JP4519603B2 - Ion generator - Google Patents

Ion generator Download PDF

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JP4519603B2
JP4519603B2 JP2004310298A JP2004310298A JP4519603B2 JP 4519603 B2 JP4519603 B2 JP 4519603B2 JP 2004310298 A JP2004310298 A JP 2004310298A JP 2004310298 A JP2004310298 A JP 2004310298A JP 4519603 B2 JP4519603 B2 JP 4519603B2
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electrode plate
lid
circuit board
casing
attached
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JP2006127766A (en
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喜造 夷藤
浩之 松谷
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アール・ビー・コントロールズ株式会社
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Description

本発明は、イオンを発生させるセラミック製の電極を有するイオン発生装置に関する。   The present invention relates to an ion generator having a ceramic electrode for generating ions.

従来のこの種のイオン発生装置は、開口部を備えた有底のケーシング本体内に昇圧コイルやその他の部品が取り付けられた回路基板をセットし、その状態でこの開口部を樹脂製の蓋体で閉塞している。この蓋体にはイオンを発生するための電極板が取り付けられている。この電極板はセラミック製の多層板で構成されており、表面には電極パターンが露出しており、裏面にはケーシング内の回路基板からのリード線がハンダ付けされる端子が設けられている。したがって、蓋体に取り付けられた状態でこの電極板の裏面はケーシング内に露出している。   In this type of conventional ion generating apparatus, a circuit board on which a booster coil and other parts are attached is set in a bottomed casing body having an opening, and in this state, the opening is made of a resin lid. Blocked. An electrode plate for generating ions is attached to the lid. This electrode plate is formed of a ceramic multilayer plate, the electrode pattern is exposed on the front surface, and terminals on which the lead wires from the circuit board in the casing are soldered are provided on the back surface. Therefore, the back surface of the electrode plate is exposed in the casing while being attached to the lid.

また、蓋体には注入口が形成されており、ケーシングの開口部を蓋体が閉塞した後、この注入口から樹脂をケーシング内に注入し、さらに熱硬化させることにより樹脂で回路基板をポッティングして耐久性を向上させている（例えば、特許文献１参照）。
特開２００３−４５６１１号公報（図１） In addition, the lid has an injection port. After the lid closes the opening of the casing, the resin is injected into the casing from the injection port, and then thermally cured to pot the circuit board with the resin. Thus, durability is improved (see, for example, Patent Document 1).
JP 2003-45611 A (FIG. 1)

上述のように、蓋体でケーシングの開口部を閉塞した後、蓋体の注入口から樹脂を注入するので、その注入された樹脂は蓋体に取り付けられている電極板の裏面にも接触する。そのため電極板の裏面はケーシング内に充填された状態の樹脂に接着された状態になる。このように完成されたイオン発生装置が加熱されるとケーシング内に充填された樹脂は膨張し、逆に冷却されると充填された樹脂は収縮する。   As described above, after closing the opening of the casing with the lid, the resin is injected from the inlet of the lid, so that the injected resin also contacts the back surface of the electrode plate attached to the lid. . Therefore, the back surface of the electrode plate is in a state of being bonded to the resin filled in the casing. When the ion generator thus completed is heated, the resin filled in the casing expands, and conversely, when the ion generator is cooled, the filled resin contracts.

このように加熱および冷却がくり返されるヒートサイクル中に、樹脂の膨張により裏面から押され、樹脂の収縮によりケーシング内方向に引き込まれる。特にケーシングが大型化すると、ケーシングへの樹脂の充填量が増え、膨張収縮量も大きくなる。特に樹脂の収縮時に電極板がケーシング内方向に引き込まれると、電極板がセラミック製であるため、電極板が割れるという不具合が生じる。   During the heat cycle in which heating and cooling are repeated in this way, the resin is pushed from the back surface by the expansion of the resin, and is drawn in the casing inward by the shrinkage of the resin. In particular, when the casing is enlarged, the amount of resin filled in the casing increases, and the amount of expansion and contraction also increases. In particular, when the electrode plate is pulled inwardly of the casing when the resin contracts, the electrode plate is made of ceramic, so that the electrode plate breaks.

また、ポッティング用の樹脂は蓋体に形成された注入口からケーシング本体内に充填されるが、ケーシング内の空気が注入される樹脂によってこの注入口から押し出されるため、注入速度を上げると、注入口が注入される樹脂で塞がれてケーシング本体内の空気がうまく排出されない。そのため樹脂の注入速度を上げることができず、樹脂の注入に長時間を要してしまうという不具合が生じる。   The potting resin is filled into the casing body from the inlet formed in the lid, but the air in the casing is pushed out of the inlet by the injected resin. The inlet is blocked by the injected resin, and the air in the casing body is not discharged well. Therefore, the injection rate of the resin cannot be increased, and there is a problem that it takes a long time to inject the resin.

そこで本発明は、上記の問題点に鑑み、ケーシングが大型化しても電極板が割れるおそれがなく、かつポッティング用の樹脂の注入を短時間で行うことできるイオン発生装置を提供することを課題とする。   Therefore, in view of the above problems, the present invention has an object to provide an ion generator that can prevent the electrode plate from cracking even when the casing is enlarged and can perform injection of a resin for potting in a short time. To do.

上記課題を解決するために本発明によるイオン発生装置は、イオンを発生させる板状の電極板と、この電極板に高圧電力を供給する回路基板とを備えたイオン発生装置において、回路基板を収納するケーシングを有底中空のケーシング本体とこのケーシング本体の開口を蓋する蓋体とで構成すると共に、回路基板を蓋体の内側にポッティングし、更に電極板で蓋される電極板取り付け用の開口が設けられた中空の電極板取付部材に電極板を取り付けた状態でポッティングし、電極板取付部材を上記蓋体の外側面に取り付けたことを特徴とする。   In order to solve the above problems, an ion generator according to the present invention includes a plate-like electrode plate that generates ions and a circuit board that supplies high-voltage power to the electrode plate. The casing is made up of a bottomed hollow casing body and a lid body that covers the opening of the casing body, the circuit board is potted inside the lid body, and the electrode plate mounting opening that is further covered with an electrode plate Potting was performed with the electrode plate attached to a hollow electrode plate attachment member provided with the electrode plate attachment member attached to the outer surface of the lid.

回路基板を蓋体の内側に取り付けてポッティングすることにより、ポッティング用の樹脂を蓋体の内側に注入する際、空気と樹脂との置換について配慮する必要が無く、短時間で樹脂を蓋体の内側に充填することができる。また、回路基板をポッティングする樹脂と電極板をポッティングする樹脂とは個別に充填され互いに接触することがないので、電極板をポッティングしている樹脂の表面は電極板取付部材内で拘束されず、樹脂の膨張収縮による応力が電極板に作用することはない。   By potting with the circuit board attached to the inside of the lid, there is no need to consider the replacement of air and resin when injecting the potting resin to the inside of the lid. Can be filled inside. In addition, since the resin for potting the circuit board and the resin for potting the electrode plate are individually filled and do not contact each other, the surface of the resin potting the electrode plate is not constrained in the electrode plate mounting member, Stress due to expansion and contraction of the resin does not act on the electrode plate.

なお、電極板を蓋体の外側面に取り付ける電極保持部材に保持させたので、電極保持部材内の電極板と蓋体内の回路基板とを連結するリード線は蓋体の外側を通す必要が生じる。そこで、蓋体をケーシング本体に取り付けた状態で蓋体とケーシングとの間に隙間ができるように蓋体に凹部を設けると共に、電極板と回路基板とを連結するリード線をこの隙間に通し、電極板取付部材を蓋体に取り付けた状態でこの隙間を電極板取付部材で覆うようにした。   Since the electrode plate is held by the electrode holding member attached to the outer surface of the lid, the lead wire for connecting the electrode plate in the electrode holding member and the circuit board in the lid needs to pass through the outside of the lid. . Therefore, with the lid attached to the casing body, a recess is provided in the lid so that a gap is formed between the lid and the casing, and a lead wire for connecting the electrode plate and the circuit board is passed through the gap. The gap was covered with the electrode plate mounting member while the electrode plate mounting member was mounted on the lid.

なお、回路基板に外部からの給電用のコネクタ部材を取り付けると共に、ケーシング本体と蓋体とを連結した状態でコネクタ部材がケーシング本体の外部に臨むように、ケーシング本体にコネクタ部材の外形とほぼ同形の窓穴を形成してもよい。   A connector member for supplying power from the outside is attached to the circuit board, and the outer shape of the connector member is substantially the same as the outer shape of the connector member so that the connector member faces the outside of the casing body in a state where the casing body and the lid are connected. A window hole may be formed.

以上の説明から明らかなように、本発明は、電極板をポッティングする樹脂は電極板保持部材内に充填されるだけであるので、樹脂の厚みはそれほど厚くならず、かつ樹脂の表面は空気中に対して露出し、拘束されることがないので、例えこの樹脂が膨張収縮しても電極板に大きな応力が作用することがなく、その結果、電極板が破損するおそれがない。   As is clear from the above description, the present invention only fills the electrode plate holding member with the resin for potting the electrode plate, so the thickness of the resin is not so thick, and the surface of the resin is not in the air. Therefore, even if this resin expands and contracts, a large stress does not act on the electrode plate, and as a result, the electrode plate is not damaged.

また、回路基板を蓋体の内側に取り付けてポッティングするので、回路基板のポッティング用の樹脂の充填を短時間を行うことができる。   Further, since the circuit board is attached to the inside of the lid and potting is performed, filling of the resin for potting the circuit board can be performed in a short time.

図１を参照して、１は本発明によるイオン発生装置の一例であり、有底中空のケーシング本体２と、このケーシング本体２の開口を閉塞する蓋体３と、この蓋体３の外側面に取り付けられた電極板保持部材４とから構成されている。この電極板保持部材４には外側に電極面が露出するように電極板４１が取り付けられており、この電極板４１からイオンが空気中に放出される。   Referring to FIG. 1, reference numeral 1 denotes an example of an ion generator according to the present invention, which includes a bottomed hollow casing body 2, a lid body 3 that closes an opening of the casing body 2, and an outer surface of the lid body 3. The electrode plate holding member 4 is attached to the electrode plate holding member 4. An electrode plate 41 is attached to the electrode plate holding member 4 so that the electrode surface is exposed to the outside, and ions are released from the electrode plate 41 into the air.

図２を参照して、蓋体３の内側には回路基板３１が取り付けられ、樹脂３ａによってポッティングされている。一方、電極板取付部材４内には樹脂４ａが充填され電極板４１の内側面をポッティングしている。なお、５はリード線であり、回路基板３１から電極板４１に対して高圧電極および露結防止のため加熱用電力を供給している。   Referring to FIG. 2, a circuit board 31 is attached to the inside of the lid 3 and potted with a resin 3a. On the other hand, the electrode plate mounting member 4 is filled with resin 4a to pot the inner surface of the electrode plate 41. Reference numeral 5 denotes a lead wire which supplies a high-voltage electrode and heating power for preventing condensation from the circuit board 31 to the electrode plate 41.

図３を参照して、電極板４１は電極板取付部材４に形成された窓穴４２に液密に取り付けられ、更に回路基板からのリード線５をハンダ付けした後、樹脂４ａによってポッティングされる。一方、回路基板３１は蓋体３内に取り付けられた状態で蓋体３内の注ぎ込まれる樹脂３ａによってポッティングされる。   Referring to FIG. 3, electrode plate 41 is liquid-tightly attached to window hole 42 formed in electrode plate attaching member 4, and after lead wire 5 from the circuit board is soldered, it is potted with resin 4a. . On the other hand, the circuit board 31 is potted by the resin 3 a poured into the lid 3 while being attached in the lid 3.

電極板４１および回路基板３１のポッティングが完了すると、電極板保持部材４を蓋体３の外側面に取り付ける。その際、リード線５は蓋体３に形成した凹部３２内に格納する。この凹部３２は電極板取付部材４に形成した凸片４３によって塞がれるようにした。したがって、蓋体３の外側面に電極板取付部材４が取り付けられた状態では、凹部３２は電極板取付部材４で覆い隠されることになる。   When the potting of the electrode plate 41 and the circuit board 31 is completed, the electrode plate holding member 4 is attached to the outer surface of the lid 3. At that time, the lead wire 5 is stored in a recess 32 formed in the lid 3. The concave portion 32 is blocked by a convex piece 43 formed on the electrode plate mounting member 4. Therefore, in a state where the electrode plate attachment member 4 is attached to the outer surface of the lid 3, the recess 32 is covered with the electrode plate attachment member 4.

図４を参照して、蓋体３に電極板取付部材４を取り付けた状態で、蓋体３とケーシング本体２とを連結する。なお、回路基板３１には空電用のリード線が外部から接続されるためのコネクタ３１ａが取り付けられている。ケーシング本体２にこのコネクタ３１ａの形状とほぼ同じ形の窓穴２１を設けて、ケーシング本体２と蓋体３とを相互に取り付けた状態で、コネクタ３１ａが窓穴２１から外部に臨むようにした。   Referring to FIG. 4, lid 3 and casing body 2 are connected with electrode plate attachment member 4 attached to lid 3. The circuit board 31 is provided with a connector 31a for connecting a lead wire for static electricity from the outside. The casing body 2 is provided with a window hole 21 having substantially the same shape as the connector 31a so that the connector 31a faces the outside from the window hole 21 with the casing body 2 and the lid 3 attached to each other. .

ところで、回路基板３１にコネクタ３１ａを取り付けずに、回路基板３１に給電用のリード線を直接取り付けてもよい。その際には、図５に示すように、ケーシング本体２に段部２２を設けると共に、この段部２２に切欠き部２３を形成し、外部からの給電用のリード線をこの切欠き部２３に挿通すればよい。そして、蓋体３に凸片３３を形成しておき、蓋体３とケーシング本体２とを相互に連結した際に凸片３３が切欠き部２３を閉塞するようにした。   By the way, a power supply lead wire may be directly attached to the circuit board 31 without attaching the connector 31 a to the circuit board 31. At this time, as shown in FIG. 5, the casing body 2 is provided with a step portion 22, and a notch portion 23 is formed in the step portion 22, and a lead wire for power feeding from the outside is provided in the notch portion 23. You just have to pass through. And the convex piece 33 was formed in the cover body 3, and when the cover body 3 and the casing main body 2 were connected mutually, the convex piece 33 closed the notch part 23. FIG.

なお、本発明は上記した形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更を加えてもかまわない。   In addition, this invention is not limited to an above-described form, You may add a various change in the range which does not deviate from the summary of this invention.

本発明の一実施の形態の構成を示す図The figure which shows the structure of one embodiment of this invention II-II断面図II-II sectional view 蓋体と電極板取付部材へのポッティング状態を示す図The figure which shows the potting state to a cover and an electrode plate attachment member 蓋体とケーシング本体との取付状態を示す図The figure which shows the attachment state of a cover body and a casing main body 他の実施の形態を示す図The figure which shows other embodiment.

符号の説明Explanation of symbols

１ イオン発生装置
２ ケーシング本体
３ 蓋体
３１ 回路基板
４ 電極板保持部材
４１ 電極板

DESCRIPTION OF SYMBOLS 1 Ion generator 2 Casing main body 3 Lid body 31 Circuit board 4 Electrode plate holding member 41 Electrode plate

Claims (3)

イオンを発生させる板状の電極板と、この電極板に高圧電力を供給する回路基板とを備えたイオン発生装置において、回路基板を収納するケーシングを有底中空のケーシング本体とこのケーシング本体の開口を蓋する蓋体とで構成すると共に、回路基板を蓋体の内側にポッティングし、更に電極板で蓋される電極板取り付け用の開口が設けられた中空の電極板取付部材に電極板を取り付けた状態でポッティングし、電極板取付部材を上記蓋体の外側面に取り付けたことを特徴とするイオン発生装置。   In an ion generator comprising a plate-like electrode plate for generating ions and a circuit board for supplying high-voltage power to the electrode plate, a casing housing the circuit board is provided with a bottomed hollow casing body and an opening of the casing body The electrode plate is attached to a hollow electrode plate mounting member that has an electrode plate mounting opening that is covered with an electrode plate, and the circuit board is potted inside the lid body. An ion generator characterized in that the electrode plate attachment member is attached to the outer surface of the lid body. 蓋体をケーシング本体に取り付けた状態で蓋体とケーシングとの間に隙間ができるように蓋体に凹部を設けると共に、電極板と回路基板とを連結するリード線をこの隙間に通し、電極板取付部材を蓋体に取り付けた状態でこの隙間を電極板取付部材で覆うようにしたことを特徴とする請求項１に記載のイオン発生装置。   With the lid attached to the casing body, the lid is provided with a recess so that a gap is formed between the lid and the casing, and a lead wire for connecting the electrode plate and the circuit board is passed through the gap. The ion generator according to claim 1, wherein the gap is covered with an electrode plate mounting member in a state where the mounting member is mounted on the lid. 回路基板に外部からの給電用のコネクタ部材を取り付けると共に、ケーシング本体と蓋体とを連結した状態でコネクタ部材がケーシング本体の外部に臨むように、ケーシング本体にコネクタ部材の外形とほぼ同形の窓穴を形成したことを特徴とする請求項１または請求項２に記載のイオン発生装置。
A window that is substantially the same shape as the outer shape of the connector member on the casing body so that the connector member faces the outside of the casing body in a state where the connector member for power feeding from the outside is attached to the circuit board and the casing body and the lid body are connected. The ion generator according to claim 1 or 2, wherein a hole is formed.
JP2004310298A 2004-10-26 2004-10-26 Ion generator Expired - Fee Related JP4519603B2 (en)

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JP4519603B2 true JP4519603B2 (en) 2010-08-04

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332944A (en) * 1993-10-06 1994-07-26 Cline David J Environmentally sealed piezoelectric switch assembly
JP2002374670A (en) * 2001-06-14 2002-12-26 Nippon Pachinko Buhin Kk Circuit module for ion generator
JP2003045611A (en) * 2001-08-01 2003-02-14 Sharp Corp Apparatus for generating ion and electric apparatus comprising it
US6964575B1 (en) * 2005-02-08 2005-11-15 Delphi Technologies, Inc. Sealed electronic module with seal-in-place connector header

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3572677B2 (en) * 1994-09-16 2004-10-06 東陶機器株式会社 Corona discharge device
JP3223835B2 (en) * 1997-03-28 2001-10-29 三菱電機株式会社 Power semiconductor device and method of manufacturing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332944A (en) * 1993-10-06 1994-07-26 Cline David J Environmentally sealed piezoelectric switch assembly
JP2002374670A (en) * 2001-06-14 2002-12-26 Nippon Pachinko Buhin Kk Circuit module for ion generator
JP2003045611A (en) * 2001-08-01 2003-02-14 Sharp Corp Apparatus for generating ion and electric apparatus comprising it
US6964575B1 (en) * 2005-02-08 2005-11-15 Delphi Technologies, Inc. Sealed electronic module with seal-in-place connector header

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