JP4547724B2 - Method for manufacturing internal electrode paste - Google Patents
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- JP4547724B2 JP4547724B2 JP29871498A JP29871498A JP4547724B2 JP 4547724 B2 JP4547724 B2 JP 4547724B2 JP 29871498 A JP29871498 A JP 29871498A JP 29871498 A JP29871498 A JP 29871498A JP 4547724 B2 JP4547724 B2 JP 4547724B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、セラミック層と交互に複数積層させて積層チップ部品の内部電極を形成する内部電極用ペーストの製造方法に関するものである。
【０００２】
【従来の技術】
通常、内部電極用ペーストは導電粉末，樹脂バインダー等の組成材料を計量調合し、それをローラやボールミル等を用いて均一に混合分散し、更に、スクリーン印刷し易い粘度に調整する工程を経て製造されている。
【０００３】
その通常通り製造された内部電極用ペーストを用い、セラミック層を１０μｍの厚み以上に形成したものには問題がなかったが、マイコン，その他の電子機器等に搭載される小型の積層チップ部品、特に、誘電体層を１０μｍ以下の厚みに形成する積層チップセラミックチコンデンサを製造するときには電気的短絡や耐電圧不良等から不良率の発生が高くなっている。
【０００４】
その問題点を種々検討したところ、導電粉末，樹脂バインダー等の組成材料を通常通り混合分散しても、粒子の凝結等により１０μｍ以上の固形分が生ずることを避けられず、この固形分の影響でセラミック層を１０μｍ以下の厚みに形成するものではピンホールやヒビ割れがセラミック層に生じ、電気的短絡や耐電圧不良等を生ずるものと判った。
【０００５】
その固形分の発生を防ぐにはペースト材料を長時間掛けて混合分散することが考えられるが、これでは製造能率の低下とコスト高を招くばかりでなく、内部電極用ペーストの粘度に影響を来し、また、時間を掛けても凝結粒子等を小さくするには限界がある。
【０００６】
【発明が解決しようとする課題】
本発明は、厚み：１０μｍ以下のセラミック層と内部電極を交互に複数積層させて積層チップ部品を製造するに、電極間のショートや耐電圧不良等の発生を抑えられる内部電極を形成可能な内部電極用ペーストの製造方法を提供することを目的とする。
【０００７】
また、本発明は工程の簡単な変更により、電極間のショートや耐電圧不良等の発生を抑えられる内部電極用ペーストとして製造可能な内部電極用ペーストの製造方法を提供することを目的とする。
【０００８】
それに加えて、本発明は電極間のショートや耐電圧不良等の発生を抑えられる内部電極用ペーストとして低コストで能率よく製造可能な内部電極用ペーストの製造方法を提供することを目的とする。
【０００９】
【課題を解決するための手段】
本願の請求項１に係る内部電極用ペーストの製造方法においては、内部電極用ペーストの製造工程中で、導電粉末，樹脂バインダー等の組成材料をペースト材料として混合分散してから、フィルターを用い、該ペースト材料から大きな固形分を取り除き、該ペースト材料により厚み：１０μｍ以下のセラミック層と交互に複数積層させて積層チップ部品の内部電極を形成する内部電極用ペーストを製造するに、
樹脂細線を縦，横線として所定のメッシュ目に綾織した１枚の綾織フィルターを用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにされている。
【００１０】
本願の請求項２に係る内部電極用ペーストの製造方法においては、樹脂細線を縦，横線としてメッシュ目：１５μｍに綾織した１枚の綾織フィルターを用いるようにされている。
【００１１】
本願の請求項３に係る内部電極用ペーストの製造方法においては、内部電極用ペーストの製造工程中で、導電粉末，樹脂バインダー等の組成材料をペースト材料として混合分散してから、フィルターを用い、該ペースト材料から大きな固形分を取り除き、該ペースト材料により厚み：１０μｍ以下のセラミック層と交互に複数積層させて積層チップ部品の内部電極を形成する内部電極用ペーストを製造するに、
樹脂細線を縦，横線として所定のメッシュ目に綾織した後、該メッシュ目を加熱処理で絞った１枚の綾織フィルターを用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにされている。
【００１２】
本願の請求項４に係る内部電極用ペーストの製造方法においては、樹脂細線を縦，横線としてメッシュ目：１５μｍに綾織した後、該メッシュ目を加熱処理で絞った１枚の綾織フィルターを用いるようにされている。
【００１３】
本願の請求項５に係る内部電極用ペーストの製造方法においては、内部電極用ペーストの製造工程中で、導電粉末，樹脂バインダー等の組成材料をペースト材料として混合分散してから、フィルターを用い、該ペースト材料から大きな固形分を取り除き、該ペースト材料により厚み：１０μｍ以下のセラミック層と交互に複数積層させて積層チップ部品の内部電極を形成する内部電極用ペーストを製造するに、
樹脂細線を縦，横線として所定のメッシュ目に綾織した綾織フィルターを２枚以上５枚以下重ねて用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにされている。
【００１４】
本願の請求項６に係る内部電極用ペーストの製造方法においては、樹脂細線を縦，横線としてメッシュ目：１５μｍに綾織した綾織フィルターを２枚以上５枚以下重ねて用いるようにされている。
【００１５】
【発明の実施の形態】
以下、添付図面を参照して説明すると、図示装置は内部電極用ペーストの製造工程中でペースト材料Ｐより少なくともセラミック層の厚みよりも大きな固形分を取り除く濾過装置として構成されている。その固形分の濾過は、導電粉末，樹脂バインダー等の組成材料を計量調合し、この組成材料をローラやロールミル等を用いて均一に混合分散し、更に、溶剤を添加させてスクリーン印刷し易い粘度に調整したペースト材料Ｐを得てから最終工程で行われる。
【００１６】
その濾過装置はフィルター１を濾過容器２に備え付けたもので、フィルター１は支持枠２０に張設固定することにより容器本体２１の上部側に着脱自在に備え付けられている。また、容器本体２１の側壁部には空気導管２２を備え、その空気導管２２とバキューム等の吸引装置３を接続することにより吸引圧を容器本体２１の内部に作用可能に構成されている。
【００１７】
フィルター１としてはテトロン等の樹脂細線を縦，横線とし、この縦線と横線とを互いに二本跨ぎに組み合わせた綾織製のものが用いられている。その綾織フィルターでは、平織よりも密度を高くするよう織成することができる。また、２００℃，２時間程度加熱処理することにより開き目を多少絞るよう形成できる。このフィルターは一枚で、または複数枚重ねて用いることができる。
【００１８】
そのフィルター１には、導電粉末，樹脂バインダー等の組成材料を分散混合したペースト材料から交互に積層形成される誘電体層の厚みよりも大きな固形分を取り除く目開きを有するものが備えられる。積層チップ部品の誘電体層を１０μｍ以下の厚みに形成するもので、誘電体層の厚みより大きな固形分を取り除くようメッシュ目：１５μｍ以下の目開きを有するものを備え付ければよい。
【００１９】
そのフィルター１によっては導電粉末，樹脂バインダー等の組成材料を分散混合したペースト材料を充填すると共に、吸引圧を容器本体２１の内部に作用させてペースト材料を濾過する。これにより、ペースト材料の濾過を迅速に行え、誘電体層の厚みより大きな固形分を取り除いた内部電極用ペーストとして最終的に製造できる。
【００２０】
その内部電極用ペーストは、セラミック粉末，樹脂バインダー，溶剤等を混合分散したセラミックペーストからセラミックシートを形成し、このセラミックシートのシート面にスクリーン印刷する導電性ペーストとして用いられる。また、その内部電極用ペーストを印刷したセラミックシートを複数積層することにより、セラミック層と交互に位置する積層チップ部品の内部電極として形成するのに用いられる。
【００２１】
その積層チップ部品では、内部電極がセラミック層の厚みより大きな粒子の凝縮等による固形分を含まないため、セラミック層のピンホールやヒビ割れによる電気的短絡や耐電圧不良等の発生を極めて少なく抑えることができる。
【００２２】
この有効性を確認するべく、従来例の内部電極用ペーストによる積層チップ部品と共に、テトロン４６０＃，メッシュ目：１５μｍの綾織フィルターを用いて濾過した内部電極用ペーストによる積層チップ部品について、ショート不良，耐電圧不良の発生を試料５０個分で検査したところ、次表１で示す通りであった。
【００２３】
その試料のセラミック層は厚み：１０μｍに形成し、また、各実施例ではペースト材料より１０μｍ以上の固形分を取り除いた。そのショート不良は抵抗値が２Ｖ電圧の印加で１０５Ω以下、耐電圧不良は抵抗値が１５０Ｖ電圧の印加で１０６Ω以下になるものを不良品として判断した。
【００２４】
【表１】
【００２５】
実施例１はテトロン４６０＃，メッシュ目：１５μｍの綾織フィルターを１枚用いた場合であり、従来例のショート不良率：２０％，耐電圧不良率：８％に対し、ショート不良率が１４％と６％も低減し、耐電圧不良率が６％と２％も低減した。
【００２６】
実施例２はテトロン４６０＃，メッシュ目：１５μｍのものを２００℃，２時間熱処理した綾織フィルターを１枚用いた場合であり、従来例に比べてショート不良率が８％と１２％も低減し、耐電圧不良率が４％と半分にまで低減した。これは綾織フィルターを熱処理したことによりメッシュの糸目を絞める効果があり、その糸目がペースト材料の充填による重みで拡大するのを防げることによる。
【００２７】
実施例３〜６は熱処理しないテトロン４６０＃，メッシュ目：１５μｍの綾織りフィルターを数枚重ねに用いた場合であり、実施例３は綾織フィルターを２枚重ねで用いたところ、従来例に比べてショート不良率が６％と１４％も低減し、耐電圧不良率が３％と半分以下にまで低減した。実施例４は綾織フィルターを３枚重ねで用いた場合で、従来例に比べてショート不良率が３％と１７％も低減し、耐電圧不良率が２％と６％も低減した。
【００２８】
実施例５は綾織フィルターを４枚重ねで用いた場合で、従来例に比べてショート不良率が２％と１８％も低減し、耐電圧不良率が２％と６％も低減した。実施例６は綾織フィルターを５枚重ねで用いた場合で、従来例に比べてショート不良率が２％と１８％も低減し、耐電圧不良率が１％と７％も低減した。
【００２９】
なお、綾織フィルターの複数枚重ねによる場合は１０枚までを行ったが、６枚を超えると、吸引装置を併用してもペースト材料の通りが悪くなり、処理能率が低下するため、最大枚数５枚までが適している。
【００３０】
【発明の効果】
以上の如く、本発明に係る内部電極用ペーストの製造方法に依れば、１０μｍ以下と厚みの薄いセラミック層を形成するものでも、内部電極形成用のペースト材料より少なくともセラミック層の厚みよりも大きな固形分を取り除くことにより、電極間のショートや耐電圧不良等の発生を抑えられる内部電極を形成可能な内部電極用ペーストとして得ることができる。
【図面の簡単な説明】
【図１】 本発明に係る内部電極用ペーストの製造方法を適用するペースト材料の濾過装置を示す説明図である。
【符号の説明】
Ｐ ペースト材料
１ フィルター[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing an internal electrode paste in which a plurality of ceramic layers are alternately stacked to form an internal electrode of a multilayer chip component.
[0002]
[Prior art]
In general, internal electrode paste is manufactured through a process of metering and mixing conductive powder, resin binder, and other composition materials, mixing and dispersing them uniformly using a roller, ball mill, etc., and adjusting the viscosity to make screen printing easy. Has been.
[0003]
There was no problem in using the paste for internal electrodes manufactured as usual and the ceramic layer was formed to a thickness of 10 μm or more, but small multilayer chip components mounted on microcomputers and other electronic devices, especially When a multilayer chip ceramic capacitor having a dielectric layer with a thickness of 10 μm or less is manufactured, the defect rate is high due to an electrical short circuit or a withstand voltage failure.
[0004]
As a result of various investigations on the problems, it is unavoidable that a solid content of 10 μm or more is generated due to particle condensation even if conductive materials such as conductive powder and resin binder are mixed and dispersed as usual. In the case where the ceramic layer is formed to a thickness of 10 μm or less, pinholes and cracks are generated in the ceramic layer, and it is found that an electrical short circuit or a withstand voltage failure occurs.
[0005]
In order to prevent the generation of the solid content, it is conceivable to mix and disperse the paste material over a long period of time, but this not only decreases the production efficiency and costs, but also affects the viscosity of the internal electrode paste. In addition, there is a limit to reducing the size of the condensed particles and the like over time.
[0006]
[Problems to be solved by the invention]
In the present invention, when a multilayer chip component is manufactured by alternately laminating a plurality of ceramic layers having a thickness of 10 μm or less and internal electrodes, an internal electrode capable of suppressing occurrence of short-circuit between electrodes or defective withstand voltage is formed. It aims at providing the manufacturing method of the paste for electrodes.
[0007]
It is another object of the present invention to provide a method for producing an internal electrode paste that can be produced as an internal electrode paste that can suppress the occurrence of short-circuiting between electrodes or defective withstand voltage by a simple change in the process.
[0008]
In addition, an object of the present invention is to provide a method for producing an internal electrode paste that can be efficiently produced at low cost as an internal electrode paste capable of suppressing the occurrence of short-circuit between electrodes or defective withstand voltage.
[0009]
[Means for Solving the Problems]
In the manufacturing method of the internal electrode paste according to claim 1 of the present application, in the manufacturing process of the internal electrode paste, a composition material such as a conductive powder and a resin binder is mixed and dispersed as a paste material, and then a filter is used. To produce a paste for internal electrodes that removes a large solid content from the paste material and alternately laminates a plurality of ceramic layers having a thickness of 10 μm or less with the paste material to form an internal electrode of a multilayer chip component.
A single twill filter is used in which fine resin lines are vertical and horizontal lines, and a predetermined mesh is used to remove a solid content larger than the thickness of the ceramic layer from the paste material.
[0010]
In the manufacturing method of the internal electrode paste according to claim 2 of the present application, one twill filter is used in which the fine resin lines are vertical and horizontal lines and the mesh is 15 μm.
[0011]
In the internal electrode paste manufacturing method according to claim 3 of the present application, in the internal electrode paste manufacturing process, a composition material such as conductive powder and resin binder is mixed and dispersed as a paste material, and then a filter is used. To produce a paste for internal electrodes that removes a large solid content from the paste material and alternately laminates a plurality of ceramic layers having a thickness of 10 μm or less with the paste material to form an internal electrode of a multilayer chip component.
After twilling a predetermined mesh with fine resin wires as vertical and horizontal lines, using a single twill filter with the mesh squeezed by heat treatment, remove at least a solid content larger than the thickness of the ceramic layer from the paste material. Has been.
[0012]
In the manufacturing method of the internal electrode paste according to claim 4 of the present application, a single twill filter is used in which the fine resin lines are arranged vertically and horizontally and mesh mesh: 15 μm, and then the mesh mesh is squeezed by heat treatment. Has been.
[0013]
In the internal electrode paste manufacturing method according to claim 5 of the present application, in the internal electrode paste manufacturing process, a composition material such as a conductive powder and a resin binder is mixed and dispersed as a paste material, and then a filter is used. To produce a paste for internal electrodes that removes a large solid content from the paste material and alternately laminates a plurality of ceramic layers having a thickness of 10 μm or less with the paste material to form an internal electrode of a multilayer chip component.
Two or more twill filters twilled in a predetermined mesh with thin resin lines as vertical and horizontal lines are used in an overlapping manner to remove at least a solid content larger than the thickness of the ceramic layer from the paste material.
[0014]
In the internal electrode paste manufacturing method according to claim 6 of the present application, two or more and five or less twill filters, which are twilled in a mesh pattern of 15 μm with the fine resin wires as vertical and horizontal lines, are used.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Referring to the accompanying drawings, the illustrated apparatus is configured as a filtration apparatus that removes a solid content larger than the thickness of the ceramic layer from the paste material P during the manufacturing process of the internal electrode paste. For the filtration of the solid content, a composition material such as a conductive powder and a resin binder is weighed and mixed, and the composition material is uniformly mixed and dispersed using a roller, a roll mill, or the like, and a solvent is added to facilitate viscosity for screen printing. It is performed in the final step after obtaining the paste material P adjusted to.
[0016]
The filter device includes a filter 1 mounted on a filter container 2, and the filter 1 is detachably mounted on the upper side of the container body 21 by being stretched and fixed to a support frame 20. An air conduit 22 is provided on the side wall of the container main body 21, and the suction pressure can be applied to the inside of the container main body 21 by connecting the air conduit 22 and a suction device 3 such as a vacuum.
[0017]
The filter 1 is made of twill made of fine resin lines such as Tetron as vertical and horizontal lines, and the vertical lines and horizontal lines are combined across two lines. The twill filter can be woven so as to have a higher density than a plain weave. Moreover, it can form so that an opening may be restrict | squeezed somewhat by heat-processing at 200 degreeC for about 2 hours. This filter can be used singly or as a plurality.
[0018]
The filter 1 includes a filter having an opening that removes a solid content larger than the thickness of a dielectric layer that is alternately laminated from a paste material in which a composition material such as conductive powder and a resin binder is dispersed and mixed. What is necessary is just to equip the thing which forms the dielectric material layer of a multilayer chip component to 10 micrometers or less, and has a mesh size: 15 micrometers or less opening so that solid content larger than the thickness of a dielectric material layer may be removed.
[0019]
Depending on the filter 1, the paste material in which a composition material such as conductive powder and resin binder is dispersed and mixed is filled, and the suction material is applied to the inside of the container body 21 to filter the paste material. As a result, the paste material can be quickly filtered and finally produced as an internal electrode paste from which a solid content larger than the thickness of the dielectric layer is removed.
[0020]
The internal electrode paste is used as a conductive paste in which a ceramic sheet is formed from a ceramic paste in which ceramic powder, a resin binder, a solvent, and the like are mixed and dispersed, and screen printing is performed on the sheet surface of the ceramic sheet. Further, a plurality of ceramic sheets on which the internal electrode paste is printed are laminated to form an internal electrode of a multilayer chip component that is alternately positioned with the ceramic layer.
[0021]
In the multilayer chip component, the internal electrode does not contain solid content due to condensation of particles larger than the thickness of the ceramic layer, so the occurrence of electrical shorts and breakdown voltages due to pinholes and cracks in the ceramic layer is extremely low. be able to.
[0022]
In order to confirm this effectiveness, together with the multilayer chip part made of the internal electrode paste of the conventional example, Tetron 460 #, the mesh: the multilayer chip part made of the internal electrode paste filtered using a 15 μm twill filter, When the occurrence of a withstand voltage failure was inspected for 50 samples, it was as shown in Table 1 below.
[0023]
The ceramic layer of the sample was formed to a thickness of 10 μm, and in each example, a solid content of 10 μm or more was removed from the paste material. The short-circuit defect was judged as a defective product when the resistance value was 10 5 Ω or less when a 2 V voltage was applied, and the withstand voltage defect was a resistance value of 10 6 Ω or less when a 150 V voltage was applied.
[0024]
[Table 1]
[0025]
Example 1 is a case where a Tetron 460 #, mesh mesh: one 15 μm twill filter is used. The short-circuit failure rate is 20% and the withstand voltage failure rate is 8% of the conventional example, and the short-circuit failure rate is 14%. 6%, and the withstand voltage failure rate was reduced by 6% and 2%.
[0026]
Example 2 is a case of using one twill filter, Tetron 460 #, mesh size: 15 μm heat-treated at 200 ° C. for 2 hours, and the short-circuit defect rate is reduced by 8% and 12% compared to the conventional example. The withstand voltage failure rate was reduced to 4% and half. This is because heat treatment of the twill weave filter has the effect of narrowing the mesh threads and prevents the threads from being expanded by the weight of the paste material.
[0027]
Examples 3 to 6 are cases where Tetron 460 #, which is not heat-treated, and meshes: 15 μm twill filters are used for several layers, and Example 3 is a case where two twill filters are used for comparison. As a result, the short-circuit failure rate was reduced by 6% and 14%, and the withstand voltage failure rate was reduced to 3% or less. Example 4 was a case where three twill filters were used, and the short-circuit failure rate was reduced by 3% and 17% and the withstand voltage failure rate was reduced by 2% and 6% compared to the conventional example.
[0028]
Example 5 was a case where four twill filters were used, and the short-circuit failure rate was reduced by 2% and 18% and the withstand voltage failure rate was reduced by 2% and 6% compared to the conventional example. Example 6 was a case where five twill filters were used, and the short-circuit failure rate was reduced by 2% and 18% and the withstand voltage failure rate was reduced by 1% and 7% compared to the conventional example.
[0029]
In the case of using a plurality of twill weave filters, up to 10 sheets were used. However, if the number of sheets exceeds 6, the paste material becomes poor even when a suction device is used together, and the processing efficiency is lowered. Up to one is suitable.
[0030]
【The invention's effect】
As described above, according to the method for manufacturing an internal electrode paste according to the present invention, even a ceramic layer having a thickness as thin as 10 μm or less is at least larger than the thickness of the ceramic layer than the internal electrode forming paste material. By removing the solid content, it can be obtained as an internal electrode paste capable of forming an internal electrode capable of suppressing the occurrence of short-circuiting between electrodes or defective withstand voltage.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing a paste material filtration device to which an internal electrode paste manufacturing method according to the present invention is applied.
[Explanation of symbols]
P Paste material 1 Filter
Claims (5)
樹脂細線を縦，横線としてメッシュ目：１５μｍに綾織した１枚の綾織フィルターを用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにしたことを特徴とする内部電極用ペーストの製造方法。In the manufacturing process of the internal electrode paste, a composition material such as conductive powder and resin binder is mixed and dispersed as a paste material, and then a large solid content is removed from the paste material using a filter. The thickness of the paste material is 10 μm. In the method for producing an internal electrode paste for alternately laminating the following ceramic layers and forming an internal electrode of a laminated chip component,
Internal electrode paste characterized by using a single twill filter with a fine mesh of resin fine lines as vertical and horizontal lines and a twill weave of 15 μm to remove at least a solid content larger than the thickness of the ceramic layer from the paste material. Manufacturing method.
樹脂細線を縦，横線として所定のメッシュ目に綾織した後、該メッシュ目を加熱処理で絞った１枚の綾織フィルターを用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにしたことを特徴とする内部電極用ペーストの製造方法。In the manufacturing process of the internal electrode paste, a composition material such as conductive powder and resin binder is mixed and dispersed as a paste material, and then a large solid content is removed from the paste material using a filter. The thickness of the paste material is 10 μm. In the method for producing an internal electrode paste for alternately laminating the following ceramic layers and forming an internal electrode of a laminated chip component,
After twilling a predetermined mesh with fine resin wires as vertical and horizontal lines, using a single twill filter with the mesh squeezed by heat treatment, remove at least a solid content larger than the thickness of the ceramic layer from the paste material. A process for producing an internal electrode paste, characterized in that
樹脂細線を縦，横線として所定のメッシュ目に綾織した後、該メッシュ目を加熱処理で絞った綾織フィルターを２枚以上５枚以下重ねて用い、上記ペースト材料から少なくともセラミック層の厚みよりも大きな固形分を取り除くようにしたことを特徴とする内部電極用ペーストの製造方法。In the manufacturing process of the internal electrode paste, a composition material such as conductive powder and resin binder is mixed and dispersed as a paste material, and then a large solid content is removed from the paste material using a filter. The thickness of the paste material is 10 μm. In the method for producing an internal electrode paste for alternately laminating the following ceramic layers and forming an internal electrode of a laminated chip component,
After twilling a predetermined mesh with fine resin lines as vertical and horizontal lines, use two or more twill filters with the meshes squeezed by heat treatment, and use at least the thickness of the ceramic layer from the paste material. A method for producing an internal electrode paste, characterized in that solid content is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29871498A JP4547724B2 (en) | 1998-10-20 | 1998-10-20 | Method for manufacturing internal electrode paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29871498A JP4547724B2 (en) | 1998-10-20 | 1998-10-20 | Method for manufacturing internal electrode paste |
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|---|---|
| JP2000133065A JP2000133065A (en) | 2000-05-12 |
| JP4547724B2 true JP4547724B2 (en) | 2010-09-22 |
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| JP29871498A Expired - Fee Related JP4547724B2 (en) | 1998-10-20 | 1998-10-20 | Method for manufacturing internal electrode paste |
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| JP4051861B2 (en) | 2000-06-12 | 2008-02-27 | 株式会社村田製作所 | Method for manufacturing thick film forming paste, thick film forming paste, and filtration device |
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| JPH09290454A (en) * | 1996-04-26 | 1997-11-11 | Hitachi Cable Ltd | Extrusion molding of plastic composition and manufacture of plastic insulated electric wire and cable |
| JP3601226B2 (en) * | 1997-01-16 | 2004-12-15 | 松下電器産業株式会社 | Gravure firing ink |
| JP3744167B2 (en) * | 1998-01-05 | 2006-02-08 | 株式会社村田製作所 | Manufacturing method of thick film forming paste |
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