JP4495520B2 - Film processing equipment - Google Patents

Description

  The present invention relates to a film processing apparatus for processing the surface of a film on which bumps are formed.

Conventionally, a module in which various elements such as an IC are mounted on a resin film has been used for an IC card or the like. Such a module is formed by forming conductive bumps projecting in the plate thickness direction on a film and pressing the terminal of the element on the bumps.

  An insulating film or a protective film is attached to the bump surface, and it is necessary to remove the protective film before the bump and the element terminal are pressed. Conventionally, like the thing of the patent document 1, the film was grind | polished and the protective film on a bump was removed.

  Therefore, depending on the roughness, density and shape of the film, the bump height after polishing tends to be non-uniform. In addition, a portion outside the target polishing portion is polished, and as a result, a lot of grinding waste is generated. Further, since the size of the grinding scrap is as fine as several μm to several tens of μm, the removal thereof is not easy. Further, since there is a possibility that foreign matters are mixed into the bump by polishing the upper part of the bump, when the element terminal and the bump are made of copper, they cannot be bonded at about 200 ° C.

  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a film processing apparatus capable of processing bumps that makes the bump height uniform regardless of the roughness, density, and shape of the film and that does not allow foreign matter to enter the bumps. For the purpose.

  In order to solve the above problems, a film processing apparatus according to the present invention includes a cylindrical roll on which a workpiece of a film is affixed on a cylindrical surface thereof, roll driving means for rotating the roll around an axis, A blade that can be disposed close to the cylindrical surface of the roll so as to come into contact with the workpiece; and blade vibration means that vibrates the blade in a direction parallel to the axis of the roll.

  Therefore, according to the present invention, since the workpiece is cut by the blade, the thickness of the film after cutting (ie, the bump height) is made uniform by controlling the distance between the cylindrical surface of the roll and the blade. Can keep. Further, unlike the case of polishing the film, the cutting waste becomes a lump having a relatively large size (about several millimeters) and can be easily removed.

  The film processing apparatus further includes blade advance / retreat means for advancing / retreating the blade in the radial direction of the roll with respect to the roll, and the blade advance / retreat means extends from a plurality of blades in the cuttable region to a cylindrical surface of the roll. A plurality of blades may be arranged at different positions, and the workpiece may be cut in stages by the plurality of blades. With such a configuration, when cutting a single workpiece multiple times, after cutting with a certain blade, the workpiece is moved to another blade and the next Since cutting is possible, the amount of movement of the workpiece can be kept low, and the workpiece can be cut efficiently.

  The film processing apparatus further includes blade rotation means for rotating the blade about an axis parallel to the axis of the roll to change a rake angle of the blade with respect to the workpiece.

  As described above, according to the present embodiment, a film processing apparatus is realized that can process the bump height uniformly regardless of the roughness, density, and shape of the film.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a top view of a film processing apparatus 1 according to a first embodiment of the present invention. The film processing apparatus 1 has a cylindrical roll 100 configured to rotate around a horizontal axis. A film F to be processed by the film processing apparatus 1 is attached to the cylindrical surface 110 of the roll 100. Further, the roll 100 is rotationally driven by the drive unit 120, and the film F rotates together with the roll 100.

  Blade mechanisms 210 and 220 for cutting the film F are disposed in proximity to the cylindrical surface 110 of the roll 100. The blade mechanisms 210 and 220 include arms 211 and 221 that are substantially horizontal plate members extending in a direction parallel to the axis 101 of the roll 100, and blade bodies 212 and 222 attached to the proximal ends of the arms with respect to the roll 100. . Each of the blade bodies 212 and 222 is a plate member extending in a direction parallel to the axis 101 of the roll 100, and its surface is substantially parallel to a portion of the cylindrical surface 110 of the roll 100 adjacent to each of the blade bodies.

  The gaps (gap) between the blade bodies 212 and 222 and the cylindrical surface 110 of the roll 100 are adjusted by the gap adjusting units 213 and 223. The gap adjusters 213 and 223 include rails 213a and 223a extending in the direction of the axis of rotation of the roll 100 (the left-right direction in FIG. 1), and carriages 213b and 223b that are guided by the rails and advance and retract with respect to the roll 100. The arms 212 and 222 described above are fixed to the carriages 213b and 223b, respectively, and the carriage and the arm move together on the rail.

  The carriages 213b and 223b are driven so as to advance and retreat along the rails by the gap adjustment driving units 214 and 224. The gap adjustment driving units 214 and 224 are, for example, a combination of a stepping motor and a feed screw mechanism, and can control the distance between the tip (edge) of the blade body and the cylindrical surface 110 of the roll 100 in units of micrometers. I can do it. Instead of the combination of the stepping motor and the feed screw mechanism, another drive / position control mechanism such as a gear mechanism may be used. By the gap adjusting drive units 214 and 224, the blade main bodies 212 and 222 can be brought into a retracted position sufficiently away from the roll 100 and a cutable area where the film F on the roll 100 can be contacted (in this embodiment, the blade main body Between the edge of the roll 100 and the cylindrical surface of the roll 100 can be moved back and forth.

  The blade bodies 212 and 222 are driven to vibrate (reciprocate) in the axial direction of the roll 100 (vertical direction in FIG. 1) by blade vibration mechanisms 215 and 225, respectively. Hereinafter, the configuration of the blade vibration mechanism will be described in detail.

  FIG. 2 is an enlarged top view of the blade mechanism 210. The configuration of the blade vibration mechanism 225 connected to the arm 221 of the blade mechanism 220 is the same as the configuration of the blade vibration mechanism 215. FIG. 3 is an enlarged side view of the blade mechanism 210.

  As shown in FIG. 3, the blade vibration mechanism 215 includes a motor 215a, an eccentric shaft 215b attached to the drive shaft of the motor 215a, and a crank shaft 215c connected to the eccentric shaft 215b. As shown in FIG. 2, the motor 215 a is fixed on a rotating shaft 217 extending in the axial direction of the roll 100 and rotatably supported by a bearing 216 formed in the carriage 213. Accordingly, the blade mechanism 210, the blade eccentric mechanism 215, and the rotating shaft all advance and retreat in accordance with the advancement and retreat of the carriage 213.

  As shown in FIG. 2, the eccentric shaft 215b is configured to make a circular motion on a horizontal plane in accordance with the drive of the drive shaft of the motor 215a. As shown in FIG. 3, the crankshaft 215c is a rod-like member having through holes 215d and 215e formed in the vertical direction at both ends, and an eccentric shaft 215b is rotatably fed to the through hole 215d. Yes. On the other hand, a pin 215f is rotatably inserted into the through hole 215e, and the crankshaft 215c and the arm 211 are connected via the pin 215f.

  As described above, since the eccentric shaft 215b and the pin 215f are rotatable with respect to the through holes 215d and 215e, respectively, the crank shaft 215c can swing around the pin 215f. Further, the moving direction of the arm 211 relative to the motor 215 a is limited only to the axial direction of the roller 100 by a slide guide 218 a provided on the table 218 fixed to the rotating shaft 217. Thus, when the motor 215a is driven, the arm 211 and the blade body 212 (FIG. 2) reciprocate in the axial direction of the roller 100.

  In the film processing apparatus 1 configured as described above, the gap adjusting drive unit 214 or 224 is operated so that the edge of the blade body 212 or 222 contacts the film F, and the blade body 212 or 222 is reciprocated by controlling the blade vibration mechanism. Then, the surface of the film F is cut by rotating the roller.

  2 and 3 is for rotating the blade body 212 around an axis parallel to the roller 100 axis. A blade angle adjusting motor 219 is attached to the rotating shaft 217, and the rotating shaft 217 is rotationally driven by this motor, and is stationary at an arbitrary rotating angle. As shown in FIGS. 2 and 3, the rotation axis of the rotation shaft 217 coincides with the edge 212 a formed on the upper end of the side of the roller 100 of the blade body 212. Therefore, by driving the motor 219, the blade body 212 swings around the edge 212a, and the angle of the blade body with respect to the surface of the film F can be adjusted. Thereby, the optimal rake angle of the blade body suitable for the characteristics (strength, elastic modulus, viscosity, etc.) of the film F can be set. Further, since the position of the edge does not change even when the motor 219 is driven, the distance between the edge 212a and the roller 100 does not change even if the rake angle of the blade body 212 is changed.

  The above mechanism is also provided in the blade mechanism 220, and the rake angle of the blade body 222 can be set.

  The procedure for processing the film F using the above apparatus 1 will be described below. FIG. 4 is a side view of the film processing apparatus 1 in which the periphery of the blade mechanisms 210 and 220 is enlarged. In FIG. 4, members denoted by reference numerals 222a, 228, and 228a are equivalent to the edge 212a, the table 218, and the slide guide 218a, respectively. In FIG. 4, the roll 100 is rotatable in both clockwise and counterclockwise directions.

  The film is cut by the following procedure. First, the gap adjustment driving units 214 and 224 are driven to move the blade main bodies 212 and 222 to the retracted positions. Next, the motor 219 is driven to adjust the rake angle of the blade body 212 to an angle suitable for the material, thickness, cutting amount, etc. of the film F. Next, the roll 100 is rotationally driven so that the front end FF of the film F to be cut comes to the position of the blade body. In the following description, when the roll 100 is rotated clockwise in FIG. 4, the front part is defined as the front end FF, and the last part is defined as the rear end FB. Therefore, when the roll 100 is rotated counterclockwise in FIG. 4, the rear end FB is the foremost part and the front end FF is the last part.

  Next, the gap adjustment driving unit 214 is driven to bring the edge 212 a of the blade mechanism 210 into contact with the film F. Next, the blade vibration mechanism 215 is driven to vibrate the blade body 212. Further, the roll 100 is rotated clockwise until the edge 212a passes the rear end FB of the film F, and the entire surface of the film F is cut by the edge 212a.

  FIG. 5 is an enlarged cross-sectional view of the film F before cutting (a), during cutting (b), and after cutting (c). As shown in FIG. 5, the film F includes a circuit layer F <b> 1 including a bump B protruding in the normal direction, an insulating film layer F <b> 2, and a protective film layer F <b> 3 in this order. In order to press-contact the terminal of the electronic device against the bump B, the insulating film layer F2 and the protective film layer F3 on the bump B are cut off.

  By the above-described operation, the distance between the edge 212a and the cylindrical surface 110 of the roll 100 is kept at the distance D1. This distance D1 is a value sufficiently smaller than the height of the bump B. Therefore, when the roll 100 is rotated clockwise from the state before cutting of FIG. 5A, the insulating film layer F2 and the protective film layer F3 on the bump B and the top of the bump B are edge 212a as shown in FIG. The bump B is exposed as shown in FIG. When the above processing is completed, the gap adjustment driving unit 214 is driven again, and the edge 212a of the blade mechanism 210 moves to the retracted position.

  The film F is cut by the above processing. In the above example, the bump B is exposed in a single process. However, when a fine-structure film is cut, if the cutting thickness in the single process is too large, the stress of the film F is caused by the stress generated during the cutting. The circuit layer F1 may be damaged. Therefore, usually, the cutting thickness per process is reduced, and the process is divided into a plurality of times. In the present embodiment, a plurality (two) of blade mechanisms are provided. This configuration is suitable for efficiently performing a plurality of times of cutting.

  Hereinafter, the cutting procedure of the film F using both the blade mechanisms 210 and 220 will be described. FIG. 6 shows a cutting process by the blade mechanism 220 in this cutting. First, the process of FIG. 5 described above is performed. At the time after implementation, both the edges 212a and 222a are located at the retracted position.

  Next, the rake angle of the blade body 222 is adjusted to an angle suitable for the material, thickness, cutting amount, etc. of the film F (using a mechanism similar to the motor 219 shown in FIG. 3). Next, the roll 100 is rotationally driven so that the rear end FB of the film F to be cut comes to the position of the blade body 222.

  Next, the gap adjustment driving unit 224 is driven to bring the edge 222 a of the blade mechanism 220 into contact with the film F. At this time, the distance between the edge 222a and the cylindrical surface 110 of the roll 100 is smaller than the distance between the edge 212a and the cylindrical surface 110 in the previous cutting process using the edge 212a. Next, the blade vibration mechanism 225 is driven to vibrate the blade body 222. Further, the roll 100 is rotated counterclockwise until the edge 222a passes the front end FF of the film F, and the entire surface of the film F is cut by the edge 222a.

  FIG. 6 is an enlarged cross-sectional view of the film F before (a), during (b), and after (c) cutting by the edge 222a.

  By the above-described operation, the distance between the edge 222a and the cylindrical surface 110 of the roll 100 is kept at the distance D2. This distance D2 is a value sufficiently smaller than the height of the bump B. Therefore, when the roll 100 is rotated counterclockwise from the state before cutting in (a), the top of the bump B and the surrounding insulating film layer F2 and protective film layer F3 are surrounded by the edge 222a as shown in FIG. 6B. The bump B is cut down as shown in FIG. When the above processing is completed, the gap adjustment driving unit 224 is driven again, and the edge 222a of the blade mechanism 220 moves to the retracted position.

  The film F is gradually cut so as not to affect the circuit layer F1 by alternately performing the above steps with the blade mechanisms 210 and 220 while gradually decreasing the distance between the edge and the cylindrical surface 110. I can do it. In addition, by using a plurality of blade mechanisms for one roll, the amount of roll rotation required from the end of one cutting process to the start of the next cutting process can be reduced.

  In the present embodiment, one blade mechanism has one edge, but the present embodiment is not limited to the above configuration. That is, a configuration in which one edge is provided above and below the arm is also within the scope of the present invention. A second embodiment of the present invention described below shows a film processing apparatus having such a configuration.

  FIG. 7 shows a film processing apparatus 1 according to the second embodiment of the present invention, which is different from that of the first embodiment only in the configuration of the blade mechanism. Therefore, the description of other parts is omitted. To do. In the present embodiment, the same members as those in the first embodiment are given the same reference numerals as those in the first embodiment.

  As shown in FIG. 7, in the present embodiment, the rotation shaft of the rotation shaft 217 includes an upper edge 1212 a formed on the upper end of the blade surface of the blade body 1212 and a blade body 1212. The roller 100 of this surface coincides with the middle of the lower edge 1212b formed at the lower end of the surface of the wafer.

  FIG. 8 is a side view of the film processing apparatus 1000 in which the periphery of the blade mechanism 1210 is enlarged. In FIG. 8, the roll 100 is rotatable in either the clockwise direction or the counterclockwise direction.

  The film is cut by the following procedure. First, the gap adjustment drive unit 214 is driven to move the blade body 1212 to the retracted position. Next, the motor 219 is driven to adjust the rake angle of the upper edge 1212a to an angle suitable for the material, thickness, cutting amount, etc. of the film F. Next, the roll 100 is rotationally driven so that the front end FF of the film F to be cut comes to the position of the upper edge 1212a.

  Next, the gap adjustment driving unit 214 is driven to bring the upper edge 1212 a of the blade mechanism 1210 into contact with the film F. Next, the blade vibration mechanism 215 is driven to vibrate the blade body 1212. Further, the roll 100 is rotated clockwise until the upper edge 1212a passes the rear end FB of the film F, and the entire surface of the film F is cut by the upper edge 1212a. When the above processing is completed, the gap adjustment drive unit 214 is driven again, and the blade body 1212 of the blade mechanism 1210 moves to the retracted position.

  Next, the motor 219 is driven to adjust the rake angle of the lower edge 1212b to an angle suitable for the material, thickness, cutting amount, etc. of the film F. Next, the roll 100 is rotationally driven so that the rear end FB of the film F to be cut comes to the position of the lower edge 1212b.

  Next, the gap adjustment driving unit 214 is driven to bring the lower edge 1212 b of the blade mechanism 1210 into contact with the film F. Next, the blade vibration mechanism 215 is driven to vibrate the blade body 1212. Further, the roll 100 is rotated counterclockwise until the lower edge 1212b passes through the front end FF of the film F, and the entire surface of the film F is cut by the lower edge 1212b. When the above processing is completed, the gap adjustment drive unit 214 is driven again, and the blade body 1212 of the blade mechanism 1210 moves to the retracted position.

  The above process is performed alternately at the upper edge 1212a and the lower edge 1212b while gradually decreasing the distance between the edge and the cylindrical surface 110, thereby gradually reducing the film F so as not to affect the circuit layer F1. Can be cut. In this embodiment, the amount of roll rotation required from the end of one cutting process to the start of the next cutting process is such that the rear end FB of the film F is moved from the upper edge 1212a to the lower edge 1212b. There is a smaller amount of movement of the roll when using the plurality of blade mechanisms of the first embodiment.

It is a top view of the film processing apparatus by the 1st Embodiment of this invention. 1 is an enlarged top view of a blade mechanism according to a first embodiment of the present invention. 1 is an enlarged side view of a blade mechanism according to a first embodiment of the present invention. It is a side view of the film processing apparatus which expanded the blade mechanism periphery by the 1st Embodiment of this invention. It is an expanded sectional view of film F before cutting, during cutting, and after cutting by a 1st embodiment of the present invention. It is an expanded sectional view of film F before cutting, during cutting, and after cutting by a 1st embodiment of the present invention. The expansion side view of the blade mechanism of the film processing apparatus by the 2nd Embodiment of this invention is shown. It is a side view of the film processing apparatus which expanded the blade mechanism periphery by the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film processing apparatus 100 Roll 110 Cylindrical surface 210,220 Blade mechanism 211,221 Arm 212,222 Blade main body 212a, 222a Edge 213,223 Gap adjustment part 214,224 Gap adjustment drive part 215,225 Blade vibration mechanism B Bump F Film F1 Circuit layer F2 Insulating film layer F3 Protective film layer FF Front end FB Rear end

Claims (9)

A cylindrical roll on which a workpiece of the film is affixed on the cylindrical surface;
Roll driving means for rotating the roll around its axis;
A blade that can be placed in proximity to the cylindrical surface of the roll so as to contact the workpiece;
Blade vibration means for vibrating the blade in a direction parallel to the axis of the roll;
A film processing apparatus comprising:   2. The film processing apparatus according to claim 1, further comprising a blade advance / retreat unit configured to advance / retreat the blade in the radial direction of the roll with respect to the roll.   The blade advancing / retreating means includes a retracted position that is sufficiently separated from the cylindrical surface of the roll than the thickness of the workpiece, and a cuttable area whose distance from the cylindrical surface of the roll is shorter than the thickness of the workpiece. The film processing apparatus according to claim 2, wherein the blade is advanced and retracted between the two.   The film processing apparatus according to claim 3, wherein a plurality of the blades are arranged in a circumferential direction of the roll. The blade advancing / retreating means arranges the plurality of blades at positions where distances from the plurality of blades to the cylindrical surface of the roll are different from each other in the cuttable region,
The film processing apparatus according to claim 4, wherein the workpiece is cut stepwise by the plurality of blades.   The blade advance / retreat means moves the blade stepwise to a plurality of positions in the cutting region so that the blade approaches the roll. The film processing apparatus as described.   The blade advancing / retreating means is configured to cut the workpiece once again after the roll rotates once after the blade cuts the workpiece once at a first position in the cuttable region. During this time, the blade is moved to the retracted position, and after the workpiece can be cut again, the blade is moved to the second position in the cuttable area closer to the roll than the first position. The film processing apparatus according to claim 6, wherein:   The film processing apparatus includes blade rotation means for rotating the blade about an axis parallel to the axis of the roll to change a rake angle of the blade with respect to the workpiece. The film processing apparatus in any one of Claims 1-7.   The film processing apparatus according to claim 8, wherein the blade rotating unit rotates the blade around a cutting edge of the blade.

Images