JP4517341B2 - Exposure apparatus, nozzle member, and device manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus that exposes a substrate through a projection optical system and a liquid , a nozzle member, and a device manufacturing method.

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography technique in which a pattern formed on a mask is transferred onto a photosensitive substrate. An exposure apparatus used in this photolithography process has a mask stage for supporting a mask and a substrate stage for supporting a substrate, and a mask pattern is transferred via a projection optical system while sequentially moving the mask stage and the substrate stage. It is transferred to the substrate. In recent years, in order to cope with higher integration of device patterns, higher resolution of the projection optical system is desired. The resolution of the projection optical system becomes higher as the exposure wavelength used is shorter and the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used in the exposure apparatus is shortened year by year, and the numerical aperture of the projection optical system is also increasing. The mainstream exposure wavelength is 248 nm of the KrF excimer laser, but the 193 nm of the shorter wavelength ArF excimer laser is also being put into practical use. Also, when performing exposure, the depth of focus (DOF) is important as well as the resolution. The resolution R and the depth of focus δ are each expressed by the following equations.
R = k ₁ · λ / NA (1)
δ = ± k ₂ · λ / NA ² (2)
Here, λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, and k ₁ and k ₂ are process coefficients. From the equations (1) and (2), it can be seen that the depth of focus δ becomes narrower when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R.

If the depth of focus δ becomes too narrow, it becomes difficult to match the substrate surface with the image plane of the projection optical system, and the focus margin during the exposure operation may be insufficient. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in Patent Document 1 below has been proposed. This immersion method fills the space between the image plane side end surface (lower surface) of the projection optical system and the substrate surface with a liquid such as water or an organic solvent to form an immersion region, and the wavelength of the exposure light in the liquid is Using 1 / n in air (where n is the refractive index of the liquid, usually about 1.2 to 1.6), the resolution is improved and the depth of focus is increased by about n times. .
International Publication No. 99/49504 Pamphlet

  By the way, in order to perform the liquid immersion exposure process and various optical measurement processes through the liquid with high accuracy, the liquid supply operation and the liquid recovery operation for forming the liquid immersion region are performed satisfactorily, and the image plane of the projection optical system It is important to keep the liquid well between the side end face and the substrate surface. For example, the liquid for forming the immersion area cannot be satisfactorily held between the image plane side end face of the projection optical system and the substrate surface, and if the liquid flows out, rusting may occur on the members and equipment around the substrate and the substrate stage. There is a possibility of causing inconvenience such as electric leakage.

  In addition, the liquid cannot be satisfactorily held between the image plane side end face of the projection optical system and the substrate surface, and if the liquid flows out, a gas portion is generated between the image plane side end face of the projection optical system and the substrate surface. It is possible that there is a high possibility that When the gas portion is generated, exposure light for forming the pattern image on the substrate does not reach the substrate due to the gas portion, or exposure light for forming the pattern image on the substrate is desired on the substrate. This causes a phenomenon that the position does not reach the position, the measurement light does not reach the measuring instrument, or the measurement light does not reach the desired position, leading to deterioration in exposure accuracy and measurement accuracy. It is also conceivable that when a liquid is supplied to form the liquid immersion region, a gas portion such as a bubble is likely to be generated in the liquid in the liquid immersion region. Even in such a case, the above-described phenomenon occurs, leading to deterioration in exposure accuracy and measurement accuracy.

  In addition, even when impurities are mixed in the liquid supplied to form the liquid immersion region, the above-described phenomenon occurs due to the impurities, leading to deterioration in exposure accuracy and measurement accuracy.

  Further, for example, if vibration occurs when recovering the liquid, the exposure accuracy and measurement accuracy may deteriorate due to the vibration.

  The present invention has been made in view of such circumstances. The liquid supply operation and the liquid recovery operation for forming the liquid immersion area are satisfactorily performed, the liquid immersion area is formed in a desired state, and high exposure is performed. An object of the present invention is to provide an exposure apparatus capable of obtaining accuracy and measurement accuracy, and a device manufacturing method using the exposure apparatus.

  In order to solve the above-described problems, the present invention adopts the following configuration corresponding to FIGS. 1 to 14 shown in the embodiment. In addition, although the code | symbol in a parenthesis is matched with the code | symbol of drawing which represents one Example, in order to demonstrate this invention easily, this invention is not limited to an Example.

  The exposure apparatus (EX) of the present invention is provided in the vicinity of the image plane side of the projection optical system (PL) in the exposure apparatus that exposes the substrate (P) through the projection optical system (PL) and the liquid (LQ). The nozzle member (70) has openings (12, 22, 32, 62) through which the liquid (LQ) flows, and the nozzle member (70) is formed by stacking a plurality of members (71, 72, 73). Among the plurality of members (71, 72, 73), at least one member (72) includes a porous body region (74, 75) in which a plurality of holes are formed. .

  According to the present invention, the nozzle member has a structure including a laminated body composed of a plurality of members, and the porous body region is provided in at least one member among the plurality of members constituting the laminated body. The strength of the nozzle member including can be maintained, and the degree of freedom in design can be improved. Therefore, for example, when supplying and recovering the liquid through the opening, the nozzle member is provided so that the generation of vibration and the elution of impurities accompanying the supply and recovery of the liquid can be suppressed and the supply and recovery of the liquid can be performed efficiently. Can be formed. Accordingly, it is possible to obtain a high exposure accuracy and measurement accuracy by forming the liquid immersion region in a desired state.

  The exposure apparatus (EX) of the present invention is provided in the vicinity of the image plane side of the projection optical system (PL) in the exposure apparatus that exposes the substrate (P) through the projection optical system (PL) and the liquid (LQ). The nozzle member (70) having the openings (12, 22, 32, 62) through which the liquid (LQ) flows, and the material forming the nozzle member (70) is compatible with the liquid (LQ) and the liquid (LQ) It is determined in consideration of the amount of impurities eluted into the water.

  According to the present invention, the material for forming the nozzle member is determined in consideration of the affinity for the liquid, so that the liquid for forming the liquid immersion region can be obtained from the nozzle member including the image plane side end surface of the projection optical system. It can hold | maintain favorably between a liquid contact surface and a board | substrate. Therefore, due to the outflow of the liquid, rust, leakage, etc. occur in the substrate and the members around the substrate stage and equipment, or a gas portion is generated between the image surface side end surface of the projection optical system and the substrate surface, etc. The occurrence of inconvenience can be prevented. In addition, by determining the material for forming the nozzle member in consideration of the amount of impurities eluted into the liquid, it is possible to prevent inconvenience that impurities are eluted from the nozzle member into the liquid immersion region. Accordingly, it is possible to obtain a high exposure accuracy and measurement accuracy by forming the liquid immersion region in a desired state.

  The exposure apparatus (EX) of the present invention is provided in the vicinity of the image plane side of the projection optical system (PL) in the exposure apparatus that exposes the substrate (P) through the projection optical system (PL) and the liquid (LQ). The nozzle member (70) having the openings (12, 22, 32, 62) through which the liquid (LQ) flows is provided, and the liquid contact region (SR) in contact with the liquid (LQ) of the nozzle member (70) is a lyophilic liquid. The region (HR) other than the liquid contact region (SR) is liquid repellent.

  According to the present invention, the liquid contact area in contact with the liquid in the liquid immersion area of the nozzle member is made lyophilic, and the area other than the liquid contact area is made liquid repellent so that the image plane side end face of the projection optical system It is possible to satisfactorily hold the liquid for forming the liquid immersion region between the liquid contact surface of the nozzle member including the substrate and the substrate. Accordingly, it is possible to obtain a high exposure accuracy and measurement accuracy by forming the liquid immersion region in a desired state.

  An exposure apparatus (EX) of the present invention is an exposure apparatus that exposes a substrate (P) through a projection optical system (PL) and a liquid (LQ), and a liquid (LQ) on a predetermined surface facing the substrate (P). ) And a recovery port (22, 32) for recovering the liquid (LQ), and a nozzle member (70) provided with at least one of the recovery ports (22, 32) for recovering the liquid (LQ). A port (62) is provided, and a predetermined area around the exhaust port (62) of the predetermined surface is a recess (68) formed so as to be separated from the substrate (P).

  According to the present invention, an exhaust port capable of exhausting gas is provided on a predetermined surface of the nozzle member, and a predetermined area around the exhaust port is formed as a recess formed so as to be separated from the substrate. When the supply of liquid to the surface side is started, even if bubbles (gas portion) exist in the supplied liquid, the gas moves upward due to the difference in specific gravity with the liquid and is discharged smoothly and quickly from the exhaust port. Is done. Therefore, highly accurate exposure processing and measurement processing can be performed through the liquid immersion area having no gas portion.

  The exposure apparatus (EX) of the present invention is a liquid supply unit (11) capable of supplying a liquid (LQ) in an exposure apparatus that exposes a substrate (P) through a projection optical system (PL) and a liquid (LQ). A liquid recovery part (21, 31) capable of recovering the liquid (LQ), a supply port (12) for supplying the liquid (LQ) onto the substrate (P), and a recovery port (22) for recovering the liquid (LQ) , 32), and a flow path (15,) connecting the nozzle member (70) with at least one of the liquid supply unit (11) and the liquid recovery unit (21, 31). And a nozzle holding mechanism (90) that holds the nozzle member (70) in a separable manner.

  According to the present invention, since the nozzle holding mechanism that detachably holds the nozzle member is provided, the maintenance workability of the nozzle member can be improved. Accordingly, even when a problem occurs in the nozzle member, an appropriate treatment can be quickly performed, so that the liquid immersion region can be formed in a desired state, and high exposure accuracy and measurement accuracy can be obtained.

The device manufacturing method of the present invention uses the above-described exposure apparatus.
According to the present invention, a liquid immersion region can be satisfactorily formed and high exposure accuracy and measurement accuracy can be obtained, so that a device having desired performance can be manufactured.

  According to the present invention, it is possible to perform a liquid supply operation and a liquid recovery operation for forming a liquid immersion area satisfactorily and form the liquid immersion area in a desired state, thereby obtaining high exposure accuracy and measurement accuracy.

  The exposure apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic block diagram showing an embodiment of the exposure apparatus of the present invention.

  In FIG. 1, an exposure apparatus EX includes a mask stage MST that supports a mask M, a substrate stage PST that supports a substrate P, and an illumination optical system IL that illuminates the mask M supported by the mask stage MST with exposure light EL. A projection optical system PL that projects and exposes the pattern image of the mask M illuminated by the exposure light EL onto the substrate P supported by the substrate stage PST, and a control device CONT that controls the overall operation of the exposure apparatus EX. I have. The control device CONT includes various measuring means (for example, interferometers 42 and 44 described later, focus / leveling detection system 120) and driving devices (for example, mask stage driving device MSTD and substrate stage driving device PSTD described later) of the exposure apparatus EX. The measurement result and the drive command can be transmitted between them. The entire exposure apparatus EX is driven by electric power from a commercial power source (first driving source) 100A supplied from an electric power company.

  The exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. A liquid supply mechanism 10 that supplies the liquid LQ to the substrate P, and a first liquid recovery mechanism 20 and a second liquid recovery mechanism 30 that recover the liquid LQ on the substrate P are provided. Further, the exposure apparatus EX includes an exhaust mechanism 60 that exhausts gas on the image plane side of the projection optical system PL. The exhaust mechanism 60 exhausts the gas on the image plane side of the projection optical system L and exhausts bubbles (gas portion) in the liquid LQ in the immersion area AR2. The exposure apparatus EX, while transferring at least the pattern image of the mask M onto the substrate P, is applied to a part on the substrate P including the projection area AR1 of the projection optical system PL by the liquid LQ supplied from the liquid supply mechanism 10. An immersion area AR2 that is larger than the projection area AR1 and smaller than the substrate P is locally formed. Specifically, the exposure apparatus EX employs a local immersion method in which the liquid LQ is filled between the optical element 2 at the image plane side end of the projection optical system PL and the surface of the substrate P disposed on the image plane side. The pattern of the mask M is projected onto the substrate P by irradiating the substrate P with the liquid LQ between the projection optical system PL and the substrate P and the exposure light EL that has passed through the mask M via the projection optical system PL. Exposure.

  Further, a nozzle member 70 which will be described in detail later is disposed in the vicinity of the image plane side of the projection optical system PL, specifically, in the vicinity of the optical element 2 at the end of the image plane side of the projection optical system PL. The nozzle member 70 is an annular member provided so as to surround the optical element 2 above the substrate P (substrate stage PST). The nozzle member 70 is detachably held by the nozzle holding mechanism 90. In the present embodiment, the nozzle member 70 constitutes a part of each of the liquid supply mechanism 10, the first liquid recovery mechanism 20, the second liquid recovery mechanism 30, and the exhaust mechanism 60.

  In the present embodiment, the exposure apparatus EX is a scanning exposure apparatus (so-called so-called exposure apparatus EX) that exposes the pattern formed on the mask M onto the substrate P while synchronously moving the mask M and the substrate P in different directions (reverse directions) in the scanning direction. A case where a scanning stepper) is used will be described as an example. In the following description, the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction, the synchronous movement direction (scanning direction) between the mask M and the substrate P in the plane perpendicular to the Z-axis direction is the X-axis direction, A direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is defined as a Y-axis direction. In addition, the rotation (inclination) directions around the X axis, the Y axis, and the Z axis are the θX, θY, and θZ directions, respectively.

The illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and the exposure light source, and an optical integrator and an optical integrator for uniformizing the illuminance of the light beam emitted from the exposure light source A condenser lens that collects the exposure light EL from the light source, a relay lens system, a variable field stop that sets the illumination area on the mask M by the exposure light EL in a slit shape, and the like. A predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illuminance distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248 nm) emitted from a mercury lamp, DUV light), vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm), or the like is used. In this embodiment, ArF excimer laser light is used.

  In the present embodiment, pure water is used as the liquid LQ. Pure water is not only ArF excimer laser light, but also far ultraviolet light (DUV light) such as ultraviolet emission lines (g-line, h-line, i-line) emitted from mercury lamps and KrF excimer laser light (wavelength 248 nm). Can also be transmitted.

  The mask stage MST is movable while holding the mask M. For example, the mask M is fixed by vacuum suction (or electrostatic suction). The mask stage MST can be moved two-dimensionally in the plane perpendicular to the optical axis AX of the projection optical system PL, that is, the XY plane, and can be slightly rotated in the θZ direction by a mask stage driving device MSTD including a linear motor or the like. The mask stage MST is movable at a scanning speed specified in the X-axis direction, and the movement stroke in the X-axis direction is such that the entire surface of the mask M can cross at least the optical axis AX of the projection optical system PL. have.

  A movable mirror 41 is provided on the mask stage MST. A laser interferometer 42 is provided at a position facing the movable mirror 41. The position of the mask M on the mask stage MST in the two-dimensional direction and the rotation angle in the θZ direction (including rotation angles in the θX and θY directions in some cases) are measured in real time by the laser interferometer 42, and the measurement result is a control device. Output to CONT. The control device CONT controls the position of the mask M supported by the mask stage MST by driving the mask stage drive device MSTD based on the measurement result of the laser interferometer 42.

  The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β, and includes a plurality of optical elements including an optical element (lens) 2 provided at the front end portion on the substrate P side. These optical elements 2 are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system.

The optical element 2 at the tip of the projection optical system PL of the present embodiment is exposed from the lens barrel PK, and the liquid LQ in the liquid immersion area AR2 is in contact with the optical element 2. The optical element 2 is made of meteorite. Since the meteorite surface has high affinity with water, the liquid LQ can be brought into close contact with almost the entire liquid contact surface (end surface) 2A of the optical element 2. That is, in the present embodiment, the liquid (water) LQ having high affinity with the liquid contact surface 2A of the optical element 2 is supplied, so that the adhesion between the liquid contact surface 2A of the optical element 2 and the liquid LQ is high. And the optical path between the optical element 2 and the substrate P can be reliably filled with the liquid LQ. The optical element 2 may be quartz having a high affinity for water. Further, the liquid contact surface 2A of the optical element 2 is subjected to a hydrophilization (lyophilic treatment) such as adhesion of MgF ₂ , Al ₂ O ₃ , SiO ₂ or the like so as to further increase the affinity with the liquid LQ. May be. Alternatively, since the liquid LQ in the present embodiment is water having a high polarity, as a lyophilic process (hydrophilization process), the optical element 2 can be formed by forming a thin film with a substance having a molecular structure having a high polarity such as alcohol. It is also possible to impart hydrophilicity to the liquid contact surface 2A. That is, when water is used as the liquid LQ, it is possible to treat the liquid contact surface 2A with a highly polar molecular structure such as an OH group.

  The substrate stage PST can move while holding the substrate P via the substrate holder PH, can move two-dimensionally in the XY plane, and can be rotated slightly in the θZ direction. Furthermore, the substrate stage PST is also movable in the Z-axis direction, the θX direction, and the θY direction. The substrate P is held by the substrate holder PH by, for example, vacuum suction. The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor controlled by the control device CONT.

  A movable mirror 43 is provided on the substrate stage PST. A laser interferometer 44 is provided at a position facing the movable mirror 43. The position and rotation angle of the substrate P on the substrate stage PST in the two-dimensional direction are measured in real time by the laser interferometer 44, and the measurement result is output to the control device CONT. The controller CONT positions the substrate P supported by the substrate stage PST by driving the substrate stage driving device PSTD including a linear motor or the like based on the measurement result of the laser interferometer 44.

  A recess 50 is provided on the substrate stage PST, and a substrate holder PH for holding the substrate P is disposed in the recess 50. The upper surface 51 of the substrate stage PST other than the recess 50 is a flat surface (flat portion) that is substantially the same height (flat) as the surface of the substrate P held by the substrate holder PH. In the present embodiment, the upper surface of the movable mirror 43 is also substantially flush with the upper surface 51 of the substrate stage PST. Since the upper surface 51 that is substantially flush with the surface of the substrate P is provided around the substrate P, there is almost no stepped portion outside the edge portion of the substrate P even when the edge region of the substrate P is subjected to immersion exposure. The liquid immersion area AR2 can be satisfactorily formed by holding the liquid LQ on the image plane side of the projection optical system PL. In addition, there is a gap of about 0.1 to 2 mm between the edge portion of the substrate P and the flat surface (upper surface) 51 provided around the substrate P. LQ hardly flows, and the liquid LQ can be held under the projection optical system PL by the upper surface 51 even when the vicinity of the periphery of the substrate P is exposed.

  Further, by making the upper surface 51 liquid repellent, it is possible to suppress the outflow of the liquid LQ to the outside of the substrate P (outside the upper surface 51) during the immersion exposure, and to smoothly collect the liquid LQ even after the immersion exposure. The inconvenience that the liquid LQ remains on the upper surface 51 can be prevented. In order to make the upper surface 51 liquid-repellent, the upper surface 51 of the substrate stage PST is formed of a liquid-repellent material such as polytetrafluoroethylene (Teflon (registered trademark)). It can be made liquid repellent. Alternatively, for example, a fluorine-based resin material such as polytetrafluoroethylene, an acrylic resin material, or a silicon-based resin material is applied to the upper surface 51, or a thin film made of the liquid-repellent material is applied. A liquid repellent treatment such as sticking may be performed. Further, the application area (liquid repellency treatment area) of the liquid repellent material may be the entire upper surface 51 or only a part of the area requiring liquid repellency.

  Here, the film for the surface treatment including the lyophilic treatment and the lyophobic treatment may be a single layer film or a film composed of a plurality of layers. As the lyophilic material for making it lyophilic or the liquid repellent material for making it lyophobic, a material that is insoluble in the liquid LQ is used.

  Further, the exposure apparatus EX includes a focus / leveling detection system (120) described later that detects positional information of the surface of the substrate P supported by the substrate stage PST. The light reception result of the focus / leveling detection system is output to the control device CONT. The control device CONT can detect the position information of the surface of the substrate P in the Z-axis direction and the tilt information of the substrate P in the θX and θY directions based on the detection result of the focus / leveling detection system. The substrate stage PST controls the focus position and tilt angle of the substrate P to align the surface of the substrate P with the image plane of the projection optical system PL by the autofocus method and the autoleveling method, and the measurement result of the laser interferometer 44. Based on the above, positioning of the substrate P in the X-axis direction and the Y-axis direction is performed.

  The exposure apparatus EX includes a lens barrel surface plate 5 that supports the projection optical system PL, and a main column 1 that supports the lens barrel surface plate 5 and the mask stage MST. The main column 1 is installed on a base 9 provided on the floor surface. The substrate stage PST is supported on the base 9. The main column 1 is formed with an upper step 7 and a lower step 8 that protrude inward.

  The illumination optical system IL is supported by a support frame 3 fixed to the upper part of the main column 1. A mask surface plate 4 is supported on the upper step 7 of the main column 1 via a vibration isolator 46. In the central portions of the mask stage MST and the mask surface plate 4, openings (the side walls of the openings are denoted by MK1 and MK2) through which the pattern image of the mask M passes are formed. A plurality of gas bearings (air bearings) 45 which are non-contact bearings are provided on the lower surface of the mask stage MST. The mask stage MST is supported in a non-contact manner on the upper surface (guide surface) of the mask surface plate 4 by the air bearing 45, and can be moved two-dimensionally in the XY plane and can be rotated in the θZ direction by the mask stage driving device MSTD. is there.

  A flange PF is provided on the outer periphery of the lens barrel PK that holds the projection optical system PL, and the projection optical system PL is supported by the lens barrel surface plate 5 via the flange PF. An anti-vibration device 47 including an air mount is disposed between the lens barrel surface plate 5 and the lower step portion 8 of the main column 1, and the lens barrel surface plate 5 that supports the projection optical system PL is the main column. 1 is supported through a vibration isolator 47. The vibration isolator 47 vibrationally separates the lens barrel base plate 5 and the main column 1 so that the vibration of the main column 1 is not transmitted to the lens barrel base plate 5 that supports the projection optical system PL. .

  A plurality of gas bearings (air bearings) 48 that are non-contact bearings are provided on the lower surface of the substrate stage PST. A substrate surface plate 6 is supported on the base 9 via a vibration isolator 49 including an air mount. The substrate stage PST is supported in a non-contact manner on the upper surface (guide surface) of the substrate surface plate 6 by an air bearing 48, and can be moved two-dimensionally in the XY plane and slightly rotated in the θZ direction by the substrate stage driving device PSTD. It is. The vibration isolator 49 prevents the vibration of the base 9 (floor surface) and the main column 1 from being transmitted to the substrate surface plate 6 that supports the substrate stage PST in a non-contact manner. (Floor surface) is separated vibrationally.

  The nozzle member 70 is separably held by a nozzle holding mechanism 90, and the nozzle holding mechanism 90 is supported on the lower step portion 8 of the main column 1 via a connecting member 52. The connecting member 52 is fixed to the lower step portion 8 of the main column 1, and the nozzle holding mechanism 90 is fixed to the connecting member 52.

  The main column 1 supporting the nozzle member 70 via the nozzle holding mechanism 90 and the connecting member 52, and the lens barrel surface plate 5 supporting the lens barrel PK of the projection optical system PL via the flange PF. Are vibrationally separated through a vibration isolator 47. Therefore, the vibration generated in the nozzle member 70 is prevented from being transmitted to the projection optical system PL. Further, the main column 1 and the substrate surface plate 6 supporting the substrate stage PST are vibrationally separated via a vibration isolator 49. Therefore, vibration generated in the nozzle member 70 is prevented from being transmitted to the substrate stage PST via the main column 1 and the base 9. Further, the main column 1 and the mask surface plate 4 supporting the mask stage MST are vibrationally separated via a vibration isolator 46. Therefore, vibration generated in the nozzle member 70 is prevented from being transmitted to the mask stage MST via the main column 1.

  The liquid supply mechanism 10 is for supplying the liquid LQ to the image plane side of the projection optical system PL, and connects the liquid supply unit 11 capable of delivering the liquid LQ and one end thereof to the liquid supply unit 11. And a supply pipe 17. The liquid supply unit 11 includes a tank that stores the liquid LQ, a temperature control device that adjusts the temperature of the liquid LQ to be supplied, a filter device that removes foreign matter in the liquid LQ, and a pressure pump. When forming the liquid immersion area AR2 on the substrate P, the liquid supply mechanism 10 supplies the liquid LQ onto the substrate P.

  The first liquid recovery mechanism 20 is for recovering the liquid LQ on the image plane side of the projection optical system PL, and includes a first liquid recovery unit 21 that can recover the liquid LQ, and a first liquid recovery unit 21. A recovery pipe 27 is connected to one end of the recovery pipe 27. The first liquid recovery unit 21 includes, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, a tank that stores the recovered liquid LQ, and the like. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing the exposure apparatus EX with a vacuum pump. In order to form the liquid immersion area AR2 on the substrate P, the first liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ on the substrate P supplied from the liquid supply mechanism 10.

  The second liquid recovery mechanism 30 is for recovering the liquid LQ on the image plane side of the projection optical system PL, and includes a second liquid recovery unit 31 that can recover the liquid LQ, and a second liquid recovery unit 31. A recovery pipe 37 is connected to one end of the recovery pipe 37. The second liquid recovery unit 31 includes, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing the exposure apparatus EX with a vacuum pump.

  The second liquid recovery mechanism 30 has an uninterruptible power supply (second drive source) 100B different from the commercial power supply 100A that is a drive source of the entire exposure apparatus EX including the first liquid recovery mechanism 20. The uninterruptible power supply 100B supplies electric power (driving force) to the drive unit of the second liquid recovery mechanism 30 at the time of a power failure of the commercial power supply 100A, for example.

  The exhaust mechanism 60 is for exhausting the gas on the image plane side of the projection optical system PL, and includes an exhaust unit 61 capable of sucking the gas, and an exhaust pipe 67 connecting one end of the exhaust unit 61 to the exhaust unit 61. I have. The exhaust unit 61 includes, for example, a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. As a vacuum system, a vacuum system in a factory where the exposure apparatus EX is disposed may be used without providing the exposure apparatus EX with a vacuum pump. Here, since the exhaust unit 61 includes a vacuum system and a gas-liquid separator, the liquid LQ on the image plane side of the projection optical system PL can also be recovered.

  Next, the nozzle member 70 will be described with reference to FIGS. 2 is a plan view of the nozzle member 70 viewed from the lower surface 70A side, FIG. 3 is a sectional view taken along the line AA in FIG. 2, FIG. 4 is a sectional view taken along the line BB in FIG. FIG. 2 is a sectional view taken along the line CC of FIG. FIG. 6 is a perspective view showing a state in which the nozzle member 70 is separated from the nozzle holding mechanism 90.

  The nozzle member 70 is an annular member that is disposed in the vicinity of the optical element 2 at the tip of the projection optical system PL and is provided so as to surround the optical element 2 above the substrate P (substrate stage PST). . The nozzle member 70 constitutes a part of each of the liquid supply mechanism 10, the first liquid recovery mechanism 20, the second liquid recovery mechanism 30, and the exhaust mechanism 60. The nozzle member 70 has a hole 70 </ b> H in which the projection optical system PL (optical element 2) can be disposed at the center thereof.

  As shown in FIG. 2, a recess 78 having a longitudinal direction in the Y-axis direction is formed on the lower surface 70 </ b> A of the nozzle member 70 facing the substrate P. A hole 70H in which the projection optical system PL (optical element 2) can be disposed is formed inside the recess 78. Therefore, the end surface 2A of the optical element 2 of the projection optical system PL disposed in the hole 70H is disposed inside the recess 78. In the present embodiment, the projection area AR1 of the projection optical system PL is set to a rectangular shape with the Y-axis direction (non-scanning direction) as the longitudinal direction.

  Inside the recess 78, there is provided a surface 78A that is substantially parallel to the XY plane and faces the substrate P supported by the substrate stage PST. In the following description, a surface 78A that is formed inside the recess 78 and faces the substrate P is appropriately referred to as a “cavity surface”.

  Of the lower surface 70 </ b> A of the nozzle member 70, a supply port 12 (12 </ b> A, 12 </ b> B) that constitutes a part of the liquid supply mechanism 10 is provided in the cavity surface 78 </ b> A inside the recess 78. The supply ports 12 (12A, 12B) are openings through which the liquid LQ formed on the lower surface 70A (cavity surface 78A) flows. In the present embodiment, two supply ports 12 (12A, 12B) are provided, and are provided on both sides in the Y-axis direction with the optical element 2 (projection area AR1) of the projection optical system PL interposed therebetween. Further, the supply ports 12A and 12B in the present embodiment are formed in a substantially circular shape. The supply ports 12A and 12B are not limited to a circular shape, and may be formed in an arbitrary shape such as an elliptical shape or a rectangular shape. In the present embodiment, the supply ports 12A and 12B have substantially the same size, but may have different sizes.

  The cavity surface 78A of the lower surface 70A of the nozzle member 70 is provided with exhaust ports 62 (62A, 62B) that constitute a part of the exhaust mechanism 60. The exhaust ports 62 (62A, 62B) are openings through which the gas or liquid LQ formed on the lower surface 70A (cavity surface 78A) flows. In the present embodiment, two exhaust ports 62 (62A, 62B) are provided, and are provided on both sides in the Y-axis direction with the optical element 2 (projection area AR1) of the projection optical system PL interposed therebetween. Further, the exhaust ports 62A and 62B in the present embodiment are formed in a substantially circular shape. The supply ports 62A and 62B are not limited to a circular shape, and may be formed in an arbitrary shape such as an elliptical shape or a rectangular shape. In the present embodiment, the exhaust ports 62A and 62B have substantially the same size, but may have different sizes.

  In the present embodiment, the supply port 12A and the exhaust port 62A are provided side by side in the X axis direction on the cavity surface 78A, and the supply port 12B and the exhaust port 62B are provided side by side in the X axis direction. Each of the supply port 12 and the exhaust port 62 is provided in the vicinity of the projection area AR1 of the projection optical system PL, and the distance between the projection optical system PL (projection area AR1) and the exhaust port 62 is determined by the projection optical system PL. The distance between the projection area AR1 and the supply port 12 is substantially equal to or shorter than the distance between the projection optical system PL (projection area AR1) and the supply port 12.

  On the lower surface 70A of the nozzle member 70, a first recovery port 22 that constitutes a part of the first liquid recovery mechanism 20 is provided outside the recess 78 with reference to the projection area AR1 of the projection optical system PL (optical element 2). ing. Further, on the lower surface 70 </ b> A of the nozzle member 70, a second recovery port 32 constituting a part of the second liquid recovery mechanism 30 is provided further outside the first recovery port 22.

  The first recovery port 22 is an opening through which the liquid LQ formed on the lower surface 70A of the nozzle member 70 flows. The first recovery port 22 has supply ports 12A and 12B of the liquid supply mechanism 10 and exhaust ports 62A and 62B of the exhaust mechanism 60 with respect to the projection area AR1 of the projection optical system PL on the lower surface 70A of the nozzle member 70 facing the substrate P. Is formed in an annular shape so as to surround the projection area AR1, the supply ports 12A and 12B, and the exhaust ports 62A and 62B. Therefore, the exhaust ports 62A and 62B are configured closer to the projection area AR1 of the projection optical system PL than the first recovery port 22. A porous body 74 in which a plurality of holes are formed is disposed in the first recovery port 22.

  The second recovery port 32 is an opening through which the liquid LQ formed on the lower surface 70A of the nozzle member 70 flows. The second recovery port 32 is provided outside the first recovery port 22 on the lower surface 70 </ b> A of the nozzle member 70 facing the substrate P, and is formed in an annular shape so as to surround the first recovery port 22. A porous body 75 in which a plurality of holes are formed is also disposed in the second recovery port 32.

  The supply ports 12A and 12B are provided between the projection area AR1 of the projection optical system PL and the first recovery port 22. The liquid LQ for forming the immersion area AR2 is supplied from above the substrate P between the projection area AR1 of the projection optical system PL and the first recovery port 22 via the supply ports 12A and 12B. It has become. Further, the first recovery port 22 is formed in a region outside the recess 78 in the lower surface 70 </ b> A of the nozzle member 70. A substantially flat flat region 77 is provided between the recess 78 and the first recovery port 22. The flat region 77 is substantially parallel to the XY plane and faces the substrate P supported by the substrate stage PST. In the following description, the flat region 77 provided around the recess 78 is appropriately referred to as a “land surface”.

  The nozzle member 70 is detachably held by the nozzle holding mechanism 90. As shown in FIGS. 3 and 4, the nozzle holding mechanism 90 includes a nozzle holder 92 that holds the nozzle member 70 in a separable manner. The nozzle holder 92 has a hole 92H in which the projection optical system PL can be disposed at the center. That is, when the nozzle holding mechanism 90 holds the nozzle member 70, the hole 92H of the nozzle holder 92 and the hole 70H of the nozzle member 70 are connected, and the projection optical system PL (optical element 2) Is disposed inside the holes 92H and 70H.

  The nozzle holding mechanism 90 (nozzle holder 92) supported by the lower step portion 8 of the main column 1 via the connecting member 52 and the nozzle member 70 held by the nozzle holding mechanism 90 are connected to the projection optical system PL (optical element). It is far from 2). That is, a gap is provided between the inner side surface 70T of the hole 70H of the nozzle member 70 and the side surface 2T of the optical element 2 of the projection optical system PL, and the projection is made with the inner side surface 92T of the hole 92H of the nozzle holder 92. A gap is also provided between the lens barrel PK of the optical system PL. These gaps are provided for vibrationally separating the projection optical system PL from the nozzle member 70 and the nozzle holding mechanism 90. This prevents vibrations generated by the nozzle member 70 and the nozzle holding mechanism 90 from being transmitted to the projection optical system PL side. Further, as described above, the main column 1 (lower step 8) and the lens barrel surface plate 5 are vibrationally separated via the vibration isolator 47. Therefore, vibration generated by the nozzle member 70 and the nozzle holding mechanism 90 is prevented from being transmitted to the projection optical system PL via the main column 1 and the lens barrel surface plate 5.

  Each of the inner side surface 70T of the nozzle member 70 and the side surface 2T of the optical element 2 forming the gap is liquid repellent. Specifically, each of the inner side surface 70T and the side surface 2T has liquid repellency by being subjected to liquid repellency treatment. As the liquid repellent treatment, a liquid repellent material such as a fluorine resin material, an acrylic resin material, or a silicon resin material is applied, or a thin film made of the liquid repellent material is attached. Further, the film for surface treatment may be a single layer film or a film composed of a plurality of layers. By making each of the inner side surface 70T of the nozzle member 70 and the side surface 2T of the optical element 2 liquid repellent, the liquid LQ in the liquid immersion area AR2 enters the gap formed by the inner side surface 70T and the side surface 2T. Is prevented.

  As shown in FIGS. 3 and 4, a supply flow path 15, a first recovery flow path 25, a second recovery flow path 35, and an exhaust flow path 65 are formed inside the nozzle holder 92. The supply flow path 15 constitutes a part of the liquid supply mechanism 10, the first recovery flow path 25 constitutes a part of the first liquid recovery mechanism 20, and the second recovery flow path 35 corresponds to the second liquid recovery mechanism 30. A part of the exhaust passage 65 constitutes a part of the exhaust mechanism 60. Therefore, the nozzle holding mechanism 90 (nozzle holder 92) constitutes a part of each of the liquid supply mechanism 10, the first liquid recovery mechanism 20, the second liquid recovery mechanism 30, and the exhaust mechanism 60.

  One end of the supply flow path 15 formed inside the nozzle holder 92 is connected to the other end of the supply pipe 17 via the joint 16, and the other end of the supply flow path 15 is connected to the nozzle member 70. It is connected to one end of a supply channel 14 formed inside. One end of the supply flow path 15 of the nozzle holder 92 is provided on the side surface of the nozzle holder 92, and the other end is provided on the lower surface of the nozzle holder 92. One end of the supply flow path 14 of the nozzle member 70 is provided on the upper surface of the nozzle member 70. On the other hand, the other end of the supply channel 14 is connected to the supply port 12 formed on the lower surface 70 </ b> A (cavity surface 78 </ b> A) of the nozzle member 70. Here, the supply flow path 14 formed inside the nozzle member 70 is branched from the middle so that the other end can be connected to each of the plurality of (two) supply ports 12 (12A, 12B). .

  Then, by holding the nozzle member 70 with the nozzle holder 92, one end of the supply flow path 14 of the nozzle member 70 and the other end of the supply flow path 15 of the nozzle holder 92 are connected. Here, one end of the supply channel 15 formed inside the nozzle holder 92 is connected to the liquid supply unit 11 capable of supplying the liquid LQ via the supply pipe 17, and the other end of the supply channel 15. The part is connected to a supply port 12 through which a liquid LQ can be supplied to the image plane side of the projection optical system PL via a supply flow path 14 formed inside the nozzle member 70. Therefore, the supply flow path 15 of the nozzle holder 92 has a configuration in which the liquid supply unit 11 and the nozzle member 70 are connected.

  Further, as shown in FIG. 4, a seal member 130 that prevents leakage of the liquid LQ is provided at a connection portion between the supply flow path 15 of the nozzle holder 92 and the supply flow path 14 of the nozzle member 70. In this embodiment, the seal member 130 is configured by an O-ring. As long as leakage of the liquid LQ can be prevented, not only an O-ring but also any sealing member such as a sealing tape can be used. By providing the seal member 130, leakage of the liquid LQ flowing through the supply channels 14 and 15 from the connection portion is prevented.

  The liquid supply operation of the liquid supply unit 11 is controlled by the control device CONT. In order to form the liquid immersion area AR2, the control device CONT sends out the liquid LQ from the liquid supply unit 11 of the liquid supply mechanism 10. The liquid LQ delivered from the liquid supply unit 11 flows through the supply pipe 17 and then flows into the supply flow path 15 that is an internal flow path of the nozzle holder 92. The liquid LQ that has flowed through the supply channel 15 of the nozzle holder 92 flows into one end of the supply channel 14 formed inside the nozzle member 70. Then, after the liquid LQ that has flowed into the one end of the supply channel 14 branches off in the middle, the liquid LQ is projected from a plurality of (two) supply ports 12A and 12B formed on the lower surface 70A (cavity surface 78A) of the nozzle member 70. Supplied on the substrate P arranged on the image plane side of the optical system PL. The liquid supply mechanism 10 can simultaneously supply the liquid LQ from each of the supply ports 12A and 12B.

  In the present embodiment, the vicinity of the supply port 12 of the supply channel 14 formed in the nozzle member 70 is formed along the vertical direction (Z-axis direction), and the supply port 12 is formed on the lower surface 70 </ b> A of the nozzle member 70. It is provided so as to face the −Z direction (downward). The liquid supply mechanism 10 supplies the liquid LQ from above to the vertically downward direction (−Z direction) with respect to the surface of the substrate P via the supply port 12.

  FIG. 7 is an enlarged cross-sectional view of the vicinity of the supply port 12 formed in the nozzle member 70. As shown in FIG. 7, the vicinity of the supply port 12 in the supply flow path 14 connected to the supply port 12 is an inclined surface 13 that gradually expands toward the supply port 12. Since the vicinity of the supply port 12 in the supply flow path 14 formed inside the nozzle member 70 and connected to the supply port 12 is formed so as to gradually expand toward the supply port (exit) 12, the substrate P (substrate stage) The force on the substrate P of the liquid LQ supplied on the PST) is dispersed. Therefore, the force exerted on the substrate P and the substrate stage PST by the supplied liquid LQ can be suppressed. Therefore, inconveniences such as deformation of the substrate P and the substrate stage PST caused by the supplied liquid LQ can be prevented, and high exposure accuracy and measurement accuracy can be obtained.

  In the present embodiment, the trumpet-shaped supply port 12 supplies the liquid LQ vertically downward from above the substrate P. However, the supply port 12 may be supplied from an inclined direction with respect to the surface (XY plane) of the substrate P. . That is, the supply port 12 may be formed to be inclined with respect to the XY plane.

  Also, it is called a mass flow controller that is sent from the liquid supply unit 11 to a predetermined position in the supply flow path of the liquid LQ, such as in the middle of the supply pipe 17, and controls the amount of liquid supplied per unit time to each of the supply ports 12A and 12B. A flow controller can be provided. The control device CONT can control the liquid supply amount via the supply ports 12A and 12B via the flow rate controller. Further, a valve for opening and closing the supply flow path can be provided at a predetermined position of the supply flow path of the liquid LQ, such as in the middle of the supply pipe 17. The control device CONT can stop the liquid supply via the supply ports 12A and 12B by closing the supply flow path at a predetermined timing using the valve.

  One end of the first recovery channel 25 formed inside the nozzle holder 92 is connected to the other end of the recovery pipe 27 via the joint 26, and the other end of the first recovery channel 25 is The nozzle member 70 is connected to one end of a manifold channel 24 that is a first recovery channel formed inside the nozzle member 70. Here, one end of the first recovery flow path 25 of the nozzle holder 92 is provided on the side surface of the nozzle holder 92, and the other end is provided on the lower surface of the nozzle holder 92. One end of the manifold channel 24 of the nozzle member 70 is provided on the upper surface of the nozzle member 70. On the other hand, the other end of the manifold channel 24 is formed in an annular shape in plan view so as to correspond to the first recovery port 22, and is connected to a part of the annular channel 23 connected to the first recovery port 22. .

  Then, by holding the nozzle member 70 with the nozzle holder 92, one end of the manifold channel (first recovery channel) 24 of the nozzle member 70 and the other end of the first recovery channel 25 of the nozzle holder 92 are connected. Connected. Here, one end portion of the first recovery flow path 25 formed inside the nozzle holder 92 is connected to the first liquid recovery portion 21 capable of recovering the liquid LQ via the recovery pipe 27, and the first recovery flow path 25 is recovered. The other end of the flow path 25 collects the liquid LQ on the image plane side of the projection optical system PL via the manifold flow path 24 and the annular flow path 23 which are first recovery flow paths formed inside the nozzle member 70. It is connected to a possible first recovery port 22. Therefore, the first recovery flow path 25 of the nozzle holder 92 has a configuration in which the first liquid recovery unit 21 and the nozzle member 70 are connected.

  Further, as shown in FIG. 3, a seal member 131 that prevents leakage of the liquid LQ is provided at a connection portion between the first recovery flow path 25 of the nozzle holder 92 and the manifold flow path 24 of the nozzle member 70. . The seal member 131 can be configured by an O-ring or the like, like the seal member 130. By providing the seal member 131, leakage of the liquid LQ flowing through the first recovery passages 24 and 25 from the connection portion is prevented.

  The liquid recovery operation of the first liquid recovery unit 21 is controlled by the control device CONT. The control device CONT drives the first liquid recovery unit 21 of the first liquid recovery mechanism 20 in order to recover the liquid LQ. By driving the first liquid recovery unit 21 having a vacuum system, the liquid LQ on the substrate P is directed vertically upward (+ Z direction) to the annular flow path 23 via the first recovery port 22 provided above the substrate P. ). The liquid LQ that has flowed into the annular flow path 23 in the + Z direction flows through the manifold flow path 24 after being collected in the manifold flow path 24. Thereafter, the liquid flows through the first recovery flow path 25 of the nozzle holder 92 and is sucked and recovered by the first liquid recovery unit 21 via the recovery pipe 27.

  One end of the second recovery flow path 35 formed inside the nozzle holder 92 is connected to the other end of the recovery pipe 37 via the joint 36, and the other end of the second recovery flow path 35 is The nozzle member 70 is connected to one end of a manifold channel 34 that is a second recovery channel formed inside the nozzle member 70. One end of the second recovery flow path 35 of the nozzle holder 92 is provided on the side surface of the nozzle holder 92, and the other end is provided on the lower surface of the nozzle holder 92. One end portion of the manifold channel 34 of the nozzle member 70 is provided on the upper surface of the nozzle member 70. On the other hand, the other end of the manifold channel 34 is formed in a ring shape in plan view so as to correspond to the second recovery port 32, and is connected to a part of the annular channel 33 connected to the second recovery port 32. .

  Then, by holding the nozzle member 70 with the nozzle holder 92, one end of the manifold flow path (second recovery flow path) 34 of the nozzle member 70 and the other end of the second recovery flow path 35 of the nozzle holder 92 are connected. Connected. Here, one end portion of the second recovery flow path 35 formed inside the nozzle holder 92 is connected to the second liquid recovery portion 31 capable of recovering the liquid LQ via the recovery pipe 37, and the second recovery flow path 35 is recovered. The other end of the flow path 35 collects the liquid LQ on the image plane side of the projection optical system PL via the manifold flow path 34 and the annular flow path 33 which are second recovery flow paths formed inside the nozzle member 70. It is connected to a possible second recovery port 32. Therefore, the second recovery flow path 35 of the nozzle holder 92 has a configuration in which the second liquid recovery unit 31 and the nozzle member 70 are connected.

  As shown in FIG. 3, a seal member 132 that prevents leakage of the liquid LQ is provided at a connection portion between the second recovery flow path 35 of the nozzle holder 92 and the manifold flow path 34 of the nozzle member 70. . The seal member 132 can be configured by an O-ring or the like, similarly to the seal members 130 and 131. By providing the seal member 132, leakage of the liquid LQ flowing through the second recovery flow paths 34 and 35 from the connection portion is prevented.

  The liquid recovery operation of the second liquid recovery unit 31 is controlled by the control device CONT. The control device CONT drives the second liquid recovery unit 31 of the second liquid recovery mechanism 30 in order to recover the liquid LQ. By driving the second liquid recovery unit 31 having a vacuum system, the liquid LQ flows vertically upward (+ Z direction) into the annular flow path 33 via the second recovery port 32 provided above the substrate P. The liquid LQ that has flowed into the annular flow path 33 in the + Z direction is collected in the manifold flow path 34 and then flows through the manifold flow path 34. After that, it flows through the second recovery flow path 35 of the nozzle holder 92 and is sucked and recovered by the second liquid recovery unit 31 via the second recovery pipe 37.

  Here, the second liquid recovery mechanism 30 is always driven by the uninterruptible power supply 100B. For example, when the commercial power supply 100A fails, the second liquid recovery unit 31 of the second liquid recovery mechanism 30 is driven with power supplied from the uninterruptible power supply 100B. In this case, the liquid recovery operation of the second liquid recovery mechanism 30 including the second liquid recovery unit 31 is not controlled by the control device CONT. For example, a command signal from another control device built in the second liquid recovery mechanism 30 Controlled based on Alternatively, the uninterruptible power supply 100B may supply power to the control device CONT in addition to the second liquid recovery mechanism 30 at the time of a power failure of the commercial power supply 100A. In this case, the control device CONT driven by the electric power from the uninterruptible power supply 100B may control the liquid recovery operation of the second liquid recovery mechanism 30.

  In order to make the drawing easier to see, in FIG. 3, one end of the first recovery channel 25 (the other end of the recovery tube 27) and the other end of the first recovery channel 25 (one end of the manifold channel 24). Are provided in the same cross section, but in actuality, they are shifted as shown in FIG. Similarly, in FIG. 3, one end of the second recovery flow path 35 (the other end of the recovery pipe 37) and the other end of the second recovery flow path 35 (one end of the manifold flow path 34) are the same. Although it is provided in the cross section, it is actually shifted.

  In the present embodiment, the first recovery port 22 is formed in an annular shape, and the recovery channels 23, 24, 25, the recovery pipe 27, and the first liquid recovery unit 21 connected to the first recovery port 22 are provided. Each of them has a configuration in which one is provided, but the first recovery port 22 is divided into a plurality, and according to the number of the first recovery ports 22 divided into a plurality, the recovery flow path, the recovery pipe, or the first A liquid recovery unit 21 may be provided. Even when the first recovery port 22 is divided into a plurality of parts, the plurality of first recovery ports 22 may be disposed so as to surround the projection area AR1, the supply port 12, and the exhaust port 62. preferable. Similarly, the second recovery port 32 may be divided into a plurality of parts.

  One end of the exhaust passage 65 formed inside the nozzle holder 92 is connected to the other end of the exhaust pipe 67 via a joint 66, and the other end of the exhaust passage 65 is connected to the nozzle member 70. It is connected to one end of an exhaust passage 64 formed inside. One end of the exhaust passage 65 of the nozzle holder 92 is provided on the side surface of the nozzle holder 92, and the other end is provided on the lower surface of the nozzle holder 92. One end portion of the exhaust passage 64 of the nozzle member 70 is provided on the upper surface of the nozzle member 70. On the other hand, the other end of the exhaust passage 64 of the nozzle member 70 is connected to an exhaust port 62 formed on the lower surface 70A (cavity surface 78A) of the nozzle member 70. Here, the exhaust flow path 64 formed inside the nozzle member 70 is branched from the middle so that the other end can be connected to each of the plural (two) exhaust ports 62 (62A, 62B). .

  Then, by holding the nozzle member 70 with the nozzle holder 92, one end of the exhaust flow path 64 of the nozzle member 70 and the other end of the exhaust flow path 65 of the nozzle holder 92 are connected. Here, one end portion of the exhaust passage 65 formed inside the nozzle holder 92 is connected to the exhaust portion 61 via the exhaust pipe 67, and the other end portion of the exhaust passage 65 is connected to the nozzle member 70. It is connected to an exhaust port 62 through which an image plane side gas of the projection optical system PL can be exhausted through an exhaust flow path 64 formed inside. Therefore, the exhaust passage 65 of the nozzle holder 92 has a configuration in which the exhaust portion 61 and the nozzle member 70 are connected.

  As shown in FIG. 4, a seal member 133 that prevents leakage of gas or liquid LQ is provided at a connection portion between the exhaust passage 65 of the nozzle holder 92 and the exhaust passage 64 of the nozzle member 70. . The seal member 133 can be configured by an O-ring or the like, similar to the seal member 130. By providing the seal member 133, leakage of the gas or liquid LQ flowing through the exhaust passages 64 and 65 from the connecting portion is prevented.

  The exhaust operation of the exhaust unit 61 is controlled by the control device CONT. The control device CONT drives the exhaust unit 61 of the exhaust mechanism 60 in order to exhaust the gas on the image plane side of the projection optical system PL. By driving the exhaust unit 61 having a vacuum system, the gas in the predetermined space on the image plane side of the projection optical system PL flows into the exhaust channel 64 through the exhaust port 62. The liquid LQ that has flowed into the exhaust flow path 64 flows through the exhaust flow path 65 of the nozzle holder 92 and is then sucked and collected by the exhaust section 61 via the exhaust pipe 67.

  Further, the control device CONT drives the exhaust unit 61 having a vacuum system, and through the exhaust ports 62A and 62B disposed in the vicinity of the optical element 2 on the image plane side of the projection optical system PL, the projection optical system. By discharging (sucking) the gas on the image plane side of the PL, the space on the image plane side can be made negative.

  As described above, since the exhaust unit 61 includes the vacuum system and the gas-liquid separator, the liquid LQ on the image plane side of the projection optical system PL can also be recovered through the exhaust ports 62A and 62B. Therefore, the exhaust mechanism 60 can discharge the gas on the image plane side of the projection optical system PL through the exhaust port 62, and discharge the bubbles (gas portion) in the liquid LQ in the liquid immersion area AR2 together with the liquid LQ. (Collection, removal) is possible.

  When the air bubbles in the liquid LQ in the liquid immersion area AR <b> 2 are recovered using the exhaust mechanism 60, the control device CONT drives the exhaust unit 61 of the exhaust mechanism 60. A part of the liquid LQ in the liquid immersion area AR2 formed on the image plane side of the projection optical system PL is sucked and collected through the exhaust port 62 by driving the exhaust unit 61 having a vacuum system. When bubbles are present in the liquid LQ, the bubbles are sucked and collected through the exhaust port 62 together with the liquid LQ.

  FIG. 8 is an enlarged cross-sectional view showing the vicinity of the exhaust port 62 formed in the nozzle member 70. As shown in FIG. 8, in the exhaust flow path 64 connected to the exhaust port 62, the vicinity of the exhaust port 62 is an inclined surface 63 that gradually expands toward the exhaust port 62. Furthermore, a predetermined area AR3 around the exhaust port 62 in the lower surface 70A of the nozzle member 70 is a recess 68 formed so as to be separated from the substrate P. Since the exhaust port 62 is provided inside the recess 68, the exhaust port 62 is provided at a position higher than the lower surface 70 </ b> A around the recess 68 with respect to the substrate P. Further, on the lower surface 70A of the nozzle member 70, an inclined surface 69 that gradually expands toward the substrate P side is formed between the region AR3 provided with the recess 68 and the surrounding region AR4. In other words, the inner surface of the recess 68 is formed so as to gradually expand toward the substrate P side.

  Since the exhaust port 62 is formed inside the recess 68 and provided at a position higher than the surrounding lower surface 70A (cavity surface 78A), even if bubbles (gas portions) exist in the liquid LQ in the liquid immersion area AR2. The bubbles move upward in the liquid LQ due to the specific gravity difference with the liquid LQ, and are collected smoothly and quickly from the exhaust port 62. Further, in the exhaust passage 64 formed in the nozzle member 70 and connected to the exhaust port 62, the vicinity of the exhaust port 62 is formed so as to gradually expand toward the exhaust port (exit) 62. Since the inner side surface of the recess 68 formed in the periphery is also formed to be inclined so as to gradually expand toward the substrate P side, for example, bubbles in the vicinity of the optical element 2 and bubbles attached to the lower surface 70A are inclined surfaces 69 and It smoothly moves to the exhaust port 62 along the inclined surface 63 and is collected smoothly and quickly from the exhaust port 62. Furthermore, in the present embodiment, the connection portion between the inclined surface 63 and the upper surface 68A of the recess 68 and the connection portion between the upper surface 68A and the inclined surface 69 are rounded so that there are no corners. When moving to the exhaust port 62 along the lower surface 70A (cavity surface 78A), the movement is performed smoothly.

  Further, as described above, since the exhaust port 62 is provided in the vicinity of the projection area AR1 of the projection optical system PL (optical element 2), bubbles adhering to the optical element 2 or in the liquid LQ of the liquid immersion area AR2 Among them, bubbles floating in the vicinity of the optical element 2 are collected smoothly and quickly through the exhaust port 62. Accordingly, it is possible to prevent the disadvantage that bubbles exist in the liquid LQ on the image plane side of the projection optical system PL.

  The exhaust mechanism 60 has a function of adding the liquid LQ to the liquid LQ supplied from the liquid supply mechanism 10 and a function of recovering a part of the liquid LQ. The pressure of the liquid LQ supplied from the liquid supply mechanism 10 may be adjusted by performing addition and partial recovery.

  In FIG. 5, the exposure apparatus EX includes a focus / leveling detection system 120 that detects surface position information of the surface of the substrate P held by the substrate stage PST. The focus / leveling detection system 120 is a so-called oblique incidence type focus / leveling detection system, and includes a light projecting unit 121 that projects detection light La onto the substrate P from an oblique direction via the liquid LQ in the liquid immersion area AR2. And a light receiving unit 122 that receives the reflected light of the detection light La reflected by the substrate P. As the configuration of the focus / leveling detection system 120, for example, the one disclosed in JP-A-8-37149 can be used.

  The light projecting unit 121 of the focus / leveling detection system 120 is provided at a position away from the projection optical system PL on the + Y side, and the light receiving unit 122 is provided at a position away from the projection optical system PL on the −Y side. It has been. That is, the light projecting unit 121 and the light receiving unit 122 are respectively provided on both sides of the projection area AR1 of the projection optical system PL.

  Of the lower surface of the nozzle holder 92, concave portions formed on the −Y side and the + Y side so as to be separated from the upper surface of the nozzle member 70 with the projection optical system PL disposed in the holes 92H and 70H interposed therebetween. 92K and 92K are formed (see FIG. 6). Similarly, in the upper surface of the nozzle member 70, the concave portions 70 </ b> K and 70 </ b> K formed so as to be separated from the lower surface of the nozzle holder 92 are respectively provided on the −Y side and the + Y side across the projection optical system PL. Is formed. Spaces 128 and 129 are formed by the recesses 70K and 92K between the nozzle holder 92 and the nozzle member 70 and on the −Y side and the + Y side, respectively, with the projection optical system PL interposed therebetween.

  The nozzle member 70 holds a first optical member 123 and a second optical member 124 that constitute a part of the focus / leveling detection system 120. The first optical member 123 can transmit the detection light La emitted from the light projecting unit 121 of the focus / leveling detection system 120, and the second optical member 124 can transmit the detection light La reflected on the substrate P. It is. The first and second optical members 123 and 124 are constituted by prism members. The nozzle member 70 has holes 123H and 124H in which the first and second optical members 123 and 124 can be arranged. The first and second optical members 123 and 124 are arranged in the holes 123H and 124H. In this state, it is fixed to the nozzle member 70 by the holder mechanisms 125 and 126. In the present embodiment, the first optical member 123 fixed to the nozzle member 70 is provided on the + Y side with respect to the projection optical system PL, and the second optical member 124 is provided on the −Y side.

  Further, the upper part of the first optical member 123 held by the nozzle member 70 is exposed (projected) in the space 128, and the lower part of the first optical member 123 is formed on the cavity surface 78A of the lower surface 70A of the nozzle member 70. The exposed opening 123K is exposed. Similarly, the upper part of the second optical member 124 held by the nozzle member 70 is exposed (projected) in the space 129, and the lower part of the second optical member 124 is exposed to the cavity surface 78 </ b> A of the lower surface 70 </ b> A of the nozzle member 70. It is exposed from the formed opening 124K.

  The detection light La emitted from the light projecting unit 121 passes through the space 128 and then enters the upper portion of the first optical member 123. The detection light La incident on the upper portion of the first optical member 123 has its optical path bent by the first optical member 123, passes through the opening 123K, and is projected onto the surface of the substrate P via the liquid LQ on the substrate P. Irradiation is performed obliquely at a predetermined incident angle with respect to the optical axis AX of the PL. The reflected light of the detection light La reflected on the substrate P passes through the opening 124K, enters the second optical member 124, bends the optical path, and is emitted from the upper part of the second optical member 124. The detection light La emitted from the upper part of the second optical member 124 passes through the space 129 and is then received by the light receiving unit 129. Further, the focus / leveling detection system 120 irradiates a plurality of detection lights La onto the substrate P from the light projecting unit 121, so that each focus at a plurality of points (each position) in a matrix shape on the substrate P, for example. The position can be obtained, and the position information in the Z-axis direction on the surface of the substrate P and the inclination information in the θX and θY directions of the substrate P can be detected based on the obtained focus positions at a plurality of points.

  The control device CONT drives the substrate stage PST via the substrate stage drive device PSTD based on the detection result of the focus / leveling detection system 120, whereby the substrate held on the substrate stage PST via the substrate holder PH. The position of P in the Z-axis direction (focus position) and the position in the θX and θY directions are controlled. That is, the substrate stage PST operates based on a command from the control device CONT based on the detection result of the focus / leveling detection system 120, and controls the focus position (Z position) and the tilt angle of the substrate P. The surface (exposed surface) is adjusted to an optimum state with respect to the image plane formed via the projection optical system PL and the liquid LQ by the autofocus method and the autoleveling method.

  In the present embodiment, the detection light La of the focus / leveling detection system 120 is irradiated substantially parallel to the YZ plane, but may be irradiated substantially parallel to the XZ plane. In this case, the light projecting unit 121 and the light receiving unit 122 are provided on the ± X side with the projection region AR1 interposed therebetween, and the first optical member 123 and the second optical member 124 are disposed on the ± X side with the projection region AR1 interposed therebetween. You may make it provide in each.

  As described above, the first optical member 123 and the second optical member 124 constitute a part of the optical system of the focus / leveling detection system 120 and a part of the nozzle member 70. In other words, in the present embodiment, a part of the nozzle member 70 also serves as a part of the focus / leveling detection system 120.

  Since the recess 78 is provided on the lower surface 70A of the nozzle member 70, the focus / leveling detection system 120 can smoothly irradiate a desired region on the substrate P with the detection light La at a predetermined incident angle. When the concave portion 78 is not provided on the lower surface 70A of the nozzle member 70, that is, when the lower surface 70A of the nozzle member 70 and the lower surface (liquid contact surface) 2A of the optical element 2 are flush with each other, detection by the focus / leveling detection system 120 When the light La is radiated to a desired region of the substrate P (specifically, for example, the projection region AR1 on the substrate P) at a predetermined incident angle, for example, a nozzle member 70 is disposed on the optical path of the detection light La and detected. In order to prevent irradiation of the light La or to secure the optical path of the detection light La, the incident angle and the distance between the lower surface (liquid contact surface) 2A of the optical element 2 of the projection optical system PL and the surface of the substrate P (working distance) This causes inconveniences such as having to be changed. However, by providing the recess 78 in the lower surface 70A of the nozzle member 70 constituting a part of the focus / leveling detection system 120 in the lower surface 70A of the nozzle member 70, the lower surface (liquid) of the projection optical system PL. Contact surface) 2A and the surface of the substrate P (working distance) are maintained at a desired value, the optical path of the detection light La of the focus / leveling detection system 120 is secured, and the detection light La is applied to a desired region on the substrate P. Can be irradiated.

  As shown in FIG. 6, the nozzle holding mechanism 90 (nozzle holder 92) and the nozzle member 70 can be separated. Since the nozzle member 70 is provided so as to be separable from the nozzle holding mechanism 90 fixed to the main column 1, the workability when maintaining the nozzle member 70 or replacing the nozzle member 70 with a new one is improved. be able to. And when a malfunction arises in the nozzle member 70, an appropriate treatment can be quickly performed. That is, in the configuration in which the pipes 17, 27, 37, 67, etc. are directly attached to the nozzle member 70, when the nozzle member 70 is maintained or replaced, it is necessary to separate the pipe (joint) and the nozzle member 70. It is complicated. However, since the piping is connected to the nozzle holding mechanism 90 (nozzle holder 92) and the nozzle member 70 can be easily attached to and detached from the nozzle holder 92, complicated work is not required.

  Further, as described above, the nozzle holder 92 and the nozzle member 70 are connected in a predetermined positional relationship, so that the internal flow paths 15, 25, 35, 65 formed in the nozzle holder 92 and the nozzle member 70 are formed. Each of the formed internal flow paths 14, 24, 34, 64 can be easily connected. Here, the exposure apparatus EX includes a positioning mechanism 91 that positions the nozzle holder 92 and the nozzle member 70. When the nozzle holder 92 and the nozzle member 70 are connected, the positioning mechanism 91 is used to connect the nozzle member 70 to the nozzle holder 92 in a predetermined positional relationship.

  In the present embodiment, as shown in FIGS. 2 and 6, the positioning mechanism 91 is fixed to the lower surface of the nozzle holder 92 and contacts the side surface of the nozzle member 70 when the nozzle holder 92 and the nozzle member 70 are connected. A plurality of (three) positioning members 91 </ b> A to 91 </ b> C that can contact each other are provided. In the present embodiment, the positioning member 91 </ b> A is in contact with the −Y side surface of the nozzle member 70, and each of the positioning members 91 </ b> B and 91 </ b> C is provided in contact with the + X side surface of the nozzle member 70.

  Since the positioning mechanism 91 for positioning the nozzle holder 92 and the nozzle member 70 is provided, the internal flow paths 15, 25, 35, 65 formed in the nozzle holder 92, and the internal flow path 14 formed in the nozzle member 70, Each of 24, 34 and 64 can be connected well. Further, as described above, in the present embodiment, since the first and second optical members 123 and 124 that constitute a part of the focus / leveling detection system 120 are fixed to the nozzle member 70, the first and second optical members are fixed. If the position of the nozzle member 70 provided with the two optical members 123 and 124 is deviated, the detection accuracy of the focus / leveling detection system 120 may deteriorate. However, the nozzle member 70 is fixed to the nozzle holder 92 (and thus the main column 1) by the positioning mechanism 91 that positions the nozzle member 70 with respect to the nozzle holder 92 (nozzle holding mechanism 90) fixed to the main column 1. Therefore, the positions of the first and second optical members 123 and 124 provided on the nozzle member 70 can also be set in a desired state. Therefore, it is possible to prevent a disadvantage that the detection accuracy of the focus / leveling detection system 120 is deteriorated.

  Further, by providing the positioning mechanism 91, the position of the supply port 12 and the collection ports 22 and 32 can be changed even when the nozzle member 70 is removed from the nozzle holder 92 and then attached to the nozzle holder 92 again. Can be prevented. Therefore, when the nozzle member 70 is attached to the nozzle holder 92 after maintenance or is replaced with a new one, it is possible to prevent fluctuations in the liquid supply position by the supply port 12 and the liquid recovery position by the recovery ports 22 and 32. The liquid LQ can be always supplied and recovered under the same liquid supply position condition and liquid recovery position condition.

  In the present embodiment, the nozzle member 70 is held by the nozzle holding mechanism 90 fixed to the main column 1. However, the nozzle member 70 is connected to the main column 1 via a predetermined coupling mechanism. The structure directly attached to (lower step part 8) may be sufficient. Even in that case, it is preferable that the coupling mechanism has a configuration in which the nozzle member 70 can be easily separated from the main column 1.

  By the way, the nozzle member 70 in this embodiment is a laminated body formed by laminating | stacking the some members 71-73, as shown in FIGS. In this embodiment, the nozzle member 70 is comprised by the three plate-shaped members of the 1st-3rd members 71-73. The number of plate-like members that form the nozzle member 70 is arbitrary. Each of the first to third members 71 to 73 is appropriately formed with holes and grooves, and by laminating the first to third members 71 to 73 so as to connect the holes and grooves, A flow path and an opening are formed.

  In the present embodiment, the first member 71 is provided with the supply flow path 14, the exhaust flow path 64, the annular flow paths 23 and 33, and the third member 73 is formed with the openings 12, 22, 32, and 62. Has been. The second member 72 is disposed so as to be sandwiched between the first member 71 and the third member 73, and is formed integrally with the porous bodies 74 and 75. That is, when the second member 72 is sandwiched between the first member 71 and the third member 73, the annular flow paths 23 and 33 formed in the first member 71 and the third member 73 formed in the third member 73. A plurality of hole portions are provided in a region located between the first and second recovery ports 22 and 23 to form a porous body region (hereinafter referred to as porous body regions 74 and 75).

  In the present embodiment, each of the first to third members 71 to 73 constituting the nozzle member 70 is formed of stainless steel (SUS316). Therefore, the porous body regions 74 and 75 are also formed of stainless steel (SUS316).

  An annular wall 141 is formed outside the first recovery port 22 with respect to the projection area AR1 in the lower surface of the third member 73 (that is, the lower surface 70A of the nozzle member 70). The wall part 141 is a convex part protruding toward the substrate P side. In the present embodiment, the distance between the lower surface of the wall 141 and the substrate P is substantially the same as the distance between the land surface 77 and the substrate P. The wall portion 141 can hold the liquid LQ in at least a part of the inner region. Further, on the lower surface of the third member 73 (the lower surface 70A of the nozzle member 70), a second wall portion 142 and a third wall portion 143 are formed outside the wall portion 141 with respect to the projection area AR1. The second recovery port 32 is provided inside a groove formed between the second wall 142 and the third wall 143. By these second and third wall portions 142 and 143, it is possible to more reliably prevent the liquid LQ from flowing out to the outside of the lower surface 70A of the nozzle member 70 (outside of the substrate P).

  FIG. 9 is an enlarged cross-sectional view of the vicinity of the first recovery port 22. In the following description, the first recovery port 22 and the porous body region 74 provided in the middle of the first recovery channel 23 connected to the first recovery port 22 will be described. However, the second recovery port 32 and the second recovery port 32 will be described. Since the porous body region 75 provided in the middle of the second recovery flow path 33 connected to the recovery port 32 also has the same configuration, the description thereof is simplified or omitted.

  The second member 72 having the porous body region 74 is provided so as to be sandwiched between the first member 71 and the third member 73. By sandwiching the second member 72 between the first member 71 and the third member 73 in a predetermined positional relationship, the porous body region 74 is connected to the first recovery port 22 in the first recovery channel 23 of the first recovery channel 23. 22 is arranged in the vicinity. The porous body region 74 disposed in the vicinity of the first recovery port 22 is provided at a position in contact with the liquid LQ filled between the substrate P and the nozzle member 70. The distance ha between the first recovery port 22 and the porous region 74 provided in the middle of the first recovery channel 23 is at least the surface tension of the liquid LQ and at least the first recovery port of the first recovery channel 23. 22 and the porous region 74 are set in consideration of the affinity with the liquid LQ. In other words, the thickness of the third member 73 is set such that the liquid LQ in the liquid immersion area AR2 is in contact with the porous body area 74. The thickness of the third member 73 is the surface tension of the liquid LQ or the third level. In consideration of the affinity of the member 73 with the liquid LQ, the thickness is set such that the surface of the liquid LQ contacts the porous body region 74.

  Then, in the first recovery channel 23, the lower channel cross-sectional area of the porous body region 74 (that is, the cross-sectional area of the channel (recovery port) formed by the third member 73) and the upper channel disconnection The area (that is, the cross-sectional area of the flow path formed by the first member 71) is set to be approximately the same value.

  Next, a method for manufacturing the nozzle member 70 will be described with reference to FIG. FIG. 10A is a schematic diagram for explaining a method of manufacturing the nozzle member 70 having the first to third members 71 to 73. As shown in FIG. 10A, the nozzle member 70 sandwiches the second member 72 having the porous region 74 between the first member 71 and the third member 73 and presses the members 71 to 73. Is formed. In the present embodiment, since each of the first to third members 71 to 73 is formed of the same material (SUS316), the press contact can be performed smoothly.

  And the 1st-3rd members 71-73 can be joined by press-contacting the 1st-3rd members 71-73, without using an adhesive agent etc. Therefore, it is possible to prevent the inconvenience of impurities mixed in the liquid LQ.

  For example, as shown in FIG. 10B, a base 70D for forming the nozzle member 70 is provided with a step 70D connected to the recovery channel (annular channel) 23, and a porous body is provided in the step 70D. The structure which joins the area | region 74 using an adhesive agent etc. can be considered. In that case, there is a possibility that an impurity due to the adhesive is mixed into the liquid LQ for forming the liquid immersion area AR2. If impurities are mixed in the liquid LQ, the exposure process and measurement process through the liquid LQ cannot be performed satisfactorily. Further, by providing the step portion 70D, the upper channel cross-sectional area has to be smaller than the lower channel cross-sectional area of the recovery channel 23 in the recovery channel 23, and the porous region There is a possibility that the recovery flow path 23 on the upper side of 74 is narrowed, resulting in a pressure loss, and the liquid LQ cannot be recovered smoothly. In particular, in the present embodiment, it is preferable that the liquid recovery mechanism 20 suppresses pressure loss as much as possible.

  Further, it is desirable that the size of the pores in the porous region 74 is as small as possible. The porous body (porous body region) 74 is formed by drilling a base material (plate member) made of stainless steel (SUS316). The thickness of is preferably smaller. On the other hand, if the thickness of the base material is thin and the strength of the second member 72 formed from the base material is not sufficient, it becomes difficult to attach the second member 72 (porous body region 74) to the stepped portion 70D. Sex is reduced.

  However, in the present embodiment, the first to third members 71 to 73 are brought into pressure contact with each other without using an adhesive, so that it is possible to prevent inconvenience that impurities are mixed into the liquid LQ. In addition, since the second member 72 is sandwiched between the first member 71 and the third member 73 and pressed, the workability is deteriorated even if the thickness of the second member 72 is thin and the strength is not sufficient. The nozzle member 70 can be formed smoothly without any problems. Further, since the second member 72 is sandwiched between the first member 71 and the third member 73 and pressed, a step portion 70D for attaching the porous region 74 as shown in FIG. 10B is provided. There is no need. Accordingly, the lower channel cross-sectional area of the porous region 74 and the upper channel cross-sectional area of the recovery channel 23 can be set to substantially the same value, and the liquid LQ can be smoothly smoothed without causing a large pressure loss. Can be recovered.

  As described above, when the porous regions 74 and 75 are provided in the recovery ports 22 and 32 through which the liquid LQ flows or the recovery channels (annular channels) 23 and 33 connected to the recovery ports 22 and 32, a plurality of nozzle members 70 are provided. Since the porous body regions 74 and 75 are provided in at least one member 72 among the plurality of members 71 to 73 constituting the laminated body, the porous body regions 74 and 75 are formed. The degree of freedom in design can be improved while maintaining the strength of the nozzle member 70 (second member 72) including the. The nozzle member 70 is configured as described above, so that when the liquid LQ is recovered through the recovery ports 22 and 32, the occurrence of vibrations and the elution of impurities associated with the recovery of the liquid LQ are suppressed, and the liquid LQ is suppressed. The nozzle member 70 can be formed so that the recovery can be performed efficiently. Therefore, the liquid immersion area AR2 can be formed in a desired state, and high exposure accuracy and measurement accuracy can be obtained.

  In the present embodiment, the porous body region 74 (75) is provided in the middle of the first recovery channel (annular channel) 23 (second recovery channel (annular channel) 33). May be provided in the middle of the supply flow path 14.

  As described above, the nozzle member 70 including the porous regions 74 and 75 is made of stainless steel, specifically, SUS316 (Cr18% + Ni12% + Mo2%). The liquid contact surface in contact with the liquid LQ in the liquid immersion area AR2 in the nozzle member 70 has a high affinity for the liquid LQ (lyophilic), like the liquid contact surface in the projection optical system PL (optical element 2). Is desirable. The liquid contact surface of the projection optical system PL (optical element 2) and the liquid contact surface of the nozzle member 70 are made lyophilic by making the liquid contact surface of the projection optical system PL (optical element 2) and the liquid contact surface of the nozzle member 70 lyophilic. The liquid immersion area AR2 can be formed while holding the liquid LQ well between the surface and the substrate P (substrate stage PST). Further, by making the porous body regions 74 and 75 disposed in the recovery ports 22 and 32 lyophilic, the liquid LQ in the liquid immersion region AR2 can be recovered well. Since stainless steel (SUS316) is lyophilic, it is preferable as a material for forming the nozzle member 70 and the porous regions 74 and 75.

  Stainless steel (SUS316) has a small amount of impurities eluted into the liquid LQ and is excellent in corrosion resistance. Moreover, since stainless steel (SUS316) has high rigidity, the resonance frequency of the nozzle member 70 formed of the stainless steel can be increased. In general, it is considered that the higher the frequency of the vibration component excited by the generated force, the less influence on the exposure accuracy. Therefore, it is desirable that the nozzle member 70 is made of high-stiffness stainless steel (SUS316) to increase the resonance frequency of the nozzle member 70. Further, since stainless steel (SUS316) has high strength, as described above, even if the thickness of the second member 72 including the porous body regions 74 and 75 is thin, the porous body regions 74 and 75 and The inconvenience that the second member 72 is deformed or damaged can be prevented.

  Thus, by determining the material for forming the nozzle member 70 in consideration of the affinity for the liquid LQ, the liquid LQ for forming the liquid immersion area AR2 is determined on the image plane side end surface 2A of the projection optical system PL. It can hold | maintain favorably between the liquid contact surface of the nozzle member 70 containing and the board | substrate P. FIG. Therefore, due to the outflow of the liquid LQ, rust, leakage, etc. occur in the members and equipment around the substrate P and the substrate stage PST, or there is a gas between the image surface side end surface 2A of the projection optical system PL and the surface of the substrate P. It is possible to prevent the occurrence of inconvenience such as generation of a part. Further, by determining the material for forming the nozzle member 70 in consideration of the amount of impurities eluted into the liquid LQ, it is possible to prevent the inconvenience of impurities eluting from the nozzle member 70 into the liquid LQ. Therefore, the liquid immersion area AR2 can be formed in a desired state, and high exposure accuracy and measurement accuracy can be obtained.

  Moreover, it is preferable to perform the process for suppressing the elution of the impurity to the liquid LQ to the nozzle member 70. FIG. Examples of such a process include a process of attaching chromium oxide to the nozzle member 70, for example, “GOLDEP” process or “GOLDEP WHITE” process of Shinko Pantech Co., Ltd. By performing such a surface treatment, it is possible to further suppress the inconvenience that impurities are eluted from the nozzle member 70 and the porous body regions 74 and 75 into the liquid LQ. Further, the process of adhering chromium oxide is performed using liquid LQ such as the porous regions 74 and 75, the lower surface 70 </ b> A of the nozzle member 70, and the internal channels 14, 23, 24, 33, 35, and 64 formed in the nozzle member 70. Can be applied to the area in contact with.

  In addition to the nozzle member 70 and the porous regions 74 and 75, the nozzle holder 92 is formed of stainless steel (SUS316), and at least a region in contact with the liquid in the nozzle holder 92 (for example, an internal flow path of the nozzle holder 92) 15, 25, 35, 65) may be subjected to the above processing. Alternatively, the member that contacts the liquid LQ, such as the supply pipe 17, the recovery pipes 23 and 37, and the exhaust pipe 67, is formed of stainless steel, and of course, the above-described processing can be performed.

  In addition, as a process applied to the nozzle member 70 in order to suppress the elution of impurities into the liquid LQ, a process of attaching a fluorine-based resin is also included. Among the fluororesins, it is particularly preferable to use PTFE (polytetrafluoroethylene) or PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer). Of course, this fluorine-based resin may be attached to the nozzle holder 92, the supply pipe 17, the recovery pipes 23 and 37, the exhaust pipe 67, and the like.

  In the present embodiment, as shown in FIG. 11, the liquid contact region SR that contacts the liquid LQ in the immersion region AR2 of the nozzle member 70 is lyophilic, and the region HR other than the liquid contact region SR is It is liquid repellent. Specifically, the lyophilic region SR having lyophilicity includes the region including the first recovery port 22 and the first recovery of the end surface 2A of the projection optical system PL (optical element 2) and the lower surface 70A of the nozzle member 70. This is a region including the cavity surface 78 </ b> A on the inner side of the port 22, and a region including the second recovery port 32. Further, as described above, the porous regions 74 and 75 provided in the first recovery port 22 and the second recovery port 32 are also lyophilic. On the other hand, the liquid repellent region HR having liquid repellency is a region outside the first recovery port 22 and includes a lyophilic region SR including the first recovery port 22 and a lyophilic region SR including the second recovery port 32. These are the area between, the area outside the second recovery port 32, and the side surface of the nozzle member 70. In the present embodiment, the land surface 77 inside the first recovery port 22 is lyophilic, but may be lyophobic.

  The contact angle of the lyophilic region SR with the liquid LQ is desirably 50 ° or less, and is approximately 5 ° in the present embodiment. Further, the contact angle of the liquid repellent region HR with the liquid LQ is desirably 60 ° or more.

In this embodiment, the lyophilic region SR is subjected to lyophilic processing and has lyophilic properties. Examples of the lyophilic process include a process of attaching MgF ₂ , Al ₂ O ₃ , SiO ₂ or the like. Alternatively, since the liquid LQ in the present embodiment is water having a large polarity, as a lyophilic process (hydrophilization process), for example, by forming a thin film with a substance having a molecular structure having a large polarity such as alcohol, the region SR becomes hydrophilic. Sex can also be imparted. That is, when water is used as the liquid LQ, it is possible to treat the region SR with a highly polar molecular structure such as an OH group.

  In the present embodiment, the liquid repellent region HR is subjected to a liquid repellent treatment and has liquid repellency. As the liquid repellency treatment, for example, a fluorine resin material such as polytetrafluoroethylene, an acrylic resin material, a silicon resin material or the like is applied, or a thin film made of the liquid repellent material is applied. And the like. Alternatively, the liquid repellency can be achieved by forming a part of the nozzle member 70 from a material having liquid repellency such as polytetrafluoroethylene or acrylic resin without performing the liquid repellency treatment.

  The film for surface treatment including the lyophilic process and the liquid repellent process may be a single layer film or a film composed of a plurality of layers. As the lyophilic material for making it lyophilic or the liquid repellent material for making it lyophobic, a material that is insoluble in the liquid LQ is used.

  As described above, the liquid contact region SR that contacts the liquid LQ in the liquid immersion region AR2 in the nozzle member 70 is made lyophilic and the region other than the liquid contact region SR is made liquid repellent, so that the projection optical system PL It is possible to satisfactorily hold the liquid LQ for forming the liquid immersion area AR2 between the liquid contact surface of the nozzle member 70 including the image surface side end surface 2A and the substrate P. Therefore, the liquid immersion area AR2 can be formed in a desired state, and high exposure accuracy and measurement accuracy can be obtained.

  Next, a method for exposing the pattern image of the mask M onto the substrate P using the exposure apparatus EX having the above-described configuration will be described with reference to a schematic diagram shown in FIG.

  When the mask M is loaded on the mask stage MST and the substrate P is loaded on the substrate stage PST and then the substrate P is scanned and exposed, the controller CONT drives the liquid supply mechanism 10 to The liquid supply operation is started. The liquid LQ supplied from the liquid supply unit 11 of the liquid supply mechanism 10 to form the liquid immersion area AR2 is supplied from the supply port 12 to the image plane side of the projection optical system PL as shown in FIG. Is done.

  The liquid supply operation when forming the immersion area AR2 on the image plane side of the projection optical system PL is performed with the projection optical system PL and the substrate P facing each other before the exposure of the substrate P. Alternatively, the projection optical system PL and a predetermined area (for example, the upper surface 51) on the substrate stage PST may be opposed to each other. Further, when the immersion area AR2 is formed on the image plane side of the projection optical system PL before the exposure of the substrate P, the substrate stage PST may be stopped or may be finely moved. Also good.

  The control device CONT drives the first liquid recovery portion 21 of the first liquid recovery mechanism 20 and starts exhaust when the supply of the liquid LQ is started using the liquid supply mechanism 10 to form the liquid immersion area AR2. The exhaust part 61 of the mechanism 60 is driven. When the exhaust unit 61 having a vacuum system is driven, the gas in the space in the vicinity of the image plane side of the projection optical system PL from the exhaust port 62 provided in the vicinity of the optical element 2 on the image plane side of the projection optical system PL. Is discharged (exhausted), and the space is made negative. In this way, the control device CONT drives the exhaust unit 61 of the exhaust mechanism 60, and on the image plane side of the projection optical system PL via the exhaust port 62 disposed in the vicinity of the projection area AR1 of the projection optical system PL. While discharging the gas, the liquid supply by the liquid supply mechanism 10 for forming the immersion area AR2 is started.

  In the present embodiment, since the concave portion 78 of the nozzle member 70 is formed on the image plane side of the projection optical system PL, when the liquid LQ is supplied to form the liquid immersion area AR2, the supplied liquid LQ is There is a high possibility that a gas portion such as a bubble is generated in the liquid LQ in the liquid immersion area AR2 or a gas is mixed into the liquid LQ without entering the recess 78. However, in the present embodiment, the liquid supply mechanism 10 supplies the liquid while discharging the gas on the image plane side of the projection optical system PL through the exhaust port 62 disposed in the vicinity of the projection area AR1 of the projection optical system PL. Since the supply of LQ is started, the liquid LQ can be smoothly arranged in the recess 78. That is, by exhausting from the exhaust port 62, the pressure in the vicinity of the exhaust port 62 is reduced, so that the supplied liquid LQ can be smoothly arranged in the negative pressure region (space) where the negative pressure is generated. Accordingly, it is possible to prevent a problem that a gas portion is generated in the liquid immersion area AR2 formed on the image plane side of the projection optical system PL or that bubbles are mixed into the liquid LQ for forming the liquid immersion area AR2. The liquid contact surface 2A of the optical element 2 of the projection optical system PL arranged inside the recess 78 can be satisfactorily covered with the liquid LQ. Therefore, high exposure accuracy and measurement accuracy can be obtained. Further, even if a gas portion such as a bubble exists in the liquid LQ, the bubble (gas portion) can be sucked and removed from the exhaust port 62, so that the bubble is mixed (existing) in the liquid LQ. Can be prevented.

  Further, the liquid LQ is supplied from the supply port 12 provided in the cavity surface 78A of the recess 78 while exhausting from the exhaust port 62 provided in the cavity surface 78A of the recess 78, thereby forming the recess 78 (exposure light EL). The optical path) can be quickly filled with the liquid LQ. Therefore, throughput can be improved.

  Further, in the present embodiment, on the lower surface 70A (cavity surface 78A) of the nozzle member 70, the predetermined area AR3 around the exhaust port 62 capable of discharging gas is a recess 68 formed so as to be separated from the substrate P. Therefore, when the supply of the liquid LQ is started on the image plane side of the projection optical system PL, even if bubbles (gas portions) exist in the supplied liquid LQ, the gas is caused by a difference in specific gravity from the liquid LQ. It moves upward and is discharged smoothly and quickly from the exhaust port 62.

  By supplying the liquid LQ via the supply port 12 of the liquid supply mechanism 10 and the recovery of the liquid LQ via the first recovery port 22 of the first liquid recovery mechanism 20 in parallel, eventually, FIG. As shown in b), an immersion area AR2 smaller than the substrate P and larger than the projection area AR1 is locally formed between the projection optical system PL and the substrate P so as to include the projection area AR1. . The liquid LQ immersion area AR2 is locally formed in a part of the substrate P in a region surrounded by the substantially annular first recovery port 22 so as to include the projection area AR1. The liquid immersion area AR2 only needs to cover at least the projection area AR1, and the entire area surrounded by the first recovery port 22 does not necessarily have to be the liquid immersion area.

  After the immersion area AR2 is formed, as shown in FIG. 12C, the control device CONT irradiates the substrate P with the exposure light EL in a state where the projection optical system PL and the substrate P face each other, and the mask M Are exposed on the substrate P through the projection optical system PL and the liquid LQ. When exposing the substrate P, the control unit CONT performs the recovery of the liquid LQ by the first liquid recovery mechanism 20 in parallel with the supply of the liquid LQ by the liquid supply mechanism 10, and the substrate stage PST that supports the substrate P. The pattern image of the mask M is projected and exposed onto the substrate P via the liquid LQ between the projection optical system PL and the substrate P and the projection optical system PL. At this time, the control device CONT supplies the liquid LQ via the supply ports 12A and 12B while adjusting the liquid supply amount per unit time of the liquid supply mechanism 10. Further, during exposure of the substrate P, the control device CONT uses the focus / leveling detection system 120 to detect positional information on the surface of the substrate P via the liquid LQ, and based on the detection result, the projection optical system For example, exposure is performed while driving the substrate stage PST so that the image plane by PL matches the surface of the substrate P.

  In the present embodiment, the vicinity of the supply port 12 in the supply flow path 14 of the liquid supply mechanism 10 is an inclined surface 13 that gradually expands toward the supply port 12 and is supplied onto the substrate P (substrate stage PST). The force of the liquid LQ on the substrate P is dispersed. Therefore, the force exerted on the substrate P and the substrate stage PST by the supplied liquid LQ can be suppressed. When the substrate P is deformed by the force exerted by the liquid LQ, there are inconveniences such as deterioration of the pattern image projected on the substrate P and deterioration of the measurement accuracy of the focus / leveling detection system 120. Further, when the edge region of the substrate P is pushed by the force of the liquid LQ when the edge region of the substrate P is subjected to immersion exposure, the height position of the edge region of the substrate P and the upper surface 51 of the substrate stage PST is shifted, It becomes difficult to satisfactorily hold the liquid LQ on the image plane side of the projection optical system PL, and the possibility that the liquid LQ leaks increases. However, in this embodiment, since the force exerted on the substrate P by the liquid LQ is suppressed, it is possible to prevent inconveniences such as the substrate P being deformed by the supplied liquid LQ and the liquid LQ leaking out. And high exposure accuracy and measurement accuracy can be obtained.

  Even during exposure of the substrate P, the control device CONT continues to collect part of the liquid LQ in the liquid immersion area AR2 via the exhaust port 62 of the exhaust mechanism 60. By doing so, even if bubbles are mixed in the liquid LQ in the liquid immersion area AR2 for some reason during the exposure of the substrate P or a gas portion is generated, the bubbles (gas portion) are removed from the exhaust port 62. Can be recovered and removed. In particular, the exhaust port 62 is disposed nearer to the optical element 2 of the projection optical system PL than the first recovery port 22, so that bubbles or the like existing in the vicinity of the optical element 2 of the projection optical system PL can be quickly recovered. Can do.

  During the exposure of the substrate P, the recovery of a part of the liquid LQ in the liquid immersion area AR2 through the exhaust port 62 by the exhaust mechanism 60 may be stopped.

  After the immersion exposure of the substrate P is completed, the control device CONT includes the first recovery port 22 of the first liquid recovery mechanism 20, the second recovery port 23 of the second liquid recovery mechanism 30, and the exhaust port 62 of the exhaust mechanism 60. Then, the liquid LQ remaining on the substrate P and the substrate stage PST is recovered. Then, after the operation of collecting the liquid LQ on the substrate P is completed, the substrate P that has been subjected to the exposure process is unloaded from the substrate stage PST.

  When the liquid LQ in the liquid immersion area AR2 on the substrate P cannot be recovered through the first recovery port 22 of the first liquid recovery mechanism 20, the liquid LQ that cannot be recovered is the first recovery port 22. However, since the liquid LQ is recovered through the second recovery port 32 of the second liquid recovery mechanism 30, as shown in FIG. 12D, the liquid LQ can be prevented from flowing out. In addition, when some abnormality occurs in the first liquid recovery mechanism 20 and the liquid recovery operation becomes impossible, or some abnormality occurs in the liquid supply mechanism 10, the liquid LQ is supplied in a large amount and the first operation is performed. Even when the liquid LQ cannot be recovered by the liquid recovery mechanism 20 alone, the liquid LQ can be recovered by the second liquid recovery mechanism 30, and the liquid LQ can be prevented from flowing out. Therefore, it is possible to prevent rusting of machine parts and the like due to the liquid LQ that has flowed out, leakage of the drive system, or fluctuations in the environment where the substrate P is placed due to vaporization of the liquid LQ that has flowed, and exposure accuracy and measurement Degradation of accuracy can be prevented. In this case, a mass flow controller or the like may be provided in the second liquid recovery mechanism 30 and the liquid supply from the liquid supply mechanism 10 may be stopped when the liquid LQ is recovered by the second liquid recovery mechanism 30.

  Further, the second liquid recovery mechanism 30 has an uninterruptible power supply 100B, and even if the commercial power supply 100A that is the drive source of the entire exposure apparatus EX including the first liquid recovery mechanism 20 has an abnormality such as a power failure, the second liquid recovery mechanism 30 Since the supply of electric power to the two liquid recovery mechanism 30 is switched to the uninterruptible power supply 100B, the liquid LQ can be recovered satisfactorily by the second liquid recovery mechanism 30. Accordingly, the liquid LQ can be prevented from flowing out, and the liquid LQ remaining on the substrate P can be recovered by the second liquid recovery mechanism 30 without being left, so that the machine around the substrate stage PST supporting the substrate P It is possible to prevent the occurrence of inconveniences such as rusting and failure of parts, or environmental changes where the board P is placed.

  For example, when the commercial power supply 100 </ b> A fails, the uninterruptible power supply 100 </ b> B supplies power to, for example, a vacuum-system power drive unit and a gas-liquid separator power drive unit that configure the second liquid recovery mechanism 230. Specifically, when the commercial power supply 100A fails, the uninterruptible power supply 100B switches the power supply to the second liquid recovery mechanism 30 to, for example, a built-in battery and supplies power without interruption. Thereafter, the uninterruptible power supply 100B starts the built-in generator in preparation for a long-time power failure, and switches the power supply to the second liquid recovery mechanism 30 from the battery to the generator. By doing so, even if the commercial power supply 100 </ b> A fails, the power supply to the second liquid recovery mechanism 30 is continued, and the liquid recovery operation by the second liquid recovery mechanism 30 can be maintained. In addition, as uninterruptible power supply 100B, it is not restricted to the form mentioned above, A well-known uninterruptible power supply is employable. In the present embodiment, the uninterruptible power supply is described as an example of the backup power supply when the commercial power supply 100A fails. However, of course, a backup battery is used as the backup power supply, and the battery at the time of the power failure of the commercial power supply 100A is used. You may make it switch to.

  Note that when the commercial power supply 100A fails, the uninterruptible power supply 100B may supply power to the suction mechanism of the substrate holder PH that holds the substrate P. By doing so, even if the commercial power supply 100A fails, it is possible to maintain the suction and holding of the substrate P by the substrate holder PH, so that the position shift of the substrate P relative to the substrate stage PST does not occur due to the power failure. Therefore, it is possible to smoothly perform the exposure process restart operation when the exposure operation is restarted after the power failure is restored.

  Further, at the time of a power failure of the commercial power supply 100A, the uninterruptible power supply 100B supplies power (driving force) to mechanisms other than the second liquid recovery mechanism 30 among the mechanisms (apparatuses) constituting the exposure apparatus EX. Also good. For example, in the event of a power failure of the commercial power supply 100A, by supplying power to the first liquid recovery mechanism 10 in addition to the second liquid recovery mechanism 30, it is possible to more reliably prevent the liquid LQ from flowing out.

  Note that a normally closed valve is provided in the supply pipe 17 of the liquid supply mechanism 10 so that when the commercial power supply 100A fails, the normally closed valve mechanically blocks the flow path of the supply pipe 17. May be. By doing so, there is no inconvenience that the liquid LQ leaks from the liquid supply mechanism 10 onto the substrate P after the power failure of the commercial power supply 100A.

  In the above-described embodiment, the liquid supply amount per unit time at the time of liquid supply before the substrate P is exposed (the states of FIGS. 12A and 12B) and the liquid supply during the exposure of the substrate P The liquid supply amount per unit time in the state (FIG. 12C) may be set to a different value. For example, the liquid supply amount per unit time before exposing the substrate P is set to about 2 liters / minute, and the liquid supply amount per unit time during exposure of the substrate P is set to about 0.5 liters / minute. The liquid supply amount before exposing the substrate P may be larger than the liquid supply amount during exposure of the substrate P. By increasing the amount of liquid supply before exposing the substrate P, for example, even if bubbles are attached to the liquid contact surface 2A of the optical element 2, the lower surface 70A of the nozzle member 70, or the surface of the substrate P, the bubbles are removed from the liquid. It can be removed at the flow rate. Then, after the bubbles (gas portions) are removed, when the substrate P is exposed, the immersion area AR2 can be formed with an optimal liquid supply amount.

  Similarly, the suction force (liquid suction amount per unit time) through the exhaust port 62 before exposing the substrate P and the suction force through the exhaust port 62 during exposure of the substrate P are set to different values. May be. For example, the suction force through the exhaust port 62 before the substrate P is exposed is made stronger than the suction force during the exposure of the substrate P, so that it adheres to the liquid contact surfaces of the optical element 2 and the nozzle member 70. Air bubbles, air bubbles adhering to the surface of the substrate P, or air bubbles (gas portion) floating in the liquid in the liquid immersion area AR2 can be reliably sucked and collected. When the substrate P is exposed, the liquid LQ and the liquid LQ are discharged from the exhaust port 62 in a state in which generation of vibration associated with the suction operation is suppressed by performing a suction operation through the exhaust port 62 with an optimal suction force. Bubbles inside can be collected and removed.

  As described above, the exhaust mechanism 60 has the function of adding the liquid LQ to the liquid LQ supplied from the liquid supply mechanism 10 and the function of recovering a part of the liquid LQ, and the exhaust port 62. The pressure of the liquid LQ supplied from the liquid supply mechanism 10 can be adjusted by adding and partially recovering the liquid LQ via the. In this case, for example, a pressure sensor is provided in a part in contact with the liquid LQ in the liquid immersion area AR2, such as a part of the lower surface 70A of the nozzle member 70, and the liquid LQ in the liquid immersion area AR2 is exposed during the liquid immersion exposure. The pressure is constantly monitored with a pressure sensor. Then, the controller CONT adjusts the pressure of the liquid LQ supplied from the liquid supply mechanism 10 onto the substrate P using the exhaust mechanism 60 based on the detection result of the pressure sensor during the immersion exposure of the substrate P. You may do it. Thereby, the force which the liquid LQ exerts on the substrate P is reduced.

  In the above-described embodiment, the case where the liquid immersion area AR2 of the liquid LQ is formed on the substrate P has been described. However, as disclosed in, for example, Japanese Patent Laid-Open No. 4-65603, on the substrate stage PST. A reference member provided with a reference mark measured by the substrate alignment system and a reference mark measured by a mask alignment system as disclosed in Japanese Patent Laid-Open No. 7-176468 is disposed, and the liquid LQ is placed on the reference member. A configuration in which the liquid immersion area AR2 is formed is conceivable. And the structure which performs various measurement processes via the liquid LQ of the liquid immersion area | region AR2 on the reference | standard member can be considered. Even in such a case, according to the exposure apparatus EX according to the present embodiment, the measurement process can be performed with high accuracy in a state where the force exerted on the reference member is suppressed. Similarly, on the substrate stage PST, as an optical sensor, for example, an illuminance unevenness sensor as disclosed in Japanese Patent Laid-Open No. 57-117238, an aerial image measurement sensor as disclosed in Japanese Patent Laid-Open No. 2002-14005. A configuration in which an irradiation amount sensor (illuminance sensor) as disclosed in Japanese Patent Application Laid-Open No. 11-16816 is conceivable is provided. An immersion area AR2 of the liquid LQ is formed on these optical sensors, and the liquid LQ is interposed therebetween. Therefore, a configuration for performing various measurement processes can be considered. Even in that case, according to the exposure apparatus EX according to the present embodiment, it is possible to perform the measurement process with high accuracy in a state where the force exerted on the optical sensor is suppressed.

  FIG. 13 is a diagram showing another embodiment of the nozzle holding mechanism 90 of the present invention. A characteristic part of the embodiment shown in FIG. 13 is that the nozzle holder 92 of the nozzle holding mechanism 90 that holds the nozzle member 70 is supported by the lens barrel surface plate 5 via the frame 52 ′. The frame 52 ′ shown in FIG. 13 has a flange portion 52 T at the upper portion thereof, and the flange portion 52 T is installed on the lens barrel surface plate 5. The flange portion PF of the lens barrel PK of the projection optical system PL is kinematically supported on the flange portion 52T of the frame 52 'via the support member 52K. The nozzle holder 92 of the nozzle holding mechanism 90 is fixed to the lower part of the frame 52 '. As described above, the nozzle holding mechanism 90 that holds the nozzle member 70 may be configured to be supported by the lens barrel surface plate 5 for supporting the projection optical system PL.

  As described above, the liquid LQ in the present embodiment is composed of pure water. Pure water has an advantage that it can be easily obtained in large quantities at a semiconductor manufacturing factory or the like, and has no adverse effect on the photoresist, optical element (lens), etc. on the substrate P. In addition, pure water has no adverse effects on the environment, and since the impurity content is extremely low, it can be expected to clean the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. . When the purity of pure water supplied from a factory or the like is low, the exposure apparatus may have an ultrapure water production device.

  The refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1.44. When ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL, On the substrate P, the wavelength is shortened to 1 / n, that is, about 134 nm, and a high resolution can be obtained. Furthermore, since the depth of focus is enlarged by about n times, that is, about 1.44 times compared with that in the air, the projection optical system PL can be used when it is sufficient to ensure the same depth of focus as that in the air. The numerical aperture can be further increased, and the resolution is improved in this respect as well.

  As described above, when the liquid immersion method is used, the numerical aperture NA of the projection optical system may be 0.9 to 1.3. When the numerical aperture NA of the projection optical system becomes large in this way, the imaging performance may deteriorate due to the polarization effect with random polarized light conventionally used as exposure light. desirable. In that case, linearly polarized illumination is performed in accordance with the longitudinal direction of the line pattern of the mask (reticle) line-and-space pattern. From the mask (reticle) pattern, the S-polarized light component (TE-polarized light component), that is, the line pattern It is preferable that a large amount of diffracted light having a polarization direction component is emitted along the longitudinal direction. When the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with a liquid, the space between the projection optical system PL and the resist applied on the surface of the substrate P is filled with air (gas). Compared with the case where it exists, the transmittance | permeability in the resist surface of the diffracted light of the S polarization component (TE polarization component) which contributes to the improvement of contrast becomes high. Therefore, high imaging performance can be obtained even when the numerical aperture NA of the projection optical system exceeds 1.0. Further, it is more effective to appropriately combine a phase shift mask or an oblique incidence illumination method (particularly a die ball illumination method) or the like according to the longitudinal direction of the line pattern as disclosed in JP-A-6-188169. In particular, the combination of the linearly polarized illumination method and the diball illumination method is used when the periodic direction of the line-and-space pattern is limited to a predetermined direction, or when the hole pattern is closely packed along the predetermined direction. It is effective when For example, when illuminating a halftone phase shift mask (pattern having a half pitch of about 45 nm) with a transmittance of 6% by using both the linearly polarized illumination method and the dieball illumination method, a diball is formed on the pupil plane of the illumination system. If the illumination σ defined by the circumscribed circle of the two luminous fluxes is 0.95, the radius of each luminous flux on the pupil plane is 0.125σ, and the numerical aperture of the projection optical system PL is NA = 1.2, the randomly polarized light is The depth of focus (DOF) can be increased by about 150 nm rather than using it.

  Further, for example, an ArF excimer laser is used as the exposure light, and a fine line and space pattern (for example, a line and space of about 25 to 50 nm) is formed on the substrate by using the projection optical system PL with a reduction magnification of about 1/4. When exposing on P, depending on the structure of the mask M (for example, the fineness of the pattern and the thickness of chrome), the mask M acts as a polarizing plate due to the Wave guide effect, and the P-polarized component (TM polarized light) that lowers the contrast. More diffracted light of the S-polarized component (TE polarized component) is emitted from the mask M than the diffracted light of the component. In this case, it is desirable to use the above-mentioned linearly polarized illumination, but even if the mask M is illuminated with random polarized light, it is high even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3. Resolution performance can be obtained.

  When an extremely fine line-and-space pattern on the mask M is exposed on the substrate P, the P-polarized component (TM-polarized component) is larger than the S-polarized component (TE-polarized component) due to the Wire Grid effect. For example, an ArF excimer laser is used as exposure light, and a line and space pattern larger than 25 nm is exposed on the substrate P using the projection optical system PL with a reduction magnification of about 1/4. In this case, since the diffracted light of the S polarization component (TE polarization component) is emitted from the mask M more than the diffracted light of the P polarization component (TM polarization component), the numerical aperture NA of the projection optical system PL is 0.9. High resolution performance can be obtained even when the value is as large as -1.3.

  Furthermore, not only linearly polarized illumination (S-polarized illumination) matched to the longitudinal direction of the line pattern of the mask (reticle) but also a circle centered on the optical axis as disclosed in JP-A-6-53120. A combination of the polarization illumination method that linearly polarizes in the tangential (circumferential) direction and the oblique incidence illumination method is also effective. In particular, when not only a line pattern extending in a predetermined direction but also a plurality of line patterns extending in different directions (a mixture of line and space patterns having different periodic directions) is included in the mask (reticle) pattern, Similarly, as disclosed in Japanese Patent Laid-Open No. 6-53120, an aperture of the projection optical system can be obtained by using both the polarization illumination method that linearly polarizes in the tangential direction of the circle centered on the optical axis and the annular illumination method. Even when the number NA is large, high imaging performance can be obtained. For example, a polarized illumination method and an annular illumination method (annular ratio) in which a half-tone phase shift mask having a transmittance of 6% (a pattern having a half pitch of about 63 nm) is linearly polarized in a tangential direction of a circle around the optical axis. 3/4), when the illumination σ is 0.95 and the numerical aperture of the projection optical system PL is NA = 1.00, the depth of focus (DOF) is more than that of using randomly polarized light. If the projection optical system has a numerical aperture NA = 1.2 with a pattern with a half pitch of about 55 nm, the depth of focus can be increased by about 100 nm.

  In the present embodiment, the optical element 2 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, for example, aberration (spherical aberration, coma aberration, etc.) can be adjusted by this lens. The optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Alternatively, it may be a plane parallel plate that can transmit the exposure light EL.

  When the pressure between the optical element at the tip of the projection optical system PL generated by the flow of the liquid LQ and the substrate P is large, the optical element is not exchangeable but the optical element is moved by the pressure. It may be fixed firmly so that there is no.

  In the present embodiment, the space between the projection optical system PL and the surface of the substrate P is filled with the liquid LQ. However, for example, the liquid with the cover glass made of a plane-parallel plate attached to the surface of the substrate P is used. The structure which satisfy | fills LQ may be sufficient.

The liquid LQ of the present embodiment is water, but may be a liquid other than water. For example, when the light source of the exposure light EL is an F ₂ laser, the F ₂ laser light does not pass through water. The liquid LQ may be, for example, a fluorinated fluid such as perfluorinated polyether (PFPE) or fluorinated oil that can transmit F ₂ laser light. In this case, the lyophilic treatment is performed by forming a thin film with a substance having a molecular structure having a small polarity including fluorine, for example, at a portion in contact with the liquid LQ. In addition, as the liquid LQ, the liquid LQ is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the photoresist applied to the projection optical system PL and the surface of the substrate P (for example, Cedar). Oil) can also be used. Also in this case, the surface treatment is performed according to the polarity of the liquid LQ to be used.

  The substrate P in each of the above embodiments is not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Further, as the exposure apparatus EX, a reduced image of the first pattern is projected with the first pattern and the substrate P being substantially stationary (for example, a refraction type projection optical system that does not include a reflecting element at 1/8 reduction magnification). The present invention can also be applied to an exposure apparatus that performs batch exposure on the substrate P using the above. In this case, after that, with the second pattern and the substrate P substantially stationary, a reduced image of the second pattern is collectively exposed onto the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  The present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 10-163099, Japanese Patent Application Laid-Open No. 10-214783, and Japanese Translation of PCT International Publication No. 2000-505958.

  In the above-described embodiment, an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed. However, the present invention is disclosed in Japanese Patent Laid-Open No. 6-124873. It is also applicable to an immersion exposure apparatus that moves a stage holding a substrate to be exposed in a liquid tank.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ) Or an exposure apparatus for manufacturing reticles or masks.

  The exposure apparatus EX of the present embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Is done. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 14, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 203, exposure processing step 204 for exposing the mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, packaging process) 205, inspection step 206, etc. It is manufactured after.

It is a schematic block diagram which shows one Embodiment of the exposure apparatus of this invention. It is the top view which looked at the nozzle member from the lower surface side. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 3 is a cross-sectional view taken along line B-B in FIG. 2. It is CC sectional view taken on the line in FIG. It is a perspective view which shows the state by which the nozzle holding mechanism and the nozzle member were isolate | separated. It is an expanded sectional view showing the neighborhood of a supply mouth. It is an expanded sectional view which shows an exhaust port vicinity. It is an expanded sectional view showing the recovery mouth neighborhood. It is a schematic diagram for demonstrating the method to manufacture a nozzle member. It is a figure for demonstrating the lyophilic area | region and liquid repellent area | region of a nozzle member. It is a schematic diagram which shows an example of operation | movement of the exposure apparatus of this invention. It is a schematic block diagram which shows another embodiment of the exposure apparatus of this invention. It is a flowchart figure which shows an example of the manufacturing process of a semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Main column (support member), 5 ... Lens-barrel surface plate (support member), 8 ... Lower step part, 10 ... Liquid supply mechanism, 12 (12A, 12B) ... Supply port (opening), 14 ... Supply flow , 15 ... supply flow path, 20 ... first liquid recovery mechanism, 22 ... first recovery port (opening), 23, 24 ... first recovery flow path, 25 ... first recovery flow path, 30 ... second liquid recovery Mechanism: 32 ... second recovery port (opening), 33, 34 ... second recovery channel, 35 ... second recovery channel, 60 ... exhaust mechanism, 62 ... exhaust port (opening), 64 ... exhaust channel, 65 ... exhaust flow path, 68 ... concave, 70 ... nozzle member, 71 ... first member, 72 ... second member, 73 ... third member, 74 ... porous body (porous body region), 75 ... porous body (porous body region) ), 90 ... Nozzle holding mechanism, 91 (91A to 91C) ... Positioning mechanism, 92 ... Nozzle holder, 120 ... Focus and leveling Detection system (surface position detection system), 123 ... first optical member, 124 ... second optical member, 130 to 133 ... seal member, AR1 ... projection area, AR2 ... liquid immersion area, EL ... exposure light, EX ... exposure apparatus , P ... substrate, PL ... projection optical system, LQ ... liquid, HR ... lyophobic region, SR ... lyophilic region

Claims (39)

An exposure apparatus for exposing a substrate through a liquid immersion area formed on the projection optical system and the substrate,
A nozzle member provided near the image plane side of the projection optical system and having an opening through which the liquid flows;
The nozzle member includes a laminate formed by laminating a plurality of members,
It said at least one member of the plurality of members may have a porous region having a plurality of holes are formed,
The opening is provided on a lower surface of the nozzle member facing the substrate, and includes a recovery port for recovering the liquid,
An exposure apparatus , wherein a lower surface of the nozzle member includes a liquid-repellent liquid repellent area outside the recovery port with respect to a projection area of the projection optical system . A flow path connected to the opening is formed inside the nozzle member,
The exposure apparatus according to claim 1, wherein the porous region is disposed at least at a part of the flow path.   The exposure apparatus according to claim 1, wherein the member having the porous region is sandwiched between other members.   The exposure apparatus according to claim 1, wherein the member having the porous body region and the other member are in pressure contact with each other. The porous body region claim 1 exposure apparatus according to any one claim 4, characterized in that provided in the filled position in contact with the liquid between the nozzle member and the substrate. Exposure apparatus according to any one of claims 1 to 5 liquid contact surface and the porous body region in contact with the liquid in the liquid immersion area, which is a lyophilic of the nozzle member. Wherein the nozzle member and the material for forming the porous body region exposure apparatus according to any one of claims 1-6, characterized in that it comprises a stainless steel. An exposure apparatus for exposing a substrate through a liquid immersion area formed on the projection optical system and the substrate,
A nozzle member provided near the image plane side of the projection optical system and having an opening through which the liquid flows;
The opening is provided on a lower surface of the nozzle member facing the substrate, and includes a recovery port for recovering the liquid,
The liquid contact area in contact with the liquid in the immersion area of the nozzle member is lyophilic,
An area other than the liquid contact area includes a liquid repellent liquid repellent area, and the liquid repellent area includes an area outside the recovery port on the lower surface of the nozzle member . The exposure apparatus according to claim 8, wherein the lyophilic liquid contact area includes an area inside the recovery port with respect to a projection area of the projection optical system on a lower surface of the nozzle member. The exposure apparatus according to claim 8 or 9, wherein a contact angle of the lyophilic liquid contact region with the liquid is 50 ° or less. The exposure apparatus according to claim 8 , wherein the liquid repellent region includes a side surface of the nozzle member. A second recovery port is provided outside the recovery port on the lower surface of the nozzle member,
Of the lower surface, the first region including the recovery port and the second region including the second recovery port are lyophilic,
The liquid repellent area, the exposure apparatus according to any one of claims 8-11, characterized in that it comprises a region between the first region and the second region.   The exposure apparatus according to claim 1, wherein the liquid repellent region has a contact angle with the liquid of 60 ° or more.   The exposure apparatus according to claim 1, wherein the liquid repellent region is formed of a fluorine resin material.   The exposure apparatus according to claim 1, wherein the liquid repellent region is formed of an acrylic resin material.   The exposure apparatus according to claim 1, wherein the liquid repellent region is formed of a silicon-based resin material.   The nozzle member is provided with a supply port for supplying liquid on the lower surface,
The exposure according to any one of claims 1 to 16, wherein, on the lower surface of the nozzle member, the recovery port is provided outside the supply port with respect to a projection region of the projection optical system. apparatus.   The nozzle member is disposed so as to surround the optical element at the tip of the projection optical system,
  The exposure apparatus according to any one of claims 1 to 17, wherein the recovery port is annularly arranged on a lower surface of the nozzle member so as to surround a projection region of the projection optical system.   The exposure apparatus according to claim 1, wherein an exhaust port through which the gas can be discharged is provided on a lower surface of the nozzle member. The exhaust port An exposure apparatus according to claim 19, wherein the provided closer than the recovery port with respect to the projection area of the projection optical system. A liquid supply mechanism for supplying the liquid;
21. The exposure apparatus according to claim 19 , wherein liquid supply by the liquid supply mechanism is started while discharging gas through the exhaust port.   A liquid recovery unit capable of recovering the liquid via the recovery port;
  The nozzle holding mechanism which has a flow path which connects the liquid recovery part and the nozzle member, and holds the nozzle member in a separable manner. Exposure equipment. By holding the nozzle member with the nozzle holding mechanism, the flow path of the nozzle holding mechanism and the internal flow path of the nozzle member are connected,
23. The exposure apparatus according to claim 22 , wherein the connecting portion is provided with a seal member that prevents liquid leakage. The exposure apparatus according to claim 22 or 23, wherein further comprising a positioning mechanism for positioning the said nozzle member and the nozzle holding mechanism. 25. The exposure apparatus according to any one of claims 22 to 24 , wherein the nozzle holding mechanism is supported by a support member that supports the projection optical system. A device manufacturing method using the exposure apparatus according to any one of claims 1 to 25 .   A nozzle member provided in an exposure apparatus that exposes the substrate through a projection optical system and a liquid in a liquid immersion region formed on the substrate,
  A lower surface facing the substrate;
  An opening provided on the lower surface, through which the liquid flows,
  The opening includes a recovery port for recovering the liquid;
  A nozzle member including a liquid-repellent liquid repellent area, the lower surface of which is disposed outside the recovery port with respect to a projection area of the projection optical system.   28. The nozzle member according to claim 27, wherein the recovery port is annular and is disposed so as to surround a projection region of the projection optical system.   The nozzle member according to claim 27 or 28, wherein the nozzle member is provided on the lower surface and has a supply port for supplying a liquid.   An internal flow path connected to the recovery port;
  The nozzle member according to any one of claims 27 to 29, further comprising a porous body region disposed in at least part of the internal flow path.   The nozzle member according to any one of claims 27 to 30, wherein the nozzle member has a liquid-repellent side surface that is disposed outside the recovery port with respect to a projection region of the projection optical system.   An inner surface facing the side surface of the optical element at the tip of the projection optical system via a gap;
  The nozzle member according to any one of claims 27 to 31, wherein the inner surface is liquid repellent.   The nozzle member according to any one of claims 27 to 32, wherein the recovery port recovers the liquid together with a gas.   The nozzle member according to any one of claims 27 to 33, wherein the liquid repellent region has a contact angle with the liquid of 60 ° or more.   The nozzle member according to any one of claims 27 to 34, wherein the liquid repellent region is formed of a fluorine resin material.   The nozzle member according to any one of claims 27 to 34, wherein the liquid repellent region is formed of an acrylic resin material.   The nozzle member according to any one of claims 27 to 34, wherein the liquid repellent region is formed of a silicon-based resin material.   38. An exposure apparatus that exposes the substrate through a projection optical system and a liquid in a liquid immersion area formed on the substrate, comprising the nozzle member according to any one of claims 27 to 37.   39. A device manufacturing method comprising exposing a substrate with the exposure apparatus according to claim 38.

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