JP4510661B2 - 酸化炉装置 - Google Patents
酸化炉装置 Download PDFInfo
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- JP4510661B2 JP4510661B2 JP2005036183A JP2005036183A JP4510661B2 JP 4510661 B2 JP4510661 B2 JP 4510661B2 JP 2005036183 A JP2005036183 A JP 2005036183A JP 2005036183 A JP2005036183 A JP 2005036183A JP 4510661 B2 JP4510661 B2 JP 4510661B2
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- sample
- chamber
- furnace
- heater
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Description
M.Kimura、et all、J. Appl. Phys. vol.89、pp.2138-2145、2001
また、上記酸化炉装置において、炉は、対向する側面に、試料の下部と同程度の高さから上方にかけて配設された第1の窓および第2の窓をさらに備え、X線照射装置は、第1の窓近傍の炉外部に配設され、第1の窓を介して試料にX線を照射し、検出器は、第2の窓近傍の炉外部に配設され、窓2を介して試料から生じる回折X線を検出するようにしてもよい。
Claims (5)
- 炉内を加熱し酸化性ガスを用いて前記炉内に配置した試料を熱酸化させる酸化炉装置において、
前記炉内を加熱するヒータと、
前記ヒータに接続され、前記ヒータに電力を供給する電極と、
前記炉内に配設され、前記電極を収容する電極室と、
前記炉外部から前記電極室に接続され、前記電極室内部に不活性ガスを導入する第1の導入管とを有し、
前記ヒータは、表面が保護材により覆われ、前記電極室外部の上部に配設される
を有することを特徴とする酸化炉装置。 - 前記炉内の前記試料の下部に配設され、前記ヒータを収容し、壁面に孔が形成された加熱室と、
前記炉外部から前記加熱室に接続され、前記加熱室内部に酸化性ガスを導入する第2の導入管と
をさらに備えることを特徴とする請求項1記載の酸化炉装置。 - 前記不活性ガスは、何れかの希ガス、窒素、および、これらのうち何れか2つ以上を混合したガスの何れかから構成される
ことを特徴とする請求項1または2記載の酸化炉装置。 - 前記試料にX線を照射するX線照射装置と、
前記試料より発生する回折X線を検出する検出器と
をさらに備えることを特徴とする請求項1乃至3の何れか1項に記載の酸化炉装置。 - 前記炉は、対向する側面に、前記試料の下部と同程度の高さから上方にかけて配設された第1の窓および第2の窓をさらに備え、
前記X線照射装置は、前記第1の窓近傍の前記炉外部に配設され、前記第1の窓を介して前記試料にX線を照射し、
前記検出器は、前記第2の窓近傍の前記炉外部に配設され、前記窓2を介して前記試料から生じる回折X線を検出する
ことを特徴とする請求項4記載の酸化炉装置。
Priority Applications (1)
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JP2005036183A JP4510661B2 (ja) | 2005-02-14 | 2005-02-14 | 酸化炉装置 |
Applications Claiming Priority (1)
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JP2005036183A JP4510661B2 (ja) | 2005-02-14 | 2005-02-14 | 酸化炉装置 |
Publications (2)
Publication Number | Publication Date |
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JP2006222372A JP2006222372A (ja) | 2006-08-24 |
JP4510661B2 true JP4510661B2 (ja) | 2010-07-28 |
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JP2005036183A Expired - Fee Related JP4510661B2 (ja) | 2005-02-14 | 2005-02-14 | 酸化炉装置 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0321844U (ja) * | 1989-07-14 | 1991-03-05 | ||
JPH08316162A (ja) * | 1995-05-12 | 1996-11-29 | Hitachi Ltd | 半導体製造装置 |
JP2000269289A (ja) * | 1999-03-15 | 2000-09-29 | Mitsubishi Electric Corp | 半導体装置ならびに半導体装置の製造方法およびその製造方法で使用する膜厚測定方法および膜厚測定装置 |
JP2003303781A (ja) * | 2002-04-12 | 2003-10-24 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2004022688A (ja) * | 2002-06-14 | 2004-01-22 | Epiquest:Kk | SiCウエハー酸化装置 |
-
2005
- 2005-02-14 JP JP2005036183A patent/JP4510661B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0321844U (ja) * | 1989-07-14 | 1991-03-05 | ||
JPH08316162A (ja) * | 1995-05-12 | 1996-11-29 | Hitachi Ltd | 半導体製造装置 |
JP2000269289A (ja) * | 1999-03-15 | 2000-09-29 | Mitsubishi Electric Corp | 半導体装置ならびに半導体装置の製造方法およびその製造方法で使用する膜厚測定方法および膜厚測定装置 |
JP2003303781A (ja) * | 2002-04-12 | 2003-10-24 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2004022688A (ja) * | 2002-06-14 | 2004-01-22 | Epiquest:Kk | SiCウエハー酸化装置 |
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