29A, 29B is in contact with each elastic portion 25C. The holding portions 29A and 29B are opposite to each other while pressing the elastic portions 25B of the holding portions 25D from the outside in contact with 25D1. Since pivots direction, and cutting the cutter 30A, 30B also housed tape T after the electronic component pickup held in each holding portion 25D moves while rotating in opposite directions.

  Therefore, in a state where the cutter units 23A and 23B are not moved, the storage tape T after taking out the electronic components from each component supply unit 3 is guided between the pair of holding portions 25D by the guide member 31, and the cutter unit 23A. , 23B is moved while holding the storage tape T by each holding portion 25D, and the cutters 30A, 30B rotating while moving are surely cutting the storage tape T. The cutter units 23A and 23B move from one of the left and right ends to the other end for cutting the storage tape T, and then stop.

  Further, when the cutter units 23A, 23B move to either the left or right end for cutting the storage tape T, a bearing 47 that can rotate around the support shafts 28A, 28B is a holding portion for the fixed body 42. 46, 46 is moved while sliding, and the holding portions 46, 46 are pressed so as to be close to each other. Therefore, the interval A between the plate bodies 41A, 41B is narrowed, and the scattering prevention cylinder 41 is provided with an opening on the upper surface. The guided storage tape is cut into the cutters 30A and 30B, and the scrap tape is prevented from being scattered by the plate bodies 41A and 41B of the scattering prevention cylindrical body 41, but through the opening 17F where the bottom wall 17E is not formed. It surely falls down.

  Therefore, when the storage tape is cut, the waste tape scatters and enters each mechanism in the cutter unit, especially the rotary drive element portion of the cutter, and the original function, that is, the driven portion does not drive or moves due to the resistance of the waste tape. It is possible to solve the problem of occurrence of problems such as worsening.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a front view of a cutter apparatus. It is a partial top view in the middle of the movement of the cutter unit of a cutter apparatus. It is a partial top view in the middle of the movement of the cutter unit of a cutter apparatus. It is a vertical right side view of a cutter device. It is a perspective view of a scattering prevention cylinder.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply unit 5 Beam 7 Mounting head 10 Cutter apparatus 11 Drive motor 17 Cutter main body 23A, 23B Cutter unit 25 Holding member 25D Holding part 30A, 30B Cutter 40 Scatter prevention apparatus 41 Scatter prevention cylinder body 42 Fixed body

Claims (4)

A mounting head equipped with a suction nozzle is provided so that the beam can be moved in one direction, and a mounting head provided with the suction nozzle can be moved along the beam. In the electronic component mounting apparatus for mounting the electronic component held by the suction nozzle on the substrate positioned and held by the substrate positioning unit, a pair of holding the storage tape after taking out the electronic component from each component supply unit A cutter device is provided that includes a holding unit and a pair of cutters that move while rotating the storage tape held by the holding unit in the direction in which the component supply units are arranged, and each of the pair of cutters. located between the support shaft, and the pair of cutters is cut by the cutter is provided in a direction along the direction of movement An electronic component mounting apparatus characterized in that a scattering prevention member for preventing scattering of the tape. A mounting head equipped with a suction nozzle is provided so that the beam can be moved in one direction, and a mounting head provided with the suction nozzle can be moved along the beam. In the electronic component mounting apparatus for mounting the electronic component held by the suction nozzle on the substrate positioned and held by the substrate positioning unit, a pair of holding the storage tape after taking out the electronic component from each component supply unit A cutter device is provided that includes a holding portion and a pair of cutters that move while cutting the storage tape held by the holding portion while rotating in the direction in which the component supply units are arranged, and the pair of cutters moves. the scattering prevention member for preventing the scattering of cut debris tape by the pair of cutter in a direction along the direction of providing, the scatter-proof Member, wherein the pair of cutters comprises a respective plate body provided opposite to both sides of the direction along the direction of movement, described above form a spacing between the plate body longer than the overlapping margin of the pair of cutters Electronic component mounting device.   The electronic component mounting apparatus according to claim 1, wherein an upper surface and a lower surface of the scattering prevention member are opened.   The electronic component mounting apparatus according to claim 1, wherein the scattering prevention member is fixed to opposed side walls constituting a cutter body of the cutter apparatus.

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