JP2006329949A - Testing device for cold thermal shock - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To restrain variation in sample temperature due to changes in the testing environment, in which a sample is exposed in a cold thermal shock test and variations in heat stress applied to the sample to a minimum. <P>SOLUTION: This cold thermal shock testing device 1 has a high-temperature testing laboratory 2 and a low temperature testing laboratory 3 The device can change the test environment in the cold thermal shock test by moving a rack 4, on which a sample is placed between both the laboratories. The cold thermal shock testing device 1 stops fans 11, 16 at the time of a change in test environment and stops air circulation inside the high-temperature testing laboratory 2 and inside the low-temperature testing laboratory 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thermal shock test apparatus.

  In recent years, the configuration of electronic parts and electronic devices has become complicated due to downsizing and high functionality. In addition, miniaturized devices such as mobile phones and in-vehicle devices are used in various environments. Thermal stress due to the usage environment of the equipment and repeated operation / stopping may greatly affect the reliability of the equipment. Therefore, reliability evaluation tests against thermal stress are often performed in the manufacture and development of devices that are concerned about the effects of thermal stress and components used in the equipment.

  In order to carry out such a reliability evaluation test, a thermal shock test apparatus as disclosed in the following Patent Document 1 has been provided. The thermal shock test apparatus disclosed in Patent Document 1 includes a high-temperature test chamber in which the ambient temperature is set to a high temperature, a low-temperature test chamber in which the ambient temperature is set to a low temperature, and a sample such as a rack for mounting the sample. Arrangement means is provided, and a circulation flow of air adjusted to a predetermined temperature is generated in the test chamber, and the sample is exposed to the circulation flow. The above-described thermal shock test apparatus accommodates a sample placement means in which a sample is placed in either the high temperature test chamber or the low temperature test chamber, and after exposing the sample for a predetermined exposure time at the ambient temperature, the sample placement means Is moved to the other test chamber, and a cooling cycle in which the sample is exposed to the circulating flow generated in this test chamber can be repeatedly performed.

JP 2002-323423 A

  In the thermal shock test apparatus disclosed in Patent Document 1 described above, when the sample placement means is moved from one of the high temperature test chamber and the low temperature test chamber to the other test chamber in order to switch the test environment, The sample placed on the sample placement means is gradually exposed to the circulating flow circulating in the test environment on the other side. For this reason, in the conventional thermal shock test apparatus, when the number of samples arranged in the sample placement means is large or the sample size is large, a part of the sample is switched between the high temperature test chamber and the low temperature test when the test environment is switched. One of the chambers is exposed to the circulating flow circulating in the test chamber on one side, and the remaining part of the sample is exposed to the circulating flow circulating in the test chamber on the other side. Therefore, in the conventional thermal shock test apparatus, there is a possibility that the temperature distribution is generated in the sample arranged in the sample arrangement means when the test environment is switched, and that the thermal stress applied to the sample varies.

  Further, the thermal shock test apparatus is often carried out by repeating a large number of cycles such as 300 to 2000 cycles. Therefore, in the thermal shock test apparatus, even if the variation of the thermal stress generated by switching the test environment once is small, the variation of the thermal stress is increased by repeating a large number of cycles. Therefore, in the conventional thermal shock test apparatus, there is a problem that the total amount of thermal stress applied from the start to the completion of the thermal shock test becomes large depending on the position where the sample is arranged.

  Based on such knowledge, an object of the present invention is to provide a thermal shock test apparatus capable of minimizing variations in sample temperature and thermal stress applied to the sample accompanying switching of the test environment to which the sample is exposed in the thermal shock test. To do.

  The invention according to claim 1, which is provided to solve the above-described problem, has a plurality of test chambers capable of adjusting the atmospheric temperature, and circulates the gas existing in the test chamber, thereby circulating the gas. It is possible to switch the test environment to which the sample is exposed by moving the sample between a plurality of test chambers. A thermal shock test apparatus characterized in that it can be prevented from being exposed to a circulating gas flow.

  In the thermal shock test apparatus of the present invention, the gas circulation flow stops when the sample is moved for switching the test environment. Therefore, in the thermal shock test apparatus of the present invention, even if a sample is moved from one of a plurality of test chambers to another test chamber, only a part of the sample is exposed to the circulating flow in the other test chamber. Things don't happen. Therefore, according to the thermal shock test apparatus of the present invention, the temperature distribution depending on the position where the sample is arranged, the part of the sample, the arrangement position, the quantity, etc., and the distribution of thermal stress are not generated, and the entire sample is Heating and cooling can be performed substantially evenly to apply thermal stress. Therefore, according to the present invention, it is possible to provide a thermal shock test apparatus capable of performing a thermal shock test by applying uniform thermal stress to the entire sample regardless of the size of the sample.

  The invention according to claim 2 is the thermal shock test apparatus according to claim 1, wherein the circulation of the gas in the test chamber is substantially stopped while the test environment is switched.

  According to such a configuration, it is possible to reliably prevent the sample from being exposed to the gas circulation flow when the test environment is switched. Therefore, according to the present invention, it is possible to minimize the variation in the sample temperature accompanying the switching of the test environment and the variation in the thermal stress applied to the sample.

  The thermal shock test apparatus according to claim 1 or 2 is capable of forming a circulating flow by blowing gas in a direction intersecting with a direction in which the sample moves in accordance with switching of the test environment. Good.

  Further, the above-described thermal shock test apparatus of the present invention has a sample temperature detecting means for detecting the temperature of the sample arranged in the sample arranging means, and is detected by the sample temperature detecting means after the switching of the test environment is completed. The sample may be exposed to a circulating gas flow formed in the test chamber over a period until a predetermined exposure time elapses with respect to a time point when the detected temperature reaches a predetermined set temperature range.

  When the thermal shock test apparatus is configured as described above, temperature distribution is unlikely to occur in the sample even if the test environment is switched. Therefore, when the thermal shock test apparatus is configured as described above, the temperature of the entire sample is set when the temperature detected by the sample temperature detection means reaches a predetermined set temperature range after switching the test environment. It is assumed that the temperature range has been reached. That is, when the configuration as described above is adopted, after the test environment is switched, the sample temperature detection means is installed even though the temperature detected by the sample temperature detection means has reached a predetermined set temperature range. It is difficult for such a situation that the temperature at the position outside the region does not reach the set temperature range. In other words, if the temperature detected by the sample temperature detection means has reached a predetermined set temperature range, the temperature of the entire sample has reached the set temperature range regardless of the mounting position of the sample temperature detection means. It is assumed. Therefore, by configuring the thermal shock test apparatus as described above, the sample can be exposed to the circulating flow for a predetermined exposure time after the temperature of the entire sample reaches the predetermined set temperature range, and the sample temperature detecting means The thermal shock test can be performed on the entire sample under almost the same test conditions regardless of the installation position of the.

  Hereinafter, a thermal shock test apparatus according to an embodiment of the present invention will be described with reference to the drawings. In FIG. 1, 1 is a thermal shock test apparatus of this embodiment. As shown in FIG. 1, the thermal shock test apparatus 1 includes a high temperature test chamber 2, a low temperature test chamber 3, and a rack 4 (sample placement means) capable of reciprocating between both test chambers 2 and 3. .

  The thermal shock test apparatus 1 can switch the test environment to which the sample W is exposed by moving the rack 4 up and down to move the sample W to either the high temperature test chamber 2 or the low temperature test chamber 3. That is, the thermal shock test apparatus 1 includes moving means (not shown) that moves the sample W between temperature environments adjusted to different atmospheric temperatures. The thermal shock test apparatus 1 is a test in which a high-temperature test in which a sample W is exposed to a high-temperature test environment for a predetermined time and a low-temperature test in which the sample W is exposed to a low-temperature test environment for a predetermined time are repeatedly performed for any number of cycles. The operation can be performed and a thermal stress can be applied to the sample W.

  The high temperature test chamber 2 and the low temperature test chamber 3 are configured such that the internal atmosphere temperature can be independently set to an arbitrary temperature within a predetermined temperature range. The high temperature test chamber 2 can adjust the internal atmospheric temperature to an arbitrary temperature within a high temperature range such as 60 ° C. to 150 ° C., for example. Similarly, the low temperature test chamber 3 can adjust the internal atmospheric temperature to an arbitrary temperature within a low temperature range such as 0 ° C. to −55 ° C., for example.

  The high temperature test chamber 2 and the low temperature test chamber 3 are in a state where they are stacked in the vertical direction as shown in FIG. More specifically, the high temperature test chamber 2 is configured to be stacked above the low temperature test chamber 3. A boundary portion between the high temperature test chamber 2 and the low temperature test chamber 3 and an outer peripheral portion of the test chambers 2 and 3 are surrounded by a heat insulating wall 5 and a partition wall 6 having high heat insulating properties. A communication hole 7 is provided in the partition wall 6 that forms the boundary between the high temperature test chamber 2 and the low temperature test chamber 3.

  The high temperature test chamber 2 is provided with high temperature side temperature control means 8 such as a heater capable of adjusting the atmospheric temperature in the tank to a predetermined set temperature. The high temperature test chamber 2 is provided with a blower 11 driven by a motor 10 and a blower duct 12. On the back surface of the high-temperature test chamber 2 (the right wall surface in FIG. 1), an outside air introduction port 14a and a damper 14b for opening and closing the opening 14a are provided. An exhaust port 19 is provided on the top side of the high temperature test chamber 2.

  The low temperature test chamber 3 is provided with a low temperature side temperature adjusting means 13, a blower 16 driven by a motor 15, and a blower duct 17. The low temperature side temperature control means 13 includes a regenerator 13a and an evaporator 13b for adjusting the ambient temperature to a low temperature, an inner wall surface of the low temperature test chamber 3 and a low temperature side temperature control means 13 as the thermal shock test proceeds. It is set as the structure provided with the heater 13c for performing the defrosting operation | movement which melts the adhering frost.

  The high temperature test chamber 2 and the low temperature test chamber 3 are air whose temperature is adjusted in the high temperature side temperature adjusting means 8 and the low temperature side temperature adjusting means 13 from the air blowing portions 12a and 17a provided on the back side of the test chambers 2 and 3, respectively. Are configured to blow out and circulate. As shown in FIGS. 1 to 3, the air blowers 12 a and 17 a have a configuration in which a register member 26 for adjusting the wind direction is arranged. As shown in FIG. 4, the register member 26 has a plurality of blade plates 27 arranged in the vertical direction, and is pivotally supported by a shaft 28 protruding from the side of the blade plate 27 in the width direction of the air blowing portions 12a and 17a. It corresponds to a so-called louver. As shown by the arrows in FIG. 4, the air blowers 12 a and 17 a have a configuration in which the air blowing direction can be finely adjusted by rotating a part or all of the plurality of blade plates 27 and appropriately adjusting the direction. Has been.

  Atmospheric temperature sensors 18 and 20 are provided inside the high temperature test chamber 2 and the low temperature test chamber 3 so that the atmospheric temperature in each of the test chambers 2 and 3 can be detected. A control device (not shown) of the thermal shock test apparatus 1 adjusts the ambient temperature in the high temperature test chamber 2 and the low temperature test chamber 3 based on the detected temperature of the ambient temperature sensors 18 and 20.

  The rack 4 is configured to reciprocate in the vertical direction between the high temperature test chamber 2 and the low temperature test chamber 3 through the communication hole 7 by an elevating mechanism (not shown). In consideration of the shape and size of the sample W, the heat transfer efficiency, etc., the rack 4 has an appropriate shape such as a basket shape or a shelf shape for the body portion 4a on which the sample W is placed, or an appropriate size. Can do. The main body 4 a of the rack 4 has a size that can pass through a communication hole 7 provided in the partition wall 6 that separates the high temperature test chamber 2 and the low temperature test chamber 3. Heat insulation packings 21 and 22 are attached to the outer periphery of the opening portion on the high temperature test chamber 2 side and the opening portion on the low temperature test chamber 3 side in the communication hole 7.

  An environmental temperature detection sensor 9 is attached to the main body 4a. The environmental temperature detection sensor 9 is for detecting the temperature of the test environment to which the sample W placed on the rack 4 is exposed.

  On the top surface side and the bottom surface side of the main body portion 4a of the rack 4, heat shield portions 4b and 4c are provided. The heat shield portions 4 b and 4 c have almost the same height as the partition wall 6 and have excellent heat insulating properties like the heat insulating wall 5 and the partition wall 6. A top plate portion 4d is provided above the heat shield portion 4b. A bottom plate portion 4e is provided below the heat shield portion 4c. As shown in FIG. 1, the top plate portion 4 d and the bottom plate portion 4 e protrude outward from the main body portion 4 a and the heat shield portions 4 b and 4 c, respectively, so that they cannot pass through the communication holes 7 when the rack 4 is raised and lowered. It is said. Therefore, by raising and lowering the rack 4 until the top plate portion 4d and the bottom plate portion 4e hit the partition wall 6, the communication hole 7 is closed by the top plate portion 4d and the bottom plate portion 4e, and the high temperature test chamber 2 and the low temperature test chamber 3 are closed. It can be thermally shut off.

  The thermal shock test apparatus 1 is provided with a sample temperature sensor 25 (sample temperature detection means) that can be attached to the sample W and detects the temperature of the sample W itself. The thermal shock test apparatus 1 is based on the sample temperature control mode in which the thermal shock test is performed based on the temperature of the sample W detected by the sample temperature sensor 25 and the ambient temperature of the test environment detected by the environmental temperature detection sensor 9. Thus, an arbitrary test mode is selected from the ambient temperature control mode in which the thermal shock test is performed, and the thermal shock test can be performed.

  Then, operation | movement of the thermal shock test apparatus 1 of this embodiment is demonstrated. The thermal shock test apparatus 1 repeats the thermal cycle in which the rack 4 is moved up and down as described above and the test environment to which the sample W is exposed is sequentially switched every predetermined time by an arbitrary number of cycles set by the operator. be able to.

  More specifically, when the thermal shock test is started, the thermal shock test apparatus 1 operates the blowers 11 and 16, and as shown by arrows in FIGS. 1 and 2, the high temperature test chamber 2 and the low temperature test chamber. 3 generates a circulating air flow, and the ambient temperature in the high temperature test chamber 2 and the low temperature test chamber 3 is within a predetermined error range (hereinafter referred to as “high temperature setting” if necessary) with respect to the set temperature set by the operator. The high temperature side temperature adjusting means 8 and the low temperature side temperature adjusting means 13 are operated so that the temperature is within a temperature range and a low temperature setting temperature range. The sample W arranged in the rack 4 is exposed to a circulating air flow adjusted to a predetermined temperature flowing in the high temperature test chamber 2 or the low temperature test chamber 3 as shown in FIGS.

  After the rack 4 is accommodated in the high-temperature test chamber 2 or the low-temperature test chamber 3, the sample W is set to a high temperature with respect to a predetermined set temperature in the atmosphere temperature in each of the test chambers 2 and 3 or the temperature of the sample W itself. The sample W is exposed to a circulating flow that circulates in the test chambers 2 and 3 until a predetermined exposure time set by the operator elapses with reference to a point in time within a temperature range or a low temperature set temperature range. It is.

  More specifically, as described above, the thermal shock test apparatus 1 of the present embodiment selects an arbitrary test mode from the test mode group including the sample temperature control mode and the ambient temperature control mode as the test mode. It can be operated. Therefore, when the test mode set by the operator is the sample temperature control mode, the temperature of the sample W itself detected by the sample temperature sensor 25 has reached a temperature within the high temperature set temperature range or the low temperature set temperature range. Using the time point as a reference, the sample W is exposed to a circulating flow of air adjusted to a predetermined temperature until a predetermined exposure time set in advance elapses.

  On the other hand, when the test mode set by the operator is the ambient temperature control mode, the time point when the temperature detected by the environmental temperature detection sensor 9 reaches the temperature within the high temperature setting temperature range or the low temperature setting temperature range is used as a reference. As described above, the sample W is exposed to a circulating air flow adjusted to a predetermined temperature until a predetermined exposure time set in advance elapses.

  The thermal shock test apparatus 1 exposes the sample W to the circulating flow until a predetermined exposure time elapses as described above, and then moves the rack 4 downward or upward as indicated by an arrow in FIG. Change the test environment to which At this time, the fans 11 and 16 provided in the high temperature test chamber 2 and the low temperature test chamber 3 are substantially stopped in operation. That is, when the test environment is switched, the rotation amounts of the motors 10 and 15 are reduced to such an extent that the motors 10 and 15 are not in operation and no air circulation occurs. Therefore, in the thermal shock test apparatus 1, the circulation of air is stopped when the test environment is switched, and the inside of the high temperature test chamber 2 and the low temperature test chamber 3 is almost free of wind. Therefore, even if the rack 4 is moved to switch the test environment, the sample W arranged in the rack 4 is not exposed to the circulating air flow.

  As described above, the rack 4 is moved in a state where the high-temperature test chamber 2 and the low-temperature test chamber 3 are not in a windless state, and the rack 4 is moved to the low-temperature test chamber 3 side or the high-temperature test chamber 2 as shown in FIGS. When moved to the side, the motors 10 and 15 of the blowers 11 and 16 are adjusted so as to rotate again at a predetermined rotational speed, and a circulating air flow is generated in the high temperature test chamber 2 and the low temperature test chamber 3. . In this way, when the switching of the test environment to which the sample W is exposed is completed, the detected temperature of the environmental temperature detection sensor 9 or the sample temperature sensor 25 is monitored in accordance with the test mode of the thermal shock test, as described above. The test environment is adjusted so that the detected temperature reaches a predetermined temperature range. When the temperature detected by the environmental temperature detection sensor 9 or the sample temperature sensor 25 reaches a predetermined temperature range, the sample W is exposed to the circulating air until a predetermined exposure time elapses with reference to that point. When the predetermined exposure time has elapsed after switching the test environment, one cycle of the cooling / heating cycle is completed.

  When the cooling cycle for one cycle is completed, the blowers 11 and 16 are substantially stopped from blowing, and the rack 4 moves while the high temperature test chamber 2 and the low temperature test chamber 3 are in a substantially no-air state. The next cooling cycle is started. The thermal shock test apparatus 1 repeats the thermal cycle over the number of cycles set by the operator in this way.

  As described above, the thermal shock test apparatus 1 of the present embodiment intersects the moving direction (height direction) when moving the sample W between the high temperature test chamber 2 and the low temperature test chamber 3 (the height direction) ( The sample W is exposed to a circulating flow generated by blowing air in the horizontal direction. Therefore, if the thermal shock test apparatus 1 is configured so that the circulating flow is not stopped in the high temperature test chamber 2 and the low temperature test chamber 3 even during switching of the test environment, a part of the sample W is moved along with the movement of the sample W. One of the high-temperature test chamber 2 and the low-temperature test chamber 3 is exposed to the circulating flow, and the remaining portion of the sample W is exposed to the circulating flow flowing through the other. Therefore, when the moving direction of the rack 4 and the air blowing direction intersect as in the thermal shock test apparatus 1, it is assumed that there is a high possibility that a temperature distribution is generated in the sample W when the test environment is switched. .

  However, as described above, the thermal shock test apparatus 1 according to the present embodiment is configured so that the fans 11 and 16 are substantially stopped during the switching of the test environment, and the inside of the high-temperature test chamber 2 and the low-temperature test chamber 3 is substantially free of wind. The sample W is configured to prevent the sample W from being exposed to the circulating air flow. Therefore, even if the thermal shock test apparatus 1 moves the sample W from one of the high temperature test chamber 2 and the low temperature test chamber 3 to the other, a part of the sample W is exposed to high temperature air and the rest is a low temperature. There is no such phenomenon as exposure to air. Therefore, the thermal shock test apparatus 1 generates a temperature distribution regardless of the arrangement of the sample W, the portion of the sample W, the number of the sample W, and the like, even if the test environment is switched. Problems such as distribution will not occur.

  Since the thermal shock test apparatus 1 of the present embodiment does not generate a temperature distribution associated with the switching of the test environment, the arrangement of the sample W, the site of the sample W, etc. even if the thermal cycle is repeated many times. Test error in the thermal shock test due to is less likely to occur.

  Further, in the thermal shock test apparatus 1 of the present embodiment, since the temperature distribution does not occur in the sample W when the test environment is switched, it is assumed that the temperature of the entire sample W has reached the detected temperature of the sample temperature sensor 25. The Therefore, the thermal shock test apparatus 1 selects the sample temperature control mode as the test mode of the thermal shock test, so that the temperature of the entire sample W reaches the predetermined set temperature and the sample W is removed from the air for a predetermined exposure time. Can be exposed to circulating flow. Therefore, according to the thermal shock test apparatus 1, by selecting the sample temperature control mode as the test mode, the entire sample W can be subjected to the thermal shock test under substantially the same test conditions regardless of the installation position of the sample temperature detection means. It can be performed and accurate test data can be obtained.

  The thermal shock test apparatus 1 is in a state in which the blowers 11 and 16 stop operating when the test environment is switched. Therefore, even if the high temperature test tank 2 and the low temperature test tank 3 communicate with each other through the communication hole 7, Air in and out of the test tanks 2 and 3 hardly occurs. For this reason, the thermal shock test apparatus 1 has a short period of time until the ambient temperature in each of the test tanks 2 and 3 is stabilized after the test environment is switched.

  In the above-described embodiment, the configuration in which the register member 26 is disposed in the air blowing portions 12a and 17a is illustrated. However, this configuration is merely an example of the present invention. A plate body 24 having a large number of air blowing openings 23 as shown in FIG. 5 may be arranged on the upstream side or the downstream side in the flow direction. Further, the thermal shock test apparatus 1 may have a configuration in which the plate body 24 is arranged instead of the register member 26, or may have a configuration in which the register member 26 and the plate body 24 are not arranged in the blower portions 12a and 17a. That is, the thermal shock test apparatus 1 may have a configuration in which either or both of the register member 26 and the plate body 24 are provided in the air blowing portions 12a and 17a, or a configuration in which the register member 26 and the plate body 24 are not provided.

  In the case where the plate body 24 is disposed in the blower units 12a and 17a, it is desirable that the size and position of the opening 23 be adjusted in consideration of the temperature distribution in the high temperature test chamber 2 and the low temperature test chamber 3. More specifically, it is desirable that the opening 23 be formed at a position where the sample W disposed in the main body 4a of the rack 4 is directly exposed to the air blown out from the air blowing units 12a and 17a. In other words, it is desirable that the opening 23 be formed so as to be able to blow out air whose temperature has been adjusted to a predetermined temperature in a direction intersecting (substantially orthogonal in the present embodiment) with the moving direction of the rack 4. .

  Further, the shape of the opening 23 formed in the plate body 24 can be set as appropriate. For example, as shown in FIG. 5, the vertically long and slit-like shape in the moving direction of the rack 4, that is, the vertical direction It can be. In the case of such a configuration, the air blowing portions 12a and 17a are formed so that a large number of the above-described vertically long openings 23 are arranged in the vertical and horizontal directions when viewed from the front, and have a lattice shape. Therefore, when it is set as the structure which has arrange | positioned the plate 24 to the ventilation parts 12a and 17a, air is the back side (FIG. 1) of the high temperature test chamber 2 and the low temperature test chamber 3 in the width direction (left-right direction in FIG. 5) of the rack 4. , From the right side in FIG. 2 to the front side (left side in FIGS. 1 and 2). Therefore, by arranging the plate body 24 in the air blowing parts 12a and 17a, the inside of the high-temperature test chamber 2 and the low-temperature test chamber 3 to which the sample W is exposed is adjusted to a substantially uniform temperature atmosphere between the back side and the front side. can do.

  The thermal shock test apparatus 1 of the present embodiment stops the rotation of the motors 10 and 15 that are the power sources of the blowers 11 and 16 during the switching of the test environment, or reduces the number of rotations to thereby circulate the air flow. Although it was made to stop substantially and to be almost a windless state, this invention is not limited to this. More specifically, the thermal shock test apparatus 1 has a configuration in which the direction of the blade plate 27 of the register member 26 can be adjusted using the power of an actuator such as a motor or a cylinder, and the actuator described above is switched when the test environment is switched. And the direction of the blade plate 27 is adjusted so that no circulating air flow is generated in the high-temperature test tank 2 or the low-temperature test tank 3, or the circulating flow is directly applied to the rack 4 or the sample W arranged on the rack 4. It is good also as a structure which adjusts the direction of the blade board 27 so that it may not spray. Even in the case of such a configuration, similarly to the case of stopping the blowing by the blowers 11 and 16, the sample W can be prevented from being exposed to the circulating air flow when the test environment is switched, and the temperature variation of the sample W can be prevented. It can be minimized.

  In addition, as described above, when the plate member 24 is provided without providing the register member 26, the openings provided on the back side of the high temperature test chamber 2 and the low temperature test chamber 3, as shown in FIG. 23 may be configured to be provided with an air flow blocking means such as an open / close mechanism 30 such as a shutter or a damper that can be opened / closed, and the open / close mechanism 30 may be closed as shown in FIG. 6B when the test environment is switched. Also in the case of such a configuration, as in the case of stopping the blowing by the blowers 11 and 16, the sample W can be prevented from being exposed to the circulating air flow when the test environment is switched, and the temperature variation of the sample W can be prevented. Etc. can be minimized.

  In the thermal shock test apparatus 1 described above, the register member 26 can adjust the direction using the power of some actuator as described above, even if the direction of the blade plate 27 can be adjusted manually. There may be. Furthermore, the register member 26 can incline the slats 27 in the vertical direction (height direction) with respect to the air blowing parts 12a and 17a. However, the present invention is not limited to this, for example, the horizontal direction. It may be adjustable in the (width direction).

  In addition, this invention is not limited to the said embodiment, The structure in which the up-and-down relationship of the high temperature test chamber 2 and the low temperature test chamber 3 was replaced, and these were arranged in the substantially same plane may be sufficient. .

  The above-described thermal shock test apparatus 1 includes a high temperature test chamber capable of adjusting the ambient temperature and the temperature of the circulating air flow to a high temperature, and a low temperature capable of adjusting the ambient temperature and the temperature of the circulating air flow to a lower temperature. The test environment can be switched to two stages in one cycle of the thermal cycle, but the present invention is not limited to this, and a test can be performed by providing more test rooms. It is good also as a structure which can switch an environment in multistep.

It is sectional drawing which shows notionally the 1st operation state of the thermal shock test apparatus which is one Embodiment of this invention. It is sectional drawing which shows notionally the 2nd operation state of the thermal shock test apparatus which is one Embodiment of this invention. It is sectional drawing which shows notionally the 3rd operation state of the thermal shock test apparatus which is one Embodiment of this invention. It is a perspective view which shows the structure of the register member employ | adopted in the thermal shock test apparatus which is one Embodiment of this invention. It is sectional drawing which shows the modification of a ventilation part. (A), (b) is sectional drawing which shows notionally the 1st and 2nd operation state of the thermal shock test apparatus which is another embodiment of this invention, respectively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thermal shock test apparatus 2 High temperature test room 3 Low temperature test room 4 Rack (sample arrangement means)
10, 15 Motor 11, 16 Blower 23 Opening 25 Sample temperature sensor (sample temperature detection means)
30 Opening and closing mechanism (air flow blocking means)

Claims (2)

It has multiple test chambers that can adjust the ambient temperature, and by circulating the gas existing in the test chamber, the sample can be exposed to the circulating flow of the gas, and the sample can be moved between multiple test chambers. By switching the test environment to which the sample is exposed,
A thermal shock test apparatus characterized in that it is possible to prevent the sample placed in the sample placement means from being exposed to a circulating gas flow during switching of the test environment.   2. The thermal shock test apparatus according to claim 1, wherein the circulation of the gas in the test chamber is substantially stopped during the switching of the test environment.

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