JP2002093983A - Isolation structure for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the isolation structure of an electronic component for easily concentrating bending stress on a notch for isolation at the supporting part of a lead frame and lowering the cost of a die for manufacturing the lead frame. SOLUTION: To the tip of the supporting part 12 extended from a hoop 13, an isolator 10 is integrally connected. At the supporting part 12, the notch 15 for the isolation is formed near a boundary with the isolator 10. Also, the supporting part 12 is curved in an arcuate shape so as to project a cross sectional shape in the normal direction of the supporting part 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for separating an electronic component, and more particularly to a structure for separating an electronic component such as a non-reciprocal circuit device used in a microwave band from a lead frame.
The present invention relates to a structure for separating electronic components.

[0002]

2. Description of the Related Art Conventionally, for an electronic component such as a non-reciprocal circuit device, a long lead frame 80 as shown in FIG. 11 has been used in order to automate manufacturing and facilitate handling during manufacturing. are doing. The lead frame 80 has a pilot hole 81a provided in each of the pair of hoop portions 81.
Each assembly process is sequentially conveyed by using. And
While the lead frame 80 is sequentially conveyed through each of the assembling steps, the components of the electronic component 83 are attached to the support portions 82 extending from the pair of hoop portions 81 of the lead frame 80, and the electronic component 83 is assembled. Support part 8
2 has a cutout notch 86 near the boundary with the electronic component 83. The electronic component 83 connected to the lead frame 80 is separated from the lead frame 80 by bending the pair of support portions 82 at the notch 86 for separation and breaking.

[0003]

In the conventional electronic component separating structure, when the electronic component 83 is separated from the lead frame 80, the separating notch 86 of the supporting portion 82 is used.
The bending stress was hardly concentrated on the support portion 82, and the cutting of the support portion 82 was difficult. Further, when the thickness of the lead frame 80 is thin, it is necessary to strictly control the depth of the groove of the separating notch 86, and precision is required for a mold for manufacturing the lead frame 80, and the cost of the mold is reduced. There was a problem that it became expensive.

Accordingly, an object of the present invention is to provide an electronic component separation structure in which bending stress is easily concentrated on the separation notch of the support portion of the lead frame and the cost of the mold for manufacturing the lead frame is low. It is in.

[0005]

In order to achieve the above-mentioned object, an electronic component separating structure according to the present invention is integrally connected to a tip end of a support portion extending from a hoop portion of a lead frame. An electronic component separating structure for separating an electronic component from the supporting portion, wherein the supporting portion has a separating notch, and between the separating notch and the hoop portion, in a direction normal to the supporting portion. The cross-sectional shape is curved.

Since the cross section of the support portion is curved between the notch for separation and the hoop portion in the normal direction of the support portion, the bending strength of the support portion at this portion is increased. Thereby, when the electronic component is separated from the lead frame, bending stress concentrates on the separation notch of the support portion, the support portion is easily cut at the separation notch, and the electronic component is easily and reliably separated from the support portion. .

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of an electronic component separating structure according to an embodiment of the present invention. Although the following embodiments will be described using a lumped-constant isolator as an example, it goes without saying that the embodiments can also be applied to non-reciprocal circuit elements employed in other high-frequency components such as circulators, or piezoelectric components. No.

As shown in FIG. 1, the lumped-constant isolator 10 includes a metal lower case part 20, a resin terminal case 30, a center electrode assembly 40, a metal upper case part 47, A permanent magnet 46, a resistance element R, and matching capacitor elements C1 to C3 are provided.

On the other hand, the lead frame 11 is made of a magnetic metal such as iron, brass, phosphor bronze, or the like, and a pair of elongated hoop portions 13 are provided with pilot holes 13a at predetermined intervals. . At the tips of the support portions 12 extending inward from the pair of hoop portions 13, respectively,
The metal lower case portion 20 of the isolator 10 is provided integrally. Further, between the pair of hoop portions 13, a plurality of bars 14 are alternately bridged with the support portions 12 at predetermined intervals. The lead frame 11 is formed by punching and bending a plate material such as iron, and then plating the surface with Cu, Ag, or the like.

On each surface of the support portion 12, a notch 15 for separation is provided near a boundary with the lower metal case portion 20.
Is provided. Each separating notch 15 is linearly arranged in the longitudinal direction of the lead frame 11. The separating notch 15 is a groove having a V-shaped cross section (see FIG. 3), and extends in the width direction of the support portion 12.

The depth of the separating notch 15 is 1/4 or more and 3/4 or less of the thickness of the supporting portion 12 (typically 1 /
About 2). For example, when the thickness of the lead frame 11 is 150 μm, the depth of the separation notch 15 is set to about 80 μm. If the depth of the separation notch 15 is smaller than 1/4 of the thickness of the lead frame 11, it is difficult to cut the lead frame 11 and the workability is deteriorated. Conversely, if the depth of the separation notch 15 is greater than 3/4 of the thickness of the lead frame 11, the mechanical strength of the support portion 12 where the separation notch 15 is provided becomes too weak. For this reason, during the operation of assembling the component parts such as the resin terminal case 30, the support portion 1
2 is easily cut.

The lead frame 11 has a pilot hole 13
Each assembly process is sequentially conveyed using a. First, the resin terminal case 30 is assembled on the metal lower case portion 20. The metal lower case portion 20 includes the left and right side walls 2.
3, a bottom wall 24 and a ground terminal 2 extending from the bottom wall 24
5 is provided. Input / output terminals 33 and 34 are insert-molded in the resin terminal case 30. Each of the input / output terminals 33 and 34 has one end exposed to the outer wall of the resin terminal case 30 and the other end exposed to the inner side surface of the resin terminal case 30 to form an input / output lead electrode portion.

Next, the center electrode assembly 40, the resistance element R, and the matching capacitor elements C1 to C3 are accommodated in the resin terminal case 30. The center electrode assembly 40 is formed on the upper surface (one magnetic pole surface) of a disk-shaped microwave ferrite 41.
In addition, the center electrodes 42 to 44 are arranged so as to cross each other approximately every 120 degrees in an electrically insulated state.

The center electrodes 42 to 44 horizontally lead out the port portions P1 to P3 on one end side, respectively, and bring the common shield portion of the center electrodes 42 to 44 on the other end side into contact with the lower surface of the ferrite 41. ing. The common shield part substantially covers the lower surface of the ferrite 41, is soldered to the bottom wall 24 of the metal lower case part 20 through the window part 31 of the resin terminal case 30, and is grounded.

The matching capacitor elements C1 to C3 have capacitor electrodes provided on both main surfaces of a dielectric substrate.
The hot-side capacitor electrodes of the matching capacitor elements C1 to C3 are soldered to the port portions P1 to P3, respectively, and the cold-side capacitor electrodes are connected to the resin terminal case 30.
Are soldered to the bottom wall 24 of the metal lower case portion 20 which is exposed at the window portion 31 of FIG.

One terminal electrode of the resistance element R is connected to the hot-side capacitor electrode of the matching capacitor element C3,
The other terminal electrode is connected to the lower metal case portion 20. That is, the matching capacitor element C3 and the resistance element R are electrically connected in parallel between the port P3 of the center electrode 44 and the ground.

Next, a metal upper case portion 47 made of a magnetic metal is assembled. A permanent magnet 46 is attached to the lower surface of the metal upper case portion 47, and a DC magnetic field is applied to the center electrode assembly 40 by the permanent magnet 46. The lower metal case 20 and the upper metal case 47 constitute a magnetic circuit and also function as a yoke. The metal upper case part 47 is formed by punching and bending a plate material having high magnetic permeability such as iron or silicon steel, and then plating the surface with Cu or Ag.

Thus, as shown in FIG. 2, the lumped constant type isolator 10 is integrally connected to the tip of the support portion 12 extending from the hoop portion 13 of the lead frame 11.
Is assembled. Next, the isolator 10 connected to the lead frame 11 is transported to a solder reflow step, and the lower metal case 20 and the center electrode assembly 40 are separated.
Is performed.

Next, as shown in FIG. 3, the isolator 10 is separated from the lead frame 11 by repeatedly bending the support portion 12 up and down with the notch 15 provided on the support portion 12 of the lead frame 11 as a fulcrum. Disconnect. At this time, the mounting surface 10a and the upper surface 10b of the isolator 10 are respectively pressed by the pressing jigs 49, so that the isolator 10 can be easily separated.

Here, with reference to FIGS.
The structure of No. 2 will be described in detail. As shown in FIG. 4, the support portion 12 has a cutout notch 15 near the boundary with the isolator 10. Further, each of the support portions 12 has a cross-sectional shape in the normal direction of the support portion 12 between the separation notch 15 and the hoop portion 13 as shown in FIG. Are curved in an arc shape so as to be convex. Note that each of the support portions 12 is shown in FIG.
As shown in the VI sectional view, there is no such curvature between the separating notch 15 and the isolator 10.

In this embodiment, since the support portion 12 is curved as described above, each of the support portions 12 has a large bending strength at the curved portion. Accordingly, when a force is applied to each of the support portions 12 when the isolator 10 is separated, bending stress concentrates on the notch 15 for separation.
Even if the depth accuracy of the groove of the separation notch 15 is not strictly regulated, the support portion 12 is easily cut by the separation notch 15, and each isolator 10 is easily and reliably separated from the lead frame 11. Therefore, in the present embodiment, a high-precision die is not required as a die for manufacturing the lead frame 11, and an inexpensive die can be used. Further, the support portion 1 of the lead frame 11
Since the width of the metal case 2 may be small, the ratio of the metal case 2 to the lead frame 11 is small, and the degree of freedom in designing the lower metal case 20 is increased.

The present invention is not limited to the above embodiment, but can be variously modified within the scope of the invention. For example, as shown in FIG.
The cross-sectional shape may be convex in the direction opposite to the direction described in FIG. Further, the width may be gradually increased from the isolator 10 toward the hoop portion 13. By increasing the width dimension of the portion apart from the separation notch 15, the bending strength of the support portion 12 is further increased, and the bending stress is concentrated on the separation notch 15 so that the support portion 12 is more easily broken. be able to.

As shown in FIG. 8 and FIG. 9, respectively, the supporting portion 12 may have a structure in which both sides are bent. Alternatively, the cross-sectional shape may be S-shaped. Further, as shown in FIG.
May not be coupled at right angles to the isolator 10.

Further, the shape of the cross section of the separating notch is not limited to the V-shape, but may be any shape such as a U-shape or a semi-circle. Further, the separation notch may be provided on the back surface side of the support portion, or may be provided to face each of the front and back surfaces of the support portion.

[0025]

As is clear from the above description, according to the present invention, the cross section of the support section is curved between the notch for separation and the hoop section in the normal direction of the support section. Since the bending strength is increased, when separating electronic components, bending stress concentrates on the notch for separation, and even if the depth accuracy of the groove of the notch for separation is not strictly regulated, the support part is notched for separation. And the electronic component can be easily and reliably separated from the lead frame. Therefore,
A high-precision mold is not required as a mold for manufacturing the lead frame, and an inexpensive mold can be used.

[Brief description of the drawings]

FIG. 1 is an assembled perspective view showing an embodiment of an electronic component separating structure according to the present invention.

FIG. 2 is an external perspective view of the electronic component shown in FIG. 1 after assembly is completed.

FIG. 3 is an explanatory diagram showing a method of separating an electronic component from a lead frame using a separation notch.

4 is a partially enlarged plan view of a lead frame to which the electronic components shown in FIG. 2 are coupled.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a sectional view taken along line VI-VI of FIG. 4;

FIG. 7 is a cross-sectional perspective view of a support section showing another embodiment.

FIG. 8 is a cross-sectional view of a support portion showing another embodiment.

FIG. 9 is a cross-sectional view of a support portion showing still another embodiment.

FIG. 10 is a plan view showing still another embodiment.

FIG. 11 is a plan view showing a conventional electronic component separating structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Isolator 11 ... Lead frame 12 ... Support part 13 ... Hoop part 15 ... Notch for separation

Claims (1)

[Claims] An electronic component separating structure for separating an electronic component integrally connected to a tip of a supporting portion extending from a hoop portion of a lead frame from the supporting portion, wherein the supporting portion has a separating notch. And a cross-sectional shape in a direction normal to the support portion between the notch for separation and the hoop portion.