JP4458855B2 - ステージ・ミラーのマッピングのための方法および装置 - Google Patents

ステージ・ミラーのマッピングのための方法および装置 Download PDF

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Publication number
JP4458855B2
JP4458855B2 JP2003584612A JP2003584612A JP4458855B2 JP 4458855 B2 JP4458855 B2 JP 4458855B2 JP 2003584612 A JP2003584612 A JP 2003584612A JP 2003584612 A JP2003584612 A JP 2003584612A JP 4458855 B2 JP4458855 B2 JP 4458855B2
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Japan
Prior art keywords
interferometry
interferometer
mirror
beams
translation stage
Prior art date
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Expired - Fee Related
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JP2003584612A
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English (en)
Japanese (ja)
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JP2005522683A (ja
Inventor
ヘンリー アレン ヒル，
Original Assignee
ザイゴ コーポレイション
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Priority claimed from US10/217,531 external-priority patent/US6700665B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02007—Two or more frequencies or sources used for interferometric measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02019—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different points on same face of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70—Using polarization in the interferometer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2003584612A 2002-04-09 2003-04-04 ステージ・ミラーのマッピングのための方法および装置 Expired - Fee Related JP4458855B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37117202P 2002-04-09 2002-04-09
US10/217,531 US6700665B2 (en) 2001-08-20 2002-08-13 Interferometric apparatus for measuring the topography of mirrors in situ and providing error correction signals therefor
PCT/US2003/010212 WO2003087710A2 (en) 2002-04-09 2003-04-04 Method and apparatus for stage mirror mapping

Publications (2)

Publication Number Publication Date
JP2005522683A JP2005522683A (ja) 2005-07-28
JP4458855B2 true JP4458855B2 (ja) 2010-04-28

Family

ID=29254154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003584612A Expired - Fee Related JP4458855B2 (ja) 2002-04-09 2003-04-04 ステージ・ミラーのマッピングのための方法および装置

Country Status (3)

Country Link
EP (1) EP1492994A4 (de)
JP (1) JP4458855B2 (de)
WO (1) WO2003087710A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007005314A2 (en) * 2005-06-29 2007-01-11 Zygo Corporation Apparatus and methods for reducing non-cyclic non-linear errors in interferometry
US7853067B2 (en) * 2006-10-27 2010-12-14 Asml Holding N.V. Systems and methods for lithographic reticle inspection
US8937707B2 (en) 2011-08-23 2015-01-20 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and method of calibrating a displacement measuring system
CN111971622A (zh) 2018-03-29 2020-11-20 Asml荷兰有限公司 位置测量系统、干涉仪系统和光刻装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151749A (en) * 1989-06-08 1992-09-29 Nikon Corporation Method of and apparatus for measuring coordinate position and positioning an object
JP3295846B2 (ja) * 1989-06-08 2002-06-24 株式会社ニコン 位置測定方法、位置測定装置、位置決め方法、位置決め装置、および露光装置
JPH04351905A (ja) * 1991-05-30 1992-12-07 Fujitsu Ltd レーザ測長装置を備えたｘｙステージ
US5363196A (en) * 1992-01-10 1994-11-08 Ultratech Stepper, Inc. Apparatus for measuring a departure from flatness or straightness of a nominally-plane mirror for a precision X-Y movable-stage
US5464715A (en) * 1993-04-02 1995-11-07 Nikon Corporation Method of driving mask stage and method of mask alignment
US5371588A (en) * 1993-11-10 1994-12-06 University Of Maryland, College Park Surface profile and material mapper using a driver to displace the sample in X-Y-Z directions
JPH07253304A (ja) * 1994-03-15 1995-10-03 Nikon Corp 多軸位置決めユニットおよびこれにおける測長方法
JPH09162113A (ja) * 1995-12-04 1997-06-20 Nikon Corp 直交度測定方法及びステージ装置並びに露光装置
WO2000022376A1 (fr) * 1998-10-14 2000-04-20 Nikon Corporation Procede et dispositif de mesure de forme, procede de commande de position, dispositif a etage, appareil d'exposition et procede de production dudit appareil d'exposition et dispositif et procede de fabrication du dispositif
DE60118726T2 (de) * 2000-05-19 2006-08-24 Zygo Corp., Middlefield In-situ spiegel-charakterisierung

Also Published As

Publication number Publication date
WO2003087710A2 (en) 2003-10-23
EP1492994A4 (de) 2010-07-28
WO2003087710A3 (en) 2003-12-18
EP1492994A2 (de) 2005-01-05
JP2005522683A (ja) 2005-07-28

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