JP4546553B2 - Glow discharge drilling apparatus and glow discharge drilling method - Google Patents

Description

  The present invention relates to a glow discharge excavation apparatus and a glow discharge excavation method capable of excavating well in accordance with characteristics of a sample to be excavated when a sample surface is excavated by sputtering accompanying glow discharge.

  Conventionally, a secondary electron microscope (SEM) is sometimes used to visually observe the structure and structure of a sample. In order to observe the cross-sectional structure and internal structure of a sample with a secondary electron microscope, it is necessary to clean the observation surface of the sample as a pretreatment for observation. For example, when observing a cross-section of a sample, the sample is broken and observed. Polishing is performed until a cross-section to be a surface is exposed and the exposed cross-section is clean and has a certain level of smoothness.

  The polishing of the sample is generally performed using an abrasive, but there is a concern that the working environment is deteriorated due to the influence of the abrasive and polishing powder generated by the polishing operation. In addition, since the polishing work is time-consuming, it takes time for pretreatment until the sample is observed with a secondary electron microscope. Furthermore, depending on the structure of the sample to be observed, it may not be possible to obtain a surface suitable for observation even if polishing is performed.For example, when the sample is composed of a hard material and a soft material such as glass and gold, By polishing, a soft material is deformed and flows, and it is very difficult to form a good observation surface.

In order to avoid the above-mentioned problems due to sample polishing and obtain a clean observation surface of the sample, the surface to be observed of the sample is scraped off with the power of sputtering by glow discharge instead of polishing, and the sample surface is made to the desired smoothness An apparatus and method for finishing are disclosed in the following Patent Documents 1 to 3.
JP 54-131539 A JP 2002-310959 A JP 2004-61163 A

  In the apparatus according to Patent Document 1 described above, an inert gas for glow discharge (for example, argon gas) is introduced into a sufficiently large vacuum chamber with respect to the sample, so that the introduced argon gas is smoothly directed toward the sample. It is difficult to guide. Therefore, when the supply amount of argon gas to the excavation site of the sample is insufficient, there is a problem that it is difficult to cause sputtering that can efficiently scrape the sample surface.

  Furthermore, in the apparatus according to Patent Document 2, the end surface of the cylindrical discharge electrode is disposed so as to face the sample, but since a predetermined gap is provided between the end surface of the discharge electrode and the sample, Since the argon gas supplied into the discharge electrode flows out from the gap, there is a problem that the power of sputtering accompanying glow discharge cannot be concentrated on the sample surface, and the efficiency of sample excavation cannot be improved. Note that the method according to Patent Document 3 only discloses that the element concentration is measured using secondary ion mass spectrometry on the surface cut using glow discharge.

  In addition, when the sample to be excavated is made of a material with a low melting point such as various rubbers, synthetic resins, and organic materials such as organic polymers, the sample melts due to heat generated by glow discharge to form a good observation surface. There is a problem that it cannot be done. Furthermore, it is very difficult to prevent the sample from being broken due to the power of sputtering accompanying glow discharge with respect to a sample formed of a material that is easily broken when subjected to a certain external force such as glass and ceramic. Furthermore, when the sample is formed of a plurality of materials such as a hard material and a soft material, there is a problem that it is generally difficult to excavate optimally by glow discharge in accordance with various material characteristics. In addition, the observation of the structure of a metal material or the like having a crystal structure is generally performed in a wet manner, but there is a problem that the conventional method for forming an observation surface cannot clearly recognize a difference in height due to crystals.

  The present invention has been made in view of such a problem, and forms a small space surrounding a portion facing a sample electrode, and supplies an inert gas to the space, thereby supplying the inert gas. An object of the present invention is to provide a glow discharge excavation apparatus and a glow discharge excavation method capable of excavating a sample surface with a sufficient amount secured.

Further, the present invention reduces the sample load against the glow discharge by intermittently supplying power for generating the glow discharge, and the sample and the crystal structure metal formed of a material having a low melting point or a fragile material An object of the present invention is to provide a glow discharge excavation apparatus and a glow discharge excavation method capable of forming a good observation surface for a material or the like.
Furthermore, an object of the present invention is to provide a glow discharge excavation apparatus and a glow discharge excavation method that realize excavation according to various sample characteristics by making it possible to change the intermittent power supply state.

  In order to solve the above-described problems, a glow discharge excavation apparatus according to the present invention is a glow discharge drill generated by supplying power to an electrode and a sample in an atmosphere in which an inert gas is supplied to the sample opposed to the electrode. In a glow discharge excavation apparatus for excavating a sample by electric discharge, a closing member that surrounds and closes a portion where the electrode and the sample face each other, a gas supply unit that supplies an inert gas to a space closed by the closing member, and a high frequency A high-frequency power generation unit that generates high-frequency power to apply a voltage to the sample and the electrode, means for receiving the number of times of power supply per second by the high-frequency power generation unit, and the number of times of power supply per second received by the means The high frequency voltage generated by the high frequency power generation unit is intermittently applied to the sample and the electrode to satisfy a predetermined smoothness, Characterized in that it comprises a intermittent feeding means for forming a sample surface to obtain a surface image using an instrument.

  A glow discharge excavation apparatus according to the present invention is a glow discharge for excavating a sample with a glow discharge generated by supplying power to the electrode and the sample in an atmosphere in which an inert gas is supplied to the sample opposed to the electrode. In a drilling apparatus, a closing member that surrounds and closes a portion where the electrode and the sample face each other, and a bottom plate portion that contacts the closing member, and a sample that closes a hole formed in the bottom plate portion is held inside. A sample holder, a gas supply unit that supplies an inert gas to the space closed by the closing member, a high-frequency power generation unit that generates high-frequency power to apply a high-frequency voltage to the sample and the electrode, A means for receiving the number of times of power supply per second by the high-frequency power generator, and a high-frequency voltage generated by the high-frequency power generator based on the number of times of power supply per second received by the means And intermittently feeding means for intermittently applied to the serial sample and the electrode, characterized in that it comprises means for excavating the exposed sample surface in the space of the sample.

  A glow discharge excavation apparatus according to the present invention includes continuous power supply means for continuously supplying power, and switching means for switching between continuous power supply performed by the continuous power supply means and intermittent power supply performed by the intermittent power supply means. It is characterized by providing.

  The glow discharge excavator according to the present invention includes a power supply state changing unit that changes a state related to intermittent power supply performed by the intermittent power supply unit.

  The glow discharge excavator according to the present invention is characterized in that the power supply state changing means changes a duty ratio related to intermittent power supply.

  The glow discharge excavation apparatus according to the present invention is characterized in that the power supply state changing means changes a power value related to intermittent power supply.

  The glow discharge excavator according to the present invention is characterized in that the means for receiving the number of times of power supply per second is configured to receive the number of times of power supply per second in the range of 30 Hz to 30000 Hz.

  The glow discharge excavation method according to the present invention supplies an inert gas to a sample disposed opposite to an electrode, supplies power to the electrode and the sample to generate a glow discharge, and excavates the sample with the generated glow discharge. In the glow discharge excavation method, a portion where the electrode and the sample face each other is closed and enclosed by a closing member, and a high-frequency power is generated by a high-frequency power generation unit to apply a high-frequency voltage to the sample and the electrode. Based on the received number of times of power supply per second in an atmosphere in which an inert gas is supplied to the space formed by being closed by the closing member and receiving the number of times of power supply per second by the power generation unit, The generated high-frequency voltage is intermittently applied to the sample and the electrode, the sample surface exposed in the space of the sample is excavated, and a predetermined smoothness is obtained. Plus, and forming a sample surface to obtain a surface image using a surface analysis instrument.

  The glow discharge excavation method according to the present invention supplies an inert gas to a sample disposed opposite to an electrode, supplies power to the electrode and the sample to generate a glow discharge, and excavates the sample with the generated glow discharge. In the glow discharge excavation method, a sample that has a bottom plate portion that is in contact with the closing member and is closed by surrounding a portion where the electrode and the sample face each other with a closing member, and that closes a hole formed in the bottom plate portion. The sample is held by a sample holder held inside, and a high frequency power generator generates high frequency power to apply a high frequency voltage to the sample and the electrode. The number of times of power supply per second by the high frequency power generator Based on the received number of times of power supply per second in the atmosphere in which an inert gas is supplied to the space formed by being closed by the closing member, the high-frequency power generation unit A high-frequency voltage generated Ri intermittently applied to the sample and the electrode, characterized by drilling the exposed sample surface in the space of the sample.

  In the present invention, the portion where the electrode and the sample face each other is closed to form a small space, and the inert gas is supplied to the space, so that the inert gas can be reliably supplied to the sample. Become. As a result, sputtering accompanying glow discharge also occurs so as to concentrate on the sample in a closed space, so that the sample can be excavated efficiently by sputtering and the accuracy of excavation can be improved.

  Furthermore, in the present invention, since power feeding is performed intermittently, the occurrence of sputtering due to glow discharge becomes intermittent. Therefore, the load on the sample that receives the power of sputtering is also reduced, so even if the sample is formed of a material that is easily melted, even if it is formed of a material that is easily destroyed by an external force above a certain level, the load on the sample is reduced. It is possible to form a surface suitable for observation by excavating the sample satisfactorily. Note that intermittent power supply can be applied when either a DC voltage or a high-frequency (AC) voltage is applied.

  In the present invention, since it is possible to switch between continuous power supply and intermittent power supply, excavation without breaking the sample by switching the power supply mode according to the characteristics of the sample, good observation A surface can be formed. Note that the two power supply modes can be switched even during excavation. For example, by supplying continuous power during the first half of the excavation time and intermittent power supply during the second half of the excavation time, a hard material can be applied near the surface. On the other hand, it is effective for a sample having a structure having a soft material at a position away from the surface in the depth direction.

  In the present invention, excavation processing that matches the characteristics of the sample is realized by switching between continuous power supply and intermittent power supply even for devices that excavate the sample surface by glow discharge in the excavation processing chamber. Thus, a good observation surface can be formed.

In the present invention, since the state related to intermittent power feeding is changed, it becomes possible to perform excavation processing that is more finely matched to the characteristics of the sample, and an observation surface suitable for structural observation with a secondary electron microscope, etc. Can be easily formed.
In the present invention, it is possible to change the state related to intermittent power supply to a device for excavating the sample surface by glow discharge in the excavation processing chamber, so that glow discharge can be performed in consideration of the characteristics of the sample. The excavation process can be performed with fine adjustment.

  In the present invention, since the number of times of power supply per unit time, that is, the frequency related to intermittent power supply can be changed, the sample surface can be excavated by reliably avoiding dissolution and destruction of the sample, and the like. Good excavation can be performed even for samples containing these materials. In addition, it is preferable that the frequency related to power supply can be changed even during excavation. Especially for a sample having a complicated structure, the frequency is appropriately changed according to the degree of excavation, and the material characteristics to be excavated It is preferable to perform excavation processing adapted to the above.

In the present invention, since the duty ratio related to intermittent power supply is changed, the optimum glow discharge can be generated according to various sample characteristics, and the duty ratio is adjusted so that the sample does not melt or break. Can be excavated. It is preferable that the duty ratio can be changed even during excavation.
In the present invention, since the power value related to intermittent power feeding is changed, the sample can be excavated by adjusting the power value according to the sample to generate glow discharge. In particular, when the sample is composed of a plurality of materials having different characteristics, changing the power value during excavation is suitable for good excavation.

In the present invention, since a small space is formed and an inert gas is supplied to the space, the inert gas can be reliably supplied to the sample, a good sample excavation can be realized, and power supply can be performed. By performing intermittently, the power of sputtering can be reduced, and excavation can be performed without trouble even on samples that are easily melted and samples that are easily broken.
In the second invention, since it is possible to switch between continuous power supply and intermittent power supply, optimal excavation can be performed in accordance with the characteristics of the sample.

  In the present invention, excavation processing that matches the characteristics of the sample is realized by switching between continuous power supply and intermittent power supply even for devices that excavate the sample surface by glow discharge in the excavation processing chamber. it can.

In the present invention, excavation processing that matches the characteristics of the sample more precisely can be performed by changing the state related to intermittent power feeding.
In the present invention, it is possible to change the state related to intermittent power supply to a device for excavating the sample surface by glow discharge in the excavation processing chamber, so that glow discharge can be performed in consideration of the characteristics of the sample. The excavation process can be performed after performing such adjustments in detail.

In the present invention, excavation processing that flexibly supports various sample characteristics can be performed by changing the frequency related to intermittent power feeding.
In the present invention, since the duty ratio related to intermittent power feeding is changed, the optimum excavation process according to the sample characteristics can be performed.
In the present invention, since the power value related to intermittent power feeding is changed, excavation processing in consideration of the characteristics of the sample can be performed.

  FIG. 1 shows the overall configuration of a glow discharge excavator 1 according to an embodiment of the present invention. The glow discharge excavation apparatus 1 includes a glow discharge tube 2 that generates glow discharge with respect to a sample S to be excavated, a power supply unit 4 that supplies high-frequency power, and a computer 7 that performs control related to power supply.

  The power supply unit 4 includes a generator 6 and a matching box 5 that are connected to an AC power supply AC (220 V in this embodiment) and generate high-frequency power. Further, in FIG. 1, a portion surrounded by a broken line indicates peripheral devices that do not belong to the essential configuration of the glow discharge excavator 1, and the peripheral devices include vacuum evacuation for evacuating the inside of the glow discharge tube 2. The apparatus 8 includes a gas supply adjusting unit 9 and a gas supply source 10 for supplying an inert gas (argon gas) to the inside of the glow discharge tube 2 after evacuation. The gas supply adjusting unit 9 includes a valve for adjusting the flow rate, and the gas supply source 10 corresponds to a cylinder filled with an inert gas such as argon gas or a mixed gas of inert gas.

  FIG. 2 is a cross-sectional view showing the configuration of the glow discharge tube 2. The glow discharge tube 2 is configured by combining a short cylindrical lamp body 11, an anode 12, a ceramic member 13, and a pressing block 15.

  The lamp body 11 has a recess 11b for attaching the anode 12 at the center of the end surface 11a to which the pressing block 15 is combined, and a center hole 11c is formed in the center of the recess 11b. The lamp body 11 is provided with a plurality of suction holes 11e and 11f for evacuation from the peripheral wall portion 11d toward the center. Some of the suction holes 11e communicate with the center hole 11c, and the other suction holes 11f are recessed. It communicates with the part 11b side. Further, the lamp body 11 is formed so that a gas supply hole 11g for supplying an inert gas communicates with the center hole 11c from the peripheral wall portion 11d toward the center.

  The anode 12 housed in the recess 11b of the lamp body 11 has a shape in which the cylindrical portion 12b protrudes from the center of the disc portion 12a, and a through hole 12c that penetrates the disc portion 12a from the inside of the cylindrical portion 12b is formed. Has been established. Further, a hole 12d is also formed in the disc portion 12. When the anode 12 is attached to the recess 11 b of the lamp body 11, it becomes a ground potential through the lamp body 11. Note that the first O-ring (seal member) 16 is provided between the lamp body 11 and the anode 12 in order to maintain the hermeticity of the center hole 11c of the lamp body 11 and the through hole 12c of the anode 12 in a state where the anode 12 is housed. Is attached.

  The ceramic member 13 disposed so as to cover the anode 12 is a thick disk-shaped member, has a protruding flange portion 13d covering the disk portion 12a of the anode 12, and is provided at a central location. Forms an insertion hole 13c through which the cylindrical portion 12b of the anode 12 is inserted. The ceramic member 13 has a ring groove 13b for mounting an O-ring on the end surface 13a on the exposed side. The ceramic member 13 is disposed with respect to the disk portion 12a of the anode 12 via the heat-resistant first insulator 17, and in the disposed state, the insertion hole 13c of the ceramic member 13 and the cylindrical portion 12b of the anode 12 A predetermined gap is formed between them, and the tip 12e of the cylindrical portion 12a does not protrude from the end face 13a of the ceramic member 13. A second O-ring 18 is also attached between the first insulator 17 and the disc portion 12a of the anode 12 in order to maintain hermeticity.

  The pressing block 15 for fixing the anode 12 and the ceramic member 13 to the lamp body 11 is an annular member, and the flange portion 13d of the ceramic member 13 is pressed toward the lamp body 11 by the protruding portion 15a on the inner peripheral side. I have to. The pressing block 15 itself is attached to the end surface 11a of the lamp body 11 with a bolt. Further, a heat-resistant second insulator 19 is interposed between the protruding portion 15 a of the pressing block 15 and the flange portion 13 d of the ceramic member 13.

  On the other hand, the sample S to be excavated attached to the glow discharge tube 2 is arranged so that the sample surface Sa abuts on a third O-ring 20 (corresponding to a closing member) attached to the end surface 13a of the ceramic member 13. Further, in this state, the oscillator 3 is pressed against the back surface Sd of the sample S, and the sample S is pressed toward the glow discharge tube 2 side. As a result, a closed space K is formed where the excavation surface Sa of the sample S and the tip 12e of the cylindrical portion 12b of the anode 12 face each other are surrounded by the third O-ring 20. As shown in FIG. 1, the oscillator 3 is connected to the power supply unit 4 by a power supply line D, and presses the sample S against the glow discharge tube 2 with an optimal pressing force by a predetermined locking means (not shown). is doing.

  In the glow discharge tube 2 configured as described above, the suction holes 11 e and 11 f of the lamp body 11 are connected to the vacuuming device 8 shown in FIG. 1, and the gas supply hole 11 g is connected to the gas supply adjusting unit 9. Therefore, when the vacuuming device 8 performs vacuuming, the space K is evacuated through the suction holes 11 e and 11 f, the center hole 11 c, and the through hole 12 c of the anode 12. In addition, when the gas supply adjusting unit 9 starts gas supply in a state where the space K is evacuated, an inert gas is supplied to the space K through the gas supply hole 11g, the center hole 11c, and the through hole 12c of the anode 12. The At this time, since the space K is closed by the third O-ring 20 and has a small volume, sufficient inert gas is supplied to the space K. In the glow discharge tube 2, the gas supply hole 11g, the center hole 11c, and the through hole 12c of the anode 12 function as a gas supply part (gas supply path) to the space K.

  FIG. 3 shows the internal configuration of the generator 6 constituting the power supply unit 4. The generator 6 includes a high frequency power generation unit 6a, a control unit 6b, and a power measurement unit 6c. The high frequency power generation unit 6a is connected to the AC power supply AC and generates high frequency power so that an alternating current (high frequency) voltage that changes to positive (+) and negative (−) shown in FIG. 4 can be applied to the sample S and the anode 12. . The high-frequency power generation unit 6a is connected to the control unit 6b through the first internal connection line 6d, and adjusts the output mode and power value related to the high-frequency power under the control of the control unit 6b. In addition, the high frequency electric power generation part 6a of this embodiment is producing | generating the electric power which consists of a high frequency voltage of 13.56 MHz.

  The control unit 6b is configured by an IC (integrated circuit) and is connected to the computer 7 through the first connection cord L1. The control unit 6b performs continuous power supply based on various signals output from the computer 7 or intermittent power supply. The output mode of the high frequency power generation unit 6a is controlled based on the determination result.

  FIG. 5A is a graph showing a first output mode by the control unit 6b, and continuously outputs high-frequency power (power value P) within a predetermined time to the sample S and the anode continuously. In this mode, a high-frequency voltage is applied (hereinafter, this mode is referred to as a continuous mode). FIG. 5B is a graph showing the second output mode by the control unit 6b, which outputs high-frequency power (power value P) in a pulsed (on / off) manner within a predetermined time. In this mode, intermittent high frequency voltage is applied to the sample S and the anode 12 (hereinafter, this mode is referred to as intermittent mode).

  In the intermittent mode, the control unit 6b alternately performs power supply and power supply suspension by performing a pulse-like process with an internal IC as an intermittent power supply unit. By such processing, high-frequency power is output at the power supply time T1 corresponding to the bar-shaped protruding portion shown in FIG. 5B, and the power supply time T1 is subtracted from the unit time T2 including one power supply and power supply suspension. The output of high-frequency power is stopped after a long time.

  Further, the control unit 6b performs switching between the above-described continuous mode and intermittent mode based on a signal output from the computer 7 as a switching unit. Further, in the intermittent mode, the control unit 6b functions as a power supply state changing unit that changes the state related to intermittent power supply, and the number of times of power supply (power supply frequency) per unit time (one second) and the duty ratio related to intermittent power supply. And the power value of intermittent power supply can be changed.

  Note that the control unit 6b can adjust the power supply frequency in the range of about 30 Hz to about 30000 Hz with respect to the change of the power supply frequency, and when the power supply frequency is changed, in the graph of FIG. (Time difference between T2 and T1) changes. As for the change of the duty ratio, the ratio (T1 / T2) occupied by one power supply time T1 to the unit time T2 during intermittent power supply can be adjusted as appropriate.

  Further, as the excavation of the sample S progresses, the distance between the sample S and the tip 12e of the anode 12 becomes longer, and the impedance value related to the sample S changes at any time. 6b is doing.

  Specifically, the control unit 6b calculates the difference between the output value Pf and the reflection value Pr transmitted from the power measurement unit 6c described later, and the high frequency power generated by the high frequency power generation unit 6a based on the calculated difference. Control is performed to change the power value (output value Pf) of the traveling wave fed to the sample S. Note that the control unit 6b adjusts the output value Pf so that the calculated difference (Pf−Pr) is constant. In this embodiment, the calculated difference (Pf−Pr) is transmitted from the computer 7 described later. The output value Pf generated by the high-frequency power generation unit 6a is adjusted by software processing of an IC built in the control unit 6b so as to be equal to the reference power value that has been performed.

  As described above, the control unit 6b performs soft adjustment, so that appropriate power supply can be performed in response to a change in the impedance value of the sample S in the intermittent mode. The control unit 6b performs adjustment corresponding to the change in the impedance value of the sample S in the intermittent mode. In the continuous mode, the matching box 5 performs adjustment as described later.

  Returning to FIG. 3, the power measurement unit 6 c of the generator 6 is connected to the control unit 6 b and the high-frequency power generation unit 6 a by the second and third internal connection lines 6 e and 6 f. The power measuring unit 6c detects the output value Pf that is the power value of the traveling wave of the high-frequency power that is generated by the high-frequency power generation unit 6a and travels toward the oscillator 3 shown in FIG. The reflection value Pr, which is the power value of the incoming reflected wave, is detected, and the detected value is transmitted to the control unit 6b.

  On the other hand, as shown in FIG. 6, the matching box 5 of the power supply unit 4 includes a variable capacitor 5a that adjusts the output form of the high-frequency power generated by the generator 6 in the continuous mode, and a motor 5b that adjusts the electric capacity of the variable capacitor 5a. And a capacitor controller 5c for controlling the driving of the motor 5b.

  The variable capacitor 5a can change its own electric capacity according to the driving of the motor 5b, and the module and the phase are adjusted by changing the electric capacity. The capacitor control unit 5c is connected to the computer 7 by the second connection cord L2, and controls the driving of the motor 5b based on the notification signal for setting the intermittent mode transmitted from the computer 7 to the matching box 5. .

  Specifically, when the notification signal of the intermittent mode is received, the capacitor control unit 5c performs control to maintain the motor 5b in a constant state so that the electric capacity of the variable capacitor 5a is fixed. Therefore, the high-frequency power module and phase are not adjusted in the matching box 5 in the intermittent mode. Further, when the notification signal of the intermittent mode is not received, that is, when the continuous mode is set, the drive of the motor 5b is controlled so that the reflection value Pr from the sample S is minimized, and the electric capacity of the variable capacitor 5a is increased. The capacitor control unit 5c performs control to be changed. If the reflection value Pr is minimum, the capacitor controller 5c does not perform control to change the electric capacity of the variable capacitor 5a.

  Further, the computer 7 shown in FIG. 1 is provided with an interface board 7b to which a first connection cord L1 extending from the generator 6 and a second connection cord L2 extending from the matching box 5 are connected. Are connected to an internal bus 7f to which a CPU 7a, a RAM 7c, a ROM 7d, and a hard disk device 7e are connected. A monitor unit 7g is connected to the internal bus 8a via a monitor connection line L3. The RAM 7c temporarily stores data associated with various control processes performed by the CPU 7a, the ROM 7d stores in advance a program that defines basic processing contents performed by the CPU 7a, and the hard disk device 7e excavates. An excavation program 21 that defines the control contents performed by the CPU 7a for the processing is stored.

  The interface board 7b has a circuit for continuous mode and a circuit for intermittent mode. When the mode set by the control of the CPU 7a is notified to the interface board 7b, a circuit corresponding to the notified mode is activated, and the activated circuit A control signal for mode switching is output to the generator 6 by the processing according to.

  Further, parameters such as a power supply frequency, a duty ratio, and a power value set by the computer 7 for the intermittent mode are transmitted to the intermittent mode circuit of the interface board 7b. In addition to generating a signal collected in one and outputting it to the generator 6, a process of outputting a notification signal called manual adaptation for notifying the intermittent mode to the matching box 5 is performed. Note that the transmitted parameters include a peak power value of high-frequency power, a reference power value (reference value) used for adjustment processing corresponding to a varying impedance value, and the like.

  The CPU 7a performs various processes based on the excavation program 21 stored in the hard disk device 7e, and performs predetermined setting and control based on an instruction input by the user by operating a keyboard or a mouse not shown in FIG.

  For example, when the excavation program 21 is activated, the CPU 7a performs processing for displaying the setting menu 22 shown in FIG. 7 on the monitor unit 7g. When the setting operation of either the intermittent mode or the continuous mode is received according to the setting menu 22, the CPU 7a performs a process of operating the circuit in the interface board 7b corresponding to the received setting content.

When the intermittent mode is set in the setting menu 22, the CPU 7a performs processing for accepting numerical settings of the frequency (feeding frequency) and the duty ratio from the user, notifies the received contents to the interface board 7b, and sends a predetermined signal to the generator 6 Is transmitted.
The duty ratio is preferably set to a value lower than 0.5 when the excavation target sample S is particularly easily dissolved and easily broken.

  Further, the CPU 7b can set other parameters such as the time required for excavation processing and the peak of the high-frequency power in another menu other than the setting menu 22 described above. When the intermittent mode is set, the CPU 7a Performs control to output a notification signal indicating the setting of the intermittent mode from the interface board 7b to the matching box 5.

  On the other hand, when the continuous mode is set in the setting menu 22, the CPU 7a performs control to output an instruction signal from the interface board 7b to the generator 6 so as to supply power for the time set for the excavation process.

Next, an overall processing procedure according to the glow discharge excavation method using the glow discharge excavation apparatus 1 having the above-described configuration will be described based on the flowchart of FIG.
First, various parameters such as mode, frequency, duty ratio and excavation time are set using the setting menu 22 shown in FIG. 7 (S1), and the sample S is set in the glow discharge tube 2 as shown in FIG. 2 (S2). .

  Next, after the inside of the glow discharge tube 2 is evacuated by the vacuuming device 8, an inert gas (argon gas) is supplied from the gas supply source 10 to the inside of the glow discharge tube 2 (S3). Then, power is supplied in accordance with the set contents in the atmosphere in which the inert gas is supplied to the space K (S4), and the sample surface Sa exposed in the space K of the sample S is excavated (S5).

  FIG. 9 shows the state of the excavated sample S. In the present embodiment, since argon gas is smoothly guided to the space K closed by the third O-ring 20 through the through hole 12c of the anode 12, sufficient argon gas is supplied to the space K as needed. Further, by supplying power in this argon gas supply atmosphere, glow discharge occurs in the space K, and argon ions contained in the argon gas jump out toward the sample surface Sa and collide to cause sputtering. The sample surface Sa is excavated by the collision of the argon ions in the sputtering, and the concave portion Sb is generated. In this embodiment, since the argon gas is sufficiently supplied, the degree to which the argon ions collide with the sample surface Sa is also conventional. Compared to the apparatus, the number of the drilled holes can be increased and the drilling can be efficiently performed, and the excavated portion can be obtained with a smoother and cleaner surface than the conventional one.

  That is, the bottom surface Sc of the excavated concave portion Sb has a predetermined area corresponding to the size of the tip 12e of the anode 12, and a clean spot having a predetermined smoothness is generated in the bottom surface Sc. The observation surface (bottom surface Sc) for the secondary electron microscope can be easily formed as compared with the polishing treatment, and furthermore, the observation surface (bottom surface Sc) excellent in smoothness compared to the conventional excavation by glow discharge can be obtained. .

  Moreover, in the glow discharge excavation apparatus 1 of the present embodiment, since the continuous mode and the intermittent mode can be switched and set, the conventional apparatus can be provided by supplying power to the easily dissolved sample, the fragile sample, etc. in the intermittent mode. The excavation of the kind of sample that was difficult with can be performed without any trouble. In particular, in the intermittent mode, the power supply frequency, duty ratio, power value and the like can be set finely, so that a delicate sample can be excavated reliably. Further, by performing a continuous mode on a sample other than the above-described characteristics, argon ions can continuously collide with the sample surface Sa to perform efficient excavation with good accuracy.

  When power is supplied in the intermittent mode, the overall processing when the difference between the output value Pf and the reflection value Pr is constant with respect to the fluctuation of the impedance value of the sample S due to the occurrence of sputtering is as follows. It becomes a flow.

  First, when the computer 7 sets the reference power value to, for example, A watts in various parameter settings before power feeding, the output value Pf and the reflection value Pr are linked with the required IC included in the intermittent mode circuit of the interface board 7b. Is set to be constant, and the output value Pf of the high-frequency power supplied from the generator 6 to the sample S is adjusted to a watts. At this time, Pf−Pr = c = A watts.

  Next, when sputtering occurs during excavation of the sample S by power feeding and the impedance value of the sample S changes, the reflection value Pr from the sample S also changes to b watts, so that Pf−Pr = a−b, and the output value The difference between Pf and the reflection value Pr is different from A watt.

  If the difference between the output value Pf and the reflection value Pr is different from A watts, the generator 6 adjusts the output value Pf to be a ′ watts so that Pf−Pr = c, and thus Pf−Pr = a′−b = c = A watts, the difference between the output value Pf and the reflection value Pr is maintained constant, and a stable power supply state is ensured even in the intermittent mode.

  In addition, the glow discharge excavation apparatus 1 according to the present invention is not limited to the above-described form, and various modifications can be applied. For example, in the above-described embodiment, the case where high-frequency power is generated and supplied is described, but the above-described device according to the present invention is also applied to a device that generates direct-current power instead of high-frequency power and generates glow discharge. The processes and configurations described above are applicable. Such feeding with DC power is suitable when the sample S is a conductor sample such as metal.

  Further, for example, when a delicate sample is not targeted for excavation, the setting process related to the power supply frequency, the duty ratio, the power value, and the like may be omitted to reduce the processing load on the computer 7 (CPU 7a). Furthermore, when the sample to be excavated is easily meltable or fragile, it is possible to omit the switching function between the intermittent mode and the continuous mode to make the device dedicated to the intermittent mode. If it is easy to excavate with characteristics other than, it may be a device dedicated to continuous mode. By doing in this way, the various processes etc. which concern on the glow discharge excavation apparatus 1 can be simplified further.

  On the other hand, if the sample to be excavated is composed of materials with different characteristics, the entire excavation time is divided into multiple time zones, power is supplied in continuous mode during certain time zones, and intermittent during other time zones Power may be supplied in the mode, and each mode may be switched during the excavation process. By switching the mode during the excavation process in this way, a good excavation process can be performed on a sample or the like in which hard materials and soft materials exist hierarchically.

  Even when the intermittent mode is performed, intermittent power supply may be performed by changing the state related to power supply for each of a plurality of time zones in the entire excavation time.

  FIG. 10 divides the entire excavation processing time Z into a first time z1 of the excavation start side time zone and a second time z2 of the excavation end side time zone, and is divided into the first time z1 and the second time z2. The power supply state with different duty ratios is shown. In this case, the duty ratio (T1 / T2) is the same as that shown in FIG. 5B at the first time z1, but at the second time z2, the duty period is set to T1 ′ (T1 ′ <T1) once. (T1 ′ / T2) is set to be smaller than the first time z1.

  As a result, in the second time z2, the load due to power feeding and the power of sputtering are reduced compared to the first time z1, and a plurality of materials are laminated and the material of the deep layer is more easily destroyed than the surface layer. A suitable power supply form for a sample or the like can be secured. In order to realize such a power supply mode, a menu such as that shown in FIG. 7 is used to set the number of time zones in which excavation time is divided by the computer 7, the time occupied by each time zone, and the duty ratio for each time zone. It is necessary to enable the power supply control corresponding to the time set by the control unit 6b, as well as to transmit the setting contents to the generator 6 and to enable the power supply control corresponding to the time set by the control unit 6b.

  FIG. 11 shows a power feeding state in which the power feeding frequency in the second time z2 in the entire excavation processing time Z is set larger than that in the first time z1. In this case, the unit time T2 ′ of the second time z2 is shorter than the unit time T2 of the first time z1. In this way, by changing the power feeding frequency for each time zone, the load due to power feeding and the power of sputtering are also different for each time zone, and detailed settings can be made according to the characteristics of the sample to be excavated. In order to realize a power supply mode in which the power supply frequency is different for each time zone, it is necessary to enable the computer 7 to classify the excavation time and to set the power supply frequency for each divided time zone.

  Further, FIG. 12 shows a power supply state in which the power value P2 of the second time z2 in the entire excavation processing time Z is larger than the power value P1 of the first time z1. Thus, by changing the power value for each time zone, the load due to power feeding for each time zone and the power of sputtering are different, and the power feeding conditions according to the sample to be excavated can be secured. In addition, the setting which is different for each time zone of the power value is suitable for a sample in which a plurality of materials are laminated. In order to supply power with different power values for each time zone, it is necessary to enable the computer 7 to accept the number of time zones for dividing the excavation time, accept power value settings for each time zone, and the like. .

  Note that the duty ratio, power supply frequency, and power value can be set appropriately for each time period, and some or all of these can be set in combination. A power supply configuration according to the characteristics can be secured, and stable excavation can be performed by reliably preventing dissolution and destruction of the sample.

  When the sample size to be excavated is small, it is preferable to apply the sample holder 26 as shown in FIG. The sample S ′ shown in FIG. 13 has a dimension M in the drawing smaller than the diameter of the third O-ring 20 and cannot be brought into direct contact with the third O-ring 20. Is used to form the space K. The sample holder 26 is composed of an opened box portion 26 and a lid portion 27 that closes the opening of the box portion 26, and the central portion of the bottom plate portion 26 a of the box portion 26 b has a cylindrical portion 12 b of the anode 12. A hole 26b having a diameter slightly larger than the outer diameter is formed.

  The small sample S ′ is disposed inside the box portion 26 so as to close the hole portion 26b, and is pressed toward the anode 12 together with the bottom plate portion 26a by the oscillator 3. As a result, the outer surface of the bottom plate portion 26a abuts on the third O-ring 20, and a space K sealed with the sample S ′ that closes the third O-ring 20, the bottom plate portion 26a, and the hole portion 26b is formed. Similarly, excavation of the sample S ′ becomes possible.

  Further, when the thickness of the sample is thin, it is possible to set the glow discharge tube 2 by bonding a plurality of samples. For example, when the cross section of a thin disk-shaped silicon wafer 30 as shown in FIG. 14A is observed with a secondary electron microscope, first, the silicon wafer 30 is cut into a plurality of strips (in the drawing, (Shown with a dashed line). Next, as shown in FIGS. 14B and 14C, the strips 31 to 35 are overlapped and bonded with an adhesive to form a sample 36 having a dimension that can be set.

  The surface 36a of the sample 36 to be excavated is a combination of the side surfaces 31a to 35a to be observed of the respective strips 31 to 35, and the plurality of side surfaces 31a to 35a are excavated simultaneously by excavating the surface 36a. Thus, since a plurality of observation locations can be formed, the probability of performing good observation is improved. In addition, in order to excavate a thin sample, it is conceivable to mold the thin sample with a resin or the like so that it can be set on the glow discharge tube 2 in addition to bonding.

  FIG. 15 shows a modified glow discharge tube 2 ', which is characterized in that a scope 40 for observing the excavation state is arranged inside the central hole 11c' of the lamp body 11 '. is there. In order to arrange the scope 40, the lamp body 11 ′ is provided with a hole 11 h ′ communicating with the center hole 11 c ′ on the outer end surface 11 i ′, and the rod-shaped scope 40 is inserted through the seal member 41 to enter the center hole 11 c ′. Is arranged. Since the scope 40 is configured to be able to observe an object on the extension line on the distal end side, it is possible to observe from the outside the situation where it is excavated on the sample surface Sa through the through hole 12c of the anode 12, and excavation processing is performed while checking the situation. You can do it.

  Further, FIG. 16 shows a glow discharge excavation apparatus 50 of a modified example, and the sample S is not set using the glow discharge tube 2 and the oscillator 3 as in the glow discharge excavation apparatus 1 of FIG. The first electrode 52 and the second electrode 53 for disposing the sample S are provided inside the excavation processing chamber 51, and the first electrode 52 is connected to the power supply unit 4 having the same configuration as that shown in FIG. It is connected to the ground side of the AC power supply AC. The power supply unit 4 is controlled by a computer 7 as in FIG.

  In the excavation processing chamber 51, a gas supply hole 51b for supplying argon gas is opened in the top plate portion 51a, an evacuation hole 51d is opened in the bottom plate portion 51c, and the internal space 51e of the excavation processing chamber 51 is evacuated 51d. After further evacuation, argon gas (inert gas) is supplied from the gas supply hole 51 b to supply power to the electrodes 52 and 53. Note that the various power supply modes described above can be applied to the power supply. In the glow discharge excavation apparatus 50 according to this modification, the sample S to be excavated only needs to be placed on the second electrode 53 of the excavation processing chamber 51, so that it takes less time to set the sample S, and the second electrode 53 Any type of sample S can be excavated as long as it can be placed on the surface, so that there is an advantage that the degree of freedom of the sample form that can be excavated is large.

Next, various samples were actually excavated using a glow discharge excavator having the same configuration as the glow discharge excavator 1 described above (an apparatus using only the portion related to the excavation process of JY-5000RF manufactured by Horiba Seisakusho). Examples (experimental results) will be described.
In the first example, excavation was performed using a silicon substrate as a sample.
The micrographs of FIGS. 17A to 17C show the silicon substrate before excavation, FIG. 17A is an image showing the entire silicon substrate by a confocal laser microscope, and FIG. FIG. 17C is an image obtained by enlarging the substrate surface with a confocal laser microscope, and FIG. 17C is an image further enlarged with a scanning electron microscope. When the roughness of the silicon substrate surface before excavation was measured with a roughness meter, there was an altitude difference of 0.84 μm with respect to the horizontal distance of 281.43 μm at one location on the substrate surface, and the horizontal distance of 25 at the other location. There was an altitude difference of 0.70 μm with respect to .31 μm.

  After performing the mechanical mirror polishing process on the silicon substrate, the silicon substrate was excavated using the glow discharge excavator. As the conditions for excavation, the mode for the occurrence of glow discharge was set to the continuous mode, and the power value supplied to the silicon substrate was set to 40 W.

  The micrographs of FIGS. 18 (a) to 18 (c) show the silicon substrate after excavation, and correspond to the images of FIG. 17 (a) to (c) before excavation, respectively, using a microscope similar to the above. It is a photographed image. When comparing the micrographs of FIGS. 17 and 18, it was confirmed that the silicon substrate after excavation was smoother than the surface before excavation.

  Further, when the surface roughness of the substrate surface after excavation was measured with a roughness meter at a location equivalent to the location at which the surface roughness was measured before excavation, it was 0. 0 with respect to the horizontal distance of 281.43 μm at one location. The height difference was 46 μm, and in other places, the height difference was 0.37 μm with respect to the horizontal distance of 62.17 μm. Therefore, it was found that the altitude difference was smoothed by halving by excavation. In addition, the substantial operation time when the glow discharge excavator performs excavation is about 5 seconds. Thus, by excavating the sample surface using the glow discharge excavator according to the present invention, a nano-level uniform and smooth surface can be formed in a very short time, and an optical microscope, scanning electron microscope, electron A good surface image and analysis information can be obtained by using a line microprobe analyzer and a surface analysis instrument.

In the second embodiment, a plastic material that is weak against heat and easily dissolved is excavated.
The micrographs of FIGS. 19A and 19B show the surface of the plastic material before excavation, FIG. 19A is an image obtained by enlarging the surface of the material with a scanning electron microscope, and FIG. It is the image which expanded the material surface further by the atomic force microscope. Moreover, the graph of FIG.19 (c) shows the height difference measured with the roughness meter with respect to the location connected with the AB line in FIG.19 (b), and the location connected with the CD line, A- There was a height difference of 160.74 nm with respect to the horizontal distance of 26.71 μm at the location of line B, and there was a height difference of 135.14 nm with respect to 29.23 μm at the location of line CD.

  The micrographs of FIGS. 20 (a) and 20 (b) show the material surface when the above-described plastic material is excavated in the intermittent mode, and correspond to the images of FIGS. 19 (a) and 19 (b) before excavation, It is the image image | photographed using the microscope similar to the above. In the excavation in the intermittent mode, the power supplied to the plastic material was set to 40 W, the duty ratio was set to 0.0625, the frequency of the intermittent power supply was set to 20000 Hz, and the entire excavation time was set to 300 seconds.

  Moreover, the graph of FIG.20 (c) shows the height difference measured with the roughness meter with respect to the location connected with the AB line in FIG.20 (b), and the location connected with the CD line, A- There was a height difference of 56.64 nm with respect to the horizontal distance of 22.31 μm at the location of line B, and there was a height difference of 68.53 nm with respect to 28.83 μm at the location of line CD. Therefore, after excavation, the altitude difference is reduced to less than one-half compared to before excavation, and the entire surface excavated by glow discharge is shown in the graphs of FIGS. 19 (c) and 20 (c). Was found to be smoothed.

  The micrographs of FIGS. 21A to 21C show the material surface when the above-described plastic material is excavated in the continuous mode, and FIG. 21A shows the entire plastic material by the confocal laser microscope. FIG. 21B is an image obtained by enlarging the material surface with a confocal laser microscope, and FIG. 21C is an image further enlarged with a scanning electron microscope. Moreover, when the surface of the plastic material excavated in the continuous mode is measured with a roughness meter, there is an altitude difference of 3.86 μm with respect to the horizontal distance of 281.43 μm as a whole, and in some places with respect to the horizontal distance of 30.81 μm. There was an altitude difference of 4.24 μm, and the altitude was higher than in the intermittent mode. Therefore, by switching the continuous mode of the glow discharge excavator according to the present invention to the intermittent mode, the surface of a sample that is vulnerable to heat and a sample that is easily destroyed by the power of sputtering (for example, a composite material that includes organic matter, etc.) It was found that drilling was smooth.

In addition, for comparative verification, drilling experiments in continuous mode were performed on various samples using the above-described glow discharge drilling apparatus.
In conducting the structural analysis from the surface of the layered sample to the depth direction, it was verified whether it was possible to peel more cleanly from the outermost layer by changing the feeding conditions and excavation time. As a sample, a semiconductor having a layer structure was used, and the degree of recognition of the pattern with respect to the depth direction of each layer exposed in the cross section of the semiconductor was compared and verified.

  The micrographs of FIGS. 22 (a) and 22 (b) show the semiconductor cross section before excavation, FIG. 22 (a) is an image of the layer structure viewed from the cross-sectional direction with a confocal laser microscope, and FIG. It is the image which looked at the layer structure from the surface with the confocal laser microscope. In addition, when the unevenness | corrugation state of the surface of FIG.22 (b) was measured with the roughness meter, there existed an altitude difference of 1.01 micrometer with respect to the horizontal distance 70.74 micrometer on the whole on the surface, and a horizontal distance in some places There was an altitude difference of 1.00 μm with respect to 14.92 μm.

  The micrographs of FIGS. 22 (c) and 22 (d) show the semiconductor cross-sections excavated in the continuous mode, and correspond to the images in FIGS. 22 (a) and 22 (b) before excavation, respectively. It is the image image | photographed using. Each image in FIGS. 22C and 22D is excavated with priority from the outermost layer of the semiconductor surface as compared with each image in FIGS. 22A and 22B, and the structure at the bottom can be seen. . As power supply conditions for obtaining the micrographs of FIGS. 22C and 22D, the power supplied to the semiconductor sample was set to 40 W, and the entire excavation time was set to 30 seconds. Further, when the roughness of the surface of FIG. 22 (d) was measured with a roughness meter, there was an altitude difference of 0.88 μm with respect to the horizontal distance of 70.74 μm as a whole on the surface. There was an altitude difference of 0.76 μm compared to 15.12 μm.

  Furthermore, the micrographs of FIGS. 22 (e) and 22 (f) show semiconductor cross sections excavated in continuous mode by changing the power supply conditions and excavation time from the case of FIGS. 22 (c) and 22 (d). These images correspond to the images in FIGS. 22 (a) and 22 (b), respectively, and are images taken using the same microscope as described above. 22E and 22F, the structure of the semiconductor surface is further excavated as compared with the images of FIGS. 22C and 22D, and the structure in the vicinity of the substrate can be seen. In the glow discharge excavator of the present invention capable of changing the excavation time, the power supply conditions and excavation time are changed, so that the surface forms to be excavated greatly differ, and the appropriate power supply conditions and excavation time are set. Structural analysis can be performed. In addition, as power supply conditions for obtaining each image of FIGS. 22E and 22F, the power supplied to the semiconductor sample was set to 40 W, and the entire excavation time was set to 60 seconds. Further, when the roughness of the surface in FIG. 22 (f) was measured with a roughness meter, there was an altitude difference of 0.44 μm with respect to the horizontal distance of 70.74 μm as a whole on the surface. There was an altitude difference of 0.35 μm with respect to 16.42 μm.

  In another experiment in the continuous mode, a sample (silicon wafer) prepared with the contents shown in FIGS. 14A to 14C was excavated in a continuous mode using a glow discharge excavator.

  As shown in FIGS. 14A to 14C, the three photographs in FIG. 23 are photographs (micrographs) of a surface obtained by excavating a plurality of parts of a single silicon wafer cut out and overlaid. It is an image. The lower photograph in FIG. 23 shows a state in which a plurality of silicon wafers provided with a pattern are stacked. In the photograph below, the central black circle is the excavated part.

  The middle photo in FIG. 23 is an enlarged image obtained by imaging an area surrounded by a white frame in the lower photo with an electron microscope, and it was confirmed that a large number of gates exist in a pattern provided on a silicon wafer. . Further, the upper photograph in FIG. 23 is an enlarged image obtained by imaging the portion surrounded by the white frame of the middle photograph with an electron microscope, and the presence of a clear gate could be confirmed. As described above, the condition of the gate structure could be evaluated by excavating a part of the sample (silicon wafer) by excavating a plurality of parts. Note that the power supply to the silicon wafer was set to 40 W as the power supply condition for excavation for obtaining the three photographs in FIG. 23, and the total excavation time was 5 seconds.

Furthermore, in another experiment by continuous mode, the structure | tissue observation normally performed by the wet process with respect to the metal material was performed under the dry process by the continuous mode drilling.
The micrographs in FIGS. 24A and 24B show the surface of the metal material (stainless steel) before excavation, and FIG. 24A is an image obtained by enlarging the material surface with a scanning electron microscope. b) is an image obtained by further enlarging the material surface with an atomic force microscope. Moreover, the graph of FIG.24 (c) shows the altitude difference measured with the roughness meter with respect to the location connected by the AB line in FIG.24 (b), and the location connected by the CD line, and A- There was an altitude difference of 7.44 nm for the horizontal distance of 84.44 μm at the location of line B, and an altitude difference of 10.29 nm for the location of CD line at 87.11 μm.

  The micrographs in FIGS. 25 (a) and 25 (b) show the surface of the above-described metal material (stainless steel) excavated in continuous mode, corresponding to the images in FIGS. 24 (a) and 24 (b) before excavation, It is the image image | photographed using the same microscope. In the excavation in the continuous mode, the power supplied to the metal material was set to 40 W, and the entire excavation time was set to 10 seconds.

  Moreover, the graph of FIG.25 (c) shows the height difference measured with the roughness meter with respect to the location connected by the AB line in FIG.25 (b), and the location connected by the CD line, A- There was an altitude difference of 64.67 nm with respect to the horizontal distance of 80.97 μm at the location of line B, and an altitude difference of 85.06 nm with respect to 99.91 μm at the location of line CD. From this, even when drilling in the continuous mode for the structure observation of the metal material having a crystal structure, the etching effect depending on the crystal orientation was obtained on the sample surface, and the difference in height depending on the crystal could be confirmed. Therefore, when the sample is a single crystal, a smooth plane can be obtained by drilling with the glow discharge drilling apparatus of the present invention, and when the sample is polycrystalline, the anisotropic etching effect depending on the crystal orientation of the sample Thus, etching is performed in a direction depending on the plane direction for each crystal, and an observation surface of the structure can be formed.

It is the schematic which shows the whole structure of the glow discharge excavation apparatus which concerns on embodiment of this invention. It is sectional drawing of a glow discharge tube. It is a block diagram which shows the internal structure of a generator. It is a graph which shows the form of the applied high frequency voltage. (A) is a graph which shows the power supply form of a continuous mode, (b) is a graph which shows the power supply form of an intermittent mode. It is a block diagram which shows the internal structure of a matching box. It is the schematic which shows the content of the setting menu which concerns on mode selection, frequency setting, etc. It is a flowchart which shows the process sequence of the glow discharge excavation method using a glow discharge excavation apparatus. It is the schematic which shows the excavation state of a sample. It is a graph which shows the electric power feeding form which made the duty ratio differ for every time slot | zone. It is a graph which shows the electric power feeding form which varied the electric power feeding frequency for every time slot | zone. It is a graph which shows the electric power feeding form which made the electric power value differ for every time slot | zone. It is the schematic which shows the state which excavates with respect to the sample hold | maintained using the sample holder. (A) is the schematic which shows a silicon wafer, (b) is the schematic which shows several strip pieces, (c) is the schematic which shows the sample formed by bonding each strip piece. It is sectional drawing which shows the glow discharge tube of a modification. It is the schematic which shows the structure of the glow discharge excavation apparatus of a modification. It is the microscope picture of the silicon substrate before excavation, (a) is the whole image of a substrate, (b) is the image which expanded the substrate surface, (c) is the image further expanded. It is the microscope picture of the silicon substrate after excavation, (a) is the whole image of a substrate, (b) is the image which expanded the substrate surface, (c) is the image further expanded. (A) and (b) are the images of the microphotograph of the plastic material surface before excavation, (c) is a graph which shows the altitude difference in two places on the surface of a plastic material. (A) and (b) are the images of the microscope picture of the plastic material surface after excavation by intermittent mode, (c) is a graph which shows the altitude difference in two places on the surface of a plastic material. It is a microscope picture of the plastic material after excavation by a continuous mode, (a) is the whole image of a plastic material, (b) is the image which expanded the material surface, (c) is the image further expanded. (A) and (b) are images of micrographs before excavation of a semiconductor cross section, (c) and (d) are images of micrographs excavated in continuous mode, and (e) and (f) are continuous modes by changing power supply conditions. It is an image of the micrograph excavated by. It is the photographic image of the surface which excavated in continuous mode what cut out and overlapped a part of one silicon wafer. (A) and (b) are the images of the microscope picture of the metal material surface before excavation, (c) is a graph which shows the altitude difference in two places on the surface of a metal material. (A) and (b) are the images of the microscope picture of the metal material surface after excavation in continuous mode, (c) is a graph which shows the altitude difference in two places on the surface of a metal material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glow discharge excavator 2 Glow discharge tube 3 Oscillator 4 Power supply part 5 Matching box 6 Generator 7 Computer 12 Anode 12b Cylindrical part 12c Through-hole 20 3rd O ring K space S Sample

Claims (9)

In a glow discharge excavation apparatus that excavates a sample with glow discharge generated by supplying power to the electrode and the sample in an atmosphere in which an inert gas is supplied to the sample opposed to the electrode,
A closing member that closes and surrounds the electrode and the sample facing each other;
A gas supply unit for supplying an inert gas to the space closed by the closing member;
A high-frequency power generator that generates high-frequency power to apply a high-frequency voltage to the sample and the electrode;
Means for receiving the number of times of power supply per second by the high-frequency power generation unit;
Surface analysis equipment satisfying a predetermined smoothness by intermittently applying a high-frequency voltage generated by the high-frequency power generation unit to the sample and the electrode based on the number of times of power supply per second received by the means A glow discharge excavator characterized by comprising: an intermittent power supply means for forming a sample surface for obtaining a surface image using a laser. In a glow discharge excavation apparatus that excavates a sample with glow discharge generated by supplying power to the electrode and the sample in an atmosphere in which an inert gas is supplied to the sample opposed to the electrode,
A closing member that closes and surrounds the electrode and the sample facing each other;
A sample holder that has a bottom plate portion that abuts against the closing member and holds a sample that closes a hole formed in the bottom plate portion;
A gas supply unit for supplying an inert gas to the space closed by the closing member;
A high-frequency power generator that generates high-frequency power to apply a high-frequency voltage to the sample and the electrode;
Means for receiving the number of times of power supply per second by the high-frequency power generation unit;
Intermittent power supply means for intermittently applying a high-frequency voltage generated by the high-frequency power generation unit to the sample and the electrode based on the number of times of power supply per second received by the means;
Means for excavating the surface of the sample exposed in the space of the sample. Continuous power supply means for continuously supplying power;
The glow discharge excavator according to claim 1, further comprising: a switching unit configured to switch between continuous power feeding performed by the continuous power feeding unit and intermittent power feeding performed by the intermittent power feeding unit.   The glow discharge excavation apparatus according to any one of claims 1 to 3, further comprising a power supply state changing unit that changes a state related to intermittent power supply performed by the intermittent power supply unit.   The glow discharge excavation apparatus according to claim 4, wherein the power supply state changing unit changes a duty ratio related to intermittent power supply.   The glow discharge excavator according to claim 4, wherein the power supply state changing unit changes a power value related to intermittent power supply. The means for receiving the number of times of power supply per second is:
The glow discharge excavator according to claim 1, wherein the glow discharge excavator is configured to receive the number of times of power supply per second in a range of 30 Hz to 30000 Hz. In a glow discharge excavation method of supplying an inert gas to a sample disposed opposite to an electrode, supplying power to the electrode and the sample to generate a glow discharge, and excavating the sample with the generated glow discharge.
A portion where the electrode and the sample face each other is enclosed by a closing member and closed,
The high-frequency power generator generates high-frequency power to apply a high-frequency voltage to the sample and the electrode,
Accept the number of times of power supply per second by the high-frequency power generation unit,
The high-frequency voltage generated by the high-frequency power generation unit is intermittently supplied to the sample and the electrode based on the received number of times of power supply per second in an atmosphere in which an inert gas is supplied to a space formed by being closed by the closing member. Applied to
Excavating the sample surface exposed in the space of the sample;
A glow discharge excavation method characterized by forming a sample surface satisfying a predetermined smoothness and using a surface analysis instrument to obtain a surface image. In a glow discharge excavation method of supplying an inert gas to a sample disposed opposite to an electrode, supplying power to the electrode and the sample to generate a glow discharge, and excavating the sample with the generated glow discharge.
A portion where the electrode and the sample face each other is enclosed by a closing member and closed,
Holding the sample by a sample holder that has a bottom plate portion that contacts the closing member and holds a sample that closes a hole formed in the bottom plate portion;
The high-frequency power generator generates high-frequency power to apply a high-frequency voltage to the sample and the electrode,
Accept the number of times of power supply per second by the high-frequency power generation unit,
The high-frequency voltage generated by the high-frequency power generation unit is intermittently supplied to the sample and the electrode based on the received number of times of power supply per second in an atmosphere in which an inert gas is supplied to a space formed by being closed by the closing member. Applied to
A glow discharge excavation method comprising excavating a sample surface exposed in the space of the sample.