JP4529599B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

As a light source for a panel display or the like, a light emitting device including a light emitting chip such as a light emitting diode (LED) may be used. In such a light emitting device, a reflecting member called a reflector is often provided for the purpose of improving light extraction efficiency. The following patent document discloses an example of a technique related to a light emitting device including a reflector.
Japanese Patent No. 2718339 Japanese Patent No. 3319392 JP 2001-44513 A

  In the above-described prior art, a wire (or lead frame) is used as an electrical connection between the electrode of the light emitting chip (LED) and the mounting substrate. Therefore, when high power (high current) is applied to the light-emitting chip for the purpose of increasing the brightness of the light-emitting chip, the connection part is likely to be deteriorated, such as the wire being cut without being able to withstand the high power. Exists. In addition, since it is necessary to provide a space (gap) for arranging a wire between the reflector and the light emitting chip, when mounting the reflector on the mounting substrate provided with the light emitting chip, the mounting substrate and the light emitting chip are provided. And positioning with the reflector may be difficult.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a light-emitting device that can achieve high brightness of a light-emitting chip and can be manufactured with good workability, and a method for manufacturing the same.

  In order to solve the above problems, a light-emitting device of the present invention includes a first electrode and a second electrode, and is provided on the first surface by being energized through the first electrode and the second electrode. In the light emitting device including the light emitting chip that emits light from the light emitting region, the light emitting device includes a reflector member having a reflecting surface that reflects the light emitted from the light emitting region in a predetermined direction, and the reflector member includes the first electrode and the first electrode. A first conductive portion that is electrically connected is provided.

  According to the present invention, the reflector member is provided with the first conductive portion that is electrically connected to the first electrode of the light emitting chip, and at least a part of the reflector member is used as the electrical connection portion with the first electrode. For example, compared with the connection part structure using a wire, even if a large electric power is applied to the light emitting chip, deterioration of the connection part can be suppressed. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased. Moreover, since the electrical connection between the first electrode and the first conductive portion can be obtained by directly connecting the reflector member and the light emitting chip, the positioning operation of the reflector member and the light emitting chip is smoothly performed. be able to. Therefore, the light emitting device can be manufactured with good workability.

  In the light emitting device of the present invention, the light emitting chip is provided on a side opposite to the first surface, has a second surface on which the second electrode is provided, and is mounted on the mounting substrate facing the second surface. A configuration in which a second conductive portion electrically connected to the second electrode is provided can be employed.

  According to the present invention, by providing the second electrode on the second surface opposite to the first surface, the second conductive portion of the mounting substrate facing the second surface and the second electrode can be smoothly connected. The light emitting chip can be energized via the first electrode and the second electrode.

  In the light emitting device of the present invention, the reflector member has a third surface facing a part of the first surface, and the first conductive portion is provided on the third surface. Can do.

  According to the present invention, since the reflector member has the third surface facing the first surface provided on the light emitting chip, by arranging the first surface and the third surface to face each other, With the light emitting chip positioned well with respect to the reflector member, the first conductive portion provided on the third surface and the first electrode provided on the first surface can be connected well.

  In the light emitting device of the present invention, the third surface may employ a configuration that opposes a peripheral region of the first surface.

  According to the present invention, since the third surface faces the peripheral region of the first surface, the third surface can be disposed avoiding the light emitting region provided on the first surface. Therefore, the light emitted from the light emitting chip can be taken out favorably.

  In the light emitting device of the present invention, the first electrode can employ a configuration provided in a peripheral region of the first surface.

  According to the present invention, since the first electrode is provided in the peripheral region of the first surface, the first conductive portion and the first electrode provided in the third surface facing the peripheral region of the first surface are connected to the light emitting region. Can be connected well.

  In the light emitting device of the present invention, the first conductive portion may include a conductive film that covers the third surface.

  According to this invention, the 1st electroconductive part can be favorably provided in a desired position by making it the electroconductive film coat | covered on the 3rd surface of a reflector member.

  In the light emitting device of the present invention, the reflector member has a fourth surface facing the mounting substrate, and the first conductive portion is provided to be continuous between the third surface and the fourth surface. The configuration can be adopted.

  According to the present invention, the first conductive portion provided on the third surface is also provided so as to continue to the fourth surface of the reflector member that faces the mounting substrate. By electrically connecting the conductive portion and the third conductive portion on the mounting substrate, the power from the mounting substrate is supplied to the third conductive portion, the first conductive portion on the fourth surface, and the first conductive portion on the third surface. It can apply to a light emitting chip via a part.

  In the light emitting device of the present invention, a configuration in which the second surface of the light emitting chip and the fourth surface of the reflector member are substantially flush with each other can be employed.

  According to the present invention, since the second surface and the fourth surface facing the mounting substrate are substantially flush among the light emitting chip and the reflector member, when the light emitting chip and the reflector member are mounted on the mounting substrate. Workability can be improved.

  In the light emitting device of the present invention, the first electrode of the light emitting chip may be configured to be connected to the first conductive portion of the reflector member via a bump or a conductive paste.

  According to the present invention, since the first electrode of the light emitting chip and the first conductive portion of the reflector member are connected by so-called flip chip bonding (flip chip mounting) via a bump or a conductive paste, the light emitting chip and the reflector member are connected. Can be connected in a well-positioned state, and workability when mounting can be improved. Further, by connecting the light emitting chip and the reflector member by flip chip bonding, it is possible to suppress deterioration of the connection portion even if a large power is applied to the light emitting chip. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased.

  In the light emitting device of the present invention, the light emitting chip and the reflector member may be configured to be flip chip mounted on a mounting substrate.

  According to the present invention, since the light-emitting chip and the reflector member are flip-chip mounted on the mounting substrate, the light-emitting chip and the reflector member and the mounting substrate can be connected in a well-positioned state, and workability when mounting is performed. Can be improved. Further, by connecting the light emitting chip / reflector member and the mounting substrate by flip chip bonding, deterioration of the connection portion can be suppressed even if a large electric power is applied to the light emitting chip / reflector member. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased.

  In the light emitting device of the present invention, it is possible to adopt a configuration in which at least one of the surface of the first conductive portion and the first electrode is roughened.

  According to the present invention, since the surface of the first conductive portion or the surface of the first electrode is roughened, the first conductive portion and the first electrode are connected to each other via a connecting material such as a bump or a conductive paste. When connecting, the contact area between the connecting material and the surface of the first conductive portion or the first electrode can be increased. Therefore, the adhesive strength can be improved.

  In the light emitting device of the present invention, the reflector member may be a polyhedron having a plurality of surfaces, and at least a part of the plurality of boundaries between the surfaces may have a curved surface.

  When the corner portion is formed on the reflector member, the heat conductivity at the corner portion is reduced, and the heat caused by the light emission of the light emitting chip may be concentrated at the corner portion. According to the invention, it is possible to prevent the heat from being concentrated on a part of the reflector member by applying curved surface processing to the corner portion of the reflector member so as to reduce or eliminate the corner portion formed on the reflector member. it can.

  The method for manufacturing a light emitting device of the present invention includes a first electrode and a second electrode, and is energized through the first electrode and the second electrode, whereby a light emitting region provided on the first surface. In a method of manufacturing a light emitting device including a light emitting chip that emits light, a step of forming a reflector member having a reflecting surface that reflects light emitted from the light emitting region in a predetermined direction; and at least a part of the reflector member Providing a first conductive portion electrically connected to the first electrode.

  According to the present invention, after the reflector member is formed, the first conductive portion that is electrically connected to the first electrode of the light emitting chip is provided on at least a part of the reflector member. The first conductive portion can be satisfactorily provided at the position. Further, for example, compared with a connection portion structure using a wire, deterioration of the connection portion can be suppressed even when a large amount of power is applied to the light emitting chip. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased. Furthermore, since the reflector member and the light emitting chip can be directly connected, the positioning operation of the reflector member and the light emitting chip can be performed smoothly. Therefore, the light emitting device can be manufactured with good workability.

  In the manufacturing method of this invention, the structure which connects the 1st electrode of the said light-emitting chip and the 1st electroconductive part of the said reflector member through a bump | vamp can be employ | adopted.

  According to the present invention, since the first electrode of the light emitting chip and the first conductive portion of the reflector member are connected by so-called flip chip bonding (flip chip mounting) via the bump, the light emitting chip and the reflector member can be favorably connected. While being able to connect in the positioned state, workability at the time of mounting can be improved. Further, by connecting the light emitting chip and the reflector member by flip chip bonding, it is possible to suppress deterioration of the connection portion even if a large power is applied to the light emitting chip. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased.

  In the manufacturing method of the present invention, the method includes a step of forming a sheet-like member including a plurality of the reflector members, and after the light emitting chip is mounted on each of the reflector members formed on the sheet-like member, the sheet The structure which divides | segments a shaped member for every said reflector member is employable.

  According to the present invention, a plurality of reflector members are formed on the sheet-like member, and after mounting the light emitting chip on each of the reflector members on the sheet-like member, the sheet-like member is cut for each reflector member. A large number of reflector members mounted with light emitting chips can be efficiently manufactured.

  In the manufacturing method of the present invention, the mounting includes connecting the first electrode provided on the first surface of the light emitting chip and the first conductive portion provided on the third surface of the reflector member. Can be adopted.

  According to the present invention, the first electrode is provided on the first surface of the light emitting chip, the first conductive portion is provided on the third surface of the reflector member, and the first surface and the third surface are opposed to each other. Thus, the first electrode on the first surface and the first conductive part on the third surface can be smoothly connected with good workability.

  In the manufacturing method of the present invention, the light emitting chip has a second surface provided on the side opposite to the first surface, and the reflector member is substantially the same as the second surface in a state where the light emitting chip is mounted. A configuration having a fourth surface that is flush can be employed.

  According to the present invention, since the reflector member has the fourth surface that is flush with the second surface of the light emitting chip, the workability when mounting the light emitting chip and the reflector member on the mounting substrate is improved. can do.

  In the manufacturing method of the present invention, a configuration in which the reflector member on which the light emitting chip is mounted is flip-chip mounted on a mounting substrate can be employed.

  According to the present invention, since the light-emitting chip and the reflector member are flip-chip mounted on the mounting substrate, the light-emitting chip and the reflector member and the mounting substrate can be connected in a well-positioned state, and workability when mounting is performed. Can be improved. Further, by connecting the light emitting chip / reflector member and the mounting substrate by flip chip bonding, deterioration of the connection portion can be suppressed even if a large electric power is applied to the light emitting chip / reflector member. Therefore, high power can be applied to the light-emitting chip, so that the luminance of the light-emitting chip can be increased.

  In the manufacturing method of the present invention, it is possible to adopt a configuration in which the light emitting chip is also mounted on the mounting substrate together with the reflector member.

  According to the present invention, it is possible to efficiently mount each of the light emitting chip and the reflector member, which are connected in advance, with good positioning with respect to the mounting substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The predetermined direction in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, the vertical direction) is the Z-axis direction. To do. Furthermore, the rotation directions around the X, Y, and Z axes are the θX, θY, and θZ directions, respectively.

<Light emitting device>
An embodiment of a light emitting device will be described with reference to the drawings. 1 is a plan view of the light emitting device 1 according to the present embodiment as viewed from above, FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is an enlarged view of the vicinity of the region indicated by symbol B in FIG. FIG.

  In these drawings, the light emitting device 1 includes a light emitting chip 2, a reflector member 10, and a mounting substrate 20 that supports the light emitting chip 2 and the reflector member 10. The light emitting chip 2 is configured by a light emitting diode (LED) that is a solid light source, and includes an upper surface 4 having a light emitting region 3 and a lower surface 14 opposite to the upper surface 4. A first electrode 6 is provided on the upper surface 4 of the light emitting chip 2, and a second electrode 5 is provided on the lower surface 14. The light emitting chip 2 emits light from the light emitting region 3 provided on the upper surface 4 by being energized through the first electrode 6 and the second electrode 5.

  The reflector member 10 is for guiding the light emitted from the light emitting region 3 of the light emitting chip 2 in the upward direction (Z-axis direction) in FIG. 2, and the light emitted from the light emitting region 3 is directed in the Z-axis direction. The reflecting surface 11 reflects the light. A substantially rectangular opening 12 formed according to the shape of the light emitting chip 2 is formed at the center of the reflector member 10 in plan view. At least the light emitting region 3 of the light emitting chip 2 is disposed inside the opening 12. The inclined surface 11 is disposed so as to surround the light emitting chip 2 (light emitting region 3), and is inclined so as to be separated from the light emitting chip 2 toward the outside from the light emitting region 3.

  The second electrode 5 provided on the lower surface 14 of the light emitting chip 2 is connected to the upper surface 15 of the mounting substrate 20. In the present embodiment, the mounting substrate 20 is formed of a conductive material such as copper, and the mounting substrate 20 functions as a second conductive portion that is electrically connected to the second electrode 5. Note that a conductive film different from the mounting substrate 20 is formed on the upper surface 15 of the mounting substrate 20, and this conductive film is used as a second conductive portion that is electrically connected to the second electrode 5 of the light emitting chip 2. May be.

  Of the reflector member 10, a step portion is formed in the vicinity of the opening 12, and the facing surface 7 that faces a part of the upper surface 4 of the light emitting chip 2 provided on the mounting substrate 20 is formed by the step portion. Is formed. The facing surface 7 is provided in a frame shape so as to face the peripheral area of the upper surface 4 of the light emitting chip 2.

  A first electrode 6 is provided on a part of the upper surface 4 of the light emitting chip 2. The first electrode 6 is provided in a substantially frame shape in the peripheral region of the upper surface 4 of the light emitting chip 2. A first conductive portion 8 that is electrically connected to the first electrode 6 is provided on the facing surface 7 of the reflector member 10 that faces the first electrode 6 provided in the peripheral region of the upper surface 4 of the light emitting chip 2. It has been. The first conductive portion 8 is formed of a conductive film (thin film) made of a conductive material such as copper so as to cover a part of the facing surface 7.

  In addition, the reflector member 10 has a lower surface 9 that faces the mounting substrate 20. The first conductive portion 8 made of a conductive film also covers a part of the lower surface 9 thereof. The first conductive portion 8 covering each of the facing surface 7 and the lower surface 9 is provided so as to be continuous between the facing surface 7 and the lower surface 9. That is, the first conductive portion 8 also covers the side surface 9S that connects the opposing surface 7 and the lower surface 9, and the first conductive portion 8 that is covered with the opposing surface 7 and the first conductive portion 9 that is covered with the lower surface 9. Is electrically connected via the first conductive portion 8 covered with the side surface 9S.

  An insulating layer 22 is provided on the upper surface 15 of the mounting substrate 20 so as to surround the light emitting chip 2, and a conductive layer 21 is further provided above the insulating layer 22. The insulating layer 22 ensures electrical insulation between the conductive layer 21 and the mounting substrate 20.

  The first conductive portion 8 provided on the lower surface 9 of the reflector member 10 and the conductive layer 21 provided on the mounting substrate 20 are in contact with each other, and the first conductive portion 8 and the conductive layer 21 are electrically connected. Connected. Therefore, the conductive layer 21 and the first electrode 6 of the light emitting chip 2 are electrically connected via the first conductive portion 8.

  The first electrode 6 provided on a part of the upper surface 4 of the light emitting chip 2 and the first conductive portion 8 provided on the opposing surface 7 of the reflector member 10 are conductive such as bumps or conductive paste (silver paste). Are electrically connected via a conductive adhesive. The second electrode 5 provided on the lower surface 14 of the light emitting chip 2 and the upper surface 15 of the mounting substrate 20 are electrically connected via a conductive adhesive such as a bump or a conductive paste (silver paste). In addition, the first conductive portion 8 provided on the lower surface 9 of the reflector member 10 and the conductive layer 21 provided on the mounting substrate 20 are provided with a conductive adhesive such as a bump or a conductive paste (silver paste). Is electrically connected. Further, the lower surface 14 of the light emitting chip 2 and the lower surface 9 of the reflector member 10 are substantially flush.

  FIG. 4 is an enlarged cross-sectional view of the vicinity of the connection portion between the first electrode 6 and the first conductive portion 8. As shown in FIG. 4, the surface of the first conductive portion 8 (the surface facing the first electrode 6) is roughened. In the present embodiment, as the rough surface treatment, a large number of V grooves are formed on the surface (lower surface) of the first conductive portion 8. As the rough surface treatment, as shown in FIG. 5, a rectangular groove having a rectangular shape in cross section may be used. Alternatively, the rough surface treatment may be performed by a technique based on sandblasting. Further, not only the first conductive portion 8 but also the surface of the first electrode 6 (surface facing the first conductive portion 8) may be roughened, or only the first electrode 6 is roughened. May be. The connection material and the first conductive portion 8 (first electrode) are prepared by roughening at least a region of the first conductive portion 8 and the first electrode 6 that is in contact with the connection material (silver paste or the like). The contact area with the surface of 6) can be increased, and the adhesive strength can be improved.

  Note that the light-emitting chip 2 in the present embodiment is a diode (LED) that emits light when a current flows through the pn junction. In a homojunction type LED in which the same semiconductor material is joined, there is no barrier against carriers injected into the light emitting portion, so that the carriers spread to the diffusion distance in the semiconductor. On the other hand, in a heterojunction LED in which different semiconductor materials are joined, a barrier against carriers is created in the structure, so that the density of carriers injected into the light emitting portion can be greatly increased. In particular, in a double heterojunction LED in which a light emitting layer is sandwiched between cladding layers, the carrier density can be increased as the width of the light emitting layer is narrowed, and the internal quantum efficiency can be improved. On the other hand, in a homojunction type LED, the material in contact with the outside world and the material of the light emitting part are the same, so that the emitted light is absorbed by its own material. On the other hand, in a double heterojunction LED, a light emitting layer made of a material having a narrow band gap is sandwiched between clad layers made of a material having a wide band gap. The extraction efficiency can be improved. Therefore, it is desirable to employ a double heterojunction type LED having excellent luminous efficiency.

When a light emitting chip 2 that emits red light is used, it is formed by growing an AlGaInP-based compound semiconductor crystal on a substrate such as gallium arsenide (GaAs). In addition, since the GaAs substrate absorbs visible light, there is a limit in improving the extraction efficiency of light emitted from the LED. Therefore, in the light-emitting chip 2 in the present embodiment, it is desirable to remove the GaAs substrate after growing the semiconductor crystal and attach a gallium phosphide (GaP) substrate that is transparent to the emission wavelength at a high temperature and high pressure. Then, a double heterojunction structure is employed in which an AlGaInP light emitting layer is sandwiched between an n-GaP clad layer and a p-GaP clad layer. When a light emitting chip 2 that emits blue or green light is used, it is formed by growing a GaInN-based compound semiconductor crystal on the surface of a substrate such as sapphire (Al ₂ O ₃ ). . It is preferable to adopt a double heterojunction structure in which a light emitting layer made of InGaN is sandwiched between a clad layer made of n-GaN and a clad layer made of p-GaN.

  In the light source device 1 having the above-described configuration, a current is applied from the conductive layer 21 on the mounting substrate 20 to the first electrode 6 via the first conductive portion 8, and the second electrode from the upper surface 15 of the mounting substrate 20. When a current is applied to 5, current is applied to the light emitting chip 2 through the first electrode 6 and the second electrode 5, and thereby light is emitted from the light emitting region 3 of the light emitting chip 2.

  Here, a current is applied to the first electrode 6 via the first conductive portion 8. Such a first conductive portion 8 has a much larger area than the wire provided in the conventional light source device, and the contact area between the first electrode 6 and the first conductive portion 8 is sufficiently large. Therefore, a larger current can be passed. Therefore, in the light source device 1 according to the present embodiment, the light emitting chip 2 can be driven with a large current, and the light source device 1 with a large amount of light emission and high luminance can be realized. Similarly, the contact area between the second electrode 5 and the mounting substrate (second conductive portion) 20 is also sufficiently large, so that a large current drive is possible. In the light source device 1 of the present embodiment, the first electrode 6 provided in the peripheral region of the upper surface 4 of the light emitting chip 2 is opposed to the peripheral region of the upper surface 4 instead of the wire as described above. A current is applied through the first conductive portion 8 provided on the facing surface 7. That is, the wire which has been conventionally arranged on the optical path of the emitted light is not arranged. For this reason, it is possible to prevent the illuminance distribution of the illumination light from becoming non-uniform.

  In the light source device 1 of the present embodiment, the mounting substrate 20 is formed of a highly conductive metal material (Cu) and functions as a second conductive portion that applies a current to the second electrode 5 of the light emitting chip 2. Therefore, the heat quantity of the light emitting chip 2 is efficiently radiated through the mounting substrate 20. For this reason, the temperature rise of the light emitting chip 2 can be suppressed. Therefore, the light emitting chip 2 can be driven with a large current, and the light source device 1 with a larger amount of light emission can be obtained.

  Of the light emitted from the light emitting region 3 of the light emitting chip 2, the light emitted in the + Z direction is emitted as it is in the + Z direction. Of the light emitted from the light emitting region 3 of the light emitting chip 2, the light emitted obliquely is reflected by the reflecting surface 11 of the reflector member 10 to be converted into parallel light and guided in the + Z direction. Of the light emitted from the light emitting region 3 of the light emitting chip 2, the light guided through the light emitting chip 2 and emitted from the lower surface 14 of the light emitting chip 2 is reflected on the lower surface 14 of the light emitting chip 2. Is reflected by the second electrode 5 functioning as, and again guided through the light emitting chip 2 and emitted in the + Z direction. Thus, in the light source device 1 of the present embodiment, since the second electrode 5 that functions as a reflective film is disposed on the lower surface 14 of the light emitting chip 2, it is possible to improve the light extraction efficiency.

  In the above-described embodiment, the first electrode 6 is provided in a frame shape on the upper surface 4 of the light-emitting chip 2 in the peripheral region of the region other than the light-emitting region 3. By forming the light-emitting chip 2 with a light-transmitting conductive material such as (Indium Tin Oxide), the light-emitting chip 2 can be provided, for example, over the entire upper surface 4. With such a configuration, a current is uniformly applied to the upper surface 4 of the light emitting chip 2, and emitted light having a uniform illuminance distribution can be obtained from the light emitting chip 2. Therefore, the illuminance distribution of the illumination light of the light source device 1 is made more uniform.

  In the above-described embodiment, the reflecting surface 11 of the reflector member 10 is configured by four inclined surfaces. However, the present invention is not limited to this. For example, the inclined surface 11 may be formed in a mortar shape.

  In the above-described embodiment, the first conductive portion 8 that applies current to the first electrode 6 is a film formed by covering the lower surface 9 and the opposing surface 7 of the reflector member 10 with a conductive material. However, the entire reflector member 10 may be formed of a conductive material, and the entire reflector member 10 may be used as the first conductive portion 8.

<Manufacturing method>
Next, a method for manufacturing the light emitting device 1 having the above-described configuration will be described. First, a sheet-like member 50 including a plurality of reflector members 10 as shown in FIG. 6 is formed. In FIG. 6, the lower surface 9 of the reflector member 10 faces upward in the drawing. The lower surface 9, the side surface 9S, and the opposing surface 7 are connected so that a partial region of each of the lower surface 9, the side surface 9S, and the opposing surface 7 is coated with a thin film-like first conductive material. Part 8 is formed. Here, the sheet-like member 50 may be a substantially flat plate-like member or may be wound in a roll shape.

  Next, as shown in FIG. 7, the light emitting chip 2 is mounted on each of the reflector members 10 formed on the sheet-like member 50. The light emitting chip 2 has a reflector member so as to connect the first electrode 6 provided on a part (peripheral region) of the upper surface 4 and the first conductive portion 8 provided on the opposing surface 7 of the reflector member 10. It is mounted inside 10 steps. Here, as described above, bumps or a connection material (conductive paste such as silver paste) or the like is interposed between the first electrode 6 and the first conductive portion 8. The first electrode 6 of the light emitting chip 2 and the first conductive portion 8 of the reflector member 10 are connected via the material. That is, in this embodiment, when the sheet-like member 50 is viewed as a printed wiring board, the light emitting chip 2 is flip-chip mounted on the sheet-like member 50 (reflector member 10). Further, the lower surface 14 (including the surface of the second electrode 5) of the light emitting chip 2 mounted on the reflector member 10 and the lower surface 9 (including the surface of the first conductive portion 8) of the reflector member 10 are: Almost flat.

  In order to electrically connect the first electrode 6 of the light-emitting chip 2 and the first conductive portion 8 of the reflector member 10, the light-emitting chip 2 and the reflector are mounted by flip-chip mounting the light-emitting chip 2 on the reflector member 10. The member 10 can be mounted while being positioned well. In addition, a plurality of reflector members 10 are formed on the sheet-like member 50, and the light-emitting chip 2 is mounted on each of the reflector members 10 on the sheet-like member 50, and then the sheet-like member 50 is cut for each reflector member 10. Thus, a large number of reflector members 10 on which the light emitting chips 2 are mounted can be efficiently manufactured.

  After the light emitting chip 2 is flip-chip mounted on each of the reflector members 10 constituting the sheet-like member 50, the sheet-like member 50 is divided (diced) for each reflector member 10. As shown in FIG. 8, the reflector member 10 on which the light emitting chip 2 is mounted is flip-chip mounted on the mounting substrate 20 together with the light emitting chip 2. When the reflector member 10 is mounted on the mounting substrate 20, the reflector member 10 (light emitting chip 2) and the mounting substrate 20 are electrically connected via a conductive adhesive such as a bump or a conductive paste (silver paste). The Thereby, the upper surface 15 of the mounting substrate 20 and the second electrode 5 of the light emitting chip 2 are electrically connected, and the conductive layer 21 on the mounting substrate 20 and the first conductive portion 8 on the lower surface 9 of the reflector member 10 Are electrically connected. At this time, the lower surface 14 (including the surface of the second electrode 5) of the light emitting chip 2 mounted on the reflector member 10 and the lower surface 9 (including the surface of the first conductive portion 8) of the reflector member 10 are defined. Since it is substantially flush, workability when the light emitting chip 2 and the reflector member 10 are mounted together on the mounting substrate 20 can be improved. Further, since the light emitting chip 2 and the reflector member 10 are flip-chip mounted on the mounting substrate 20, the light emitting chip 2 and the reflector member 10 and the mounting substrate 20 can be connected in a well-positioned state, and can be mounted. Workability can be improved.

  Thus, after forming the reflector member 10, it is set as the structure which provides the 1st electroconductive part 8 electrically connected with the 1st electrode 6 of the light emitting chip 2 in at least one part on the reflector member 10, The first conductive portion can be favorably provided at a desired position on the reflector member 10. Further, by connecting the light emitting chip 2 and the reflector member 10 by flip chip bonding, a large contact area can be obtained between the first electrode 6 of the light emitting chip 2 and the first conductive portion 8 of the reflector member 10. it can. Similarly, a large contact area can be obtained between the second electrode 5 of the light emitting chip 2 and the upper surface 15 of the mounting substrate 20 by flip-chip mounting the light emitting chip 2 and the reflector member 10 to the mounting substrate 20. In addition, a large contact area can be obtained between the first conductive portion 8 of the reflector member 10 and the conductive portion 21 on the mounting substrate 20. Therefore, it is possible to realize a large current drive and to achieve high brightness of the light emitting chip 2.

  By the way, in embodiment mentioned above, the reflector member 10 is a polyhedron which has a some surface. Therefore, as shown in FIG. 9, at least a part of the plurality of boundaries between the surfaces can be formed in a curved surface shape. In the example shown in FIG. 9, the boundary between the facing surface 7 and the side surface 9S is curved to form a curved surface. In the light emitting device 1, there is a possibility that light is emitted also from the side surface of the light emitting chip 2, and the temperature in the vicinity of the side surface 9 </ b> S of the reflector member 10 can be increased by irradiation of light emitted from the side surface of the light emitting chip 2. There is sex. Here, when corner portions are formed on the reflector member 10, the thermal conductivity in the vicinity of the corner portions is often lower than the thermal conductivity of other portions. May concentrate at that corner. However, as shown in FIG. 9, the corner portion of the reflector member 10 is curved so that the corner portion of the reflector member 10 in the vicinity of the position irradiated with the light emitted from the side surface of the light emitting chip 2 is eliminated ( (Or less), it is possible to prevent heat from being trapped and to suppress the temperature rise of the light source device 1.

<Projector>
FIG. 10 is a schematic configuration diagram of a projector including the light source device according to the present embodiment. In FIG. 10, a projector 500 includes light source devices 512, 513, and 514, liquid crystal light valves (light modulation elements) 522, 523, and 524, a cross dichroic prism 525, and a projection lens 526 as in the above-described embodiment. I have.

  Each of the light source devices 512, 513, and 514 employs LEDs that emit light in red (R), green (G), and blue (B), respectively. In addition, a condensing lens 535 corresponding to each of the light source devices 512, 513, and 514 is disposed.

  The light beam from the red light source device 512 passes through the condenser lens 535R, is reflected by the reflection mirror 517, and enters the red light liquid crystal light valve 522. Further, the light beam from the green light source device 513 passes through the condenser lens 535G and enters the liquid crystal light valve 523 for green light. The light beam from the blue light source device 514 passes through the condenser lens 535B, is reflected by the reflection mirror 516, and enters the blue light liquid crystal light valve 524.

  In addition, polarizing plates (not shown) are arranged on the incident side and the emission side of each liquid crystal light valve. Then, only linearly polarized light in a predetermined direction out of the light flux from each light source passes through the incident side polarizing plate and enters each liquid crystal light valve. Further, a polarization conversion means (not shown) may be provided behind the incident side polarizing plate. In this case, the light beam reflected by the incident side polarizing plate can be recycled and incident on each liquid crystal light valve, and the utilization efficiency of illumination light (emitted light) can be improved.

  The three color lights modulated by the liquid crystal light valves 522, 523, and 524 are incident on the cross dichroic prism 525. This prism is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are arranged in a cross shape on the inner surface thereof. These dielectric multilayer films combine the three color lights to form light representing a color image. The synthesized light is projected onto the projection screen 527 by the projection lens 526 which is a projection optical system, and an enlarged image is displayed.

  In the light source device 1 of the present embodiment described above, the illuminance distribution of the illumination light is made uniform and the parallel illumination light is emitted. For this reason, it becomes a light source device suitable as a light source of a projector.

  As mentioned above, although preferred embodiment of the light source device which concerns on this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the said embodiment. Various shapes, combinations, and the like of the constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention. For example, in the above-described embodiment, the LED has been described as an example of the light emitting chip 2, but a surface emitting laser (VCSEL) may be used as the light emitting chip 2. That is, the light emitting chip 2 applicable to the present invention is applicable to a surface light emitting chip (element) having a light emitting region on a predetermined surface (first surface).

It is a top view which shows one Embodiment of the light-emitting device of this invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is a principal part enlarged view of FIG. It is an enlarged view which shows an example of the connection part vicinity of a 1st electrode and a 1st electroconductive part. It is an enlarged view which shows the other example of the connection part vicinity of a 1st electrode and a 1st electroconductive part. It is a figure for demonstrating an example of the manufacturing process of a light-emitting device. It is a schematic diagram for demonstrating an example of the manufacturing process of a light-emitting device. It is a schematic diagram for demonstrating an example of the manufacturing process of a light-emitting device. It is a schematic diagram which shows other embodiment of a light-emitting device. It is a figure which shows the example of application of a light-emitting device, Comprising: It is a schematic diagram which shows a projector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light emitting device, 2 ... Light emitting chip, 3 ... Light emission area | region, 4 ... Upper surface (1st surface), 5 ... 2nd electrode, 6 ... 1st electrode, 7 ... Opposite surface (3rd surface), 8 ... 1st Conductive portion, 9 ... lower surface (fourth surface), 10 ... reflector member, 11 ... reflective surface, 12 ... opening, 14 ... lower surface (second surface), 15 ... upper surface (second conductive portion), 20 ... mounting substrate (Second conductive part)

Claims (1)

A light emitting device having a first electrode and a second electrode, and having a light emitting chip that emits light from a light emitting region provided on the first surface by being energized through the first electrode and the second electrode A device manufacturing method comprising:
Forming a plate-like member including a plurality of reflector members each having an accommodation recess having a depth substantially the same as the thickness of the light emitting chip and an opening in the accommodation recess;
A step of forming a first conductive portion in the form of a thin film that is electrically connected to the first electrode by covering a partial region of each of the plurality of reflector members with a conductive material ;
Flip chip mounting while positioning the light emitting chip with respect to the housing recesses of the plurality of reflector members to electrically connect the first electrode and the first conductive portion;
Dividing the plate-like member for each reflector member;
Have a, a step of flip-chip mounting a reflector member mounted with the light emitting chip to the mounting substrate,
The step of forming the plate-shaped member includes processing a curved surface of a part of the boundary between the side surface and the opposing surface that constitutes the housing recess of the reflector member.
A method for manufacturing a light-emitting device.

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