JP4469308B2 - LED lighting device - Google Patents

Description

  The present invention relates to an LED lighting device capable of variable light distribution control in which an LED light source, a mounting substrate, and a reflecting surface are integrated. In particular, the circuit can be easily manufactured, and the heat generated by the LED is effective. It relates to what can dissipate heat.

  In recent years, LEDs (light-emitting diodes) with characteristics such as low power consumption and long life have been expected to be used as light sources for lighting fixtures due to their higher brightness, and various technologies have been developed to meet these expectations. Yes.

  As an example of such a technique, a substrate having a plurality of LEDs arranged on one surface and a resin case having a bottom to which the substrate is attached, the substrate is attached to the bottom via a heat dissipation fixing plate. LED lighting device comprising: a LED lighting device in which a concave portion is formed on the surface of the heat radiation fixing plate facing the surface on which the substrate is mounted so as to increase the contact area with the bottom of the resin case (for example, (See Patent Document 1).

  According to this technique, the heat generated in the LED is effectively transmitted to the resin case via the heat radiation fixing plate, and is radiated from the outer surface of the resin case to the outside air. For this reason, deterioration of the LED element due to heat generation can be prevented.

  However, in this LED lighting device, an LED package member, a heat radiation fixing plate, and a resin case are interposed between an LED element that is a heat generation source and outside air that is a heat radiation destination. That is, the distance from the LED element to the outside air is long. For this reason, a so-called power LED that emits a high heat of about 150 to 200 ° C. at the maximum when it is turned on can be turned on for a long time. In such a case, the heat generated by the LED element with the passage of time is confined to the bottom of the resin case and cannot be radiated well, which may cause the LED element to deteriorate.

  In the LED lighting device described above, a plurality of LEDs are arranged on the upper surface (front side) of the substrate to form an illumination unit. In such an illumination unit, the substrate is mounted on the substrate according to the shape of the LED to be mounted. Complicated processing such as through-hole processing and double-sided conductive circuits is required. For this reason, in such an illumination unit, the production of the conductive circuit becomes complicated, and there is a problem that it is difficult to efficiently manufacture the LED illumination device.

On the other hand, in each lighting field such as automobile lighting, store lighting, and crime prevention lighting, in addition to the demand for low power and long life, variable light distribution lighting that can change the irradiation position according to the external situation and environment is required. Yes. Therefore, when the LED lighting device described above is provided with a reflection surface on the inner surface of the resin case and the irradiation range is changed by deforming the resin case in order to correspond to the variable light distribution, the LED passes through the heat radiation fixing plate. Since the LED lighting device is fixed to the bottom of the resin case, it is difficult to control the light distribution accompanying the movement of the focal point as in the case of a single light source such as a halogen bulb, and is not suitable for variable light distribution lighting. There was a problem.
JP 2002-299700 A

  Therefore, the main problems of the present invention are light weight and high accuracy, high illuminance efficiency, easy variable control of light distribution by external stress, excellent heat dissipation, and high degree of freedom in light distribution design. It is another object of the present invention to provide an LED lighting device that can easily produce a circuit.

The invention described in claim 1 is “a substrate body 14 formed of a thermoplastic heat-resistant film in a predetermined three-dimensional shape, and a plurality of surface-mounted LEDs 12 attached at predetermined positions of the substrate body 14; An LED lighting device including a reflective surface 16 that is provided on the surface of the substrate body 14 and reflects light emitted from the LED 12, and a conductive circuit 18 that is provided on the back surface of the substrate body 14 and connects the LED 12 to an external circuit to light the LED 12. 10 and the substrate body 14 is provided with an opening 26 having a size substantially the same as the light emitting area L on the surface of the LED 12 so that the opening 26 and the light emitting area L on the surface of the LED 12 coincide with each other. the main body 14 rear face surface side of the LED12 is fixed to Rutotomoni, the substrate main body 14 including the movable portion as mounting portion of the plurality of LED12 in the substrate main body 14 are separated from each other all the An LED lighting apparatus 10, characterized in that it is arranged "on.

  In the present invention, a heat-resistant film having thermoplasticity is formed into a predetermined three-dimensional shape reflecting the target irradiation range as a whole to form the substrate body 14 and the reflecting surface 16 that reflects light on the surface thereof. Therefore, by changing the shape of the substrate body 14 using an external signal or stress, it is possible to easily change the light distribution of the light emitted from the LED 12 and to focus on the target irradiation range. it can. That is, the light distribution of the light emitted from the LED 12 can be variably controlled and the illuminance efficiency can be improved.

In addition, since the plurality of LEDs 12 are arranged on the entire surface of the substrate body 14 including the movable part so as to be separated from each other , the substrate 12 is changed from the original shape so that the LEDs 12 are changed. When the light distribution of the emitted light is changed, each LED 12 can irradiate the corresponding range, and the focus of the light is not blurred as in the case of a single light source, preventing a decrease in illuminance when the light distribution changes can do.

  It should be noted that the substrate body 14 is provided with an opening 26 having a size substantially equal to the light emitting region L of the surface-mounted LED 12, and the opening 26 and the light emitting region L on the surface of the LED 12 coincide with each other. Thus, the front surface (that is, the light exit surface) side of the LED 12 is fixed to the back surface side (that is, the outer surface side) of the substrate body 14. Thus, by disposing both the LED 12 and the conductive circuit 18 on the back side of the substrate body 14, complicated processing such as through-hole processing or double-sided conductive circuit 18 is not necessary when manufacturing the conductive circuit 18. Circuit fabrication can be simplified.

  Further, with this configuration, the heat generated in the LED 12 can be immediately radiated into the outside air without any resistance, and the temperature rise of the LED 12 can be suppressed extremely efficiently.

  The invention described in claim 2 is characterized in that, in the LED lighting device 10 according to claim 1, "the heat-resistant film is an aromatic polyimide film". It is possible to obtain the substrate body 14 that is easy to mount and has high shape accuracy.

  The invention described in claim 3 is the LED lighting device 10 according to claim 1 or 2, wherein “the LED 12 mounting portion of the substrate body 14 includes a partial recess surrounding the light emitting region L of the LED 12 in order to increase reflection efficiency. 28 ”is provided, which makes it possible to more effectively reflect the light emitted from the LED 12 and condense it in the target irradiation range.

  According to a fourth aspect of the present invention, in the LED lighting device 10 according to the first to third aspects of the present invention, “a stress formed in a bent structure such as slits 32 a and 32 d and grooves 32 b and 32 c on at least a part of the substrate body 14. The absorption part 32 is provided ".

  In this invention, since the stress absorption part 32 which consists of bending structures, such as slit 32a, 32d and groove | channel 32b, 32c, is provided in at least one part of the board | substrate body 14, external stress is given to the LED lighting apparatus 10, and primary shape is given. When controlling deformation from a predetermined shape to a secondary or subsequent shape, the LED lighting device 10 can be deformed into a predetermined shape without distortion. For this reason, the light distribution accuracy of the LED lighting apparatus 10 in the secondary and subsequent shapes can be further improved.

  According to the present invention, a thermoplastic heat-resistant film is formed into a predetermined three-dimensional shape reflecting the target irradiation range as a whole to form a substrate body, and a reflective surface is provided on the surface thereof, and the back surface thereof is provided. In addition to the effect of increasing the reflection efficiency (that is, the illuminance efficiency) in the primary shape, the LED lighting device is configured by changing the shape of the substrate body using external stress or the like. The light distribution of the emitted light can be variably controlled, and the illuminance efficiency in the secondary and subsequent shapes can be improved by the reflecting surface formed in a three-dimensional shape.

In addition, since the plurality of LEDs are disposed on the entire surface of the substrate body including the movable part so as to be separated from each other, the light distribution of the light emitted from the LEDs by changing the shape of the substrate body is provided. Even if it changes, since each LED irradiates the range which each respond | corresponds, there is no illumination fall at the time of a light distribution change, and effective light distribution can be implement | achieved.

  In particular, an opening having a size substantially equal to the light emitting area of the surface-mounted LED is provided in the LED mounting portion of the substrate body, and the LED is attached to the back side of the opening. In this case, complicated processing such as through-hole processing and double-sided conductive circuit is not required, and circuit fabrication can be simplified, and heat generated by the LED can be immediately radiated to the outside air. Therefore, it is possible to prevent the light emission efficiency or luminance from being lowered and the deterioration of the LED.

  Therefore, it is lightweight and highly accurate, has high illuminance efficiency, can easily variably control the light distribution with external stress, has excellent heat dissipation, and has a high degree of freedom in light distribution design and can easily produce a circuit. A possible LED lighting device can be provided.

  The present invention will be described below with reference to the drawings. 1 and 2, an LED illumination device 10 according to an embodiment of the present invention emits a plurality of surface-mounted LEDs 12 mounted as a light source and emits the light toward a predetermined irradiation range. In addition to the LED 12, the substrate body 14, the reflecting surface 16, and the conductive circuit 18 are included.

  The surface-mounted LED 12 is a light source that emits white light. As shown in FIG. 3, the surface-mounted LED 12 is housed in a rectangular package member 12a made of ceramic or the like and having a recess at the center of the surface, and a recess in the package member 12a. LED element 12b and a pair of lead frames 12c electrically connected to LED element 12b. This LED 12 is a flat top type in which the LED element 12b mounting portion (that is, the concave portion at the center of the surface of the package member 12a) is covered with a transparent resin 20 made of epoxy resin or the like, and the portion covered with the transparent resin 20 emits light. This is a region L. Further, on the back surface of the LED 12, a heat radiating plate made of a material having good thermal conductivity (for example, metal or ceramic) so that heat generated by the LED element 12b when it is lit can be quickly dissipated into the outside air. 22 is attached.

  Here, as a method for causing the LED 12 to emit white light, a blue LED is used as the LED element 12b, and a YAG (yttrium, aluminum, garnet) fluorescent material is disposed on the inner surface of the recess of the package member 12a or the transparent resin 20. A method of converting blue light emitted from the LED element 12b into white light, a method of using a 2in1 type LED element 12b in which two light emitting elements of blue and amber are arranged in parallel, or three of red, green and blue For example, a method using a 3 in 1 type LED element 12b in which light emitting elements are arranged in parallel may be used.

  Further, the LED 12 is fixed to the back surface side (outer surface side) of the LED 12 mounting portion of the substrate body 14 to be described later via an adhesive 24 made of a heat-resistant resin such as a silicon resin. At this time, it is preferable to reduce the thickness of the layer formed by the adhesive 24 as much as possible. However, when the layer cannot be thin due to problems such as adhesive strength, a white pigment or filler is added to the adhesive 24. Is preferred. By doing so, it is possible to prevent light emitted from the LED 12 from leaking out to the back side of the substrate body 14 via the adhesive 24 layer.

  In addition, when using the LED lighting apparatus 10 of this invention for the illumination which requires high-intensity light, such as indoor main lighting and a headlight of a motor vehicle, it is suitable to use what is called power LED as LED12.

  The substrate body 14 is made of a heat-resistant film having thermoplasticity, maintains the form of the LED lighting device 10, and has a predetermined three-dimensional shape so that light emitted from the mounted LED 12 is irradiated toward a predetermined irradiation range. It is a molded product.

  Examples of the material of the heat-resistant film constituting the substrate body 14 include polyimide, polyamide, polyphenylene sulfide, and liquid crystal polymer, and it is particularly preferable to use a polyimide film. Thus, by using the polyimide film excellent in heat resistance as the substrate body 14, it is easy to mount the LED 12 with excellent solder heat resistance, and the substrate body 14 with high shape accuracy can be obtained. Moreover, even if it is a case where power LED which emits about 150-200 degreeC heat at the maximum is used as LED12 mounted, there is no fear that the board | substrate body 14 deform | transforms with the heat | fever which LED12 emits.

  Furthermore, a thermoplastic aromatic polyimide film is preferable in order to obtain a molded shape for improving the illuminance efficiency, that is, a predetermined three-dimensional shape with high accuracy.

  Aromatic polyimide is a condensate of aromatic tetracarboxylic acid and aliphatic or aromatic diamine, typically tetracarboxylic dianhydrides such as pyromellitic dianhydride and biphenyltetracarboxylic dianhydride. And a diamine such as paraphenylenediamine and diaminodiphenyl ether to produce an amic acid, which is obtained by ring-closing curing with heat or a catalyst. The thermoplastic polyimide can be obtained, for example, by copolymerizing the following compounds.

  Examples of dicarboxylic acid anhydrides include pyromellitic dianhydride, 4,4′-oxydiphthalic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′biphenyltetracarboxylic dianhydride, 2,2′-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride Bis (3,4-dicarboxyphenyl) sulfone dianhydride, bis (3,4-dicarboxyphenyl) sulfide dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3 , 4-dicarboxyphenyl) methane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) methane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) propan Anhydride, 2,2-bis (3,4-carboxyphenyl) propane dianhydride, m- phenylene bis (trimellitic acid) may be mentioned dianhydrides like.

  Examples of diamines include hexamethylenediamine, heptamethylenediamine, 3,3′-dimethylpentamethylenediamine, 3-methylhexamethylenediamine, 3-methylheptamethylenediamine, 2,5-dimethylhexamethylenediamine, octamethylenediamine, and nona. Methylenediamine, 1,1,6,6-tetramethylhexamethylenediamine, 2,2,5,5-tetramethylhexamethylenediamine, 4,4-dimethylheptamethylenediamine, decamethylenediamine, m-phenylenediamine, 4 , 4′-diaminobenzophenone, 4-aminophenyl-3-aminobenzoate, m-aminobenzoyl-p-aminoanilide, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, bis (4-aminophenyl) Nyl) methane, 1,1-bis (4-aminophenyl) ethane, 2,2-bis (4-aminophenyl) propane, 2,2′-bis [4- (4-aminophenoxy) phenyl)] propane, 4,4′-diaminodiphenyl sulfoxide, 3,3′-diaminobenzophenone, 1,3-bis (4-aminophenoxy) benzene, 2,2′-diaminozenzophenone, 1,2-bis (4-aminophenoxy) ) Benzene, 1,3-bis (4-aminobenzoyloxy) benzene, 4,4′-dibenzanilide, 4,4′-bis (4-aminophenoxy) phenyl ether, 2,2′-bis (4-aminophenyl) Hexafluoropropane, 2,2′-bis (4-aminophenyl) -1,3-dichloro-1, 1,3,3-hexafluoropropane, 4,4′- Diaminodiphenyl sulfone, 1,12-diamino-dodecane, 1,13-diamino dodecane, etc. polysiloxane diamine.

  Among the above compounds, the thermoplastic polyimide used in the present invention includes 1,3-bis (4-aminophenoxy) benzene (abbreviated as RODA), pyromellitic dianhydride (abbreviated as PMDA) and 4, Copolymer of 4′-oxydiphthalic dianhydride (ODPA), 4,4′-diaminodiphenyl ether (abbreviated as ODA) and 3,3′4,4′-biphenyltetracarboxylic dianhydride (abbreviated as BPDA) Copolymer with ODA, PMDA and BPDA, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and PMDA with 2,2′-bis [4- A copolymer with (4-aminophenoxy) phenyl)] propane (abbreviated as BAPP) is particularly preferable.

  The thermoplastic polyimide is softened by heating. In the present invention, the glass transition temperature is preferably 200 to 350 ° C., more preferably 210 to 320 ° C. from the viewpoint of solder heat resistance during LED mounting. More preferably, it is a thing of 250 to 310 degreeC. The thermoplastic polyimide preferably has a breaking elongation at the glass transition temperature of 100 to 700%, and more preferably 150 to 400%.

  The thickness of the film formed of the material as described above and formed on the substrate body 14 is preferably 12.5 to 175 μm, more preferably 25 to 130 μm from the viewpoints of flexibility and heat dissipation. Moreover, it is preferable that the thermal expansion coefficient of a film is 5-60 ppm / degrees C in the location where the wiring after shaping | molding exists.

  Examples of a method for forming the substrate body 14 using such a thermoplastic heat-resistant film include a vacuum forming method and a press forming method. However, the method is not particularly limited as long as the method does not cause cracks or wrinkles. is not.

  In addition, the shape (three-dimensional shape) of the substrate main body 14 reflects the primary light distribution design for the purpose of illumination in addition to the bowl shape or bowl shape shown in FIGS. In consideration of the secondary and subsequent light distribution at the time of light distribution change, any shape can be used as long as the above-mentioned thermoplastic / heat-resistant film follows without tearing during molding. May be.

  A plurality of apertures 26 having substantially the same size as the light emitting region L of the LED 12 described above are provided in a predetermined position of the substrate body 14 formed in the shape as described above, and this portion is an LED 12 mounting portion. It has become. Here, as shown in FIG. 3, the shape of the opening 26 provided in the substrate main body 14 is changed from the back side where the conductive circuit 18 is provided toward the front side where the reflective surface 16 is provided. It is preferable to form in a taper shape so that an internal diameter may expand. By doing so, the light emitted from the LED 12 can be reflected even on the peripheral wall surface of the opening 26 and can be more effectively condensed to the target irradiation range.

  Further, for example, as shown in FIG. 1, the LED 12 mounting portions are preferably disposed on the entire surface of the substrate body 14 such that the LED 12 mounting portions are separated from each other at substantially equal intervals. In this way, when the light distribution of the light emitted by the LEDs 12 is changed by changing the substrate body 14 from the original shape, each LED 12 can irradiate the corresponding range, and light can be emitted as in the case of a single light source. This is because the focal point of the light is not blurred, and a decrease in illuminance when the light distribution changes can be prevented.

  Further, with respect to the locally molded shape of the LED 12 mounting portion, as shown in FIG. 4, a concave portion 28 having a sufficiently deep wall surface is formed to increase the reflection efficiency of light emitted from the LED 12. You may make it do.

  As shown in FIGS. 1 and 2, a pair of slits 32a designed so as not to cut the wiring of the LED 12 mounting portion from the central portion of the substrate body 14 toward the outer edge portion 30, and the slits 32a One or a plurality of (two in FIG. 1 and FIG. 2) stress absorbing portions 32 having a bent structure having a groove 32b connecting the tips are provided, and stress is applied to the substrate body 14 from the outside. In this case, one LED 12 mounting portion may be displaced without distortion independently of other LED 12 mounting portions. Here, when the slit 32a is provided, a concave groove is formed in the slit 32a forming portion, and then, if the bottom of the concave groove is slit, the separated concave groove becomes the flange 34, and the shape of the slit 32a forming portion is formed. It will be useful for retention.

  The stress absorbing portion 32 is not limited to the slit 32a and the groove 32b described above. For example, when the primary shape of the substrate body 14 is formed in a curved plate shape as shown in FIG. Only the two grooves 32 c provided so as to be parallel to each other in the width direction can be used as the stress absorbing portion 32. In addition to this, as shown in FIG. 6, a single slit 32 d is provided in a direction substantially orthogonal to the groove 32 c so as not to cut the wiring of the LED 12 mounting portion. You can also. That is, the stress absorption part 32 can displace some LED12 mounting parts in the board main body 14 without distortion independently of other LED12 mounting parts when stress is applied from the outside, and the entire board main body 14 is distorted. As long as it can be deformed into a predetermined shape without any limitation, its shape and arrangement position may be arbitrary.

  In addition to such a stress absorbing portion 32, the substrate body 14 is partially reinforced at the LED 12 mounting portion and the edge portion of the substrate body 14 and the connection portion with the outside to facilitate displacement control. Therefore, a separately prepared resin molded product or a metal plate may be attached.

  Further, in place of the grooves 32b and 32c described above, a pair of auxiliary plates (not shown) adjacent to the bent portion of the substrate main body 14 corresponding to the bent portion of the stress absorbing portion 26 along the bent portion. Alternatively, the substrate body 14 around the bent portion may be formed thick. By doing so, the rigidity around the bent portion in the substrate body 14 can be improved, and only the bent portion can be smoothly swung.

  Moreover, it is preferable that the outer edge portion 30 of the substrate body 14 is previously formed with a shape such as a flange or a folded portion so as to be convenient when the LED lighting device 10 is attached to a lighting fixture.

  The reflection surface 16 is a surface formed by coating a reflection material on the irradiation side surface of the substrate body 14 in order to increase the reflection efficiency of light emitted from the LED 12.

  As a composition of the reflecting material constituting the reflecting surface 16 and a method of forming the reflecting material, a metal such as aluminum or silver is coated by vapor deposition or plating, a dielectric is vapor-deposited in multiple layers, or a reflection or color rendering property is achieved. Examples include excellent resin and paint coatings. That is, the composition of the reflecting material constituting the reflecting surface 16 and the method for forming the reflecting surface 16 are not particularly limited as long as the reflectance is improved as compared with the raw polyimide film in accordance with the purpose of illumination.

  In addition, the range in which the reflective surface 16 is provided by coating the reflective material can be divided on the substrate body 14 according to the purpose of illumination, and two or more kinds of different types of coatings can be applied. In addition, a coating that does not contribute to the reflection is applied to a molding part that does not contribute to the lighting effect, a molding part that is generated depending on a product design purpose, a mounting part, or a molding part that is generated due to a shape requirement on an external electrical connection. Or conversely, no coating may be applied. Furthermore, it goes without saying that a protective film can be coated for the purpose of preventing oxidative deterioration and scratching of the coating material.

  The conductive circuit 18 is a circuit that is provided on the back surface of the substrate body 14 and lights the LED 12 by connecting the LED 12 and an external circuit (not shown).

  The conductive circuit 18 is preferably formed after the substrate body 14 is formed into a predetermined three-dimensional shape in order to prevent oxidative deterioration of the conductor during the formation of the substrate body 14 and the generation of cracks due to stress. Alternatively, after a wiring process is performed in advance on a heat-resistant film having thermoplasticity, the substrate body 14 provided with the conductive circuit 18 may be obtained by forming the wiring.

  The conductive circuit 18 is manufactured using a subtractive method, a semi-additive method, a full additive method, using a method in which metal deposition is performed after the substrate body 14 is formed and electroplating is performed later, or a method in which electroless plating is performed after forming. Either of these methods may be used, or a method of obtaining a circuit pattern by removing unnecessary conductor portions using laser processing may be used. Furthermore, a method of transferring a circuit made of a metal foil through an adhesive may be used, or a method of drawing a circuit using a conductive paste may be used.

  When the conductive circuit 18 is formed by these methods, the conductor metal is preferably made of copper. However, when the conductive paste is used, a silver paste may be used. For example, solder, It goes without saying that different metals and alloys such as tin, gold and nickel can be plated. In addition, when vapor deposition is used, it goes without saying that a metal such as chromium or nickel can be vapor-deposited in order to increase the adhesion between the substrate body 14 and the metal or prevent oxidation.

  In order to protect the conductive circuit 18, it is preferable to apply a resist ink on the surface of the circuit 18 or adhere a cover film formed in the same shape as the substrate body 14 in order to improve reliability. The material of the cover film is preferably a heat-resistant film having the same kind of thermoplasticity as that of the substrate body 14, for example, a polyimide film, when heat resistance is required depending on the order of the manufacturing process, but is not limited thereto. . Note that the position of the terminal of the conductive circuit 18 connected to an external circuit (not shown) is not limited.

  Next, when manufacturing the LED lighting device 10 of the present invention, first, the reflecting surface 16 and the conductive circuit 18 are formed on the substrate body 14. Subsequently, the adhesive 24 is applied to the peripheral portion on the surface side of the LED 12. At this time, care is taken so that the adhesive 24 does not adhere to the light emitting region L. Then, it positions so that the opening 26 and the light emission area | region L of LED12 may correspond, and the surface of LED12 which apply | coated the adhesive agent 24 to the back surface of the board | substrate body 14 is pressed, and both are fixed. Then, the lead frame 12c bent so as to face the surface side of the LED 12 (that is, the conductive circuit 18 side) and the conductive circuit 18 are electrically connected by solder 36 or the like, thereby completing the LED lighting device 10 of the present invention. To do.

  When the completed LED lighting device 10 is used, an external circuit (not shown) having a power source is connected to the conductive circuit 18, and power is supplied to the LED 12 through these circuits. Lights up.

  According to the LED lighting device 10 of the present invention configured as described above, the substrate main body 14 is formed by molding a thermoplastic heat-resistant film into a predetermined three-dimensional shape reflecting the target irradiation range as a whole. In addition, since the reflective surface 16 that reflects light is provided on the surface on which the LED 12 that is a light source is mounted, the light distribution is changed by changing the shape of the substrate body 14 using an external signal or stress. The light can be easily changed, and the light emitted from the LED 12 can be sufficiently reflected without being leaked, so that the light can be collected in a target irradiation range. That is, the light distribution of the light emitted from the LED 12 can be variably controlled and the illuminance efficiency can be improved.

  In addition, since the plurality of LEDs 12 are arranged on the surface of the substrate body 14, when the light distribution of the light emitted from the LEDs 12 is changed by changing the substrate body 14 from the original shape, each LED 12 Each of the corresponding ranges can be irradiated, and the focal point of the light is not blurred as in the case of a single light source, and a desired light distribution can be obtained without a decrease in illuminance when the light distribution changes.

  In particular, the substrate body 14 is provided with an opening 26 having a size substantially equal to that of the light emitting region L of the surface-mounted LED 12, and the substrate 26 is configured such that the opening 26 and the light emitting region L on the surface of the LED 12 coincide. Since the front surface side of the LED 12 is fixed to the back surface side (that is, the outer surface side) of the main body 14, the heat generated by the LED 12 can be immediately radiated to the outside air without any resistance, and the temperature rise of the LED 12 is extremely high. It can be suppressed efficiently. In addition, by arranging the LED 12 and the conductive circuit 18 on the back side of the substrate body 14 in this way, complicated processing such as through-hole processing or double-sided conductive circuit 18 is not required when the conductive circuit 18 is manufactured. Circuit fabrication can be simplified.

  Furthermore, since the back surface of the substrate body 14 is provided with a conductive circuit 18 that is connected to an external circuit and turns on the LED 12, the LED lighting device 10 can be made thin and excellent in heat dissipation. it can.

  When the stress absorbing portion 32 is provided in the vicinity of a part of the LED 12 mounted on the substrate body 14, external deformation is applied to the LED lighting device 10 to control deformation from a primary shape to a predetermined secondary shape or later. In this case, the LED lighting device 10 can be deformed into a predetermined shape without distortion. For this reason, the light distribution accuracy of the LED lighting apparatus 10 in the secondary and subsequent shapes can be further improved.

  In the above-described example (embodiment), the reflective surface 16 is coated with a protective film to protect the reflective surface 16, and resist ink is applied to or covered with the conductive circuit 18 to protect the conductive circuit 18. Although the bonding of the film has been described, the entire surface of the LED lighting device 10 may be protected by the following method instead of these methods. That is, a transparent resin solution made of a fluorine resin or an epoxy resin is applied to the entire surface of the completed LED lighting device 10 by a known method such as dipping, and this is dried to be transparent on the entire surface of the LED lighting device 10. A thin resin thin film may be formed. According to such a method, the protective film can be simultaneously formed on both surfaces of the substrate body 14 in one step. That is, a protective film can be formed on the entire LED lighting device 10 efficiently and economically. Further, by using a transparent resin solution made of a fluororesin in particular, it is possible to prevent the reflective material from being oxidized and scratched on the reflective surface 16, and the resin thin film is covered in the conductive circuit 18 formation portion. By functioning as a film, the insulation and reliability of the conductive circuit 18 can be improved, and at the same time, antifouling can be imparted to the entire surface of the LED lighting device 10.

  In the above example, the case where a flat top type LED 12 is used as the surface mount type LED 12 is shown. However, as shown in FIG. 7, a so-called lens top type in which a lens portion 38 is formed on the surface of the light emitting region L. The LED 12 may be used. In addition, since such a lens top type LED 12 generally has high light directivity, the opening 26 provided in the substrate body 14 may be straight with uniform inner diameters on the front and back sides.

  EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, the technical scope of this invention is not limited to this Example.

  As a heat-resistant film having thermoplasticity, “Kapton (registered trademark)” 500SKJ (thickness 125 μm) manufactured by Toray DuPont Co., Ltd. is used. As shown in FIG. 1 and FIG. A molded product having a simple shape (in the case of this example) is molded by a vacuum molding method so as not to be wrinkled or distorted, and the area of the outer surface side (back side) is formed on the LED12 mounting portion of the obtained molded product. An opening 26 having the same area as the light emitting region L of the LED 12 to be mounted and having an inner diameter tapered toward the inner surface (front side) was obtained. It should be noted that a pair of concave grooves to be slit later and grooves 32b for connecting the tips of the concave grooves are formed in advance at positions facing each other on the substrate body 14.

  Subsequently, after plasma processing is performed on the substrate body 14 to activate the surface, the irradiation surface side (front side) is masked, and nickel, chromium, and copper are deposited on the back side to deposit 300 mm of metal. A film was obtained, and then a 18 μm conductor film was obtained by electrolytic copper plating. Thereafter, an LED conductive circuit 18 was formed on the back side of the substrate body 14 by using a photolithography method, and then a solder resist was applied while masking the connection terminal portion with the outside. Note that an external connection circuit (not shown) was formed in the plane portion at the center of the back surface of the substrate body 14.

  Subsequently, after masking the entire back surface of the substrate body 14, aluminum was vapor-deposited on the surface of the substrate body 14 to a thickness of 1200 mm to form the reflecting surface 16.

  Subsequently, an adhesive 24 is applied to the front surface side peripheral portion of the prepared surface mount type LED 12 (flat top type), and the LED 12 is disposed on the back surface of the substrate body 14 so that the opening 26 and the light emitting region L of the LED 12 coincide. The surface is pressed to fix both, and then the lead frame 12c and the conductive circuit 18 bent so as to face the front side of the LED 12 (that is, the conductive circuit 18 side when the LED 12 is fixed to the substrate body 14). Soldering was performed.

  Finally, the bottom of the concave groove of the substrate body 14 is slit to form the stress absorbing portion 32 composed of the slit 32a and the groove 32b, and the outer periphery of the external connection circuit terminal portion around the center of the back surface is cut into three sides. The external connection terminal (not shown) was produced by bending the LED lighting device 10 of the present invention.

  When the obtained LED lighting device 10 is temporarily fixed to a separately prepared metal frame using the molded shape of the outer edge portion 30 and the lighting device 10 is connected to an external LED lighting circuit, the LED 12 is turned on. The primary designed range was irradiated with high illuminance. Moreover, when the part divided | segmented by the slit 32a was operated by the mechanical stress by an external motor drive, the irradiation pattern designed secondary was able to be obtained.

  The LED illumination device of the present invention can be used for a variable light distribution illumination device.

It is a perspective view which shows the LED lighting apparatus of one Example of this invention. It is the II sectional view taken on the line in FIG. It is a principal part expanded sectional view in the LED lighting apparatus of one Example of this invention. It is a principal part expanded sectional view in the LED lighting apparatus of the other Example of this invention. It is a perspective view which shows the LED lighting apparatus (curved plate shape) of the other Example of this invention. It is a perspective view which shows the LED illuminating device (slit addition to FIG. 5) of the other Example of this invention. It is a principal part expanded sectional view in the LED lighting apparatus of the other Example of this invention.

Explanation of symbols

10 ... LED lighting device 12 ... LED
DESCRIPTION OF SYMBOLS 14 ... Board | substrate body 16 ... Reflective surface 18 ... Conductive circuit 20 ... Transparent resin 22 ... Heat sink 24 ... Adhesive 26 ... Opening 28 ... Concave 30 ... Outer edge part 32 ... Stress absorption part 32a, 32d ... Slit 32b, 32c ... Groove 34 ... Flange 36 ... Solder 38 ... Lens part L ... Light emitting area

Claims (4)

A substrate body formed by molding a thermoplastic heat-resistant film into a predetermined three-dimensional shape, a plurality of surface-mounted LEDs mounted at predetermined positions on the substrate body, and the LED provided on the surface of the substrate body; An LED illumination device comprising: a reflection surface that reflects light emitted from the substrate; and a conductive circuit that is provided on the back surface of the substrate body and connects the LED to an external circuit for lighting.
The substrate body is provided with an opening having a size substantially equal to the light emitting area of the LED surface,
Said opening and said LED surface of the light emitting region and is Rutotomoni a surface side of the LED is fixed to the substrate main body rear surface so as to coincide,
The LED lighting device, wherein a plurality of LED mounting portions on the substrate main body are disposed on the entire surface of the substrate main body including a movable portion so as to be separated from each other .   The LED lighting device according to claim 1, wherein the heat-resistant film is an aromatic polyimide film.   3. The LED lighting device according to claim 1, wherein the LED mounting portion of the substrate body is provided with a partial recess surrounding the light emitting region of the LED in order to increase reflection efficiency.   The LED lighting device according to claim 1, wherein a stress absorbing portion configured by a bent structure such as a slit or a groove is provided on at least a part of the substrate body.