JP4475399B2 - Cutting tool and manufacturing method thereof - Google Patents

Description

The present invention relates to a cutting tool and a manufacturing method thereof. Specifically, turning, drilling, suitable for various cutting pressurized Engineering Applications such as end milling, and milling, cutting tool having excellent wear resistance, in particular, can greatly suppressed the adhesion of the mating member in contact In addition, the present invention relates to a cutting tool that is excellent in adhesion between a base material and a film, and can thereby ensure excellent wear resistance, and a method for manufacturing the same.

With the sophistication of the required characteristics for industrial products, to improve the wear resistance of various cutting engineering tools are required.

That is, for cutting tools, in order to further improve the cutting efficiency, a tool that can ensure good wear resistance even when cutting at high speed is required. In addition, so-called “High Tens 780 (HT780)” and other “ Without high-strength steels called “materials”, high strength materials such as 13Cr martensitic stainless steel, and difficult-to-cut materials such as austenitic and ferritic stainless steel A tool having an excellent cutting function is required.

In order to cope with such a request, conventionally, carbide, nitride and carbonitride such as Ti and Zr, Al ₂ O _{3 and the} like are used as a hard protective film on the surface of a substrate made of cemented carbide. It is made to form. Specifically, the hard protective film described above is formed as a single layer or multiple layers on the surface of the base material by a chemical vapor deposition method (CVD method) or a physical vapor deposition method (PVD method), with a thickness of several μm to several tens of μm. Forming is performed to suppress wear of the cutting tool and adhesion to the workpiece.

However, conventional hard protective films such as TiN, Ti (C, N), TiAlN, and Al ₂ O ₃ have excellent adhesion and wear resistance at room temperature, but are processed at high speed. When cutting high-strength materials, the contact surface with the material to be cut rises to a high temperature of 1000 ° C or higher, which causes oxidative decomposition and chemical reaction with the material to be cut. End up. As a result, a decrease in wear resistance, adhesion of the workpiece, and the like occur, and the function as the hard protective film is significantly impaired.

  For this reason, the hard protective film is required to have higher oxidation resistance and adhesion than before, and several new techniques have been proposed to meet this demand.

For example, Patent Document 1 discloses a technique for suppressing oxidative decomposition of a hard protective film, in other words, a technique for improving oxidation resistance characteristics by increasing an oxidation start temperature. That is, Patent Document 1 discloses a nitride or carbonitride of one or more elements selected from the group consisting of Group 4a elements, Group 5a elements, Group 6a elements, and Al formed on a substrate. For the purpose of increasing the hardness of the coating in the wear resistant coating as the main component, B ₄ C, BN, TiB ₂ , TiB, TiC, WC, SiC, SiN _x (X = 0.5 to 1.. 33) and a cutting tool containing at least one ultrafine compound selected from the group consisting of Al ₂ O ₃ has been proposed.

  Patent Document 2 discloses a technique for improving the plastic deformability in the vicinity of the surface of a base material (base material) and improving the adhesion with a film. That is, Patent Document 2 describes a coated cemented carbide in which a hard composite layer composed of a hard phase particle and a coating particle of a base material is provided between a cemented carbide base material and a hard coating.

  Specifically, the hard phase particles are tungsten carbide or tungsten carbide and carbides, nitrides and carbonitrides of Group 4a element, Group 5a element and Group 6a metal of the periodic table, and one of these solid solutions. Cubic compound composed of more than seeds, cemented carbide whose binder phase is an iron group metal is used as a base material, and the amount of the binder phase is 2 to 3 to 20 μm from the base material surface to the inside. Selected from the group consisting of hard phase particles of the base material, group 4a elements, group 5a elements, group 6a elements, Al and Si carbides, nitrides and oxides, and their mutual solid solutions. A uniform hard composite layer composed of one or more kinds of compound particles, and further, carbide, nitride and oxide from the group 4a element to Si on the surface of the base material, and mutual solid solutions thereof. One or more compounds selected from Coated cemented carbide coated with a hard film of 0.5~20μm composed of a single layer or a laminate of two or more made of has been proposed.

  Patent Document 3 discloses a high-hardness carbon film having a specific density. The carbon film proposed in Patent Document 3 can improve wear resistance and durability of tools, molds, mechanical parts, and the like, instead of diamond films and diamond-like carbon films.

JP 2001-293601 A JP 2002-38205 A JP 2003-147508 A

The object of the present invention is to greatly suppress the adhesion of the mating material to be contacted, and has excellent adhesion between the base material and the film, thereby ensuring excellent wear resistance, and turning and drilling. is to provide a method of manufacturing a suitable cutting tool to various cutting pressurized Engineering Applications such as end milling, and milling.

If the tool proposed in the above-mentioned Patent Document 1 is used, excellent wear resistance and high lubricity can be secured even in high-speed cutting at 250 m / min, and an effect of suppressing adhesion can be obtained. However, on the base material of the tool, the nitride or carbonitride of the specific element is a main component, and at least one selected from B ₄ C to Al ₂ O ₃ is included therein. It is necessary to provide a film containing a kind of ultrafine compound. For this reason, it is extremely difficult to manufacture on an industrial mass production scale. Furthermore, in the case of this film, when the temperature becomes high, for example, 1000 ° C. or higher at the time of cutting, a compressive stress is generated due to a large linear expansion coefficient, and the adhesion at the interface between the substrate and the film is reduced, and Abrasion may be reduced.

  Next, the coated cemented carbide proposed in Patent Document 2 has a hard composite layer that suppresses plastic deformation of the base material and at the same time enhances the adhesion between the base material and the hard film. Even at extremely high cutting speeds of minutes, excellent wear resistance can be ensured and a long tool life can be obtained. However, this coated cemented carbide first removes the iron group metal that is the binder phase from the surface of the cemented carbide that is the base material, and then covers the hard film described above, and between the hard film and the base material. It is necessary to form the hard composite phase in the range of 3 to 20 μm from the surface of the base material. For this reason, it is very difficult to manufacture on an industrial mass production scale, and the manufacturing cost is increased. Furthermore, also in the case of the said film | membrane, the adhesive force in the interface of a base material and a film | membrane may fall, and abrasion resistance may fall.

  And the technique proposed by patent document 3 is object for the cold processing whose tool use temperature range is 400 degrees C or less. The carbon film has a problem that it reacts with surrounding oxygen in the temperature range exceeding 400 ° C. to generate carbon dioxide gas and does not function as a hard protective film.

In order to solve such problems, the present inventors have used a WC-TiC-Co cemented carbide as an example of a base material, the chemical composition of a hard protective film covering the surface of the base material, and their composition. The film formation method was examined in detail. As a result, the following findings (a) to (e), (g) and (h) were obtained.

  (A) In order to suppress wear and further suppress adhesion of the mating material to be contacted, it is necessary that the film which is a hard protective film has a high oxidative decomposition temperature, and the film is in contact with it. It is necessary to suppress chemical reaction with the counterpart material, particularly liquid phase precipitation.

(B) For example, in the case of Mg ₂ Al ₄ Si ₅ O ₁₈ (cordierite), the composite oxide of Mg, Al, and Si has a melting point that exceeds 2000 ° C. A very stable state can be maintained even at a high temperature of 1200 ° C. or higher at which the tool surface is exposed.

(C) Since the composite oxide of Mg, Al, and Si is thermally stable, it has excellent adhesion to a substrate even when exposed to high temperatures and does not peel off. Among these, in particular, the coefficient of linear expansion of Mg ₂ Al ₄ Si ₅ O ₁₈ is sufficiently smaller than, for example, a cemented carbide that is a base material. Tensile stress is generated, and the adhesion to the substrate is extremely excellent.

  (D) The composite oxide of Mg, Al and Si is suitable as a hard protective film because it is mechanically stable and has excellent thermal shock resistance.

  (E) For example, if the surface of the base material is coated with the composite oxide of Mg, Al and Si as a cutting tool for various steel materials, this oxide is the main material of the steel material to be cut. Since the reactivity with Fe as a component is extremely low, it can exist in a chemically stable state even at high temperatures during high-speed cutting.

  (G) In order to prevent chemical composition fluctuations in the composite oxide of Mg, Al, and Si described above and to apply as a film without impairing the above-described physical properties, for example, a high-purity oxide is sufficient. After being sintered, this is used as a raw material, that is, a film forming source (hereinafter also referred to as “target”), and a film is formed on the surface of the substrate by physical vapor deposition. In other words, the physical properties of a film in which cluster ions excited from the above-described target by physical vapor deposition are deposited on the surface of the substrate are the same as the above-described physical properties of the oxide.

  (H) In physical vapor deposition, precise mass transfer from the target to the film is possible, and further, cluster ions can be miniaturized, and a dense film can be generated directly regardless of the surface irregularity of the substrate. In order to achieve this, it is preferable to employ a physical vapor deposition method in a temperature range of 800 ° C. or less, and it is more preferable to employ a physical vapor deposition method in a temperature range of 100 ° C. or less.

  The present invention has been completed based on the above findings.

Gist of the present invention is a method of manufacturing shown to switching cutting machining tools in the following (1) and shown to switching cutting machining Engineering tools (2), in parallel Beauty (3) and ().

(1) which incorporates a base, Mg, switching cutting machining tool you wherein the thickness of a composite oxide of Al and Si having a film of 0.5~10μm the outermost layer.

(2) Mg, switching cutting machining tool according to (1), wherein the composite oxide of Al and Si are _{Mg 2 Al 4 Si 5 O 18} .

(3) A method for producing the cutting tool according to (1) or (2) above, comprising a composite oxide of Mg, Al and Si in an inert gas atmosphere introduced into a vacuum chamber. the sintered body cluster ions are excited as a raw material, by depositing the cluster ions the excitation, switching you, characterized in that to produce a film of thickness 0.5~10μm the outermost layer of the cutting tool A method for manufacturing a cutting tool.

(4) The sintered body as a raw material is a fine powder made of a composite oxide of Mg, Al and Si having a particle size of 0.4 μm or less and a purity of 97% or more, and 95% or more of the theoretical density switching cutting manufacturing method of machining tools according to the above (3), characterized in that is obtained by sintering.

Note that the composite oxide of Mg, Al, and Si includes, for example, Mg ₃ Si ₄ O ₁₀ (OH) ₂ (steatite), 2MgO · SiO ₂ (forsterite), and Al ₂ O ₃ (alumina). It refers to oxides in the molten state and Mg ₂ Al ₄ Si ₅ O ₁₈ (cordierite).

  The particle size of the powder is the diameter of particles having a particle size distribution of 50% or more. The theoretical density of sintering is the single lattice volume calculated from the lattice constant and the atomic mass contained in the single lattice. The density calculated from

Hereinafter, the (1) and inventions of the switching cutting machining tool (2), the invention according to the manufacturing method of the switching cutting machining tool to the parallel beauty (3) and (4), respectively present invention (1) -This invention (4) . In addition, the present invention may be collectively referred to as the present invention.

The cutting tool of the present invention can largely suppress the adhesion of the mating material to be contacted and has excellent adhesion between the base material and the coating film. It can be used for industrial tools . This cutting tool can be obtained stably and reliably by the method of the present invention.

  Hereinafter, each requirement of the present invention will be described in detail.

(A) Constituent material of outermost layer coating Mg, Al and Si composite oxide has a decomposition temperature as high as 1200 ° C. or higher and is thermally and mechanically stable. It has excellent adhesion to the substrate, does not peel off, and can exhibit stable mechanical properties. Therefore, as a cutting tool for various steel materials, if the surface of the base material is coated with the above composite oxide of Mg, Al and Si, this oxide is used as the main component of the steel material to be cut. Since the reactivity with Fe is extremely low, it can exist in a chemically stable state even at high temperatures during high-speed cutting. Moreover, the film comprising a composite oxide of the above Mg, Al and Si, to the friction coefficient in the sliding portion is extremely small, Ru excellent chemical stability.

Therefore, machining tools switching cutting Ru engagement with the of the present invention (1) is, Mg, and as having a coating comprising a composite oxide of Al and Si. Of the complex oxides of Mg, Al and Si, the above characteristics can be obtained extremely stably and reliably if Mg ₂ Al ₄ Si ₅ O ₁₈ (cordierite) is used as the coating. Accordingly, the engagement Ru switching cutting machining tool to the invention (2) is, Mg, a composite oxide of Al and Si is limited to a _{Mg 2 Al 4 Si 5 O 18} .

(B) Thickness of outermost layer film Even when the outermost layer has a film composed of the composite oxide of Mg, Al and Si described in the above (A), the thickness is less than 0.5 μm. In some cases, sufficient wear resistance may not be obtained. On the other hand, even if the thickness of the outermost layer exceeds 10 μm, the wear resistance is saturated and the cost is increased.

Therefore, the thickness of the of the present invention (1) and the outermost layer of the coating in the engagement Ru switching cutting machining tool to the invention (2), both, was defined as 0.5 to 10 [mu] m. In addition, it is preferable that the film thickness in the said outermost layer shall be 1-5 micrometers.

The reasons described above (A) and (B) section, wherein the engagement Ru switching cutting machining tools in the present invention (1) has a base material in the inner portion, Mg, a composite oxide of Al and Si It was defined that the outermost layer had a film having a thickness of 0.5 to 10 μm. Further, the engagement Ru switching cutting machining tool to the invention (2) is, Mg constituting the film of the outermost layer, it is limited a composite oxide of Al and Si in the _{Mg 2 Al 4 Si 5 O 18} .

  Here, the formation temperature of the film made of the composite oxide of Mg, Al, and Si described in the item (A) is preferably 800 ° C. or less, and more preferably 100 ° C. or less. The temperature may be 15 ° C.

  In addition, according to the required characteristics as a member, for example, cemented carbide such as WC, WC-TiC, WC-TiC-Co, high-speed steel, ceramics, cermet, die steel, Various materials such as steel for molds and Ti alloys can be used.

(C) Formation method of outermost layer coating Various properties of the above-described composite oxide coating of Mg, Al and Si, that is, high decomposition temperature, thermal and mechanical stability, high temperature during high-speed cutting Properties such as chemical stability in the state and extremely small coefficient of friction can be ensured, for example, by forming a film by the physical vapor deposition method described below.

  That is, in an inert gas atmosphere introduced into the vacuum chamber, the cluster ions are excited with the sintered body of the composite oxide of Mg, Al, and Si described above as a target, and the excited cluster ions have a thickness of 0.5. The various characteristics described above are ensured by depositing the film to 10 μm to obtain a film.

Here, the treatment under the inert gas atmosphere introduced into the vacuum chamber is to prevent the excited cluster ions from reacting with oxygen to become a composition different from the desired film composition in advance. This is because the straightness of the cluster ions to the base material is increased by eliminating oxygen having a large atomic radius. In addition, as an inert gas, nitrogen gas, Ar gas, etc. should just be selected suitably according to a target. For example, these gases may be introduced into a vacuum chamber evacuated to 10 ⁻³ Pa or less, and the pressure in the vacuum chamber may be maintained at about 10 ⁻³ Pa.

  When the target sintered body is irradiated with laser light, electron beam, or various ions accelerated at high speed, cluster ions are easily excited, and the cluster ions are thickened on the outermost layer of the coating material (base material). By depositing to a thickness of 0.5 μm or more, a film having desired characteristics can be obtained. The reason why the deposition thickness is 10 μm or less is that the wear resistance is saturated and the cost increases even if the thickness exceeds 10 μm.

Accordingly, the above manufacturing method of the present invention (3) to the switching engaging Ru cutting machining tools, in an inert gas atmosphere which is introduced into the vacuum chamber, Mg, a complex oxide of Al and Si sintered body Was used as a raw material, and the cluster ions were excited, and the excited cluster ions were deposited to form a film having a thickness of 0.5 to 10 μm on the outermost layer.

  In addition, if what is shown below is used for the sintered compact as a target, the various characteristics of an above-described membrane | film | coat can be ensured stably and reliably.

  That is, as a sintered body as a target, a fine powder having a particle size of 0.4 μm or less and a purity of 97% or more sintered at 95% or more with respect to the theoretical density is used. Various characteristics of the film are ensured stably and reliably.

  Here, the particle size is set to 0.4 μm or less because it is possible to reduce the film formation energy by miniaturizing the cluster ions excited from the target. In addition, since the film formation energy becomes so low that ions serving as nuclei during film formation are easily generated, miniaturization of cluster ions is effective.

  Moreover, the reason why the fine powder having a purity of 97% or more is used is to prevent the impurities from being mixed into the film and to express the mechanical and thermal properties of the film by homogenizing the composition as expected. Furthermore, if the sintered material is used at a density of 95% or more with respect to the theoretical density, the target is a material sintered at less than 95% with respect to the theoretical density. This situation occurs because the gas that constitutes the gas atmosphere may thermally expand when irradiated with laser light, electron beams, or various types of accelerated ions for cluster ion excitation, causing cracks or cracks in the target. Is to avoid.

Therefore, the manufacturing method of the the present invention (4) in engagement Ru switching cutting machining tool, the sintered body as a data Getto, with a particle size 0.4μm or less and a purity of 97% or more of Mg, Al and It was defined that a fine powder composed of a complex oxide of Si was sintered at 95% or more of the theoretical density.

  In addition, since it is preferable that the target is obtained by sintering ultra-fine and ultra-pure fine powder at a high density, for example, the particle size is 0.4 μm or less, the purity is 99.9% or more, and the sintering density Is preferably 98% or more.

  For example, if the binder used at the time of granulation is removed in advance by performing a treatment at 400 ° C. for 2 hours and then subjected to a firing treatment at 1500 ° C. for 1.0 hour, it is 95% or more of the theoretical density. Can be sintered.

  Here, the temperature when the film is formed by the physical vapor deposition method described above enables accurate mass transfer from the target to the film, and further enables miniaturization of cluster ions, and is related to the surface unevenness state of the substrate. In order to realize the formation of a dense film directly, a temperature range of 800 ° C. or lower is preferable, and a temperature range of 100 ° C. or lower is more preferable.

  Hereinafter, the present invention will be described in more detail with reference to examples.

WC-TiC-Co cemented carbide with ISO chip size SNMN120408 with a chip size of 12.7 mm in width, 12.7 mm in length and 4.76 mm in thickness is used as a base material, and Mg ₂ Al ₄ Si ₅ O A film of ₁₈ and Al ₂ O ₃ was produced by physical vapor deposition. Details of film formation by physical vapor deposition are as follows.

That is, as a raw material powder of Mg ₂ Al ₄ Si ₅ O ₁₈ , a powder composition product having a purity of 99.7% or more and a particle size of 0.4 mm or less was purchased. For Al ₂ O ₃ , a powder composition having a purity of less than 97% and a particle size of 0.4 mm or less was purchased as a raw material powder. Next, these raw material powders are granulated using polyvinyl alcohol as an organic binder, and a cemented carbide mold is used so that the size after sintering becomes a pellet shape with a diameter of 30 mm and a thickness of 10 mm. And molded under pressure.

The binder removal and firing conditions were such that the sintered density was 95% or more of the theoretical density calculated from the lattice constant of a single lattice by XRD (X-ray diffraction pattern) measurement. Specifically, the firing for Mg ₂ Al ₄ Si ₅ O ₁₈ and the firing for Al ₂ O ₃ were both performed in the atmosphere at 1500 ° C. for 1.0 hour.

Using a ceramic sintered body having a diameter of 30 mm and a thickness of 10 mm obtained as described above as a target, a WC-TiC-Co cemented carbide as a base material is coated with Mg ₂ Al ₄ Si by laser deposition. A film of ₅ O ₁₈ and Al ₂ O ₃ was produced.

  That is, as schematically shown in FIG. 1, the substrate 1 was placed on the turntable 4 on the substrate film-forming stage 5 provided inside the sealed chamber 3. In addition, after wash | cleaning the base material 1 beforehand with a pure water and ethanol, it fully dried and 20 units | sets were mounted on the turntable 4 so that the rake face side of a chip | tip might turn up.

Next, evacuation was performed until the pressure in the chamber 3 became 10 ⁻³ Pa, and then an inert gas was introduced into the chamber ³ to keep the inside of the chamber at 10 ⁻³ Pa. Note that the inert gas was nitrogen gas in both cases where Mg ₂ Al ₄ Si ₅ O ₁₈ was used as the target 2 and Al ₂ O ₃ was used.

  Next, the laser beam 7 was applied to the target 2 from the laser device 6 to excite the cluster ions 8, and the excited cluster ions 8 were deposited on the substrate 1 to form a film having a thickness of 5 μm.

  The output of the laser device 6 was controlled to about 500 W, and YAG laser light with an oscillation wavelength of 266 nm was applied.

Throughout the treatment by the laser deposition method, the temperature in the chamber 3 was 20 ° C. when Mg ₂ Al ₄ Si ₅ O ₁₈ having a purity of 99.7% or more was used as the raw material powder of the target 2. Further, the temperature in the chamber 3 was 500 ° C. when Al ₂ O ₃ having a purity of less than 97% was used as the raw material powder of the target 2.

In addition, an Al ₂ O ₃ film having a thickness of 5 μm at 1000 ° C. by an ordinary chemical vapor deposition method has a width of 12.7 mm, a length of 12.7 mm and a thickness of 4.76 mm. It was produced on a substrate made of WC-TiC-Co cemented carbide with chip dimensions.

  On the other hand, a commercially available cemented carbide cutting tool (ISO model SNMN120408, a chip having a width of 12.7 mm, a length of 12.7 mm and a thickness of 4.76 mm) provided with a TiN film by chemical vapor deposition was purchased.

  The adhesion was evaluated for each of the above films. In addition, a turning test was performed using a tip provided with each of the above-mentioned coatings, and the amount of wear and the state of adhesion of the workpiece were investigated.

  The adhesion of the film was investigated by a normal scratch method. That is, a 2.0 μm diameter needle was brought into contact with the surface of the film, and a scratch test was performed by load sweeping of 0 to 100 N to investigate the presence or absence of a signal indicating a decrease in adhesion.

  The turning test was performed under the following conditions using a round bar having a chemical composition shown in Table 1 and a diameter of 100 mm and a Vickers hardness (HV) of 250 as a test material.

Feed amount: 0.1 mm / rev,
Cutting depth: 1.5 mm,
Cutting speed: 200 m / min,
Cutting time: 3 minutes
Lubrication: Dry (no lubrication).
After performing the above-described cutting test, the average wear amount of the tip flank was measured using an optical microscope.

  Table 2 shows the results of the above tests.

  Of the chips after the cutting test, adhesion of the work material was observed on a commercially available chip provided with a TiN film by chemical vapor deposition.

  Then, the chip | tip surface was observed in detail next using SEM (scanning electron microscope).

  As a result, it was found that the TiN film was peeled off on the commercially available chip provided with the TiN film in addition to adhesion to the chip surface. On the other hand, no adhesion was observed on the other chip surfaces.

  In FIG. 2, the SEM photograph of the adhesion mark vicinity in the commercially available chip | tip which provided the TiN film | membrane is shown.

  Next, the observation region corresponding to the SEM photograph was analyzed by EDS (energy dispersive X-ray analyzer). As a result, Fe was detected, and it became clear that the main component of the adherend was derived from the workpiece. In addition, as a result of the EDS mapping analysis of the Fe—Kα line, the Fe detection location and the adhesion mark completely coincided.

  FIG. 3 and FIG. 4 show the EDS mapping image of the Fe—Kα line in the observation region corresponding to the SEM photograph of FIG. 2 and the EDS analysis result of the adherend, respectively. Moreover, the observation result of the presence or absence of the adhesion is also shown in Table 2.

  From Table 2, it is clear that the chip having the coating according to the present invention has excellent adhesion and wear resistance.

  That is, in the case of the chip having the film according to the present invention of Test No. 1, no signal for decreasing the adhesion force is detected even at a load of 100 N, and it is clear that the film has good adhesion.

On the other hand, in the case of a chip having an Al ₂ O ₃ film produced at 500 ° C. by a physical vapor deposition method of test number 2 and a commercially available chip provided with a TiN film of test number 4, a signal for decreasing the adhesion force Is observed at 80 N, and in the case of a chip having an Al ₂ O ₃ film produced at 1000 ° C. by the usual chemical vapor deposition method of test number 3, a signal of lowering adhesion is observed at 50 N, both of which are The adhesion was inferior.

The wear amount of the chip having the coating according to the present invention of test number 1 is as small as 1 μm, whereas that of the chip having the Al ₂ O ₃ film formed at 500 ° C. by the physical vapor deposition method of test number 2 In the case of a chip having an Al ₂ O ₃ film formed at 1000 ° C. by a normal chemical vapor deposition method of test number 3 and a large chip of 10 μm, and in the case of a commercially available chip provided with a TiN film of test number 4 It was very large at 15 μm. Note that the base (base material) was completely exposed in any of Test No. 2, Test No. 3 and Test No. 4.

The cutting tool of the present invention can largely suppress the adhesion of the mating material to be contacted and has excellent adhesion between the base material and the coating film. It can be used for industrial tools . This cutting tool can be obtained stably and reliably by the method of the present invention.

It is a figure explaining the film-forming method by the laser deposition method. It is a figure which shows the SEM photograph of the adhesion mark vicinity in the commercially available chip | tip which provided the TiN film | membrane. It is a figure which shows the EDS mapping image of the Fe-K alpha ray of the observation area corresponding to the SEM photograph of FIG. It is a figure which shows the EDS analysis result of the adhesion thing of the observation area | region corresponding to the SEM photograph of FIG.

Explanation of symbols

1: base material,
2: Target,
3: chamber,
4: Turntable,
5: Base film forming stage,
6: Laser device
7: Laser light
8: Cluster ion

Claims (4)

Which incorporates a base, Mg, for cutting engineering tools, wherein a thickness of a composite oxide of Al and Si having a film of 0.5~10μm the outermost layer. Mg, for cutting Engineering tool according to claim 1, wherein the composite oxide of Al and Si are _{Mg 2 Al 4 Si 5 O 18} . A method of manufacturing a cutting for engineering tool according to claim 1 or 2, in an inert gas atmosphere introduced into the vacuum chamber, Mg, a sintered body composed of a composite oxide of Al and Si as raw materials the cluster ions are excited, by depositing the cluster ions the excitation method of cutting for engineering tools, characterized in that to produce a film of thickness 0.5~10μm the outermost layer of the cutting tool. A sintered body as a raw material is sintered with a fine powder composed of a composite oxide of Mg, Al, and Si having a particle size of 0.4 μm or less and a purity of 97% or more at a theoretical density of 95% or more. method for producing a cutting for engineering tool according to claim 3, characterized in that the.

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