JP4490363B2 - Electrical equipment - Google Patents

Description

  The present invention relates to an electric device including a printed circuit board.

  Conventionally, in an electrical device having a printed circuit board on which a plurality of lead wires are mounted together with various integrated circuits and circuit components, the waterproof property of the printed circuit board in the case is ensured when the printed circuit board is stored in the case. Therefore, filling a potting material in a case is performed (for example, patent document 1).

  However, the plurality of lead wires mounted on the printed circuit board are merely pulled out from the case and are not held in the case. For example, filling work for filling the case with potting material or other When the assembly work for attaching the parts is performed, there is a problem that the lead wire moves unexpectedly and the workability of the filling work and the assembly work is deteriorated.

Therefore, in order to solve the above problem, electric devices as shown in FIGS. 4A to 4C have been proposed. 4A to 4C includes a printed circuit board 101, four lead wires 103A to 103D having one end connected to the printed circuit board 101, and a column portion for fixing the lead wires 103A to 103D. A case 102 having a printed wiring board 101, a binding band 104 for binding the lead wires 103A to 103D, and a waterproof potting material 105 filled in the case 102 containing the printed board 101; The other end side of the lead wires 103A to 103D is pulled out from the case 102 in a state where the lead wires 103A to 103D are bound to the column portion 102a using the binding band 104. In FIG. 4A, the potting material 105 is omitted.
Japanese Patent Laid-Open No. 10-190245 (FIG. 1)

  4A to 4C described above, the lead wires 103A to 103D are bundled together with the column portion 102a of the case 102 by the binding band 104, so that the potting material 105 is filled. In addition, since the lead wires 103A to 103D are not scattered or moved unexpectedly during the assembly work, workability can be improved.

  However, when the lead wires 103A to 103D are bound by the binding band 104, the gap between the lead wires 103A to 103D is very narrow. There is a risk that the potting material 105 may not be sufficiently filled in the gaps between the lead wires 103A to 103D because the gaps between the lead wires 103A to 103D are difficult to enter.

  Such gaps between the lead wires 103A to 103D are difficult for the potting material 105 having a high viscosity to enter, but those having a low viscosity such as water, moisture, and the like sufficiently enter the gap. be able to. Therefore, if the potting material 105 is not sufficiently filled in the gaps between the lead wires 103A to 103D, water or the like enters the case 102 through the gaps between the lead wires 103A to 103D, and is waterproof. There was a problem that it was not possible to secure enough.

  This invention is made | formed in view of the above-mentioned point, The objective is to provide the electric equipment which can improve waterproofness.

  In order to solve the above-mentioned problems, in the invention of the electric device according to claim 1, a printed circuit board, a case in which the printed circuit board is accommodated, one end side is connected to the printed circuit board, and the other end side is outward from the case. And a waterproof potting material filled in the case in a state in which the printed circuit board is housed, and the case is formed on the surface of the case immersed in the potting material. A plurality of ribs projecting in the vicinity of a connection portion between the substrate and the lead wire; and a plurality of ribs penetrating the rib in the thickness direction and provided at predetermined intervals in the rib; A lead wire holding portion having an insertion hole is provided.

  In the present invention, since a plurality of lead wires are held by the lead wire holding portion in a state of being spaced apart from each other by a predetermined interval, when the potting material is filled, the potting material enters the gap between the lead wires and leads It becomes easy to fill the gaps between the wires, thereby preventing water and moisture from entering the case through the gaps between the lead wires, thereby improving the waterproof property. In addition, even when water or moisture enters the case through the gap between the lead wires, the ribs of the lead wire holding portion become a waterproof wall that blocks such water and moisture, so that the waterproof property is further increased. There is an effect that improvement can be achieved.

  Below, one Embodiment of the electric equipment of this invention is described with reference to FIGS. 1-3.

  As shown in FIGS. 1A and 1B, the electrical apparatus according to the present embodiment includes a printed circuit board 1, a case 2 in which the printed circuit board 1 is stored substantially in parallel with the bottom surface, and one end on the printed circuit board 1. A plurality of (four in the present embodiment) lead wires 3A to 3D having the other end connected to the outside and being pulled out from the case 2 and the lead wires 3A to 3D for binding the lead wires 3A to 3D in the case 2 The binding member 4 and a waterproof potting material 5 filled in the case 2 in a state where the printed circuit board 1 is accommodated. In FIG. 1A, the potting material 5 is omitted.

  The printed circuit board 1 is, for example, a paper base copper clad laminate such as a paper base epoxy resin copper clad laminate, a glass cloth base copper clad laminate such as a glass cloth base epoxy resin copper clad laminate, or a glass nonwoven fabric. A glass nonwoven fabric copper-clad laminate such as a base material epoxy resin copper-clad laminate is used, and various integrated circuits and circuit components necessary for electrical equipment are mounted. Also, one end of the four lead wires 3A to 3D is connected to one end of the printed circuit board 1 (the right end in FIG. 1A) by soldering or the like. In addition, a screw insertion hole (not shown) through which a fixing screw 70 for fixing the printed circuit board 1 to the case 2 is inserted is provided in the printed circuit board 1.

  For example, as shown in FIGS. 1A and 1B, the case 2 is formed in a box shape with one surface opened using a synthetic resin or the like, and on the bottom surface that becomes a surface immersed in the potting material 5, In addition to the lead wire holding portion 6 being integrally provided, a rib (not shown) having a screw hole (not shown) into which a fixing screw 70 for the printed circuit board 1 is screwed, and fixing for the binding member 4 A rib (not shown) having a screw hole (not shown) to which the screw 71 is screwed is integrally provided.

  Here, the lead wire holding part 6 is for holding the lead wires 3A to 3D in a state of being separated from each other at a predetermined interval. As shown in FIGS. 2 (a) and 2 (b), the bottom surface of the case 2 is used. In FIG. 1, a substantially rectangular rib 60 projecting in the vicinity of the connection portion C (see FIG. 1A) between the printed circuit board 1 and the lead wires 3A to 3D, and a predetermined interval in the length direction of the rib 60 (this embodiment) It is formed in a substantially comb-like shape having four notches 61A to 61D provided at equal intervals in the form.

  The notches 61A to 61D are substantially circular holes having an inner diameter equivalent to the outer diameter of the lead wires 3A to 3D and penetrating the rib 60 in the thickness direction, and the lead wires 3A to 3D are individually inserted. Each having a through hole 62 to be formed and a communication portion 63 serving as a passage for arranging the lead wires 3A to 3D in the insertion hole 62 from the tip end surface (the right end surface in FIG. 2B) side of the rib 60. Become. The width dimension (the vertical dimension in FIG. 2B) of the communication portion 63 is substantially the same as the outer diameter of the lead wires 3A to 3D, but the opening end side (the right end side in FIG. 2B). ) Is formed wider than the outer diameter of the lead wires 3A to 3D so that the lead wires 3A to 3D can be easily placed in the insertion holes 62.

  The binding member 4 is made of, for example, synthetic resin, and has a substantially rectangular flat plate portion 4a provided with a screw insertion hole (not shown) for the mounting screw 71. Further, a pair of protrusions for binding the lead wires 3A to 3D with the inner side surface of the case 2 on the side surface of the flat plate portion 4a facing the inner side surface of the case 2 (the right inner side surface in FIG. 1A). The pieces 4b and 4b are integrally provided, and the protruding dimension of the protruding pieces 4b and 4b from the flat plate portion 4a is substantially equal to the outer diameter of the lead wires 3A to 3D, and the distance between the protruding pieces 4b and 4b is The outer diameter of the lead wires 3A to 3D is about four times. Furthermore, a substantially rectangular protrusion for holding the lead wires 3A to 3D between the bottom surface of the case 2 and holding the lead wires 3A to 3D on the surface facing the bottom surface of the case 2 in the flat plate portion 4a. The part 4c is provided integrally.

  The printed circuit board 1, the lead wires 3 </ b> A to 3 </ b> D, and the binding member 4 described above are accommodated in the case 2 as follows. That is, the printed circuit board 1 has the fixing screws 70 inserted through the screw insertion holes (not shown) of the printed circuit board 1 in the state where the lead wires 3 </ b> A to 3 </ b> D are opposed to the bottom surface of the case 2. It is housed in the case 2 by being screwed onto it (not shown). The lead wires 3A to 3D are arranged in the insertion holes 62 of the cutout portions 61A to 61D of the lead wire holding portion 6 via the communication portion 63, and the other end side is drawn outward from the case 2, As a result, the lead wires 3A to 3D are held by the lead wire holding portion 6 in a state of being separated from each other at a predetermined interval.

  Further, the bundling member 4 holds the lead wires 3A to 3D between the bottom surface of the case 2 and the protrusion 4c on the other end side of the lead wires 3A to 3D with respect to the lead wire holding portion 6, and the inside of the case 2 A fixing screw through which a screw insertion hole (not shown) of the bundling member 4 is inserted in a state where the lead wires 3A to 3D are arranged in the space S surrounded by the side surface, the flat plate portion 4a, and the protruding pieces 4b and 4b. 71 is screwed into a screw hole (not shown) of the case 2 to be accommodated in the case 2.

  As described above, the potting material 5 for waterproofing is filled in the case 2 in which the printed circuit board 1, the lead wires 3 </ b> A to 3 </ b> D, and the binding member 4 are accommodated, and is cured later. Here, as the potting material 5 for waterproofing, a casting resin such as a urethane resin for casting (for example, “UE-921” manufactured by Sanyu Rec Co., Ltd.) is used.

  As described above, according to the electrical apparatus of the present embodiment, the lead wires 3A to 3D are held by the case 2 in a state of being separated from each other by a predetermined interval by the lead wire holding portion 6, so The lead wire does not move unexpectedly when filling the battery, and the workability of the filling work can be improved. Further, when the potting material 5 is filled, the potting material 5 easily enters the gaps between the lead wires 3A to 3D and fills the gaps between the lead wires 3A to 3D. As in the conventional example shown in c), water and moisture can be prevented from entering the case through the gap between the lead wires, and the waterproof property can be improved. Moreover, even when water or moisture enters the case 2 through the gaps between the lead wires 3A to 3D, the rib 60 of the lead wire holding portion 6 is provided with a waterproof wall that blocks such water and moisture. Therefore, there is an effect that waterproofing can be further improved.

  Furthermore, the lead wires 3A to 3D are arranged in the space portion S surrounded by the inner surface of the case 2, the flat plate portion 4a, and the projecting pieces 4b and 4b, thereby binding the lead wires 3A to 3D. Therefore, when the potting material is filled in the case, the lead wire can be prevented from moving unexpectedly, and the workability of the filling work can be further improved.

  In addition, since the lead wires 3A to 3D are sandwiched between the protrusion 4c of the binding member 4 and the inner bottom surface of the case 2, a force (load) that pulls the lead wires 3A to 3D to the other end side. ) Is applied to the lead wires 3 </ b> A to 3 </ b> D, the bundling member 4 acts as a tension stopper that receives such a load, thereby reducing the load applied to the connecting portion between the lead wires 3 </ b> A to 3 </ b> D and the printed circuit board 1. There is an effect.

  Moreover, you may make it use the lead wire holding part 8 as shown in FIG. 3 instead of the lead wire holding part 6 shown in said FIGS. 1-2.

  The lead wire holding portion 8, like the lead wire holding portion 6, has a substantially rectangular rib 80 projecting in the vicinity of the connection portion between the printed circuit board 1 and the lead wires 3 </ b> A to 3 </ b> D on the bottom surface of the case 2, The rib 80 is formed in a substantially comb-like shape having four notches 81A to 81D provided at predetermined intervals in the length direction, but the configuration of the notches 81A to 81D is the above-described notches 61A to 61D. It is different from the configuration. The notches 81A to 81D are formed of substantially circular holes having an inner diameter equivalent to the outer diameter of the lead wires 3A to 3D and penetrating the ribs 80 in the thickness direction, and the lead wires 3A to 3D are individually inserted. And a communication portion 83 that serves as a passage for arranging the lead wires 3A to 3D in the insertion hole 82 from the tip end surface (right end surface in FIG. 3) side of the rib 80. The width dimension (the vertical dimension in FIG. 3) is substantially the same as the outer diameter of the lead wires 3A to 3D, and the width dimension on the opening end side (right end side in FIG. 3) is the outer dimension of the lead wires 3A to 3D. It is set smaller than the diameter (small enough to allow the lead wires 3A to 3D to be press-fitted).

  When such a lead wire holding portion 8 is adopted, for example, when the binding member 4 is attached or when the potting material 5 is filled, the lead wires 3A to 3D are lifted or dropped from the notches 81A to 81D. It is possible to prevent this from happening, thereby further improving the workability.

  On the other hand, in the present embodiment, the lead wires 3A to 3D have substantially the same shape. However, for example, the outer diameter and the wire type may be different. In this case, the shape of the insertion hole of the lead wire holding portion May be formed in a shape suitable for the corresponding lead wire. Moreover, in said example, although the space | interval between notch parts (insertion hole) is made into equal intervals, it may not be equal intervals. Furthermore, it is good also as only an insertion hole, without providing a communication part in a notch part.

  Instead of the binding member 4, the lead wires 3 </ b> A to 3 </ b> D may be fixed to the case 2 using a binding band 104 as shown in FIG. 4. In addition, the shape of the printed circuit board 1 and the case 2 is not limited to the above example, and a suitable shape may be used depending on the situation.

  By the way, in the present embodiment, the description has been made focusing only on the waterproof property, but even when it is desired to ensure the airtightness of the case 2 by filling the potting material 5, the configuration of the electrical device of the present embodiment (especially the lead) Of course, the configuration of the line holding unit can be used.

(A) is a top view of the electric equipment of Embodiment 1 of this invention, (b) is sectional drawing of the A1-A1 line | wire of the figure (a). (A) is an enlarged view of a portion indicated by P1 in FIG. 1 (a), and (b) is a schematic explanatory view of a state in which a lead wire is fixed to a lead wire holding portion. It is a schematic explanatory drawing of the state which fixed the lead wire to other lead wire holding parts. (A) is a top view of the electric equipment of a prior art example, (b) is sectional drawing of the A2-A2 line of the figure (a), (c) is P2 in the figure (a). It is an enlarged view of the part shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Case 3A-3D Lead wire 4 Bundling member 5 Potting material 6 Lead wire holding part 60 Rib 62 Insertion hole C Connection part

Claims (1)

  A printed circuit board, a case in which the printed circuit board is accommodated, a plurality of lead wires having one end connected to the printed circuit board and the other end being drawn out from the case, and the printed circuit board is accommodated A potting material for waterproofing that is filled in a case, and the case has a rib projecting in the vicinity of a connection portion between the printed circuit board and the lead wire on a surface of the case immersed in the potting material, An electric device comprising: a lead wire holding portion that penetrates the rib in the thickness direction and is provided at a predetermined interval in the rib and has a plurality of insertion holes through which the plurality of lead wires are individually inserted. machine.

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