JP4509589B2 - ペルチェモジュール - Google Patents
ペルチェモジュール Download PDFInfo
- Publication number
- JP4509589B2 JP4509589B2 JP2004025918A JP2004025918A JP4509589B2 JP 4509589 B2 JP4509589 B2 JP 4509589B2 JP 2004025918 A JP2004025918 A JP 2004025918A JP 2004025918 A JP2004025918 A JP 2004025918A JP 4509589 B2 JP4509589 B2 JP 4509589B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- heat
- side insulating
- metal electrode
- peltier module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 100
- 229910052751 metal Inorganic materials 0.000 claims description 85
- 239000002184 metal Substances 0.000 claims description 85
- 238000010521 absorption reaction Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 38
- 238000001816 cooling Methods 0.000 description 18
- 238000003384 imaging method Methods 0.000 description 18
- 230000005855 radiation Effects 0.000 description 15
- 238000007747 plating Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (3)
- 一方の面に金属電極を有する吸熱側絶縁基板と、
前記一方の面に対向するように配置され、前記吸熱側絶縁基板側の面に金属電極を有する放熱側絶縁基板と、
前記吸熱側絶縁基板の金属電極と前記放熱側絶縁基板の金属電極との間に配置され、金属電極を介して交互に直列に接続されたP型熱電素子及びN型熱電素子からなる熱電素子群と、
少なくとも前記吸熱側絶縁基板の熱電素子側の面に設けられ、前記金属電極と同一の材質の赤外線反射膜と、
を備え、
前記赤外線反射膜は、前記金属電極と一定の距離を空けることによって電気的に絶縁されている、
ペルチェモジュール。 - 前記赤外線反射膜は、金属膜を含むものである、
請求項1に記載のペルチェモジュール。 - 前記放熱側絶縁基板の熱電素子側の面に赤外線反射膜が併せて設けられたものである、
請求項1又は2記載のペルチェモジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025918A JP4509589B2 (ja) | 2004-02-02 | 2004-02-02 | ペルチェモジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004025918A JP4509589B2 (ja) | 2004-02-02 | 2004-02-02 | ペルチェモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005217376A JP2005217376A (ja) | 2005-08-11 |
JP4509589B2 true JP4509589B2 (ja) | 2010-07-21 |
Family
ID=34908150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004025918A Expired - Fee Related JP4509589B2 (ja) | 2004-02-02 | 2004-02-02 | ペルチェモジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4509589B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022196724A1 (ja) * | 2021-03-16 | 2022-09-22 | 古河電気工業株式会社 | 熱電変換モジュール |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125960A (ja) * | 1996-10-23 | 1998-05-15 | Matsushita Electric Works Ltd | 熱電変換装置 |
JP2005079347A (ja) * | 2003-08-29 | 2005-03-24 | Toshiba Corp | 熱電変換装置 |
JP2005093560A (ja) * | 2003-09-12 | 2005-04-07 | Toshiba Corp | 熱電変換装置 |
JP2005175022A (ja) * | 2003-12-08 | 2005-06-30 | Toshiba Corp | 熱電変換装置 |
-
2004
- 2004-02-02 JP JP2004025918A patent/JP4509589B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125960A (ja) * | 1996-10-23 | 1998-05-15 | Matsushita Electric Works Ltd | 熱電変換装置 |
JP2005079347A (ja) * | 2003-08-29 | 2005-03-24 | Toshiba Corp | 熱電変換装置 |
JP2005093560A (ja) * | 2003-09-12 | 2005-04-07 | Toshiba Corp | 熱電変換装置 |
JP2005175022A (ja) * | 2003-12-08 | 2005-06-30 | Toshiba Corp | 熱電変換装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005217376A (ja) | 2005-08-11 |
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