JP4484042B2 - Transparent shield case, method for manufacturing the same, and gaming machine - Google Patents

Description

  The present invention relates to a shield case installed so as to cover at least a part of an electronic circuit board in order to prevent malfunction of the electronic circuit caused by electrostatic discharge or unnecessary electromagnetic waves, and in particular, a transparent shield case having a structure in which the inside can be visually confirmed. The present invention also relates to a manufacturing method thereof and a gaming machine provided with the shield case.

  In general, a gaming machine such as a pachinko machine or a slot machine machine is provided with an electronic circuit board for controlling the operation contents of the game machine, and the electronic circuit board may malfunction due to external electrostatic discharge or unnecessary electromagnetic waves. was there. Further, the electronic circuit board for controlling the operation content of the gaming machine needs to be visible from the outside (or desirably visible) for security measures.

Therefore, conventionally, as disclosed in Patent Document 1 below, an electromagnetic shield member having a large number of holes is used to cover the electronic circuit board of the gaming machine, and the inside is visually recognized through the holes.
No. 7-46297

Further, as in Patent Document 2 below, at least a part of the shield structure covering the electronic circuit board of the gaming machine is made of a conductive film that can be seen through, thereby improving internal visibility. .
JP-A-5-251889

  However, when an electromagnetic shielding member having a large number of holes as in Patent Document 1 is used, there is a problem that the inside is difficult to see due to being obstructed by the remaining portions between the holes, and the visibility from the outside is poor. In the example of Patent Document 2, as shown in paragraph [0012] of Patent Document 2, the terminal lead-out wiring 4e, the electrode terminal 4f, and the coupler 5a are used for grounding the transparent conductive film. Etc. are provided. As a result, although the invention of Patent Document 2 can improve the visibility from the outside, it requires a complicated structure for grounding the conductive film that can be seen through, and must be expensive.

  Therefore, in view of the above points, the present invention realizes a favorable visibility from the outside, a transparent shield case capable of protecting an electronic circuit board from electrostatic discharge and unnecessary electromagnetic waves with a simple and inexpensive structure, and a manufacturing method thereof An object of the present invention is to provide a gaming machine provided with the transparent shield case.

  Other objects and novel features of the present invention will be clarified in embodiments described later.

In order to achieve the above object, a first transparent shield case according to the present invention has a case part provided with a shield layer on either the inside or the outside of a case part body of a transparent member, and at least an electronic circuit board. A shielding case installed so as to cover a part of the surface of the case part , wherein an opaque shielding layer made of an opaque shielding material is applied to a portion that does not require transparency, and a portion that requires transparency. A transparent shield layer made of a transparent shield material is provided, and the opaque shield layer and the transparent shield layer are arranged in contact with each other.

The second transparent shield case according to the present invention has a case portion provided with a shield layer on both the inside and the outside of the case portion main body of the transparent member, and is installed so as to cover at least a part of the electronic circuit board. An opaque shield layer made of an opaque shield material for a portion that does not require transparency, and a transparent shield layer made of a transparent shield material for a portion that requires transparency, respectively, among the constituent surfaces of the case portion. And is arranged so that a boundary portion between the opaque shield layer and the transparent shield layer is in contact.

In the transparent shield case, the transparent shield layer of the transparent shield material may be a configuration including a layer made of at least two transparent shielding material.

Wherein at least a layer composed of two transparent shield material is not in direct contact with each other, may respectively in contact with the opaque shield layer of said opaque shield material.

Each of the at least two layers of transparent shield material is in contact with the opaque shield layer of the opaque shield material in an overlapping manner;
Said than the size of the opaque shield layer made of the transparent shield material on the side in contact with the layer, the size layer of the transparent shield material is positioned away from the side in contact with said opaque shield layer, said opaque It is better to increase the distance from the side in contact with the shield layer .

In the boundary portion, the opaque shield layer and the transparent shield layer may be joined via a conductive adhesive layer.

It is desirable that the corner portion of the case portion is not transparent. In addition, it is desirable that the portion requiring transparency is composed of only a flat surface.

It is good to insulate at least one part of the surface of the said case part which provided the said transparent shield layer and the said opaque shield layer . Moreover, you may give a corrosion prevention process to at least one part of the surface of the said case part which provided the said transparent shield layer and the said opaque shield layer .

It is preferable that the surface resistance value of the transparent shield portion, which is the portion where the transparent shield layer is provided, of the constituent surfaces of the case portion is 450Ω / □ or less.

When at least one or more small holes for heat dissipation are provided in the transparent shield part which is the part where the transparent shield layer is provided or the opaque shield part which is the part where the opaque shield layer is provided in the constituent surfaces of the case part Good.

The structure which provided the noise suppression sheet | seat in at least one part of the opaque shield part which is the part which provided the said opaque shield layer among the structural surfaces of the said case part may be sufficient. Or the structure which provided the ferrite sintered compact in the at least one part of the said opaque shield part may be sufficient. Moreover, you may provide an antistatic material in at least one part of the said opaque shield part.

It is good also as a structure by which the hole which a cable passes is provided in a part of structural surface of the said case part , and the noise suppression member was installed around this hole.

  A gaming machine according to the present invention includes the transparent shield case.

First method of manufacturing a transparent shield case Ru engaged to the invention, the inside or outside of the one side of the transparent casing body, and transparency to form an opaque shield layer on unnecessary portions, then the opaque shield A transparent shield layer is formed on the same side on which the layer is formed so as to overlap at least an end portion of the opaque shield layer.
Further, in the second transparent shield case manufacturing method according to the present invention, a transparent shield layer is formed on the inner side or the outer side of the transparent case portion main body and on a portion requiring transparency, and then the transparent case is formed. An opaque shield layer is formed on the same side as the shield layer so as to overlap at least the end portion of the transparent shield layer.

  In the manufacturing method of the transparent shield case, when forming the opaque shield layer, a portion where transparency is required is masked, and the mask is removed after forming the opaque shield layer, whereby transparency of the portion where transparency is required It is characterized by ensuring.

According to the transparent shield case according to the present invention, among the constituent surfaces of the case portion, an opaque shield layer of an opaque shield material is unnecessary portions transparency, is necessary portions transparency transparent transparent shielding material Since each shield layer is provided and the boundary between the opaque shield layer and the transparent shield layer is in contact with each other, good visibility from the outside can be realized, and a special shield for grounding the transparent shield layer can be realized. The structure can be eliminated, and the electronic circuit board can be protected from electrostatic discharge and unnecessary electromagnetic waves with a simple and inexpensive structure.

According to the method for manufacturing a transparent shield case according to the present invention, an opaque shield layer is formed on the inner side or the outer side of the transparent case part main body and on a portion where transparency is unnecessary, and then the opaque shield layer is formed. Since the transparent shield layer is formed on the same side as that of the opaque shield layer so as to overlap at least the end of the opaque shield layer, or on one side inside or outside the transparent case body, and transparency is required. The transparent shield layer is formed on the portion, and then the opaque shield layer is formed on the same side as the transparent shield layer so as to overlap at least the end of the transparent shield layer. Electrical connection at the boundary of the transparent shield layer is ensured. In addition, when the transparent case portion main body is formed of a lightweight plastic, the weight of the transparent shield case can be reduced.

  According to the gaming machine according to the present invention, by covering at least a part of the electronic circuit board of the gaming machine with the transparent shield case, it is possible to achieve good visibility from the outside, and with a simple and inexpensive structure, The electronic circuit board can be protected from electrostatic discharge and unnecessary electromagnetic waves, and thus malfunction of the gaming machine can be prevented.

  Hereinafter, as a best mode for carrying out the present invention, a transparent shield case, a manufacturing method thereof, and an embodiment of a gaming machine will be described with reference to the drawings.

Embodiment 1 FIG.
Embodiment 1 of the transparent shield case, the manufacturing method thereof, and the gaming machine according to the present invention will be described with reference to FIGS. In these drawings, reference numeral 1 denotes an electronic circuit board included in a gaming machine such as a pachinko machine or a slot machine machine, and a transparent shield case 10 is installed so as to cover at least a part of the electronic circuit board 1.

  In this transparent shield case 10, a portion (four side surfaces) that does not require transparency in the rectangular parallelepiped case portion constituting surface is an opaque shield portion 11 using an opaque shield material, and a portion that requires transparency. The (ceiling surface) is a transparent shield portion 12 using a transparent shield material.

  Specifically, as shown in FIG. 2, an opaque shield layer 21 made of an opaque shield material and a transparent shield layer 22 made of a transparent shield material are formed inside a transparent case part body 15 formed with a transparent member. As shown enlarged in the dotted line frame, the opaque shield layer 21 and the transparent shield layer 22 are formed so as to overlap each other in order to ensure contact at the boundary between the opaque shield material and the transparent shield material. Have arranged. Of the case surface, the portion where the opaque shield layer 21 is provided becomes the opaque shield portion 11, and the portion where the transparent shield layer 22 is provided becomes the transparent shield portion 12.

  The manufacturing procedure is as follows. First, on one side of the transparent case body 15 formed with a transparent member, the opaque shield layer 21 is formed on a portion where transparency is not required, and then on the same side on which the opaque shield layer 21 is formed. The transparent shield layer 22 is formed so as to overlap at least the end portion of the opaque shield layer 21. In this case, when the opaque shield layer 21 is formed, a portion where transparency is required is masked, and after the opaque shield layer is formed, the mask is peeled off to ensure transparency of the portion where transparency is required. Thereafter, the transparent shield layer 22 may be formed. Note that a mask may be applied not only to a portion that requires transparency but also to a portion that does not require a shield layer.

When the transparent case portion main body 15 has a corner shape as shown in FIGS. 1 and 2, it is preferable that the case portion corner portion 15a and its periphery have no transparency. If the case where a transparent shield layer is manufactured at the corner portion of the case portion is considered, the following two methods are conceivable.
a. A transparent shield layer is formed on the transparent case main body formed with the transparent member.
b. A transparent shield layer is formed on a flat plate made of a transparent member, and the flat plate is formed into a case shape.

  However, a. In this method, since the case portion has a plurality of surfaces, and these surfaces form concave portions or convex portions, the direction of the case portion is changed in the transparent conductive film forming method such as the sputtering method or the vapor deposition method. However, it is necessary to form the transparent conductive film in several times, which is expensive. In addition, since there are concave portions or convex portions, the surface resistance of the transparent conductive film may be greatly uneven. Moreover, if it is a coating method, a transparent conductive film can be suitably formed. However, in a general coating method, it cannot be formed unless it is a high-resistance transparent conductive film, and a desired shielding effect may not be realized. .

  B. In this method, the transparent shield layer is destroyed by the elongation and deflection generated during molding, and in particular, in the corner portion where the elongation and deflection occur, electrical connection may not be maintained, which is not practical.

  Therefore, when the transparent shield case 10 has corners, it is preferable to design the transparent shield case 10 and its arrangement so that transparency is not necessary at least at the corners of the transparent case and its periphery. That is, as shown in FIG. 1 and FIG. 2, it is preferable to form the opaque shield layer 21 at the corner portion of the transparent case body 15 using an opaque shield material.

  Furthermore, it is desirable that the transparent shield case 10 that requires transparency is composed of only a flat surface. Although the transparent shield layer 22 can be formed even if the portion requiring transparency is not a flat surface, it is more expensive than a flat surface. Moreover, since it is not a plane, the surface resistance of the transparent conductive film forming the transparent shield layer 22 may be uneven. Moreover, if it is a coating method, a transparent conductive film can be suitably formed. However, in a general coating method, it cannot be formed unless it is a high-resistance transparent conductive film, and a desired shielding effect may not be realized. . Therefore, it is preferable that the portion where transparency is required is composed of only a flat surface.

  The transparent member constituting the transparent case body 15 may be a plastic such as polycarbonate, acrylic, polyethylene terephthalate, or ABS resin, or may be a laminate of different types of plastics. In particular, polycarbonate excellent in impact resistance can be suitably used.

  The opaque shield layer 21 formed using an opaque shield material may be a conductive film. In this case, a metal such as silver, nickel, tin, or zinc is used as the opaque shield material, and a laminate of different types of opaque shield materials may be used. Examples of the method for forming the conductive film include a plating method, a sputtering method, a vapor deposition method, and a coating method. Further, the conductive film formed by plating, sputtering, or vapor deposition has a surface resistance value of 0.1 Ω / □ or less, and becomes a very low resistance conductive film.

  The transparent shield layer 22 formed using the transparent shield material may be a transparent conductive film. In this case, as the transparent shield material, ITO (indium tin oxide), tin oxide, silver or the like is used, and a laminate of different types of transparent shield materials may be used. The film thickness of the transparent conductive film varies depending on the formation method and the surface resistance value, but is a very thin film of several tens of nm to several hundreds of μm. Examples of the method for forming the transparent conductive film include a coating method, a sputtering method, a vapor deposition method, and an ion plating method. In particular, in the case where a transparent shield layer is formed on the transparent case portion main body 15 made of polycarbonate, a coating method and a low-temperature sputtering method can be used. However, a general low-temperature sputtering method is expensive, and a general coating method can be formed only with a high-resistance transparent conductive film, and a desired shielding effect may not be realized. Therefore, when forming a transparent shield layer on polycarbonate, it is necessary to use a transfer-type coating method capable of producing a transparent conductive film having a low resistance as compared with a general coating method. Moreover, when using the apply | coating method, it is preferable that the surface (namely, part in which transparency is required) which forms the transparent shield layer 22 is the outer side of the transparent case part main body 15, and a plane. In FIG. 2, the shield layers 21 and 22 are illustrated inside the transparent case portion main body 15, but they may be disposed outside.

  The opaque shield layer 21 of the opaque shield part 11 is connected to the ground wiring 2 of the electronic circuit board 1 and an external ground. For example, as shown in FIG. 2, the transparent case portion main body 15 is bent to the outside on the electronic circuit board side, and the opaque shield layer 21 is extended to the surface of the bent portion on the electronic circuit board side. The shield layer 21 is connected to the ground wiring 2 on the electronic circuit board. The connection between the extended opaque shield layer 21 and the ground wiring 2 on the electronic circuit board may be made around the entire circumference of the transparent shield case 10 on the electronic circuit board side, or may be made in part. Also good. When performed all around, the grounding effect of the transparent shield case 10 is great, and the effect of preventing electromagnetic waves generated from the electronic circuit board 1 in the transparent shield case from leaking to the outside is also great.

  Further, when the assumed static energy is weak and the opaque shield part 11 functions sufficiently as a ground, it is necessary to connect the opaque shield part 11 to the ground wiring 2 of the electronic circuit board 1 or an external ground. Absent.

  The transparent shield case 10 can be fixed to the electronic circuit board by fixing means such as screwing, fitting or double-sided adhesive tape. For example, in FIG. 2, the transparent shield case 10 is bent to the outside on the electronic circuit board side, holes are formed in the bent portions, holes are also formed in the electronic circuit board at positions corresponding to the holes, and these holes are formed. A screw 5 is passed through the screw 5 and is screwed with a nut 6.

  In the present embodiment, the visible light transmittance of the transparent shield portion 12 is preferably 50% or more, and more preferably 70% or more. The surface resistance value of the transparent shield part 12 is preferably 450Ω / □ or less, and more preferably 100Ω / □ or less. If the surface resistance value of the transparent shield part 12 is 450 Ω / □ or less, for example, a shielding effect of 3 dB or more can be realized with respect to a plane wave (electromagnetic wave) incident perpendicularly to the transparent shield surface. That is, transmission of electromagnetic waves is suppressed by the transparent shield part, and the energy of the transmitted electromagnetic waves becomes half or less. Further, if the surface resistance value of the transparent shield part is 100Ω / □ or less, a shielding effect of 9 dB or more can be realized against a plane wave (electromagnetic wave) incident perpendicularly to the transparent shield surface.

  The surface resistance value of the opaque shield part 11 is preferably 10Ω / □ or less, and more preferably 1Ω / □ or less.

  The transparent shield case 10 does not show holes other than screws, but may have holes through which cables for connecting to other electronic circuit boards, display devices, and the like are passed.

  According to the first embodiment, the following effects can be obtained.

(1) Of the rectangular parallelepiped case portion constituting surface, a portion requiring transparency is a flat transparent shield portion 12 using a transparent shield material, so that good visibility from the outside can be secured.

(2) Since the boundary between the opaque shield layer 21 formed of the opaque shield material and the transparent shield layer 22 formed of the transparent shield material is placed so as to contact each other and the electrical connection between the two is ensured, the transparent shield layer 21 is transparent. Even when the shield layer 22 is subjected to electrostatic discharge, electric energy flows from the transparent shield layer 22 to the opaque shield layer 21. Therefore, it is not necessary to provide terminal lead-out wiring or electrode terminals in the transparent shield part 12 for grounding the transparent shield layer 22, and a simple and inexpensive structure can be achieved.

(3) When the plastic is used as the transparent case body 15 and the shield layers 21 and 22 are conductive films and transparent conductive films, the transparent shield case 10 is extremely light, so that not only the gaming machine, It can also be suitably used for portable electronic devices and in-vehicle electronic devices.

Embodiment 2. FIG.
FIG. 3 shows a configuration suitable for a transfer type coating method, for example, according to the second embodiment of the present invention. In this case, the transparent shield case 10 is formed by forming the transparent shield layer 22 of the transparent shield material on the outside of the transparent case portion main body 15 formed with the transparent member by a transfer type coating method, and then the opaque shield layer of the opaque shield material. In order to make contact at the boundary between the opaque shield material and the transparent shield material more reliably, the opaque shield layer 21 and the transparent shield layer 22 are formed as shown in FIG. It is formed and arranged so as to overlap at the boundary. Of the case portion constituting surface, the portion where the opaque shield layer 21 is provided becomes the opaque shield portion 11, and the portion where the transparent shield layer 22 is provided becomes the transparent shield portion 12.

  The transparent shield case 10 is fixed to the electronic circuit board 1 of a gaming machine such as a pachinko machine or a slot machine machine with a double-sided adhesive tape 39, and an opaque shield layer 21 extending on the lower surface of the transparent case body 15 is provided. It is electrically connected to the ground wiring 2 of the electronic circuit board 1.

  The manufacturing procedure is as follows. First, on one side of the transparent case part body 15 formed with a transparent member, the transparent shield layer 22 is formed on a portion requiring transparency, and then on the same side as the transparent shield layer 22 is formed. The opaque shield layer 21 is formed so as to overlap at least the end of the transparent shield layer 22. In this case, when the opaque shield layer 21 is formed, a portion where transparency is required (that is, a region where the transparent shield layer 22 is formed) is masked, and the mask is removed after the opaque shield layer is formed. It is preferable to ensure the transparency of the necessary transparent shield layer 22 portion. Note that a mask may be applied not only to a portion that requires transparency but also to a portion that does not require a shield layer.

  The reason for this manufacturing procedure will be described below. For example, in the transfer type coating method, the transparent shield layer 22 and the non-conductive transparent binder layer 23 are laminated on the transparent case body 15 in a laminated state. That is, when the transparent shield layer 22 is formed on the transparent case body 15, the transparent case body 15, the transparent binder layer 23, and the transparent shield layer 22 are sequentially laminated. In the case where the opaque shield layer 21 is first formed on the transparent case body 15 and then the transparent shield layer 22 is formed, the opaque shield layer 21 and the transparent shield layer 22 are overlapped at the end portion of the opaque shield layer 22. The transparent binder layer 23 will be interposed between the material and the transparent shield material, and electrical connection between the opaque shield layer 21 and the transparent shield layer 22 will not be obtained. On the other hand, when the transparent shield layer 22 is formed first on the transparent case portion main body 15 and then the opaque shield layer 21 is formed as in this embodiment, the opaque shield layer 21 and the transparent shield layer 21 are transparent. It is possible to ensure electrical connection with the shield layer 22.

  Other configurations and operational effects are the same as those in the first embodiment.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. In this example, both sides of the electronic circuit board 1 included in a gaming machine such as a pachinko machine or a slot machine board are covered with a shield case, and electrostatic discharge and unwanted electromagnetic waves arriving on both sides of the electronic circuit board 1 are dealt with. By the way, the electronic circuit board 1 incorporated in the gaming machine usually only needs to be able to visually recognize the electronic circuit board only from one side. Therefore, in the third embodiment, the transparent shield case 10 having the transparent shield portion 12 is installed on one side of the electronic circuit board 1, and the opaque shield case 30 is installed on the other side. For the opaque shield case 30, a metal molded case or the like is used. Moreover, what is necessary is just to install the transparent shield case 10 on both surfaces when visual recognition from both surfaces is required.

  Further, in the third embodiment, an opaque shield layer 21 made of an opaque shield material and a transparent shield layer 22 made of a transparent shield material are formed on the outer side of the transparent case body 15 formed with a transparent member. Further, it is provided so as to overlap with each other, and further includes connecting means for connecting the opaque shield part 11 of the transparent shield case 10 to the ground outside the electronic circuit board 1.

  That is, as shown in FIG. 5, the opaque shield layer 21 formed on the outer side of the transparent case body 15 is electrically connected to the washer 25 disposed on the outer side of the case, and the washer 25 and the screw 26 are connected to the washer 25 and the screw 26. It is electrically connected to the sandwiched conductive wire 27. Here, the conducting wire 27 is a covered conducting wire so that it is not connected at a portion where electrical connection is unnecessary. The screw 26 passes through the washer 25 and the transparent case main body 15 and is fastened and fixed by a nut 28. Similarly, the coated conductor 27 can be attached to the opaque shield case 30 using a washer 25, a screw 26, and a nut 28 as means for connecting to an external ground.

  As shown in FIG. 5, mechanical attachment of the transparent shield case 10 and the opaque shield case 30 to the electronic circuit board 1 is performed by providing posts 35 (both female threads are engraved on both ends) on both sides of the electronic circuit board 1, respectively. The transparent shield case 10 and the opaque shield case 30 are fixed to these support columns 35 with screws 37.

  In the third embodiment, both sides of the electronic circuit board 1 can be shielded, and protection from electrostatic discharge and unwanted electromagnetic waves that arrive on both sides of the electronic circuit board 1 can be achieved. Other configurations and operational effects are the same as those of the first embodiment.

Embodiments 4 and 5.
In each of the above embodiments, the shape of the shield case is a rectangular parallelepiped, but a dome (hemispherical) shape as shown in FIG. 6A or a substantially rectangular parallelepiped with rounded corners as shown in FIG. 6B. It may be a shape or the like. That is, in the fourth embodiment shown in FIG. 6A, the opaque shield layer 21 made of an opaque shield material and the transparent shield layer 22 made of a transparent shield material are disposed inside the dome-shaped transparent case main body 15 at their boundaries. It is provided so that it may contact. In addition, in Embodiment 5 in FIG. 6B, an opaque shield layer 21 made of an opaque shield material and a transparent shield layer 22 made of a transparent shield material are provided outside the transparent case portion main body 15 having a substantially rectangular parallelepiped shape with rounded corners. Are provided so that their borders are in contact with each other. Other configurations and operational effects are the same as those of the first embodiment.

Embodiments 6 and 7.
In each of the above embodiments, the case where the transparent shield portion of the transparent shield case is one place has been shown. However, as in the sixth embodiment in FIG. 7A and the seventh embodiment in FIG. The transparent shield part may be a transparent shield case in a plurality of locations. That is, in the sixth embodiment of FIG. 7A, in the transparent shield case 10 installed so as to cover at least a part of the electronic circuit board 1, transparency is unnecessary among the rectangular parallelepiped case portion configuration surfaces. This portion (four side surfaces) is an opaque shield portion 11 using an opaque shield material, and two transparent shield portions 12 using a transparent shield material are provided on a portion (ceiling surface) that requires transparency. ing. In Embodiment 7 of FIG. 7B, one transparent shield portion 12 is provided on the ceiling surface of the rectangular parallelepiped case portion constituting surface of the transparent shield case 10, and the transparent shield portion 12 is also provided on each of the four side surfaces. Is provided. Other configurations and operational effects are the same as those of the first embodiment.

Embodiment 8 FIG.
FIG. 8 shows an eighth embodiment of the present invention, which is an example of using a transparent shield case 10 in which shield layers are formed on both the inside and the outside of a transparent case main body 15 formed with a transparent member. In other words, the opaque shield part 11 is constituted by the opaque shield layers 21 on both sides of the case part main body 15, and the transparent shield part 12 is constituted by the transparent shield layers 22 on both sides of the case part main body 15. Moreover, the boundary of both the shield layers 21 and 22 overlaps and is in contact.

  The transparent shield case 10 is fixed to the electronic circuit board 1 of a gaming machine such as a pachinko machine or a slot machine machine with a double-sided adhesive tape 39.

  Furthermore, a connecting means for connecting the opaque shield part 11 of the transparent shield case 10 to the ground outside the electronic circuit board 1 is provided. That is, the opaque shield layer 21 formed on the inside and outside of the transparent case body 15 is electrically connected to the washer 25 arranged on the inside and outside of the case, and is sandwiched between the washer 25 and the screw 26 on the outside. The lead wire 27 is electrically connected. Here, the conducting wire 27 is a covered conducting wire so that it is not connected at a portion where electrical connection is unnecessary. The screw 26 passes through the washer 25 and the transparent case main body 15 and is fastened and fixed by a nut 28.

  In the eighth embodiment, since the shield layers 21 and 22 can be formed on both the inside and the outside of the transparent case portion main body 15, the shielding effect is improved as compared with the case where the shield layer is formed only on one side. In general, the transparent shield material for forming the transparent shield layer 21 has higher electrical resistance than the opaque shield material, and therefore, when the shield layer is formed only on one side, a desired shielding effect may not be obtained. . Therefore, as in the present embodiment, a configuration in which a shield layer is formed on both the inside and the outside of the case portion is useful. Other configurations and operational effects of the eighth embodiment are the same as those of the first embodiment.

Reference Example 1
As shown in FIG. 9, in Reference Example 1 , a transparent conductive film 40 is used as the transparent shield portion 12 and is disposed in a portion requiring transparency. That is, the transparent shield case 10 is formed so as to cover the opaque shield part 11 formed of a metal such as aluminum, iron, brass, and stainless steel as the opaque shield material, and the window part formed in the opaque shield part 11. And a transparent conductive film 40 bonded to the peripheral portion via a conductive adhesive layer 45.

  When the transparent conductive film 40 is used as the transparent shield part 12, it is preferable that the transparent shield part 12 has a planar structure, so that the transparent conductive film 40 can be easily applied.

  As the transparent conductive film 40, a transparent conductive film 42 made of ITO, tin oxide, silver or the like (functioning as a transparent shield layer) is formed on a transparent film base 41 made of polycarbonate, acrylic, polyethylene terephthalate, ABS resin or the like. Are formed by sputtering, vapor deposition, ion plating, coating, or the like. For example, there is a transparent conductive film obtained by sputtering ITO on a polyethylene terephthalate film with a thickness of several tens of nm. The surface resistance value of this transparent conductive film is about 100 to 200 Ω / □, and the visible light transmittance is 80% or more. Further, there is a transparent conductive film obtained by sputtering silver or the like on a polyethylene terephthalate film with a thickness of several tens of nanometers. The transparent conductive film has a surface resistance value of about 10Ω / □ and a visible light transmittance of 75% or more.

  Examples of the conductive adhesive layer 45 include a conductive adhesive and a conductive adhesive tape. In FIG. 9, the shield layer forming surface (that is, the surface of the transparent conductive film 42) of the transparent conductive film 40 is joined to an opaque shield material such as a metal forming the opaque shield portion 11 through the conductive adhesive layer 45. Are electrically connected.

According to the reference example 1 , the visibility inside the shield case 10 can be improved by using the transparent conductive film 40 having a high visible light transmittance. Moreover, cost reduction can be aimed at by using the existing transparent conductive film 40. FIG. The other configurations and operational effects of Reference Example 1 are the same as those of the first embodiment described above.

Ninth Embodiment
As shown in FIG. 10, in the transparent shield case 10 of the ninth embodiment, a transparent conductive film 40 is used as the transparent shield part 12, and this is attached to the transparent case part body 15 with a transparent adhesive layer 46. That is, an opaque shield layer 21 of an opaque shield material is formed inside the transparent case body 15, and the opaque shield layer 21 and the transparent conductive film 40 (transparent conductive film 42) are interposed via the conductive adhesive layer 45. The boundary portion is joined, and portions other than the boundary portion are joined to the inside of the transparent case portion main body 15 via the transparent adhesive layer 46.

  When the transparent conductive film 40 is used as the transparent shield part 12, the transparent case part main body 15 that is to be the transparent shield part 12 is preferably a flat surface. It becomes easy.

  When an opaque adhesive layer is used instead of the transparent adhesive layer 46, the use range is limited so as not to hinder the transparency as a shield case (used only at the peripheral edge of the transparent conductive film 40). It is necessary to avoid parts that require transparency.

  The transparent shield case 10 is fixed to the electronic circuit board 1 of a gaming machine such as a pachinko machine or a slot machine machine by a double-sided adhesive tape 39, and the opaque shield layer 21 is electrically connected to the ground wiring 2 of the electronic circuit board 1. It is connected.

In the case of the ninth embodiment, since the transparent conductive film 40 is bonded to the transparent case main body 15 such as plastic, the mechanical strength is superior to that of the reference example 1 . Other configurations and operational effects of the ninth embodiment are the same as those of the first embodiment.

Embodiment 10 FIG.
As shown in FIG. 11, in the transparent shield case 10 of the tenth embodiment, the transparent shield part 12 is formed by forming a plurality of transparent shield layers on the transparent case part main body 15. That is, in the illustrated case, the first transparent shield layer 22a made of the first transparent shield material is formed outside the transparent case portion main body 15, and the second transparent shield layer 22b made of the second transparent shield material is formed thereon. Each of the transparent shield layers 22a and 22b is laminated and connected to the opaque shield layer 21 formed of an opaque shield material on the outside of the transparent case main body 15 at the end.

  As shown in the dotted frame by enlarging the boundary between the opaque shield layer 21 and the transparent shield layers 22a and 22b, the first and second transparent shield layers 22a and 22b are laminated by, for example, a transfer type coating method. In this case, each transparent shield layer is laminated on the transparent case body 15 via a non-conductive transparent binder layer. That is, when the first transparent shield layer 22a is first formed on the transparent case main body 15, and then the second transparent shield layer 22b is formed, the transparent case main body 15, the first transparent binder layer 23a, 1 transparent shield layer 22a, 2nd transparent binder layer 23b, and 2nd transparent shield layer 22b are laminated | stacked in order.

  Therefore, since the second transparent binder layer 23b is interposed between the first transparent shield layer 22a and the second transparent shield layer 22b, they are not in direct contact with each other. Further, when only one of the transparent shield layers and the opaque shield layer 21 are brought into contact with each other, the shielding effect of the other transparent shield layer may not be sufficiently exhibited. Therefore, each of the transparent shield layers 22a and 22b is brought into contact with the opaque shield layer 21 to ensure electrical connection.

  Furthermore, in order to make each of the transparent shield layers 22a and 22b come into contact with the opaque shield material forming the opaque shield layer 21 in an overlapping manner, the second transparent shield on the side in contact with the opaque shield material (upper side in FIG. 11). The size of the first transparent shield layer 22a at a position farther from the side in contact with the opaque shield material than the size of the layer 22b (the second transparent binder layer 23b has the same size) is in contact with the opaque shield material. Increasing the distance from the side. As a result, a step between the two transparent shield layers is formed in the overlapping portion, and the transparent shield layers 22a and 22b can contact with the opaque shield material forming the opaque shield layer 21 with overlap.

According to the tenth embodiment, even if the desired shielding effect cannot be achieved with only one transparent shield layer made of a transparent shield material, two transparent shield layers made of a transparent shield material are formed. Thus, a desired shielding effect can be realized. For example, when there are two transparent shield layers having a surface resistance value of 200Ω / □, a shielding effect equivalent to that of a single 100Ω / □ transparent shield layer can be realized.

  Further, by setting the first transparent shield layer 22a at a position away from the side in contact with the opaque shield material larger than the size of the second transparent shield layer 22b on the side in contact with the opaque shield material, The transparent shield layers 22a and 22b can be reliably brought into contact with the opaque shield material forming the opaque shield layer 21 with an overlap.

  Other configurations and operational effects are the same as those of the second embodiment. In the case of FIG. 11, there are two layers, but there may be three or more transparent shield layers made of a transparent shield material.

Reference Example 2
As shown in FIG. 12, in Reference Example 2 , a plurality of transparent conductive films are used as the transparent shield portion 12 and are arranged in a portion where transparency is required. That is, the transparent shield case 10 is formed so as to cover the opaque shield part 11 formed of a metal such as aluminum, iron, brass, and stainless steel as the opaque shield material, and the window part formed in the opaque shield part 11. 1st and 2nd transparent conductive films 40a and 40b each joined to the peripheral part via the conductive adhesive layer 45 are provided. As the transparent conductive films 40a and 40b, transparent conductive films 42a and 42b made of ITO, tin oxide, silver or the like were provided on the transparent film bases 41a and 40b made of polycarbonate, acrylic, polyethylene terephthalate, ABS resin or the like. Things can be used.

  In this case as well, the transparent conductive films 42a and 42b of the first and second transparent conductive films 40a and 40b are in contact with the conductive adhesive layer 45 provided on the opaque shield part 11 in an overlapping manner. The second transparent conductive film 40b located farther from the side in contact with the opaque shield material than the size of the first transparent conductive film 40a on the side in contact with the opaque shield material (the lower side in FIG. 12). Is increased as the distance from the side in contact with the opaque shielding material increases. As a result, there is a step between the transparent conductive films 42a and 42b of the two transparent conductive films in the overlapping portion, and the transparent conductive films 42a and 42b are in contact with the conductive adhesive layer 45 on the opaque shield material side with overlapping. it can.

According to this reference example 2 , even if only one layer of the transparent conductive film cannot achieve the desired shielding effect, two layers of the transparent conductive film made of the transparent conductive film are formed. A shield effect can be realized. For example, when there are two transparent conductive films having a surface resistance value of 200Ω / □, a shielding effect equivalent to that of a single 100Ω / □ transparent shield layer can be realized.

Other configurations and operational effects are the same as those in Reference Example 1 . In the case of FIG. 12, the transparent conductive film has two layers, but may have three or more layers.

Embodiment 11 FIG.
As shown in FIG. 13, in the transparent shield case 10 of the eleventh embodiment, at least one or more small holes 50 are formed in the opaque shield part 11 and the transparent shield part for heat dissipation of LSI or the like mounted on the electronic circuit board 1. 12 is provided in the case part.

  Electronic components installed on the electronic circuit board 1, particularly LSIs and ICs, can generate a lot of heat. However, if a shield case is installed so as to cover the electronic circuit board, heat generated from the LSI, IC, etc. is trapped in the shield case, the inside of the shield case becomes high temperature, LSI, IC, other electronic components, etc. May malfunction.

  In the present embodiment, it is possible to release heat in the transparent shield case 10 by providing at least one or more small holes 50 in one or both of the transparent shield part 11 and the opaque shield part 12. In order to improve heat dissipation, it is preferable to provide a plurality of small holes 50. Moreover, in order to suppress the deterioration of the shielding effect due to the provision of the holes, it is desirable that the holes for heat dissipation have a small diameter.

Other configurations and operational effects of the eleventh embodiment are the same as those of the first embodiment.

Embodiment 12 FIG.
As shown in FIG. 14, in the transparent shield case 10 of the twelfth embodiment, at least one or more small holes 50 are provided to dissipate heat from LSI or the like mounted on the electronic circuit board 1, and a cooling device 55 such as a fan is provided. It is mainly provided in the installed opaque shield part 11. By disposing the cooling device 55 so as to cover the small holes 50 for heat dissipation, the heat dissipation can be improved, and it is not necessary to provide many (or large) small holes 50 in the transparent shield case 10, so that the shielding effect is almost eliminated. It is possible to ensure sufficient heat dissipation without deteriorating.

The remaining configuration and operational effects of the twelfth embodiment are the same as those of the first embodiment.

Embodiment 13 FIG.
As shown in FIG. 15, in the transparent shield case 10 of the thirteenth embodiment, a noise suppression member 60 is provided on at least a part of the opaque shield part 11 using an opaque shield material.

  As the noise suppression member 60, a noise suppression sheet (composite magnetic material sheet) in which soft magnetic powder such as metal magnetic powder or ferrite powder is mixed with a binder such as synthetic rubber or synthetic resin can be used. A plate-like ferrite sintered body can also be used as the noise suppressing member 60. It is preferable that the noise suppression sheet or the noise suppression member 60 of the ferrite sintered body is disposed adjacent to the opaque shield material of the opaque shield portion 11. For example, as shown in FIG. 15, when the opaque shield layer 21 is formed on the outer side of the transparent case part body 15 using an opaque shield material, the noise suppression member 60 is provided on the further outer side of the opaque shield layer 21. The noise suppression member 60 should just be mounted | worn with the opaque shield part 11 via an adhesive agent, a double-sided adhesive tape, a conductive adhesive, and a conductive double-sided adhesive tape.

  The transparent shield case 10 is fixed to the electronic circuit board 1 of a gaming machine such as a pachinko machine or a slot machine machine with a double-sided adhesive tape 39, and the opaque shield layer 21 is electrically connected to the ground wiring 2 of the electronic circuit board 1. It is connected.

According to the thirteenth embodiment, the high-frequency current in the opaque shield part 11 can be reduced, and an improvement in the shielding effect can be expected. Further, even if it is difficult to connect the transparent shield case 10 to the ground wiring 2 of the electronic circuit board 1 or an external ground, or even if it can be connected to the ground wiring 2 of the electronic circuit board 1 or an external ground, the ground When the effect is insufficient, the noise suppression member 60 can cause the electrical energy in the opaque shield portion 21 to be lost, and an improvement in the ground function of the opaque shield portion 11 can be expected.

  When a noise suppression sheet made of a composite magnetic material is used as the noise suppression member 60, it is effective for reducing a high-frequency current having a higher frequency than a ferrite sintered body, and when using a ferrite sintered body, noise suppression is performed. Compared with the sheet, it is effective in reducing the high-frequency current at a lower frequency.

The remaining configuration and operational effects of the thirteenth embodiment are the same as those of the first embodiment.

Embodiment 14 FIG.
The fourteenth embodiment will be described with reference to FIGS. In the transparent shield case 10 according to the fourteenth embodiment, a through hole 76 through which the cable 75 passes is provided in a part of the case portion constituting surface (in the illustrated case, the opaque shield portion 11), and noise is formed around the through hole 76. The suppression member 70 is installed.

  Noise generated when the cable 75 receives electrostatic discharge or unnecessary electromagnetic waves can reach the electronic circuit in the electronic circuit board 1 through the cable 75. By disposing the noise suppression member 70 so as to surround the cable 75, it is possible to suppress noise transmitted through the cable. Further, the present invention is effective in suppressing unnecessary electromagnetic waves emitted from the cable 75.

  As the noise suppression member 70, a composite magnetic material in which a soft magnetic powder such as a metal magnetic powder or a ferrite powder is mixed with a binder such as a synthetic rubber or a synthetic resin is used as in the noise suppression sheet. A ferrite sintered body may be used.

  For convenience such as mounting on the transparent shield case 10, the noise suppression member 70 may be composed of a plurality of parts divided as shown in FIG. FIG. 18A is suitable for a flat cable, and has a structure in which a half-cylinder divided body 81 obtained by halving a long cylindrical body having an elliptical cross section is abutted. FIG. 18B is suitable for a flat cable, and is obtained by connecting short cylindrical bodies 82 obtained by dividing an axial length of a long cylindrical body having an elliptical cross section into two. FIG. 18C is suitable for a round cable, and has a structure in which a half-cylinder divided body 83 in which a cylindrical body having a circular cross section is halved is abutted. FIG. 18D is suitable for a round cable, in which a short cylindrical body 84 obtained by dividing the axial length of a cylindrical body having a circular cross section into two parts is connected.

  The transparent shield case 10 is fixed to the electronic circuit board 1 of a gaming machine such as a pachinko machine or a slot machine machine with a double-sided adhesive tape 39, and the opaque shield layer 21 is electrically connected to the ground wiring 2 of the electronic circuit board 1. It is connected.

Other configurations and operational effects of the fourteenth embodiment are the same as those of the first embodiment.

  In the transparent shield case of each embodiment described above, at least a part of the surface of the case portion having the opaque shield portion using the opaque shield material and the transparent shield portion using the transparent shield material may be subjected to insulation treatment. . This insulation treatment is performed to prevent the shield surface of the transparent shield case from coming into contact with the electronic circuit board or the like and causing the electronic circuit board or the like to malfunction or fail. When performing insulation treatment on the transparent shield portion, it is necessary to select a transparent insulation treatment method. Examples of the insulating treatment method include attaching an insulating tape, or applying a resin coating or an inorganic coating. In addition, the place where the insulation process is performed may be a part that may come into contact with the electronic circuit board or the like, but the entire shield surface may be subjected to an insulation process to prevent malfunction or failure.

  Further, in the transparent shield case of each embodiment, the corrosion prevention treatment may be applied to at least a part of the surface of the case portion having the opaque shield portion using the opaque shield material and the transparent shield portion using the transparent shield material. Good. This anti-corrosion treatment is a measure for preventing or reducing the deterioration of the shield characteristics and the deterioration of the transparency due to the corrosion of the shield surface of the transparent shield case. When performing corrosion prevention treatment on the transparent shield part, it is necessary to select a transparent corrosion prevention treatment method. As a method for the corrosion prevention treatment, a resin coating or an inorganic coating may be applied.

  It is also conceivable to perform the insulation treatment and the corrosion prevention treatment at the same time. For example, by applying a resin coating or an inorganic coating.

An antistatic material can be used in place of the noise suppression member of the thirteenth embodiment. In other words, by providing an antistatic material to at least a part of the opaque shield portion using the opaque shield material, the same effect as when a noise suppression member (noise suppression sheet, ferrite sintered body) is provided can be expected. . Compared to a noise suppression sheet, it is effective in reducing high frequency high frequency current. It is an anti-static material, synthetic rubber, synthetic resin, a mixture of conductive powder of carbon or the like is used to foam synthetic resin. The antistatic material is preferably disposed adjacent to the opaque shield material of the opaque shield portion. The antistatic material may be attached to the opaque shield part via an adhesive, a double-sided adhesive tape, a conductive adhesive, and a conductive double-sided adhesive tape. When the antistatic material is attached to the opaque shield part via a conductive adhesive or conductive double-sided adhesive tape, the antistatic material and the opaque shield part are electrically connected. Thus, the present invention is also effective in reducing a low frequency current. The noise suppression member (noise suppression sheet, ferrite sintered body) and the antistatic material may be used in combination. For example, the noise suppressing member and the antistatic material can have a laminated structure.

  Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows Embodiment 1 of the transparent shield case which concerns on this invention, its manufacturing method, and a game machine. FIG. 2 is a cross-sectional view taken along the line A-A′-A ″ in FIG. 1 according to the first embodiment. It is a fragmentary sectional view of Embodiment 2 of the present invention. It is a perspective view of Embodiment 3 of the present invention. FIG. 6 is a cross-sectional view taken along the line A-A′-A ″ of FIG. 4 according to the third embodiment. It is an embodiment of the present invention, (A) is a fourth embodiment, (B) is a front sectional view of the fifth embodiment. It is an embodiment of the present invention, (A) is a sixth embodiment, (B) is a perspective view of the seventh embodiment. It is a fragmentary sectional view of Embodiment 8 of the present invention. It is a fragmentary sectional view of reference example 1 of the present invention. It is a fragmentary sectional view of Embodiment 9 of the present invention. It is a fragmentary sectional view of Embodiment 10 of the present invention. It is a fragmentary sectional view of reference example 2 of the present invention. It is a front sectional view of Embodiment 11 of the present invention. It is a front sectional view of Embodiment 12 of the present invention. It is a fragmentary sectional view of Embodiment 13 of the present invention. It is a partial front sectional view of Embodiment 14 of the present invention. FIG. 17 is a cross-sectional view taken along the line B′-B ″ of FIG. 16 according to the fourteenth embodiment. 14 is a noise absorbing member that can be used in Embodiment 14 , wherein (A) is a noise absorbing member having a structure in which a half-cylinder divided body obtained by halving a long cylindrical body having a cross-sectional oval shape, and (B) is a sectional view. A noise-absorbing member having a structure in which a short long cylindrical body obtained by dividing the length of an elliptical long cylindrical body into two parts is connected. (C) is a structure in which a half-cylinder divided body in which a circular cylindrical section is abutted (D) is a perspective view of a noise absorbing member having a structure in which short cylindrical bodies obtained by dividing the axial length of a cylindrical body having a circular cross section into two are connected.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic circuit board 2 Ground wiring 5,26 Screw 6,28 Nut 10 Transparent shield case 11 Opaque shield part 12 Transparent shield part 15 Transparent case part main body 21 Opaque shield layer 22,22a, 22b Transparent shield layer 23a, 23b Transparent binder layer 25 Washer 27 Conductor 30 Opaque shield case 39 Double-sided adhesive tape 40, 40a, 40b Transparent conductive film 41, 41a, 41b Transparent film base 42, 42a, 42b Transparent conductive film 45 Conductive adhesive layer 46 Transparent adhesive layer 50 Small Hole 55 Cooling device 60, 70 Noise suppression member 75 Cable 76 Through hole

Claims (20)

A shield case having a case portion provided with a shield layer on either the inside or outside of the case portion body of the transparent member, is a shield case installed so as to cover at least a part of the electronic circuit board ,
Among the constituent surfaces of the casing part, is provided an opaque shield layer of an opaque shield material is unnecessary portions transparency, is necessary portions transparency transparent shield layer of transparent shielding material, respectively, and the opaque shield A transparent shield case, which is disposed so that a boundary portion of the layer and the transparent shield layer are in contact with each other. A shield case that has a case part provided with a shield layer on both the inside and outside of the case part body of the transparent member, and is installed so as to cover at least a part of the electronic circuit board ,
Among the constituent surfaces of the casing part, is provided an opaque shield layer of an opaque shield material is unnecessary portions transparency, is necessary portions transparency transparent shield layer of transparent shielding material, respectively, and the opaque shield A transparent shield case, which is disposed so that a boundary portion of the layer and the transparent shield layer are in contact with each other. The transparent shield layer of transparent shield material, at least according to claim 1 or 2 transparent shield case according, characterized in that it comprises a layer made of two transparent shielding material. Transparent shield case according to claim 3, characterized in that in contact with the layer comprising the two transparent shielding material at least is not directly contact with each other, an opaque shield layer of each of said opaque shield material. Each of the at least two layers of transparent shield material is in contact with the opaque shield layer of the opaque shield material in an overlapping manner;
Said than the size of the opaque shield layer made of the transparent shield material on the side in contact with the layer, the size layer of the transparent shield material is positioned away from the side in contact with said opaque shield layer, said opaque The transparent shield case according to claim 4 , wherein the transparent shield case increases in size as the distance from the side in contact with the shield layer increases. In the boundary portion, the transparent shield case according to any one of claims 1 to 5, characterized in that the transparent shield layer and the opaque shield layer are bonded via a conductive adhesive layer. The transparent shield case according to claim 1, wherein corner portions of the case portion are not transparent. The transparent shield case according to any one of claims 1 to 7, wherein the portion requiring transparency is formed of only a flat surface. The transparent shield case according to any one of claims 1 to 8 , wherein at least a part of a surface of the case portion provided with the transparent shield layer and the opaque shield layer is subjected to an insulation treatment. The transparent shield layer and the transparent shield case according to any one of claims 1 to 9, characterized in that subjected to at least a portion corrosion treatment of the opaque shield layer provided on the surface of the case portion. The transparent shield case according to any one of claims 1 to 10 , wherein a surface resistance value of a transparent shield portion which is a portion where the transparent shield layer is provided in a constituent surface of the case portion is 450 Ω / □ or less. . At least one or more small holes for heat dissipation are provided in the transparent shield part that is the part provided with the transparent shield layer or the opaque shield part that is the part provided with the opaque shield layer in the constituent surfaces of the case part . transparent shield case according to any one of claims 1 to 11, characterized in that. The transparent shield according to any one of claims 1 to 12 , wherein a noise suppression sheet is provided on at least a part of the opaque shield portion, which is a portion where the opaque shield layer is provided in the constituent surface of the case portion. Case. The transparent sintered body according to any one of claims 1 to 13 , wherein a ferrite sintered body is provided on at least a part of the opaque shield part, which is a part where the opaque shield layer is provided in the constituent surface of the case part. Shield case. The transparent material according to any one of claims 1 to 14, wherein an antistatic material is provided on at least a part of the opaque shield portion, which is a portion where the opaque shield layer is provided, in a constituent surface of the case portion. Shield case. It said portion of the structure surface of the case portion hole through which the cable is provided, the transparent shield case according to any one of claims 1 to 15, characterized in that the noise suppression member is installed around the pores. A gaming machine comprising the transparent shield case according to any one of claims 1 to 16 .   An opaque shield layer is formed on the inner or outer side of the transparent case main body and on a portion where transparency is not required, and then at least the opaque shield layer is formed on the same side on which the opaque shield layer is formed. A method for producing a transparent shield case, wherein a transparent shield layer is formed so as to overlap with an end portion.   A transparent shield layer is formed on the inner side or the outer side of the transparent case main body and on a portion where transparency is required, and then at least the transparent shield layer is formed on the same side on which the transparent shield layer is formed. A method for producing a transparent shield case, wherein an opaque shield layer is formed so as to overlap with an end portion. When forming the opaque shield layer, a mask is applied to a portion requiring transparency, and the mask is removed after forming the opaque shield layer, thereby ensuring transparency of the portion requiring transparency. The method for producing a transparent shield case according to claim 18 or 19 .

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