JP4551823B2 - 電子部品用トレイの識別方法 - Google Patents

電子部品用トレイの識別方法 Download PDF

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Publication number
JP4551823B2
JP4551823B2 JP2005168376A JP2005168376A JP4551823B2 JP 4551823 B2 JP4551823 B2 JP 4551823B2 JP 2005168376 A JP2005168376 A JP 2005168376A JP 2005168376 A JP2005168376 A JP 2005168376A JP 4551823 B2 JP4551823 B2 JP 4551823B2
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JP
Japan
Prior art keywords
tray
electronic component
mass
regular
similar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005168376A
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English (en)
Japanese (ja)
Other versions
JP2006341873A (ja
JP2006341873A5 (enExample
Inventor
浩二 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005168376A priority Critical patent/JP4551823B2/ja
Priority to TW095118126A priority patent/TW200710006A/zh
Priority to CNB2006100879508A priority patent/CN100462291C/zh
Priority to US11/448,902 priority patent/US7510081B2/en
Publication of JP2006341873A publication Critical patent/JP2006341873A/ja
Publication of JP2006341873A5 publication Critical patent/JP2006341873A5/ja
Application granted granted Critical
Publication of JP4551823B2 publication Critical patent/JP4551823B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Packaging Frangible Articles (AREA)
  • Pallets (AREA)
JP2005168376A 2005-06-08 2005-06-08 電子部品用トレイの識別方法 Expired - Fee Related JP4551823B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005168376A JP4551823B2 (ja) 2005-06-08 2005-06-08 電子部品用トレイの識別方法
TW095118126A TW200710006A (en) 2005-06-08 2006-05-22 Electronic component tray and identification method of similar electronic component tray
CNB2006100879508A CN100462291C (zh) 2005-06-08 2006-06-08 电子部件用托盘及其识别方法
US11/448,902 US7510081B2 (en) 2005-06-08 2006-06-08 Electronic component tray and identification method of similar electronic component tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005168376A JP4551823B2 (ja) 2005-06-08 2005-06-08 電子部品用トレイの識別方法

Publications (3)

Publication Number Publication Date
JP2006341873A JP2006341873A (ja) 2006-12-21
JP2006341873A5 JP2006341873A5 (enExample) 2007-05-31
JP4551823B2 true JP4551823B2 (ja) 2010-09-29

Family

ID=37509125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005168376A Expired - Fee Related JP4551823B2 (ja) 2005-06-08 2005-06-08 電子部品用トレイの識別方法

Country Status (4)

Country Link
US (1) US7510081B2 (enExample)
JP (1) JP4551823B2 (enExample)
CN (1) CN100462291C (enExample)
TW (1) TW200710006A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120087601A1 (en) * 2008-05-22 2012-04-12 Blue Avocado Co. Shopping Bag System
US8541886B2 (en) * 2010-03-09 2013-09-24 Stats Chippac Ltd. Integrated circuit packaging system with via and method of manufacture thereof
CN112313160B (zh) * 2018-06-28 2023-06-13 松下知识产权经营株式会社 电子部件组、电容器、电子部件组的制造方法、读取方法以及读取装置
JP7304709B2 (ja) * 2019-02-19 2023-07-07 株式会社ディスコ 被加工物の加工方法
DE102019105869A1 (de) 2019-03-07 2020-09-10 Mahle International Gmbh Flüssigkeitsreibkupplung
CN109884455B (zh) * 2019-03-27 2021-03-19 环旭电子股份有限公司 承载盘组件和辨识系统
CN110626567B (zh) * 2019-11-01 2021-06-01 佛山市鼎科科技发展有限公司 一种半导体激光的封装结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567025U (enExample) * 1979-06-27 1981-01-22
JPH01164948U (enExample) * 1988-05-10 1989-11-17
JPH0266475A (ja) * 1988-09-01 1990-03-06 Tokyo Electron Ltd 半導体素子の検査方法
JP3263856B2 (ja) * 1991-09-02 2002-03-11 ソニー株式会社 半導体ウエハ用キャリヤ
JPH08244877A (ja) * 1995-03-03 1996-09-24 Oki Electric Ind Co Ltd 半導体素子の搬送及び保管用トレイ
JPH09188383A (ja) * 1996-01-04 1997-07-22 Toppan Printing Co Ltd 半導体部品収納用トレイ
US20040146602A1 (en) * 2000-11-28 2004-07-29 Garwood Anthony J.M. Continuous production and packaging of perishable goods in low oxygen environments
JP2001287785A (ja) * 2000-04-06 2001-10-16 Nec Yamagata Ltd 半導体部品収納用トレイ
JP2004284601A (ja) * 2003-03-19 2004-10-14 Renesas Technology Corp 半導体装置の搬送方法および実装方法ならびに包装方法およびそれに用いられる収容体の再利用方法
EP1638847B1 (en) * 2003-07-02 2015-09-30 United States Postal Service System and method for tracking shipment of items utilizing rfid-tags

Also Published As

Publication number Publication date
CN100462291C (zh) 2009-02-18
TWI298704B (enExample) 2008-07-11
TW200710006A (en) 2007-03-16
CN1876521A (zh) 2006-12-13
JP2006341873A (ja) 2006-12-21
US7510081B2 (en) 2009-03-31
US20060278563A1 (en) 2006-12-14

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