CN110536538A - Board structure and preparation method thereof - Google Patents
Board structure and preparation method thereof Download PDFInfo
- Publication number
- CN110536538A CN110536538A CN201810517023.8A CN201810517023A CN110536538A CN 110536538 A CN110536538 A CN 110536538A CN 201810517023 A CN201810517023 A CN 201810517023A CN 110536538 A CN110536538 A CN 110536538A
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- layer
- connection pad
- dielectric layer
- copper post
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides a kind of board structure and preparation method thereof.Board structure includes dielectric layer, the first patterned line layer, at least one first copper post, at least one second copper post and the second patterned line layer.It is buried in first patterned line layer in the dielectric layer and including at least one first connection pad and at least one second connection pad.The surface of first patterned line layer is trimmed in the lower surface of dielectric layer.It buries in the dielectric layer and is located on the first connection pad in first copper post.It buries in the dielectric layer and is located on the second connection pad in second copper post.First sectional width of the first copper post is greater than the second sectional width of the second copper post.First width of the first connection pad is greater than the first sectional width of the first copper post.Second width of the second connection pad is greater than the second sectional width of the second copper post.
Description
Technical field
The present invention relates to a kind of board structures and preparation method thereof, and have preferable heat dissipation effect in particular to one kind
Board structure and preparation method thereof.
Background technique
In general, if via hole to be formed or conductive hole, it can be after forming one dielectric layer, via e.g. laser drilling
Hole method forms blind hole, to expose the line layer below this dielectric layer.Then, then by plating mode copper electroplating layer blind
In hole and on this dielectric layer, and form another line layer and via hole.However, when carrying out electroplating process, due to laser drilling method
It is formed by blind hole without dielectric layer, needs to insert copper material with plating mode and carry out consent.In order to avoid the copper face shape above blind hole
At the quality problem of recess, existing fabrication steps need first to carry out increase plating copper thickness the step of and then plus subtract copper thickness
The step of and reach flatness specification, or slow down copper facing rate using special copper facing liquid medicine, to increase the copper facing time, in turn
The case where avoiding above-mentioned recess generation.But higher cost needed for aforesaid way and fabrication steps are also more.In addition, by swashing
Drill finish hole is formed by the processing procedure that blind hole forms via hole via the mode of plating filling perforation and structure constraint in the density of its blind hole
It is not easy to improve, and the shape of blind hole is unfavorable for being made linear or block-like convex block, therefore above-mentioned processing procedure is not easy to reach high power
Heat sinking function needed for chip.
Summary of the invention
The present invention be directed to a kind of board structures, have various sizes of copper post on same line layer, have preferable
Heat dissipation effect.
Present invention is alternatively directed to a kind of production methods of board structure, to make above-mentioned board structure.
According to an embodiment of the invention, board structure includes dielectric layer, the first patterned line layer, at least one first bronze medal
Column, at least one second copper post and the second patterned line layer.Dielectric layer has upper surface and lower surface relative to each other.First
It is buried in the dielectric layer in patterned line layer, and including at least one first connection pad and at least one second connection pad.First patterned lines
The surface of road floor is trimmed in the lower surface of dielectric layer.It buries in the dielectric layer, and is located at least one first connection pad in first copper post.
It buries in the dielectric layer, and is located on the second connection pad in second copper post.First sectional width of the first copper post is greater than the second copper post
Second sectional width, and the first width of the first connection pad is greater than the first sectional width of the first copper post, and the second of the second connection pad
Width is greater than the second sectional width of the second copper post.Second patterned line layer is configured on the upper surface of dielectric layer.Second figure
Case line layer includes an at least third connection pad and at least one the 4th connection pad.
In the board structure of embodiment according to the present invention, dielectric layer be glass resin pickup (Prepreg, PP), taste it
Element constitutes film ABF (Ajinomoto Build-up Film, ABF), epoxy resin or epoxy film plastics.
In the board structure of embodiment according to the present invention, the range of the first sectional width of the first copper post is greater than 0.5
Millimeter and less than 20 millimeters.
In the board structure of embodiment according to the present invention, the range of the second sectional width of the second copper post is micro- between 15
Rice is between 500 microns.
In the board structure of embodiment according to the present invention, board structure further includes the first soldermask layer, is configured at dielectric
On layer, and the second patterned line layer is covered, and expose the 4th connection pad of part third connection pad and part.
In the board structure of embodiment according to the present invention, board structure further includes an at least increasing layer dielectric layer, at least
One increasing layer patterned line layer, at least one first increasing layer copper post and at least one second increasing layer copper post.Increasing layer dielectric layer is configured at
Between dielectric layer and the first soldermask layer.It is embedded in increasing layer patterned line layer in increasing layer dielectric layer, and at least directly contact first
Copper post and the second copper post.Increasing layer patterned line layer includes at least one first increasing layer connection pad and at least one second increasing layer connection pad.
It is embedded in increasing layer dielectric layer, and is located on the first increasing layer connection pad in first increasing layer copper post.First increasing layer copper post connects the second pattern
Change line layer and increasing layer patterned line layer.It is embedded in increasing layer dielectric layer in second increasing layer copper post, and is located at the second increasing layer connection pad
On.Second increasing layer copper post connects the second patterned line layer and increasing layer patterned line layer.
In the board structure of embodiment according to the present invention, board structure further includes the second soldermask layer, is configured at dielectric
On the lower surface of layer, and the first patterned line layer is covered, and expose the second connection pad of the first connection pad of part and part.
In the board structure of embodiment according to the present invention, board structure further includes first surface process layer and second
Surface-treated layer.First surface process layer is configured on third connection pad and the 4th connection pad that the first soldermask layer is exposed.Second
Surface-treated layer is configured on the first connection pad and the second connection pad that the second soldermask layer is exposed.
In the board structure of embodiment according to the present invention, board structure further includes core substrate, is had relative to each other
First surface with second surface and connect at least copper facing consent of first surface and second surface.The aperture of copper facing consent
Gradually successively decrease from first surface and second surface toward core substrate center.Dielectric layer is configured on core substrate, and the first pattern
Change line layer and connects copper facing consent.
According to an embodiment of the invention, the production method of board structure includes the following steps.Support plate is provided, support plate has that
This opposite top surface and bottom surface.On the top surface of support plate with the first patterned line layer is respectively formed on bottom surface,
In the first patterned line layer include at least one first connection pad and at least one second connection pad.On the first connection pad and on the second connection pad
It is respectively formed at least one first copper post and at least one second copper post.First sectional width of the first copper post is greater than the of the second copper post
Two sectional widths, and the first width of the first connection pad is greater than the first sectional width of the first copper post, and the second of the second connection pad is wide
Degree is greater than the second sectional width of the second copper post.On the top surface of support plate with provide dielectric layer respectively on bottom surface.Dielectric layer
With at least one opening, and the aperture being open is less than the first sectional width of the first copper post.On the top surface of support plate with bottom table
Dielectric layer is pressed on face, respectively at least to cover the first patterned line layer and the second copper post.Opening exposes the first copper post
First surface.Polish process is carried out, to completely reveal the first surface of the first copper post and the second surface of the second copper post, and it is fixed
Justice goes out the upper surface of dielectric layer.The second patterned line layer is respectively formed on the upper surface of dielectric layer.Second patterned circuit
Layer includes an at least third connection pad and at least one the 4th connection pad.It is respectively formed the first soldermask layer, on the dielectric layer to cover
Two patterned line layers, and expose the 4th connection pad of part third connection pad and part.
In the production method of the board structure of embodiment according to the present invention, support plate includes core layer and two copper foils
Layer.Copper foil layer is respectively arranged on opposite two configuration surfaces of core layer.
In the production method of the board structure of embodiment according to the present invention, copper foil layer is covered each by the configuration of core layer
Surface, and part configuration surface is exposed respectively.
In the production method of the board structure of embodiment according to the present invention, dielectric layer is glass resin pickup.Substrate knot
The production method of structure is further comprising the steps of.When on the top surface of support plate with dielectric layer is provided respectively on bottom surface, in dielectric
Copper sheet is provided respectively on layer.Copper sheet has rough surface, and rough surface is towards dielectric layer.On the top surface of support plate with bottom table
Dielectric layer and copper sheet thereon are pressed on face respectively.Polish process is carried out, to remove part copper sheet, and completely reveals the first bronze medal
The priming paint of the second surface and part of dielectric layer of the first surface of column and the second copper post.
In the production method of the board structure of embodiment according to the present invention, dielectric layer is glass resin pickup.Substrate knot
The production method of structure is further comprising the steps of.When on the top surface of support plate with dielectric layer is provided respectively on bottom surface, in dielectric
Copper sheet is provided respectively on layer.Copper sheet has priming paint, and priming paint is towards dielectric layer.Distinguish on the top surface of support plate on bottom surface
Press dielectric layer and copper sheet thereon.Polish process is carried out, to remove part copper sheet, and completely reveals the first of the first copper post
The second surface and part of dielectric layer on surface and the second copper post.Program is etched after carrying out polish process, to remove
Remaining copper sheet, and expose the upper surface of dielectric layer.
In the production method of the board structure of embodiment according to the present invention, the material of support plate is material containing fiberglass resin
Material.
In the production method of the board structure of embodiment according to the present invention, the material of support plate includes metal material, and
The metal material includes copper or stainless steel.
In the production method of the board structure of embodiment according to the present invention, dielectric layer is that aginomoto constitutes film.
In the production method of the board structure of embodiment according to the present invention, the model of the first sectional width of the first copper post
It encloses greater than 0.5 millimeter and less than 20 millimeters.
In the production method of the board structure of embodiment according to the present invention, the model of the second sectional width of the second copper post
It encloses between 15 microns to 500 microns.
It is further comprising the steps of in the production method of the board structure of embodiment according to the present invention.In dielectric layer
It is respectively formed on upper surface before the second patterned line layer, an at least increasing layer pattern is respectively formed on the upper surface of dielectric layer
Change line layer, at least directly to contact the first copper post and the second copper post.Increasing layer patterned line layer includes at least one first increasing layer
Connection pad and at least one second increasing layer connection pad.On the first increasing layer connection pad be respectively formed at least one first on the second increasing layer connection pad
Increasing layer copper post and at least one second increasing layer copper post.An at least increasing layer dielectric layer is respectively formed on the upper surface of dielectric layer, so that
Increasing layer patterned line layer, the first increasing layer copper post and the second increasing layer copper post are covered less.
It is further comprising the steps of in the production method of the board structure of embodiment according to the present invention.On the dielectric layer
It is respectively formed after the first soldermask layer, support plate is removed, to expose lower surface of the dielectric layer relative to upper surface respectively.First figure
The surface of case line layer is trimmed in the lower surface of dielectric layer.
In the production method of the board structure of embodiment according to the present invention, further includes: after removing support plate, in dielectric
The second soldermask layer is formed on the lower surface of layer, to cover the first patterned line layer, and exposes the first connection pad of part and portion
Divide the second connection pad.
In the production method of the board structure of embodiment according to the present invention, further includes: exposed in the first soldermask layer
First surface process layer is formed on third connection pad and the 4th connection pad out.It is sudden and violent in the second soldermask layer institute to form second surface process layer
On the first connection pad and the second connection pad exposed.
In the production method of the board structure of embodiment according to the present invention, support plate is core substrate, has glass tree
The upper copper face and lower copper face of rouge layer and the opposite sides positioned at fiberglass resin layer, it is same in upper copper face and lower copper face through laser
Position drills and becomes through-hole, and wherein the aperture of through-hole reduces from upper copper face and lower copper face to the center of fiberglass resin layer, penetrates
Copper facing consent make route and become support plate on top surface and bottom surface the first patterned line layer.
Based on above-mentioned, in the structure of board structure of the invention, there are different sizes in same patterned line layer
The first copper post and the second copper post, it is thermally conductive with conductive function to provide simultaneously.Whereby, board structure of the invention can have compared with
Good heat dissipation effect.In addition, compared to it is well known by after laser drill through formed via hole in a manner of by plating filling perforation for,
The present invention is to be initially formed various sizes of copper post in same patterned line layer, then presses dielectric layer again, can omit laser
The step of drilling and increase plating copper thickness or omission are given birth to using special copper facing liquid medicine the step of slowing down copper facing rate, to have to reduce
It generates this and simplifies the advantage of fabrication steps.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and cooperate appended attached drawing
It is described in detail below.
Detailed description of the invention
Comprising attached drawing to further understand the present invention, and attached drawing is incorporated to and in this specification and constitutes one of this specification
Point.Detailed description of the invention the embodiment of the present invention, and principle for explaining the present invention together with the description.
Figure 1A to Fig. 1 I is schematically shown as a kind of diagrammatic cross-section of the production method of board structure of one embodiment of the invention；
Fig. 1 J is schematically shown as a kind of section of the partial steps of the production method of board structure of another embodiment of the present invention
Schematic diagram；
Fig. 2A to Fig. 2 C is schematically shown as a kind of partial steps of the production method of board structure of another embodiment of the present invention
Diagrammatic cross-section；
Fig. 3 is schematically shown as a kind of diagrammatic cross-section of board structure of another embodiment of the present invention.
Drawing reference numeral explanation
10: support plate；
11: top surface；
12: core layer；
12a, 12b: configuration surface；
13: bottom surface；
14: copper foil layer；
100,100 ': board structure；
110: the first patterned line layers；
110a: increasing layer patterned line layer；
111: surface；
112: the first connection pads；
112a: the first increasing layer connection pad；
114: the second connection pads；
114a: the second increasing layer connection pad；
115: core substrate
117: copper facing consent
120: the first copper posts；
120a: the first increasing layer copper post；
122: first surface；
130: the second copper posts；
130a: the second increasing layer copper post；
132: second surface；
140,140 ': dielectric layer；
140a: increasing layer dielectric layer；
141,141 ': opening；
142,142 ': upper surface；
144: lower surface；
145,145 ': copper sheet；
146: rough surface；
147: priming paint；
150: the second patterned line layers；
152: third connection pad；
154: the four connection pads；
160: the first soldermask layers；
170: the second soldermask layers；
180: first surface process layer；
190: second surface process layer；
D, D ': aperture；
L: thickness；
L1: the first height；
L2: the second height；
L3, L3 ': third thickness；
T1: the first width；
T2: the second width；
W1: the first sectional width；
W2: the second sectional width.
Specific embodiment
With detailed reference to exemplary embodiment of the invention, the example of exemplary embodiment is illustrated in attached drawing.Only
It is possible that similar elements symbol is used to indicate same or similar part in the accompanying drawings and the description.
Figure 1A to Fig. 1 I is schematically shown as a kind of diagrammatic cross-section of the production method of board structure of one embodiment of the invention.
It should be noted that Fig. 1 F is indicated with perspective view.It please refer to Figure 1A, according to the production side of the board structure of the present embodiment
Method, firstly, providing support plate 10, wherein support plate 10 has top surface 11 and bottom surface 13 relative to each other.Specifically, this implementation
The support plate 10 of example includes core layer 12 and two copper foil layers 14, and wherein copper foil layer 14 is respectively arranged at opposite the two of core layer 12
On configuration surface 12a, 12b.Herein, the copper foil layer 14 on configuration surface 12a has top surface 11, and is located at configuration surface
Copper foil layer 14 on 12b has bottom surface 13.Copper foil layer 14 is covered each by two configuration surface 12a, 12b of core layer 12, and divides
Part two configuration surface 12a, 12b are not exposed.
Then, please refer to Figure 1B, on the top surface 11 of support plate 10 be respectively formed the first patterned lines on bottom surface 13
Road floor 110, wherein the first patterned line layer 110 includes at least one first connection pad 112 and at least one second connection pad 114.Herein,
First patterned line layer 110 is to be formed using half laminating method with film, exposure, development and copper facing on copper foil layer 14.Position
In the part that can expose support plate 10 on the top surface 11 of support plate 10 respectively with the first patterned line layer 110 on bottom surface 13
Top surface 11 and part bottom surface 13, imply that the first patterned line layer 110 is not to be comprehensively covered on top surface 11
On bottom surface 13.
Then, refer again to Figure 1B, on the first connection pad 112 at least one first bronze medal is respectively formed on the second connection pad 114
Column 120 and at least one second copper post 130, imply that first copper post 120 is formed on first connection pad 112, and one
Second copper post 130 is formed on second connection pad 114.In particular, the first section of first copper post 120 of the present embodiment is wide
The second sectional width W2 that W1 is greater than the second copper post 130 is spent, and the first width T1 of the first connection pad 112 is greater than corresponding first bronze medal
First sectional width W1 of column 120, and the second width T2 of the second connection pad 114 is greater than the second of corresponding second copper post 130 and cuts open
Face width W2.Preferably, the range of the first sectional width W1 of the first copper post 120 is greater than 0.5 millimeter and less than 20 millimeter, and the
The range of second sectional width W2 of two copper posts 130 is between 15 microns to 500 microns.Herein, the first copper post 120 and second
Copper post 130 is to use galvanoplastic to be formed on the first connection pad 112 and the second connection pad 114 of the first patterned line layer 110.The
First height L1 of one copper post 120 and the second height L2 of the second copper post 130 are identical, e.g. between 30 microns to 200 microns.
Then, please refer to Fig. 1 C, on the top surface 11 of support plate 10 with provide dielectric layer 140 respectively on bottom surface 13,
Dielectric layer 140 has at least one opening 141, and the aperture D of opening 141 is less than the first sectional width W1 of the first copper post 120.
More specifically, in the present embodiment, on the top surface 11 of support plate 10 with provide the same of dielectric layer 140 respectively on bottom surface 13
When, copper sheet 145 is provided respectively on dielectric layer 140, wherein copper sheet 145 have rough surface 146, and rough surface 146 towards
Dielectric layer 140.Herein, dielectric layer 140 be glass resin pickup (Prepreg, PP), can effectively improve structural strength and its uniformly
Property.On the other hand, the copper sheet 145 of the present embodiment can be for example ultra-thin copper sheet, such as containing ultra-thin copper sheet with a thickness of 3 microns to 5 microns
And 18 microns of copper sheet carrier.
Then, Fig. 1 C and Fig. 1 D be please also refer to, on the top surface 11 of support plate 10 on bottom surface 13 respectively pressing be situated between
Electric layer 140 and copper sheet 145 thereon, at least to cover the first patterned line layer 110 and the second copper post 130.Due to copper sheet 145
Rough surface 146 towards dielectric layer 140, therefore can have when pressing between copper sheet 145 and dielectric layer 140 and preferably be combined
Power.At this point, the thickness L3 due to dielectric layer 140 adds the first patterned line layer less than the first height L1 of the first copper post 120
The thickness L of 110a, therefore the opening 141 of dielectric layer 140 can expose the first surface 122 of the first copper post 120.Furthermore because
The aperture D of opening 141 less than the first copper post 120 the first sectional width W1, so after pressing, neighbouring first copper post 120
Dielectric layer 140 around first surface 122 and copper sheet thereon 145 can be tilted slightly.On the other hand, due to dielectric layer 140
Thickness L3 adds the thickness L of the first patterned line layer 110a, therefore corresponding second less than the second height L2 of the second copper post 120
Convex can be presented in dielectric layer 140 at copper post 130 and copper sheet thereon 145.
Then, Fig. 1 E is please referred to, polish process is carried out, to remove part copper sheet 145, and completely reveals the first copper post
The second surface 132 and part of dielectric layer 140 of 120 first surface 122 and the second copper post 130.At this point, being located at the first copper post
Dielectric layer 140 around 120 first surface 122 can be exposed.It is seen from overlooking, the dielectric layer 140 being exposed is presented
It is cyclic annular and between copper sheet 145 and the first copper post 120.
Then, after carrying out polish process, progress copper and electro-coppering are made and are patterned to make general route
Layer.Fig. 1 J is please referred to, if subsequent will make fine rule road, program must be etched to remove remaining special copper sheet (PCF)
145 ' expose its lower priming paint (Primer) 147 being coated with and make fine rule road on priming paint 147.In other words, etching program is
Required route thickness is seen to determine in selectively step, end.Herein, copper sheet 145 ' has priming paint 147, and priming paint 147 is face
To dielectric layer 140.
Then, Fig. 1 F is please referred to, an at least increasing layer patterned circuit is respectively formed on the upper surface of dielectric layer 140 142
Layer 110a, at least directly to contact the first copper post 120 and the second copper post 130.Increasing layer patterned line layer 110a includes at least one
First increasing layer connection pad 112a and at least one second increasing layer connection pad 114a.
And then, please refer to Fig. 1 G, on the first increasing layer connection pad 112a be respectively formed on the second increasing layer connection pad 114a to
Few one first increasing layer copper post 120a and at least one second increasing layer copper post 130a.In particular, the first copper post 120 and the first increasing layer copper post
120a is arranged on same reference line, so as to thermally conductive.Herein, the generation type of increasing layer patterned line layer 110a and the first pattern
The generation type for changing line layer 110 is identical, and the generation type of the first increasing layer copper post 120a and the second increasing layer copper post 130a and the
The generation type of one copper post 120 and the second copper post 130 is identical, and details are not described herein.
Then, it refer again to Fig. 1 H, an at least increasing layer dielectric layer be respectively formed on the upper surface of dielectric layer 140 142
140a, at least to cover increasing layer patterned line layer 110a, the first increasing layer copper post 120a and the second increasing layer copper post 130a.This
The step of the step of place, formation increasing layer dielectric layer 140a is with above-mentioned Fig. 1 C, Fig. 1 D and Fig. 1 E, implying that must be first in increasing layer dielectric layer
140a is upper to provide copper sheet (not being painted) simultaneously；Then, while increasing layer dielectric layer 140a and copper sheet thereon being pressed；Then, it carries out
Polish process and it is selectively etched program, and completes the production of increasing layer dielectric layer 140a.
And then, it refer again to Fig. 1 H, the second patterned line layer be respectively formed on the upper surface of dielectric layer 140 142
150.Specifically, the increasing layer that the second patterned line layer 150 is directly formed at 142 top of upper surface of dielectric layer 140 is situated between
On electric layer 140a, wherein the second patterned line layer 150 includes an at least third connection pad 152 and at least one the 4th connection pad 154.
Herein, the generation type of the second patterned line layer 150 is identical as the generation type of the first patterned line layer 110, herein not
It repeats again.
Then, it refer again to Fig. 1 H, be respectively formed the first soldermask layer on the increasing layer dielectric layer 140a on dielectric layer 140
160, to cover the second patterned line layer 150, and expose the 4th connection pad 154 of part third connection pad 152 and part.
Then, it please be respectively formed on dielectric layer 140 after first soldermask layer 160 with reference to Fig. 1 H and Fig. 1 I, remove and carry
Plate 10, to expose lower surface 144 of the dielectric layer 140 relative to upper surface 142 respectively.At this point, the first patterned line layer 110
Surface 111 trim in the lower surface of dielectric layer 140 144, imply that the first patterned line layer 110 be embedded type circuit structure
(Embedded Trace Structure,ETS).It should be noted that Fig. 1 I is only painted support plate 10 1 for the sake of for convenience of explanation
The line construction of side.
Then, it refer again to Fig. 1 I, form the second soldermask layer 170 on the lower surface of dielectric layer 140 144, to cover
One patterned line layer 110, and expose the first connection pad of part 112 and the second connection pad of part 114.
Finally, refer again to Fig. 1 I, on the third connection pad 152 and the 4th connection pad 154 that the first soldermask layer 160 is exposed
First surface process layer 180 is formed, and on the first connection pad 112 and the second connection pad 114 that the second soldermask layer 170 is exposed
Form second surface process layer 190.Herein, the material of first surface process layer 180 and second surface process layer 190 is, for example,
Gold, silver, ni au, nickel/palladium/gold, nickel silver or other metal materials appropriate, it is herein and without restriction.So far, base is completed
The production of hardened structure 100.
Since first copper post 120 of the present embodiment and the second copper post 130 are to be respectively formed in the first patterned line layer 110
The first connection pad 112 on on the second connection pad 114, imply that in same first patterned line layer 110 have it is various sizes of
First copper post 120 and the second copper post 130, therefore conductive and thermally conductive function can be provided simultaneously.Whereby, the substrate knot of the present embodiment
Structure 100 can have preferable heat dissipation effect.Furthermore it is respectively formed after the first soldermask layer 160, can remove on dielectric layer 140
Support plate 10, to expose lower surface 144 of the dielectric layer 140 relative to upper surface 142 respectively.At this point, the semi-finished product base completed
Hardened structure is coreless (coreless) board structure, and because two semi-finished product board structures can be made simultaneously, is had
Cost of manufacture and processing time are saved, and then improves the advantage of production capacity.In addition, compared to well known to pass through after laser drill by electricity
For the formed via hole of mode for plating filling perforation, the present embodiment is to be initially formed various sizes of first copper post 120 and the second copper post
130 in same first patterned line layer 110, then press dielectric layer 140 again, and laser drill can be greatly reduced and repeat to plate
Copper and the step of subtracting copper, the step of reaching laser filling perforation, have reduction production life originally and simplify the advantage of fabrication steps.In addition,
Since the dielectric layer 140 of the present embodiment is glass resin pickup (Prepreg, PP), structural strength can be improved, therefore in shipment,
Carry out supporting substrate structure without additional loading plate, production cost can be effectively reduced.
It refer again to Fig. 1 I, in structure, board structure 100 includes dielectric layer 140, the first patterned line layer 110, extremely
Few one first copper post 120, at least one second copper post 130, the second patterned line layer 150 and the first soldermask layer 160.Dielectric layer
140 with upper surface 142 and lower surface 144 relative to each other.It is embedded in dielectric layer 140 in first patterned line layer 110, and
Including at least one first connection pad 112 and at least one second connection pad 114.The surface 111 of first patterned line layer 110 trims Jie Yu
The lower surface 144 of electric layer 140.It is embedded in dielectric layer 140, and is located on the first connection pad 112 in first copper post 120.Second copper post
It is embedded in dielectric layer 140, and is located on the second connection pad 114 in 130.First sectional width W1 of the first copper post 120 is greater than second
Second sectional width W2 of copper post 130, and the first section that the first width T1 of the first connection pad 112 is greater than the first copper post 120 is wide
W1 is spent, and the second width T2 of the second connection pad 114 is greater than the second sectional width W2 of the second copper post 130.Second patterned circuit
150 configuration of layer is on the upper surface of dielectric layer 140 142, wherein the second patterned line layer 150 includes an at least third connection pad
152 and at least one the 4th connection pad 154.First soldermask layer 160 configures on dielectric layer 140, and covers the second patterned circuit
Layer 150, and expose the 4th connection pad 154 of part third connection pad 152 and part.
Furthermore the board structure 100 of the present embodiment further includes an at least increasing layer dielectric layer 140a, at least increasing layer patterning
Line layer 110a, at least one first increasing layer copper post 120a and at least one second increasing layer copper post 130a.Increasing layer dielectric layer 140a matches
It sets between dielectric layer 140 and the first soldermask layer 160.It is embedded in increasing layer patterned line layer 110a in increasing layer dielectric layer 140a,
And at least directly contact the first copper post 120 and the second copper post 130.Increasing layer patterned line layer 110a includes at least one first increasing layer
Connection pad 112a and at least one second increasing layer connection pad 114a.It is embedded in increasing layer dielectric layer 140a in first increasing layer copper post 120a, and
On the first increasing layer connection pad 112a.First the second patterned line layer of increasing layer copper post 120a connection 150 and increasing layer patterned lines
Road floor 110a.It is embedded in increasing layer dielectric layer 140a, and is located on the second increasing layer connection pad 114a in second increasing layer copper post 130a.Second
The second patterned line layer of increasing layer copper post 130a connection 150 and increasing layer patterned line layer 110a.
In addition, the board structure 100 of the present embodiment further includes the second soldermask layer 170, wherein the configuration of the second soldermask layer 170 exists
On the lower surface 144 of dielectric layer 140, and cover the first patterned line layer 110, and expose the first connection pad of part 112 and
The second connection pad of part 114.Board structure 100 further includes first surface process layer 180 and second surface process layer 190.First
Surface-treated layer 180 is configured on third connection pad 152 and the 4th connection pad 154 that the first soldermask layer 160 is exposed.Second surface
Process layer 190 is configured on the first connection pad 112 and the second connection pad 114 that the second soldermask layer 170 is exposed.
In the structure of the board structure 100 of the present embodiment, there are different rulers in same first patterned line layer 110
Very little the first copper post 120 and the second copper post 130, to provide conductive and thermally conductive function simultaneously.Whereby, the substrate knot of the present embodiment
Structure 100 can have preferable heat dissipation effect.
It should be noted that in the embodiment that other are not painted, dielectric layer can also be constituted for aginomoto film, epoxy resin or
Epoxy film plastics, this still falls within the range of the invention to be protected.
Fig. 2A to Fig. 2 C is schematically shown as a kind of partial steps of the production method of board structure of another embodiment of the present invention
Diagrammatic cross-section.The present embodiment continues to use the element numbers and partial content of previous embodiment, wherein using identical label come
It indicates identical or approximate element, and the explanation of same technique content is omitted.Before explanation about clipped can refer to
Embodiment is stated, it is no longer repeated for the present embodiment.
After Figure 1B the step of, please refer to Fig. 2A, on the top surface 11 of support plate 10 with provided respectively on bottom surface 13
Dielectric layer 140 ', dielectric layer 140 ' has at least one opening 141 ', and the aperture D ' of opening 141 ' is less than the first copper post 120
The first sectional width W1.Herein, dielectric layer 140 ' is that aginomoto constitutes film (ABF).
Then, Fig. 2A and Fig. 2 B be please also refer to, on the top surface 11 of support plate 10 with overlay Jie respectively on bottom surface 13
Electric layer 140 ', at least to cover the first patterned line layer 110 and the second copper post 130.At this point, due to the thickness of dielectric layer 140 '
L3 ' adds the thickness L of the first patterned line layer 110a, therefore dielectric layer 140 ' less than the first height L1 of the first copper post 120
Opening 141 ' first surface 122 of the first copper post 120 can be exposed.Furthermore because the aperture D ' of opening 141 ' is less than first
First sectional width W1 of copper post 120, so the dielectric layer after pressing, around the first surface 122 of neighbouring first copper post 120
140 ' can slightly tilt.On the other hand, added due to the thickness L3 ' of dielectric layer 140 ' less than the second height L2 of the second copper post 120
The thickness L of upper first patterned line layer 110a, therefore convex can be presented in the dielectric layer 140 ' at corresponding second copper post 130.
Then, Fig. 2 C is please referred to, polish process is carried out to dielectric layer 140 ', to expose the second surface 132 of the second copper post 130, and
Define the upper surface 142 ' of dielectric layer 140 '.Finally, board structure can be completed according to the step of Fig. 1 G, 1H and Fig. 1 I
Production.Since the dielectric layer 140 ' of the present embodiment is that aginomoto constitutes film (ABF), line density can be improved.
It is noted that the total quantity of the first connection pad and the first copper post can also in the embodiment that other are not painted
It is zero.That is, board structure can be not provided with the first connection pad and the first copper post, this still falls within what the present invention to be protected
Range.Furthermore in another embodiment not being painted, the line layer of board structure can increase to 20 layers or more according to demand,
This still falls within the range of the invention to be protected.
Fig. 3 is schematically shown as a kind of diagrammatic cross-section of board structure of another embodiment of the present invention.Before the present embodiment is continued to use
The element numbers and partial content of embodiment are stated, wherein adopting the identical or approximate element that is denoted by the same reference numerals, and are saved
The explanation of same technique content is omited.Explanation about clipped can refer to previous embodiment, and the present embodiment is not repeated to go to live in the household of one's in-laws on getting married
It states.Referring to FIG. 3, in the present embodiment, board structure 100 ' includes core substrate 115, dielectric layer 140, the first patterned lines
Road floor 110, the first copper post 120, the second copper post 130 and the second patterned line layer 150.Core substrate 115 has phase each other
Pair first surface 115a with second surface 115b and connect an at least copper facing of first surface 115a Yu second surface 115b
Consent 117, wherein the aperture of copper facing consent 117 from first surface 115a and second surface 115b in core substrate 115 gradually
Successively decrease.First patterned line layer 110 directly contacts copper facing consent 117 and is located at first surface 115a and second surface 115b
On, and the first copper post 120 and the second copper post 130 are located in the first patterned line layer of part 110.Dielectric layer 140 covers
First patterned line layer 110, the first copper post 120, the second copper post 130 and core substrate 115 first surface 115a and
Two surface 115b.Second patterned line layer 150 is located on dielectric layer 140 and covers the first copper post 120 and the second copper post 130.
Herein, the first copper post 120 connect the first patterned line layer 110 and the second patterned line layer 150 with the second copper post 130.
On processing procedure, core substrate 115 can be considered a kind of support plate, have fiberglass resin layer (i.e. core substrate 115) and
Positioned at upper copper face (i.e. the first table of the patterned line layer 110 far from core substrate 115 of the opposite sides of the fiberglass resin layer
Face) with lower copper face (i.e. the first surface of the patterned line layer 110 far from core substrate 115), through laser upper copper face under
Copper face same position drills and becomes through-hole (being subsequently formed the place of copper facing consent 117).The aperture of through-hole by upper copper face with
Lower copper face reduces to the center of fiberglass resin layer, the first patterned line layer 110 through copper facing consent production route.
In conclusion there are different sizes in same patterned line layer in the structure of board structure of the invention
The first copper post and the second copper post, it is thermally conductive with conductive function to provide simultaneously.Whereby, board structure of the invention can have compared with
Good heat dissipation effect.In addition, compared to it is well known by after laser drill through formed via hole in a manner of by plating filling perforation for,
The present invention is to be initially formed various sizes of copper post in same patterned line layer, then presses dielectric layer again, can be greatly reduced
It laser drill and repeats copper facing and reduces production raw this and simplified processing procedure to have the step of reaching laser filling perforation the step of subtract copper
The advantage of step.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (24)
1. a kind of board structure characterized by comprising
Dielectric layer has upper surface and lower surface relative to each other；
First patterned line layer is inside embedded in the dielectric layer, and including at least one first connection pad and at least one second connection pad,
Wherein the surface of first patterned line layer is trimmed in the lower surface of the dielectric layer；
At least one first copper post, is inside embedded in the dielectric layer, and is located at least one first connection pad；
At least one second copper post, is inside embedded in the dielectric layer, and is located at least one second connection pad, wherein it is described at least
Second sectional width of the first sectional width of one first copper post at least one second copper post greater than described in, and described at least one first
First sectional width of first width of connection pad at least one first copper post greater than described in, and at least one second connection pad
Second width is greater than second sectional width of at least one second copper post；And
Second patterned line layer configures on the upper surface of the dielectric layer, and the second patterned line layer packet
Include an at least third connection pad and at least one the 4th connection pad.
2. board structure according to claim 1, which is characterized in that the dielectric layer is glass resin pickup, aginomoto structure
Film forming, epoxy resin or epoxy film plastics.
3. board structure according to claim 1, which is characterized in that first section of at least one first copper post
The range of width is greater than 0.5 millimeter and less than 20 millimeter.
4. board structure according to claim 1, which is characterized in that second section of at least one second copper post
The range of width is between 15 microns to 500 microns.
5. board structure according to claim 1, which is characterized in that further include:
First soldermask layer is configured on the dielectric layer, and covers second patterned line layer, and expose described in part
An at least third connection pad and part at least one the 4th connection pad.
6. board structure according to claim 5, which is characterized in that further include:
An at least increasing layer dielectric layer is configured between the dielectric layer and first soldermask layer；
An at least increasing layer patterned line layer is inside embedded in an at least increasing layer dielectric layer, and at least directly contact is described extremely
Few one first copper post and at least one second copper post, an at least increasing layer patterned line layer include at least one first increasing layer
Connection pad and at least one second increasing layer connection pad；
At least one first increasing layer copper post is inside embedded in an at least increasing layer dielectric layer, and is located at least one first increasing layer
On connection pad, wherein at least one first increasing layer copper post connects second patterned line layer and an at least increasing layer pattern
Change line layer；And
At least one second increasing layer copper post is inside embedded in an at least increasing layer dielectric layer, and is located at least one second increasing layer
On connection pad, wherein at least one second increasing layer copper post connects second patterned line layer and an at least increasing layer pattern
Change line layer.
7. board structure according to claim 5, which is characterized in that further include:
Second soldermask layer is configured on the lower surface of the dielectric layer, and covers first patterned line layer, and sudden and violent
At least one first connection pad described in exposed portion and part at least one second connection pad.
8. board structure according to claim 7, which is characterized in that further include:
First surface process layer, configuration exposed in first soldermask layer described in an at least third connection pad and it is described at least
On one the 4th connection pad；And
Second surface process layer, configuration exposed in second soldermask layer described at least one first connection pad and it is described at least
On one second connection pad.
9. board structure according to claim 1, which is characterized in that further include:
Core substrate has each other relative first surface and second surface and connect the first surface and second table
An at least copper facing consent in face, wherein the aperture of an at least copper facing consent from the first surface and the second surface toward
The core substrate center is gradually successively decreased, and the dielectric layer is configured on the core substrate, and first patterned lines
Road floor connects an at least copper facing consent.
10. a kind of production method of board structure characterized by comprising
Support plate is provided, the support plate has top surface and bottom surface relative to each other；
On the top surface of the support plate be respectively formed the first patterned line layer on the bottom surface, wherein described
One patterned line layer includes at least one first connection pad and at least one second connection pad；
On at least one first connection pad be respectively formed at least one second connection pad at least one first copper post at least
One second copper post, wherein second of the first sectional width of at least one first copper post greater than at least one second copper post is cutd open
Face width, and first section that the first width of at least one first connection pad is greater than at least one first copper post is wide
Degree, and the second width of at least one second connection pad is greater than second sectional width of at least one second copper post；
On the top surface of the support plate with provide dielectric layer respectively on the bottom surface, wherein the dielectric layer have extremely
A few opening, and the aperture of at least one opening is less than first sectional width of first copper post；
On the top surface of the support plate with press the dielectric layer respectively on the bottom surface, at least to cover described
One patterned line layer and at least one second copper post, and at least one opening exposes at least one first copper post
First surface；
Polish process is carried out, to completely reveal at least first surface of one first copper post and described at least one second
The second surface of copper post, and define the upper surface of the dielectric layer；And
It is respectively formed the second patterned line layer on the upper surface of the dielectric layer, and second patterned line layer
Including an at least third connection pad and at least one the 4th connection pad.
11. the production method of board structure according to claim 10, which is characterized in that the support plate includes:
Core layer；And
Two copper foil layers are respectively arranged on opposite two configuration surfaces of the core layer.
12. the production method of board structure according to claim 11, which is characterized in that two copper foil layer is covered each by
Two configuration surface of the core layer, and part two configuration surface is exposed respectively.
13. the production method of board structure according to claim 10, which is characterized in that the dielectric layer is glass leaching tree
Rouge, and the production method of the board structure, further include:
When on the top surface of the support plate with the dielectric layer is provided respectively on the bottom surface, on the dielectric layer
Copper sheet is provided respectively, wherein the copper sheet has rough surface, and the rough surface is towards the dielectric layer；
On the top surface of the support plate with the dielectric layer and the copper sheet thereon are pressed on the bottom surface respectively；
And
The polish process is carried out, to remove the part copper sheet, and completely reveals the described of at least one first copper post
First surface and at least second surface of one second copper post and the part dielectric layer.
14. the production method of board structure according to claim 10, which is characterized in that the dielectric layer is glass leaching tree
Rouge, and the production method of the board structure, further include:
When on the top surface of the support plate with the dielectric layer is provided respectively on the bottom surface, on the dielectric layer
Copper sheet is provided respectively, wherein the copper sheet has priming paint, and the priming paint is towards the dielectric layer；
On the top surface of the support plate with the dielectric layer and the copper sheet thereon are pressed on the bottom surface respectively；
The polish process is carried out, to remove the part copper sheet, and completely reveals the described of at least one first copper post
First surface and at least second surface of one second copper post and the part dielectric layer；And
It is etched program, the priming paint of the upper surface on the dielectric layer is exposed to remove the remaining copper sheet.
15. the production method of board structure according to claim 14, which is characterized in that the material of the support plate is containing glass
Fiberized resin material.
16. the production method of board structure according to claim 14, which is characterized in that the material of the support plate includes gold
Belong to material, the metal material includes copper or stainless steel.
17. the production method of board structure according to claim 10, which is characterized in that the dielectric layer is aginomoto structure
Film forming.
18. the production method of board structure according to claim 10, which is characterized in that at least one first copper post
The range of first sectional width is greater than 0.5 millimeter and less than 20 millimeter.
19. the production method of board structure according to claim 10, which is characterized in that at least one second copper post
The range of second sectional width is between 15 microns to 500 microns.
20. the production method of board structure according to claim 10, which is characterized in that further include:
It is respectively formed on the upper surface of the dielectric layer before second patterned line layer, in the dielectric layer
An at least increasing layer patterned line layer is respectively formed on the upper surface, at least directly contact at least one first copper post with
At least one second copper post, wherein an at least increasing layer patterned line layer is including at least one first increasing layer connection pad and extremely
Few one second increasing layer connection pad；
On at least one first increasing layer connection pad be respectively formed on at least one second increasing layer connection pad at least one first increasing
Layer copper post and at least one second increasing layer copper post；And
It is respectively formed an at least increasing layer dielectric layer on the upper surface of the dielectric layer, is increased at least covering described at least one
Pattern layers line layer, at least one first increasing layer copper post and at least one second increasing layer copper post.
21. the production method of board structure according to claim 10, which is characterized in that further include:
It is respectively formed the first soldermask layer on the dielectric layer, to cover second patterned line layer, and exposes part
An at least third connection pad and part at least one the 4th connection pad；And
It is respectively formed after first soldermask layer on the dielectric layer, removes the support plate, given an account of with exposing respectively
Lower surface of the electric layer relative to the upper surface, wherein the surface of first patterned line layer is trimmed in the dielectric layer
The lower surface.
22. the production method of board structure according to claim 21, which is characterized in that further include:
After removing the support plate, the second soldermask layer is formed on the lower surface of the dielectric layer, to cover described first
Patterned line layer, and expose part at least one first connection pad and part at least one second connection pad.
23. the production method of board structure according to claim 22, which is characterized in that further include:
The is formed on an at least third connection pad described in being exposed in first soldermask layer and at least 1 the 4th connection pad
One surface-treated layer；And
The is formed at least one first connection pad described in being exposed in second soldermask layer and at least one second connection pad
Two surface-treated layers.
24. the production method of board structure according to claim 10, which is characterized in that the support plate is core substrate,
The upper copper face and lower copper face of opposite sides with fiberglass resin layer and positioned at the fiberglass resin layer, through laser described
Upper copper face and lower copper face same position drilling and become through-hole, wherein the aperture of the through-hole by the upper copper face with it is described
Lower copper face reduces to the center of the fiberglass resin layer, makes route through copper facing consent and becomes top described on the support plate
First patterned line layer on surface and the bottom surface.
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