JP4505967B2 - Electronic component separation structure - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component separation structure, and more particularly to an electronic component separation structure when an electronic component such as a non-reciprocal circuit device used in a microwave band is separated from a lead frame.
[0002]
[Prior art]
Conventionally, in an electronic component such as a non-reciprocal circuit element, a long lead frame 80 as shown in FIG. 11 is used in order to facilitate automation of manufacturing and handling during manufacturing. The lead frame 80 is sequentially conveyed through the assembly steps by using pilot holes 81a provided in the pair of hoop portions 81, respectively. Then, while the lead frame 80 is sequentially conveyed through each assembly process, the components of the electronic component 83 are attached to the support portions 82 extending from the pair of hoop portions 81 of the lead frame 80, and the electronic component 83 is assembled. It is done. A separation notch 86 is formed in the support portion 82 in the vicinity of the boundary with the electronic component 83. The electronic component 83 connected to the lead frame 80 is separated from the lead frame 80 by bending and breaking the pair of support portions 82 with the notch 86 for separation.
[0003]
[Problems to be solved by the invention]
By the way, in the conventional separation structure of the electronic component, when the electronic component 83 is separated from the lead frame 80, bending stress is difficult to concentrate on the separation notch 86 of the support portion 82, and it is difficult to cut the support portion 82. Further, when the lead frame 80 is thin, it is necessary to strictly control the depth of the groove of the notch 86 for separation, and the mold for manufacturing the lead frame 80 is required to have high accuracy, and the cost of the mold is reduced. There was a problem of becoming expensive.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component separation structure in which bending stress is easily concentrated on a notch for separation of a support portion of a lead frame, and the cost of a die for producing a lead frame is low. .
[0005]
[Means and Actions for Solving the Problems]
In order to achieve the above object, an electronic component separating structure according to the present invention is an electronic component that separates an electronic component that is integrally coupled to a tip of a support portion extending from a hoop portion of a lead frame from the support portion. It is a separation structure, wherein the support portion has a notch for separation, and a cross-sectional shape is curved in the normal direction of the support portion between the notch for separation and the hoop portion. And
[0006]
Since the cross-sectional shape of the support portion is curved in the normal direction of the support portion between the notch for separation and the hoop portion, the bending strength of the support portion of this portion is increased. As a result, when the electronic component is separated from the lead frame, bending stress is concentrated on the notch for separation of the support portion, the support portion is easily cut by the notch for separation, and the electronic component is easily and reliably separated from the support portion. .
[0007]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an electronic component separating structure according to the present invention will be described with reference to the accompanying drawings. The following embodiment will be described by taking a lumped constant type isolator as an example, but it goes without saying that it can also be applied to non-reciprocal circuit elements employed in other high-frequency components such as circulators, or piezoelectric components. Yes.
[0008]
As shown in FIG. 1, the lumped constant isolator 10 generally includes a metal lower case portion 20, a resin terminal case 30, a center electrode assembly 40, a metal upper case portion 47, and a permanent magnet 46. And a resistor element R, matching capacitor elements C1 to C3, and the like.
[0009]
On the other hand, the lead frame 11 is made of a magnetic metal such as iron, brass, phosphor bronze, or the like, and pilot holes 13a are provided at predetermined intervals in a pair of long hoop portions 13, respectively. A metal lower case portion 20 of the isolator 10 is integrally provided at the tip of the support portion 12 extending inward from the pair of hoop portions 13. Further, between the pair of hoop portions 13, a plurality of crosspieces 14 are bridged with the support portion 12 alternately at a predetermined interval. The lead frame 11 is formed by punching and bending a plate material such as iron and plating the surface with Cu, Ag or the like.
[0010]
On each surface of the support portion 12, a notch 15 for separation is provided in the vicinity of the boundary with the metal lower case portion 20. Each separation notch 15 is linearly arranged in the longitudinal direction of the lead frame 11. The notch 15 for separation is a groove having a V-shaped cross section (see FIG. 3), and extends in the width direction of the support portion 12.
[0011]
The depth of the notch 15 for separation is preferably set to ¼ or more and ¾ or less of the thickness of the support portion 12 (representative value is about ½). For example, when the thickness of the lead frame 11 is 150 μm, the depth of the notch 15 for separation is set to about 80 μm. This is because if the depth of the notch 15 for separation becomes smaller than ¼ of the thickness of the lead frame 11, it becomes difficult to cut and the workability becomes worse. On the contrary, when the depth of the notch 15 for separation becomes larger than 3/4 of the thickness of the lead frame 11, the mechanical strength of the support portion 12 in the portion where the notch 15 for separation is provided becomes too weak. For this reason, it is because the support part 12 becomes easy to cut | disconnect during the operation | work which assembles components, such as the resin-made terminal cases 30. FIG.
[0012]
The lead frame 11 is sequentially conveyed through each assembly process using the pilot holes 13a. First, the resin terminal case 30 is assembled on the metal lower case portion 20. The metal lower case part 20 has left and right side walls 23, a bottom wall 24, and a ground terminal 25 extending from the bottom wall 24. Input / output terminals 33 and 34 are insert-molded in the resin terminal case 30. One end of each of the input / output terminals 33 and 34 is exposed on the outer wall of the resin terminal case 30 and the other end is exposed on the inner side surface of the resin terminal case 30 to form an input / output lead electrode portion.
[0013]
Next, the center electrode assembly 40, the resistor element R, and the matching capacitor elements C1 to C3 are accommodated in the resin terminal case 30. The center electrode assembly 40 is arranged on the upper surface (one magnetic pole surface) of the disk-shaped microwave ferrite 41 so that the center electrodes 42 to 44 intersect each other approximately every 120 degrees in an electrically insulated state.
[0014]
The center electrodes 42 to 44 lead out the port portions P1 to P3 on one end side horizontally, and a common shield portion on the other end side is in contact with the lower surface of the ferrite 41. The common shield portion substantially covers the lower surface of the ferrite 41 and is soldered to the bottom wall 24 of the metal lower case portion 20 through the window portion 31 of the resin terminal case 30 and grounded.
[0015]
The matching capacitor elements C1 to C3 are obtained by providing capacitor electrodes on both main surfaces of a dielectric substrate. The hot-side capacitor electrodes of the matching capacitor elements C1 to C3 are soldered to the port portions P1 to P3, respectively, and the cold-side capacitor electrode is exposed to the window portion 31 of the resin terminal case 30. Each of the 20 bottom walls 24 is soldered.
[0016]
One terminal electrode of the resistor element R is connected to the hot-side capacitor electrode of the matching capacitor element C3, and the other terminal electrode is connected to the metal lower case portion 20. That is, the matching capacitor element C3 and the resistance element R are electrically connected in parallel between the port portion P3 of the center electrode 44 and the ground.
[0017]
Next, the metal upper case portion 47 made of a magnetic metal is assembled. A permanent magnet 46 is attached to the lower surface of the metal upper case portion 47, and a DC magnetic field is applied to the center electrode assembly 40 by the permanent magnet 46. The metal lower case portion 20 and the metal upper case portion 47 constitute a magnetic circuit and also function as a yoke. The metal upper case portion 47 is formed by punching and bending a plate material having a high magnetic permeability such as iron or silicon steel and plating the surface thereof with Cu or Ag.
[0018]
In this way, as shown in FIG. 2, the lumped constant type isolator 10 that is integrally coupled to the tip of the support portion 12 extending from the hoop portion 13 of the lead frame 11 is assembled. Next, the isolator 10 connected to the lead frame 11 is transported to a solder reflow process, where the lower case part 20 made of metal and the center electrode assembly 40 are soldered.
[0019]
Next, as shown in FIG. 3, the isolator 10 is separated from the lead frame 11 by repeatedly bending the support portion 12 up and down using the notch 15 for separation provided in the support portion 12 of the lead frame 11 as a fulcrum. At this time, by pressing the mounting surface 10a and the upper surface 10b of the isolator 10 with the pressing jig 49, the work of separating the isolator 10 becomes easy.
[0020]
Here, the structure of the support part 12 will be described in detail with reference to FIGS. As shown in FIG. 4, the support portion 12 is formed with a notch 15 for separation near the boundary with the isolator 10. Each of the support portions 12 has a cross-sectional shape in the normal direction of the support portion 12 between the notch 15 for separation and the hoop portion 13 as shown in the VV cross-sectional view of FIG. Is curved in an arc shape so as to be convex. Each of the support portions 12 is not curved as described above between the notch 15 for separation and the isolator 10, as shown in the VI-VI sectional view of FIG. 4 in FIG.
[0021]
In the present embodiment, since the support portion 12 is curved as described above, each of the support portions 12 has a high bending strength at the curved portion. As a result, when the isolator 10 is separated, if a force is applied to each of the support portions 12, bending stress concentrates on the notch 15 for separation, and the depth accuracy of the groove of the notch 15 for separation is not strictly regulated. However, the support portion 12 is easily cut by the notch 15 for separation, and each isolator 10 is easily and reliably separated from the lead frame 11. Therefore, in this embodiment, a high-precision mold is not required as a mold for manufacturing the lead frame 11, and an inexpensive mold can be used. Further, since the support portion 12 of the lead frame 11 may be narrow, the ratio of the support portion 12 to the lead frame 11 is small, and the degree of freedom in designing the metal lower case portion 20 is increased.
[0022]
In addition, this invention is not limited to the said embodiment, It can change variously within the range of the summary. For example, as shown in FIG. 7, the support section 12 may have a convex cross-sectional shape in a direction opposite to the direction described in FIG. 5. Moreover, the shape where the width dimension increases gradually toward the hoop part 13 from the isolator 10 may be sufficient. By increasing the width dimension of the part away from the notch 15 for separation, the bending strength of the support part 12 is further increased, and bending stress is concentrated on the notch 15 for separation, so that the support part 12 is more easily broken. be able to.
[0023]
Further, as shown in FIGS. 8 and 9, respectively, the support portion 12 may have a structure in which both sides thereof are bent. Alternatively, the cross-sectional shape may be S-shaped. Furthermore, as shown in FIG. 10, the support portion 12 may not be coupled to the isolator 10 at a right angle.
[0024]
Furthermore, the shape of the cross section of the notch for separation is arbitrary such as a U shape or a semicircular shape in addition to the V shape. Further, the notch for separation may be provided on the back surface side of the support portion, or may be provided to face each of the front and back surfaces of the support portion.
[0025]
【The invention's effect】
As is clear from the above description, according to the present invention, the bending strength of the support portion is increased by curving the cross-sectional shape in the normal direction of the support portion between the notch for separation and the hoop portion. Therefore, when the electronic parts are separated, bending stress concentrates on the notch for separation, and even if the depth accuracy of the groove of the notch for separation is not strictly regulated, the support part is easily cut with the notch for separation. The electronic component can be easily and reliably separated from the lead frame. Accordingly, a high-precision mold is not required as a mold for manufacturing the lead frame, and an inexpensive mold can be used.
[Brief description of the drawings]
FIG. 1 is an assembled perspective view showing an embodiment of an electronic component separating structure according to the present invention.
FIG. 2 is an external perspective view after assembly of the electronic component shown in FIG. 1 is completed.
FIG. 3 is an explanatory view showing a method of separating an electronic component from a lead frame using a notch for separation.
4 is a partially enlarged plan view of a lead frame to which the electronic component shown in FIG. 2 is coupled.
5 is a VV cross-sectional view of FIG.
6 is a sectional view taken along line VI-VI in FIG.
FIG. 7 is a cross-sectional perspective view of a support portion showing another embodiment.
FIG. 8 is a cross-sectional view of a support portion showing another embodiment.
FIG. 9 is a cross-sectional view of a support portion showing still another embodiment.
FIG. 10 is a plan view showing still another embodiment.
FIG. 11 is a plan view showing a conventional electronic component separating structure;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Isolator 11 ... Lead frame 12 ... Support part 13 ... Hoop part 15 ... Notch for separation

Claims (1)

In the separation structure of the electronic component for separating the electronic component integrally coupled to the tip of the support portion extending from the hoop portion of the lead frame from the support portion,
The support part has a notch for separation, and the cross-sectional shape is curved in the normal direction of the support part between the notch for separation and the hoop part. Construction.

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