JP4542763B2 - Wiring board for IC inspection and its manufacturing method - Google Patents

Description

  The present invention relates to an IC inspection wiring board in which an IC receiving wall is provided on the wiring board and a method for manufacturing the same.

  Conventionally, inspection IC sockets have been widely used in which a socket contact is implanted in a socket substrate and the IC is connected to the inspection printed circuit board through the contact. Recently, however, the density of IC electrodes has been increased (minimum pitch). In order to cope with this, an IC socket is known in which a wiring board in which the pitch of the IC contact electrodes is relatively easy is assembled to a socket board and the wiring board is used as a connection medium instead of the punching contact.

  In the IC socket, a socket substrate having an IC receiving portion is integrally formed with an insulating material, and the wiring substrate is assembled to the socket substrate with a screw or the like, and the IC contact electrode group included in the wiring substrate is received by the assembly. It is arranged in the department.

  In many of such IC sockets, an IC pressing cover is pivotally supported at one end of the socket substrate so that the IC pressing cover can be opened and closed. After the IC is received in the IC receiving portion of the socket substrate, the IC pressing cover is closed to the socket substrate. In general, a configuration is adopted in which the IC is pressed and the electrode group disposed on the lower surface of the IC is brought into pressure contact with the electrode contact electrode group of the wiring board assembled to the socket substrate.

  As described above, in the conventional IC socket, when the wiring board is used as a contact means with an external device, the wiring board is assembled to the socket board with screws or the like, and the IC contact electrode group possessed by the wiring board is assembled by the assembly. Although it is arranged in the IC receiving part, in the assembly structure using screws or the like, the IC receiving wall is loaded between the IC receiving wall and the IC contact electrode group due to manufacturing errors between them, that is, in the IC receiving part defined by the IC receiving wall. The electrode group of the IC and the IC contact electrode group of the wiring board tend to be displaced, and a proper contact between the IC electrode group arranged at high density and the IC contact electrode group is obtained with a slight displacement. There is a problem that it becomes difficult to properly cope with the increase in the density of the electrodes of the IC.

  Also, the entire socket must be discarded due to short-term wear of the IC receiving wall, which is uneconomical. Alternatively, when replacing the wiring board due to contact function deterioration due to foreign matter adhesion or wear of the IC contact electrode, it takes a lot of time to assemble the wiring board while accurately positioning the wiring board with respect to the socket board.

  At present, IC socket manufacturers and wiring board manufacturers are different, and it is common practice to obtain both from different manufacturers and assemble them together to complete the IC socket, which leads to the above problems It can be said that it is the cause.

An object of the present invention is to provide a method of manufacturing a wiring board for IC inspection that solves the above problems. In the present invention, the IC inspection wiring board has an open type IC receiving wall molding open mold part closed with the wiring board, and a fluid insulating material is placed in the IC receiving wall molding cavity formed by the closure by the wiring board. Manufactured by filling and molding an IC receiving wall on a wiring board, and is very easy to manufacture.

  In the above manufacturing method, the positioning projection provided on the upper surface of the wiring board is received in the positioning hole provided on the lower surface of the open-type IC receiving part molding die, and the IC contact electrode group included in the wiring board and the above-mentioned A relative position with respect to the IC receiving wall formed in the IC receiving wall forming cavity is set.

  The wiring substrate is formed of a rigid substrate made of an insulating material or a flexible substrate (film substrate).

  The best mode for carrying out the present invention will be described below with reference to FIGS.

  1 and 2 exemplify a rectangular wiring substrate 1 prepared for forming the above-described IC inspection wiring substrate. As shown in the drawing, the wiring substrate 1 has a fine pitch in the central region of the upper surface. In addition to having two IC contact electrodes arranged on the lower surface, there are three groups of external device contact electrodes arranged on the lower surface of the IC contact electrode. There are four groups of leads for individually connecting the three groups of device contact electrodes.

  That is, as shown in the lower part of FIG. 3, the IC contact electrodes 2 groups (bump groups) are formed at the inner ends of the lead 4 groups, respectively, and the external device contact electrodes 3 groups are formed at the outer ends. As shown in the upper part of FIG. 3, the lead 4 group is arranged in parallel with the pitch being increased from the inner end to the outer end, and the pitch of the external device contact electrode 3 group with respect to the IC contact electrode 2 group is increased. Expand. The leads 4 are covered with an insulating material as necessary.

  The outer end of the lead 4 group and the external device contact electrode 3 group are connected by a connection conductor 5 penetrating the wiring board 1. Alternatively, the lead 4 group is arranged on the lower surface of the wiring board 1, and the inner end of the lead 4 group and the IC contact electrode 2 group are connected by a connection conductor 5 penetrating the wiring board 1.

  Alternatively, a multilayer substrate is used as the wiring substrate 1, and the outer ends of the lead 4 groups extending on the upper surface of the substrate 1 and the external device contact electrodes 3 group are connected via the internal wiring (interlayer connection wiring) of the multilayer substrate. Connecting. Alternatively, the lead 4 group is arranged on the lower surface of the wiring board 1 and the inner end of the lead 4 group and the IC contact electrode 2 group are connected via the internal wiring of the multilayer board.

  In this case, the IC contact electrode group 2 can be connected to the external device contact electrode group 3 via the interlayer connection wiring without providing the lead 4 group.

  The wiring substrate 1 having the IC contact electrode 2 group, the external device contact electrode 3 group, and the lead 4 group is formed by etching a conductive metal foil such as a copper foil layered on the surface of a rigid substrate or a flexible substrate. It can be easily manufactured by an applying method or an additive method of forming wirings and bumps by plating, and the pitches of these 2, 3, and 4 can be easily reduced and expanded. That is, the wiring board 1 can be easily manufactured by a conventional circuit wiring board manufacturing technique or bump forming technique.

  A wiring board 1 having the above-mentioned IC contact electrodes 2 group and external device contact electrodes 3 group or a wiring board 1 having these electrodes 2 and 3 groups and leads 4 group is prepared. As shown in FIG. An open mold 6 and a closed mold 9 are prepared as molds for the wall 8, the open mold part 7 for forming the IC receiving wall of the open mold 6 is closed with the wiring board 1, and the IC receiving wall is formed by the closing. The cavity 7 ′ is filled with a fluid insulating material typified by fluid synthetic resin, and the IC receiving wall 8 is formed on the wiring board 1.

  More specifically, the lower surface of the wiring board 1 is supported on the flat upper surface of the closed mold (wiring board support mold) 9. That is, the lower surface of the wiring board 1 is supported on the upper surface of the closed mold 9 by the external device contact electrodes 3 group.

  An open mold 6 having an open mold portion 7 for forming an IC receiving wall that can be opened on the other lower surface is prepared, the open mold 6 and the closed mold 9 are clamped, and the lower surface of the peripheral edge of the open mold 6, that is, an IC receiving wall molding. The first seal portion 10 formed in the outer peripheral area of the open mold portion 7 is brought into close contact with the upper surface of the peripheral edge portion of the closed mold 9.

  That is, the lower surface of the first seal part 10 is brought into close contact with the upper surface of the peripheral edge of the closed mold 9 in the outer peripheral area of the wiring board 1, and the lower open surface of the open mold part 7 is closed with the wiring board 1 to form a rectangular ring shape. The IC receiving wall forming cavity 7 'is formed in communication.

  At the same time, the lower surface of the IC receiving portion molding die 11 formed at the center of the lower surface of the open die 6 is brought into close contact with the upper surface of the wiring substrate 1, covering the region where the IC contact electrodes 2 are arranged, and receiving the IC. Shut off from the wall forming cavity 7 '.

  The IC receiving part molding die 11 has an electrode receiving part 12 for receiving the IC contact electrodes 2 group (bump group) of the wiring board 1 on the lower surface thereof.

  Further, a positioning hole 13 is provided on the lower surface of the IC receiving portion molding die 11, that is, on the outer peripheral area of the electrode receiving portion 12, and on the other hand, an IC contact electrode group 2 is provided on the upper surface of the wiring substrate 1. Positioning projections 14 are provided in the outer peripheral area of the region, and the positioning projections 14 are fitted into the positioning holes 13 so that the wiring substrate 1 is positioned relative to the open mold 6.

  The positioning of the IC contact electrode 2 group and the IC can be performed by positioning at the periphery of the lower surface of the IC receiving portion forming mold portion 11 in the immediate vicinity of the region where the IC contact electrode 2 group is disposed. The relative position of the receiving wall 8 is positioned with high accuracy.

  Further, a second seal portion 15 is formed on the inner peripheral surface of the first seal portion 10 on the lower surface of the peripheral portion of the open mold portion 7 for forming the IC receiving wall. A lower second seal portion 15 is formed continuously inside, the upper surface of the peripheral portion of the wiring board 1 is pressed by the second seal portion 15, and the upper surface of the peripheral portion of the wiring substrate 1 is pressed against the second seal of the open mold 6. The wiring substrate 1 is sandwiched between the lower surface of the IC receiving portion molding die 11 and the closing die 9 while being sandwiched between the portion 15 and the closing die 9.

Therefore, the open mold part 7 for forming the IC receiving wall of the open mold 6 is closed by the wiring board 1, and the fluid receiving material is filled in the cavity part 7 ′ for forming the IC receiving wall formed by the closing by the wiring board 1. Then, demold after waiting for curing. Therefore, an IC inspection wiring board in which the IC receiving wall 8 is formed on the wiring board 1 shown in FIG.
The IC receiving wall is formed by integrally bonding a fluid insulating material typified by a fluid synthetic resin to the upper surface of the wiring substrate by molding and curing on the upper surface of the wiring substrate, and the wiring substrate is formed in the IC receiving portion defined by the IC receiving wall. It is set as the structure by which the electrode group for IC contact which has is arranged.
The IC inspection wiring board can function as inspection means similar to a known IC socket. Alternatively, as the most useful aspect, the socket is configured using the IC inspection wiring board as a structural element of the IC socket. That is, an inspection wiring board having an IC receiving wall integrally formed on the wiring board is assembled to the socket board to constitute an IC socket.
In any of the above examples, the wiring board is provided at a predetermined position in the IC receiving portion defined by the IC receiving wall by the IC inspection wiring board integrally formed with the IC receiving wall at the predetermined position of the wiring board. An IC contact electrode group can be arranged, and a highly accurate correspondence between the IC electrode accommodated in the IC receiving portion and the IC contact electrode of the wiring board can be achieved.
The IC inspection wiring board can be easily handled by integrally forming an IC receiving wall on the wiring board manufactured by the wiring board manufacturer by the socket manufacturer or the wiring board manufacturer.

The wiring board 1 has on its upper surface a group of external device contact electrodes 3 included in the board 1 and a group of leads 4 connecting the group of IC contact electrodes 2, and the group of leads 4 includes the IC receiving wall 8. It is embedded in the connection surface with the wiring board 1. The group of leads 4 exhibits an anchor effect, increases the bonding strength between the two 1 and 8, and conceals and protects the group of leads 4 with the IC receiving wall 8.
The wiring board has a lead group that is in close contact with the upper surface thereof, the IC contact electrode is formed on the inner end of the lead group, and the external device contact electrode that is in contact with the external device is formed on the outer end side. Then, all or a part of the lead group arranged in parallel with the upper surface of the wiring board is embedded in the coupling surface with the wiring board by forming the IC receiving wall. Therefore, the lead group is given an anchor effect to increase the bonding strength between them and to protect the lead group.

  As another example, when the group of leads 4 is not provided, an anchor means for improving the adhesion strength with the insulating material forming the IC receiving wall 8 is formed instead of the group of leads 4 shown in FIG. As the anchor means, a solid metal foil with a high surface roughness, a solid metal foil provided with a number of protrusions or recesses, or an appropriate metal pattern is attached to the upper surface of the wiring board 1 or layered by an etching method or an additive method. To do.

  Alternatively, without using the anchor means made of these separate members, protrusions and recesses can be provided on the upper surface of the wiring board 1 itself to provide the anchor means.

  In the above embodiment, the positioning protrusion 14 is provided on the wiring board 1 and the relative position with respect to the open mold 6 is determined. However, when the positioning protrusion 14 cannot be formed, that is, when the IC contact electrode 2 group is flat, (1) The wiring board 1 is positioned and mounted on the closed mold 9, and the positioning method uses a general method such as pin alignment or external positioning. (2) The open mold 6 is overlaid and filled with a fluid insulating material. (3 5) Inspecting the resin-molded product as shown in FIG. 5 and measuring the positional deviation between the IC receiving wall 8 and the IC contact electrode 2 group. (4) The mold is relatively displaced from the above measurement. Repeat (1) to (4) to improve the positional accuracy and perform mass production.

  As shown in FIG. 6, an IC socket is configured using the above-described IC inspection wiring board. That is, as described above, the IC socket includes the socket substrate 16 formed of an insulating material and the IC presser cover 17 pivotally supported at one end of the socket substrate 16 so as to be openable and closable. The substrate receiving portion 18 to be formed is formed by integral molding, the IC inspection wiring substrate is fitted into the substrate receiving portion 18, and the lower surface of the wiring substrate 1 is connected to the external device contact electrode 3 group. It is supported horizontally on the inner bottom surface of the substrate receiving portion 18.

  Further, a screw 20 is inserted into a peripheral hole of the IC inspection wiring board, for example, a mounting hole 19 provided in each corner portion, and a screw shaft is provided in each corner portion of the bottom wall of the substrate receiving portion 18. Then, the IC inspection wiring board is assembled to the socket substrate 16.

  Thus, the IC 22 is loaded into the IC receiving portion 23 defined by the IC receiving wall 8 of the wiring board for IC inspection, and the side surfaces of the IC 22 are regulated by the inner surface of the IC receiving wall 8. Then, the electrode group disposed on the lower surface of the IC 22 is brought into contact with the IC contact electrode group 2.

  Even if the mounting position of the wiring board for IC inspection by the screw 20 is slightly shifted, the relative position of the IC receiving wall 8 integrally formed on the wiring board 1 and the group 2 of IC contact electrodes, that is, the electrodes of the IC 22 The relative position between the group and the two IC contact electrodes is ensured appropriately.

  After the IC 22 is loaded into the IC receiving portion 23, the IC pressing cover 17 is closed, and the upper surface of the IC 22 is pressurized by the IC pressing portion 24 provided on the inner surface of the cover 17, so that the electrode group of the IC 22 and the IC contact electrode 2 are pressed. Press contact with the group.

  By engaging a lock lever 25 made of an insulating material pivotally supported on the free end of the IC pressing cover 17 with a stepped portion on one side surface of the socket substrate 16, the closing state is maintained, and the IC pressing state is maintained. Hold.

  As an example, a group of vertically moving contact pins 26 supported by springs are implanted and placed on the bottom wall of the board receiving portion 18 provided on the socket board 16, and the upper ends of the contact pins 26 group are placed on the outside. The lower surface of the group of device contact electrodes 3 is elastically pressure-contacted, and the lower end of the contact pin 26 group is elastically pressure-contacted to an electrode group of an external device typified by an inspection wiring circuit board. Is electrically connected to an external device.

  When an inspection IC socket is configured by assembling the inspection wiring board, when the IC receiving wall 8 is worn for a short time or when the IC contact electrodes 2 are worn, only the IC inspection wiring board is used. It is economical because it can be replaced and the socket body can be reused. Further, the work of assembling while accurately positioning the wiring board 1 with respect to the socket board is not required, and the mounting effort is reduced.

  The IC inspection wiring board is used as a component of the IC socket as described above, or can function alone as an IC socket.

Sectional drawing of the wiring board which comprises the wiring board for IC inspection. The bottom view of the said wiring board. FIG. 2 is a plan view (upper view) showing the arrangement of an IC contact electrode group and an external device contact electrode group on the wiring board, and a lead group connecting the two, and a sectional view showing the same arrangement (lower view). A and B are cross-sectional views showing a state in which an IC inspection wiring board is arranged in a molding die for forming an IC receiving wall on the wiring board, A is before filling with a fluid insulating material, and B is It shows after the filling. Sectional drawing of the wiring board for IC inspection shape | molded by the said shaping | molding die. Sectional drawing of the IC socket comprised by the said wiring board for IC inspection.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... IC contact electrode, 3 ... External device contact electrode, 4 ... Lead, 5 ... Connection conductor, 6 ... Open type, 7 ... IC receiving wall shaping | molding open part, 7 '... IC reception Wall forming cavity portion, 8 ... IC receiving wall, 9 ... closed mold, 10 ... first seal portion, 11 ... IC receiving portion forming mold portion, 12 ... electrode receiving portion, 13 ... positioning hole, 14 ... positioning protrusion, DESCRIPTION OF SYMBOLS 15 ... 2nd seal | sticker part, 16 ... Socket board | substrate, 17 ... IC press cover, 18 ... Board | substrate receiving part, 19 ... Mounting hole, 20 ... Screw, 21 ... Female screw hole, 22 ... IC, 23 ... IC receiving part, 24 ... IC presser, 25 ... Lock lever, 26 ... Contact pin

Claims (1)

An open mold for forming an IC receiving wall is closed with a wiring board, a fluid insulating material is filled in the cavity for forming an IC receiving wall formed by the closing by the wiring board, and the IC receiving wall is formed on the wiring board. The IC contact electrode group and the IC receiving wall which the wiring board has by receiving the positioning projections formed on the upper surface of the wiring board in the positioning holes provided on the lower surface of the mold part for molding the open type IC receiving part. A method of manufacturing a wiring board for IC inspection, characterized in that a relative position with respect to an IC receiving wall formed in the forming cavity is set .

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