JP4543700B2 - Semiconductor light emitting device - Google Patents

Description

  The present invention relates to a semiconductor light emitting device such as a light emitting diode or a semiconductor laser, and more particularly to a nitride semiconductor device formed using a semiconductor layer in which nitride semiconductors are stacked.

  Conventionally, a structure in which a p-type semiconductor layer and an n-type semiconductor layer are stacked on a substrate and an electrode electrically connected to each of the p-type and n-type semiconductor layers is formed as a semiconductor light emitting device. Yes. Further, as an electrode electrically connected to the p-type semiconductor layer, a structure is known in which an electrode made of a translucent material is formed on the entire surface of the p-type semiconductor layer, and a metal electrode is formed thereon.

In the semiconductor light emitting device having such a configuration, in order to improve the light extraction efficiency, a transparent film such as a metal thin film, ITO, ZnO, In ₂ O ₃ , SnO ₂ or the like is used as the entire surface electrode on the p-type semiconductor layer. An oxide film is used (see, for example, Patent Document 1).
JP 2001-196633 A

  However, for example, the conductive oxide itself exhibits n-type semiconductor characteristics, so that it does not necessarily have good ohmic properties with the semiconductor layer. Due to various factors such as the type of semiconductor layer, conductivity type, and film formation method, Schottky A barrier may be formed, increasing the contact resistance. When the sheet resistance at the interface between the electrode and the semiconductor layer is increased, there is a problem that the loss is increased and the output is decreased, and further, heat is generated and the element life is also decreased.

  The present invention has been made in view of such a problem, and its main purpose is to use a transparent conductive oxide film as an electrode, to obtain an ohmic contact while maintaining sufficient transparency, and An object of the present invention is to provide a semiconductor light emitting device having excellent luminous efficiency.

In order to achieve the above object, the semiconductor light emitting device of the present invention has a semiconductor stacked structure in which a semiconductor layer containing gallium as the first element A is located on the surface. This semiconductor light emitting element has a conductive oxide film made of indium tin oxide and an oxide film containing the second element B on the surface of the semiconductor layer. Conductive oxide film, film oxygen concentration in the vicinity of the interface between oxide film containing the second element B is higher rather than the membrane oxygen concentration in the vicinity of the interface between the semiconductor layer and the semiconductor layer film of tin concentration in the vicinity of the interface between have higher comb than film tin concentration in the vicinity of the interface between oxide film containing the second element B.

Further, another embodiment of the present invention will be described below. In another embodiment of the semiconductor light emitting device of the present invention, the oxide film containing the second element B is preferably an insulating oxide film. Further, the second element B preferably has a Pauling value indicating electronegativity greater than that of indium and tin . Further, the second element B preferably has a Pauling value indicating an electronegativity greater than that of the first metal. The first element A is preferably gallium. Further, the semiconductor layer is preferably a nitride semiconductor layer containing gallium. Furthermore, the conductive oxide film preferably contains a trace element D in addition to the element C. Furthermore, the trace element D is preferably at least one element selected from tin, zinc, gallium, and aluminum. Further, in the conductive oxide film, the concentration of the trace element D in the vicinity of the interface with the semiconductor layer is higher than the concentration of the trace element D in the other part of the conductive oxide film. Furthermore, the conductive oxide film is preferably ITO. Furthermore, the second element B is preferably either silicon or tin. Furthermore, it is preferable that the oxygen concentration in the film of the conductive oxide film gradually decreases from the interface with the oxide film containing the second element B toward the interface with the semiconductor layer.

  According to the semiconductor light emitting device of the present invention, the oxygen concentration in the film near the interface with the oxide film containing the second element B of the conductive oxide film is higher than the oxygen concentration in the film near the interface with the semiconductor layer. Since it is high, the crystallinity is excellent in the vicinity of the interface with the oxide film containing the second element B, and light from the light-emitting layer can be extracted to the outside sufficiently. Further, the oxygen concentration in the vicinity of the interface between the conductive oxide film and the semiconductor layer is lower than that in the vicinity of the interface with the oxide film containing the second element B, so that the deficient oxygen has the same trend as the carrier. Therefore, a large number of carriers can be arranged only on the semiconductor layer side of the conductive oxide film, and as a result, the Schottky barrier with the semiconductor layer containing the first element A can be reduced. In addition, the conductive oxide film can reduce the sheet resistance at the interface with the semiconductor multilayer structure side on which the semiconductor layer containing the first element A is on the surface, so that current can be injected most efficiently into the semiconductor multilayer structure. A semiconductor light emitting device having a high level can be obtained. As described above, by improving the light extraction efficiency and reducing the sheet resistance by increasing the concentration in the vicinity of the interface with the oxide film without making the oxygen concentration in the film uniform, a high-quality semiconductor light emitting device can be realized. . In addition, when the conductive oxide film contains the trace element D in addition to the element C, the concentration of the trace element D in the vicinity of the interface with the semiconductor layer can be increased to further dispose more carriers on the semiconductor layer side. In addition, the Schottky barrier can be further reduced, the sheet resistance on the semiconductor multilayer structure side can be further reduced, and an extremely excellent semiconductor light emitting device can be configured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a semiconductor light emitting element for embodying the technical idea of the present invention, and the present invention does not specify the semiconductor light emitting element as follows. Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, but are merely described. It's just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

FIG. 1 shows a configuration of a semiconductor light emitting device according to an embodiment of the present invention. The semiconductor light emitting element is typically a light emitting diode (LED), a semiconductor laser (LD), or the like, and includes a conductive oxide film and an oxide film formed on a semiconductor layer. The semiconductor layer is not particularly limited, and examples thereof include elemental semiconductors such as silicon and germanium, and compound semiconductors such as III-V group, II-VI group, and VI-VI group. In particular, a gallium nitride-based compound semiconductor such as In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably used. The semiconductor layer may be a single layer structure, but may be a homo structure, a hetero structure or a double hetero structure having a MIS junction, a PIN junction or a PN junction, and a superlattice structure or a thin film generating a quantum effect is laminated. It may be a single quantum well structure or a multiple quantum well structure. Further, either n-type or p-type impurities may be doped. This semiconductor layer can be formed by known techniques such as metal organic chemical vapor deposition (MOCVD), hydride vapor deposition (HVPE), molecular beam epitaxy (MBE), and the like. The film thickness of the semiconductor layer is not particularly limited, and various film thicknesses can be applied depending on applications and purposes.

The conductive oxide film is a film made of an oxide containing at least one element C selected from the group consisting of zinc (Zn), indium (In), tin (Sn), and magnesium (Mg). Specifically, ITO, ZnO, In ₂ O ₃ , SnO ₂ , MgO and the like can be mentioned. Of these, an ITO (indium tin oxide) film is preferable. These ITO films and the like are light-transmitting films that are usually used in the field, and form a good ohmic connection with the above-described semiconductor layer, so that a current supplied to the conductive oxide film is applied to the film. It is a film that can be diffused throughout and evenly diffused into the semiconductor layer. Further, the adhesion with the oxide film described later is improved. Therefore, the conductive oxide film is formed on the semiconductor layer and further between the oxide film described later, and the oxygen concentration in the film in the vicinity of the interface with the oxide film is such that the conductive oxide film The oxygen concentration in the film is lower than other portions of the film, for example, the central portion in the thickness direction of the conductive oxide film and the vicinity of the interface with the semiconductor layer. In other words, on the interface side with the oxide film, in the region adjacent to the oxide film, that is, inside the conductive oxide film, the film tends to increase from the oxygen concentration in the film from the semiconductor layer side to the oxide film side. It has an oxygen concentration.

  The conductive oxide film may have two layers, a film having a low oxygen concentration on the semiconductor layer side and a film having a high oxygen side on the oxide film side, and a step in which the oxygen concentration in the film extends from the semiconductor layer side to the oxide film side. Although it may be a multi-layer film that becomes higher, the light from the light-emitting layer can be suitably transmitted to the outside by forming a conductive oxide film having a single film with a high oxygen concentration region and a low oxygen concentration region. It is possible to take it out. When this is measured by SIMS, it tends to be as shown in FIG. FIG. 2 (a) shows a case where there is a concentration gradient in the oxygen concentration continuously, (b) and (c) show a case where there is a concentration gradient in the oxygen concentration step by step, and (d) shows oxygen that summarizes these. It is a figure which shows the tendency of a density | concentration. Note that the thickness of the conductive oxide film is not particularly limited, and may be about several angstroms to several micrometers. Specifically, it is appropriate to set it to about 4000 to 7000 mm.

  The oxygen concentration in the film can be measured by, for example, AES (Auger Electron Spectroscopy). AES is a method of irradiating an electron beam, detecting emitted Auger electrons and performing elemental analysis of the sample, and can know the chemical composition and isotope composition of the sample, particularly the composition change in the depth direction. Moreover, it can also measure by SIMS (Secondary Ion-microprobe Mass Spectrometer (or Spectrometry): secondary ion mass spectrometer (or analysis method)). In SIMS, by irradiating a sample with primary ions and counting the number of secondary ions separated by mass, the chemical composition and isotope composition of the sample, particularly the composition change in the depth direction, can be known.

  Conductive oxide films having different oxygen concentrations in the film can be formed by a conventionally known method. For example, sputtering method, reactive sputtering method, vacuum deposition method, ion beam assisted deposition method, ion plating method, laser ablation method, CVD method, spray method, spin coating method, dipping method or a combination of these methods and heat treatment, etc. Various methods can be used.

  Specifically, when forming a conductive oxide film such as an ITO film by sputtering, the sputtering gas is switched from a gas having a low oxygen partial pressure or a gas having a low oxygen partial pressure to a gas having a large oxygen partial pressure. In addition to the target for forming a conductive oxide film, for example, a method using a target with a large amount of In or a target with a small amount of oxygen, and gradually increasing the input power of the sputtering apparatus. Examples include a film forming method. Also, when forming a conductive oxide film by vacuum deposition, a method of rapidly or gradually increasing the temperature of the semiconductor layer, a method of rapidly increasing the film formation rate, and a film of oxygen ions using an ion gun A method of irradiating only in the latter half of the time is mentioned.

  Further, when the conductive oxide film is formed by the ion plating method, oxygen gas is turned into plasma in the latter half of the film formation, and this oxygen plasma is taken into the conductive oxide film, thereby forming the conductive oxide film. A method of forming a film, such as a solution containing a conductive oxide, when a conductive oxide fine particle is dissolved or dispersed or suspended in a solvent to form a film by a spray method, a spin coating method, or a dip method. When forming a conductive oxide film by CVD, a method for controlling the atmosphere, temperature, etc. at the time of drying or baking, using a plurality of types of solutions with varying metal element content or oxygen content, oxygen, etc. A method for controlling the flow rate of the gas or the raw material oxygen-containing gas may be mentioned.

  In addition, after forming the conductive oxide film, for example, in an oxidizing gas (specifically, oxygen, nitrogen, halogen) atmosphere, about 200 to 650 ° C. for a predetermined time according to the thickness of the conductive oxide film A method of annealing treatment may be mentioned. Examples of the annealing process include a lamp annealing process and an annealing process using a heating furnace. Further, as a method of processing after forming a conductive oxide film, electron beam irradiation or laser ablation may be used. Furthermore, these methods may be used in any combination.

  Although various oxide films can be used as the oxide film containing the second element B, the second element B has a Pauling value (polling value) indicating electronegativity greater than that of indium. It is preferable to select an element. Further, the conductive oxide film is not limited to ITO, and in the conductive oxide film made of an oxide containing at least one element C selected from the group consisting of zinc, indium, tin, and magnesium, On the other hand, it is preferable to include the second element B having a similar relationship between the Pauling value (polling value). By using an oxide film containing such an element, the conductive oxide film has a higher oxygen concentration in the vicinity of the interface with the oxide film than in the other portions of the conductive oxide film. Is easily obtained. This is considered to be due to the movement of oxygen in the oxide film toward the conductive oxide film having a low electronegativity. What is necessary is just to form or process so that the oxygen concentration in the film | membrane of an interface vicinity may become higher than another part at the time of an oxide film formation or after an oxide film formation.

  In addition, it is more preferable that the second element B is an element having a larger Pauling value (Pauling value) indicating electronegativity than the first element A. By using an oxide film containing such an element, oxygen in the oxide film can easily move to the conductive oxide film, and is also attracted to the semiconductor layer containing the first element A, so that the conductive film becomes conductive. It becomes easy to obtain a conductive oxide film having an oxygen concentration gradient over the entire oxide film. In this way, by using a conductive oxide film having a gradient of oxygen concentration throughout the conductive oxide film, the current input to the conductive oxide film is most efficiently diffused throughout the film, and the luminous efficiency is improved. A semiconductor light emitting device having a high level can be obtained. This also makes it possible to reduce the thickness of the conductive oxide film, and a conductive oxide film that is excellent in translucency can be obtained.

  In addition, when the oxide film containing the second element B is an insulating oxide film, a semiconductor light-emitting element that functions as a protective film of the semiconductor light-emitting element and has excellent reliability can be obtained. Specific examples of the preferable second element B include silicon (Si) and tin (Sn).

  On the other hand, the first element A is preferably gallium (Ga). For example, a GaAs-based semiconductor layer (however, Al or In may be included), a GaN-based semiconductor layer (which may include Al, In, or the like), and the like. A conductive oxide film can function as a simple electrode.

Further, the semiconductor layer containing the first element A is preferably a nitride semiconductor layer containing gallium (Ga). In other words, it is a semiconductor layer made of Al _x In _y Ga _1-xy N (0 ≦ x, 0 ≦ y, x + y <1), and thus functions suitably as a full-surface electrode that can inject current almost uniformly into the surface of the semiconductor layer In addition, the light from the light emitting layer can be efficiently extracted to the outside. The semiconductor layer containing the first element A may be a nitride semiconductor containing at least gallium, and may be doped with an impurity that determines the conductivity type such as Si or Mg, or may contain other elements.

Further, when the conductive oxide film contains a trace element D in addition to the element C, the trace element D in the vicinity of the interface with the semiconductor layer is less than the concentration of the trace element D in the other part of the conductive oxide film. Is preferably high. By this trace element D, the conductive oxide film has more carriers and better conductivity. The trace element D has a specific concentration distribution in the film thickness direction, whereby a conductive oxide film having excellent crystallinity and conductivity can be obtained. Specifically, if there is too much trace element D, the conductivity tends to improve, but the crystallinity deteriorates, which is not preferable as a translucent electrode. In other words, it is preferable that the high concentration region and the low concentration region of the trace element D coexist in the film thickness direction. In particular, the concentration of the trace element D in the film in the vicinity of the interface with the semiconductor layer containing the first element A is more preferably higher than the concentration of the trace element D in the other part of the conductive oxide film. For example, when the conductive oxide film is ITO, the trace element D is tin. ITO can obtain a high carrier concentration when the amount of oxygen deficiency is large, and can also obtain a high carrier concentration when the doping amount of tin is large. However, if the tin doping amount is too large, the carrier becomes high but the crystallinity is deteriorated, so that it is generally not preferable as a translucent electrode. However, in the embodiment of the present invention, a large amount of tin is doped in the vicinity of the interface with the semiconductor layer, so that a good ohmic contact can be obtained between the conductive oxide film and the semiconductor layer, and in other regions. A small tin doping amount is preferable because a good crystalline film is obtained. When this state is measured by SIMS, the tendency is as shown in FIG. FIG. 3 (a) is a diagram showing a general tendency of tin concentration when there is a concentration gradient in the tin concentration continuously. In addition, the tin doping amount is within the range where the state of high mobility is maintained, that is, the doping amount of tin with the best conductivity is provided in the vicinity of the interface with the semiconductor layer. This is preferable because the obtained current can be diffused throughout the film and further uniformly diffused into the semiconductor layer. These, as a configuration in which trace elements D, for example tin doped _{In 2 O 3, In 2 O} 3 , etc. doped zinc and gallium doped ZnO, aluminum doped with ZnO is this Since a conductive oxide film having such a specific concentration distribution is obtained, it is preferable. In the present invention, the conductive oxide containing the trace element D specifically means that about 20 percent or less of the element D is contained with respect to the element C.

  The semiconductor light emitting device according to the embodiment of the present invention has, as another configuration, a pad electrode that preferably has an opening in a part of the insulating oxide film and is electrically connected to the conductive oxide film. It is preferable to have. The type and form of the pad electrode are not particularly limited, and any pad electrode can be used as long as it is normally used as an electrode. For example, zinc (Zn), nickel (Ni), platinum (Pt) palladium (Pd), rhodium (Rh), ruthenium (Ru), osmium (Os), iridium (Ir) titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), cobalt (Co), iron (Fe), manganese (Mn), molybdenum (Mo), chromium (Cr), tungsten (W), lanthanum (La), copper (Cu), silver (Ag), yttrium (Y), and other metals, alloy single layer films or laminated films. Among them, those having low resistance are preferable, and specific examples include single layer films or laminated films of W, Rh, Ag, Pt, Pd, Al, and the like. Furthermore, a conductive oxide film, particularly a film having good adhesion to an ITO film, specifically, a single layer film or a laminated film of W, Rh, and Pt is preferable. By adopting such a configuration, it can suitably function as a pad electrode or the like bonded by solder or wire bonded.

  In the embodiment of the present invention, the semiconductor light-emitting element having the above-described structure includes all light-emitting elements known in the art such as LEDs and LDs. These are made by methods known in the art and have a known configuration. For example, a semiconductor light emitting device in which a first conductive type semiconductor layer, a light emitting layer, and a second conductive type semiconductor layer are stacked in this order, and electrodes are connected to the first conductive type and the second conductive type semiconductor layer, respectively. . The first conductivity type means n-type or p-type, and the second conductivity type means p-type or n-type.

  This type of semiconductor light-emitting element is formed by growing a plurality of semiconductor layers on a substrate, and an insulating substrate such as sapphire is preferably used as the substrate. When the insulating substrate is not finally removed, both the p-electrode and the n-electrode are usually formed on the same surface side of the semiconductor layer. It can be a surface. Further, flip-chip mounting, that is, the insulating substrate side may be used as the main light extraction surface. In this case, metallization layers (bumps: Ag, Au, Sn, In, Bi, Cu, Zn, etc.) for connection with external electrodes or the like are formed on the p electrode and the n electrode, respectively. A pair of positive and negative external electrodes provided on the submount are respectively formed, and further, a wire or the like is wired to the submount. Further, the substrate may be finally removed and used for either face-up mounting or flip chip mounting. In addition, a board | substrate is not limited to sapphire, For example, well-known board | substrates, such as a spinel, SiC, GaN, GaAs, can be used. Further, by using a conductive substrate such as SiC, GaN, or GaAs as the substrate, the p electrode and the n electrode may be arranged to face each other.

  In the semiconductor light emitting device according to the embodiment of the present invention, the above-described electrode may be provided on either the first conductive type semiconductor layer or the second conductive type semiconductor layer. For example, it is preferable to provide on a p-type semiconductor layer. Moreover, you may provide on both the 1st conductivity type and the 2nd conductivity type semiconductor layer. If both have the same electrode structure, the manufacturing process is simplified, and as a result, an inexpensive and highly reliable semiconductor light emitting device can be obtained. However, the metal film formed on the first conductivity type and the second conductivity type semiconductor layer may be different in type, laminated structure, film thickness, and the like.

  The pad electrode in such a semiconductor light emitting element is, for example, an Rh / Pt / Au electrode in which Rh, Pt, and Au are sequentially laminated from the semiconductor layer side (each film thickness is, for example, 100 nm / 200 nm / 500 nm). Pt / Au electrode (film thickness is, for example, 20 nm / 700 nm) or the like in which Pt and Au are sequentially laminated by sputtering. By using Au as the uppermost layer of the pad electrode, it is possible to ensure good connection with a conductive wire or the like mainly composed of Au. Further, by stacking Pt between Rh and Au, diffusion of Au or Rh can be prevented, and highly reliable electrical connection as an electrode can be obtained. Rh is excellent in light reflectivity and barrier properties, and can be suitably used because light extraction efficiency is improved. Of these, a laminated film of Pt / Au (in the case of face-up) and Rh / Au (in the case of face-down) is preferable.

  The semiconductor layers formed on the substrate are a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer in order from the substrate side. An undoped or doped semiconductor layer may be stacked between the substrate and the first conductivity type semiconductor layer. In addition, these semiconductor layers are preferably nitride semiconductor layers. Specifically, a stacked structure of semiconductor layers as shown in the following (1) to (5) can be given.

(1) A buffer layer made of GaN having a thickness of 200 、, an n-type contact layer made of Si-doped n-type GaN having a thickness of 4 µm, and a single quantum well structure made of undoped In _0.2 Ga _0.8 N having a thickness of 30 Å An active layer, a p-type cladding layer made of Mg-doped p-type Al _0.1 Ga _0.9 N having a thickness of 0.2 μm, and a p-type contact layer made of Mg-doped p-type GaN having a thickness of 0.5 μm.

(2) A buffer layer made of AlGaN having a thickness of about 100 mm, an undoped GaN layer having a thickness of 1 μm, an n-side contact layer made of GaN containing 4.5 × 10 ¹⁸ / cm ³ of Si having a thickness of 5 μm, and 3000 μm undoped. An n-side first multilayer film composed of three layers: a lower layer made of GaN, an intermediate layer made of GaN containing 4.5 × 10 ¹⁸ / cm ^{3 of} 300 Ｓｉ Si, and an upper layer made of 50 Å undoped GaN (total film) A thickness of 3350 mm), 40 mm of nitride semiconductor layers made of undoped GaN, and 20 mm of nitride semiconductor layers made of undoped In _0.1 Ga _0.9 N were alternately stacked, and 10 layers of nitride semiconductor layers made of undoped GaN were further stacked. An n-side second multilayer film layer (total film thickness: 640 mm) having a superlattice structure formed with a thickness of 40 mm, a barrier layer made of undoped GaN with a film thickness of 250 mm Thickness active layer of multiple quantum well structure barrier further thickness is laminated by six layers alternately an In _0.3 Ga _0.7 consisting of N well layer and the repetition of 30Å is made of undoped GaN of 250Å was formed (total film A thickness of 1930 mm), a nitride semiconductor layer composed of Al _0.15 Ga _0.85 N containing 5 × 10 ¹⁹ / cm ^{3 of} Mg and a nitride semiconductor layer composed of In _0.03 Ga _0.97 N containing 5 × 10 ¹⁹ / cm ^{3 of} Mg A p-side multilayer having a superlattice structure in which a nitride semiconductor layer made of Al _0.15 Ga _0.85 N containing 5 × 10 ¹⁹ / cm ^{3 of} Mg and 5 × 10 ¹⁹ / cm ³ is further laminated alternately with 5 layers each having a thickness of 40 mm. A p-side contact layer made of GaN containing 1 × 10 ²⁰ / cm ³ of Mg having a film layer (total film thickness 365 mm) and a film thickness of 1200 mm.

(3) A buffer layer made of AlGaN having a thickness of about 100 mm, an undoped GaN layer having a thickness of 1 μm, an n-side contact layer made of GaN containing 4.5 × 10 ¹⁸ / cm ³ of Si having a thickness of 5 μm, and 3000 μm undoped. An n-side first multilayer film composed of three layers: a lower layer made of GaN, an intermediate layer made of GaN containing 4.5 × 10 ¹⁸ / cm ^{3 of} 300 Ｓｉ Si, and an upper layer made of 50 Å undoped GaN (total film) A thickness of 3350 mm), 40 mm of nitride semiconductor layers made of undoped GaN, and 20 mm of nitride semiconductor layers made of undoped In _0.1 Ga _0.9 N were alternately stacked, and 10 layers of nitride semiconductor layers made of undoped GaN were further stacked. The n-side second multilayer film layer (total film thickness: 640 mm) having a superlattice structure formed with a thickness of 40 mm, and is initially composed of undoped GaN with a film thickness of 250 mm. Wall layer and subsequently thickness first barrier layer and the thickness of the well layer and the film thickness made of In _0.3 Ga _0.7 N of 30Å consists 100Å of In _0.02 Ga _0.98 N second made of undoped GaN of 150Å An active layer having a multiple quantum well structure (total film thickness of 1930 mm) formed by alternately and alternately stacking 6 barrier layers alternately (the number of layers alternately stacked is preferably in the range of 3 to 6 layers), and 5 Mg Nitride semiconductor layer made of Al _0.15 Ga _0.85 N containing × 10 ¹⁹ / cm ³ and 40 Å and 25 を nitride semiconductor layer made of In _0.03 Ga _0.97 N containing 5 × 10 ¹⁹ / cm ³ Mg are repeated 5 layers each. A p-side multi-layer film having a superlattice structure in which nitride semiconductor layers made of Al _0.15 Ga _0.85 N containing 5 × 10 ¹⁹ / cm ³ and further containing Mg 5 × 10 ¹⁹ / cm ³ are formed in a thickness of 40 mm (total film thickness 365 mm) ) M with a film thickness of 1200 mm The 1 × 10 ²⁰ / cm ³ p-side contact layer made of GaN containing.

(4) Buffer layer, undoped GaN layer, n-side contact layer made of GaN containing 6.0 × 10 ¹⁸ / cm ^{3 of} Si, undoped GaN layer (the above is an n-type nitride semiconductor layer with a total film thickness of 6 nm), Si the 2.0 × 10 ¹⁸ / cm ³ comprising GaN barrier layer and the active layer of the InGaN well layer and a multiple quantum well which is repeated alternately stacked five layers of, 5.0 × the Mg having a thickness of 1300 Å 10 ¹⁸ / A p-type nitride semiconductor layer made of GaN containing cm ³ and an InGaN layer having a thickness of 50 mm may be provided between the light-transmitting conductive layer and the p-type nitride semiconductor layer.

(5) Buffer layer, undoped GaN layer, n-side contact layer made of GaN containing 1.3 × 10 ¹⁹ / cm ^{3 of} Si, undoped GaN layer (the above is an n-type nitride semiconductor layer having a total film thickness of 6 nm), Si Active layer (total film thickness of 800 mm) in which 7 layers of GaN barrier layers and InGaN well layers containing 3.0 × 10 ¹⁸ / cm ³ are alternately stacked, and Mg with a film thickness of 1300 mm 2 A p-type nitride semiconductor layer made of GaN containing 0.5 × 10 ²⁰ / cm ³ and an InGaN layer having a thickness of 50 mm may be provided between the light-transmitting conductive layer and the p-type nitride semiconductor layer.

  In addition, the semiconductor light emitting device according to the embodiment of the present invention may include a light conversion member that converts part of light from the light emitting device into light having a different wavelength. Accordingly, a light-emitting device in which light from the light-emitting element is converted can be obtained, and a light-emitting device having a white color or a light bulb color can be obtained by using mixed color light of light emission from the light-emitting element and converted light. Such a light conversion member includes Al and at least one element selected from Y, Lu, Sc, La, Gd, Tb, Eu, and Sm, and one element selected from Ga and In. And an aluminum garnet-based phosphor containing at least one element selected from rare earth elements. Thereby, even when the light emitting element is used with high output and high heat generation, a light emitting device having excellent temperature characteristics and excellent durability can be obtained.

The light converting member _{may, (Re 1-x R x} ) 3 (Al 1-y Ga y) 5 O 12 (0 <x <1,0 ≦ y ≦ 1, where, Re is, Y, Gd, La, It may be a phosphor represented by at least one element selected from the group consisting of Lu, Tb, and Sm, wherein R is Ce or Ce and Pr. As a result, in the same manner as described above, in a high-output light emitting element, an element having excellent temperature characteristics and durability can be obtained. In particular, when the active layer is InGaN, the temperature characteristic changes along with black body radiation, which is advantageous for white light emission.

Furthermore, the light conversion member contains at least one element selected from Be, Mg, Ca, Sr, Ba and Zn, and at least selected from C, Si, Ge, Sn, Ti, Zr and Hf. A nitride-based phosphor containing one element and activated by at least one element selected from rare earth elements may be used. Specific examples of the nitride-based phosphor include a general formula L _X Si _Y N (2 / 3X + 4 / 3Y): Eu or L _X Si _Y O _Z N (2 / 3X + 4 / 3Y-2 / 3Z): Eu (L Is any one of Sr and Ca, or Sr and Ca. Thereby, it is possible to obtain a light-emitting element having excellent temperature characteristics and durability in a high-output light-emitting element similar to the phosphor. In particular, when the nitride-based phosphor is a silicon oxynitride compound, an excellent phosphor can be obtained. Further, by combining with the above-mentioned aluminum / garnet phosphor, the temperature characteristics of the two interact with each other, and a light emitting device with a small temperature change of the mixed color can be obtained.

  Further, in the semiconductor light emitting device according to the embodiment of the present invention, it is preferable that the metal film is not only used as a pad electrode but also provided with an extended conductive portion. As a result, the entire active layer can emit light efficiently, which is particularly effective when a semiconductor light emitting device is provided by face-up mounting. Examples of the pad electrode provided with the extended conductive portion include configurations as shown in FIGS.

  As shown in FIGS. 4 and 5, the n-electrode 53 is formed so as to be close to at least one side of the semiconductor light emitting element. For example, in the central part of one side, a p-type semiconductor layer and a part of the active layer are removed by etching to provide a notch 51a in which the n-type contact layer 51 is exposed, and an n-electrode 53 is provided in the notch 51a. Form. 52 is a p-type contact layer.

  The p-side pad electrode 55 is formed on the translucent electrode 54 at a position adjacent to the side facing the side where the n-electrode is close. Further, the extended conductive portion 56 (57) on two lines is connected to the p-side pad electrode 55, and the extended conductive portion 56 is adjacent to the p-side pad electrode 55 from both sides (see FIG. 4 is extended along the upper side). As a result, the active layer located between the p-side pad electrode 55 and the n-electrode 53 can emit light efficiently, and the extended conductive portion 56 connected to the p-side pad electrode 55 is electrically connected to the translucent electrode 54. By forming so as to be electrically conductive, the current can be effectively diffused throughout the p layer, and the entire light emitting layer can be made to emit light efficiently. Further, light emission with high luminance can be obtained at the periphery of the p-side pad electrode 55 and the extended conductive portion 56. Therefore, in the embodiment of the present invention, it is more preferable that the light emission with high luminance in the peripheral portion of the extended conductive portion 56 is effectively used.

  Specifically, in order to secure the above-described high-luminance light emission between the extended conductive portion 56 and the edge of the light emitting layer and the p layer formed along the extended conductive portion 56, It is preferable to leave a space between the edge and the extended conductive portion 56. When the sheet resistance RnΩ / □ of the n-type contact layer 51 and the sheet resistance RpΩ / □ of the translucent electrode 54 satisfy the relationship of Rp ≧ Rn, the extended conductive portion 56 and the edge of the light emitting layer Is preferably 20 μm or more and 50 μm or less. This is because if the interval is smaller than 20 μm, a sufficient peripheral region where light emission with high luminance can be obtained cannot be secured (the region where light emission with high luminance should be obtained protrudes outside). This is because a portion having a low emission luminance is formed along the line, resulting in a decrease in luminance as a whole.

  Further, as shown in FIG. 4, each of the extended conductive portions 56 is preferably formed in an arc shape so as to be equidistant from the n-electrode 53, and when this is provided linearly as shown in FIG. Compared to the above, a more uniform emission distribution can be obtained.

  Further, as shown in FIGS. 6 and 7, the n electrode 63 is provided so as to be close to the two sides at one corner of the semiconductor light emitting device, and the pad electrode is diagonally opposite the corner where the n electrode 63 is close. More preferably, it is provided at the other corners forming

  Even when the n-electrode 63 and the p-side pad electrode 65 are diagonally arranged, as shown in FIGS. 6 and 7, the extended conductive portions 66 provided on the translucent electrode 64 are respectively n-electrodes. It is preferably formed in an arc shape so as to be equidistant from 63, whereby higher luminance and more uniform light emission can be obtained. In this case as well, the distance between the extended conductive portion 66 and the edge of the light emitting layer is preferably 20 μm or more and 50 μm or less in order to secure a sufficient region where light emission with high luminance can be obtained as described above.

  Hereinafter, semiconductor light emitting devices and electrodes thereof according to embodiments of the present invention will be described in detail with reference to the drawings.

The semiconductor light emitting device prepared as Example 1 will be described in detail with reference to FIG. In the semiconductor light emitting device 10, a buffer layer (not shown) made of Al _0.1 Ga _0.9 N and a non-doped GaN layer (not shown) are stacked on a sapphire substrate 1, and an n-type semiconductor layer 2 is formed thereon. , An n-type contact layer made of Si-doped GaN, a superlattice n-type cladding layer in which a GaN layer (40Å) and an InGaN layer (20Å) are alternately laminated 10 times, and a film is first formed thereon. A barrier layer made of undoped GaN having a thickness of 250 と, a well layer made of In _0.3 Ga _0.7 N having a thickness of 30 と, a first barrier layer made of In _0.02 Ga _0.98 N having a thickness of 100 と, and a thickness of 150 Å As the p-type semiconductor layer 4, the active layer 3 (total thickness 1930 mm) having a multiple quantum well structure in which the second barrier layers made of undoped GaN are alternately and repeatedly stacked in six layers are formed. The Al _0.1 Ga _0.9 N layer, (40 Å) and Mg-doped InGaN layer (20 Å) and superlattice p-type cladding layer stacked 10 times alternately, the p-type contact layer made of Mg-doped GaN are laminated in this order configuration Is done.

  In a part of the n-type semiconductor layer 2, the active layer 3 and the p-type semiconductor layer 4 stacked thereon are removed, and a part of the n-type semiconductor layer 2 itself in the thickness direction is removed. An n-electrode 7 is formed on the exposed n-type semiconductor layer 2.

On the p-type semiconductor layer 3, a translucent electrode 5 made of ITO is formed on almost the entire surface, and an opening for forming a part of the pad electrode 6 is formed on the translucent electrode 5. Thus, a conductive oxide film 8 is formed. In the translucent electrode 5, a region 5a having a low in-film oxygen concentration is formed on the pad electrode 6 side, and a region 5b having a high in-film oxygen concentration is formed on the p-type semiconductor layer 3 side. Such a semiconductor light emitting device can be formed by the following manufacturing method.
<Formation of semiconductor layer>

On a 2 inch φ sapphire substrate 1, using a MOVPE reactor, a buffer layer made of Al _0.1 Ga _0.9 N is made 100 μm, a non-doped GaN layer is 1.5 μm, and an n-type semiconductor layer 2 is made of n doped Si-doped GaN. The n-type cladding layer 5 of the superlattice in which the n-type contact layer is 2.165 μm, the GaN layer (40 cm) and the InGaN layer (20 cm) are alternately laminated 10 times, is made of 640 cm, and is initially made of undoped GaN having a film thickness of 250 mm. A barrier layer, followed by a well layer made of In _0.3 Ga _0.7 N with a thickness of 30 と, a first barrier layer made of In _0.02 Ga _0.98 N with a thickness of 100 と, and a second layer made of undoped GaN with a thickness of 150 とThe Mg-doped Al _{0 is used} as the active layer 3 (total film thickness 1930 mm) having a multi-quantum well structure in which six barrier layers are alternately and repeatedly stacked and the p-type semiconductor layer 4 is formed. _.1 0.2 μm of the superlattice p-type cladding layer in which the Ga _0.9 N layer (40 Å) and the Mg-doped InGaN layer (20 Å) are alternately stacked 10 times, and the p-type contact layer made of Mg-doped GaN is 0.1 μm. The wafer was grown by growing in this order with a film thickness of 5 μm.
<Etching>

The obtained wafer was annealed in a reaction vessel at 600 ° C. in a nitrogen atmosphere to further reduce the resistance of the p-type cladding layer and the p-type contact layer. After annealing, the wafer was taken out of the reaction vessel, a mask having a predetermined shape was formed on the surface of the uppermost p-type contact layer, and etching was performed from above the mask with an etching apparatus to expose a part of the n-type contact layer. .
<Formation of ITO film>

After removing the mask, a wafer is placed in the sputtering apparatus, and a first oxide target made of a sintered body in which In ₂ O ₃ and SnO ₂ are mixed at a weight ratio of 95: 5, and this In ₂ O _3. A second target obtained by further adding In to the sintered body of SnO ₂ with a weight ratio of 90:10 was placed as an ITO target. First, sputtering is performed with an argon gas as a sputtering gas in an oxygen gas atmosphere using a sputtering apparatus, using a first oxide target, for example, at an RF power of 10 W / cm ³ for 5 minutes, and subsequently changed to a second target. By sputtering for 15 minutes, the translucent electrode 5 made of ITO was formed to a thickness of 4000 mm on almost the entire surface of the p-type contact layer 8 of the wafer. The obtained translucent electrode 5 had good translucency and could be observed through the sapphire substrate 1.
<Formation of pad electrode>

A mask having a predetermined pattern is formed on the translucent electrode 5 by using a resist, and a Pt layer and an Au layer are stacked in this order on the translucent electrode 5, and a bonding pad electrode 6 is formed with a total film thickness of 1 μm by a lift-off method. Formed. Thereafter, an n-electrode 7 made of Rh / Pt / Au was formed on the n-type contact layer with a film thickness of 7000 mm, and heat treatment was performed at 400 ° C. or higher with an annealing apparatus to alloy the electrode. Further, the insulating oxide film 8 made of ZrO ₂ is formed with a thickness of 2000 mm on the surface and side surfaces of the semiconductor laminated structure and the conductive oxide film so that part of the surface of the pad electrode 6 and the n electrode 7 is exposed. Formed. The obtained wafer was divided at a predetermined location to obtain a semiconductor light emitting device 10.

  The semiconductor light emitting device formed as described above is analyzed by SIMS from the surface of the oxide film 8 to the ITO film 5 and the semiconductor layer 4 to measure the depth profile of the pad electrode, the translucent electrode, and the p-type semiconductor layer. did. The result is the tendency shown in FIG. 2. From FIG. 2, the ITO film has a region 5a having an oxygen concentration higher than the oxygen concentration on the p-type semiconductor layer 4 side in the vicinity of the interface on the pad electrode side. Was confirmed.

  With such a configuration, a region having a high oxygen concentration, that is, a low carrier concentration is formed on the surface of the ITO film, and the crystallinity is excellent in the vicinity of the interface with the oxide film. It can be taken out. Further, since a region having a low oxygen concentration, that is, a large amount of carriers is formed on the semiconductor layer side of the ITO film, the Schottky barrier with the semiconductor layer can be reduced. In addition, the ITO film can lower the sheet resistance on the side of the semiconductor multilayer structure with the semiconductor layer on the surface and can perform current injection most efficiently into the semiconductor multilayer structure, so that a semiconductor light emitting device with high luminous efficiency can be obtained.

  Next, the semiconductor light emitting device of Example 2 uses the first oxide target when forming the ITO film in the manufacturing process of Example 1, and initially uses only argon gas as the sputtering gas. A semiconductor light emitting device having the same configuration was obtained by substantially the same method as in Example 1 except that the sputtering gas was changed to a mixed gas of argon gas and oxygen gas.

Note that when the pressure of the sputtering gas at the time of film formation was about 0.01 to 0.5 Pa, the initial partial pressure of the oxygen gas was about 1 × 10 ⁻⁴ to 1 × 10 ⁻² Pa. The film formation time using only argon gas was about 5 minutes, and then the film was formed with a mixed gas of argon gas and oxygen gas for about 15 minutes.

  Also in the obtained semiconductor light emitting device, similarly to Example 1, a region having a high oxygen concentration, that is, a region with few carriers was formed on the surface of the ITO film, and excellent crystallinity in the vicinity of the interface with the oxide film, Light from the light emitting layer can be sufficiently extracted to the outside. Further, since a region having a low oxygen concentration, that is, a large amount of carriers is formed on the semiconductor layer side of the ITO film, the Schottky barrier with the semiconductor layer can be reduced. In addition, the ITO film can lower the sheet resistance on the side of the semiconductor multilayer structure with the semiconductor layer on the surface and can perform current injection most efficiently into the semiconductor multilayer structure, so that a semiconductor light emitting device with high luminous efficiency can be obtained.

The semiconductor light emitting device of Example 3 uses the second oxide target when forming the ITO film in the manufacturing process of Example 1, and the RF power of the sputtering apparatus is 2 W / cm ^{2 at the} initial stage of film formation. Then, a semiconductor light emitting device having the same configuration was obtained by substantially the same method as in Example 1 except that the acceleration was gradually accelerated to 10 W / cm ² .

  In the semiconductor light emitting device of Example 4, after forming the ITO film in the manufacturing process in Example 1, or after forming the 4000 ＩＴＯ ITO film using the first oxide target in the manufacturing process in Example 1 A semiconductor light emitting device having a configuration substantially similar to that of Example 1 was obtained by performing lamp annealing at 300 ° C. in an oxidizing gas atmosphere (for example, in an oxygen gas atmosphere). The oxygen concentration on the surface of the ITO film can be increased by causing the oxygen in the ITO film on the surface side to react with the oxidizing gas by the annealing treatment in the oxidizing gas atmosphere.

  In the semiconductor light emitting device of Example 5, after forming the ITO film in the manufacturing process of Example 1, or after forming the 4000 ＩＴＯ ITO film using the second oxide target in the manufacturing process of Example 1 As an oxide film, a single-layer film or a laminated film of a metal that is easily oxidized, such as Si or Sn, is formed with a film thickness of, for example, about 2 μm, and annealed at 300 ° C., thereby substantially the same as in Example 1. A semiconductor light emitting device having the structure was obtained. Thus, by forming the oxide film 8 and performing the heat treatment, oxygen in the oxide film moves to the ITO film, and the oxygen concentration on the surface of the ITO film can be increased.

The semiconductor element of Example 6 was produced in the same manner as in Example 1 except that the ITO film was formed as follows.
<Formation of ITO film>

After removing the mask, a wafer is placed in the sputtering apparatus, and a first oxide target made of a sintered body in which In ₂ O ₃ and SnO ₂ are mixed at a weight ratio of 90:10, and this In ₂ O _3. A second target obtained by further adding In to the sintered body of SnO ₂ and SnO ₂ at a weight ratio of 95: 5 was placed as an ITO target. First, using a sputtering apparatus, sputtering is performed using argon gas as a sputtering gas in an oxygen gas atmosphere, using a first oxide target, for example, at an RF power of 2 W / cm ³ for 5 minutes, and subsequently changed to a second target. Then, for example, by sputtering for 15 minutes at an RF power of 10 W / cm ³ , the translucent electrode 5 made of ITO was formed on the entire surface of the p-type contact layer 8 of the wafer with a thickness of 4000 mm. In the obtained ITO film, the oxygen concentration on the oxide film side can be made higher than in the film, and the Sn doping amount on the semiconductor layer side can be made higher than in the film.

  In the semiconductor light emitting device of Example 7, after forming an ITO film in the manufacturing process of Example 6, a single layer film or a laminated film of a metal that is easily oxidized, such as Si and Sn, is formed as an oxide film, for example, about 2 μm. A semiconductor light emitting device having a configuration substantially similar to that of Example 1 was obtained by annealing at 300 ° C. In this way, by forming the oxide film 8 and performing the heat treatment, oxygen in the oxide film is transferred to the ITO film, the oxygen concentration on the oxide side is increased, and the doping amount of Sn on the semiconductor layer side is increased. It can be higher than in the membrane. That is, the Schottky barrier can be further reduced, and the sheet resistance on the semiconductor multilayer structure side can be further reduced.

The semiconductor light emitting device of Example 8 is substantially the same as Example 1 except that in the manufacturing process of Example 1, an ITO film is formed, a vacuum deposition method is used instead of the sputtering method. By the method, a semiconductor light emitting device having the same configuration was obtained. The wafer with a part of the n-type contact layer exposed is placed in a vacuum evaporation system, and while maintaining the wafer temperature at 100 ° C., ITO with 10% SnO ₂ is heated and evaporated with an electron gun to form an ITO film. A film was formed. During the film formation, the wafer temperature was rapidly raised to 300 ° C. for 10 seconds using a heating means to form an ITO film having a film thickness of 4000 mm. In this way, the wafer temperature is rapidly raised during film formation, and the film is first formed at a temperature lower than the crystallization temperature of ITO, and subsequently formed at the crystallization temperature. In this case, an ITO film having a high oxygen concentration can be formed.

In the manufacturing process of Example 8, the semiconductor light emitting device of Example 9 was formed in the latter half of the film formation by using an ion gun while maintaining the wafer temperature at 300 ° C. when forming the ITO film by vacuum deposition. In addition, a semiconductor light emitting device having the same configuration was obtained in substantially the same manner as in Example 4 except that the wafer surface (p-type semiconductor layer) was irradiated with oxygen ions at about 1012 ions / cm ² .

  In the semiconductor light emitting device of Example 10, in the manufacturing process of Example 8, when the ITO film was formed by vacuum deposition, the film formation rate at the initial stage of film formation was maintained at 5 ° C./second while maintaining the wafer temperature at 300 ° C. Then, a semiconductor light emitting device having the same configuration was obtained by a method substantially similar to that in Example 4 except that the acceleration was accelerated to 50 K / sec. Thus, by accelerating the film formation rate, the temperature of the vapor deposition particles constituting the ITO film is increased, the reactivity with oxygen is improved, and the oxygen concentration of the ITO film on the surface side can be increased.

  The semiconductor light emitting device of Example 11 is substantially the same as Example 1 except that, in the manufacturing process of Example 1, an ITO film is formed, an ion plating method is used instead of the sputtering method. By this method, a semiconductor light emitting device having the same configuration was obtained. That is, a wafer from which a part of the n-type contact layer is exposed is introduced into an ion plating apparatus equipped with a plasma gun, and O 2 gas as a reaction gas is introduced into the reaction chamber. Further, Ar gas is introduced into the plasma gun so that the pressure inside the plasma gun is higher than that in the reaction chamber. Electrons emitted from the cathode built in the plasma gun are guided by a magnetic field and concentratedly irradiated to the ITO pellets charged in the crucible. At this time, the evaporant evaporated from the ITO pellets and oxygen gas are activated in the plasma by electron beam heating, and are deposited on the wafer to form an ITO film. In the initial stage of film formation, the oxygen concentration of the ITO film on the surface side can be increased by setting the power applied to the plasma gun to 1 kW and then 3 kW.

  The semiconductor light emitting device of the present invention can be applied to, for example, an LED device such as a full color LED display, an LED traffic light, a road information display board, or a light receiving device such as a solar cell or an optical sensor, or an electronic device (FET). And a light source for optical disks using these, and media such as a DVD for storing a large amount of information, a light source for communication, a printing device, an illumination light source, and the like. As an illumination application, it can be used for a backlight light source, a vehicle lamp, and the like.

It is sectional drawing which shows the structure of the semiconductor light-emitting device which concerns on one embodiment of this invention. It is a graph which shows the depth profile of oxygen in the electroconductive oxide film (ITO film | membrane) in FIG. It is a graph which shows the depth profile of the tin in the ITO film | membrane in FIG. It is a top view for demonstrating the electrode shape of the semiconductor light-emitting device based on one Example of this invention. It is a top view for demonstrating the electrode shape of the semiconductor light-emitting device based on the other Example of this invention. It is a top view for demonstrating the electrode shape of the semiconductor light-emitting device which concerns on another Example of this invention. It is a top view for demonstrating the electrode shape of the semiconductor light-emitting device which concerns on another Example of this invention.

Reference Signs List 1 substrate 2 n-type semiconductor layer 3 active layer 4 p-type semiconductor layer 5 translucent electrode 5a region 5b region 6 pad electrode 7 n electrode 8 insulating oxide film 10 semiconductor light emitting device

Claims (8)

A semiconductor light emitting device comprising a semiconductor stacked structure in which a semiconductor layer containing gallium as the first element A is located on the surface,
On the surface of the semiconductor layer, a conductive oxide film made of indium tin oxide, and an oxide film containing the second element B,
Said conductive oxide film, the film oxygen concentration in the vicinity of the interface between oxide film containing the second element B is the rather high than the membrane oxygen concentration in the vicinity of the interface between the semiconductor layer and the semiconductor A semiconductor light emitting element , wherein a tin concentration in a film near an interface with a layer is higher than a tin concentration in a film near an interface with the oxide film containing the second element B.   2. The semiconductor light emitting device according to claim 1, wherein the second element B has a Pauling value indicating an electronegativity higher than that of gallium. 3. The semiconductor light emitting device according to claim 1, wherein the second element B has a Pauling value indicating an electronegativity higher than that of indium and tin .   4. The semiconductor light emitting device according to claim 1, wherein the oxide film containing the second element B is a protective film for an insulating oxide film. 5.   5. The semiconductor light emitting device according to claim 1, wherein the semiconductor layer is a nitride semiconductor layer. 6.   6. The semiconductor light emitting device according to claim 1, wherein the conductive oxide film is a translucent electrode.   7. The semiconductor light-emitting device according to claim 1, wherein the oxide film containing the second element B is a surface of the conductive oxide film, wherein the second element B is silicon. A semiconductor light-emitting element, which is a protective film provided on the substrate.   8. The semiconductor light emitting device according to claim 1, wherein an oxygen concentration in the conductive oxide film is between the interface with the oxide film containing the second element B and the semiconductor layer. A semiconductor light emitting element characterized by gradually decreasing toward an interface.

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