JP4528243B2 - 熱伝導材料及びその製造方法 - Google Patents
熱伝導材料及びその製造方法 Download PDFInfo
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- JP4528243B2 JP4528243B2 JP2005306372A JP2005306372A JP4528243B2 JP 4528243 B2 JP4528243 B2 JP 4528243B2 JP 2005306372 A JP2005306372 A JP 2005306372A JP 2005306372 A JP2005306372 A JP 2005306372A JP 4528243 B2 JP4528243 B2 JP 4528243B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Materials Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Carbon And Carbon Compounds (AREA)
Description
図6に示すように、本発明に係る実施例1の熱伝導材料10は、第一表面41およびそれに反対の第二表面42を備える基板4と、この基板4に分布される複数の炭素ナノチューブ・高分子材料のファイバー2と、を含む。ここで、前記複数のファイバー2は前記第一表面41から前記第二表面42まで延伸するように、基板4に規則的に(例えば、マトリックスのように)配列されている。また、前記基板4の肉厚は実際の仕様により適宜設定されるが、その材料はオレフィンを採用する。このように構成されれば、本実施例の熱伝導材料10は電気部品に応用される場合、電気部品の平らでない接触面と完全に接合でき、熱抵抗が低減するので、電気部品の放熱を効率的に高めることができる。前記ファイバーとして、炭素ナノチューブ・高分子材料の複合ファイバー2が採用される。さらに、前記第一表面41及び前記第二表面が平行して、複数の炭素ナノチューブ・高分子材料の複合ファイバー2の間が互いに平行し、且つ前記第一表面42及び第二表面に垂直するように構成されることが好ましい。
1、4 基板
3 埋め込みの材料
41 第一表面
42 第二表面
2 炭素ナノチューブ・高分子材料のファイバー
Claims (3)
- 第一表面及び第二表面を備える基板と、該基板に分布されるファイバーと、を含む熱伝導材料であり、
前記ファイバーは、前記第一表面から前記第二表面まで延伸するように、前記基板に分布され、
前記ファイバーは、炭素ナノチューブ・高分子材料複合ファイバーから成るものであることを特徴とする熱伝導材料。 - 前記高分子材料は、相変化材料、樹脂材料、熱伝導材料、又はそれらの混合物を含むことを特徴とする、請求項1に記載の熱伝導材料。
- 複数のファイバーを準備する工程と、
前記複数のファイバーを所定の方向に配列させる工程と、
埋め込み用の材料を利用して前記の工程で配列されたファイバーを埋め込んで、複合材料を形成する工程と、
前記複合材料を所定の厚さにより、前記ファイバーの長手方向に垂直する方向に沿ってカット加工をして、熱伝導材料を製造する工程と、
を含み、
前記ファイバーは炭素ナノチューブ・高分子材料複合ファイバーから成るものであり、
前記複数のファイバーを準備する工程において、
導電部材を溶液に入れて、器具で線引きを行って、機械加工によりファイバーを製造することを特徴とする熱伝導材料の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA200510033937XA CN1841713A (zh) | 2005-03-31 | 2005-03-31 | 热界面材料及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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JP2006287179A JP2006287179A (ja) | 2006-10-19 |
JP4528243B2 true JP4528243B2 (ja) | 2010-08-18 |
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JP2005306372A Active JP4528243B2 (ja) | 2005-03-31 | 2005-10-20 | 熱伝導材料及びその製造方法 |
Country Status (3)
Country | Link |
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US (1) | US7678614B2 (ja) |
JP (1) | JP4528243B2 (ja) |
CN (1) | CN1841713A (ja) |
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EP2162910B1 (en) * | 2007-04-23 | 2013-06-12 | University College Cork-National University of Ireland, Cork | A thermal interface material |
JP5104688B2 (ja) | 2007-10-22 | 2012-12-19 | 富士通株式会社 | シート状構造体及びその製造方法並びに電子機器 |
KR101111127B1 (ko) * | 2007-10-22 | 2012-03-14 | 후지쯔 가부시끼가이샤 | 시트 형상 구조체와 그 제조 방법 및 전자기기 |
EP2269948B1 (en) * | 2008-02-29 | 2017-08-02 | Fujitsu Limited | Sheet structure |
WO2009117456A2 (en) * | 2008-03-17 | 2009-09-24 | Avery Dennison Corporation | Functional micro-and/or nano-structure bearing constructions and/or methods for fabricating same |
CN102110501B (zh) * | 2008-04-09 | 2012-11-21 | 清华大学 | 线缆及其缆芯的制备方法 |
CN101826467B (zh) * | 2009-03-02 | 2012-01-25 | 清华大学 | 热界面材料的制备方法 |
BR112012017304A2 (pt) | 2010-01-14 | 2016-04-19 | Saab Ab | artigo com função de degelo/antigelo |
JP5673668B2 (ja) * | 2010-03-12 | 2015-02-18 | 富士通株式会社 | 放熱構造体、電子機器およびそれらの製造方法 |
FR2960218B1 (fr) * | 2010-05-21 | 2012-08-03 | Thales Sa | Dispositif de dissipation thermique pour equipement spatial, notamment pour satellite |
CN101880035A (zh) | 2010-06-29 | 2010-11-10 | 清华大学 | 碳纳米管结构 |
CN102464954B (zh) * | 2010-11-19 | 2013-12-25 | 富葵精密组件(深圳)有限公司 | 复合胶粘片、包括该复合胶粘片的胶片及胶片的制作方法 |
KR20140112035A (ko) * | 2011-12-28 | 2014-09-22 | 도요보 가부시키가이샤 | 절연 열전도 시트 |
US9314817B2 (en) | 2012-02-29 | 2016-04-19 | Georgia Tech Research Corporation | Three-dimensional vertically aligned functionalized multilayer graphene |
KR102150136B1 (ko) | 2012-08-01 | 2020-09-01 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | 코일형 및 비-코일형 꼬인 나노섬유 원사 및 폴리머 섬유 비틀림 및 인장 액추에이터 |
FR2995877B1 (fr) * | 2012-09-21 | 2014-10-24 | Thales Sa | Structure meca-thermique adaptee pour un environnement spatial |
JP5662545B1 (ja) * | 2013-11-13 | 2015-01-28 | 多田 禮子 | 高性能全熱交換器 |
EP3245844B1 (en) | 2015-01-12 | 2020-05-27 | Laminaheat Holding Ltd. | Fabric heating element |
WO2017068416A1 (en) | 2015-10-19 | 2017-04-27 | Laminaheat Holding Ltd. | Laminar heating elements with customized or non-uniform resistance and/or irregular shapes, and processes for manufacture |
JP6551208B2 (ja) * | 2015-12-15 | 2019-07-31 | 株式会社デンソー | 熱交換部材およびその製造方法 |
CN107141803A (zh) * | 2017-04-19 | 2017-09-08 | 天津大学 | 碳纤维‑碳纳米管阵列/硅树脂导热复合材料的制备方法 |
CN106947436B (zh) * | 2017-05-10 | 2022-10-14 | 中国科学院宁波材料技术与工程研究所 | 一种热界面材料及其制备和应用 |
DE102018119476A1 (de) * | 2018-08-10 | 2020-02-13 | Rheinisch-Westfälische Technische Hochschule (Rwth) Aachen | Werkstoff zur richtungsabhängigen Steuerung eines elektrischen Feldes |
US11076510B2 (en) * | 2018-08-13 | 2021-07-27 | Facebook Technologies, Llc | Heat management device and method of manufacture |
USD911038S1 (en) | 2019-10-11 | 2021-02-23 | Laminaheat Holding Ltd. | Heating element sheet having perforations |
CN111500070A (zh) * | 2020-04-14 | 2020-08-07 | 南方科技大学 | 碳纤维取向热界面材料及其制备方法 |
CN111508914B (zh) * | 2020-06-18 | 2020-11-13 | 上海大陆天瑞激光表面工程有限公司 | 用于电子封装热界面材料的双面绒毛导热毯 |
CN112724699A (zh) * | 2021-01-19 | 2021-04-30 | 天津泰吉诺新材料科技有限公司 | 一种具有结构取向的多功能高导热复合树脂的制备工艺 |
WO2024036611A1 (zh) * | 2022-08-19 | 2024-02-22 | 中国科学院深圳先进技术研究院 | 一种仿壁虎爪的复合热界面材料及其制备方法 |
SE2251191A1 (en) * | 2022-10-11 | 2023-11-07 | Sht Smart High Tech Ab | Method for manufacturing a graphene-enhanced thermal interface material |
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- 2005-12-29 US US11/321,140 patent/US7678614B2/en active Active
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Publication number | Publication date |
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CN1841713A (zh) | 2006-10-04 |
JP2006287179A (ja) | 2006-10-19 |
US20060219689A1 (en) | 2006-10-05 |
US7678614B2 (en) | 2010-03-16 |
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