JP4516179B2 - Contact and non-contact IC card manufacturing method and manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus for a contact / non-contact IC card in which an IC module having a contact type and a non-contact type interface is mounted in a card substrate.
[0002]
[Prior art]
The contact / non-contact IC card is a dual interface IC card that can selectively use the communication methods of contact IC card and non-contact IC card. The use is increasing from the viewpoint of multi-use that combines the convenience of communication.
This contact / non-contact IC card is mounted with one IC having two interfaces due to cost and size restrictions.
[0003]
FIG. 4 is a diagram showing an IC module used for a contact / contactless IC card. 4A is a diagram illustrating the front surface (contact terminal side), and FIG. 4B is a diagram illustrating the back surface (IC mounting side).
The IC module 30 is a dual interface IC module having eight contact communication external terminals 31 defined by ISO provided on the front surface and two non-contact communication external terminals 32 provided on the rear surface. It has become.
[0004]
In this IC module 30, like the conventional contact IC card IC module, the contact communication external terminal 31 has an IC mounted on the back surface of the module tape substrate, and each terminal of the module tape substrate from each pad of the IC. Is bonded to the back surface by wire bonding and sealed with a mold resin 33 for the main purpose of protection from the external environment.
[0005]
However, the non-contact communication external terminal 32 must be in a position facing the antenna terminal 24 (see FIG. 5) when the IC module 30 is embedded in the card. Must be outside the range of the mold resin 33. In general, the range of the mold resin 33 is normally arranged in the center of the IC module 30 in view of the handling property of the IC module 30. Therefore, conduction between the non-contact communication external terminal 31 of the IC module 30 and the IC is performed by a connecting line (wiring) 34 drawn on the back surface of the IC module 30.
[0006]
FIG. 5 is a cross-sectional view showing the contact / non-contact shared IC card 20.
The IC module 30 is not necessarily the size to be mounted on the IC card 20 from the beginning, and is often handled in the form of a 38 mm wide tape from the viewpoint of productivity and handling. Such a tape-shaped module is referred to as COT (Chip On Tape), and a process (lamination process) for applying a hot-melt adhesive tape to bond the IC card 20 and the IC module 30 is performed. Ultimately, it is punched out with a mold into individual pieces of an appropriate size.
[0007]
Corresponding to the IC module 30, the contact / non-contact shared IC card 20 is arranged and adhered to the card position determined by the ISO of the card base 31 like a conventional contact IC card. Therefore, not only the counterbore part (recessed part) 22 spotted with a drill but also two antenna terminals 24 of the antenna coil 23 embedded in the card base 21 are contacted from the counterbore part 22 to the IC module 30. It is necessary to be exposed at each position facing the communication external terminal 32.
[0008]
The card substrate 21 and the IC module 30 prepared as described above are connected to the contactless external terminal 32 (conduction bonding step), and the IC module 30 is bonded to the recess 22 in the card substrate 21. Through the process (sealing process), the integrated dual interface IC card is obtained.
[0009]
That is, the contact / non-contact IC card 20 requires an additional conductive joining step, whereas the contact IC card only requires a sealing step. In this conductive bonding step, two antenna terminals 24 and two non-contact external terminals 32 of the IC module 30 are conductively connected using a bonding agent 25 so that non-contact communication can be performed, and a separately installed reader A signal (power or information) received from the antenna coil 23 in the card 20 from the writer is taken into the IC in the IC module 30, and the result of collating the information in the IC can be returned. is there.
Here, as the bonding agent 25, solder, conductive adhesive, ACF (Anisotropic Conductive Film) or the like is used. The ACF is a film that exhibits conductivity only in the pressing direction, and is mainly used for lamination of a chip with a bump and a substrate, lamination of a film substrate with fine wiring, and the like.
[0010]
By the way, such a bonding agent 25 generally has a high melting temperature (curing temperature), and in this manufacturing method, the temperature of the heater chip is required for the bonding agent 25 through a COT module by hot pressing. Since the temperature is transmitted, the heating temperature of the heater chip needs to be about 50 to 100 ° C. higher than the required temperature.
[0011]
In the case of solder, a liquid paste containing a flux is often used because of the ease of filling the material into the recesses 22, but it is a general Pb—Sn-based one at around 183 ° C. (press temperature is 238 ° C. to 283 ° C.), and it takes about 60 seconds to melt the solid content after the flux is blown to obtain a solid content.
There are low-temperature type Bi-based solders of around 138 ° C. (press temperature is 188 ° C. to 238 ° C.), but there is a fact that they are brittle in strength and not reliable.
[0012]
In addition, if the conductive adhesive is of a two-component mixed type, there are some that cure at room temperature to 50 ° C., but in that case, it takes time to cure for half a day to 3 days or more. Not suitable for this application. The one-pack type can be cured by applying heat of around 100 ° C., but it still takes 5 minutes to 30 minutes. For this reason, the heating temperature is increased (press temperature is about 250 ° C.) and curing is performed for about 1 minute.
[0013]
[Problems to be solved by the invention]
As described above, the conventional method for manufacturing a contact / non-contact IC card 20 employs a bonding process by a hot press method that enables high-speed bonding using an existing bonding agent 25, and is 200 ° C. or higher. In addition, the press temperature must be raised, and even at high speed, it takes about 30 sec to 1 min.
[0014]
For this reason, the surface of the card base 21 is “swelled A” along the antenna shape in the area of the antenna terminal 24 in the area of the antenna terminal 24 where the heat concentrates on the terminal section (antenna terminal section to antenna coil lead-out section). Will occur.
Further, since the heater chip of the pressing device applies a slight pressure of about 100 g during heating and presses the IC module 30, the surface of the card base 21 swells with high heat in a region near the outer periphery of the IC module 30. "Turning up B" occurs, and the height reaches 50 to 100 μm.
Therefore, there is a problem that it is difficult to satisfy the dimensional standard (0.76 ± 0.08 mm) of the thickness defined by ISO.
[0015]
In order to solve this problem, a separate process is required, such as pressing the “turn over A” or “swell B” again with a cooling plate or a heat radiating plate to keep the card thickness within the standard value. The size of the manufacturing apparatus was increased and the manufacturing cost was increased.
[0016]
The object of the present invention is to solve the above-mentioned problems, in the case where a high temperature load is involved in an IC module joining process in which the coil terminal of the antenna coil in the card substrate and the external terminal of the IC module are joined through a bonding agent. , A contact / non-contact IC card manufacturing method capable of preventing deformation of the card base material due to heat (appearance defect or non-dimensional standard) at low cost, improving product quality, and significantly improving manufacturing yield. And providing a manufacturing apparatus.
[0017]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention of claim 1 is a contact / non-contact method including an IC module bonding step of bonding an antenna terminal of an antenna coil in a card base and an external terminal of an IC module with a bonding agent. In the method for manufacturing a shared IC card, the IC module bonding step is configured to apply heat applied to the card base material when the bonding agent is melted by applying a high temperature load to the surface of the IC module to perform hot pressing. Dissipating heat, the IC module joining step radiating heat applied to the card base by a heat sink contacting the card base, and the heat sink on the IC base A contact / non-contact IC card manufacturing method , comprising: an opening provided at a position corresponding to the IC module .
[0020]
The invention of claim 2 is the method for manufacturing a contact and contactless shared IC card according to claim 1, wherein the heat sink forcibly be cooled is a cooling plate, the contact and non-contact, characterized in This is a method for manufacturing a shared IC card.
[0021]
The invention according to claim 3 is the method for manufacturing a contact / non-contact IC card according to claim 1 , wherein the heat radiating plate is brought into pressure contact. It is.
[0022]
The invention of claim 4 is an apparatus for manufacturing a contact / non-contact IC card including IC module joining means for joining an antenna terminal of an antenna coil in a card substrate and an external terminal of an IC module with a bonding agent. The IC module bonding means includes a heating unit that heats the surface of the IC module to melt the bonding agent, and a heat radiating plate that contacts the card base and dissipates heat applied to the card base. And the heat radiating plate is provided on the IC substrate, and has an opening at a position corresponding to the IC module. It is.
[0024]
According to a fifth aspect of the present invention, there is provided the contact / noncontact common IC card manufacturing apparatus according to the fourth aspect , further comprising cooling means for forcibly cooling the heat radiating plate. This is a card manufacturing apparatus.
[0025]
The invention of claim 6 is the contact / non-contact IC card manufacturing apparatus according to claim 4 , further comprising a pressurizing means for pressurizing and contacting the heat radiating plate to the card substrate. This is a contact / non-contact IC card manufacturing device.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a process diagram for explaining an embodiment of a method for manufacturing a contact / non-contact common IC card according to the present invention, and FIG. 2 is an IC module joining step of the method for manufacturing a contact / non-contact common IC card according to this embodiment. FIG. 3 is a diagram showing an embodiment of a contact / non-contact IC card manufacturing apparatus according to the present invention.
In the embodiment described below, the same parts as those of the IC card described with reference to FIGS. 4 and 5 described above are denoted by the same reference numerals, and overlapping drawings and description will be omitted as appropriate.
[0027]
As shown in FIG. 1, the method for manufacturing a contact / non-contact IC card according to this embodiment includes a card base material production process # 101, a recess formation process # 102, an IC module production process # 103, and an IC module bonding. Step # 104.
[0028]
In the card base material production step # 101, a PVC (vinyl chloride) sheet to be the card base material 21 and a PVC antenna coil sheet to which the Cu foil antenna coil 23 is transferred are arranged in the center. The laminated sheets are laminated and pressed flat under the conditions of a pressure of 20 kgf / cm ² , a heating temperature of 150 ° C., and a heating time of 15 minutes, and the sheets are fused to produce a laminated sheet. Next, this laminate sheet is aligned with the card removal position and punched out using a mold to produce a card substrate 21 as shown in FIG.
[0029]
In the recess forming step # 102, the punched card base 21 is mounted to the mounting position of the IC module 30 to a predetermined depth using a drill, and the counterbore (recess) 22 as shown in FIG. Form.
At the same time, the card substrate 21 is seated with a drill at a position corresponding to the non-contact external terminal 32 of the IC module 30 until the antenna terminal 24 of the antenna coil 23 is exposed. Actually, the antenna terminal 24 of Cu foil having a thickness of 30 μm used in this embodiment was cut by about 5 μm.
[0030]
In the IC module manufacturing step # 103, the two non-contact external terminals 32 and the back surface (IC mounting side) of the IC module tape on which the IC is mounted (in this embodiment, a double-sided Cu foil substrate made of glass epoxy) After affixing the tape with the hot melt adhesive so as to avoid the IC mounting part, it is punched one by one to the dimensions to be mounted on the IC card, and a small piece of IC as shown in FIG. A module 30 is produced.
[0031]
In the IC module joining step # 104, the card base 21 and the IC module 30 are integrated with the card base 21 and the IC module 30 prepared as described above.
[0032]
First, the antenna terminal 24 to which the antenna coil 23 of the IC card 20 is connected is filled with an appropriate amount of solder paste so that the solder paste and the flux are not scattered in a large amount other than the area of the antenna terminal 24. By fitting so that the surface (contact communication terminal 31 surface side) is on the top and the surface position of the surface of the IC module 30 is substantially the same as the surface position of the surface of the card substrate 21, The solder paste is sandwiched between the antenna terminal 24 on the card base 21 side and the non-contact external terminal 32 of the IC module 30.
[0033]
Thereafter, the bonding agent (solder) 25 is melted by hot pressing the position corresponding to the antenna terminal 24 on the surface of the IC module 30, and the bonding agent 25 to the antenna terminal 24 and the bonding agent 25 to IC. Each joint between the non-contact external terminals 32 of the module 30 is performed simultaneously.
[0034]
Next, heat press conditions will be examined. The smaller the temperature, time, and press thrust, which are the conditions for the heat press, the more the production capacity is improved, and the deformation of the card base material 21 (PVC in this embodiment) due to high heat is reduced to reduce the quality. Alternatively, the yield can be improved.
On the other hand, the conditions of the hot press vary slightly depending on the design of the filling amount of the bonding agent 25, the distance between the bonding terminals, and the like. In particular, what controls the conditions is the bonding agent (solder paste, conductive adhesive). Etc.) 25 types and the thickness of the substrate of the IC module 30.
[0035]
As the bonding agent 25 used in this embodiment, the most common and highly reliable Pb—Sn system (melting point: 186 ° C.) was used. The filling amount was about 4 mg / (one place). The thickness of the IC module 30 was about 190 μm (Cu foil thickness: 35 μm—adhesive thickness: 5 μm—glass epoxy thickness: 110 μm—adhesive thickness: 5 μm—Cu foil thickness: 35 μm). Actually, the pressing of the pressing conditions was made constant (about 100 g), the temperature × time was used as a matrix, and the bonding condition and the bonding portion strength were evaluated as the evaluation items.
As a result, the total amount of heat given to the solder paste as the bonding agent 25 through the thickness of the substrate of the IC module 20 was 285 ° C. × 60 sec, which is about 100 ° C. higher than the melting temperature of the solder.
[0036]
From the above, the hot press conditions taking into account the reliability of the solder joints were 285 ° C. × 60 sec × 100 g. At this time, in order to efficiently apply a heat amount of 285 ° C. × 60 sec to the solder joint from the surface of the IC module 30, the heater chip needs to be sufficiently larger than the solder joint.
[0037]
In such a case, according to the conventional technology, the heater chip is fitted to the spot 22 of the card base material 21 and the card surface at the boundary of the card base material 21 has hot air from the heater chip. The thickness of the card increased and reached an average of 925 μm (± 58.3 μm; 3σ / n = 20), which sometimes significantly exceeded the standard value of the card thickness.
[0038]
In the conventional technique, the heat applied to the solder joint portion is transmitted to the antenna coil 23 through the antenna terminal 24 of the card, but on the card surface on the antenna coil 23 near the antenna terminal 24 and the antenna terminal 24. In some cases, the surface of the card base material 21 swells in the shape of an antenna due to the flowing heat.
In this case, the swell appears only on the card surface, is cooled on the stage side, and does not appear on the back side where swell is restricted.
[0039]
As a result, it was found that the hot press conditions considering the reliability of the joints are conditions that cannot be used because the appearance quality of the card is deteriorated and the thickness standard value is over.
[0040]
Therefore, in the IC module joining step # 104 of the present embodiment, as shown in FIG. 2, after the card base material 21 into which the IC module 30 is fitted is placed at a predetermined position on the stage 11 (see FIG. 3), The heat sink 13 according to the embodiment is disposed on the card base 21.
[0041]
As shown in FIG. 3, the IC card manufacturing apparatus 10 according to the present embodiment includes a stage 11, positioning pins 12 for positioning the card base 21 on the stage 11, a heat dissipating plate 13 provided with a window 13 a, and heat dissipation. A press device 14 that presses the plate 13, a heater chip 15 that heats the IC module 30, a press device 16 that presses the heater chip 15, and the like are provided.
For example, an air cylinder can be used as the pressing device 14 as shown in FIG. This air cylinder presses the heat radiating plate 13 previously arranged at an appropriate position against the card substrate 21. As for the pressing pressure, a force of around zero to several tens of kg can be easily obtained by adjusting the air pressure flowing into and out of the air cylinder.
[0042]
The heat radiating plate 13 is made of aluminum having a thickness of 1 mm and is slightly larger than the size of the card 20 so that the heat pressing of the IC module 30 can be performed and the heat applied to the IC module 30 is not directly radiated. Thus, the window (opening) 13a was opened at a position corresponding to the mounting portion of the IC module 30.
[0043]
If the window 13a is placed on the IC module 30, the amount of heat to be applied to the solder joint escapes from the heater chip 15 to the IC module 30 to the heat sink 13, and the solder joint is not sufficiently melted. For this reason, an IC module 30 that is 0.1 mm larger on one side (that is, 0.2 mm on both sides) is used, but in reality, the positioning accuracy of the IC card 20 and the fitting accuracy of the IC module 30 are taken into consideration. You can determine the size above.
[0044]
The manufacturing apparatus 10 is positioned and positioned on the stage 11 with the positioning pins 12 in a state where the IC module 30 is fitted to the card base 21 filled with an appropriate amount of the bonding agent 25 at a predetermined position of the spot facing portion 22. Then, the heat radiating plate 13 provided with the window 13 a is pressed against the card base 21 by the press device 14.
[0045]
As a result of performing the heat press in the state as described above, the heat generated from the end of the heater chip 15 flows directly to the heat radiating plate 13, and the card base 21 is hardly turned up. The card thickness at the boundary with the IC module 30 was 819 μm (± 26.3 μm; 3σ / n = 20), which was well within the standard value.
Further, the rise of the card surface could be drastically reduced by regulating the heat sink 11 in the same manner as the back surface.
[0046]
As described above, according to the present embodiment, the contact having the reliability of the joint portion of the antenna terminal 24 of the antenna coil 23, the thickness standard of the card, and the appearance quality can be easily used by using the existing bonding agent 25. -It was confirmed that mass production of the contactless shared IC card 20 with high yield was feasible at low cost.
[0047]
The present invention is not limited to the embodiment described above, and various modifications and changes are possible, and these are also within the equivalent scope of the present invention.
(1) Although the sheet | seat which produces a card | curd base material demonstrated by PVC with a self-fusing property, it is not restricted to this, PET etc. without a self-fusing property may be sufficient. In this case, a laminate sheet may be produced by coating an adhesive and then laminating the sheets via the adhesive.
[0048]
(2) Although the heat dissipation plate 13 used in the present embodiment has been described using an example made of aluminum, it is only necessary to have good heat dissipation, and a Cu material, a SUS material, or the like can be substituted.
[0049]
(3) In this embodiment, although the example which presses the heat sink 13 with the press apparatus 14 was demonstrated, you may place the heat sink 13 on the card | curd base material 21 simply. Further, the heat sink 13 may be made heavy (thick) so as to reduce the clearance so that the heat flowing from the heater chip 15 does not flow into the IC module boundary.
[0050]
(4) In this embodiment, solder paste is used as the bonding material. However, the same applies to the case of a conductive adhesive or the like. In order to increase productivity and transmit heat to the bonding portion through the thickness of the IC module substrate. The surface of the IC module must be hot-pressed with a high-temperature heater chip of 200 ° C. or higher, and the problem can be similarly solved by the manufacturing method using the radiator plate 13 of the present invention.
[0051]
(5) The manufacturing apparatus 10 can also be used as a cooling plate by providing cooling means for forcibly cooling the heat radiating plate 13.
[0052]
【The invention's effect】
As described above in detail, according to the present invention, in the present situation where the IC module joining process is inevitably subjected to a high temperature load in order to increase the productivity, the deformation of the card surface caused by the high temperature load (swelling and turning up) Can be prevented easily and at low cost, and not only can the yield be dramatically improved, but also the productivity can be improved by applying a higher temperature load.
[Brief description of the drawings]
FIG. 1 is a process diagram illustrating an embodiment of a method for manufacturing a contact / non-contact IC card according to the present invention.
FIG. 2 is a diagram showing an IC module joining step of a method for manufacturing a contact / non-contact shared IC card according to the present embodiment.
FIG. 3 is a diagram showing an embodiment of a contact / non-contact IC card manufacturing apparatus according to the present invention.
FIG. 4 is a diagram showing an IC module used for a contact / non-contact shared IC card.
FIG. 5 is a cross-sectional view showing a contact / non-contact common IC card 20;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Contact / non-contact common IC card manufacturing apparatus 11 Stage 12 Positioning pin 13 Heat sink 13a Window 14 Press device 15 Heater chip 16 Press device 20 Contact / non-contact common IC card 21 Card base 22 Counterbore part (recess)
23 antenna coil 24 antenna terminal 25 bonding agent 30 IC module 31 contact type communication external terminal 32 non-contact type communication external terminal 33 mold resin 34 connecting wire (wiring)

Claims (6)

In the method of manufacturing a contact / non-contact common IC card including an IC module joining step of joining the antenna terminal of the antenna coil in the card substrate and the external terminal of the IC module with a bonding agent,
The IC module bonding step dissipates heat applied to the card substrate when the bonding agent is melted by applying a high temperature load to the surface of the IC module and hot pressing.
The IC module joining step radiates heat applied to the card substrate by a heat radiating plate in contact with the card substrate; and
The heat dissipation plate is provided on the IC base material, and has an opening at a position corresponding to the IC module;
A method of manufacturing a contact / non-contact IC card characterized by the above. In the manufacturing method of the contact / non-contact shared IC card according to claim 1 ,
The radiator plate is a cooling plate that is forcibly cooled;
A method of manufacturing a contact / non-contact IC card characterized by the above. In the manufacturing method of the contact / non-contact shared IC card according to claim 1 ,
The heat sink is brought into pressure contact;
A method of manufacturing a contact / non-contact IC card characterized by the above. In a contact / non-contact shared IC card manufacturing apparatus including an IC module bonding means for bonding an antenna terminal of an antenna coil in a card substrate and an external terminal of an IC module with a bonding agent,
The IC module bonding means heats the surface of the IC module and melts the bonding agent;
A heat sink that contacts the card substrate and dissipates heat applied to the card substrate; and
The heat dissipation plate is provided on the IC base material, and has an opening at a position corresponding to the IC module;
A contact / non-contact IC card manufacturing device characterized by In the contact / non-contact shared IC card manufacturing apparatus according to claim 4 ,
Comprising cooling means for forcibly cooling the heat sink;
A contact / non-contact IC card manufacturing device characterized by In the contact / non-contact shared IC card manufacturing apparatus according to claim 4 ,
Comprising a pressurizing means for bringing the heat sink into pressure contact with the card substrate;
A contact / non-contact IC card manufacturing device characterized by

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