JP4556910B2 - Double-sided copper-clad laminate - Google Patents

Double-sided copper-clad laminate Download PDF

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JP4556910B2
JP4556910B2 JP2006121325A JP2006121325A JP4556910B2 JP 4556910 B2 JP4556910 B2 JP 4556910B2 JP 2006121325 A JP2006121325 A JP 2006121325A JP 2006121325 A JP2006121325 A JP 2006121325A JP 4556910 B2 JP4556910 B2 JP 4556910B2
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double
clad laminate
copper
sided copper
copper foil
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JP2007216662A (en
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昌二 橋本
清孝 古森
恭文 福本
充修 西野
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Panasonic Corp
Panasonic Electric Works Co Ltd
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Panasonic Corp
Matsushita Electric Works Ltd
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Description

本発明は、プリント配線板を製造するために用いられる両面銅張積層板に関するものである。   The present invention relates to a double-sided copper-clad laminate used for manufacturing a printed wiring board.

現在、両面銅張積層板に使用される銅箔への要求品質は多様化している。例えば、信号層として用いる銅箔には、伝送損失の点から銅箔表面の粗度が小さいものを用いることが要求される。   Currently, the required quality of copper foil used for double-sided copper-clad laminates is diversifying. For example, the copper foil used as the signal layer is required to have a copper foil surface with a small roughness in terms of transmission loss.

ここで、上記のような表面粗度が小さい銅箔は、特殊な管理のもとで製造する必要があるために一般的に価格が高く、このような特殊な銅箔は特殊な特性を必要とする部分にだけ使用したいという要求がある。そのため、表裏で異なる種類の銅箔を使用した両面銅張積層板を用いることが増えつつある（例えば、特許文献１等参照）。
特開２００５−１５３２９８号公報 Here, copper foil with a low surface roughness as described above is generally expensive because it needs to be manufactured under special management, and such special copper foil requires special characteristics. There is a request to use it only for the part. Therefore, the use of double-sided copper clad laminates using different types of copper foils on the front and back sides is increasing (see, for example, Patent Document 1).
JP 2005-153298 A

しかしながら、表裏で異なる種類の銅箔を用いた両面銅張積層板を取り扱う場合において、表面及び裏面の識別ができなくなり、その結果、表裏の銅箔の種類が識別できなくなるという問題があった。   However, when handling a double-sided copper-clad laminate using different types of copper foils on the front and back sides, the front and back surfaces cannot be identified, and as a result, the type of front and back copper foils cannot be identified.

ここで、表裏の銅箔の厚みが異なる場合には、従来抵抗チェッカー等の器具を用いて表裏の銅箔を識別する手法が一般的に用いられているが、この方法では、識別操作に時間を要することや、あるいは識別操作の際に銅箔表面に傷を付けてしまうリスクがあること等の問題点を有していた。   Here, when the thicknesses of the copper foils on the front and back sides are different, conventionally, a technique for identifying the copper foils on the front and back sides using a resistance checker or the like is generally used. Or the risk of scratching the surface of the copper foil during the identification operation.

さらに、表裏の銅箔の厚みが等しい場合においては、抵抗チェッカーを用いても識別が困難となり、商品としてラインナップできない場合があった。   Furthermore, when the thicknesses of the copper foils on the front and back sides are equal, it may be difficult to identify even if a resistance checker is used, and the product may not be lined up.

本発明は、かかる事由に鑑みてなしたもので、その目的とするところは、表裏を簡便に識別することができる両面銅張積層板を提供することにある。   This invention is made | formed in view of this reason, The place made into the objective is to provide the double-sided copper clad laminated board which can identify front and back simply.

上記課題を解決するために本発明の請求項１に係る両面銅張積層板においては、絶縁層の表面及び裏面に銅箔が配設されてなる両面銅張積層板であって、前記銅箔は表面にスジが形成されてなるものであり、前記銅箔に形成されたスジの方向の差異により、両面銅張積層板の表面と裏面とを識別可能としたものであることを特徴とする。   In order to solve the above problems, a double-sided copper-clad laminate according to claim 1 of the present invention is a double-sided copper-clad laminate in which copper foil is disposed on the front and back surfaces of an insulating layer, and the copper foil Is formed by forming streaks on the surface, and the front and back surfaces of the double-sided copper-clad laminate can be identified by the difference in the direction of the streaks formed on the copper foil. .

請求項２に係る両面銅張積層板においては、前記両面銅張積層板は縦と横の寸法が異なるものであり、該両面銅張積層板の４辺のうちある１辺を基準として、表面側から見た場合と裏面側から見た場合とで、前記スジの方向が異なるように表面及び裏面の銅箔が配設されていることを特徴とする。   In the double-sided copper-clad laminate according to claim 2, the double-sided copper-clad laminate has different vertical and horizontal dimensions, and the surface is based on one side of the four sides of the double-sided copper-clad laminate. The front and back copper foils are arranged so that the direction of the streaks is different between when viewed from the side and when viewed from the back side.

請求項３に係る両面銅張積層板においては、縦と横の寸法差が１〜５ｍｍであることを特徴とする。   The double-sided copper-clad laminate according to claim 3 is characterized in that a vertical and horizontal dimensional difference is 1 to 5 mm.

請求項４に係る両面銅張積層板においては、前記両面銅張積層板は縦と横の寸法が等しいものであり、該両面銅張積層板の４辺のうちいずれの辺を基準としても、表面側から見た場合と裏面側から見た場合とで、前記スジの方向が異なるように表面及び裏面の銅箔が配設されていることを特徴とする。   In the double-sided copper-clad laminate according to claim 4, the double-sided copper-clad laminate has the same vertical and horizontal dimensions, and any one of the four sides of the double-sided copper-clad laminate can be used as a reference. Copper foils on the front surface and the back surface are arranged so that the direction of the streak is different between when viewed from the front surface side and when viewed from the back surface side.

請求項５に係る両面銅張積層板においては、前記絶縁層の表面と裏面の銅箔の厚みが等しいことを特徴とする。 The double-sided copper clad laminate according to claim 5 is characterized in that the copper foils on the front surface and the back surface of the insulating layer have the same thickness.

上記本発明に係る両面銅張積層板によると、銅箔表面のスジの方向によって表裏を識別することができるので、識別操作に多大な時間を要することなく簡便に表裏を識別することが可能となる。また、識別操作の際に銅箔表面に傷を付けてしまうリスクを低減することができる。 According to the double-sided copper-clad laminate according to the present invention, it is possible to identify the front and back by the direction of the stripes of the copper foil surface, it is possible to identify easily sides without requiring a lot of time identification operation It becomes. Moreover, the risk of scratching the copper foil surface during the identification operation can be reduced.

以下、本発明を実施するための最良の形態を説明する。   Hereinafter, the best mode for carrying out the present invention will be described.

両面銅張積層板１は、図４に示すように、樹脂からなる絶縁層２と、絶縁層２の表面及び裏面にそれぞれ銅箔３，４を配設し、これらを加熱加圧して積層一体化して形成されている。   As shown in FIG. 4, the double-sided copper-clad laminate 1 has an insulating layer 2 made of resin, and copper foils 3 and 4 are disposed on the front and back surfaces of the insulating layer 2, respectively, and these are heated and pressed to be laminated and integrated. Formed.

絶縁層２を形成するための樹脂としては、特に限定されるものではないが、例えば、エポキシ樹脂、ポリイミド樹脂、ポリブタジエン樹脂等の熱硬化性樹脂を用いることができる。また、ガラスクロスやアラミド繊維等の無機基材や有機基材に上記樹脂を含浸させたプリプレグを用いることもできる。   Although it does not specifically limit as resin for forming the insulating layer 2, For example, thermosetting resins, such as an epoxy resin, a polyimide resin, a polybutadiene resin, can be used. Moreover, the prepreg which impregnated the said resin to inorganic base materials, such as glass cloth and an aramid fiber, and organic base materials can also be used.

ここで、銅箔３と銅箔４の厚みはそれぞれ３５μｍと等しく、表面粗度については銅箔３がＲｚ＝２μｍ、銅箔４がＲｚ＝８μｍであり、絶縁層２の表面と裏面で粗度が異なる銅箔３，４を用いている。また絶縁層２の厚みは０．１ｍｍである。   Here, the thickness of each of the copper foil 3 and the copper foil 4 is equal to 35 μm, and the surface roughness is Rz = 2 μm for the copper foil 3 and Rz = 8 μm for the copper foil 4. Copper foils 3 and 4 having different degrees are used. The thickness of the insulating layer 2 is 0.1 mm.

本発明の第１の実施形態における両面銅張積層板１は、図１に示すように、平面視したときに縦と横の寸法が異なる矩形であり、両面銅張積層板１の４辺、すなわち縦辺２１と２２、横辺２３と２４において、縦辺２１と２２の方が横辺２３と２４よりも寸法が大きくなっている。   As shown in FIG. 1, the double-sided copper-clad laminate 1 in the first embodiment of the present invention has a rectangular shape with different vertical and horizontal dimensions when viewed in plan, That is, in the vertical sides 21 and 22 and the horizontal sides 23 and 24, the vertical sides 21 and 22 are larger in size than the horizontal sides 23 and 24.

銅箔３及び銅箔４の表面には、スジ１０及びスジ１１がそれぞれ形成されている。このスジ１０及びスジ１１は、銅箔を電解法で製造するにあたって、電解ドラムに析出させた銅箔を巻き取りロールで巻き取る際に、この巻取り方向と平行に形成されるものであり、電解銅箔では一般に形成されているものである。   Lines 10 and 11 are formed on the surfaces of the copper foil 3 and the copper foil 4, respectively. The stripe 10 and the stripe 11 are formed in parallel with the winding direction when the copper foil deposited on the electrolytic drum is wound with a winding roll when the copper foil is manufactured by an electrolytic method. The electrolytic copper foil is generally formed.

そして銅箔３は図１（ａ）に示すように、表面のスジ１０が横辺２３から横辺２４へ向かう方向、すなわち長辺側の縦辺２１，２２と平行になるように、絶縁層２の表面側に配設して積層されており、銅箔４は図１（ｂ）に示すように、表面のスジ１１が縦辺２１から縦辺２２へ向かう方向、すなわち短辺側の横辺２３，２４と平行になるように、絶縁層２の裏面側に配設して積層されている。   As shown in FIG. 1A, the copper foil 3 is an insulating layer so that the surface stripe 10 is parallel to the direction from the lateral side 23 to the lateral side 24, that is, the longitudinal sides 21 and 22 on the long side. As shown in FIG. 1B, the copper foil 4 is laminated in the direction in which the surface stripes 11 are directed from the vertical sides 21 to the vertical sides 22, that is, on the short side. The insulating layer 2 is disposed and laminated on the back surface side so as to be parallel to the sides 23 and 24.

このように絶縁層２の表面に配設される銅箔３と裏面に配設される銅箔４においてスジ１０，１１の方向が異なるようにすることによって、両面銅張積層板１を裏返えした際に、図１（ａ）（ｂ）のようにスジ１０，１１の方向が異なる方向で現れるので、このスジ１０，１１の方向の差異で表面側の銅箔３と裏面側の銅箔４とを識別することができるものであり、識別操作に多大な時間を要することなく簡便に表裏を識別することが可能になるものである。従って、抵抗チェッカーなどの器具を用いる必要なく表裏を識別することができ、識別操作の際に銅箔３，４の表面に傷を付けてしまうリスクを低減することができるものである。   In this way, the copper foil 3 disposed on the surface of the insulating layer 2 and the copper foil 4 disposed on the back surface are made different in the direction of the stripes 10 and 11 so that the double-sided copper clad laminate 1 is turned over. 1A and 1B, the directions of the stripes 10 and 11 appear in different directions. Therefore, the copper foil 3 on the front surface side and the copper foil on the back surface side due to the difference in the direction of the stripes 10 and 11 appear. 4 can be identified easily, and the front and back sides can be easily identified without requiring much time for the identification operation. Therefore, the front and back sides can be identified without the need to use an instrument such as a resistance checker, and the risk of scratching the surfaces of the copper foils 3 and 4 during the identification operation can be reduced.

特に、上記のように縦と横の寸法が異なる両面銅張積層板１の場合、両面銅張積層板を縦長あるいは横長になるように配置した状態で、両面銅張積層板１の４辺のうち１辺、縦辺２１と２２の一方の辺、あるいは横辺２３と２４の一方の辺を基準にして、この基準にした辺を中心にして両面銅張積層板１を裏返えした際に、表面側から見た場合と裏面側から見た場合とで、スジ１０，１１の方向が異なるように設定しておくことによって、表裏の識別が可能になるものである。従って図１（ａ）（ｂ）のように、銅箔３，４のうち一方を、そのスジ１０，１１が縦辺２１，２２と横辺２３，２４の一方と平行に、銅箔３，４のうち他方を、そのスジ１０，１１が縦辺２１，２２と横辺２３，２４の他方と平行になるように配設することによって、表裏を識別することができるようにすることができるものである。   In particular, in the case of the double-sided copper-clad laminate 1 having different vertical and horizontal dimensions as described above, the double-sided copper-clad laminate 1 has four sides of the double-sided copper-clad laminate 1 with the double-sided copper-clad laminate arranged vertically or horizontally. When one side, one side of the vertical sides 21 and 22 or one side of the horizontal sides 23 and 24 is used as a reference, the double-sided copper-clad laminate 1 is turned over with the reference side as the center. By setting the direction of the streaks 10 and 11 to be different between when viewed from the front side and when viewed from the back side, the front and back sides can be identified. Accordingly, as shown in FIGS. 1 (a) and 1 (b), one of the copper foils 3 and 4 is arranged such that the stripes 10 and 11 are parallel to one of the vertical sides 21 and 22 and the horizontal sides 23 and 24, respectively. By arranging the other of the four lines 10 and 11 so that the stripes 10 and 11 are parallel to the other of the vertical sides 21 and 22 and the horizontal sides 23 and 24, the front and the back can be identified. Is.

尚、両面銅張積層板１を加工してプリント配線板を作製する場合、一枚の両面銅張積層板１を複数に区画して複数枚取りでプリント配線板が作製されることが多い。そしてプリント配線板の寸法取りのロスを小さくするために両面銅張積層板１は正方形に近いほうが望ましい。そこで、両面銅張積層板１を縦と横の寸法が異なる矩形に形成して、上記のように表裏の識別が容易になるようにする場合、縦と横の寸法差は１〜５ｍｍの範囲に設定するのが好ましい。表裏の識別のためには縦横１ｍｍ以上の寸法差を付けることが必要であり、またロスを小さくするためには寸法差は５ｍｍ以下であることが必要である。   When a double-sided copper-clad laminate 1 is processed to produce a printed wiring board, a single-sided double-sided copper-clad laminate 1 is often divided into a plurality of pieces to produce a printed wiring board. The double-sided copper-clad laminate 1 is preferably close to a square in order to reduce the dimension loss of the printed wiring board. Therefore, when the double-sided copper-clad laminate 1 is formed into rectangles having different vertical and horizontal dimensions so that front and back can be easily identified as described above, the vertical and horizontal dimension difference is in the range of 1 to 5 mm. It is preferable to set to. In order to identify the front and back, it is necessary to provide a dimensional difference of 1 mm or more in the vertical and horizontal directions, and in order to reduce the loss, the dimensional difference needs to be 5 mm or less.

次に、本発明の第２の実施形態における両面銅張積層板１について説明する。ここでは、第１の実施形態と異なる点について主に説明する。   Next, the double-sided copper-clad laminate 1 in the second embodiment of the present invention will be described. Here, differences from the first embodiment will be mainly described.

本実施形態における両面銅張積層板１は、図２に示すように、平面視したときに縦と横の寸法が等しい正方形であり、両面銅張積層板１の４辺、すなわち縦辺２１と２２、横辺２３と２４の寸法がすべて等しいものである。   As shown in FIG. 2, the double-sided copper-clad laminate 1 in the present embodiment is a square having the same vertical and horizontal dimensions when viewed in plan, and the four sides of the double-sided copper-clad laminate 1, that is, the vertical side 21. 22, the dimensions of the horizontal sides 23 and 24 are all equal.

銅箔３及び銅箔４の表面には上記のようにスジ１０及び１１が形成されている。そして銅箔３は図２（ａ）に示すように、表面のスジ１０が横辺２３から横辺２４へ向かう方向、すなわち縦辺２１，２２と平行になるように、絶縁層２の表面側に配設して積層されており、銅箔４は図２（ｂ）に示すように、表面のスジ１１が両面銅張積層板１の対角線と平行な斜め方向になるように、絶縁層２の裏面側に配設して積層されている。   As described above, the stripes 10 and 11 are formed on the surfaces of the copper foil 3 and the copper foil 4. As shown in FIG. 2A, the copper foil 3 is on the surface side of the insulating layer 2 so that the surface stripe 10 is parallel to the direction from the lateral side 23 to the lateral side 24, that is, the longitudinal sides 21 and 22. As shown in FIG. 2 (b), the copper foil 4 is laminated so that the surface streaks 11 are in an oblique direction parallel to the diagonal line of the double-sided copper-clad laminate 1. Are disposed and laminated on the back side.

このように絶縁層２の表面に配設される銅箔３と裏面に配設される銅箔４においてスジ１０，１１の方向が異なるようにすることによって、両面銅張積層板１を裏返えした際に、図２（ａ）（ｂ）のようにスジ１０，１１の方向が異なる方向で現れるので、このスジ１０，１１の方向の差異で表面側の銅箔３と裏面側の銅箔４とを識別することができるものであり、識別操作に多大な時間を要することなく簡便に表裏を識別することが可能になるものである。従って、抵抗チェッカーなどの器具を用いる必要なく表裏を識別することができ、識別操作の際に銅箔３，４の表面に傷を付けてしまうリスクを低減することができるものである。   In this way, the copper foil 3 disposed on the surface of the insulating layer 2 and the copper foil 4 disposed on the back surface are made different in the direction of the stripes 10 and 11 so that the double-sided copper clad laminate 1 is turned over. 2 (a) and 2 (b), the direction of the stripes 10 and 11 appears in different directions. Therefore, the copper foil 3 on the front surface side and the copper foil on the back surface side due to the difference in the direction of the stripes 10 and 11. 4 can be identified easily, and the front and back sides can be easily identified without requiring much time for the identification operation. Therefore, the front and back sides can be identified without the need to use an instrument such as a resistance checker, and the risk of scratching the surfaces of the copper foils 3 and 4 during the identification operation can be reduced.

ここで、上記のように縦と横の寸法が等しい両面銅張積層板１の場合、両面銅張積層板１は縦と横の区別を付けることができないので、両面銅張積層板１の４辺の全ての辺を基準にしても、この基準にした辺を中心にして両面銅張積層板１を裏返えした際に、表面側から見た場合と裏面側から見た場合とで、スジ１０，１１の方向が異なるように設定する必要がある。このため図２（ａ）（ｂ）のように、銅箔３，４のうち一方を、そのスジ１０，１１が縦辺２１，２２と横辺２３，２４の一方と平行になるように配置し、銅箔３，４のうち他方を、そのスジ１０，１１が縦辺２１，２２や横辺２３，２４に対して傾斜するように配設することによって、表裏を識別するようにしている。   Here, in the case of the double-sided copper-clad laminate 1 having the same vertical and horizontal dimensions as described above, the double-sided copper-clad laminate 1 cannot distinguish between the vertical and horizontal directions. Even if all sides of the side are used as a reference, when the double-sided copper-clad laminate 1 is turned over with the reference side as the center, the case where the side is viewed from the front side and the case from the back side is It is necessary to set so that the directions of 10 and 11 are different. Therefore, as shown in FIGS. 2A and 2B, one of the copper foils 3 and 4 is arranged so that the stripes 10 and 11 are parallel to one of the vertical sides 21 and 22 and the horizontal sides 23 and 24. Then, the other one of the copper foils 3 and 4 is arranged such that the stripes 10 and 11 are inclined with respect to the vertical sides 21 and 22 and the horizontal sides 23 and 24 so that the front and back sides are identified. .

尚、図２（ｂ）のように銅箔４のスジ１１を傾斜させる場合、傾斜角度が大きいと、絶縁層２に合わせて銅箔４をカットする際のカットロスが大きくなる。このため、図２（ｃ）のようにスジ１１の縦辺２１，２２や横辺２３，２４に対する傾斜角度θを小さくして（例えばθ＝１°）、カットロスが少なくなるようにするのが好ましい。   2B, when the stripe 11 of the copper foil 4 is inclined, if the inclination angle is large, the cut loss when the copper foil 4 is cut in accordance with the insulating layer 2 becomes large. Therefore, as shown in FIG. 2C, the inclination angle θ with respect to the vertical sides 21 and 22 and the horizontal sides 23 and 24 of the stripe 11 is reduced (for example, θ = 1 °) so that the cut loss is reduced. preferable.

次に、参考例である第３の実施形態における両面銅張積層板１について説明する。ここでは、第１及び第２の実施形態と異なる点について主に説明する。 Next, the double-sided copper-clad laminate 1 in the third embodiment which is a reference example will be described. Here, differences from the first and second embodiments will be mainly described.

銅箔３及び銅箔４は、両面のうち一方の片面がシャイニング面１３、他方の片面がマット面１４に形成されている。銅箔を電解法で製造するにあたっては、電解液に電解ドラムを浸漬し、電解ドラムの表面に銅を析出させ、これを引き剥がして巻き取りロールに巻き取ることによって行なわれるものであり、このため電解銅箔では電解ドラムの側の面が光沢のあるシャイニング面１３、反対側の面が微細な凹凸を有して光沢のないマット面１４に形成されているものである。   One side of the copper foil 3 and the copper foil 4 is formed on the shining surface 13 and the other side is formed on the mat surface 14. In producing a copper foil by an electrolytic method, an electrolytic drum is immersed in an electrolytic solution, copper is deposited on the surface of the electrolytic drum, and this is peeled off and wound on a winding roll. Therefore, in the electrolytic copper foil, the surface on the side of the electrolytic drum is formed on the glossy shining surface 13 and the surface on the opposite side is formed on the matte surface 14 having fine unevenness and not gloss.

そして銅箔３は図３（ａ）に示すように、シャイニング面１３が外側になるように絶縁層２の表面側に配設して積層されており、銅箔４は図３（ｂ）に示すように、マット面１４が外側になるように、絶縁層２の裏面側に配設して積層されている。   Then, as shown in FIG. 3A, the copper foil 3 is disposed and laminated on the surface side of the insulating layer 2 so that the shining surface 13 is outside, and the copper foil 4 is shown in FIG. 3B. As shown, the mat surface 14 is disposed and laminated on the back surface side of the insulating layer 2 so that the mat surface 14 is on the outside.

このように絶縁層２の表面に配設される銅箔３と裏面に配設される銅箔４において、表裏の一方にはシャイニング面１３が、他方にはマット面１４が現れるので、光沢の差異で表面側の銅箔３と裏面側の銅箔４とを識別することができるものであり、識別操作に多大な時間を要することなく簡便に表裏を識別することが可能になるものである。従って、抵抗チェッカーなどの器具を用いる必要なく表裏を識別することができ、識別操作の際に銅箔３，４の表面に傷を付けてしまうリスクを低減することができるものである。   In this way, in the copper foil 3 disposed on the front surface of the insulating layer 2 and the copper foil 4 disposed on the back surface, the shining surface 13 appears on one of the front and back surfaces, and the mat surface 14 appears on the other side. The copper foil 3 on the front surface side and the copper foil 4 on the back surface side can be identified by the difference, and the front and back surfaces can be easily identified without requiring much time for the identification operation. . Therefore, the front and back sides can be identified without the need to use an instrument such as a resistance checker, and the risk of scratching the surfaces of the copper foils 3 and 4 during the identification operation can be reduced.

ここで、銅箔４のようにマット面１４が外側になるように絶縁層２に積層する場合、この銅箔４はシャイニング面１３で絶縁層２の樹脂に接着されることになり、絶縁層２に対する銅箔４の密着強度が低くなってピール強度を得ることが難しくなる。そこでこの場合には、銅箔４のシャイニング面１３に粗面化処理を施して微細な凹凸を形成し、絶縁層２に対する銅箔４のピール強度を高めるようにするのが好ましい。粗面化処理は、例えばメッキコブ付けなどで行なうことができる。   Here, when laminated on the insulating layer 2 so that the mat surface 14 is on the outside like the copper foil 4, the copper foil 4 is bonded to the resin of the insulating layer 2 on the shining surface 13. The adhesion strength of the copper foil 4 to 2 becomes low and it becomes difficult to obtain the peel strength. Therefore, in this case, it is preferable to roughen the shining surface 13 of the copper foil 4 to form fine irregularities so as to increase the peel strength of the copper foil 4 with respect to the insulating layer 2. The roughening treatment can be performed by, for example, plating bumping.

本発明の実施形態１における両面銅張積層板の、（ａ）表面側からみた平面図、（ｂ）裏面側からみた平面図である。It is the (a) top view seen from the surface side of the double-sided copper clad laminated board in Embodiment 1 of this invention, (b) The top view seen from the back surface side. 本発明の実施形態２における両面銅張積層板の、（ａ）表面側からみた平面図、（ｂ）（ｃ）裏面側からみた平面図である。It is the top view seen from the (a) surface side of the double-sided copper clad laminated board in Embodiment 2 of this invention, (b) (c) The top view seen from the back surface side. 参考例である実施形態３における両面銅張積層板の、（ａ）表面側からみた平面図、（ｂ）裏面側からみた平面図である。 It is the top view seen from the surface side of the double-sided copper clad laminated board in Embodiment 3 which is a reference example , (b) The top view seen from the back surface side. 本発明の実施形態における両面銅張積層板の側面図である。It is a side view of the double-sided copper clad laminated board in embodiment of this invention.

符号の説明Explanation of symbols

１ 両面銅張積層板
２ 絶縁層
３ 銅箔
４ 銅箔
１０、１１ スジ
１３ シャイニング面
１４ マット面 DESCRIPTION OF SYMBOLS 1 Double-sided copper clad laminated board 2 Insulating layer 3 Copper foil 4 Copper foil 10, 11 Stripe 13 Shining surface 14 Matte surface

Claims (5)

絶縁層の表面及び裏面に銅箔が配設されてなる両面銅張積層板であって、前記銅箔は表面にスジが形成されてなるものであり、前記銅箔に形成されたスジの方向の差異により、両面銅張積層板の表面と裏面とを識別可能としたものであることを特徴とする両面銅張積層板。   A double-sided copper-clad laminate in which a copper foil is disposed on the front and back surfaces of an insulating layer, wherein the copper foil has a streak formed on the surface, and the direction of the streaks formed on the copper foil The double-sided copper-clad laminate is characterized in that the front and back surfaces of the double-sided copper-clad laminate can be identified by the difference between the two. 前記両面銅張積層板は縦と横の寸法が異なるものであり、該両面銅張積層板の４辺のうちある１辺を基準として、表面側から見た場合と裏面側から見た場合とで、前記スジの方向が異なるように表面及び裏面の銅箔が配設されていることを特徴とする請求項１に記載の両面銅張積層板。   The double-sided copper-clad laminate has different vertical and horizontal dimensions, and when viewed from the front side and from the back side, based on one side of the four sides of the double-sided copper-clad laminate. 2. The double-sided copper-clad laminate according to claim 1, wherein copper foils on the front surface and the back surface are arranged so that the directions of the stripes are different. 縦と横の寸法差が１〜５ｍｍであることを特徴とする請求項２に記載の両面銅張積層板。   The double-sided copper-clad laminate according to claim 2, wherein a dimensional difference between length and width is 1 to 5 mm. 前記両面銅張積層板は縦と横の寸法が等しいものであり、該両面銅張積層板の４辺のうちいずれの辺を基準としても、表面側から見た場合と裏面側から見た場合とで、前記スジの方向が異なるように表面及び裏面の銅箔が配設されていることを特徴とする請求項１に記載の両面銅張積層板。   The double-sided copper-clad laminate has the same vertical and horizontal dimensions, and when viewed from the front side and the back side, regardless of any of the four sides of the double-sided copper-clad laminate 2. The double-sided copper-clad laminate according to claim 1, wherein copper foils on the front surface and the back surface are disposed so that the directions of the stripes are different. 前記絶縁層の表面と裏面の銅箔の厚みが等しいことを特徴とする請求項１乃至４のいずれかに記載の両面銅張積層板。 The double-sided copper-clad laminate according to any one of claims 1 to 4 , wherein the thickness of the copper foil on the front surface and the back surface of the insulating layer is equal.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715483A (en) * 1980-07-01 1982-01-26 Toshiba Chem Prod Both-side steel-lined laminated board
JPS6251437A (en) * 1985-08-30 1987-03-06 日立化成工業株式会社 Manufacture of copper lined laminated board
JPH0240986A (en) * 1988-07-29 1990-02-09 Sumitomo Metal Ind Ltd Laminated board for electronic material
JP2005101398A (en) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd Copper foil with silver coating layer and copper clad laminate using it
JP2006103189A (en) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk Surface-treated copper foil and circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715483A (en) * 1980-07-01 1982-01-26 Toshiba Chem Prod Both-side steel-lined laminated board
JPS6251437A (en) * 1985-08-30 1987-03-06 日立化成工業株式会社 Manufacture of copper lined laminated board
JPH0240986A (en) * 1988-07-29 1990-02-09 Sumitomo Metal Ind Ltd Laminated board for electronic material
JP2005101398A (en) * 2003-09-26 2005-04-14 Mitsui Mining & Smelting Co Ltd Copper foil with silver coating layer and copper clad laminate using it
JP2006103189A (en) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk Surface-treated copper foil and circuit board

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