JP4459670B2 - UIM with plate frame - Google Patents

Description

The present invention relates to a UIM with a plate-like frame including a UIM or a mini-size UIM.
Here, the UIM with a plate-like frame is generally formed in a card case-sized card base so that the outer shape of the UIM can be folded by a peripheral slit, The present invention relates to an IC card that is used by being attached to a reader / writer. In the present invention, the UIM or mini-size UIM uses an authentication label that cannot be re-attached to the outline portion of the wallet-size plate-like frame body, It is characterized in that it is detachably attached to the plate-like frame across the part.

Such a UIM is guaranteed to be unused by the authentication label before being removed from the plate-shaped frame, and after being removed, it is attached to an adapter or reader / writer, and the UIM is not used for facilities or transportation facilities. It can be applied to settlement transactions such as opening and closing of contact gates and non-contact shopping, or it can be mounted on a mobile phone and used for user identification.
Therefore, the technical field related to the present invention relates to the field of manufacturing and using UIM with a plate-like frame.

Of the various IC cards, what is called a contact IC card is folded into a 53.98 mm x 85.60 mm (ID-1 type) wallet size specified by ISO or JIS, and a size slightly smaller than this. There is a card called a UIM (Universal / User Identity Module) card or a SIM (Subscriber Identity Module) card that can be removed and inserted into a mobile device or other device. .
A UIM card or a SIM card has a GSM (Global System for Mobile Communications) standard and a 3GPP (3rd Generation Partnership Project) standard, and is well known for determining shape, position, electrical characteristics in use, and the like.

By the way, as shown in FIGS. 8 and 9, a conventional UIM or SIM card is usually provided with a peripheral slit (outside of the UIM or SIM card) in a card 50 manufactured in the above-mentioned wallet size conforming to the ISO7816 / 2 standard. Groove) etc. and leave a breakable bridge part (connecting part), or by using a double-sided half-cut method, immediately before use, fold the UIM area compliant with GSM and 3GPP standards from the bridge part, It is common to use it by wearing it.
FIG. 8 is a diagram showing the UIM 1 held on the plate-like frame body by the peripheral slit 1 s and the breakable bridge portion 1 b. In this case, the UIM 1 can be removed from the peripheral slit 2s by folding the two portions of the half cut line 1h of the bridge portion 1b.
FIG. 9 shows a double-sided half-cut method, in which the entire periphery of UIM1 is surrounded by double-sided half-cut line 1h, peeled along half-cut line 1h, and UIM1 can be taken out.

  This is because the UIM card is manufactured by diverting the normal contact IC card manufacturing process, and issuance processing (UIM and device send and receive data before inserting and using it) This also refers to the installation of programs necessary for proper functioning and loading of personal information and initial data.) Using a contact IC card issuance processor reduces manufacturing and equipment costs. This is due to the fact that it can be done.

  Therefore, the UIM is formed in the shape of a normal contact IC card, and the UIM area can be easily folded later. Processing, grooving, punching, and combinations thereof) are generally performed, and various proposals have been made regarding this shape and method.

The main use of UIMs is to incorporate them into mobile phones, but as the size of mobile phones has become smaller year by year, the need for smaller size of UIM itself, which is not bound by the standards, has increased. Yes.
Prior arts relating to this include Patent Document 1, Patent Document 2, and the like, which are used to fold a small IC card area from a wallet-sized card outer shape, a normal standard-compliant UIM size, and a smaller miniature card. It proposes a UIM break-off shape that allows selection of either size UIM.

Here, when the prior art is examined, the following can be cited.
Patent Document 1 describes that a precut contour is provided on a card base so that a chip card can be removed from a card body by a groove and a bridge.
Patent Documents 2 and 3 describe the formation of a small mini-size UIM.
Patent Document 4 proposes a “card carrier for a plug-in IC card”, but does not describe using an authentication label as in the present application.
In addition, although many well-known techniques exist about the authentication label which cannot be reattached, patent document 5, patent document 6, etc. can be mentioned as an example.

JP-A-6-24188 Japanese translation of PCT publication No. 2002-535783 Special Table 2002-537609 JP 2003-208580 A JP-A-8-152842 JP-A-10-97172

  By the way, UIM itself is a special plastic material (for example, polycarbonate, PET-G, ABS resin, etc.) having sufficient heat resistance (generally capable of withstanding up to 85 ° C.) so as not to be deformed even in a high-temperature device. It is necessary to form, but the plate-like frame part is not used after folding, and it is effective from the viewpoint of cost reduction and effective use of resources to make it with inexpensive recycled material that does not require durability Is. However, the UIM is usually considered to have started to be used after the UIM has been separated (broken) from the frame by the user's own intention. If it is simply joined with a label, it is easy to repair after folding, and it is difficult to determine whether the card is unused or used.

Moreover, the UIM formation method is limited to the counterbore method, the groove punching process, the half cut process, the perforation process, and the like for the above reasons. In the case of these processing methods, a complicated processing form is required, and it is assumed that some difficulty is caused in mass production.
In addition, in the case of manufacturing integrally with a plate-like frame that is a card, since the UIM cannot be incorporated even when a defect occurs only in the frame, the entire UIM with the plate-like frame becomes a defective product. There is. When other forming methods such as injection molding are considered, the resin does not flow evenly due to the complicated cut-off groove, and the weld (the boundary where the resin does not mix) ) Occurs, and the choice of the manufacturing method is narrowed such that it cannot be adopted.
Therefore, in the present invention, the present invention has been completed by studying a form in which the choices of the manufacturing method can be expanded and the UIM can be provided to the user to guarantee its unused state.

In order to solve the above-mentioned problems, the present invention is firstly a UIM with a plate-like frame body in which a UIM having a rectangular shape is removably assembled to a UIM contour portion in a wallet-size plate-like frame body, A wallet so as to straddle the UIM contour using an authentication label having a smaller area than the contact terminal plate, which cannot be re-attached to two opposite sides of the contact terminal plate on the front side and / or the back side. A UIM with a plate-like frame characterized by being attached to a size plate-like frame is performed.

In order to solve the above-mentioned problems, the present invention secondly is a UIM with a plate-like frame in which a rectangular mini-size UIM is removably attached to a contour for a mini-size UIM in a wallet-size plate-like frame. The mini-size UIM can be reattached to the opposite side of the contact terminal plate on the front side and / or the back side , using an authentication label having a smaller area than the contact terminal plate. A UIM with a plate-like frame, which is pasted on a wallet-size plate-like frame across the UIM outline, is performed.

In order to solve the above-mentioned problem, the present invention thirdly, a rectangular mini-size UIM is removably assembled to the outline of the mini-size UIM in the wallet-size plate-like frame, and the mini-size UIM can be incorporated. It is a UIM with a plate-like frame that is provided so that the outer size of the normal size UIM can be folded, and the two sides of the mini-size UIM on the front side and / or the back side cannot be reattached. A UIM with a plate-shaped frame, wherein the UIM is attached to a wallet-size plate-shaped frame across the outline for the mini-size UIM using an authentication label having a smaller area than the contact terminal plate. , Do the means.

In the above, the UIM or mini-size UIM can be re-installable in the plate-shaped frame, and the UIM or mini-size UIM IC module contact terminal board is in a predetermined position of the wallet size card defined by ISO7816. It can also be.
Alternatively, a UIM or wallet-size plate frame, or a mini-size UIM or wallet-size plate frame may be manufactured by injection molding.

The UIM with a plate-like frame of the present invention has the following effects.
(1) Since the UIM or mini-size UIM and the card substrate which is a plate-like frame are pasted with an authentication label that cannot be re-pasted across the UIM contour, the UIM or The security of the mini-size UIM is ensured, and the user can easily determine whether it is unused or in use.
(2) When the UIM or mini-size UIM is removed from the plate-shaped frame, it is impossible to re-adhere it. Therefore, the user started using the UIM after removing it from the outer frame. As a result, the conventional rules can be safely followed and operational problems can be avoided.
(3) Since a UIM or a mini-size UIM and a card substrate which is a plate-like frame can be manufactured in separate manufacturing processes and incorporated after completion of both, the selection of manufacturing methods can be expanded for each part. That is, in addition to conventional processing methods such as counterbore method, half-cut method, and punching, an injection molding method can be easily adopted.

(4) UIM parts that require heat resistance and plate-like frame parts that do not require heat resistance and durability must be made of different materials, and manufacturing methods that reduce costs and increase production efficiency can be adopted. The selection range such as can be expanded.
(5) The UIM with a plate-like frame according to claim 3 can be used as a standard-compliant UIM in which the removed mini-size UIM is fitted and integrated in the same frame, and the UIM outer shape as an adapter can be easily broken off. Since it is provided by the conversion processing, the usage application of the mini-size UIM can be expanded. In addition, once a mini-size UIM is inserted into a normal-size UIM, it can be removed and used as a mini-size UIM, so mutual compatibility can always be obtained and the range of application to UIM-equipped devices can be expanded. it can.
(6) If a UIM or a mini-size UIM is mounted at a position specified by the ISO of the card substrate, the issuing process can be performed in the same process using the same issuing processing equipment as the normal IC card issuing process. .

Hereinafter, a UIM with a plate-like frame of the present invention will be described with reference to the drawings.
1 is a diagram showing a first embodiment of a UIM with a plate-like frame according to the present invention, FIG. 2 is a diagram showing the second embodiment, FIG. 3 is a diagram showing the third embodiment, and FIG. Fig. 5 is a diagram showing standard values related to the UIM shape, etc., Fig. 5 is a layout diagram showing a mounting portion of a mini-size UIM, Fig. 6 is a diagram showing a configuration example of a brittle hologram label, and Fig. 7 is a non-re-adhesive. It is a figure which shows the structural example of an adhesive label.

1A and 1B are diagrams showing a first embodiment, in which FIG. 1A is a plan view, and FIGS. 1B to 1D are enlarged sectional views taken along line A1-A2 of FIG. is there.
In the first embodiment of the UIM with a plate frame, the UIM 1 is assembled in the UIM contour portion 10s of the UIM 10 with the plate frame as shown in FIG. In this case, the UIM1 is a normal-size UIM, and can be removed by pushing it out from the UIM contour portion 10s with a fingertip. Re-installation is not essential, but it may be re-installable. The IC module contact terminal plate 6 is visible on the surface of the UIM 1, and the IC module 5 is embedded in the base of the UIM 1 as shown in the cross-sectional views of FIGS.

The UIM1 is composed of a substrate having a long side of 25 mm and a short side of 15 mm, and has a uniform thin plate shape with a thickness of about 0.76 mm. The reason why the notched portion 14 is provided at one corner is to align the position when it is mounted on a mobile phone or the like.
The feature of the UIM 10 with a plate-like frame of the present invention is that the UIM 1 is attached to the wallet size card substrate 3 with an authentication label 11 that cannot be attached again. The authentication label 11 that cannot be reattached is attached to the lower surface side of the card substrate 3 in FIG. 1 (B), but when not used as an IC card, the authentication label 11 is not attached to the upper surface side as shown in FIG. 1 (C). It does not matter.
Alternatively, although not shown, the UIM 1 may be attached to the left and right two locations on the front surface side and the upper and lower two locations on the back surface side. Moreover, you may stick the authentication label 11 to each of four corner parts of the surface side of UIM1. In this case, when the outer frame 3 is bent along the long piece and the short side, it is possible to reduce the influence of the stress load that tends to occur along the left, right, and top and bottom of the UIM 1.

In order to guarantee an unused state when used as a contact IC card, the surface of the contact terminal 6 may be covered, but a label adhesive material that can keep the terminal surface clean is used. When the UIM 1 is used exclusively for a mobile phone or the like, it cannot be used unless it is separated from the card substrate 3, so it is not necessary to consider covering the terminal surface. As shown in FIG. 1, the label may be a label that covers the entire UIM 1 instead of a small-sized label.
Such an authentication label, which will be described in detail later, is characterized by using a brittle hologram label or a non-re-adhesive adhesive and having irreversibility.
In order to allow the UIM 1 to be re-assembled into the card substrate 3, as shown in FIG. 1D, a convex inclined surface 10t is formed on the UIM 1, and the side surface of the UIM contour portion 10s is a concave inclined surface 10h. It becomes possible by carrying out proper processing.

2A and 2B are diagrams showing a second embodiment, in which FIG. 2A is a plan view, and FIGS. 2B to 2D are enlarged sectional views taken along line A3-A4 of FIG. .
In the second embodiment of the UIM with a plate-like frame body, as shown in FIG. 2A, the mini-size UIM1m is assembled in the mini-size UIM contour portion 10m of the UIM 10 with the plate-like frame body.
In this case, the mini-size UIM can be removed by being pushed out from the mini-size UIM contour portion 10m with a fingertip. It is not essential to re-assemble the mini-size UIM1m, but it may be made re-integratable.

The mini size UIM1m is designed to have an outer shape that is comparable to the outer shape of the contact terminal board 6. When the horizontal dimension of the mini-size UIM1m is 13.0 mm and the vertical dimension is 12.0 mm, the alignment notch 4 is about 1.5 mm long and 1.5 mm wide (about 2.1 mm). become. However, in consideration of processing convenience, the size of the mini-size UIM may be different from the ideal size.
The second embodiment is also characterized in that the mini size UIM 1m is attached to the wallet size card substrate 3 with the authentication label 11 that cannot be attached again.
The authentication label 11 that cannot be reattached is attached to the lower surface side of the card substrate 3 in FIG. 2B, but when not used as an IC card, the authentication label 11 is attached to the upper surface side as shown in FIG. It does not matter. Various other methods can be adopted as the attaching position of the authentication label 11 as in the case of the first embodiment.
FIG. 2D shows a case where re-installation is possible, and as in the case of FIG. 1, a convex inclined surface 10t and a concave inclined surface 10h are formed.

  FIG. 3 is a diagram illustrating a third embodiment. 3A is a plan view, FIG. 3B is an enlarged sectional view taken along line A5-A6 of FIG. 3A, and FIG. 3C is an enlarged sectional view taken along line B1-B2 of FIG. It is. As shown in FIG. 3 (A), the third embodiment of the UIM with a plate-like frame includes a mini-size UIM1m assembled in the mini-size UIM contour portion 10m of the UIM with a plate-like frame, and the same card. The substrate 3 has a normal size UIM outer shape 2 in which a mini size UIM1m can be incorporated. The normal size UIM outer shape 2 serves as an adapter that can be used as a normal size UIM by incorporating the mini size UIM1m in the inner frame 9, and is hereinafter also expressed as "adapter 2".

An outer shape of the adapter 2 is formed by the peripheral slit 2s, and two to three portions are connected to the card substrate 3 by the bridge portion 2b and the half cut 2h. The half cut 2h is a portion where the card substrate is punched out from both sides leaving a thin layer, and the adapter 2 can be easily folded from the portion. The notch 8 is also formed in a half cut 2h.
The adapter 2 has a punched inner frame 9 and is structured so that a mini-size UIM 1 m can be incorporated into the inner frame 9.
The built-in structure of the mini-size UIM1m has a convex inclined surface 10t formed on two opposing sides as shown in FIG. 3B and a concave inclined formed on the inner surface of the inner frame 9 in FIG. 3C. With the surface 9h, the mini-size UIM1m can be pressed from the upper surface and fitted.
You may make it the structure which can be slid and fitted from the one side of the adapter 2 using the same structure. In the case of the sliding fitting structure, the insertion port 12 side of the adapter 2 is an open end from which the base material is removed.

Since it is not essential to re-assemble the mini-size UIM 1 m into the card substrate 3, the side of the mini-size UIM contour portion 10 m does not have to be an inclined surface, but a concave inclined surface 10 h as shown in FIG. If it becomes, re-incorporation becomes possible. The inclined surfaces need to be formed on at least two opposing sides of the mini-size UIM, and may be three or four sides.
The authentication label 11 that cannot be reattached is attached to the mini size UIM1m in the same manner as in the first and second embodiments. In the case of FIG. 3, the authentication label 11 is affixed to two places on the upper and lower sides of the back side of the mini-size UIM1m.

A dual-mode IC module having a contact type defined by ISO7816-2 and ISO7816-3, or a contact type and a non-contact interface defined by ISO14443 is mounted on the UIM1 or the mini-size UIM1m. Therefore, although not shown, when a non-contact communication function is provided, an antenna coil may be provided in the UIM 1. Even when the antenna coil is not provided, the antenna of the device can be used when the antenna coil is mounted. In this case, the empty terminals C4 and C8 are used.
The UIM 10 with a plate-like frame of each embodiment can be used as a contact type or a contact / non-contact IC card with the UIM 1 or the mini size UIM 1m incorporated in the card substrate 3, and the UIM 1 or the mini size UIM 1m is removed. In the state, the UIM1 or the mini size UIM1m can be used by being attached to the device.

For reference, standard values relating to UIM shapes and the like are shown in FIG.
The shape of UIM1 is defined by GSM (Global System for Mobile communications) and 3GPP (3rd Generation Partnership Project), as shown in FIG.
The numerical values in the drawing indicate the position of UIM1 in the wallet size card, the numerical values of the long side and the short side, or the allowable position range of the C1 to C8 terminals.
Further, FIG. 5 shows a layout showing a mounting portion of the mini-size UIM. When the terminal position of the mini-size UIM1m is determined based on the specified value, the center position C of the contact terminal board 6 is 15.06 mm from the left end of the card board and 23.89 mm from the upper end. In addition, the broken-line rectangular frame in each terminal board shows the terminal board position range which adapts the said specification.

Next, an authentication label that cannot be reattached will be described. As the authentication label, a brittle hologram label or a label that cannot be re-adhered is used. There are a wide variety of embodiments of these. Therefore, the following are examples, and are not limited to these.
FIG. 6 is a diagram showing a configuration example of a brittle hologram label, which is characterized by using a hologram laminate. The brittle hologram label 110 shown in FIG. 6A has a structure in which an adhesive layer 115, a hologram layer 116, a brittle resin layer 117 containing a monomer or a plasticizer, and a surface protective film 118 are laminated on a release paper 111. It has become.
A brittle hologram label 110 shown in FIG. 6B has an adhesive layer 115A, a hologram layer 116, a brittle resin layer 117 containing a monomer or a plasticizer, an adhesive layer 115B, and a surface protective film 118 on a release paper 111. It is the structure which laminated | stacked.
In these labels, the surface protective film surface may be subjected to a hard coat treatment if necessary, and may be subjected to a release treatment.

When the brittle hologram label 110 is used, the release paper 111 may be removed and the card substrate 3 and UIM1 may be stuck across the contour portion 10s.
When the label 110 is to be peeled after sticking, the interface between the brittle resin layer 117 containing the plasticizer and the hologram layer 116 is peeled first, and then the hologram layer is destroyed. It becomes impossible.

  For the adhesive layers 115, 115A and 115B, for example, acrylic, acrylate ester, or a copolymer thereof, styrene-butadiene copolymer, natural rubber, casein, rosin ester, styrene resin, silicone, maleimide And an adhesive such as polyvinyl ether.

The brittle resin layer 117 contains fine particles in the resin. As the resin, a single or copolymer resin of styrene resin such as polystyrene and poly-α-methylstyrene, polymethyl methacrylate, polyethyl methacrylate, and the like. , Polymethyl acrylate, polyethyl acrylate, ethyl cellulose, nitrocellulose, hydroxyethyl cellulose, polyvinyl alcohol, melamine resin and the like.
Examples of the fine particles to be contained in the resin include inorganic particles such as calcium carbonate, talc, china clay, kaolin, microsilica, titanium dioxide, and silica powder.

The hologram layer 116 may be a volume hologram. As a manufacturing method thereof, a Lippmann hologram is recorded on a hologram recording film, a surface film of the hologram recording material is peeled off, and then a phthalic acid-2- It can be produced by a method of laminating a film provided with an acrylic resin film (thickness of about 20 μm) containing ethylhexyl (DOP).
Details of these production methods are described in JP-A-10-97172 (Patent Document 6) and the like. Other embodiments of the hologram label are also described in Japanese Utility Model Laid-Open Nos. 61-206976, 62-43378, 2-58278, and Japanese Patent Laid-Open No. 8-152842.

A label in which the authentication label cannot be re-adhered can be made of a material that generates adhesive force by strong pressure but does not generate adhesive force under normal pressure. This is an adhesive material often used in concealment postcards and mail forms.
FIG. 7 is a cross-sectional view illustrating a configuration example of a pressure-sensitive adhesive label that cannot be re-adhered. The pressure-sensitive adhesive label 120 includes a pressure-sensitive adhesive layer 125A, a base film 123, a non-re-adhesive pressure-sensitive adhesive layer 125B, a surface film 124, a hologram layer 126, a protective layer 127, and the like on a release paper 121. Instead of the hologram layer 126, a simple print layer may be used.
The pressure-sensitive adhesive layer 125A is a pressure-sensitive adhesive having a normal pressure-sensitive adhesive force, and the pressure-sensitive adhesive force can be appropriately adjusted. However, the pressure-sensitive adhesive layer 125A has a stronger pressure-sensitive adhesive force than the non-re-adhesive pressure-sensitive adhesive layer 125B and cannot be re-adhered. When the label 120 is to be peeled off, the inside of the pressure-sensitive adhesive layer 125B is peeled off first. Once the pressure-sensitive adhesive layer 125B has been peeled off, no adhesive force is produced with a pressure that can be pressed with a fingertip. Therefore, it is impossible to reattach.
Note that if pressure bonding between the base film 123 and the surface film 124 is performed on the UIM1 surface, the UIM1 is destroyed. Therefore, a completed pressure-sensitive adhesive label is obtained by using a base material on which the base film 123 and the surface film 124 are press-bonded in advance. It is natural to use 120.

Next, a manufacturing process of the UIM with a plate-like frame will be described.
(1) In manufacturing a UIM with a plate-like frame, first, a card before mounting an IC module is manufactured in the same manner as a normal IC card. This process prepares two front and back layers of a multi-sided printing core layer, and further heat-transfers the magnetic tape in advance to the oversheet as the outermost surface as necessary, and then laminates it on the two-layer core sheet. To fuse and unify the base material.
Thereafter, punching to individual card sizes is performed. Transfer sign panels, hologram labels, etc. as necessary.

(2) Next, a counterboring process of the concave portion for embedding the IC module and a process for facilitating the folding of the UIM1 and the normal size UIM outline 2 (half cut process, perforation process, groove punching process, and a combination process thereof) are performed. The UIM and the outer frame portion can be manufactured simultaneously in the same process, or can be manufactured in separate processes. Consider the optimal manufacturing method in consideration of the required UIM performance, application, and production volume. The material used may be the same material, or may be manufactured from different materials, but processed in any combination.
Therefore, when manufacturing separately, it is not necessary to perform the above-described break-up facilitation processing for UIM1.

  In the case of a conventional UIM with a plate-like frame body, the process of forming a bridge that partially connects to the outer frame body 3 in the UIM external area is performed by punching or cutting by an end mill (counterbore process), making it easier to fold In order to improve the properties, half cutting (punching or counterboring) processing is performed in the ridge portion along the outer periphery of the UIM. However, in the UIM with a plate-like frame body of this method, such a bridge is not provided except when the adapter 2 is provided. No formation is necessary.

(3) The UIM 1 is positioned in the outer frame body part, and both are joined with an authentication label that cannot be reattached at a predetermined location, for example, a brittle label.
However, in this process, the following (4) and (5) may be processed after the UIM alone and then integrated.

(4) COT (Chip On Tape; IC module aligned in a tape shape) back surface is laminated with an adhesive tape or a liquid adhesive, or an adhesive is applied to the UIM IC module embedding concave side. Then, a stamped piece of COT is mounted therein. Usually, it is attached and fixed to the UIM 1 bonded (attached) to the outer frame 3 by applying heat pressure.

The above assumes processing in a state where the outer frame body side and UIM side are joined (adhered), but the UIM with a plate-like frame body cuts out the UIM after manufacturing the IC card in the normal process. It is also possible to manufacture by performing a cutting process to be performed and then assembling.
In addition, since it is possible to manufacture the UIM side and the frame side in separate steps and finally integrate them, the step (4) is performed by the UIM alone without performing the step (3). It is good also as a process of assembling and integrating with an outer frame.
After that, the card issuance process is performed, and the card is delivered as it is.

(5) When the outer frame 3 side of the card is injection-molded, it is manufactured by a label insert injection molding method. The injection molding of an IC card to which an IC module is mounted requires a high degree of management of mold manufacturing accuracy and molding conditions. However, the manufacture of only a frame without an IC module is not possible with normal label insert injection molding. Can be done under conditions. The label to be inserted (the surface material of the card) is a label on which a description of the design and the usage method of the UIM with a plate-like frame is printed. This label is placed on the front and back surfaces of the inner surface of the mold and molded by a method of injecting an injection molding resin between the front and back labels.

The base material to be a label (card surface material) may be paper or synthetic paper, and may be made of polyvinyl chloride resin, polyethylene terephthalate resin, or PET-G resin, which are originally used for cards. Cellulosic resins, polypropylene resins, polycarbonate resins, ABS resins and the like may be used.
Molding resins include general-purpose polystyrene resin, impact-resistant polystyrene resin, acrylonitrile styrene resin, ABS resin, acrylic resin, polyethylene resin, polypropylene resin, polyamide resin, polyacetal resin, polycarbonate resin, polyvinyl chloride resin, polyethylene terephthalate resin , Etc. can be used.

(6) After the outer frame body of the card is injection-molded, a process for punching the periphery of the outer frame body is performed if necessary, and a contour shape for assembling the UIM1 or the mini size UIM1m is further punched. In order to make the UIM contour portion 10s re-installable, it is necessary to cut the concave inclined surface on the side of the inner frame 9 or the convex inclined surface of the UIM by an end mill.

An embodiment of the present invention will be described with reference to FIG.
<Preparation of IC module for IC card>
A COT (glass epoxy base material, thickness of 160 μm) IC chip on which a contact terminal board was formed and a contact type IC chip was mounted and an epoxy resin was dropped around the wire bonding portion to perform resin molding.
The size of the IC module contact terminal plate 6 is 13.0 mm × 11.8 mm, the size of the resin mold portion is 8.0 mm × 8.0 mm, and the height of the resin mold portion not including the substrate thickness is 440 μm. It was.

This COT back surface (opposite surface of the contact terminal plate 6) is covered with a portion that is in contact with the first recess (the portion in the IC module mounting recess where the contact terminal plate is placed) except for the resin mold portion. As described above, a heat-reactive adhesive tape (polyester resin type, thickness 50 μm) was punched out and laminated.
The pressing conditions were 130 ° C. and time 5 seconds. During the lamination, the adhesive tape was compressed by about 10 μm.

<Preparation of IC card board>
The printed core sheet with a thickness of 360 μm is combined with one sheet of white hard vinyl chloride sheet with a thickness of 360 μm, and the two sheets are used as a core sheet, and two sheets of a transparent vinyl chloride sheet with a thickness of 50 μm on both sides are core sheets. A total of four sheets arranged on the upper and lower surfaces were temporarily fixed and then fused by applying hot pressure (150 ° C., 0.03 MPa, time 40 minutes) to prepare a card substrate.

<Cutting of IC module mounting recess>
The concave portion for mounting the IC module was formed by NC cutting of a counterbore machine.
First, the first concave portion was cut to a depth corresponding to the total thickness of the size, thickness and adhesive tape thickness of the IC module substrate (contact terminal plate). The size of the first recess at this stage was 13.1 × 11.9 mm (corner radius of curvature 2.5 mm), and the depth was 200 μm. This size is an opening about 0.1 mm larger than the actual terminal board size.
Furthermore, the second concave portion (the deepest portion at the center of the concave portion for mounting the IC module) that accommodates the resin mold portion of the IC module has a size of 8.2 mm × 8.2 mm, the depth is 640 μm from the card surface, and further 440 μm from the first concave surface. Drilled to deepen.

<Installation of IC module>
The IC module on which the previously prepared heat-reactive adhesive tape was laminated was punched out of the COT and mounted, and the adhesive tape was melted by applying hot pressure (150 ° C., time 5 seconds) to fix the IC module.

<Finishing>
The outer shape was continuously cut and formed using an end mill cutting blade having a diameter of 0.5 mm so that the UIM 1 had a long side of 25 mm and a short side of 15 mm. After extracting UIM1, the notch 14 was cut and provided in one corner. As the outer frame 3 of the UIM 10 with a plate-like frame, the same plate-like frame as the substrate from which the UIM 1 was extracted was used.
UIM1 completed by the above process was assembled | attached in the outline part 10s of UIM with a plate-shaped frame. A UIM 10 with a plate-like frame is completed by attaching a 10 mm × 10 mm fragile hologram label 110 across the UIM contour portion 10 s to two places on the left and right sides of the UIM 1 and two places on the back and top of the UIM 1 (see FIG. 1). ). Thereafter, the issuing process was performed.

<UIM outer frame>
Insert a 50 μm thick printed transparent hard vinyl chloride sheet on each side of the inner surface of the mold so that both printed surfaces are on the inside of the printed transparent hard vinyl chloride sheet with a thickness of 50 μm. A white vinyl chloride resin was injected and molded between the transparent hard vinyl chloride sheets on the front and back. After the injection molding, the UIM 1 was assembled after the outer shape of the card substrate 3 and the UIM contour portion 10s were punched out. The same UIM1 as that manufactured in Example 1 was used. After the UIM1 is assembled, a 20 mm × 20 mm non-re-adhesive adhesive label 120 is attached to the UIM1 on the left and right sides of the UIM1 across the UIM contour portion 10s to complete the UIM10 with a plate frame ( (See FIG. 1). Thereafter, the issuing process was performed.

  The UIM 10 with a plate-like frame of Example 1 and Example 2 could be used as a contact IC card without any trouble. It was also confirmed that the UIM 1 can be used when the authentication label is peeled off and the UIM 1 is detached and attached to the mobile phone.

  In the above embodiment, the UIM 1 is manufactured using a conventional IC card manufacturing process. However, those skilled in the art can also manufacture the IC module by a method of insert injection molding. Obviously, the UIM with a plate-like frame of the present invention is obviously not limited to the manufacturing method.

It is a top view which shows 1st Embodiment of UIM with a plate-shaped frame. It is a top view which shows the 2nd Embodiment. It is a top view which shows the 3rd Embodiment. It is a figure which shows the standard value regarding the shape etc. of UIM. It is a layout view showing a mounting portion of a mini size UIM. It is a figure which shows the structural example of a brittle hologram label. It is a figure which shows the structural example of the adhesive label which cannot be re-adhered. It is a figure which shows the conventional UIM or SIM card. It is a figure which shows the conventional UIM or SIM card.

Explanation of symbols

1 UIM
1m mini size UIM
2 Normal size UIM outline, adapter 3 Card board, outer frame 4 Notch 5 IC module 6 IC module contact terminal board 8 Notch 9 Inner frame 10 UIM with plate frame
10s UIM contour 10m Mini size UIM 11 Authentication label 14 Notch

Claims (7)

A UIM with a plate-like frame in which a rectangular UIM is removably assembled to a UIM contour in a wallet-size plate-like frame, and the UIM has a contact terminal plate on the front side and / or on the back side. It is characterized in that two places on the side to be attached cannot be re-attached and are attached to a wallet-size plate frame so as to straddle the UIM contour using an authentication label having a smaller area than the contact terminal board. UIM with a plate-like frame. A UIM with a plate-like frame in which a rectangular mini-size UIM is removably attached to a contour for a mini-size UIM in a wallet-size plate-like frame, and the contact terminal plate surface side of the mini-size UIM and / Or two places on the opposite side of the back side cannot be re-attached , and an authentication label having a smaller area than the contact terminal board is used to cross the outline for the mini-size UIM into the wallet-size plate frame A UIM with a plate-like frame, which is attached. A rectangular mini-size UIM is removably assembled to the outline for the mini-size UIM in the wallet-size plate-shaped frame, and a normal-size UIM outer shape into which the mini-size UIM can be incorporated is provided in a foldable manner. A UIM with a plate-shaped frame, and an authentication label having a smaller area than the contact terminal plate, which cannot be re-attached to two opposite sides of the front side and / or back side of the contact terminal plate of the mini-size UIM A UIM with a plate frame, wherein the UIM is attached to a wallet-size plate frame across the outline for the mini size UIM. The UIM with a plate-like frame according to any one of claims 1 to 3, wherein the UIM or the mini-size UIM can be re-assembled into the plate-like frame. 4. The plate-like frame according to claim 1, wherein a UIM or mini-size UIM IC module contact terminal board is located at a predetermined position of a wallet size card defined by ISO7816. 5. UIM with body. The UIM with a plate-like frame according to claim 1, wherein the UIM or the wallet-size plate-like frame is manufactured by injection molding. 4. The UIM with a plate frame according to claim 2, wherein the mini size UIM or the wallet size plate frame is manufactured by injection molding.

Images