JP4466096B2 - Method for manufacturing plasma display panel - Google Patents

Description

  The present invention relates to a method for manufacturing a plasma display panel used for image display in computers, televisions and the like.

  In a plasma display panel, ultraviolet rays are generated by gas discharge, and phosphors are excited by the ultraviolet rays to emit light to perform color display. And the discharge cell divided by the partition is provided on the board | substrate, and it has the structure by which the fluorescent substance layer is formed in this.

  This plasma display panel is roughly divided into AC type and DC type in terms of driving. Among AC types, there are two types of discharge types: surface discharge type and counter discharge type. At present, the mainstream of the plasma display panel is a surface discharge type having a three-electrode structure because of the simplicity of manufacturing.

  FIG. 3 shows a main part of a conventional AC surface discharge type plasma display panel having a three-electrode structure. As shown in FIG. 3, on the first substrate 1 on the transparent front side, such as a glass substrate, a stripe shape in which a scanning electrode 2 as a first electrode and a sustaining electrode 3 as a second electrode make a pair The display electrodes 4 are formed in a plurality of rows, and a dielectric layer 5 is formed so as to cover the display electrodes 4, and a protective layer 6 is formed on the dielectric layer 5.

  A plurality of columns covered with a dielectric layer 8 are arranged on the second substrate 7 disposed to face the first substrate 1 on the front side so as to intersect with the display electrodes 4 including the scan electrodes 2 and the sustain electrodes 3. A data electrode 9 is formed as a striped third electrode. On the dielectric layer 8 between the data electrodes 9, a plurality of partition walls 10 are arranged in parallel with the data electrodes 9, and a phosphor layer 11 is provided on the side surfaces of the partition walls 10 and on the surface of the dielectric layer 8. .

  The first substrate 1 and the second substrate 7 are arranged to face each other with a minute discharge space so that the display electrode 4 and the data electrode 9 including the scan electrode 2 and the sustain electrode 3 are substantially orthogonal to each other. The periphery is sealed, and in the discharge space, a mixed gas such as neon and xenon is sealed as a discharge gas. In addition, the discharge space is partitioned into a plurality of sections by the barrier ribs 10, and discharge cells are provided at portions where the display electrodes 4 and the data electrodes 9 intersect three-dimensionally. Each of the discharge cells has red, green and blue The phosphor layers 11 are sequentially arranged one by one so that Note that the actual panel is configured such that the surface of the protective layer 6 and the top of the partition wall 10 are substantially in contact with each other.

  Next, a method for driving the panel will be described with reference to FIG. 4 which is an example of a voltage waveform applied to each of the scan electrode 2, the sustain electrode 3, and the data electrode 9.

  As shown in FIG. 4, first, in the initialization period, the initialization voltage Vset is applied to the scan electrode 2 to initialize the wall charges in the discharge cells of the panel and the discharge between the scan electrode 2 and the sustain electrode 3. Wall charges are formed in each discharge cell so that the voltage applied to the space is close to the discharge start voltage.

  Next, in the address period, a scan pulse is applied by applying a bias voltage Vscan to all the scan electrodes 2 and removing the bias voltage Vscan of one scan electrode 2. In the discharge cell to be displayed, an address discharge is caused by applying a scan pulse to the scan electrode 2 and simultaneously applying an address pulse Vdata to the data electrode 9. By this address discharge, wall charges are accumulated on the surfaces of the protective layer 6 and the phosphor layer 11, so that an address operation is performed. By sequentially applying scan pulses to all the scan electrodes 2 and applying an address pulse Vdata to a desired data electrode 9, an address operation is sequentially performed over the entire surface of the panel to select discharge cells to be displayed.

  Next, in the sustain period, the data electrode 9 is grounded, and the sustain pulse Vsus is alternately applied to the scan electrode 2 and the sustain electrode 3, so that in the discharge cell in which wall charges are accumulated in the address period, When the potential exceeds the discharge start voltage, a discharge (sustain discharge) is generated, and a sustain discharge is generated each time a sustain pulse is applied, and the sustain discharge continues during the sustain period.

  Thereafter, the wall charges are erased and initialized by applying an erase pulse Verase in the erase period. Thereafter, the subfield consisting of the following writing period, sustain period, and erasing period is repeated.

In the plasma display panel, in order to improve luminance and efficiency, a device for improving light extraction efficiency has been devised. As one of the devices for improving the efficiency, there is a plasma display panel including a reflective layer or a white dielectric layer on the second substrate 7 (see, for example, Patent Document 1). This is intended to improve luminance by reflecting light from the phosphor layer 11 leaking to the second substrate 7 side to the first substrate 1 side which is the display side.
Japanese Patent Laid-Open No. 9-231910

  By the way, when the partition 10 is formed on the second substrate 7, the partition 10 having a fine pattern can be obtained by using photolithography using a photosensitive paste. However, since the second substrate 7 on which the reflective layer or the white dielectric layer is formed is a substrate having a high reflectivity, the ultraviolet rays for exposure reaching the substrate surface are reflected on the substrate surface and the periphery of the pattern. The part is also exposed, and it is difficult to accurately form the fine-patterned partition 10. In particular, it is difficult to form a fine pattern by photolithography on a thick film. As described above, since it is difficult to form a fine pattern by photolithography on a substrate having a high reflectance, there are problems in cost, pattern formation time, and the like.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a method for manufacturing a plasma display panel, which can accurately form partition walls by photolithography on a substrate having high reflectivity. And

In order to achieve the above object, the present invention provides a first barrier rib material layer having a property of absorbing light on a substrate having a light reflectance of 40% or more at a wavelength of 550 nm, A photosensitive second barrier rib material layer is formed on the barrier rib material layer, and the first barrier rib material layer and the second barrier rib material layer are simultaneously exposed, developed, and baked, whereby the barrier ribs are formed on the substrate. a method of manufacturing a PDP of which is characterized by forming a.

  According to the present invention, when the plasma display panel is manufactured, the partition walls can be accurately formed on the substrate having high reflectivity by photolithography.

That is, in the first aspect of the present invention, after forming a photosensitive first barrier rib material layer having a property of absorbing light on a substrate having a light reflectance of 40% or more at a wavelength of 550 nm , the first barrier rib is formed. A photosensitive second barrier rib material layer is formed on the material layer, and the first barrier rib material layer and the second barrier rib material layer are simultaneously exposed, developed, and baked to form barrier ribs on the substrate. It is a manufacturing method of a plasma display panel characterized by forming .

  The invention according to claim 2 is characterized in that, in the invention according to claim 1, the first partition wall material layer is black.

  Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings. In addition, the same number is attached | subjected about the part same as the part shown in FIG.

  FIG. 1 is a cross-sectional view showing a main part for explaining a method of manufacturing a plasma display panel according to an embodiment of the present invention, and shows a step of forming a partition wall using photolithography.

  First, as shown in FIG. 1A, after the data electrode 9 is formed on the second substrate 7 which is the back side substrate, the dielectric layer 8 is formed so as to cover the data electrode 9, and then the dielectric is formed. A reflective layer 12 is formed on the body layer 8. Here, the reflective layer 12 can be formed, for example, by including titanium oxide or the like in the dielectric glass layer, and the second substrate 7 on which the reflective layer 12 is formed has a high reflectance. It becomes the board | substrate 13 which has. Alternatively, the reflective layer 12 may be formed on the second substrate 7, and the data electrode 9 and the dielectric layer 8 may be formed on the reflective layer 12.

  Next, as shown in FIG. 1 (b), a photosensitive paste containing a photosensitive resin, glass powder and a non-reflective black material is applied to the substrate 13 having a high reflectance by a screen printing method, A photosensitive first barrier rib material layer 14 is formed by drying, and then a photosensitive paste for barrier rib formation is applied on the first barrier rib material layer 14 and dried to form a photosensitive second barrier rib material. Layer 15 is formed. The photosensitive paste for forming the partition includes a photosensitive resin and glass powder. Since the photosensitive paste for forming the first partition wall material layer 14 contains a black material, the first partition wall material layer 14 is black and has a property of absorbing light. For example, an inorganic pigment such as iron, nickel, or cobalt can be used as the black material.

  Next, as shown in FIG. 1C, the first barrier rib material layer 14 and the second barrier rib material layer 15 are simultaneously exposed to ultraviolet rays by using the photomask 16 for forming the barrier ribs, thereby forming the first barrier rib material. The exposed portions of the layer 14 and the second partition wall material layer 15 are cured. At this time, since the first partition wall material layer 14 is black, it is easy to absorb light. Therefore, reflected light from the substrate 13 having a high reflectivity during exposure (here, reflected light from the reflective layer 12) is generated. It becomes easy to adjust the exposure conditions so as to minimize or do not affect the formation of the partition pattern. For this reason, exposure conditions can be easily adjusted so that the periphery of the pattern that should not be exposed is not exposed by reflected light, so that exposure can be performed with high accuracy and high reflection. The fine patterning by photolithography on the substrate 13 having a high rate can be performed with high accuracy.

  After the exposure, development is performed with a predetermined developer, followed by baking, so that the barrier ribs 19 having a predetermined pattern including the first barrier rib layer 17 and the second barrier rib layer 18 are formed as shown in FIG. It is formed. Since the exposure is performed with high accuracy as described above, the formed partition wall 19 does not have a shape in which the width of the bottom thereof is abnormally wide, and the width of the reflective layer 12 between the partition walls 19 is increased. The partition wall 19 having a fine pattern can be formed without being narrowed. In addition, when the reflectance of the reflective layer 12 is small and the reflected light from the reflective layer 12 at the time of exposure is small, the influence on the partition pattern formation by photolithography is small and the width of the reflective layer 12 between the partition walls 19 is reduced. Becomes a small value. For this reason, the method according to the present embodiment is particularly effective for a substrate having a reflectance of a predetermined value or more, and a substrate having a reflectance of light with a wavelength of 550 nm of 40% or more is used in the present embodiment. By using the substrate 13 having the reflectance, the fine pattern partition wall 19 can be formed with high accuracy.

  As described above, the partition walls 19 are formed on the substrate 13 having a high reflectance by using photolithography. Thereafter, the phosphor layer 11 is formed between the barrier ribs 19. In this manner, predetermined constituent members including the data electrode 9, the dielectric layer 8, the reflective layer 12, the partition wall 19, and the phosphor layer 11 are formed on the second substrate 7.

  FIG. 2 is a cross-sectional view showing the main part of a plasma display panel configured using the second substrate 7 on which predetermined components are formed, and is formed on the first substrate 1 which is the front substrate. The configuration of the display electrode 4, the dielectric layer 5 and the protective layer 6 is the same as that shown in FIG. FIG. 2 shows a cross section of a portion where the display electrode 4 is not formed. In other words, on the first substrate 1 on the transparent front side such as a glass substrate, a stripe-shaped display electrode 4 that is paired with a scanning electrode 2 as a first electrode and a sustaining electrode 3 as a second electrode is formed. A plurality of rows are formed, a dielectric layer 5 is formed so as to cover the display electrode 4, and a protective layer 6 is formed on the dielectric layer 5. Then, the first substrate 1 and the second substrate 7 are opposed to each other so that the display electrode 4 and the data electrode 9 as the third electrode are orthogonal to each other, and the periphery is sealed, and a discharge space is formed between the substrates. Is filled with a discharge gas composed of neon and xenon. A discharge cell is provided at a portion where the display electrode 4 and the data electrode 9 intersect three-dimensionally.

  The method of driving the plasma display panel according to the present embodiment configured as described above is the same as that described with reference to FIG. Light emission for image display occurs in the sustain period. In the sustain period, sustain pulses are alternately applied to the scan electrodes 2 and the sustain electrodes 3 to generate a sustain discharge in the discharge cells to be displayed, and the phosphor layer 11 is caused to emit light by the ultraviolet rays generated by the sustain discharge. . Image display is performed by light emission of the phosphor layer 11 at this time.

  As shown in FIG. 2, in the plasma display panel according to the present embodiment, the partition walls 19 can be formed without the width between the partition walls 19 becoming unnecessarily narrow, and the substrate 13 having a high reflectance between the partition walls 19. Thus, the light emitted from the phosphor layer 11 can be reflected to the first substrate 1 side which is the display surface, so that the light extraction efficiency can be improved. In addition, since the lower portion of the barrier rib 19 is constituted by the black first barrier rib layer 17 that absorbs light, it is possible to prevent color mixing between adjacent discharge cells during light emission, so that high-definition display is possible. .

  In the above embodiment, the form in which the partition wall 19 is formed using a photosensitive paste has been described. However, the present invention is not limited to this form, and the partition wall 19 can be formed using a film material or the like. . When the film material is used, the above-described drying process is not necessary, and thus the process can be further simplified.

  In addition, the term “black” used in the above description is not necessarily limited to black with no shading, but includes a black or dark color that visually contrasts against a white background. .

  As described above, according to the present invention, when manufacturing a plasma display panel, it is useful when a partition is formed on a substrate having a high reflectance by using photolithography.

(A)-(d) is sectional drawing which shows the manufacturing method of the plasma display panel by one embodiment of this invention Sectional drawing which shows the principal part structure of the plasma display panel by one embodiment of this invention The perspective view which shows the principal part structure of the conventional plasma display panel. Signal waveform diagram showing drive voltage waveform of conventional plasma display panel

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st board | substrate 7 2nd board | substrate 13 board | substrate with high reflectance 14 1st partition material layer 15 2nd partition material layer 17 1st partition layer 18 2nd partition layer 19 Partition

Claims (2)

After forming a photosensitive first barrier rib material layer having a characteristic of absorbing light on a substrate having a light reflectance of 40% or more at a wavelength of 550 nm, a photosensitive second barrier rib is formed on the first barrier rib material layer. A plasma display panel , wherein a material layer is formed and the first barrier rib material layer and the second barrier rib material layer are simultaneously exposed, developed, and baked to form barrier ribs on the substrate . Production method. The method of manufacturing a plasma display panel according to claim 1, wherein the first barrier rib material layer is black.

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