JP4554437B2 - Thermal shock test equipment - Google Patents

Description

  The present invention relates to a thermal shock test apparatus.

  In recent years, the configuration of electronic parts and electronic devices has become complicated due to downsizing and high functionality. In addition, miniaturized devices such as mobile phones and in-vehicle devices are used in various environments. Temperature stress due to the usage environment of the equipment and repeated operation / stopping may greatly affect the reliability of the equipment. Therefore, reliability evaluation tests for temperature stress are often carried out in the manufacture and development of devices that are concerned about the effects of temperature stress and the components used therefor.

  In order to carry out such a reliability evaluation test, a thermal shock test apparatus as disclosed in the following Patent Document 1 has been provided. The thermal shock test apparatus disclosed in Patent Document 1 has a high-temperature test chamber in which the ambient temperature is set to a high temperature and a low-temperature test chamber in which the ambient temperature is set to a low temperature. After the sample is stored and exposed to the ambient temperature for a predetermined exposure time, a cooling cycle in which the sample is moved to another test chamber can be repeatedly performed.

  In the conventional thermal shock test, air containing moisture present in the high temperature test chamber flows into the low temperature test chamber when switching the test environment to which the sample is exposed, and cools the inner wall and gas in the low temperature test chamber. A cooler or the like may condense, or it may freeze and frost may adhere. For this reason, in the conventional thermal shock test apparatus, a heating means such as a heater is provided on the low temperature test chamber side, and when the thermal cycle is repeated for a predetermined number of cycles, the thermal shock test is temporarily stopped and the heating means is operated. The defrosting operation is performed to remove frost.

JP-A-5-203555

  As described above, in the conventional thermal shock test apparatus, the thermal shock test must be stopped and the defrosting operation must be performed every predetermined number of cycles, and the thermal shock test is performed for the desired number of cycles. There is a problem that the period required for the process becomes longer. In general, the thermal shock test is often performed by repeating a number of cycles such as 300 to 2000 cycles, so the defrost operation is performed by interrupting the thermal shock test several times in the middle. Will do. Therefore, there has been a problem that even if the time required for one defrosting operation is slightly increased, the time required from the start to the completion of the thermal shock test is significantly increased.

  Based on such knowledge, an object of the present invention is to provide a thermal shock test apparatus capable of minimizing the period required for the defrosting operation in the thermal shock test.

The invention according to claim 1, which is provided to solve the above-described problem, is a high temperature exposure operation in which a sample is exposed to a first test environment adjusted to a high ambient temperature, and the ambient temperature is higher than that of the first test environment. A thermal shock test apparatus capable of repeatedly performing a thermal cycle operation in which a low temperature exposure operation in which a sample is exposed to a second test environment having a low temperature is performed in order, a sample placement means capable of placing a sample, and a test environment A moisture absorbing means capable of absorbing the existing moisture and releasing the moisture in the first test environment, the moisture absorbing means includes a moisture absorbent, and when repeatedly performing the cooling and heating cycle operation, hygroscopic means is repeatedly exposed to a sample placement means and the same test environment, the moisture absorbing means at a high temperature exposure operation of exposing the sample to said first test environment adjusted to a high temperature of the ambient temperature, the same test ring Upcoming wherein by exposure to a high temperature atmosphere moisture means releases the absorbed moisture, the moisture absorbing means again, a thermal shock test apparatus characterized by can return the moisture absorbable condition.

  In the thermal shock test apparatus of the present invention, a hygroscopic means including a hygroscopic agent is provided, and the moisture contained in the gas present in the test environment can be absorbed by the hygroscopic means. For this reason, the thermal shock test apparatus of the present invention is unlikely to cause condensation or frost even when the test environment is repeatedly switched.

  The thermal shock test apparatus of the present invention is less likely to cause dew condensation and frost due to switching of the test environment, so that it is possible to minimize the time and effort required to remove the frost and the time required to remove the frost. Therefore, according to the thermal shock test apparatus of the present invention, the period required for the thermal shock test of the sample can be minimized.

  In the present invention, as a moisture absorbing means including a moisture absorbent, a device capable of absorbing moisture existing in the test environment and releasing moisture in the first test environment is employed. Further, the thermal shock test apparatus of the present invention is configured such that the sample placement means and the moisture absorption means for placing the sample are arranged in the same test environment. Therefore, the thermal shock test apparatus of the present invention can absorb moisture existing in the test environment to suppress the formation of dew condensation and frost, and release the moisture absorbed by the moisture absorbing means in the first test environment. The moisture absorbing means can be returned again to a state in which moisture can be absorbed.

  According to the second aspect of the present invention, it is possible to generate a gas circulation flow adjusted to a predetermined temperature in the test environment, and the moisture absorption means is disposed at a position exposed to the gas circulation flow. The thermal shock test apparatus according to claim 1, wherein

  According to such a configuration, moisture present in the low-temperature test environment can be efficiently absorbed by the moisture absorption means, and the occurrence of condensation and frost can be suppressed to a minimum. Furthermore, according to the above-described configuration, the moisture absorbed in the moisture absorption means can be released with high efficiency and sufficient by the circulating flow of high-temperature air circulating in the first test environment. It is possible to return to a hygroscopic state.

  The invention according to claim 3 has a high temperature test section capable of adjusting the ambient temperature of the test environment to a predetermined temperature, and a low temperature test section capable of adjusting the test environment to a lower temperature than the high temperature test section, and the high temperature test. The sample placement means moves between the test section and the low temperature test section to switch the test environment to which the sample is exposed. The moisture absorption means absorbs moisture in the low temperature test section and releases moisture in the high temperature test section. The thermal shock test apparatus according to claim 1, wherein the thermal shock test apparatus is a thermal shock test apparatus.

  In the thermal shock test apparatus of the present invention, when the sample placement means moves to the high temperature test section, the moisture absorbed by the moisture absorption means is released. Therefore, the sample placement means moves to the high temperature test section and is exposed to a high temperature atmosphere, so that it returns to a state where moisture can be absorbed again.

  The invention according to claim 4 is a test section in which the sample placement means is arranged, a high temperature gas adjusting means capable of adjusting a gas supplied to the test section to a high temperature, and a gas supplied to the test section. A low-temperature gas adjustment means that can be adjusted to a low temperature, the test environment can be switched by operating one or both of the high-temperature gas adjustment means and the low-temperature gas adjustment means to adjust the ambient temperature of the test section, A high-temperature gas introduction path for introducing gas from the high-temperature gas adjustment means to the test chamber is provided above the low-temperature gas introduction path for introducing gas from the low-temperature gas adjustment means to the test chamber. The thermal shock test apparatus according to any one of claims 1 to 3, wherein

  In the thermal shock test apparatus of the present invention, since the high temperature gas introduction path is provided above the low temperature gas introduction path, the gas flowing through the high temperature gas introduction path is unlikely to flow into the low temperature gas introduction path side. For this reason, the thermal shock test apparatus of the present invention allows the gas to flow into the low temperature gas adjusting means side to cause condensation or frost even when the humidity of the gas introduced from the high temperature gas adjusting means to the test unit is high. It is difficult for problems to occur.

  Here, in any of the thermal shock test apparatuses according to the first to fourth aspects, not only the sample but also the moisture absorption means cause a rapid temperature change in accordance with the switching of the test environment. Therefore, it is desirable that the moisture absorption means employed in the present invention can exhibit stable moisture absorption performance even when exposed to an environment where the temperature change is severe.

  Accordingly, in the invention according to claim 5 provided based on such knowledge, the moisture absorption means is a desiccant containing either one or both of silica gel and molecular sieve. It is a thermal shock test apparatus in any one.

  The silica gel and molecular sieve employed in the present invention can absorb or release moisture stably even when exposed to a rapid temperature change by a thermal shock test. Therefore, according to the present invention, it is possible to provide a thermal shock test apparatus capable of minimizing the occurrence of condensation or frost even when the thermal shock test is repeated.

  Hereinafter, a thermal shock test method and a thermal shock test apparatus according to an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, 1 is a thermal shock test apparatus of this embodiment. As shown in FIG. 1, the thermal shock test apparatus 1 includes a high-temperature test tank 2, a low-temperature test tank 3, and a rack 4 that can reciprocate between both test tanks 2 and 3.

  The thermal shock test apparatus 1 can switch the test environment to which the sample W is exposed by moving the rack 4 up and down to move the sample W to either the high temperature test tank 2 or the low temperature test tank 3. That is, the thermal shock test apparatus 1 includes moving means (not shown) that moves the sample W between temperature environments adjusted to different atmospheric temperatures. The thermal shock test apparatus 1 is a test in which a high-temperature test in which a sample W is exposed to a high-temperature test environment for a predetermined time and a low-temperature test in which the sample W is exposed to a low-temperature test environment for a predetermined time are repeatedly performed for any number of cycles. The operation can be performed and a thermal stress can be applied to the sample W. Moreover, the thermal shock test apparatus 1 is configured to be able to perform a defrosting operation for removing frost and the like generated in the low temperature test tank 3 along with the test operation.

  Each of the high-temperature test tank 2 and the low-temperature test tank 3 is configured such that the internal atmospheric temperature can be independently set to an arbitrary temperature within a predetermined temperature range. The high temperature test tank 2 can adjust the internal atmospheric temperature to an arbitrary temperature within a high temperature range such as 60 ° C. to 200 ° C., for example. Similarly, the low-temperature test chamber 3 can adjust the internal atmospheric temperature to an arbitrary temperature within a low temperature range such as 0 ° C. to −65 ° C.

  The high temperature test tank 2 and the low temperature test tank 3 are in a state where they are stacked in the vertical direction as shown in FIG. More specifically, the high temperature test tank 2 is configured to be stacked above the low temperature test tank 3. A boundary portion between the high temperature test tank 2 and the low temperature test tank 3 and an outer peripheral portion of the test tanks 2 and 3 are surrounded by a heat insulating wall 5 and a partition wall 6 having high heat insulating properties. A communication hole 7 is provided in the partition wall 6 that forms the boundary between the high temperature test tank 2 and the low temperature test tank 3.

  The high temperature test tank 2 is provided with high temperature side temperature control means 8 such as a heater capable of adjusting the atmospheric temperature in the tank to a predetermined set temperature. The high-temperature test tank 2 is provided with a blower 11 driven by a motor 10 and a blower duct 12. On the back surface of the high-temperature test tank 2 (the right wall surface in FIG. 1), an outside air inlet 14a and a damper 14b for opening and closing the same are provided. Further, an exhaust port 19 is provided on the top surface side of the high temperature test tank 2.

  The low temperature test tank 3 is provided with a low temperature side temperature adjusting means 13, a blower 16 driven by a motor 15, and a blower duct 17. The low temperature side temperature control means 13 includes a regenerator 13a and an evaporator 13b for adjusting the ambient temperature to a low temperature, an inner wall surface of the low temperature test tank 3 and a low temperature side temperature control means 13 as the thermal shock test proceeds. It is set as the structure provided with the heater 13c for performing the defrosting operation | movement which melts the adhering frost.

  The high temperature test tank 2 and the low temperature test tank 3 are air whose temperature is adjusted in the high temperature side temperature adjusting means 8 and the low temperature side temperature adjusting means 13 from the air blowing ports 12a and 17a provided on the back side of the test tanks 2 and 3, respectively. Are configured to blow out and circulate. When air is circulated in the high temperature test tank 2 and the low temperature test tank 3, a circulating air flow as shown by arrows in FIGS. 1 and 2 is generated.

  Atmospheric temperature sensors 18 and 20 are provided inside the high temperature test tank 2 and the low temperature test tank 3 so that the atmospheric temperature in each of the test tanks 2 and 3 can be detected. A control device (not shown) of the thermal shock test apparatus 1 adjusts the atmospheric temperature in the high temperature test tank 2 and the low temperature test tank 3 based on the detected temperature of the ambient temperature sensors 18 and 20.

  The rack 4 is configured to reciprocate in the vertical direction between the high temperature test tank 2 and the low temperature test tank 3 through the communication hole 7 by an elevating mechanism (not shown). In consideration of the shape and size of the sample W, the heat transfer efficiency, etc., the rack 4 has an appropriate shape such as a basket shape or a shelf shape for the body portion 4a on which the sample W is placed, or an appropriate size. Can do. The main body 4 a of the rack 4 has a size that can pass through the communication hole 7 provided in the partition wall 6 that separates the high temperature test tank 2 and the low temperature test tank 3. Heat insulation packings 21 and 22 are attached to the outer periphery of the opening portion on the high temperature test tank 2 side and the opening portion on the low temperature test tank 3 side in the communication hole 7.

  An environmental temperature detection sensor 9 is attached to the main body 4a. The environmental temperature detection sensor 9 is for detecting the temperature of the test environment to which the sample W placed on the rack 4 is exposed.

  On the top surface side and the bottom surface side of the main body portion 4a of the rack 4, heat shield portions 4b and 4c are provided. The heat shield portions 4 b and 4 c have almost the same height as the partition wall 6 and have excellent heat insulating properties like the heat insulating wall 5 and the partition wall 6. A top plate portion 4d is provided above the heat shield portion 4b. A bottom plate portion 4e is provided below the heat shield portion 4c. As shown in FIG. 1, the top plate portion 4 d and the bottom plate portion 4 e protrude outward from the main body portion 4 a and the heat shield portions 4 b and 4 c, respectively, so that they cannot pass through the communication holes 7 when the rack 4 is raised and lowered. It is said. Therefore, by raising and lowering the rack 4 until the top plate portion 4d and the bottom plate portion 4e abut against the partition wall 6, the communication hole 7 is closed by the top plate portion 4d and the bottom plate portion 4e, and the high temperature test tank 2 and the low temperature test tank 3 are connected. It can be thermally shut off.

  Moreover, the moisture absorption means 25 is attached to the top | upper surface side of the main-body part 4a. The moisture absorption means 25 has a shallow bottom, and an absorbent member 30 is placed inside a bowl-shaped member 26 having a shape like a bat or a bowl. As shown in FIG. 3, the absorbent member 30 is a bag-shaped or bowl-shaped storage member 28 filled with a moisture absorbent 27 capable of absorbing and releasing moisture. Both the bowl-shaped member 26 and the accommodating member 28 are excellent in air permeability through which air circulating in the high-temperature test tank 2 and the low-temperature test tank 3 can pass, and for example, many like a net-like one or punching metal It is made of a member having a hole. Further, the hook-like member 26 and the housing member 28 need to be able to withstand the thermal shock associated with the thermal shock test. Therefore, it is desirable that the bowl-shaped member 26 and the housing member 28 are made of, for example, metal or made of a resin having excellent heat resistance.

  As the hygroscopic agent 27, a material capable of absorbing moisture in the low-temperature test tank 3 serving as a test environment and capable of releasing moisture already absorbed by being exposed to the atmosphere on the high-temperature test tank 2 side is adopted. ing. More specifically, as the hygroscopic agent 27, for example, silica gel, molecular sieve, activated carbon, or the like can be employed.

  As described above, since the moisture absorbing means 25 is arranged on the top surface side of the main body 4a, when a circulating air flow is generated in the high temperature test tank 2 or the low temperature test tank 3, a hygroscopic agent 27 is added to the circulating flow. Is exposed. Therefore, the moisture present in the high temperature test tank 2 and the low temperature test tank 3 can be efficiently absorbed by the hygroscopic agent 27. When moisture is absorbed by the hygroscopic agent 27, the hygroscopic agent 27 is heated by exposing it to high-temperature air circulating in the high-temperature test chamber 2 to release the moisture that has already been absorbed. It can be returned to an absorbable state.

  The thermal shock test apparatus 1 repeats the thermal cycle in which the rack 4 is moved up and down as described above and the test environment to which the sample W is exposed is sequentially switched every predetermined time by an arbitrary number of cycles set by the operator. be able to.

  When the thermal shock test apparatus 1 repeats the above-described thermal cycle, the water present in the low-temperature test tank 3 is cooled, and condensation occurs on the inner wall surface of the low-temperature test tank 3 or the low-temperature side temperature control means 13 or frost adheres. There are things to do. If dew condensation or frost adheres in the low temperature test chamber 3, the circulation flow of air circulating in the low temperature test chamber 3 becomes unstable, or the adjustment of the atmospheric temperature in the low temperature test chamber 3 becomes unstable. There is a risk. Therefore, the thermal shock test apparatus 1 temporarily stops the test operation every time the thermal cycle is performed for a predetermined number of cycles, and the inside of the low temperature test tank 3 is set to about 40 to 60 ° C. by the heater 13 c of the low temperature side temperature control means 13. It is set as the structure which implements the defrost operation which heats up.

  As described above, in the thermal shock test apparatus 1 according to the present embodiment, the low temperature test is performed from the high temperature test tank 2 side when moving between the high temperature test tank 2 and the low temperature test tank 3 together with the rack 4 on which the sample W is placed. If air containing moisture flows into the tank 3 side, it may cause condensation or frost. However, in the thermal shock test apparatus 1 of the present embodiment, since the moisture absorption means 25 is attached to the rack 4, air containing moisture flows from the high temperature test tank 2 side to the low temperature test tank 3 side when the test environment is switched. Even so, most of the moisture contained in the air can be captured by the moisture absorption means 25. Accordingly, the thermal shock test apparatus 1 is less prone to problems such as condensation or frost on the low temperature test tank 3 side.

  As described above, the thermal shock test apparatus 1 according to the present embodiment is unlikely to cause condensation or frost, so the frequency of the defrosting operation and the time required for one defrosting operation can be suppressed to the minimum. The period required for the impact test is short. In addition, since the thermal shock test apparatus 1 is unlikely to generate condensation or frost, the circulation flow of the air flowing in the low temperature test tank 3 becomes unstable due to these, or the ambient temperature in the low temperature test tank 3 Is less likely to cause instability.

  Moreover, in the thermal shock test apparatus 1 of the present embodiment, when the rack 4 moves to the high temperature test tank 2 side, moisture absorbed by the moisture absorbent 27 of the moisture absorbing means 25 is released. The released moisture is discharged from the exhaust port 19 together with the air. Therefore, the thermal shock test apparatus 1 returns to a state in which moisture can be absorbed again when the rack 4 moves to the high temperature test tank 2 side and is exposed to a high temperature atmosphere. Therefore, the thermal shock test apparatus 1 does not have to perform special maintenance such as taking out the moisture absorption means 25 and drying it.

  As described above, the moisture absorption means 25 is disposed at a position exposed to the circulating flow of air circulating in the high temperature test tank 2 and the low temperature test tank 3, so that moisture is absorbed and released smoothly. Therefore, according to the above-described configuration, the humidity in the high temperature test tank 2 and the low temperature test tank 3 can always be maintained in a state suitable for the test, and the moisture absorbing means 25 can be maintained in an optimal state.

  The thermal shock test apparatus 1 of the said embodiment has the high temperature test tank 2 and the low temperature test tank 3, and switches the test environment to which the sample W is exposed by moving the rack 4 between these. However, the present invention is not limited to this. More specifically, for example, as in the thermal shock test apparatus 50 shown in FIG. 4, a test tank 51 for storing the sample W, a heating unit 52 including the high temperature side temperature control means 8, and the low temperature side temperature control means 13. And a cooling system 53 provided with circulation systems 55 and 56 for circulating air between the test tank 51 and the heating section 52 and the cooling section 53, and the moisture absorption means 25 described above is provided in the test tank 51. Also good.

  In such a configuration, any one of the dampers 62 and 63 provided at the boundary between the heating unit 52 and the cooling unit 53 and the circulation systems 55 and 56, and the test tank 51 and the circulation systems 55 and 56 are provided. If the dampers 60 and 61 provided at the air inlet 57 and the outlet 58 are opened between them, it is assumed that a circulating air flow as shown by an arrow A or an arrow B in FIG. Therefore, in the case of a configuration like the thermal shock test apparatus 50, for example, as shown in FIG. 4, a configuration in which the moisture absorption means 25 is provided in one or both of the air inlet 57 and the outlet 58 to the test tank 51. If so, moisture contained in the air introduced into the test tank 51 can be absorbed to prevent the formation of condensation and frost. Also in the thermal shock test apparatus 50, by introducing air heated to a high temperature, the moisture absorbed by the moisture absorbing means 25 can be released and returned to a state in which moisture can be absorbed again.

  The thermal shock test apparatuses 1 and 50 of the above embodiment generally consider that the warm air tends to rise, and the high temperature test tank 2 and the circulation system 55 on the heating unit 52 side are connected to the low temperature test tank 3 and The cooling system 53 is arranged above the circulation system 56 on the cooling unit 53 side. Therefore, the above-described thermal shock test apparatus 1, 50 is a mixture of the air present in the high temperature test tank 2 or the heating unit 52 and the air present in the low temperature test tank 3 or the cooling unit 53 when the test environment is switched. Is unlikely to occur. Therefore, according to the above-described configuration, it is possible to smoothly stabilize the atmospheric temperature of each of the test tanks 2, 3, 51 when the test environment is switched.

  Further, if the circulation system 55 on the high temperature test tank 2 or the heating unit 52 side is disposed above the circulation system 56 on the low temperature test tank 3 or the cooling unit 53 side, the inside of the high temperature test tank 2 that may contain moisture or It is possible to prevent the air in the heating unit 52 from flowing into the low temperature test tank 3 or the cooling unit 53 side. Therefore, according to the above-described configuration, it is possible to suppress the occurrence of dew condensation and the generation of frost in the thermal shock test apparatuses 1 and 50, and it is possible to minimize the time required for the defrosting operation.

  In addition, this invention is not limited to the said embodiment, The high temperature test tank 2, the heating part 52, the low temperature test tank 3, the up-and-down relation of the cooling part 53, or these are substantially on the same plane. It may be a side-by-side configuration.

It is sectional drawing which shows notionally the 1st operation state of the thermal shock test apparatus which is one Embodiment of this invention. It is sectional drawing which shows notionally the 2nd operation state of the thermal shock test apparatus which is one Embodiment of this invention. It is a schematic diagram which shows notionally the structure of the moisture absorption member which is one Embodiment of this invention. It is sectional drawing which shows notionally the structure of the thermal shock test apparatus which is other embodiment of this invention.

DESCRIPTION OF SYMBOLS 1 Cold / thermal shock test apparatus 2 High temperature test tank 3 Low temperature test tank 4 Rack 8 High temperature side temperature control means 13 Low temperature side temperature control means 25 Hygroscopic means 30 Absorbing member 50 Cold shock test apparatus 51 Test tank 52 Heating part 53 Cooling part 55,56 Circulation system

Claims (5)

A high temperature exposure operation in which the sample is exposed to a first test environment adjusted to a high ambient temperature, and a low temperature exposure operation in which the sample is exposed to a second test environment in which the ambient temperature is lower than the first test environment. A thermal shock test apparatus capable of repeatedly performing the thermal cycle operation to be performed,
Sample placement means capable of placing a sample, and moisture absorption means capable of absorbing moisture present in the test environment and releasing moisture in the first test environment,
The moisture absorbing means includes a moisture absorbent,
When repeatedly performing a cooling cycle operation, the moisture absorption means is repeatedly exposed to the same test environment as the sample placement means, and the moisture absorption means exposes the sample to the first test environment adjusted to a high ambient temperature. During the exposure operation , the moisture absorbed by the moisture absorbing means is released by being exposed to a high temperature atmosphere that is the same test environment, and the moisture absorbing means can be returned to a state in which moisture can be absorbed again. Thermal shock test equipment. It is possible to generate a gas circulation flow adjusted to a predetermined temperature in the test environment,
2. The thermal shock test apparatus according to claim 1, wherein the moisture absorbing means is disposed at a position exposed to the gas circulation flow. A high-temperature test unit that can adjust the ambient temperature of the test environment to a predetermined temperature, and a low-temperature test unit that can adjust the test environment to a lower temperature than the high-temperature test unit, between the high-temperature test unit and the low-temperature test unit Switching the test environment to which the sample is exposed by moving the sample placement means,
The thermal shock test apparatus according to claim 1 or 2, wherein the moisture absorbing means absorbs moisture in the low temperature test section and releases moisture in the high temperature test section. A test unit in which a sample placement unit is arranged, a high-temperature gas adjusting unit capable of adjusting a gas supplied to the test unit to a high temperature, and a low-temperature gas adjusting unit capable of adjusting a gas supplied to the test unit to a low temperature The test environment can be switched by operating either one of the high temperature gas adjustment means and the low temperature gas adjustment means to adjust the ambient temperature of the test section,
A high-temperature gas introduction path for introducing gas from the high-temperature gas adjustment means to the test chamber is provided above the low-temperature gas introduction path for introducing gas from the low-temperature gas adjustment means to the test chamber. The thermal shock test apparatus according to any one of claims 1 to 3.   5. The thermal shock test apparatus according to claim 1, wherein the moisture absorbing means is a desiccant containing one or both of silica gel and molecular sieve.

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